Etching and spraying device for PCB (Printed Circuit Board) processing

Abstract

The invention relates to the technical field of PCB processing, in particular to a PCB processing, etching and spraying device which comprises an etching machine and two spraying mechanisms, a conveying mechanism is arranged in the etching machine, the two spraying mechanisms are symmetrically distributed at the top and the bottom of the conveying mechanism, U-shaped moving frames are arranged at the top and the bottom of the conveying mechanism, and the spraying mechanisms are arranged on the U-shaped moving frames. Transmission mechanisms are arranged in the two U-shaped moving frames, a first connecting rod and a second connecting rod are fixedly installed on one sides of the two U-shaped moving frames respectively, and a first air cylinder and a second air cylinder are fixedly installed on the side, close to the first connecting rod and the second connecting rod, of the etching machine. The spraying device has the beneficial effects that the angles of the spraying nozzles in the two spraying mechanisms are adjusted according to the depth of the hole, etching liquid sprayed in an inclined mode can forcibly enter the hole with the high thickness-diameter ratio, and therefore copper residues in the hole are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and specifically provides an etching spraying device for PCB board processing. Background Art

[0002] A PCB board is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. In PCB manufacturing, etching spraying is a key step in the etching process. By combining chemical solutions and physical spraying, the copper foil not protected by the anti-etching layer is removed to form a circuit pattern.

[0003] Generally, the PCB board is transported into the etching machine by a transport mechanism, and then the top and bottom of the PCB board are etched and sprayed by a spraying mechanism. There are holes in some PCB boards. In the prior art, the nozzles in the spraying mechanism are usually vertically arranged, and the liquid flow direction of vertical spraying is parallel to the axial direction of the through hole, resulting in that the etching liquid is difficult to effectively penetrate the hole. Especially for the deep holes of PCB boards with an aspect ratio exceeding 8:1, vertical spraying can hardly complete the etching of the hole center, which further leads to incomplete etching of the copper layer on the inner wall of the hole. Subsequently, workers need to etch the holes separately, thus affecting the processing efficiency of the PCB board. Summary of the Invention

[0004] The purpose of the present invention is to provide an etching spraying device for PCB board processing to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: An etching spraying device for PCB board processing includes an etching machine and two spraying mechanisms. A conveying mechanism is arranged inside the etching machine. The two spraying mechanisms are symmetrically distributed on the top and bottom of the conveying mechanism. U-shaped moving frames are arranged on the top and bottom of the conveying mechanism. Transmission mechanisms are arranged in both U-shaped moving frames. One side of each of the two U-shaped moving frames is fixedly installed with a connecting rod one and a connecting rod two respectively. One side of the etching machine close to the connecting rod one and the connecting rod two is fixedly installed with a cylinder one and a cylinder two respectively. The telescopic shaft end of the cylinder one is fixedly connected to the connecting rod one. The cylinder two cooperates with the connecting rod two. The telescopic shaft end of the cylinder two is fixedly installed with a receiving block. A connecting groove is opened inside the receiving block. A connecting mechanism is arranged inside the connecting rod two.

[0006] Preferably, the conveying mechanism includes a rectangular sliding frame and two rectangular fixing frames. A plurality of evenly distributed conveying rollers are rotatably installed inside the rectangular sliding frame. The two rectangular fixing frames are respectively fixedly installed at both ends inside the etching machine. A plurality of evenly distributed pulleys are rotatably installed on both sides of the rectangular sliding frame. The top and bottom of the inner walls of the two rectangular fixing frames are respectively fixedly installed with limiting sliding bars. The four limiting sliding bars cooperate with the plurality of pulleys respectively. The U-shaped moving frame at the bottom is fixedly connected to the rectangular sliding frame.

[0007] Preferably, the spraying mechanism includes a conveying pipeline. A plurality of evenly distributed hoses are communicated with one side of the conveying pipeline close to the rectangular sliding frame. One end of each of the plurality of hoses away from the conveying pipeline is communicated with a plurality of spraying pipelines. One end of each of the plurality of spraying pipelines away from their respective corresponding hoses is communicated with a plurality of evenly distributed spraying nozzles.

