Wafer test data processing method, electronic equipment and computer readable medium

Abstract

The invention discloses a wafer test data processing method, electronic equipment and a computer readable medium, and the method comprises the steps: analyzing binary wafer test data into structured wafer test data according to a binary file format specification of the binary wafer test data and a preset data analysis mode; wherein the structured wafer test data comprises global metadata and chip test data of each chip stored in a two-dimensional array, the chip test data comprises a BIN number and a test result state, and the test result state comprises one of a pass state and a failure state; rendering the structured wafer test data to a wafer graph storage file; and generating a test report file according to the wafer graph storage file. The time period from testing to report generation can be shortened, the wafer testing efficiency is improved, the accuracy and reliability of the wafer graph and the testing report are improved, the manpower demand can be reduced, the operation cost can be reduced, and resources are saved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor data processing, and specifically, to a method for processing wafer test data, an electronic device, and a computer-readable medium. Background Art

[0002] In the process of semiconductor manufacturing, wafer testing is one of the key steps to ensure product quality. After wafer testing, a wafer map and a wafer test report are usually generated to record the test results of each die. These documents are very important for subsequent quality control, data analysis, and product traceability, so that engineers can quickly analyze the test results.

[0003] However, currently, both the wafer map and the wafer test report are generated manually, which has many serious drawbacks such as low accuracy, low efficiency, low data consistency, low traceability, low resource utilization, poor adaptability, and low data analysis degree. Therefore, there is an urgent need for a method that can automatically generate a wafer map and a wafer test report based on wafer test data. Summary of the Invention

[0004] This application aims to solve one of the technical problems in the related art to a certain extent. For this purpose, this application provides a method for processing wafer test data, an electronic device, and a computer-readable medium.

[0005] As the first aspect of this application, a method for processing wafer test data is provided, wherein the method includes:

[0006] According to the binary file format specification of the binary wafer test data and a preset data parsing method, parse the binary wafer test data into structured wafer test data; wherein, the structured wafer test data includes global metadata and chip test data of each chip stored in a two-dimensional array, the chip test data includes a BIN number and a test result status, and the test result status includes one of a pass status and a fail status;

[0007] Render the structured wafer test data into a wafer map storage file;

[0008] Generate a test report file according to the wafer map storage file.

[0009] Optionally, the parsing the binary wafer test data into structured wafer test data according to the binary file format specification of the binary wafer test data and a preset data parsing method includes:

[0010] Use a preset reader to read the binary wafer test data into a byte array;

[0011] When it is determined that the length of the byte array is not less than the preset byte length, according to the binary file format specification, the global metadata is parsed from the byte array, and the global metadata includes product identification, batch identification, BIN length, wafer orientation, number of chips in the first direction, number of chips in the second direction, test time, and wafer map address;

[0012] When both the number of chips in the first direction and the number of chips in the second direction are not 0, according to the binary file format specification and the BIN length, the chip test data of each chip is parsed from the byte array;

[0013] According to the number of chips in the first direction and the number of chips in the second direction, the chip test data of each chip is stored as a two-dimensional array.

[0014] Optionally, the global metadata includes batch identification and BIN length, and the rendering of the structured wafer test data to the wafer map storage file includes:

[0015] According to the batch identification, create a wafer map directory path and a backup sub-directory path;

[0016] Create a wafer map storage file path, a wafer map storage file object, and a wafer map storage file write stream object in sequence;

[0017] Dependent on the wafer map storage file write stream object, write the global metadata to the wafer map storage file;

[0018] Dependent on the wafer map storage file write stream object, according to the BIN length, write the chip test data of each chip to the wafer map storage file;

[0019] Generate BIN summary information according to each BIN number in the chip test data of each chip;

[0020] Dependent on the wafer map storage file write stream object, write the BIN summary information to the wafer map storage file;

[0021] Close the wafer map storage file write stream object.

[0022] Optionally, the writing of the chip test data of each chip to the wafer map storage file according to the BIN length includes:

[0023] When the BIN length is 1, directly write the chip test data of each chip to the wafer map storage file;

[0024] When the BIN length is 2, write each of the chip test data into the wafer map storage file according to the BIN number in each of the chip test data.

