Flash memory chip

Abstract

The invention relates to the technical field of storage chips, in particular to a flash memory chip which comprises a chip body, a chip body shell cover plate and a chip shell bottom, the chip body is installed in the chip shell bottom and fixed, the chip body shell cover plate is installed on the chip shell bottom and completely covers the chip body, and the chip body shell cover plate is installed on the chip shell bottom and completely covers the chip body. The chip body comprises a transistor, an optocoupler, an MOS tube pull-down resistor, an MOS tube gate current-limiting resistor and an optocoupler resistor structure. According to the flash memory chip, the current condition in the circuit is monitored and managed through two important components, namely the transistor and the optocoupler, when the circuit operates stably, only little power supply voltage is occupied, a protected load circuit is not influenced, and when short-circuit and over-current phenomena occur, the circuit can be quickly disconnected, a power supply and a load can be protected, and the reliability of the circuit is improved. And meanwhile, the lamp is automatically turned on to remind maintenance personnel so as to quickly find out a circuit fault area, and the chip can reset the state in a manner of externally connecting a reset key so as to quickly restart and recover operation.

Description

Technical Field

[0001] The present invention relates to the technical field of storage chip technology, and particularly to a flash memory storage chip. Background Art

[0002] A storage chip is a specific application of the concept of an embedded system chip in the storage industry. Therefore, whether it is a system chip or a storage chip, software is embedded in a single chip to achieve multi-functionality and high performance, as well as support for multiple protocols, multiple hardware, and different applications. Storage chip technology mainly focuses on the application of enterprise-level storage systems, providing high-quality support for access performance, storage protocols, management platforms, storage media, and various applications. With the rapid growth of data and the increasing importance of data to businesses, the data storage market has evolved rapidly. From DAS, NAS, SAN to virtual data centers and cloud computing, all pose great challenges to traditional storage design capabilities.

[0003] For storage and data disaster recovery, functions such as virtualization, data protection, data security (encryption), data compression, deduplication, and thin provisioning are increasingly becoming standard functions of solutions. Managing more data with fewer resources is becoming an inevitable trend in the market. However, these optimization functions mentioned above all consume a large amount of CPU resources. How to quickly realize the productization process of multi-functional products and ensure the high performance of the optimized system is the market driving force for the development of storage chips.

[0004] A storage chip can quickly integrate various storage functions onto a single chip, ensuring the high performance of the optimized system. This advantage will gradually make storage chips regarded as an ideal technical platform for online storage, near-line storage, and off-site disaster recovery.

[0005] The current storage chip does not have an overcurrent protection function, so when the current is unstable, it is easy to cause chip damage. Summary of the Invention

[0006] The purpose of the present invention is to provide a flash memory storage chip, which solves the problems raised in the above background art.

[0007] To solve the above technical problems, the present invention provides the following technical solution: A flash memory storage chip includes a chip body, a chip body housing cover plate, and a chip housing bottom. The chip body is installed inside the chip housing bottom and fixed, and the chip body housing cover plate is installed on the chip housing bottom and completely covers the chip body.

[0008] After the chip assembly is completed, the chip is fixed on the load circuit or electronic component to be protected by soldering through the connection pins on the bottom of the chip housing, and the power supply is connected, and an external reset button is connected. When the power supply is turned on, the optocoupler provides a driving voltage for the transistor through the gate, making the source and gate of the transistor conduct, and at the same time powering the optocoupler to keep the circuit inside the chip in an operating state. When the load circuit to be protected has a short circuit or overcurrent, the optocoupler stops operating due to the voltage, and the transistor is cut off synchronously. At this time, the indicating LED emits light to remind the maintenance personnel that there is a short circuit or overcurrent in the circuit. After the cause of the fault is eliminated, press the external reset button to make the optocoupler start to provide a driving voltage for the transistor again, and the chip re-enters the working state.

[0009] Preferably, the chip body includes a transistor, an optocoupler, a MOS tube pull-down resistor, a MOS tube gate current-limiting resistor, an optocoupler resistor structure, an indicating LED, and a connection circuit. The transistor, the optocoupler, the MOS tube pull-down resistor, the MOS tube gate current-limiting resistor, the optocoupler resistor structure, and the indicating LED are all installed on the chip body, and all components are interconnected through the connection circuit to form the same circuit.

[0010] Preferably, the transistor includes three electrodes provided at the bottom, namely the drain located in the middle, and the source and gate located on both sides of the drain.