[0008] Preferably, the transmission mechanism includes two fixed seats. The two fixed seats are respectively fixedly connected to the inner walls on both sides of the etching machine. A plurality of evenly distributed rotating seats are rotatably installed on the opposite sides of the two fixed seats. A transmission groove is formed at one end of each of the plurality of rotating seats away from the rectangular sliding frame. Transmission rods are movably installed inside the plurality of transmission grooves. The plurality of transmission rods are all fixedly connected to the U-shaped moving frame. The plurality of spraying pipelines are respectively arranged between two opposite rotating seats.

[0009] Preferably, rectangular mounting blocks are fixedly installed on both sides of the plurality of spraying pipelines. Mounting grooves are formed inside the plurality of rotating seats. The plurality of mounting grooves cooperate with the plurality of rectangular mounting blocks respectively.

[0010] Preferably, L-shaped sliding grooves are formed inside the four fixed seats. L-shaped sliding blocks are slidably installed inside the four L-shaped sliding grooves. The four L-shaped sliding blocks are respectively fixedly connected to their respective corresponding U-shaped moving frames.

[0011] Preferably, the connecting mechanism includes a separating component one and a separating component two. The separating component one includes a lifting rod. The lifting rod is slidably and fittingly installed inside the connecting rod two. A plurality of evenly distributed clamping bars one are fixedly installed at the top of the lifting rod. A pushing plate is arranged inside the lifting rod. The bottom of the pushing plate cooperates with the lifting rod. Two guide rods are slidably sleeved at both ends of the pushing plate. The same side of the four guide rods is fixedly connected to the connecting rod two. Spring one is sleeved outside the four guide rods. A spring two is fixedly installed between the bottom of the lifting rod and the inner wall of the connecting rod two. The separating component two is arranged inside the lifting rod. A plurality of evenly distributed clamping bars two are fixedly installed at the bottom of the connecting rod one. The plurality of clamping bars two cooperate with the plurality of clamping bars one respectively.

[0012] Preferably, the second separation component includes a connecting plate and a wedge block. The wedge block is fixedly installed on one side of the etching machine close to the second connecting rod. The connecting plate is slidably and fittingly installed inside the lifting rod. A third spring is fixedly installed between the top of the connecting plate and the inner wall of the lifting rod. One end of the bottom of the connecting plate close to the pushing plate is matched with the connecting groove, and the bottom end of the connecting plate away from the pushing plate is matched with the wedge block.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Through the push of the first cylinder, the angles of the spray nozzles in the two spray mechanisms can be adjusted synchronously. When the height-to-diameter ratio of the holes in the PCB board is relatively large, it is necessary to adjust the angles of the spray nozzles in the two spray mechanisms according to the depth of the holes at this time. The etched solution sprayed obliquely can be forced into the holes with a high height-to-diameter ratio, thereby reducing the copper residue inside the holes. Moreover, the eddy current effect generated by the inclination angle can take away the bubbles inside the holes, avoiding the "etching blind area" and avoiding subsequent workers etching the holes separately, improving the processing efficiency of the PCB board.

[0014] 2. Through the arranged connecting mechanism, when the second cylinder is started, the first connecting rod and the second connecting rod are separated and cooperate with the first cylinder to achieve the effect of separately adjusting the angles of the spray nozzles in the two spray mechanisms. When the copper thickness on the upper and lower surfaces of the PCB board is different, the method of independently adjusting the angles can avoid over-etching of the upper and lower surfaces of the PCB board. At the same time, it also ensures that the etched solution can enter the holes with a high height-to-diameter ratio, meeting the etching requirements of different PCB boards. Brief Description of the Drawings

[0015] Figure 1 is the overall structural schematic diagram of the present invention; Figure 2 is the structural schematic diagram of one side of the etching machine of the present invention; Figure 3 is the partial three-dimensional structural schematic diagram of the present invention; Figure 4 is of the present invention Figure 3 Local enlarged view of A; Figure 5 is the structural schematic diagram of the spray mechanism and two U-shaped moving frames of the present invention; Figure 6 is the structural schematic diagram of the spray mechanism of the present invention; Figure 7 is of the present invention Figure 6 Local enlarged view of B; Figure 8 is the structural schematic diagram of the first cylinder of the present invention; Figure 9 is the structural schematic diagram of the second cylinder of the present invention; Figure 10Schematic diagram of the U-shaped moving frame of the present invention; Figure 11 Schematic diagram of the fixed seat of the present invention; Figure 12 Schematic diagram of the rotating seat of the present invention; Figure 13 Schematic diagram of the second connecting rod of the present invention; Figure 14 Schematic diagram of the internal structure of the second connecting rod of the present invention; Figure 15 Schematic diagram of the connecting plate of the present invention.

