Glue uniformizing unit

Abstract

The utility model provides a glue uniformizing unit which comprises a glue uniformizing unit body provided with a sliding rail. The wafer bearing module is located on the glue uniformizing unit main body and is opposite to the sliding rail, the wafer bearing module is used for placing a wafer, and the wafer bearing module can rotate around a central shaft of the wafer bearing module; one end of the spraying arm is located in the sliding rail and the other end is connected with the nozzle; the spray head is provided with at least one spray nozzle, the bottom surface of each spray nozzle is provided with at least one liquid outlet hole for spraying photoresist, and when the spray nozzles spray the photoresist, the spray arm moves in the sliding rail to drive the spray head to move from the circle center of the wafer to the edge of the wafer. According to the photoresist uniformizing unit, in the photoresist spraying process, the wafer bearing module rotates the wafer, the spraying arm drives the spraying head to move, and the nozzle on the spraying head is provided with the multiple liquid outlet holes, so that the photoresist spraying uniformity can be improved, and the problem of non-uniform coating is avoided.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing, and particularly to a spin coating unit. Background Art

[0002] In the photoresist coating process of semiconductor device manufacturing, spin coating or spray coating can be used. Among them, spin coating is to spray a specific amount of diluted photoresist at the center position of the wafer, and then rotate the wafer, and the centrifugal force during high-speed rotation evenly distributes the photoresist on the wafer. Whether the photoresist coating is uniform is related to the manufacturing accuracy of the semiconductor manufacturing process. Under this background, how to improve the coating uniformity of the photoresist has become a technical problem that those skilled in the art urgently need to solve. Summary of the Utility Model

[0003] To solve the above technical problems, the embodiments of the present application provide a spin coating unit, including:

[0004] A spin coating unit main body, on which a slide rail is arranged along the extending direction of the spin coating unit main body;

[0005] A wafer carrier module, located on the spin coating unit main body and oppositely arranged with the slide rail, the wafer carrier module is used to place the wafer, and the wafer carrier module can rotate around the central axis of the wafer carrier module;

[0006] A spray arm, one end of which is located in the slide rail and the other end is connected to a nozzle;

[0007] At least one nozzle is arranged on the nozzle. Wherein, at least one liquid outlet hole for spraying photoresist is arranged on the bottom surface of each nozzle. When the nozzle sprays photoresist, the spray arm moves in the slide rail to drive the nozzle to move from the edge of the wafer along the diameter direction of the wafer, and the diameter direction of the wafer is parallel to the extending direction of the spin coating unit main body.

[0008] The spin coating unit provided by the embodiment of the present application, on the one hand, by arranging a slide rail on the main body of the spin coating unit, during the process of spraying photoresist, the spraying arm located in the slide rail can drive the nozzle to move from the center of the wafer (the wafer to be sprayed located on the wafer carrier module) to the edge of the wafer; at the same time, since the wafer carrier module is arranged to be rotatable around the central axis of the wafer carrier module, therefore, while the nozzle is moving, the wafer carrier module can drive the wafer to rotate, so that the photoresist can be evenly sprayed on the wafer; on the other hand, the embodiment of the present application arranges at least one nozzle with a plurality of liquid outlet holes on the nozzle, so that when using the spin coating unit to spray photoresist, the photoresist ejected from the nozzle corresponding to the nozzle can be dispersed and sprayed on the wafer (such as photoresist with a relatively high viscosity) through the nozzle with a plurality of liquid outlet holes, thereby reducing the viscosity of the photoresist sprayed on the wafer, and further making the photoresist sprayed on the wafer evenly distributed in the working environment where the wafer carrier module drives the wafer to rotate and the spraying arm moves, improving the coating uniformity of the photoresist, and avoiding the problem of uneven coating. Description of the Drawings

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0010] Figure 1 It is a schematic diagram of the spin coating unit provided by the embodiment of the present application.

