A laser heating device and a semiconductor laser

Abstract

The application discloses a laser heating device and a semiconductor laser. The laser heating device comprises: a plurality of laser assemblies, the laser assemblies being used for outputting light beams; a first laser heat sink, a first surface of the first laser heat sink forming a plurality of first steps, the plurality of first steps being in a stepped shape, each first step being provided with a plurality of laser assemblies, and a second surface of the first laser heat sink being used for forming a first heat dissipation channel; and a second laser heat sink, the second laser heat sink being oppositely arranged with the first laser heat sink, a first surface of the second laser heat sink forming a plurality of second steps, the plurality of second steps being in a stepped shape, each second step being provided with a plurality of laser assemblies, and a second surface of the second laser heat sink being used for forming a second heat dissipation channel; and the first surface of the second laser heat sink is oppositely arranged with the first surface of the first laser heat sink. In the above manner, the distance between the first laser heat sink and the second laser heat sink at a combined position is effectively reduced, the distance between light spots is further reduced, and the uniformity of the output light beams is improved.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a laser heating device and a semiconductor laser. Background Art

[0002] Heating technology plays a crucial role in modern industrial production and daily life, with applications spanning a wide range of fields, from material processing and component manufacturing to food preparation, providing crucial support for meeting people's diverse needs. In recent years, laser heating, as an emerging heating method, has rapidly developed due to its unique advantages, gaining widespread attention and application.

[0003] In traditional laser heating devices, stepped heat sinks are typically positioned in a forward orientation with heat dissipation channels at the bottom, meaning the heat dissipation channels of the two stepped heat sinks are positioned opposite each other. This design limits the thickness of the steps at the bottom, resulting in an excessively large spacing between the beam spots of the two laser assemblies at the combined position when the steps face each other, leading to poor output beam uniformity. Summary of the Invention

[0004] The present application mainly provides a laser heating device and a semiconductor laser to solve the problem that when step-by-step combination is performed, the spot spacing between the two sets of laser components at the combination position is too large, resulting in poor uniformity of the output light beam.

[0005] The present application provides a laser heating device, comprising:

[0006] a plurality of laser assemblies configured to output light beams;

[0007] a first laser heat sink, wherein a first surface of the first laser heat sink is formed with a plurality of first steps, the plurality of first steps are in a stepped shape, a plurality of the laser assemblies are disposed on each first step, and a second surface of the first laser heat sink is used to form a first heat dissipation channel;

[0008] a second laser heat sink, disposed opposite to the first laser heat sink, wherein a first surface of the second laser heat sink is formed with a plurality of second steps, the plurality of second steps being in a stepped shape, a plurality of the laser assemblies being disposed on each second step, and a second surface of the second laser heat sink being used to form a second heat dissipation channel;

[0009] The first surface of the second laser heat sink is arranged opposite to the first surface of the first laser heat sink;

[0010] A first supporting wall, a second supporting wall, a third supporting wall and a fourth supporting wall, a plurality of first steps are arranged between the first supporting wall and the second supporting wall, and a plurality of second steps are arranged between the third supporting wall and the fourth supporting wall.

[0011] Among them, any two of the plurality of first steps are arranged in parallel, and the numbers of laser components on any two of the first steps are not equal; any two of the plurality of second steps are arranged in parallel, and the numbers of laser components on any two of the second steps are not equal.

[0012] Among them, among the multiple first steps, the number of laser components on the first steps decreases successively along the length direction of the laser heating device; among the multiple second steps, the number of laser components on the second steps decreases successively along the length direction of the laser heating device.

[0013] In which, the laser heating device includes a first cover plate and a second cover plate, the first cover plate is arranged between the first support wall and the second support wall, and the first cover plate, the second surface of the first laser heat sink, the first support wall and the second support wall form the first heat dissipation channel; the second cover plate is arranged between the third support wall and the fourth support wall, and the second cover plate, the second surface of the second laser heat sink, the third support wall and the fourth support wall form the second heat dissipation channel.

