Flat-cup high-light-emitting-angle LED packaging technology

Abstract

The invention discloses a flat-cup high-light-emitting-angle LED packaging process. The flat-cup high-light-emitting-angle LED packaging process comprises the following steps that S1, a high-turbine-cup support is manufactured; s2, fixing a light-emitting wafer: fixing the light-emitting wafer on the bottom of the cavity by using a wafer fixing machine table and a wafer fixing adhesive; s3, connecting and conducting the positive and negative pole pieces at the bottom of the cavity with the positive and negative poles of the light-emitting wafer by using a wire welding machine; s4, glue, fluorescent powder and an optical diffusant are selected according to a certain proportion, the glue, the fluorescent powder and the optical diffusant are mixed and then stirred to be uniform, defoaming is carried out, and diffusion glue is prepared; s5, the diffusion glue in the step S4 is dropwise added into the cavity of the support through a glue dispenser, the liquid level is lower than the opening of the cavity, curing is carried out after glue dispensing is completed, and a diffusion glue block with a smooth liquid level is formed after curing; and S6, sorting is conducted, specifically, the cured LED lamp beads are sorted and packaged through a light splitting machine according to the display effect and the light intensity, the packaging process is completed, and very good optical consistency is achieved.

Description

Technical Field

[0001] The invention relates to the field of LEDs, and in particular to a flat cup high light-emitting angle LED packaging process. Background Art

[0002] LEDs are widely used, and different types of LED products are used in different industries, including signal indication, display, backlight and lighting.

[0003] At present, LED backlight products generally have three structural forms to meet the module visual effects:

[0004] The first is to use a conventional flat cup to package the LED chip and then match it with a diffuser and reflector, and perform secondary optical design when the lamp beads are assembled into a module;

[0005] The second method is to use the convex cup ball head dispensing method to optimize the light output at the LED lamp bead stage, eliminating the lens patch process, and then matching the expansion board and reflector to form an optical module;

[0006] The third method is to use the min LED packaging method, which uses dispensing to make a silicone lens above the light-emitting chip, and then combines it with a diffusion plate, quantum membrane and reflector to form an optical module.

[0007] The above structures all have their own disadvantages:

[0008] The first product is relatively basic and is at a disadvantage in terms of overall resolution and color richness;

[0009] The second product has lower yield and production stability due to the complexity and instability of the convex cup ball head packaging process;

[0010] Although the third type of product, the whole module, has higher resolution and richer colors, the process is complex, there are more steps, and the production cost is higher.

[0011] In addition, the first product mainly relies on secondary optical lenses to achieve the diffusion of light angles, which has the disadvantages of large OD value (i.e., light mixing distance), high cost, complex process, and thick thickness of the whole machine;

[0012] The second product mainly relies on the secondary convex cup dispensing above the LED lamp bead to expand the luminous angle, and is equipped with a low-transparency bracket to replace the optical lens in the first product. To a certain extent, it simplifies the SMT process of the lamp bead and reduces costs. However, due to its convex cup characteristics, there are certain instability and low yield problems in the production process; and the lamp bead module has high requirements for the diffusion plate, and the convex cup dispensing optical diffusion effect is relatively low. Summary of the invention

[0013] The object of the present invention is to provide a flat-cup high-emission-angle LED packaging process aiming at the above-mentioned problems and deficiencies, which improves the overall working efficiency.

[0014] The present invention solves at least one of the following technical problems:

[0015] (1) How to ensure stability in the production process and high-yield products;

[0016] (2) How to reduce the process difficulty and cost at a low OD value;

[0017] (3) How to increase its own halo range at a low OD value, so as to adapt to different-quality diffusion plates on the basis of stability and high yield.

[0018] The object of the present invention can be achieved by the following technical solutions: A flat-cup high-emission-angle LED packaging process, comprising the following steps:

[0019] Step S1: Fabricate a high-transparency flat-cup bracket;

[0020] Step S2: Fix the light-emitting wafer, and use a die bonder and die bonding glue to fix the light-emitting wafer on the bottom of the cavity;

[0021] Step S3: Use a wire bonder to connect and conduct the positive and negative electrodes on the bottom of the cavity to the positive and negative electrodes of the light-emitting wafer;

[0022] Step S4: Select a certain proportion of glue, phosphor, and optical diffusing agent, mix the glue, phosphor, and optical diffusing agent evenly, and perform degassing to prepare diffusing glue;

[0023] Step S5: Drop the diffusing glue in Step S4 into the bracket cavity through a dispenser, with the liquid level lower than the mouth of the cavity. After dispensing, cure it to form a diffusing glue block with a flat liquid surface;

[0024] Step S6: Sorting, and sorting and packaging the cured LED lamp beads according to the display effect and light intensity through a spectrometer to complete the packaging process.