[0011] Figure 2 It is a schematic diagram of the idle state of the spin coating unit provided by the embodiment of the present application.

[0012] Figure 3 It is a schematic diagram of the spin coating unit provided by the embodiment of the present application spraying photoresist.

[0013] Figure 4 It is a schematic diagram of a nozzle of the spin coating unit provided by the embodiment of the present application.

[0014] Figure 5 It is a schematic diagram of another nozzle of the spin coating unit provided by the embodiment of the present application.

[0015] Figure 6 It is a schematic diagram of a wafer after the spin coating unit provided by the embodiment of the present application sprays photoresist.

[0016] Figure 7 It is a schematic diagram of another wafer after the spin coating unit provided by the embodiment of the present application sprays photoresist.

[0017]

[0018] Detailed implementation manners

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0020] In the process of manufacturing semiconductor devices, photoresist coating is a key step. Currently, spin coating and spray coating are mainly used for photoresist coating. The operation of spin coating is to first spray a specific amount of diluted photoresist at the center of the wafer, and then rotate the wafer at a high speed. The centrifugal force is used to evenly distribute the photoresist on the surface of the wafer, and the excess photoresist is thrown out of the wafer.

[0021] However, in some processes with a relatively large thickness of the photoresist layer, the viscosity of the photoresist used is relatively high, and poor coating is likely to occur during the spin coating process, which affects the quality of the final product.

[0022] Based on this, the present application provides a spin coater unit to improve the coating uniformity of the photoresist. Please refer to Figure 1 , Figure 1 which is a schematic diagram of the spin coater unit provided by the embodiment of the present application.

[0023] As Figure 1 shown, the spin coater unit provided by the present application includes:

[0024] The main body 1 of the spin coater unit is provided with a slide rail 21 along the extension direction A of the main body of the spin coater unit;

[0025] The wafer carrier module 3 is located on the main body 1 of the spin coater unit and is disposed opposite to the slide rail 21. The wafer carrier module 3 is used to place the wafer 6 (shown in Figure 3 ), and the wafer carrier module 3 can rotate around its central axis;

[0026] The spraying arm 22 has one end located in the slide rail 21 and the other end connected to the nozzle 23;

[0027] At least one nozzle 24 is provided on the nozzle head 23. Each nozzle 24 is provided with at least one liquid outlet hole 25 (not shown in the figure) for spraying photoresist. When the nozzle 24 sprays photoresist, the spraying arm 22 moves within the slide rail 21 to drive the nozzle head 23 to move from the edge of the wafer 6 along the diameter direction B of the wafer 6. The diameter direction B of the wafer is parallel to the extending direction A of the spin coating unit main body.

[0028] In the spin coating unit provided in the embodiment of the present application, the shape of the spin coating unit main body 1 can be a cuboid, and the slide rail 21 can be arranged on the top surface of the spin coating unit main body 1. For example, Figure 1 Taking the placement position of the shown spin coating unit as an example, the slide rail 21 is located on the top surface C of the spin coating unit main body 1.

[0029] The shape of the wafer carrier module 3 is not limited, as long as it can place the wafer 6 and rotate around its own central axis.

[0030] For example, as Figure 1 shown, in the spin coating unit provided in the embodiment of the present application, the top surface of the wafer carrier module 3 can be disc-shaped, so as to facilitate placing the wafer to be sprayed on the disc-shaped top surface of the wafer carrier module 3. Of course, in some other embodiments, the top surface of the wafer carrier module 3 can also be in the shape of a ring, a cross, etc., as long as it can be used to place the wafer 6.