[0014] The first heat dissipation channel includes a first input channel and a first output channel communicating with the first input channel, and the second heat dissipation channel includes a second input channel and a second output channel communicating with the second input channel.

[0015] Particularly, a first input port and a first output port are provided on the second surface of the first laser heat sink, and the first input port and the first output port are arranged along the width direction of the laser heating device, the first input port is connected to the first input channel, and the first output port is connected to the first output channel; a second input port and a second output port are provided on the second surface of the second laser heat sink, and the second input port and the second output port are arranged along the width direction of the laser heating device, the second input port is connected to the second input channel, and the second output port is connected to the second output channel.

[0016] In which, the laser heating device also includes multiple first collimating lenses and multiple second collimating lenses, and the multiple first collimating lenses and the multiple second collimating lenses are arranged corresponding to the multiple laser components, and the first collimating lenses and the second collimating lenses are arranged in sequence on the light output side of the corresponding laser components.

[0017] Among them, the multiple laser assemblies on the multiple first steps are connected in series in sequence, the multiple laser assemblies on the multiple second steps are connected in series in sequence, and the last laser assembly among the multiple laser assemblies on the multiple first steps is connected to the last laser assembly among the multiple laser assemblies on the multiple second steps.

[0018] The present application also provides a semiconductor laser, comprising the laser heating device as described above.

[0019] The beneficial effects of the present application are as follows: in the present application, the first laser heat sink and the second laser heat sink are arranged opposite to each other, and the first surface of the first laser heat sink forms a plurality of first steps in a stepped shape, the first surface of the second laser heat sink forms a plurality of second steps in a stepped shape, and the first surface of the second laser heat sink is arranged opposite to the first surface of the first laser heat sink; compared with the traditional laser heating device, the present application arranges the first surface of the second laser heat sink opposite to the first surface of the first laser heat sink, so that the plurality of second steps in a stepped shape are arranged opposite to the plurality of first steps in a stepped shape, and when the steps are combined facing each other, there is no need to be restricted by the step thickness, which can effectively reduce the distance between the first laser heat sink and the second laser heat sink at the combined position, thereby reducing the spot spacing, thereby improving the uniformity of the output light beam. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. Among them:

[0021] Figure 1 This is a schematic structural diagram of an embodiment of a laser heating device provided by the present application;

[0022] Figure 2 yes Figure 1 A schematic structural diagram of an embodiment of a first laser heat sink;

[0023] Figure 3 yes Figure 2 A schematic structural diagram of an embodiment of the second surface of the first laser heat sink;

[0024] Figure 4 yes Figure 1 A schematic structural diagram of an embodiment of a second laser heat sink;

[0025] Figure 5 yes Figure 4 A schematic structural diagram of an embodiment of the second surface of the second laser heat sink;

[0026] Figure 6 This is a schematic structural diagram of an embodiment of a plurality of laser components of a laser heating device provided by the present application;

[0027] Figure 7 yes Figure 6 A structural diagram of an embodiment of connecting multiple laser components in. DETAILED DESCRIPTION

[0028] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0030] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0031] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0033] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0034] In the description of the embodiments of the present application, unless otherwise clearly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; they can refer to mechanical connections or electrical connections; they can refer to connections between components or indirect connections through an intermediate medium; they can refer to internal connections between two components or interactions between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0035] In traditional laser heating devices, stepped heat sinks are typically positioned in a forward orientation with heat dissipation channels at the bottom, meaning the heat dissipation channels of the two stepped heat sinks are positioned opposite each other. This design limits the thickness of the steps at the bottom, resulting in an excessively large spacing between the beam spots of the two laser assemblies at the combined position when the steps face each other, leading to poor output beam uniformity.