[0025] As a further solution of the invention, the high-transparency flat-cup bracket includes a bracket cavity, the bracket cavity has a cavity mouth, a cavity bottom, and a cavity side wall, the cavity mouth faces the cavity bottom, the cavity side wall connects the cavity mouth and the cavity bottom, and positive and negative electrodes are welded on the cavity bottom.

[0026] As a further solution of the invention, the light transmittance of the high-transparency flat-cup bracket material exceeds 80%, the light transmittance of the diffusing glue block is lower than that of the high-transparency flat-cup bracket, and the light intensity at the top of the diffusing glue block is the same as the light emission intensity on the side of the high-transparency flat-cup bracket.

[0027] As a further aspect of the invention, the bracket cavity is generally a frustum-shaped cavity structure, where the size of the cavity opening is larger than that of the cavity bottom, and the angle between the inner wall of the bracket sidewall and the cavity bottom is an obtuse angle.

[0028] As a further aspect of the invention, the light diffusing agent is an organosilicon light diffusing microsphere.

[0029] As a further aspect of the invention, in step S4, different types of glue are selected according to different curing steps:

[0030] The first is the thermal curing scheme. The glue used is an amine curing agent epoxy resin or an acid anhydride curing agent epoxy resin with a viscosity greater than 190 and a thixotropic agent ratio less than 3%, and thermal curing is carried out using an atmospheric furnace.

[0031] The second is the light curing scheme. The glue used is an addition-curing silicone or acrylic resin with a viscosity greater than 190 and a thixotropic agent ratio less than 3%, and curing is carried out using UV light waves.

[0032] As a further aspect of the invention, the thickness of the sidewall of the high-turbine cup bracket cavity ranges from 150 microns to 300 microns, and the thickness of the diffusion glue block ranges from 150 microns to 350 microns, preferably between 240 microns and 300 microns.

[0033] As a further aspect of the invention, the thickest part of the sidewall of the high-turbine cup bracket cavity is 250 microns, the thinnest part is 150 microns, the light transmittance is 82%, and the thickness of the diffusion glue block is 270 microns.

[0034] As a further aspect of the invention, based on steps S1 to S3:

[0035] Step S7: Only mix the glue and the phosphor, without adding a light diffusing agent. After mixing, stir evenly and defoam to prepare a conventional fluorescent glue.

[0036] Step S8: Use a dispenser to drop the fluorescent glue in step S7 into the bracket cavity, with the liquid level lower than the cavity opening. After dispensing, cure it to form a flat liquid surface.

[0037] Step S9: Select a matte film with a light transmittance and thickness within a certain range, cut it to the same size as the cavity opening, and use die bonding equipment to place it on the cavity opening.

[0038] Step S10: Sorting. After curing, the LED lamp beads are sorted and packaged according to the display effect and light intensity by a spectrometer to complete the encapsulation process.

[0039] As a further aspect of the invention, based on steps S1 to S3 and S7 and S8:

[0040] Step S11: preparing matte glue, and using a spraying device to spray the matte glue directly onto the mouth of the cavity to form a matte film layer;

[0041] Step S12: Sorting: using a spectrometer to sort and package the cured LED lamp beads according to the display effect and light intensity, thus completing the packaging process.

[0042] Beneficial effects of the present invention:

[0043] (1) When working, the light transmission effect of the diffusion rubber block is matte, and the light intensity on the top of the diffusion rubber block is consistent with the light intensity on the side of the high turbine cup bracket, so that the light intensity of the finished LED lamp bead at each angle of the periphery after taking itself as the center of the sphere is consistent, forming a wide-angle light-emitting angle, so that it achieves very good optical consistency when the flat cup is not matched with an optical lens and a convex cup colloid, reducing the OD value, thereby reducing the number of LED lamp beads required per unit area, controlling costs, and enhancing the lighting effect;

[0044] (2) During operation, the matte film can be mounted point-to-point through a simple batch transfer tooling, or a matte film layer can be formed by simple and uniform spraying, which can reduce the OD value and increase the spot size, and the light intensity distribution at each spot is uniform, thus adapting to diffusers of different qualities. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0046] Figure 1 This is a process flow chart of Embodiment 1 of the present invention;