[0016] In the attached drawings, the list of components represented by each reference numeral is as follows: 1, etching machine; 2, rectangular sliding frame; 3, conveying roller; 4, rectangular fixing frame; 5, pulley; 6, limiting slide bar; 7, conveying pipeline; 8, hose; 9, spray pipeline; 10, spray nozzle; 11, U-shaped moving frame; 12, fixed seat; 13, rotating seat; 14, transmission groove; 15, transmission rod; 16, rectangular mounting block; 17, mounting groove; 18, L-shaped sliding groove; 19, L-shaped slider; 20, first connecting rod; 21, second connecting rod; 22, first cylinder; 23, second cylinder; 24, receiving block; 25, connecting groove; 26, lifting rod; 27, first clamping bar; 28, pushing plate; 29, guiding rod; 30, first spring; 31, second spring; 32, second clamping bar; 33, connecting plate; 34, third spring; 35, wedge-shaped block. Detailed implementation manners

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] The present invention provides a technical solution: As Figure 1 - Figure 15A PCB board processing etching spray device is shown, including an etching machine 1 and two spray mechanisms. A conveying mechanism is arranged inside the etching machine 1. The two spray mechanisms are symmetrically distributed at the top and bottom of the conveying mechanism. U-shaped moving frames 11 are arranged at both the top and bottom of the conveying mechanism. Transmission mechanisms are arranged in both of the two U-shaped moving frames 11. One side of each of the two U-shaped moving frames 11 is fixedly installed with a connecting rod one 20 and a connecting rod two 21 respectively. One side of the etching machine 1 close to the connecting rod one 20 and the connecting rod two 21 is fixedly installed with a cylinder one 22 and a cylinder two 23. The telescopic shaft end of the cylinder one 22 is fixedly connected with the connecting rod one 20. The cylinder two 23 cooperates with the connecting rod two 21. The telescopic shaft end of the cylinder two 23 is fixedly installed with a receiving block 24. A connecting groove 25 is opened inside the receiving block 24. A connecting mechanism is arranged inside the connecting rod two 21.

[0019] The conveying mechanism includes a rectangular sliding frame 2 and two rectangular fixing frames 4. A plurality of evenly distributed conveying rollers 3 are rotatably installed inside the rectangular sliding frame 2. The two rectangular fixing frames 4 are respectively fixedly installed at both ends inside the etching machine 1. A plurality of evenly distributed pulleys 5 are rotatably installed on both sides of the rectangular sliding frame 2. The top and bottom of the inner walls of the two rectangular fixing frames 4 are fixedly installed with limiting sliding strips 6 respectively. The four limiting sliding strips 6 cooperate with the plurality of pulleys 5 respectively. The U-shaped moving frame 11 at the bottom is fixedly connected with the rectangular sliding frame 2.

[0020] The spray mechanism includes a conveying pipeline 7. A plurality of evenly distributed hoses 8 are communicated on one side of the conveying pipeline 7 close to the rectangular sliding frame 2. One end of each of the plurality of hoses 8 far from the conveying pipeline 7 is communicated with a plurality of spray pipelines 9. One end of each of the plurality of spray pipelines 9 far from their respective corresponding hoses 8 is communicated with a plurality of evenly distributed spray nozzles 10.

[0021] The transmission mechanism includes two fixed seats 12. The two fixed seats 12 are respectively fixedly connected with the inner walls on both sides of the etching machine 1. A plurality of evenly distributed rotating seats 13 are rotatably installed on the opposite sides of the two fixed seats 12. A transmission groove 14 is opened at one end of each of the plurality of rotating seats 13 far from the rectangular sliding frame 2. Transmission rods 15 are movably installed inside the plurality of transmission grooves 14. The plurality of transmission rods 15 are all fixedly connected with the U-shaped moving frame 11. The plurality of spray pipelines 9 are respectively arranged between two opposite rotating seats 13.

[0022] Rectangular mounting blocks 16 are fixedly installed on both sides of the plurality of spray pipelines 9. Mounting grooves 17 are opened inside the plurality of rotating seats 13. The plurality of mounting grooves 17 cooperate with the plurality of rectangular mounting blocks 16 respectively.