[0031] When the spin coating unit is ready to spray photoresist, the spraying arm 22 drives the nozzle head 23 to move within the slide rail 21, so that the nozzle head 23 moves directly above the wafer carrier module 3, so that the nozzles 24 on the nozzle head 23 can be aligned with the wafer 6 placed on the wafer carrier module 3. At this time, the wafer carrier module 3 starts to rotate, and at the same time the spraying arm 22 moves within the slide rail 21 to drive the nozzles 24 to move from the edge of the wafer 6 along the diameter direction B of the wafer 6. Since the diameter direction B of the wafer 6 is parallel to the extending direction A of the spin coating unit main body, through the mutual cooperation of the movement of the spraying arm 22 driving the nozzle head 23 and the rotation of the wafer carrier module 3 driving the wafer 6, during the process of the nozzle 24 spraying photoresist, the photoresist can be sprayed on the wafer 6 in a spiral shape; at the same time, since there are multiple nozzles 24 on one nozzle head 23, the photoresist ejected by the nozzle head 23 can be ejected dispersedly by multiple nozzles 24, so as to achieve the effect of diluting the viscosity of the photoresist, reducing the viscosity of the photoresist sprayed on the wafer 6 (such as photoresist with a relatively high viscosity), so that in the subsequent process, the uniform coating of the photoresist can be better realized.

[0032] It can be seen that for the spin coating unit provided in the embodiments of the present application, on the one hand, by providing a slide rail on the main body of the spin coating unit, during the process of spraying photoresist, the spraying arm located in the slide rail can drive the nozzle to move from the center of the wafer (the wafer to be sprayed located on the wafer carrier module) to the edge of the wafer; at the same time, since the wafer carrier module is arranged to be rotatable around the central axis of the wafer carrier module, therefore, while the nozzle is moving, the wafer carrier module can drive the wafer to rotate, so that the photoresist can be evenly sprayed on the wafer; on the other hand, the embodiments of the present application are provided with at least one nozzle having a plurality of liquid outlet holes on the nozzle, so that when using the spin coating unit to spray photoresist, the photoresist ejected from the nozzle corresponding to the nozzle can be dispersed and sprayed on the wafer (such as photoresist with a higher viscosity) through the nozzle having a plurality of liquid outlet holes, thereby reducing the viscosity of the photoresist sprayed on the wafer, and further making the photoresist sprayed on the wafer evenly distributed in the working environment where the wafer carrier module drives the wafer to rotate and the spraying arm moves, improving the coating uniformity of the photoresist, and avoiding the problem of uneven coating.

[0033] Among them, in some embodiments, during the process of the nozzle 24 spraying photoresist, the wafer carrier module 3 can rotate at an angular velocity of 10 - 100 rad / s. For example, the angular velocity of the wafer carrier module 3 can be 10 rad / s, 40 rad / s, 75 rad / s, 100 rad / s, etc.; the speed at which the spraying arm 22 drives the nozzle 23 to move in the slide rail 21 can be 5 - 30 mm / s. For example, the moving speed of the spraying arm 22 driving the nozzle 23 can be 5 mm / s, 15 mm / s, 24 mm / s, 30 mm / s, etc.

[0034] During the process of the nozzle 24 spraying photoresist, the distance in the height direction H between the nozzle 24 and the wafer carrier module 3 is 10 - 40 mm, such as 10 mm, 20 mm, 25 mm, 40 mm, etc.

[0035] In some embodiments, according to the viscosity of the photoresist to be sprayed, during the process of the nozzle 24 spraying photoresist, the rotation speed of the wafer carrier module 3, the speed at which the spraying arm 22 drives the nozzle 23 to move in the slide rail 21, and the distance in the height direction H between the nozzle 24 and the wafer carrier module 3 can be adjusted. For example, for photoresist with a higher viscosity, during the process of the nozzle 24 spraying photoresist, the rotation speed of the wafer carrier module 3 and the speed at which the spraying arm 22 drives the nozzle 23 to move in the slide rail 21 can be reduced, and the distance in the height direction H between the nozzle 24 and the wafer carrier module 3 can be increased, further ensuring the even distribution of the photoresist, avoiding the problem of uneven coating during the subsequent rotation process, and ensuring the stability of the process.