[0025] Optionally, generating a test report file according to the wafer map storage file includes:

[0026] Initialize the second variable of the modification time, and create a wafer map backup file object and a test report file object;

[0027] When the wafer map backup file exists, assign the historical modification time of the wafer map backup file to the second variable of the modification time;

[0028] Copy the wafer map storage file to the wafer map backup file, and assign the current modification time of the wafer map backup file to the first variable of the modification time;

[0029] When the test report file exists, write data to the test report file according to the wafer map backup file.

[0030] Optionally, the test report file includes a comma-separated values file, and writing data to the test report file according to the wafer map backup file includes:

[0031] Determine the number of BINs according to the BIN length;

[0032] Generate statistical data of the number of BINs according to each chip test data in the wafer map backup file;

[0033] Store the global metadata in the wafer map backup file and the statistical data of the number of BINs as a line of data into the test report file.

[0034] Optionally, a UTF-8 byte order mark encoding is added to the test report file.

[0035] Optionally, the method further includes:

[0036] Draw a wafer map on a two-dimensional plane according to the correspondence between the preset color and the test result status and the wafer map storage file.

[0037] As a second aspect of the present application, there is provided an electronic device, where the electronic device includes:

[0038] One or more processors;

[0039] A memory stores one or more computer programs, which, when executed by one or more processors, cause the one or more processors to implement the wafer test data processing method provided in the first aspect of the present application.

[0040] As a third aspect of the present application, a computer-readable medium is provided, on which a computer program is stored, wherein when the computer program is executed by a processor, the wafer test data processing method provided in the first aspect of the present application is implemented.

[0041] The wafer test data processing method provided by the present application parses the binary wafer test data into structured wafer test data including global metadata and chip test data of each chip stored in a two-dimensional array according to the binary file format specification of the binary wafer test data and a preset data parsing method, wherein the chip test data includes a BIN number and a test result status, and the test result status includes one of a pass status and a fail status. The structured wafer test data is rendered to a wafer map storage file, and a test report file is generated according to the wafer map storage file. It can automatically process the original binary wafer test data to obtain the wafer map storage file and the test report file, which is beneficial to complete the processing and analysis of a large amount of wafer test data in a short time, shorten the time cycle from testing to generating a report, improve the wafer test efficiency, realize the intelligence and high efficiency of wafer testing, avoid problems such as misreading, misrecording or calculation errors caused by manual processing, thereby improving the accuracy and reliability of the wafer map and the test report, reduce the manpower requirement, lower the operation cost, the automatically generated wafer map storage file and test report file follow a preset standard format, thus ensuring data consistency between different test batches, being beneficial to long-term data analysis and comparison, being able to record each test step and its test result in detail, thus facilitating subsequent quality tracking and problem location, and being able to support complex data analysis, thus providing scientific data support for optimizing the design and process. Description of the Drawings

[0042] The present application will be further described below with reference to the drawings:

[0043] Figure 1 is a flowchart of an implementation manner of the wafer test data processing method provided by an embodiment of the present application;

[0044] Figure 2 is a flowchart of an implementation manner of parsing binary wafer test data provided by an embodiment of the present application;

[0045] Figure 3 is a flowchart of an implementation manner of rendering structured wafer test data to a wafer map storage file provided by an embodiment of the present application;

[0046] Figure 4 It is a flowchart of an implementation manner for writing the chip test data of each chip into a wafer map storage file according to the BIN length provided by an embodiment of the present application;

[0047] Figure 5 It is a flowchart of an implementation manner for generating a test report file according to a wafer map storage file provided by an embodiment of the present application;

[0048] Figure 6 It is a flowchart of an implementation manner for writing data into a test report file according to a wafer map backup file provided by an embodiment of the present application;

[0049] Figure 7 It is a flowchart of another implementation manner of the wafer test data processing method provided by an embodiment of the present application;

[0050] Figure 8 It is a module diagram of an implementation manner of an electronic device provided by an embodiment of the present application;

[0051] Figure 9 It is a schematic diagram of a computer-readable medium provided by an embodiment of the present application.

