Molding press mold device and press molding method

Abstract

According to one embodiment of the present invention, a mold device for press molding is used in a press molding machine, and comprises a pair of upper and lower molds and a heater for heating the molds.

Description

Technical Field

[0001] The present disclosure relates to a die device for forming stamping and a stamping method. Background Art

[0002] For example, a stamping method is known in which a workpiece such as a thin metal plate is processed into a desired shape by stamping.

[0003] For example, in Patent Document 1, it is described that a heat transfer surface having unevenness for a heat exchange plate for a plate heat exchanger is formed by stamping a thin metal plate with a stamping device.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2007-285682 Summary of the Invention

[0007] (I) Technical Problem to be Solved

[0008] For example, in the stamping for forming unevenness on a thin plate such as a heat exchange plate described in Patent Document 1, when relatively high forming accuracy is required for the formed workpiece, the influence of the deviation of the tensile strength of the workpiece cannot be ignored.

[0009] The tensile strength of the workpiece depends not only on the deviation allowed in the specification of the material of the workpiece but also on the temperature of the workpiece. Therefore, for example, when the tensile strength of the workpiece is a value near the upper limit of the range allowed in the specification of the material of the workpiece, and further in an environment where the surrounding temperature becomes low such as in winter, the tensile strength of the workpiece further increases. Therefore, the forming accuracy of the formed workpiece may not be satisfied under a specified pressing pressure.

[0010] In this case, for example, measures such as extending the holding time of the state of pressing the workpiece and increasing the pressing pressure can be considered. However, for the extension of the holding time, since the time required for stamping becomes long, the productivity is reduced. Therefore, in the case of corresponding by increasing the pressing pressure, the pressing pressure is increased within the pressure capacity range of the forming press.

[0011] However, when there is no margin in the pressure capacity of the forming press, it is difficult to correspond by increasing the pressing pressure.

[0012] In view of the above situation, an object of at least one embodiment of the present disclosure is to stabilize the forming accuracy of a workpiece stamped by a forming press.

[0013] (2) Technical Solution

[0014] (1) The die device for forming stamping according to at least one embodiment of the present disclosure is a die device for forming stamping used in a forming stamping machine, and includes:

[0015] A pair of upper and lower dies; and

[0016] A heater for heating the die.

[0017] (2) The stamping forming method according to at least one embodiment of the present disclosure

[0018] Uses the die device for forming stamping described in (1) above, and performs stamping forming on the object to be processed through a forming stamping machine.

[0019] (3) Advantageous Effects

[0020] According to at least one embodiment of the present disclosure, it is possible to stabilize the forming accuracy of the object to be processed stamped by a forming stamping machine. Description of the Drawings

[0021] Figure 1 is a diagram showing the overall configuration of a die device for forming stamping according to an embodiment.

[0022] Figure 2 is a schematic front view of a die device for forming stamping according to an embodiment.

[0023] Figure 3 is a flowchart showing the processing sequence in the stamping forming method using a die device according to an embodiment. Detailed Description of the Embodiment

[0024] Hereinafter, some embodiments of the present disclosure will be described with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, etc. of the components described as embodiments or shown in the drawings do not limit the scope of the present disclosure, but are merely illustrative examples.

[0025] For example, expressions indicating relative or absolute arrangements such as "in a certain direction", "along a certain direction", "parallel", "orthogonal", "center", "concentric", or "coaxial" not only represent such arrangements in a strict sense, but also represent a state of relative displacement with an angle or distance having a tolerance or being able to obtain the same function.

[0026] For example, expressions indicating an equivalent state of things such as "same", "equivalent", and "uniform" not only represent an equivalent state in a strict sense, but also represent a state with a tolerance or a difference to the extent of being able to obtain the same function.

[0027] For example, expressions indicating shapes such as a quadrilateral shape and a cylindrical shape not only represent the shapes of a quadrilateral shape and a cylindrical shape in the strict geometric sense, but also represent shapes including concave and convex portions, chamfered portions, etc. within the range where the same effects can be obtained.

[0028] On the other hand, the expressions "comprising", "carrying", "having", "including" or "possessing" a constituent element are not exclusive expressions that exclude the existence of other constituent elements.

[0029] Figure 1 FIG. is a view showing the overall configuration of a molding and stamping die device according to an embodiment.

[0030] Figure 2 FIG. is a schematic front view of a molding and stamping die device according to an embodiment.