[0036] See Figure 1-Figure 5 As shown, Figure 1 This is a schematic structural diagram of an embodiment of a laser heating device provided by the present application; Figure 2 yes Figure 1 A schematic structural diagram of an embodiment of a first laser heat sink; Figure 3 yes Figure 2 A schematic structural diagram of an embodiment of the second surface of the first laser heat sink; Figure 4 yes Figure 1 A schematic structural diagram of an embodiment of a second laser heat sink; Figure 5 yes Figure 4 Schematic diagram of the structure of an embodiment of the second surface of the second laser heat sink. The laser heating device 100 of this embodiment includes a first laser heat sink 10, a second laser heat sink 20, a plurality of laser assemblies 30, a first support wall 40, a second support wall 50, a third support wall 60 and a fourth support wall 70.

[0037] The plurality of laser components 30 are used to output light beams, and the laser components 30 include but are not limited to laser diodes or laser chips.

[0038] The first surface 101 of the first laser heat sink 10 forms a plurality of first steps 11 in a stepped shape. Each first step 11 is provided with a plurality of laser assemblies 30 . The second surface 102 of the first laser heat sink 10 is used to form a first heat dissipation channel 12 .

[0039] The laser heat sink is a component used to absorb and conduct the heat generated by the laser assembly 30 and dissipate the heat to the surrounding environment; the laser heat sink is usually made of a material with high thermal conductivity, including but not limited to copper, aluminum, diamond or graphene.

[0040] In some embodiments, the first surface 101 of the first laser heat sink 10 has a plurality of stepped first steps 11 , and a plurality of laser assemblies 30 are disposed on each first step 11 , so that the plurality of laser assemblies 30 form a layered layout on the first laser heat sink 10 .

[0041] like Figure 2 and Figure 3 As shown, the first surface 101 of the first laser heat sink 10 forms 7 first steps 11, and the 7 first steps 11 are stepped, and each first step 11 is provided with multiple laser components 30; the second surface 102 of the first laser heat sink 10 is used to form a first heat dissipation channel 12.

[0042] The second laser heat sink 20 is arranged opposite to the first laser heat sink 10. The first surface 201 of the second laser heat sink 20 forms a plurality of second steps 21. The plurality of second steps 21 are stepped. Each second step 21 is provided with a plurality of laser assemblies 30. The second surface 202 of the second laser heat sink 20 is used to form a second heat dissipation channel 22.

[0043] The first heat dissipation channel 12 and the second heat dissipation channel 22 are used to quickly dissipate heat generated by the plurality of laser components 30 when they are working.

[0044] In some embodiments, the first surface 201 of the second laser heat sink 20 has a plurality of second steps 21 in a stepped shape, and the plurality of second steps 21 are arranged correspondingly to the plurality of first steps 11 formed on the first surface 101 of the first laser heat sink 10; a plurality of laser assemblies 30 are arranged on each second step 21, and the plurality of laser assemblies 30 form a layered layout on the second laser heat sink 20; and the second heat dissipation channel 22 formed on the second surface 202 of the second laser heat sink 20 is arranged correspondingly to the first heat dissipation channel 12 formed on the second surface 102 of the first laser heat sink 10.

[0045] like Figure 2-Figure 5 As shown, seven second steps 21 are formed on the first surface 201 of the second laser heat sink 20. The seven second steps 21 correspond one-to-one to the seven first steps 11, and the laser assembly 30 on each second step 21 corresponds to the laser assembly 30 on the corresponding first step 11. The second surface 202 of the second laser heat sink 20 forms a second heat dissipation channel 22, which corresponds to the first heat dissipation channel 12 formed on the second surface 102 of the first laser heat sink 10.

[0046] The first surface 201 of the second laser heat sink 20 is disposed opposite to the first surface 101 of the first laser heat sink 10 .