[0052] Description of the reference numerals

[0053] 101: Processor 102: Memory

[0054] 103: I / O interface 104: Bus Detailed implementation manners

[0055] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. Based on the embodiments in the implementation manners, it is intended to explain the present application and should not be construed as a limitation to the present application.

[0056] As used in this specification, the phrase "an embodiment" or "an example" or "an instance" means that a particular feature, structure, or characteristic described in connection with the embodiment itself may be included in at least one embodiment disclosed in the present application. The appearances of the phrase "in an embodiment" in various positions in the specification do not necessarily refer to the same embodiment.

[0057] In the semiconductor manufacturing process, wafer testing is one of the key steps to ensure product quality. After wafer testing, a wafer map and a wafer test report are usually generated to record the test results of each die. These documents are very important for subsequent quality control, data analysis, and product traceability, so that engineers can quickly analyze the test results.

[0058] However, currently, both the wafer map and the wafer test report are generated manually, which have the following serious drawbacks:

[0059] 1. Low accuracy. The manual generation method is prone to human errors, such as copying errors, calculation errors, etc.;

[0060] 2. Low efficiency. The manual generation method requires a lot of time and labor, especially when the data volume is large;

[0061] 3. Low data consistency. Different operators are inconsistent in terms of generation format, data structure style, etc., which will affect subsequent data analysis and comparison;

[0062] 4. Low traceability. The manual generation method lacks a complete historical modification record, making it difficult to track errors or changes;

[0063] 5. Low resource utilization. The manual generation method not only takes time but may also lead to waste of materials and human resources;

[0064] 6. Poor adaptability. When the test standard or product specification changes, the manual generation method may not be able to adapt and requires re-training of operators;

[0065] 7. Low data analysis degree. The manually generated wafer map and wafer test report are not conducive to complex data analysis, such as trend analysis, statistical process control, etc.

[0066] Therefore, there is an urgent need for a method that can automatically generate a wafer map and a wafer test report based on wafer test data.

[0067] In this regard, the applicant of this application proposes to first automatically parse the original binary wafer test data into structured wafer test data, then automatically render the structured wafer test data into a wafer map storage file, and finally automatically generate a test report file based on the wafer map storage file.

[0068] As the first aspect of the embodiment of this application, a method for processing wafer test data is provided, as Figure 1 shown, the method may include the following steps:

[0069] Step S110, according to the binary file format specification of the binary wafer test data and the preset data parsing method, parse the binary wafer test data into structured wafer test data; wherein, the structured wafer test data includes global metadata and chip test data of each chip stored in a two-dimensional array, the chip test data includes a BIN number and a test result status, and the test result status includes one of a pass status and a fail status;

[0070] Step S120: Render the structured wafer test data into a wafer map storage file;

[0071] Step S130: Generate a test report file based on the wafer map storage file.

[0072] It can be understood that wafer testing usually involves a probe station, test equipment, wafers, etc.

[0073] Among them, binary wafer test data refers to the binary - format wafer test data generated by the probe station during wafer testing. These data include the test results of each chip (Die) on the wafer.

[0074] Among them, step S110 can be executed by a parser. The binary file format specification of the binary wafer test data can be obtained from the probe station supplier in advance. Based on this binary file format specification, the parser can correctly identify each data field in the binary wafer test data.

[0075] Among them, BIN is a specific term in the field of semiconductor testing. The BIN number is used to identify the test classification result of the chip (Die). In addition to the BIN number and the test result status, the chip test data can also include characters for realizing the readable expression of the BIN type or the test result status.

[0076] Among them, it should be noted that the "rendering" involved in step S120 is different from the "rendering" in the field of image processing. It refers to organizing and recording the structured wafer test data in a specific file format for subsequent visual presentation and data analysis. That is to say, subsequently, the "rendering" operation in the field of image processing can be performed based on this wafer map storage file to realize the visualization of the wafer map.