[0031] A molding and stamping die device 1 according to an embodiment is a molding and stamping die device used in a molding and stamping press 3. In the following description, the molding and stamping die device 1 is also simply referred to as the die device 1. A die device 1 according to an embodiment includes an upper die 1U and a lower die 1L. In addition, in Figure 1 and Figure 2 the description of guides and the like for guiding the upper die 1U so as to be movable relative to the lower die 1L in the vertical direction is omitted. In addition, in Figure 2 it is illustrated in a state where the upper die 1U and the lower die 1L are separated by a greater interval than in the assembled state of the die device 1.

[0032] In addition, a die device 1 according to an embodiment includes a heater control device 9 for controlling a heater 21 described later.

[0033] A die device 1 according to an embodiment is configured to be provided on a bolster (Japanese: ボルスタ) 3a of a molding and stamping press 3, and the upper die 1U is pressed down by a vertically moving slider 3b, so that a metal thin plate as a processing object 11 is stamped into a desired shape by a pair of upper and lower dies 8 described later.

[0034] (Upper die 1U)

[0035] In a die device 1 according to an embodiment, the upper die 1U includes an upper retainer 5U, an upper liner 6U, and an upper die 8U as main constituent elements.

[0036] The upper retainer 5U is a retainer for retaining the upper die 8U and the upper liner 6U of a pair of upper and lower dies 8.

[0037] The upper liner 6U is disposed between the upper cage 5U and the upper die 8U, and is a liner held together with the upper die 8U by the upper cage 5U. As will be described later, the upper liner 6U is equipped with a heater 21 and is a different component from the pair of upper and lower dies 8.

[0038] In a die device 1 according to an embodiment, the upper liner 6U is mounted on the lower surface of the upper cage 5U.

[0039] In a die device 1 according to an embodiment, a plurality of grooves 6a are formed on the lower surface of the upper liner 6U. The plurality of grooves 6a are grooves for disposing the heater 21 on the upper liner 6U, and the heater 21 is for heating the upper die 8U. In Figure 2 the example shown, the plurality of grooves 6a extend in the depth direction shown in the figure and are spaced apart in the left-right direction shown in the figure.

[0040] As described above, the heater 21 is respectively disposed in the plurality of grooves 6a. The heater 21 is, for example, a rod-shaped heater such as a sheathed heater.

[0041] In a die device 1 according to an embodiment, a plurality of holes 6b are formed from, for example, the side surface of the upper liner 6U toward the inside of the upper liner 6U. The plurality of holes 6b are holes for disposing the heater 21 on the upper liner 6U, and the heater 21 is for heating the upper die 8U. In Figure 2 the example shown, the plurality of holes 6b extend in the left-right direction shown in the figure and are spaced apart in the depth direction shown in the figure.

[0042] As described above, the heater 21 is respectively disposed in the plurality of holes 6b.

[0043] In a die device 1 according to an embodiment, a heat-conductive putty or the like filling material 31 can be filled in the gap between the groove 6a or the hole 6b of the upper liner 6U and the heater 21.

[0044] In a die device 1 according to an embodiment, the upper liner 6U is detachably held by the upper cage 5U.

[0045] In addition, as will be described later, when it is not necessary to heat the upper die 8U by the heater 21, the upper liner 6U is removed from the upper die 1U, and a liner (not shown) on which no heater 21, groove 6a for disposing the heater 21, hole 6b, etc. are provided is mounted on the upper die 1U.

[0046] The upper die 8U is a die having a template pattern formed on the lower surface, and the template pattern is for stamping a workpiece 11, which is a metal thin plate, of the die device 1 according to an embodiment into a desired shape.

[0047] Further, in the present embodiment, the object to be processed 11 is, for example, a metallic thin plate having a thickness of 1 mm or less.

[0048] In the die device 1 of one embodiment, the upper die 8U is mounted on the lower surface of the upper liner 6U. That is, the upper liner 6U is held by the upper holder 5U at a position above the upper die 8U.

[0049] (Lower die 1L)

[0050] In the die device 1 of one embodiment, the lower die 1L includes a lower holder 5L, a lower liner 6L, a die liner 7, and a lower die 8L as main components.

[0051] The lower holder 5L is a holder for holding the lower die 8L, the die liner 7, and the lower liner 6L of the pair of upper and lower dies 8.

[0052] The lower liner 6L is disposed between the lower holder 5L and the die liner 7, and is held by the lower holder 5L together with the lower die 8L. The lower liner 6L is provided with a heater 21 as described later, and is a different component from the pair of upper and lower dies 8.

[0053] In the die device 1 of one embodiment, the lower liner 6L is mounted on the upper surface of the lower holder 5L.

[0054] In the die device 1 of one embodiment, a plurality of grooves 6a are formed on the upper surface of the lower liner 6L. The plurality of grooves 6a are grooves for disposing a heater 21 on the lower liner 6L, and the heater 21 is for heating the lower die 8L. In Figure 2 the example shown, the plurality of grooves 6a extend along the depth direction shown in the figure, and are provided at intervals along the left - right direction shown in the figure.