[0036] Of course, after the photoresist is sprayed, during the subsequent process, the wafer carrier module 3 can continue to rotate (for example, rotate at a speed lower than that during the process of spraying photoresist onto the wafer carrier module by the nozzle), so as to further evenly coat the spiral photoresist already sprayed on the wafer 6 by using centrifugal force, avoid the problem of uneven coating, and ensure the stability of the process.

[0037] In some embodiments, as Figure 1 shown, the spraying arm 22 may include:

[0038] A spraying arm support 221, one end of which is located in the slide rail;

[0039] A spraying arm connecting member 222, one end of which is connected to the other end of the spraying arm support 221, and the other end is connected to the nozzle 23. The spraying arm connecting member 222 can move along the vertical direction Y of the spraying arm support 221.

[0040] The spraying arm support 221 can move in the slide rail 21 to drive the spraying arm connecting member 222, the nozzle 23, and the nozzle 24 to move along the diameter direction B of the wafer 6. The spraying arm connecting member 222 can move up and down along the vertical direction Y of the spraying arm support 221 through a slide rail or a roller provided on the spraying arm support 221, so that the distance between the nozzle 24 and the wafer carrier module 3 in the height direction H can be adjusted.

[0041] In some embodiments, as Figure 1 shown, the spin coating unit further includes a nozzle placement table 4, which is located on the spin coating unit main body 1. The nozzle placement table 4 has at least one nozzle placement groove 41, and the position of the nozzle placement groove 41 on the nozzle placement table 4 corresponds to the position of the nozzle 24 on the nozzle 23.

[0042] Figure 2 is a schematic diagram of the idle state of the spin coating unit provided by the embodiment of the present application. As Figure 2 shown, the purpose of setting the nozzle placement table 4 is to place the nozzle 24 in the nozzle placement groove 41 when the spin coating unit is in the idle state, which can effectively prevent the photoresist at the nozzle 24 from crystallizing due to drying, and avoid the problem that the nozzle 24 cannot evenly spray the photoresist or cannot spray the photoresist.

[0043] In some embodiments, as Figure 1 shown, the nozzle 23 can be a rectangular plate, and 16 nozzles 24 are provided on the nozzle. The distribution mode of each nozzle 24 is 2 rows and 8 columns, and they are arranged at equal intervals on the nozzle 23. Among them, every 2 rows of nozzles 24 are used to spray the same type of photoresist.

[0044] The arrangement with equal spacing enables the two nozzles in the same column to spray photoresist above the wafer 6 simultaneously when the nozzle sprays photoresist, further improving the uniformity of photoresist spraying.

[0045] Since different processes require different types of photoresist, in order to meet the requirement that the nozzle can spray the photoresist required by different processes in the same spin coating unit, in its embodiments, two nozzles in each of the 8 columns of nozzles are respectively used to spray the same type of photoresist. For example, when photoresist a1 needs to be sprayed, the two nozzles in the first column are used to spray simultaneously; when photoresist b1 needs to be sprayed, the two nozzles in the sixth column are used to spray simultaneously, and so on.

[0046] In some embodiments, as Figure 1 shown, the wafer carrier module 3 may include:

[0047] A first wafer carrier module 31 and a second wafer module 32. In the extending direction A parallel to the spin coating unit, the first wafer carrier module 31 and the second wafer carrier module 32 are oppositely arranged;

[0048] The nozzle placement table 4 is located between the first wafer carrier module 31 and the second wafer carrier module 32.

[0049] The purpose of setting the second wafer carrier module 32 is to better utilize the internal space of the spin coating unit and improve production efficiency.

[0050] Among them, in some embodiments, during the process of the nozzle 24 spraying photoresist, the second wafer carrier module 32 can rotate at an angular velocity of 10 - 100 rad / s, such as 10 rad / s, 40 rad / s, 75 rad / s, 100 rad / s, etc.; the speed at which the spraying arm 22 drives the nozzle 23 to move in the slide rail 21 is 5 - 30 mm / s, such as 5 mm / s, 15 mm / s, 24 mm / s, 30 mm / s, etc.; during the process of the nozzle 24 spraying photoresist, the distance of the nozzle 24 from the second wafer carrier module 32 in the height direction H is 10 - 40 mm, such as 10 mm, 20 mm, 25 mm, 40 mm, etc.