[0077] The wafer test data processing method provided by the embodiments of the present application parses the binary wafer test data into structured wafer test data including global metadata and chip test data of each chip stored in a two-dimensional array according to the binary file format specification of the binary wafer test data and a preset data parsing method, where the chip test data includes a BIN number and a test result status, and the test result status includes one of a pass status and a fail status. Render the structured wafer test data to a wafer map storage file, and generate a test report file according to the wafer map storage file. It can automatically process the original binary wafer test data to obtain the wafer map storage file and the test report file, which is beneficial to complete the processing and analysis of a large amount of wafer test data in a short time, shorten the time cycle from testing to report generation, improve the wafer test efficiency, realize the intelligence and high efficiency of wafer testing, and can avoid problems such as misreading, misrecording or calculation errors caused by manual processing, thereby improving the accuracy and reliability of the wafer map and the test report. It can reduce the manpower requirement, lower the operation cost, and save resources. The automatically generated wafer map storage file and test report file follow a preset standard format, which ensures the data consistency between different test batches, is beneficial to long-term data analysis and comparison, can record each test step and its test result in detail, which is convenient for subsequent quality tracking and problem location, and can support complex data analysis, thereby providing scientific data support for optimizing the design and process.

[0078] In some embodiments, parsing the binary wafer test data into structured wafer test data according to the binary file format specification of the binary wafer test data and a preset data parsing method (i.e., involved in step S110) may include the following steps as Figure 2 shown:

[0079] Step S210, use a preset reader to read the binary wafer test data into a byte array;

[0080] Step S220, when it is determined that the length of the byte array is not less than a preset byte length, parse the global metadata from the byte array according to the binary file format specification, where the global metadata includes product identification, batch identification, BIN length, wafer orientation, number of chips in the first direction, number of chips in the second direction, test time, and wafer map address;

[0081] Step S230, when both the number of chips in the first direction and the number of chips in the second direction are not zero, parse the chip test data of each chip from the byte array according to the binary file format specification and the BIN length;

[0082] Step S240: Store the chip test data of each chip as a two-dimensional array according to the number of chips in the first direction and the number of chips in the second direction.

[0083] In this embodiment of the present application, there is no specific limitation on the preset reader. For example, it may include a file byte reader FileInputStream and a basic data type reader DataInputStream.

[0084] In this embodiment of the present application, there is no specific limitation on the preset byte length. For example, the preset byte length may be 200 bytes, 220 bytes, 240 bytes, etc.

[0085] It can be understood that when it is determined that the length of the byte array (buf) is less than the preset byte length, it can be indicated that the current binary wafer test data is abnormal. At this time, skip the current binary wafer test data and return an error prompt "false", and then parse the next set of binary wafer test data.

[0086] The product identifier refers to the unique model code of the chip, the batch identifier refers to the unique identifier of the wafers produced in the same batch, the BIN length refers to the number of encoding bits of the chip classification level (BIN) after testing (which determines the maximum number of BIN levels that can be divided), the wafer orientation refers to the physical orientation of the wafer notch / flat edge (UP, RIGHT, DOWN, LEFT), the test time refers to the specific time of wafer testing (first extract the start timestamp and end timestamp from the byte array and then calculate), the number of chips in the first direction and the number of chips in the second direction refer to the number of chips arranged along the first direction on the wafer and the number of chips arranged along the second direction on the wafer (the number of X and the number of Y, the first direction and the second direction are, for example, the row direction and the column direction), and the wafer map address refers to the starting coordinates of the chip arrangement on the wafer (the initial positions of X and Y). Combining the wafer map address with the number of chips in the first direction and the number of chips in the second direction can determine the chip arrangement positions on the wafer.

[0087] It can be understood that when any one of the number of chips in the first direction and the number of chips in the second direction is 0, it can also indicate that the current binary wafer test data is abnormal. At this time, skip the current binary wafer test data and return an error prompt "false", and then parse the next set of binary wafer test data.

[0088] The wafer test data processing method provided by the embodiments of the present application can automatically parse the original binary wafer test data into structured wafer test data through the preset data parsing method, which is convenient for subsequent rendering of the wafer map storage file and generation of the test report file.