[0023] L-shaped sliding grooves 18 are opened inside the four fixed seats 12. L-shaped sliding blocks 19 are slidably installed inside the four L-shaped sliding grooves 18. The four L-shaped sliding blocks 19 are respectively fixedly connected with their corresponding U-shaped moving frames 11.

[0024] The connecting mechanism includes a first separating component and a second separating component. The first separating component includes a lifting rod 26 which is slidably and fittingly installed inside the second connecting rod 21. At the top of the lifting rod 26, a plurality of evenly distributed first clamping strips 27 are fixedly installed. Inside the lifting rod 26, a pushing plate 28 is arranged. The bottom of the pushing plate 28 cooperates with the lifting rod 26. At both ends of the pushing plate 28, two guiding rods 29 are slidably sleeved respectively. On the same side of the four guiding rods 29, they are all fixedly connected to the second connecting rod 21. On the outside of the four guiding rods 29, a first spring 30 is sleeved respectively. Between the bottom of the lifting rod 26 and the inner wall of the second connecting rod 21, a second spring 31 is fixedly installed. The second separating component is arranged inside the lifting rod 26. At the bottom of the first connecting rod 20, a plurality of evenly distributed second clamping strips 32 are fixedly installed. The plurality of second clamping strips 32 cooperate with the plurality of first clamping strips 27 respectively.

[0025] The second separating component includes a connecting plate 33 and a wedge-shaped block 35. The wedge-shaped block 35 is fixedly installed on one side of the etching machine 1 close to the second connecting rod 21. The connecting plate 33 is slidably and fittingly installed inside the lifting rod 26. Between the top of the connecting plate 33 and the inner wall of the lifting rod 26, a third spring 34 is fixedly installed. One end of the bottom of the connecting plate 33 close to the pushing plate 28 cooperates with the connecting groove 25. The bottom end of the connecting plate 33 away from the pushing plate 28 cooperates with the wedge-shaped block 35.

[0026] Working principle: Before spraying and etching the PCB board, by installing a driving mechanism, multiple conveying rollers 3 are rotated. Both of the two conveying pipes 7 are connected to the device for conveying etching solution. The driving mechanism, how to rotate the multiple conveying rollers 3 and the device for conveying etching solution are all prior arts and will not be elaborated here. The PCB board to be processed is placed on the top of the rectangular sliding frame 2. With the rotation of the multiple conveying rollers 3, the PCB board can be conveyed into the etching machine 1. Subsequently, the device for conveying etching solution feeds the etching solution into the two conveying pipes 7. The conveying liquid inside the two conveying pipes 7 then enters the multiple spray pipes 9 through multiple hoses 8, and finally sprays onto the surface of the PCB board through multiple spray nozzles 10 for etching.

[0027] When the height-to-diameter ratio of the hole in the PCB board is relatively large, it is necessary to adjust the angles of the spray nozzles 10 in the two spray mechanisms according to the depth of the hole. The etching liquid sprayed obliquely can be forced into the hole with a high aspect ratio, thereby reducing the copper residue inside the hole. In addition, the eddy current effect generated by the oblique angle can take away the bubbles in the hole to avoid the "etching blind area". There are two ways to adjust the angles of the spray nozzles 10 in the two spray mechanisms. Method 1: Start the cylinder 1 22. At this time, the connecting rod 1 20 is connected to the connecting rod 21. Therefore, when the cylinder 1 22 pushes the connecting rod 1 20, the connecting rod 21 moves synchronously, and the two U-shaped moving frames 11 move synchronously. The two U-shaped moving frames 11 installed on the two U-shaped moving frames 11 move synchronously. The L-shaped sliders 19 in the U-shaped moving frame 11 slide inside the corresponding L-shaped slide grooves 18. The mutual cooperation of the four L-shaped sliders 19 and the four L-shaped slide grooves 18 improves the stability of the two U-shaped moving frames 11 when moving. With the movement of the two U-shaped moving frames 11, the multiple transmission rods 15 move inside the corresponding transmission grooves 14, and the multiple rotating seats 13 are all rotated under force, thereby driving the multiple spray pipes 9 to rotate, and then adjusting the angles of the multiple spray nozzles 10. This method achieves the effect of synchronously adjusting the spray nozzles 10 in the two spray mechanisms through the cylinder 22. The parameter setting of the adjustment angle of the entire device is simple, which is suitable for standardized mass production of PCB boards.