[0047] Figure 2 This is a process flow chart of Embodiment 2 of the present invention;

[0048] Figure 3 This is a process flow chart of Embodiment 3 of the present invention;

[0049] Figure 4 This is a front view of the overall structure of the high turbine cup bracket of the present invention;

[0050] Figure 5 This is a front view of the overall structure of the first embodiment of the present invention;

[0051] Figure 6 This is a front view of the overall structure of the second embodiment of the present invention;

[0052] Figure 7 This is a front view of the overall structure of the third embodiment of the present invention;

[0053] In the figure: 100, high-turbine cup bracket; 200, light-emitting chip; 101, bracket cavity; 102, cavity opening; 103, cavity bottom; 104, cavity side wall; 201, diffusion glue block; 202, matte film; 203, matte film layer. Detailed implementation manners

[0054] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following will, in conjunction with the accompanying drawings and preferred embodiments, describe in detail the specific implementation manners, structures, features and their effects of the present invention as follows.

[0055] Please refer to Figure 1-7 as shown: Embodiment 1:

[0056] A flat-cup high-light-emitting-angle LED packaging process includes the following steps:

[0057] Step S1: Fabricate a high-turbine cup bracket 100. The high-turbine cup bracket 100 includes a bracket cavity 101. The bracket cavity 101 has a cavity opening 102, a cavity bottom 103 and a cavity side wall 104. The cavity opening 102 faces the cavity bottom 103. The cavity side wall 104 connects the cavity opening 102 and the cavity bottom 103. Positive and negative electrodes are welded on the cavity bottom 103.

[0058] Step S2: Fix the light-emitting chip 200. Use a die bonder and die bonding glue to fix the light-emitting chip 200 on the cavity bottom 103.

[0059] Step S3: Use a wire bonder to connect and conduct the positive and negative electrodes on the cavity bottom 103 with the positive and negative electrodes of the light-emitting chip 200.

[0060] Step S4: Select a certain proportion of glue, phosphor and optical diffusing agent. Mix the glue, phosphor and optical diffusing agent evenly and stir, and then perform degassing to prepare diffusion glue.

[0061] Step S5: Drop the diffusion glue in step S4 into the bracket cavity 101 through a dispenser. The liquid level is lower than the cavity opening 102. After dispensing, cure it. After curing, a diffusion glue block 201 with a flat liquid surface is formed.

[0062] Step S6: Sorting. Sort and package the cured LED lamp beads according to the display effect and light intensity through a spectrometer to complete the packaging process.

[0063] The light transmittance of the material of the high-turbine cup bracket 100 exceeds 80%. The light transmittance of the diffusion glue block 201 is lower than that of the high-turbine cup bracket 100. The light transmission effect of the diffusion glue block 201 is a matte effect. The light intensity at the top of the diffusion glue block 201 is consistent with the light emission intensity on the side of the high-turbine cup bracket 100, so that the light intensity at each angle of the outer periphery of the finished LED lamp bead with itself as the center of the sphere remains consistent, forming a wide-angle light-emitting angle, enabling it to achieve very good optical consistency without matching an optical lens and a convex cup colloid in a flat cup, reducing the OD value, thereby reducing the number of LED lamp beads required per unit area, controlling the cost, and enhancing the light illumination effect.

[0064] The bracket cavity 101 is generally a frustum-shaped cavity structure. The size of the cavity opening 102 is larger than the size of the cavity bottom 103. The included angle between the inner wall of the bracket side wall 103 and the cavity bottom 103 is an obtuse angle.

[0065] The light diffusing agent is an organosilicon light diffusing microsphere.

[0066] In step S4, different types of glue are selected according to different curing steps:

[0067] The first is the thermal curing scheme. The glue used is an amine curing agent epoxy resin or an acid anhydride curing agent epoxy resin with a viscosity greater than 190 and a thixotropic agent ratio less than 3%, and thermal curing is carried out using an atmospheric furnace;

[0068] The second is the light curing scheme. The glue used is an addition type silicone or an acrylic resin with a viscosity greater than 190 and a thixotropic agent ratio less than 3%, and curing is carried out using UV light waves.