[0089] In some embodiments, the global metadata includes a lot identifier and a BIN length. Rendering the structured wafer test data into a wafer map storage file (i.e., involved in step S120) may include the following steps as Figure 3 shown:

[0090] Step S310: Create a wafer map directory path and a backup sub-directory path according to the lot identifier;

[0091] Step S320: Sequentially create a wafer map storage file path, a wafer map storage file object, and a wafer map storage file write stream object;

[0092] Step S330: Write the global metadata into the wafer map storage file depending on the wafer map storage file write stream object;

[0093] Step S340: Write the chip test data of each chip into the wafer map storage file according to the BIN length depending on the wafer map storage file write stream object;

[0094] Step S350: Generate BIN summary information according to each BIN number in the chip test data of each chip;

[0095] Step S360: Write the BIN summary information into the wafer map storage file depending on the wafer map storage file write stream object;

[0096] Step S370: Close the wafer map storage file write stream object.

[0097] Among them, in addition to the lot identifier and the BIN length, the global metadata may further include a product identifier, a wafer orientation, the number of chips in the first direction, the number of chips in the second direction, a test time, a wafer map address, and so on.

[0098] Among them, creating the wafer map directory path and the backup sub-directory path according to the lot identifier (LotName) facilitates classifying and storing the test data of wafers in different lots according to the lot identifier.

[0099] Among them, the present application embodiment does not make specific limitations on the BIN summary information. For example, the BIN summary information may include the number and yield of chips in each BIN.

[0100] In some embodiments, writing the chip test data of each chip into the wafer map storage file according to the BIN length (i.e., involved in step S340) may include the following steps as Figure 4 shown:

[0101] Step S410, when the BIN length is 1, directly write the chip test data of each chip into the wafer map storage file;

[0102] Step S420, when the BIN length is 2, write the chip test data of each chip into the wafer map storage file according to the BIN number in each chip test data.

[0103] Among them, after writing the global metadata into the wafer map storage file, it is determined whether the BIN number of each chip is written into the wafer map storage file as single BIN data or double BIN data according to the BIN length (that is, the value of the binlength field). Specifically, when the BIN length is 1, single BIN data is written, and the chip test data of each chip is directly written into the wafer map storage file. When the BIN length is 2, double BIN data is written, that is, it is necessary to format and write the chip test data of each chip into the wafer map storage file according to the BIN number.

[0104] In some embodiments, generating a test report file according to the wafer map storage file (that is, involved in step S130), as Figure 5 shown, may include the following steps:

[0105] Step S510, initialize the second variable of the modification time, and create a wafer map backup file object and a test report file object;

[0106] Step S520, when the wafer map backup file exists, assign the historical modification time of the wafer map backup file to the second variable of the modification time;

[0107] Step S530, copy the wafer map storage file to the wafer map backup file, and assign the current modification time of the wafer map backup file to the first variable of the modification time;

[0108] Step S540, when the test report file exists, write data to the test report file according to the wafer map backup file.

[0109] Among them, by assigning the historical modification time of the wafer map backup file (WFMapFile2) to the second variable of the modification time (modifyTime2) before copying and assigning the current modification time of the wafer map backup file to the first variable of the modification time (modifyTime) after copying, the modification time record of the wafer map backup file can be effectively retained, facilitating data traceability, ensuring the high availability of the system, and avoiding service interruption caused by single point of failure.

[0110] Among them, the embodiments of the present application do not make special limitations on how to copy the wafer map storage file to the wafer map backup file. For example, the FileUtils.copyFile method (provided by the Apache Commons IO library) can be used for copying.

[0111] In some embodiments, the test report file includes a comma-separated values file. Writing data to the test report file according to the wafer map backup file (i.e., involved in step S540) can include the following steps as Figure 6 shown:

[0112] Step S610, determining the number of BINs according to the BIN length;

[0113] Step S620, generating statistical data of the number of BINs according to the chip test data in the wafer map backup file;

[0114] Step S630, storing the global metadata in the wafer map backup file and the statistical data of the number of BINs as a line of data into the test report file.

[0115] Among them, the test report file includes a comma-separated values file (CSV). Different fields are separated by commas, and each line represents a record.

[0116] Among them, the embodiments of the present application do not make specific limitations on how to determine the number of BINs according to the BIN length, which can be determined according to the binary file format specification of the binary wafer test data. For example, in some scenario settings, if the BIN length (the value of the binlength field) is 1, the number of BINs is determined to be 64; if the BIN length (the value of the binlength field) is 2, the number of BINs is determined to be 256.