[0028] Method 2: First, start the cylinder 23, which pushes the receiving block 24 into the interior of the connecting rod 21. The receiving block 24 exerts a force on the push plate 28. The push plate 28 is forced to move synchronously with the receiving block 24. The push plate 28 moves along the four guide rods 29 and squeezes the four springs 30. The bottom of the push plate 28 contacts the inclined surface of the lifting rod 26. Therefore, when the push plate 28 moves, its bottom acts on the inclined surface, and the lifting rod 26 is forced to move downward and squeeze the spring 2 31 at the bottom. Due to the descent of the lifting rod 26, the card strip 1 27 on its top moves downward, thereby disengaging from the multiple card strips 2 32, and the lifting rod 26 is separated from the connecting rod 1 20, thereby separating the connecting rod 21 from the connecting rod 1 20. At this time, the connecting plate 3 One end of the connecting rod 21 cannot move downward under the action of the wedge block 35. Subsequently, when the receiving block 24 moves to the maximum position inside the connecting rod 21, the connecting rod 21 starts to move synchronously with the receiving block 24. When the connecting plate 33 and the wedge block 35 are staggered, the connecting plate 33 moves downward under the action of the spring 34 at its top, and its bottom end is stuck in the inside of the connecting groove 25. The connecting rod 21 can move left and right under the action of the cylinder 23, and the angle of the spray nozzle 10 in the lower spray mechanism is adjusted separately, and the cylinder 1 22 adjusts the angle of the spray nozzle 10 in the upper spray mechanism separately. When the copper thickness of the upper and lower surfaces of the PCB board is different, the method of independently adjusting the angle can avoid excessive etching of the upper and lower surfaces of the PCB board, and at the same time, it also ensures that the etching liquid can enter the hole with a high aspect ratio.

[0029] When the two spraying mechanisms in the second mode are reset, first, the connecting rod 20 is reset by the cylinder 1 22. Subsequently, the connecting rod 2 21 is pulled to reset by the cylinder 2 23. As the connecting rod 2 21 moves, the wedge block 35 acts on the connecting plate 33, and the connecting plate 33 is forced to move upward. When the connecting rod 2 21 moves to the extreme position close to the cylinder 2 23 side, the connecting plate 33 completely disengages from the inside of the connecting groove 25. As the receiving block 24 is gradually reset, the pushing plate 28 is reset under the action of the four springs 1 30, and the lifting rod 26 is reset upward under the action of the spring 2 31, and drives a plurality of first latches 27 to engage into a plurality of second latches 32, realizing the reconnection between the connecting rod 2 21 and the connecting rod 1 20.

[0030] In the first mode and the second mode, while the U-shaped moving frame 11 below moves, the rectangular sliding frame 2 moves synchronously, driving a plurality of pulleys 5 to move along the corresponding limiting slide bars 6, avoiding the etching solution sprayed by the spray nozzles 10 in the lower spraying mechanism from acting on the outside of the plurality of conveying rollers 3 when the moving angle of the spray nozzles 10 is relatively large.

[0031] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0032] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB board processing etching spraying device, comprising an etching machine (1) and two spraying mechanisms, characterized in that: Inside the etching machine (1), a conveying mechanism is provided. Two spraying mechanisms are symmetrically distributed at the top and bottom of the conveying mechanism. U-shaped moving frames (11) are provided at the top and bottom of the conveying mechanism. Transmission mechanisms are provided in both U-shaped moving frames (11). One side of each of the two U-shaped moving frames (11) is fixedly installed with a connecting rod one (20) and a connecting rod two (21) respectively. On one side of the etching machine (1) close to the connecting rod one (20) and the connecting rod two (21), a cylinder one (22) and a cylinder two (23) are fixedly installed. The telescopic shaft end of the cylinder one (22) is fixedly connected to the connecting rod one (20). The cylinder two (23) cooperates with the connecting rod two (21). The telescopic shaft end of the cylinder two (23) is fixedly installed with a receiving block (24). A connecting groove (25) is opened inside the receiving block (24). A connecting mechanism is provided inside the connecting rod two (21).