[0055] As described above, the heaters 21 are respectively disposed in the plurality of grooves 6a.

[0056] In the die device 1 of one embodiment, a plurality of holes (not shown) may be provided, and the plurality of holes are formed from, for example, the side surface of the lower liner 6L toward the inside of the lower liner 6L. The plurality of holes may also extend in the left - right direction shown in the figure and be provided at intervals in the depth direction shown in the figure, similarly to the plurality of holes 6b in the upper liner 6U. In the plurality of holes, a heater 21 for heating the lower die 8L may also be provided, similarly to the plurality of holes 6b in the upper liner 6U.

[0057] In the die device 1 of one embodiment, a heat - conductive putty or the like, such as a filler material 31, may be filled in the gap between the groove 6a or the holes (not shown) of the lower liner 6L and the heater 21.

[0058] In the mold device 1 of one embodiment, the lower side liner 6L is detachably held on the lower side holder 5L.

[0059] In addition, as will be described later, when it is not necessary to heat the lower mold 8L by the heater 21, the lower side liner 6L is removed from the lower mold 1L, and a liner (not shown) on which the heater 21 and the groove 6a for arranging the heater 21 are not provided is installed on the lower mold 1L.

[0060] The die liner 7 is a liner provided between the lower side liner 6L and the lower mold 8L.

[0061] In the mold device 1 of one embodiment, the die liner 7 is installed on the upper surface of the lower side liner 6L. The die liner 7 is used, for example, as a height adjustment member for arranging the height position of the lower mold 8L at a desired height position.

[0062] The lower mold 8L is a mold having a template pattern formed on its upper surface, and the template pattern is used to stamp the work piece 11 into a desired shape.

[0063] In the mold device 1 of one embodiment, the lower mold 8L is installed on the upper surface of the die liner 7. That is, the lower side liner 6L is held by the lower side holder 5L at a position lower than the lower mold 8L.

[0064] (Advantages of the mold device 1 of one embodiment)

[0065] In the mold device 1 of one embodiment, concavities and convexities can be formed on the work piece 11. Here, when relatively high forming accuracy is required for the formed work piece 11, the influence of the deviation of the tensile strength of the work piece 11 sometimes cannot be ignored.

[0066] The tensile strength of the work piece 11 depends not only on the deviation allowed in the specification of the material of the work piece 11, but also on the temperature of the work piece 11. Therefore, for example, when the tensile strength of the work piece 11 is a value near the upper limit of the range allowed in the specification of the material of the work piece 11, and further in an environment where the ambient temperature becomes lower in winter or the like, the tensile strength of the work piece 11 further increases, so that the forming accuracy of the formed work piece 11 may not be satisfied under a specified pressing pressure.

[0067] In this case, for example, countermeasures such as extending the holding time of maintaining the pressurized state of the work piece 11 and increasing the pressing pressure can be considered. However, for the extension of the holding time, since the time required for stamping becomes longer, the productivity is reduced. Therefore, when corresponding measures are taken by increasing the pressing pressure, the pressing pressure is increased within the pressure capacity range of the forming press 3.

[0068] However, when there is no margin in the pressure capacity of the molding press 3, it is difficult to respond by increasing the pressing pressure.

[0069] Therefore, in the mold device 1 of one embodiment, for example, when it is necessary to increase the pressing pressure of the molding press 3 as described above but there is no margin in the pressure capacity of the molding press 3, the object to be processed 11 is heated to suppress the tensile strength of the object to be processed 11.

[0070] In the mold device 1 of one embodiment, for example, by controlling the output of the heater 21 by the heater control device 9, the temperature of the pressing surfaces 8a of the upper mold 8U and the lower mold 8L can be maintained below 80°C in the temperature environment in winter. In the mold device 1 of one embodiment, for example, the temperature of the pressing surface 8a is set to be maintained at 60°C.

[0071] The inventors conducted in-depth research and found that, for example, in the temperature environment in winter, when the temperature of the pressing surface 8a is maintained at 60°C and the mold device 1 of one embodiment is used to mold a thin stainless steel plate with a thickness of 0.8 mm as the object to be processed 11, when the holding time for applying the molding pressure to the object to be processed 11 is 5 seconds, the temperature of the object to be processed 11 becomes about 40°C after the stamping molding.

[0072] That is, by using the mold device 1 of one embodiment to perform stamping molding while heating the object to be processed 11, it is possible to perform stamping molding in a state where the object to be processed 11 is heated to suppress the tensile strength of the object to be processed 11. Therefore, the same molding accuracy as that in a relatively warm temperature environment other than winter can be obtained.