[0117] In the embodiments of the present application, when the test report file exists, the content in the wafer map storage file can be first read into the csvStr array using a preset reader (such as a buffered character input stream (BufferedReader, a class in the java.io package of the Java programming language)), and then the statistical data of the number of BINs is generated according to the chip test data in the csvStr array.

[0118] In the embodiments of the present application, subsequently, the test report file in the comma-separated value file format can be further converted into other formats, such as Portable Document Format (PDF) format, Excel format, etc., to facilitate meeting the query needs of different users.

[0119] Correspondingly, in some embodiments, a UTF-8 byte order mark encoding is added to the test report file to solve the problem of Chinese character garbled code when opening Excel.

[0120] It should be noted that the embodiments of the present application are not limited to the test report file being in the comma-separated value file format, and it can also be in JavaScript Object Notation (JSON format).

[0121] In some embodiments, as Figure 7 shown, the method may further include the following steps:

[0122] Step S140, draw a wafer map on a two-dimensional plane according to the correspondence between the preset color and the test result status and the wafer map storage file.

[0123] Among them, the embodiments of the present application do not make specific limitations on the correspondence between the preset color and the test result status. For example, green can be used to represent the pass status and red can be used to represent the failure status. Drawing the wafer map on the two-dimensional plane according to this correspondence and the wafer map storage file can more intuitively display the positions and test result statuses of each chip on the wafer, which is beneficial for users to quickly identify the positions of defective products.

[0124] In addition, the applicant of the present application also proposes that a back-end application programming interface (API) can be built using the Spring Boot 3 framework to provide data upload and query services, and a user-friendly front-end interface can be built using a progressive JavaScript framework Vue 2 and a Vue3-based component library Element Plus. A HyperText Transfer Protocol (HTTP) client based on Promise (an object used to handle asynchronous operations in JavaScript) is used to implement data interaction between the back-end and the front-end, which can be used in browser and Node.js environments. It is widely used in front-end development. The following will introduce the relevant content of Axios in detail for you.

[0125] The features enable users to store the obtained structured wafer test data, wafer map storage files, wafer maps, test report files, etc. in a MySQL database through a server, and query and download them. A dedicated data model can also be designed to store the obtained structured wafer test data, wafer map storage files, wafer maps, and test report files, further improving data consistency and integrity. Use a semi-automated Object-Relational Mapping (ORM) framework, MyBatis, to facilitate users to operate the MySQL database more conveniently.

[0126] As the second aspect of the embodiments of the present application, an electronic device is provided. As Figure 8 shown, the electronic device includes:

[0127] One or more processors 101;

[0128] A memory 102, on which one or more computer programs are stored. When the one or more computer programs are executed by the one or more processors 101, the one or more processors 101 implement the wafer test data processing method provided in the first aspect of the embodiments of the present application.

[0129] The electronic device may further include one or more I / O interfaces 103, connected between the processor 101 and the memory 102, configured to implement information interaction between the processor 101 and the memory 102.

[0130] Among them, the processor 101 is a device with data processing capabilities, including but not limited to a central processing unit (CPU), etc.; the memory 102 is a device with data storage capabilities, including but not limited to a random access memory (RAM, more specifically such as SDRAM, DDR, etc.), a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a flash memory (FLASH); the I / O interface (read / write interface) is connected between the processor and the memory and can implement information interaction between the processor and the memory, including but not limited to a data bus (Bus), etc.

[0131] In some embodiments, the processor 101, the memory 102, and the I / O interface 103 are interconnected through a bus 104, and then connected to other components of the computing device.

[0132] As the third aspect of the embodiments of the present application, as Figure 9 shown, a computer-readable medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the wafer test data processing method provided in the first aspect of the embodiments of the present application is implemented.