[0047] In some embodiments, the first surface 201 of the second laser heat sink 20 is arranged opposite to the first surface 101 of the first laser heat sink 10, so that the multiple stepped second steps 21 are arranged opposite to the multiple stepped first steps 11; at this time, the second surface 202 of the second laser heat sink 20 is arranged opposite to the second surface 102 of the first laser heat sink 10, so that the second heat dissipation channel 22 is arranged opposite to the first heat dissipation channel 12.

[0048] like Figure 1 As shown, the multiple second steps 21 of the second laser heat sink 20 are arranged opposite to the multiple first steps 11 of the first laser heat sink 10, and the high steps among the multiple second steps 21 are opposite to the high steps among the multiple first steps 11, and the low steps among the multiple second steps 21 are opposite to the low steps among the multiple first steps 11.

[0049] The plurality of first steps 11 are disposed between the first support wall 40 and the second support wall 50 , and the plurality of second steps 21 are disposed between the third support wall 60 and the fourth support wall 70 .

[0050] like Figure 2 As shown, the first laser heat sink 10 is disposed between the first support wall 40 and the second support wall 50 , so that the plurality of first steps 11 formed on the first surface 101 of the first laser heat sink 10 are disposed between the first support wall 40 and the second support wall 50 .

[0051] like Figure 4 As shown, the second laser heat sink 20 is disposed between the third support wall 60 and the fourth support wall 70 , so that the plurality of second steps 21 formed on the first surface 201 of the second laser heat sink 20 are disposed between the third support wall 60 and the fourth support wall 70 .

[0052] In some embodiments, when the second laser heat sink 20 and the first laser heat sink 10 are disposed opposite to each other, the fourth support wall 70 abuts against the first support wall 40 , and the third support wall 60 abuts against the second support wall 50 to form the laser heating device 100 .

[0053] like Figure 1 As shown, after the fourth support wall 70 abuts against the first support wall 40 and the third support wall 60 abuts against the second support wall 50, the laser heating device 100 forms a light outlet, and the light beams output by the multiple laser assemblies 30 are emitted through the light outlet.

[0054] By arranging multiple first steps 11 between the first support wall 40 and the second support wall 50, and arranging multiple second steps 21 between the third support wall 60 and the fourth support wall 70, the laser heating device 100 has high structural stability, ensuring that the laser heating device 100 can withstand greater thermal stress and mechanical stress when high-power laser output is applied.

[0055] In this embodiment, the first surface 201 of the second laser heat sink 20 is arranged opposite to the first surface 101 of the first laser heat sink 10, so that the multiple second steps 21 in a stepped shape are arranged opposite to the multiple first steps 11 in a stepped shape. When the steps are combined in opposite directions, there is no need to be restricted by the step thickness. This can effectively reduce the distance between the first laser heat sink 10 and the second laser heat sink 20 at the combined position, thereby reducing the spot spacing and improving the uniformity of the output beam.

[0056] According to some embodiments of the present application, any two of the multiple first steps 11 are arranged in parallel, and the numbers of laser components 30 on any two first steps 11 are not equal; any two of the multiple second steps 21 are arranged in parallel, and the numbers of laser components 30 on any two second steps 21 are not equal.

[0057] like Figure 2 As shown, any two of the seven first steps 11 are arranged in parallel, the seven first steps 11 are parallel to each other, and the number of laser assemblies 30 on each first step 11 is not equal. Figure 4 As shown, any two of the seven second steps 21 are arranged in parallel, the seven second steps 21 are parallel to each other, and the number of laser assemblies 30 on each second step 21 is not equal.

[0058] In this embodiment, any two of the multiple first steps 11 are arranged in parallel, and any two of the multiple second steps 21 are arranged in parallel. The parallel arrangement of the steps can ensure that the light beam output by the laser assembly 30 arranged on the first step 11 and the second step 21 has a certain directional consistency in space, which helps to achieve a more uniform beam distribution in the target area; and the parallel arrangement of the step structure can improve the structural stability of the first laser heat sink 10 and the second laser heat sink 20, so that the first laser heat sink 10 and the second laser heat sink 20 can better withstand thermal stress when high-power laser output.