[0051] During the process of spraying photoresist, the nozzle 23 located on the nozzle placement table 4 can be taken out, and the spraying arm 22 drives the nozzle 23 to move along the diameter direction B of the wafer 6 from the edge position of the first wafer carrier module 31 or the second wafer carrier module 32. For example, Figure 1Taking the placement position of the spin coating unit shown as an example, the spraying arm 22 drives the nozzle 23 to move from the left side L of the first wafer carrier module 31 along the diameter direction B of the wafer 6 towards the right side R of the first wafer carrier module 31. Of course, it can also be that the spraying arm 22 drives the nozzle 23 to move from the right side R of the first wafer carrier module 31 along the diameter direction B of the wafer 6 towards the left side L of the first wafer carrier module 31.

[0052] Figure 3 It is a schematic diagram of spraying photoresist of the spin coating unit provided by an embodiment of the present application.

[0053] In some embodiments, as Figure 3 shown, the spin coating unit further includes a nozzle sensor 241, fixed on one side of each nozzle 24, and the nozzle sensor is used to detect whether the position of the nozzle corresponds to the position of the wafer carrier module. When the nozzle sensor detects that the position of the nozzle does not correspond to the wafer carrier module, the spraying of photoresist is stopped.

[0054] The nozzle sensor 241 is used to detect whether the nozzle 24 is in the upper area of the wafer carrier module 3. When the nozzle 24 leaves the upper area of the wafer carrier module 3, the spraying of photoresist is stopped.

[0055] Among them, the nozzle sensor 241 can emit a signal and judge whether the nozzle 24 is in the upper area of the wafer carrier module 3 by receiving the reflected signal of the wafer 6. In some specific embodiments, the nozzle sensor 241 can emit an optical signal and judge whether the nozzle 24 is in the upper area of the wafer carrier module 3 by analyzing the reflected wavelength of the received wafer 6. When the nozzle 24 is not in the upper area of the wafer carrier module 3, the nozzle 24 will not spray photoresist.

[0056] In addition, the nozzle sensor 241 can also be used to monitor whether the nozzle 24 can spray photoresist normally. When the nozzle 24 cannot spray photoresist normally, the nozzle sensor 241 will issue an alarm, indicating a fault of the spin coating unit, and cause the spin coating unit to stop working.

[0057] Figure 4 It is a schematic diagram of a nozzle of the spin coating unit provided by an embodiment of the present application.

[0058] As Figure 4 shown, in some embodiments, the nozzle 24 can be a cylinder with a diameter of 5 cm.

[0059] Setting the nozzle 24 as a cylinder can facilitate better utilization of the area of the nozzle 23 and set more nozzles 24.

[0060] In one embodiment, when the nozzle 24 is a cylindrical nozzle 24, the liquid outlet holes 25 can be circular liquid outlet holes. There are 17 circular liquid outlet holes distributed in the circular area at one end of the nozzle 24 far from the nozzle head 23. Among them, each circular liquid outlet hole includes a circular liquid outlet hole located at the center of the circular area, and the remaining circular liquid outlet holes surround the circular liquid outlet hole located at the center of the circular area and are equally spaced in the radial direction of the circular area.

[0061] There are 17 circular liquid outlet holes 25 distributed in the circular area at one end of the nozzle 24 far from the nozzle head 23. The distribution mode of the liquid outlet holes is as follows: a central liquid outlet hole, located at the center of the bottom surface of the nozzle head (that is, a circular liquid outlet hole located at the center of the circular area).