[0011] Preferably, the MOS tube pull-down resistor is connected in parallel with the transistor through the source and gate of the transistor by a connection circuit.

[0012] Preferably, the optocoupler, the optocoupler resistor structure and the drain of the transistor are connected together in series through a connection circuit.

[0013] Preferably, the indicating LED is connected in parallel to the series components composed of the source of the transistor, the optocoupler, and the optocoupler resistor structure.

[0014] Preferably, the top of the indicating LED is provided with an upwardly protruding cylindrical light-emitting tube structure.

[0015] Preferably, the MOS tube gate current-limiting resistor is connected in parallel to the series components composed of the gate of the transistor, the optocoupler, and the optocoupler resistor structure.

[0016] Preferably, the chip body housing cover plate includes a slot and an indicator lamp installation slot. The slot is a plurality of small rectangular groove structures provided on two side surfaces of the chip body housing cover plate. The indicator lamp installation slot is provided on the front surface of the chip body housing cover plate and is a circular through-hole structure with a beveled edge structure.

[0017] Preferably, the diameter and depth of the indicator light installation groove are the same as the diameter and height of the light-emitting tube structure at the top of the prompt light-emitting tube, and can be inserted into the indicator light installation groove.

[0018] When the prompt light-emitting tube emits light during operation, it can be directly observed intuitively to more quickly discover the operation of the chip.

[0019] Preferably, the bottom of the chip housing includes a chip body groove and connection pins. The chip body groove is a large rectangular groove structure provided at the center of the bottom of the chip housing, and the groove depth is the same as the thickness of the main body of the chip body. The connection pins are grouped in threes and are installed on both sides of the bottom of the chip housing and extend inward by a part.

[0020] Preferably, the thickness of the connection pins is the same as the slot opening. The inwardly extending part of the connection pins can directly contact the chip body and establish a circuit connection with the components installed on the chip body through a connection circuit.

[0021] Avoid squeezing the connection pins to cause damage and affect the connection effect between the chip and the external circuit, so that the overcurrent protection chip can be interconnected with the external circuit by welding to form a circuit, and the chip can perform overcurrent detection and protection on important circuit components, etc.

[0022] Preferably, the chip body housing cover plate and the bottom of the chip housing are fixedly connected to each other by means of hot melt adhesive.

[0023] Fixing the connection by means of hot melt adhesive can avoid the adverse effects on the chip body caused by methods such as welding and screws.

[0024] Preferably, the connection pins are respectively used to connect three components: a power supply, a circuit to be protected, and an overcurrent protection reset component. The overcurrent protection reset component generally uses a touch switch and needs to be connected to the source electrode of the transistor and the optocoupler.

[0025] After the overcurrent protection circuit inside the overcurrent protection chip is activated and the cause of the overcurrent phenomenon is eliminated, the working states of the transistor and the optocoupler can be reset by pressing the touch switch outside the chip, so that the circuit and the overcurrent protection chip return to the normal working mode.

[0026] Compared with the prior art, the present invention provides a flash memory chip, which has the following beneficial effects: This flash memory storage chip monitors and manages the current status in the circuit through two important components, namely transistors and optocouplers. When the circuit is operating stably, only a very small voltage is required to control the chip to maintain its operation, without causing a significant impact on the protected load circuit. When a short circuit or overcurrent occurs in the circuit, the circuit can be quickly disconnected to protect the power supply and load from being burned due to excessive current. After a short circuit or overcurrent occurs, a warning LED will automatically light up to remind maintenance personnel of the circuit fault, so as to quickly identify the circuit fault area. At the same time, the chip can reset the optocoupler state by connecting an external reset button to achieve the function of quickly restarting and restoring the circuit operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. is a three-dimensional exploded view of the structure of the present invention; Figure 2 FIG. is a three-dimensional overall view of the structure of the present invention; Figure 3 FIG. is a three-dimensional partial enlarged view of portion A of the structure of the present invention; Figure 4 FIG. is a three-dimensional view of the chip body of the structure of the present invention; Figure 5 FIG. is a three-dimensional view of the transistor of the structure of the present invention; Figure 6 FIG. is a three-dimensional view of the MOS transistor pull-down resistor of the structure of the present invention; Figure 7 FIG. is a three-dimensional view of the warning LED of the structure of the present invention.