2. The PCB board processing etching spray device according to claim 1, wherein: The conveying mechanism includes a rectangular sliding frame (2) and two rectangular fixing frames (4). Inside the rectangular sliding frame (2), multiple evenly distributed conveying rollers (3) are rotatably installed. The two rectangular fixing frames (4) are respectively fixedly installed at both ends inside the etching machine (1). Multiple evenly distributed pulleys (5) are rotatably installed on both sides of the rectangular sliding frame (2). Limiting slide bars (6) are fixedly installed at the top and bottom of the inner walls of the two rectangular fixing frames (4). The four limiting slide bars (6) cooperate with multiple pulleys (5) respectively. The U-shaped moving frame (11) at the bottom is fixedly connected to the rectangular sliding frame (2).

3. The PCB board processing etching spray device according to claim 1, characterized in that: The spraying mechanism includes a conveying pipeline (7). Multiple evenly distributed hoses (8) are communicated on one side of the conveying pipeline (7) close to the rectangular sliding frame (2). One end of each of the multiple hoses (8) far from the conveying pipeline (7) is communicated with multiple spraying pipelines (9). One end of each of the multiple spraying pipelines (9) far from their respective corresponding hoses (8) is communicated with multiple evenly distributed spraying nozzles (10).

4. A PCB board processing etching spray device according to claim 3, characterized in that: The transmission mechanism includes two fixed seats (12). The two fixed seats (12) are respectively fixedly connected to the inner walls on both sides of the etching machine (1). Multiple evenly distributed rotating seats (13) are rotatably installed on the opposite sides of the two fixed seats (12). A transmission groove (14) is opened at one end of each of the multiple rotating seats (13) far from the rectangular sliding frame (2). Transmission rods (15) are movably installed inside the multiple transmission grooves (14). The multiple transmission rods (15) are all fixedly connected to the U-shaped moving frame (11). The multiple spraying pipelines (9) are respectively arranged between two opposite rotating seats (13).

5. The PCB board processing etching spray device according to claim 4, characterized in that: Rectangular mounting blocks (16) are fixedly installed on both sides of the multiple spraying pipelines (9). Mounting grooves (17) are opened inside the multiple rotating seats (13). The multiple mounting grooves (17) cooperate with the multiple rectangular mounting blocks (16) respectively.

6. A PCB board processing etching spray device according to claim 4, characterized in that: L-shaped chutes (18) are formed inside each of the four fixing seats (12). L-shaped sliders (19) are slidably installed inside the four L-shaped chutes (18). The four L-shaped sliders (19) are fixedly connected to their respective U-shaped moving frames (11).

7. The PCB board processing etching spray device according to claim 1, characterized in that: The connecting mechanism includes a first separating component and a second separating component. The first separating component includes a lifting rod (26). The lifting rod (26) is slidably and fittingly installed inside the connecting rod two (21). A plurality of evenly distributed first clamping strips (27) are fixedly installed at the top of the lifting rod (26). A pushing plate (28) is arranged inside the lifting rod (26). The bottom of the pushing plate (28) cooperates with the lifting rod (26). Two guide rods (29) are slidably sleeved at both ends of the pushing plate (28). The same side of the four guide rods (29) is fixedly connected to the connecting rod two (21). A first spring (30) is sleeved outside the four guide rods (29). A second spring (31) is fixedly installed between the bottom of the lifting rod (26) and the inner wall of the connecting rod two (21). The second separating component is arranged inside the lifting rod (26). A plurality of evenly distributed second clamping strips (32) are fixedly installed at the bottom of the connecting rod one (20). The plurality of second clamping strips (32) cooperate with the plurality of first clamping strips (27) respectively.

8. A PCB board processing etching spray device according to claim 7, characterized in that: The second separating component includes a connecting plate (33) and a wedge-shaped block (35). The wedge-shaped block (35) is fixedly installed on one side of the etching machine (1) close to the connecting rod two (21). The connecting plate (33) is slidably and fittingly installed inside the lifting rod (26). A third spring (34) is fixedly installed between the top of the connecting plate (33) and the inner wall of the lifting rod (26). One end of the bottom of the connecting plate (33) close to the pushing plate (28) cooperates with the connecting groove (25). The bottom end of the connecting plate (33) away from the pushing plate (28) cooperates with the wedge-shaped block (35).

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