[0069] In this embodiment, the thickness range of the cavity side wall 103 of the high-turbine cup bracket 100 is between 150 microns and 300 microns, and the thickness of the diffusion glue block 201 is between 150 microns and 350 microns, preferably between 240 microns and 300 microns;

[0070] Specifically, the thickest part of the cavity side wall 103 of the high-turbine cup bracket 100 is 250 microns, the thinnest part is 150 microns, the light transmittance is 82%, and the thickness of the diffusion glue block 201 is 270 microns;

[0071] It is found in the experiment that the dispensing thickness depends on the concentration of the light diffusing agent, the halo effect, and the light transmission effect of the high-turbine cup bracket 101. First, the concentration of the light diffusing agent is roughly determined according to the light transmission effect of the high-turbine cup bracket 101, and then the thickness of the diffusion glue block 201 for dispensing is tested. Finally, the top light transmittance intensity of the diffusion glue block 201 is made consistent with the light transmittance intensity of the high-turbine cup bracket 101.

[0072] The LED lamp beads produced in this embodiment include a high-transparency cup-shaped bracket 100 and a light-emitting chip 200. The high-transparency cup-shaped bracket 100 includes a bracket cavity 101, the bracket cavity 101 has a cavity opening 102, a cavity bottom 103, and a cavity side wall 104. The cavity opening 102 faces the cavity bottom 103, the cavity side wall 104 connects the cavity opening 102 and the cavity bottom 103. A light-emitting chip 200 is fixed on the cavity bottom 103, and a diffusion glue block 201 is dispensed in the cavity opening 102. The liquid surface of the diffusion glue block 201 is substantially flat and does not protrude from the cavity opening 103.

[0073] Embodiment Two:

[0074] Based on steps S1 to S3 of Embodiment One:

[0075] Step S7: Only mix the glue and phosphor, without adding a light diffusing agent, stir evenly after mixing, and defoam to prepare a conventional fluorescent glue;

[0076] Step S8: Use a dispenser to drop the fluorescent glue in step S7 into the bracket cavity 101, the liquid surface is lower than the cavity opening 102, and after dispensing, cure it to form a flat liquid surface;

[0077] Step S9: Select a matte film 202 with a light transmittance and thickness within a certain range, cut it into the same size as the cavity opening 102, and use a die bonding device to place it on the cavity opening 102;

[0078] Step S10: Sorting, use a spectrometer to sort and package the cured LED lamp beads according to the display effect and light intensity to complete the encapsulation process.

[0079] In this embodiment, the light transmittance of the high-transparency cup-shaped bracket 100 is at least eighty percent, the thickness of the used matte film 202 is 50 microns, and the light transmittance is sixty-five percent.

[0080] Embodiment Three:

[0081] Based on steps S1 to S8 of Embodiment Two:

[0082] Step S11: Prepare matte glue and use a spraying device to directly spray the matte glue onto the cavity opening 102 to form a matte film layer 203;

[0083] Step S12: Sorting, use a spectrometer to sort and package the cured LED lamp beads according to the display effect and light intensity to complete the encapsulation process.

[0084] When this embodiment works, at least 90% of the sprayed matte glue covers the cavity opening 102, and the surface of the fluorescent glue is completely covered by the matte glue layer 203.

[0085] When the present invention works, the light transmission effect of the diffusion glue block 201 is a matte effect, and the light intensity at the top of the diffusion glue block 201 is consistent with the light output intensity on the side of the high-transparency flat cup bracket 100, so that the light intensity at each angle of the outer periphery of the finished LED lamp bead with itself as the center of the sphere is consistent, forming a wide-angle light-emitting angle, enabling it to achieve very good optical consistency without matching an optical lens and a convex cup colloid for the flat cup, reducing the OD value, thereby reducing the number of LED lamp beads required per unit area, controlling the cost, and enhancing the lighting effect;

[0086] When working, the matte film 202 can be mounted point-to-point through a simple batch transfer tooling, or a matte film layer 203 can be formed by simple and uniform spraying, which can reduce the OD value, increase the spot size, and the light intensity distribution at each part of the spot is uniform, so as to adapt to diffusion plates of different qualities.