[0059] According to some embodiments of the present application, see Figure 6 As shown, Figure 6 FIG2 is a schematic diagram of the structure of one embodiment of multiple laser assemblies of the laser heating device provided in this application. In this embodiment, the number of laser assemblies 30 on the multiple first steps 11 decreases along the length of the laser heating device 100; and the number of laser assemblies 30 on the multiple second steps 21 decreases along the length of the laser heating device 100.

[0060] like Figure 6As shown, for example, along the length direction of the laser heating device 100, the number of laser assemblies 30 on the first step 11 decreases successively, namely, 9, 8, 7, 6, 5 and 2, that is, the lower half 110 includes 37 laser assemblies 30 on the first laser heat sink 10; along the length direction of the laser heating device 100, the number of laser assemblies 30 on the second step 21 decreases successively, namely, 9, 8, 7, 6, 5 and 2, that is, the upper half 120 includes 37 laser assemblies 30 on the second laser heat sink 20.

[0061] In this embodiment, the number of laser assemblies 30 on the first step 11 decreases successively, and the number of laser assemblies 30 on the second step 21 decreases successively. By setting the decreasing number of laser assemblies 30, the energy distribution can be optimized according to the energy demand of the target area; for example, a higher energy output may be required in the starting area of ​​the laser heating device 100, so more laser assemblies 30 are set; and in the area away from the starting point, the energy demand may gradually decrease, so the number of laser assemblies 30 is also reduced accordingly.

[0062] According to some embodiments of the present application, the laser heating device 100 includes a first cover plate 80 and a second cover plate 90. The first cover plate 80 and the second cover plate 90 include but are not limited to sealing plates.

[0063] The first cover plate 80 is disposed between the first support wall 40 and the second support wall 50 . The first cover plate 80 , the second surface 102 of the first laser heat sink 10 , the first support wall 40 and the second support wall 50 form a first heat dissipation channel 12 .

[0064] like Figure 3 As shown, the first cover plate 80 is arranged on the second surface 102 of the first laser heat sink 10, and the first cover plate 80 is arranged between the first support wall 40 and the second support wall 50; at this time, the first cover plate 80, the second surface 102 of the first laser heat sink 10, the first support wall 40 and the second support wall 50 form a first heat dissipation channel 12, and the first surface 101 of the first laser heat sink 10 absorbs heat from the multiple laser components 30 and conducts the heat to the first heat dissipation channel 12 on the second surface 102 of the first laser heat sink 10.

[0065] The second cover plate 90 is disposed between the third support wall 60 and the fourth support wall 70 . The second cover plate 90 , the second surface 202 of the second laser heat sink 20 , the third support wall 60 and the fourth support wall 70 form a second heat dissipation channel 22 .

[0066] like Figure 5As shown, the second cover plate 90 is arranged on the second surface 202 of the second laser heat sink 20, and the second cover plate 90 is arranged between the third support wall 60 and the fourth support wall 70; at this time, the second cover plate 90, the second surface 202 of the second laser heat sink 20, the third support wall 60 and the fourth support wall 70 form a second heat dissipation channel 22, and the first surface 201 of the second laser heat sink 20 absorbs the heat of the multiple laser assemblies 30 and conducts the heat to the second heat dissipation channel 22 of the second surface 202 of the second laser heat sink 20.

[0067] In this embodiment, the first cover plate 80, the second surface 102 of the first laser heat sink 10, the first support wall 40 and the second support wall 50 form a first heat dissipation channel 12, and the second cover plate 90, the second surface 202 of the second laser heat sink 20, the third support wall 60 and the fourth support wall 70 form a second heat dissipation channel 22. By combining the cover plate with the surface and support walls of the laser heat sink to form the heat dissipation channel, the entire heat dissipation channel has a compact structure and does not occupy additional space, making it easy to achieve miniaturization and high integration of the laser heating device 100.