[0133] Those of ordinary skill in the art will appreciate that all or part of the processes in the above-described embodiment methods can be accomplished by instructing relevant hardware through a computer program. Accordingly, the computer program can be stored in a non-volatile computer-readable storage medium, and when the computer program is executed, the methods of any of the above embodiments can be implemented. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided by the embodiments of the present application may include non-volatile and / or volatile memories. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0134] The above is only the specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Those skilled in the art should understand that the present application includes but is not limited to the content described in the drawings and the above specific embodiments. Any modification that does not deviate from the functional and structural principles of the present application will be included in the scope of the claims.

Claims

1. A wafer test data processing method, characterized in that, The method includes: According to the binary file format specification of the binary wafer test data and a preset data parsing method, parsing the binary wafer test data into structured wafer test data; wherein, the structured wafer test data includes global metadata and chip test data of each chip stored in a two-dimensional array, the chip test data includes a BIN number and a test result status, and the test result status includes one of a pass status and a fail status; Rendering the structured wafer test data into a wafer map storage file; Generating a test report file according to the wafer map storage file.

2. The method according to claim 1, wherein The parsing the binary wafer test data into structured wafer test data according to the binary file format specification of the binary wafer test data and a preset data parsing method includes: Using a preset reader to read the binary wafer test data into a byte array; When it is determined that the length of the byte array is not less than a preset byte length, parsing the global metadata from the byte array according to the binary file format specification, where the global metadata includes a product identifier, a batch identifier, a BIN length, a wafer orientation, the number of chips in the first direction, the number of chips in the second direction, a test time, and a wafer map address; When both the number of chips in the first direction and the number of chips in the second direction are not zero, parsing the chip test data of each chip from the byte array according to the binary file format specification and the BIN length; Storing the chip test data of each chip as a two-dimensional array according to the number of chips in the first direction and the number of chips in the second direction.

3. The method according to claim 1, wherein The global metadata includes a batch identifier and a BIN length, and the rendering the structured wafer test data into a wafer map storage file includes: Creating a wafer map directory path and a backup sub-directory path according to the batch identifier; Successively creating a wafer map storage file path, a wafer map storage file object, and a wafer map storage file write stream object; Depending on the wafer map storage file write stream object, writing the global metadata into the wafer map storage file; Depending on the wafer map storage file write stream object, writing the chip test data of each chip into the wafer map storage file according to the BIN length; Generating BIN summary information according to each BIN number in the chip test data of each chip; Depending on the wafer map storage file write stream object, writing the BIN summary information into the wafer map storage file; Closing the wafer map storage file write stream object.

4. The method according to claim 3, characterized in that, The writing the chip test data of each chip into the wafer map storage file according to the BIN length includes: When the BIN length is 1, directly writing the chip test data of each chip into the wafer map storage file; When the BIN length is 2, writing each chip test data into the wafer map storage file according to the BIN number in each chip test data.

5. The method according to claim 3, wherein The generating a test report file according to the wafer map storage file includes: Initialize the second modification time variable, and create a wafer map backup file object and a test report file object; If the wafer map backup file exists, assign the historical modification time of the wafer map backup file to the second modification time variable; Copy the wafer map storage file to the wafer map backup file, and assign the current modification time of the wafer map backup file to the first modification time variable; If the test report file exists, write data to the test report file according to the wafer map backup file.

6. The method according to claim 5, wherein The test report file includes a comma-separated value file. Writing data to the test report file according to the wafer map backup file includes: Determine the number of BINs according to the BIN length; Generate statistical data for the number of BINs according to the chip test data in the wafer map backup file; Store the global metadata in the wafer map backup file and the statistical data for the number of BINs as a line of data in the test report file.

7. The method according to claim 6, characterized in that, A UTF-8 byte order mark encoding is added to the test report file.

8. The method according to any one of claims 1-7, characterized in that The method further includes: Draw a wafer map on a two-dimensional plane according to the correspondence between the preset color and the test result status and the wafer map storage file.

9. An electronic device, characterized in that, The electronic device includes: One or more processors; A memory having stored thereon one or more computer programs, which when executed by the one or more processors, cause the one or more processors to implement the wafer test data processing method according to any one of claims 1-8.

10. A computer-readable medium having a computer program stored thereon, characterized in that, The computer program, when executed by a processor, implements the wafer test data processing method according to any one of claims 1-8.

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