[0087] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the above-disclosed technical content within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A flat cup high luminous angle LED packaging process, characterized in that It includes the following steps: Step S1: Fabricate a high-transparency cup bracket (100); Step S2: Fix the light-emitting wafer (200), and use a die bonder and die bonding glue to fix the light-emitting wafer (200) on the bottom of the cavity (103); Step S3: Use a wire bonder to connect and conduct the positive and negative electrodes on the bottom of the cavity (103) to the positive and negative electrodes of the light-emitting wafer (200); Step S4: Select a certain proportion of glue, phosphor, and optical diffusing agent, mix the glue, phosphor, and optical diffusing agent evenly, and perform degassing to prepare a diffusing glue; Step S5: Drop the diffusing glue in Step S4 into the bracket cavity (101) through a dispensing machine, with the liquid level lower than the cavity opening (102). After dispensing, cure it to form a diffusing glue block (201) with a flat liquid surface; Step S6: Sorting, and use a spectrometer to sort and package the cured LED lamp beads according to the display effect and light intensity to complete the encapsulation process.

2. The flat cup high luminous angle LED packaging process according to claim 1, characterized in that, The high-transparency cup bracket (100) includes a bracket cavity (101), the bracket cavity (101) has a cavity opening (102), a cavity bottom (103), and a cavity side wall (104). The cavity opening (102) faces the cavity bottom (103), and the cavity side wall (104) connects the cavity opening (102) and the cavity bottom (103). Positive and negative electrodes are welded on the cavity bottom (103).

3. A flat cup high luminous angle LED packaging process according to claim 1, characterized in that, The light transmittance of the material of the high-transparency cup bracket (100) exceeds 80%, the light transmittance of the diffusing glue block (201) is lower than that of the high-transparency cup bracket (100), and the light intensity at the top of the diffusing glue block (201) is the same as the light output intensity on the side of the high-transparency cup bracket (100).

4. A flat cup high luminous angle LED packaging process according to claim 1, characterized in that, The bracket cavity (101) is generally a frustum-shaped cavity structure, the size of the cavity opening (102) is larger than the size of the cavity bottom (103), and the included angle between the inner wall of the bracket side wall (103) and the cavity bottom (103) is an obtuse angle.

5. A flat cup high luminous angle LED packaging process according to claim 1, characterized in that, The optical diffusing agent is an organosilicon optical diffusing microsphere.

6. A flat cup high luminous angle LED packaging process according to claim 1, characterized in that, In Step S4, different types of glue are selected according to different curing steps: The first is a thermal curing scheme, and the glue used is an amine curing agent epoxy resin or an acid anhydride curing agent epoxy resin with a viscosity greater than 190 and a thixotropic agent ratio less than 3%, and it is thermally cured using an atmospheric furnace; The second is a light curing scheme, and the glue used is an addition-type silicone or acrylic resin with a viscosity greater than 190 and a thixotropic agent ratio less than 3%, and it is cured using UV light waves.

7. A flat cup high luminous angle LED packaging process according to claim 1, characterized in that, The thickness of the cavity side wall (103) of the high-transparency cup bracket (100) ranges from 150 microns to 300 microns, and the thickness of the diffusing glue block (201) is from 150 microns to 350 microns, preferably from 240 microns to 300 microns.

8. A flat cup high luminous angle LED packaging process according to claim 7, characterized in that The thickest part of the cavity side wall (103) of the high-transparency cup bracket (100) is 250 microns, the thinnest part is 150 microns, the light transmittance is 82%, and the thickness of the diffusing glue block (201) is 270 microns.

9. A flat cup high luminous angle LED packaging process according to claim 1, characterized in that, Based on Steps S1 to S3: Step S7: Only mix the glue and the phosphor, without adding a light diffuser. After mixing, stir evenly and defoam to prepare a conventional fluorescent glue. Step S8: Use a dispenser to drop the fluorescent glue in Step S7 into the bracket cavity (101) with the liquid level lower than the cavity opening (102). After dispensing, cure it to form a flat liquid surface. Step S9: Select a matte film (202) with a light transmittance and thickness within a certain range, cut it into the same size as the cavity opening (102), and use die bonding equipment to place it on the cavity opening (102). Step S10: Sorting. Sort and package the cured LED lamp beads according to the display effect and light intensity through a spectrometer to complete the encapsulation process.

10. A flat cup high luminous angle LED packaging process according to claim 9, characterized in that, Based on Steps S1 to S3, S7, and S8: Step S11: Prepare matte glue and use spraying equipment to directly spray the matte glue onto the cavity opening (102) to form a matte film layer (203). Step S12: Sorting. Sort and package the cured LED lamp beads according to the display effect and light intensity through a spectrometer to complete the encapsulation process.

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