[0028] Wherein: 1. Chip body; 101. Transistor; 1011. Drain; 1012. Source; 1013. Gate; 102. Optocoupler; 103. MOS transistor pull-down resistor; 104. MOS transistor gate current-limiting resistor; 105. Optocoupler resistor structure; 106. Warning LED; 107. Connection circuit; 2. Chip body housing cover; 201. Slotted; 202. Indicator lamp mounting groove; 3. Chip housing bottom; 301. Chip body groove; 302. Connection pin. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] Please refer to Figure 1-7, the present invention provides a technical solution: a flash memory chip, including a chip body 1, a chip body housing cover plate 2 and a chip outer shell bottom 3. The chip body 1 is installed inside the chip outer shell bottom 3 and fixed, and the chip body housing cover plate 2 is installed on the chip outer shell bottom 3 and completely covers the chip body 1.

[0031] In the first embodiment of the present invention, after the chip assembly is completed, the chip is welded and fixed on the load circuit or electronic component to be protected through the connection pins 302 on the chip outer shell bottom 3, the power supply is connected, and an external reset button is connected, etc. When the power supply is turned on, the optocoupler 102 provides a driving voltage for the transistor 101 through the gate 1013, so that the source 1012 and the gate 1013 of the transistor 101 are turned on, and at the same time, the optocoupler 102 is powered, so that the internal circuit of the chip maintains an operating state; when the load circuit to be protected has a short circuit or overcurrent, the optocoupler 102 stops operating due to zero voltage, and the transistor 101 is synchronously cut off. At this time, the indicating light-emitting diode 106 emits light, reminding the maintenance personnel that there is a short circuit or overcurrent phenomenon in the circuit. After the cause of the fault is eliminated, press the external reset button to make the optocoupler 102 start to provide a driving voltage for the transistor 101 again, so that the chip re-enters the working state.

[0032] Specifically, the chip body 1 includes a transistor 101, an optocoupler 102, a MOS transistor pull-down resistor 103, a MOS transistor gate current-limiting resistor 104, an optocoupler resistor structure 105, an indicating light-emitting diode 106 and a connection circuit 107. The transistor 101, the optocoupler 102, the MOS transistor pull-down resistor 103, the MOS transistor gate current-limiting resistor 104, the optocoupler resistor structure 105 and the indicating light-emitting diode 106 are all installed on the chip body 1, and all components are interconnected through the connection circuit 107 to form the same circuit.

[0033] In the second embodiment of the present invention, the transistor 101 includes three electrodes provided at the bottom, namely the drain 1011 located in the middle, and the source 1012 and the gate 1013 located on both sides of the drain. The MOS transistor pull-down resistor 103 is connected in parallel with the transistor 101 through the source 1012 and the gate 1013 of the transistor 101 by the connection circuit 107. The optocoupler 102, the optocoupler resistor structure 105 and the drain 1011 of the transistor 101 are connected in series through the connection circuit 107. The indicating light-emitting diode 106 is connected in parallel to the series element composed of the source 1012 of the transistor 101, the optocoupler 102 and the optocoupler resistor structure 105. The top of the indicating light-emitting diode 106 is provided with an upwardly convex cylindrical light-emitting tube structure.

[0034] In the third embodiment of the present invention, the MOS transistor gate limit current resistor 104 is connected in parallel to the series elements composed of the gate 1013 of the transistor 101, the optocoupler 102, and the optocoupler resistor structure 105. The chip body housing cover 2 includes a slot 201 and an indicator light mounting groove 202. The slot 201 is a plurality of small rectangular groove structures provided on two sides of the chip body housing cover 2, and the indicator light mounting groove 202 is provided on the front of the chip body housing cover 2 and is a circular through-hole structure with a bevel structure at the edge.

[0035] Specifically, the diameter and depth of the indicator light mounting groove 202 are the same as the diameter and height of the light-emitting tube structure at the top of the prompt light-emitting tube 106, and can be inserted into the indicator light mounting groove 202. Through the above technical solution, when the prompt light-emitting tube 106 is operating and emitting light, it can be directly observed, so as to more quickly discover the operation situation of the chip.

[0036] Specifically, the chip housing bottom 3 includes a chip body groove 301 and connection pins 302. The chip body groove 301 is a large rectangular groove structure provided at the center of the chip housing bottom 3, and the groove depth is the same as the main body thickness of the chip body 1. The connection pins 302 are grouped in threes and are installed on both sides of the chip housing bottom 3 and extend inward by a part.