[0062] The remaining circular liquid outlet holes surround the circular liquid outlet hole located at the center of the circular area and are equally spaced in the radial direction of the circular area. It can be: two concentric circles (the first concentric circle and the second concentric circle) are divided in the circular area according to the center of the circular area. Among them, 8 circular liquid outlet holes are equally spaced on the first concentric circle and are at equal distances from the central liquid outlet hole; 8 circular liquid outlet holes are equally spaced on the second concentric circle, and the distance from the central liquid outlet hole is greater than that of the first circle of liquid outlet holes.

[0063] Equal setting of each circular liquid outlet hole according to the circular area of the nozzle can make the ejected photoresist more uniform.

[0064] In one embodiment, the diameter of each circular liquid outlet hole is 0.8 cm.

[0065] As Figure 4 The distribution mode of the circular liquid outlet holes and the shape of the nozzle 24 shown can further ensure the uniformity of the sprayed photoresist. Especially for the photoresist with high viscosity, it can be ejected in an atomized state, so that the photoresist is evenly covered on the wafer surface.

[0066] Figure 5 It is a schematic diagram of another nozzle of the spin coating unit provided by the embodiment of the present application.

[0067] As Figure 5 shown, in some other embodiments, Figure 4 the 8 circular liquid outlet holes equally spaced on the second concentric circle are increased to 16. Compared with Figure 4 the nozzle 24 shown, it can make the photoresist more evenly cover the wafer surface.

[0068] Figure 6 It is a schematic diagram of a wafer after the spin coating unit provided by the embodiment of the present application sprays photoresist.

[0069] In some embodiments, the liquid outlet hole 25 is a single circular liquid outlet hole. For example, Figure 6 As shown, after the photoresist is sprayed by the nozzle 24, the photoresist sprayed on the wafer 6 is a plurality of circular glue spots distributed in a spiral pattern. After that, the wafer carrier module 3 will also rotate at a speed of 100 - 400 rad / min, so that the circular glue spots spread outwards under the action of centrifugal force and evenly cover the wafer 6. Among them, the rotation speed of the wafer carrier module 3 can be 100 rad / min, 250 rad / min, 320 rad / min, 400 rad / min, etc.

[0070] When the wafer carrier module of the spin coating unit includes the first wafer carrier module 31 and the second wafer carrier module 32, the second wafer carrier module 32 is the same as the first wafer carrier module 31. After the photoresist is sprayed by the nozzle 24, it rotates at a speed of 100 - 400 rad / min, so that the circular glue spots spread outwards under the action of centrifugal force and evenly cover the wafer 6. Among them, the rotation speed of the second wafer carrier module 32 can be 100 rad / min, 250 rad / min, 320 rad / min, 400 rad / min, etc.

[0071] Figure 7 It is another schematic diagram of the wafer after the spin coating unit provided by the embodiment of the present application sprays the photoresist.

[0072] In some embodiments, when a nozzle as shown in Figure 5 is applied, the photoresist sprayed on the wafer 6 is as shown in Figure 7 As shown, after the nozzle 24 sprays the photoresist, the photoresist sprayed on the wafer 6 is a plurality of dot-shaped glue spots distributed in a spiral pattern. After that, the wafer carrier module 3 will also rotate at a speed of 100 - 400 rad / min, so that the dot-shaped glue spots spread outwards under the action of centrifugal force and evenly cover the wafer 6. Among them, the rotation speed of the wafer carrier module 3 can be 100 rad / min, 250 rad / min, 320 rad / min, 400 rad / min, etc.

[0073] When the wafer carrier module of the spin coating unit includes the first wafer carrier module 31 and the second wafer carrier module 32, the second wafer carrier module 32 is the same as the first wafer carrier module 31. After the nozzle 24 sprays the photoresist, it rotates at a speed of 100 - 400 rad / min, so that the dot-shaped glue spots spread outwards under the action of centrifugal force and evenly cover the wafer 6. Among them, the rotation speed of the second wafer carrier module 32 can be 100 rad / min, 250 rad / min, 320 rad / min, 400 rad / min, etc.