[0068] According to some embodiments of the present application, see Figure 3 and Figure 5 As shown, the first heat dissipation channel 12 of this embodiment includes a first input channel 121 and a first output channel 122 communicating with the first input channel 121 , and the second heat dissipation channel 22 includes a second input channel 221 and a second output channel 222 communicating with the second input channel 221 .

[0069] The first input channel 121 is used to introduce the heat dissipation medium into the first heat dissipation channel 12; the first output channel 122 is used to discharge the heat dissipation medium passing through the first heat dissipation channel 12. The second input channel 221 is used to introduce the heat dissipation medium into the second heat dissipation channel 22; the second output channel 222 is used to discharge the heat dissipation medium passing through the second heat dissipation channel 22.

[0070] The heat dissipation medium is also called the cooling medium, including but not limited to air, water or other coolants.

[0071] In this embodiment, through the provision of the first input channel 121, the first output channel 122, the second input channel 221 and the second output channel 222, the heat dissipation medium can smoothly flow through the first heat dissipation channel 12 and the second heat dissipation channel 22, absorb and remove the heat of the laser assembly 30, and ensure that the laser assembly 30 operates within the normal operating temperature range.

[0072] According to some embodiments of the present application, see Figure 3 and Figure 5As shown, the second surface 102 of the first laser heat sink 10 of this embodiment is provided with a first input port 13 and a first output port 14. The first input port 13 and the first output port 14 are arranged along the width direction of the laser heating device 100. The first input port 13 is connected to the first input channel 121, and the first output port 14 is connected to the first output channel 122.

[0073] In some embodiments, the heat dissipation medium enters the first input channel 121 through the first input port 13 , then flows into the first output channel 122 connected to the first input channel 121 , and is finally discharged through the first output port 14 , thereby removing heat from the laser assembly 30 .

[0074] like Figure 3 As shown, the first input port 13 and the first output port 14 are arranged on the second surface 102 of the first laser heat sink 10. The first input port 13 and the first output port 14 are arranged along the width direction of the laser heating device 100 and are located on one side of the high step among the multiple first steps 11; the first input channel 121 and the first output channel 122 are connected on one side of the low step among the multiple first steps 11; at this time, the heat dissipation medium can effectively remove the heat of the multiple laser components 30 through the first input port 13, the first input channel 121, the first output channel 122 and the first output port 14.

[0075] The second surface 202 of the second laser heat sink 20 is provided with a second input port 23 and a second output port 24. The second input port 23 and the second output port 24 are arranged along the width direction of the laser heating device 100. The second input port 23 is connected to the second input channel 221, and the second output port 24 is connected to the second output channel 222.

[0076] In some embodiments, the heat dissipation medium enters the second input channel 221 through the second input port 23 , flows into the second output channel 222 connected to the second input channel 221 , and is finally discharged through the second output port 24 , thereby removing heat from the laser assembly 30 .

[0077] like Figure 5 As shown, the second input port 23 and the second output port 24 are arranged on the second surface 202 of the second laser heat sink 20. The second input port 23 and the second output port 24 are arranged along the width direction of the laser heating device 100 and are located on one side of the high step among the multiple second steps 21; the second input channel 221 and the second output channel 222 are connected on one side of the low step among the multiple second steps 21; at this time, the heat dissipation medium can effectively remove the heat of the multiple laser components 30 through the second input port 23, the second input channel 221, the second output channel 222 and the second output port 24.

[0078] Optionally, in order to facilitate processing, the first input port 13, the first output port 14, the first input channel 121 and the first output channel 122 are milled in advance on the second surface 102 of the first laser heat sink 10, and the second input port 23, the second output port 24, the second input channel 221 and the second output channel 222 are milled in advance on the second surface 202 of the second laser heat sink 20. After being sealed by the first cover plate 80 and the second cover plate 90 respectively, the first heat dissipation channel 12 and the second heat dissipation channel 22 are formed respectively.