[0037] Specifically, the thickness of the connection pins 302 is the same as that of the slot 201. The inwardly extending part of the connection pins 302 can directly contact the chip body 1 and establish a circuit connection with the components installed on the chip body 1 through the connection circuit 107. Through the above technical solution, it is possible to avoid damaging the connection pins 302 due to extrusion, which affects the connection effect between the chip and the external circuit, so that the overcurrent protection chip can be interconnected with the external circuit by welding to form a circuit, and the chip can perform overcurrent detection and protection on important circuit components, etc.

[0038] Specifically, the chip body housing cover 2 and the chip housing bottom 3 are fixedly connected to each other by means of hot melt adhesive. Through the above technical solution, fixedly connecting to each other by means of hot melt adhesive can avoid the adverse effects on the chip body 1 caused by methods such as welding and screws.

[0039] Specifically, the connection pins 302 are respectively used to connect three components: the power supply, the circuit to be protected, and the overcurrent protection reset element. The overcurrent protection reset element generally uses a tactile switch and needs to be connected to the source 1012 of the transistor 101 and the optocoupler 102. Through the above technical solution, when the overcurrent protection circuit inside the overcurrent protection chip is started and the cause of the overcurrent phenomenon is eliminated, the working states of the transistor 101 and the optocoupler 102 can be reset by pressing the tactile switch outside the chip, so that the circuit and the overcurrent protection chip return to the normal working mode.

[0040] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention. The scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A flash memory storage chip, comprising a chip body (1), a chip body housing cover plate (2) and a chip housing bottom (3), characterized in that: The chip body (1) is installed and fixed inside the bottom of the chip housing (3), and the chip body housing cover plate (2) is installed on the bottom of the chip housing (3) and completely covers the chip body (1). The bottom of the chip housing (3) includes a chip body groove (301) and connection pins (302). The chip body groove (301) is a large rectangular groove structure provided at the center of the bottom of the chip housing (3), and the groove depth is the same as the main body thickness of the chip body (1). The connection pins (302) are grouped in threes and are installed on both sides of the bottom of the chip housing (3) and extend inward for a part. The chip body (1) includes a transistor (101), an optocoupler (102), a MOS transistor pull-down resistor (103), a MOS transistor gate limiting resistor (104), an optocoupler resistor structure (105), a prompt light-emitting diode (106) and a connection circuit (107). The transistor (101), the optocoupler (102), the MOS transistor pull-down resistor (103), the MOS transistor gate limiting resistor (104), the optocoupler resistor structure (105) and the prompt light-emitting diode (106) are all installed on the chip body (1). All components are interconnected through the connection circuit (107) to form the same circuit. The transistor (101) includes three electrodes provided at the bottom, namely the drain (1011) located in the middle, and the source (1012) and gate (1013) located on both sides of the drain.

2. A flash memory storage chip according to claim 1, wherein: The MOS transistor pull-down resistor (103) is connected in parallel with the transistor (101) through the source (1012) and gate (1013) of the transistor (101) by the connection circuit (107).

3. A flash memory chip according to claim 1, characterized in that: The optocoupler (102), the optocoupler resistor structure (105) and the drain (1011) of the transistor (101) are connected together in series through the connection circuit (107).

4. A flash memory chip according to claim 1, characterized in that: The prompt light-emitting diode (106) is connected in parallel to the series element composed of the source (1012) of the transistor (101), the optocoupler (102) and the optocoupler resistor structure (105).

5. A flash memory storage chip according to claim 4, characterized in that: The top of the prompt light-emitting diode (106) is provided with an upwardly protruding cylindrical light-emitting tube structure.

6. A flash memory storage chip according to claim 1, wherein: The MOS transistor gate limiting resistor (104) is connected in parallel to the series element composed of the gate (1013) of the transistor (101), the optocoupler (102) and the optocoupler resistor structure (105).

7. A flash memory storage chip according to claim 1, characterized in that: The chip body housing cover plate (2) includes a slot (201) and an indicator light installation slot (202). The slot (201) is a plurality of small rectangular groove structures provided on two sides of the chip body housing cover plate (2). The indicator light installation slot (202) is provided on the front of the chip body housing cover plate (2) and is a circular through-hole structure with a beveled edge structure.

8. A flash memory storage chip according to claim 7, characterized in that: The diameter and depth of the indicator lamp mounting groove (202) are the same as the diameter and height of the light-emitting tube structure at the top of the prompting light-emitting tube (106), and can be inserted into the indicator lamp mounting groove (202). The thickness of the connection pin (302) is the same as that of the slot (201). The part of the connection pin (302) extending inward can directly contact the chip body (1) and establish an electrical connection with the components mounted on the chip body (1) through the connection circuit (107).

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