[0074] Although the present application is disclosed as above, the present application is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be subject to the scope defined by the claims.

Claims

1. A spin coating unit, characterized in that, Comprising: A spin coating unit main body, on which a slide rail is arranged along the extension direction of the spin coating unit main body; A wafer carrier module, located on the spin coating unit main body and arranged opposite to the slide rail, the wafer carrier module is used to place a wafer, and the wafer carrier module can rotate around its central axis; A spraying arm, one end of which is located in the slide rail and the other end is connected to a nozzle; At least one nozzle is arranged on the nozzle, and at least one liquid outlet hole for spraying photoresist is arranged on each nozzle. When the nozzle sprays photoresist, the spraying arm moves in the slide rail to drive the nozzle to move from the edge of the wafer along the diameter direction of the wafer, and the diameter direction of the wafer is parallel to the extension direction of the spin coating unit main body.

2. The spin coating unit according to claim 1, wherein The spraying arm includes: A spraying arm support, one end of which is located in the slide rail; A spraying arm connecting member, one end of which is connected to the other end of the spraying arm support and the other end is connected to the nozzle, and the spraying arm connecting member can move in a direction perpendicular to the spin coating unit main body.

3. The spin coating unit according to claim 1, wherein It further includes: A nozzle placement table, located on the spin coating unit main body, and at least one nozzle placement groove is provided on the nozzle placement table, and the position of the nozzle placement groove on the nozzle placement table corresponds to the position of the nozzle on the nozzle.

4. The spin coating unit according to claim 3, wherein The wafer carrier module includes: A first wafer carrier module and a second wafer carrier module, which are arranged opposite to each other in a direction parallel to the extension direction of the spin coating unit; The nozzle placement table is located between the first wafer carrier module and the second wafer carrier module.

5. The spin coating unit according to claim 1, characterized in that, The nozzle is a rectangular plate, and 16 nozzles are arranged on the nozzle, and the distribution mode of each nozzle is 2 rows and 8 columns, and they are arranged at equal intervals on the nozzle. Among them, every 2 rows of nozzles are used to spray the same type of photoresist.

6. The spin coating unit according to any one of claims 1-5, characterized in that The nozzle further includes: A nozzle sensor, fixed on one side of each nozzle, and the nozzle sensor is used to detect whether the position of the nozzle corresponds to the position of the wafer carrier module. When the nozzle sensor detects that the position of the nozzle does not correspond to the wafer carrier module, the spraying of photoresist is stopped.

7. The spin coating unit according to claim 6, wherein During the process of the nozzle spraying photoresist, the wafer carrier module rotates at an angular velocity of 10 - 100 rad / s; after the nozzle sprays photoresist, the wafer carrier module rotates at an angular velocity of 100 - 400 rad / min to make the photoresist evenly distributed on the wafer.

8. The spin coating unit according to claim 7, characterized in that, The nozzle is a cylinder with a diameter of 5 cm.

9. The spin coating unit according to claim 8, characterized in that, The liquid outlet hole is a circular liquid outlet hole, and 17 circular liquid outlet holes are distributed in the circular area at the end of the nozzle far from the nozzle. Among them, one circular liquid outlet hole located at the center of the circular area is included in each circular liquid outlet hole, and the remaining circular liquid outlet holes surround the circular liquid outlet hole located at the center of the circular area and are evenly distributed in the radial direction of the circular area.

10. The spin coating unit according to claim 9, characterized in that, The diameter of each circular liquid outlet hole is 0.8 cm.

11. The spin coating unit according to claim 10, wherein The moving speed of the spraying arm moving in the slide rail is 5 - 30 mm / s.

12. The spin coating unit according to claim 11, wherein During the process of spraying photoresist by the nozzle, in a direction perpendicular to the wafer carrier module, the nozzle is 10 to 40 millimeters away from the wafer carrier module.

Images