[0079] According to some embodiments of the present application, the laser heating device 100 also includes a plurality of first collimating lenses 31 and a plurality of second collimating lenses 32, and the plurality of first collimating lenses 31 and the plurality of second collimating lenses 32 are arranged corresponding to the plurality of laser components 30, and the first collimating lenses 31 and the second collimating lenses 32 are arranged in sequence on the light-emitting side of the corresponding laser components 30.

[0080] The first collimating lens 31 includes but is not limited to a fast-axis collimating lens; the second collimating lens 32 includes but is not limited to a slow-axis collimating lens.

[0081] In some embodiments, multiple laser assemblies 30 on multiple first steps 11 and multiple laser assemblies 30 on multiple second steps 21 are arranged horizontally in the same direction, and the first collimating lens 31 and the second collimating lens 32 are sequentially arranged on the light-emitting side of the corresponding laser assemblies 30; the first collimating lens 31 is used to perform fast-axis collimation on the light beam output by the laser assembly 30, and the second collimating lens 32 is used to perform slow-axis collimation on the light beam after fast-axis collimation, so that the light beams output by the multiple laser assemblies 30 of the laser heating device 100 are parallel light spots after fast-axis collimation and slow-axis collimation.

[0082] In some embodiments, the step height difference of the multiple first steps 11 is the same, the step height difference of the multiple second steps 21 is the same, and the step height difference of the first steps 11 is the same as the height difference of the second steps 21; the laser assembly 30 arranged on the multiple first steps 11 and the laser assembly 30 arranged on the multiple second steps 21 have the same spot height; the first laser heat sink 10 and the second laser heat sink 20 are combined facing each other, that is, when the first laser heat sink 10 and the second laser heat sink 20 are arranged relative to each other, the spot height emitted by the laser assembly 30 on the high step among the multiple first steps 11 is the same as the spot height emitted by the laser assembly 30 on the high step among the adjacent multiple second steps 21.

[0083] Since the step height difference of the multiple first steps 11 is the same, the step height difference of the multiple second steps 21 is the same, and the step height difference of the first steps 11 is the same as the height difference of the second steps 21, the light spots emitted by the multiple laser components 30 in the laser heating device 100 are distributed in a circular shape.

[0084] According to some embodiments of the present application, see Figure 7 As shown, Figure 7 yes Figure 6 FIG. 1 is a schematic diagram illustrating a structure of an embodiment in which multiple laser assemblies are connected. In this embodiment, the multiple laser assemblies 30 on the multiple first steps 11 are sequentially connected in series, and the multiple laser assemblies 30 on the multiple second steps 21 are sequentially connected in series, with the last laser assembly 30 among the multiple laser assemblies 30 on the multiple first steps 11 being connected to the last laser assembly 30 among the multiple laser assemblies 30 on the multiple second steps 21.

[0085] like Figure 7 As shown, the laser assemblies 30 on adjacent steps among the multiple first steps 11 are connected through the switching electrodes, and the negative electrode of the last laser assembly 30 on the previous first step 11 is connected to the positive electrode of the first laser assembly 30 on the next first step 11 through the connecting line 130, so that the multiple laser assemblies 30 on the multiple first steps 11 are connected in series in sequence to form a circuit series; the laser assemblies 30 on the multiple second steps 21 are connected in series in the same way; the negative electrode of the last laser assembly 30 on the multiple first steps 11 is connected to the positive electrode of the first laser assembly 30 on the multiple second steps 21 through the connecting line 130 to form a complete circuit connection of the laser heating device 100.

[0086] In this embodiment, multiple laser assemblies 30 are connected in series in sequence, so that the light beams output by each laser assembly 30 can be superimposed on each other, so that the energy distribution of the output light beams in the target area is more uniform.

[0087] Another embodiment of the present application further provides a semiconductor laser, comprising the laser heating device 100 of the above embodiment.

[0088] In summary, in the present application, the first surface 201 of the second laser heat sink 20 is arranged relative to the first surface 101 of the first laser heat sink 10, so that the multiple second steps 21 in a stepped shape are arranged relative to the multiple first steps 11 in a stepped shape. When the steps are combined in opposite directions, there is no need to be restricted by the step thickness. The distance between the first laser heat sink 10 and the second laser heat sink 20 at the combined position can be effectively reduced, thereby reducing the spot spacing, thereby improving the uniformity of the output light beam.

[0089] The above is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A laser heating device, characterized in that: include: a plurality of laser assemblies configured to output light beams; a first laser heat sink, wherein a first surface of the first laser heat sink is formed with a plurality of first steps, the plurality of first steps are in a stepped shape, a plurality of the laser assemblies are disposed on each first step, and a second surface of the first laser heat sink is used to form a first heat dissipation channel; a second laser heat sink, disposed opposite to the first laser heat sink, wherein a first surface of the second laser heat sink is formed with a plurality of second steps, the plurality of second steps being in a stepped shape, a plurality of the laser assemblies being disposed on each second step, and a second surface of the second laser heat sink being used to form a second heat dissipation channel; The first surface of the second laser heat sink is arranged opposite to the first surface of the first laser heat sink; a first supporting wall, a second supporting wall, a third supporting wall and a fourth supporting wall, wherein a plurality of the first steps are disposed between the first supporting wall and the second supporting wall, and a plurality of the second steps are disposed between the third supporting wall and the fourth supporting wall; The laser heating device further includes a first cover plate and a second cover plate, wherein the first cover plate is disposed between the first supporting wall and the second supporting wall, and the first cover plate, the second surface of the first laser heat sink, the first supporting wall, and the second supporting wall form a first heat dissipation channel; the second cover plate is disposed between the third supporting wall and the fourth supporting wall, and the second cover plate, the second surface of the second laser heat sink, the third supporting wall, and the fourth supporting wall form a second heat dissipation channel; Any two of the plurality of first steps are arranged in parallel, and the numbers of laser components on any two of the first steps are not equal; any two of the plurality of second steps are arranged in parallel, and the numbers of laser components on any two of the second steps are not equal; In the plurality of first steps, the number of laser components on the first steps decreases in sequence along the length direction of the laser heating device; in the plurality of second steps, the number of laser components on the second steps decreases in sequence along the length direction of the laser heating device; The first heat dissipation channel includes a first input channel and a first output channel communicating with the first input channel, and the second heat dissipation channel includes a second input channel and a second output channel communicating with the second input channel; The second surface of the first laser heat sink is provided with a first input port and a first output port, the first input port and the first output port are arranged along the width direction of the laser heating device, the first input port is connected to the first input channel, and the first output port is connected to the first output channel; the second surface of the second laser heat sink is provided with a second input port and a second output port, the second input port and the second output port are arranged along the width direction of the laser heating device, the second input port is connected to the second input channel, and the second output port is connected to the second output channel.

2. The laser heating device according to claim 1, characterized in that The laser heating device also includes multiple first collimating lenses and multiple second collimating lenses. The multiple first collimating lenses and the multiple second collimating lenses are arranged corresponding to the multiple laser components. The first collimating lenses and the second collimating lenses are sequentially arranged on the light-emitting side of the corresponding laser components.

3. The laser heating device according to claim 1, characterized in that The multiple laser assemblies on the multiple first steps are connected in series in sequence, the multiple laser assemblies on the multiple second steps are connected in series in sequence, and the last laser assembly among the multiple laser assemblies on the multiple first steps is connected to the last laser assembly among the multiple laser assemblies on the multiple second steps.

4. A semiconductor laser, characterized in that The invention comprises the laser heating device according to any one of claims 1 to 3.

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