[0073] In this way, the mold device 1 of one embodiment includes a pair of upper and lower molds 8 and a heater 21 for heating the molds.

[0074] According to the mold device 1 of one embodiment, when stamping and molding the object to be processed 11 using the mold 8 heated by the heater 21, heat is transferred from the mold 8 to the object to be processed 11, and the temperature of the object to be processed 11 rises. Due to this temperature rise, the tensile strength of the object to be processed 11 is suppressed. Thus, even without extending the holding time of maintaining the pressurized state of the object to be processed 11 or increasing the pressing pressure, the molding accuracy of the object to be processed 11 stamped and molded by the molding press 3 can be stabilized.

[0075] The die device 1 of one embodiment includes an upper liner 6U and a lower liner 6L. Since heaters 21 are installed on the upper liner 6U and the lower liner 6L, which are different components from the pair of upper and lower dies 8, there is no need to machine the dies 8 to set the heaters 21, and the strength of the dies 8 can be ensured.

[0076] In the die device 1 of one embodiment, the heaters 21 are respectively installed on the upper liner 6U and the lower liner 6L.

[0077] Thus, the upper die 8U can be heated by the upper liner 6U having the heater 21, and the lower die 8L can be heated by the lower liner 6L having the heater 21. Therefore, during stamping, the workpiece 11 to be processed can be stably heated, and the forming accuracy of the workpiece 11 to be stamped can be stabilized.

[0078] In the die device 1 of one embodiment, the upper liner 6U is held by the upper holder 5U at a position above the upper die 8U, and the lower liner 6L is held by the lower holder 5L at a position below the lower die 8L.

[0079] Thus, the upper liner 6U and the lower liner 6L having the heaters 21 can be efficiently arranged in the die device 1. In addition, according to the die device 1 of one embodiment, compared with the case of heating the die 8 from the side, when the areas of the upper and lower surfaces of the die 8 are larger than the side area of the die 8 as in the die 8 of one embodiment, by transferring heat from the upper and lower surfaces of the die 8 as in the die device 1 of one embodiment, the die 8 can be heated efficiently.

[0080] In the die device 1 of one embodiment, the upper liner 6U is detachably held by the upper holder 5U, and the lower liner 6L is detachably held by the lower holder 5L. Therefore, when the temperature environment around the molding press 3 is relatively warm, for example, and it is not necessary to heat the die 8 by the heaters 21, the upper liner 6U and the lower liner 6L can be removed from the die device 1.

[0081] Thus, the burden on the upper liner 6U and the lower liner 6L can be reduced and their service life can be extended.

[0082] In the die device of one embodiment, at least one of a groove 6a or a hole 6b for arranging the heater 21 may be formed in the upper liner 6U and the lower liner 6L.

[0083] Thus, the heater 21 can be easily arranged on the upper liner 6U and the lower liner 6L.

[0084] In the die device 1 according to one embodiment, the surface temperature of the stamping surfaces 8a of the pair of upper and lower dies 8 heated by the heater 21 is 80°C or lower.

[0085] According to the die device 1 of one embodiment, for example, it is possible to suppress the tensile strength without accompanying the quenching of a general metal workpiece 11.

[0086] In the die device 1 of one embodiment, the workpiece 11 is a metallic thin plate with a thickness of 1 mm or less.

[0087] According to the die device 1 of one embodiment, it is possible to stabilize the forming accuracy of a metallic thin plate.

[0088] (Regarding the stamping forming method)

[0089] Hereinafter, a stamping forming method using the die device 1 of one embodiment will be described.

[0090] Figure 3 is a flowchart showing the processing sequence in the stamping forming method using the die device 1 of one embodiment. The stamping forming method of the present embodiment is implemented, for example, by Figure 1 the forming stamping machine 3 shown.

[0091] In the stamping forming method of the present embodiment, before the stamping forming of the workpiece 11, the heating of the die 8 by the heater 21 is started (step S1).

[0092] In step S1, the heater control device 9 starts energizing each heater 21 and controls the power supply to each heater 21 so as to maintain a preset set temperature.

[0093] For example, in step S1, the set temperature of the heater 21 is set to a temperature considering the deviation from the temperature of the stamping surface 8a. When the temperature of the stamping surface 8a is about 20°C lower than the set temperature of the heater 21, the set temperature of the heater 21 is set to a temperature about 20°C higher than the target temperature of the stamping surface 8a.

[0094] In addition, the heater control device 9 is configured to be able to independently control the temperature of each heater 21 provided on the upper platen 6U and each heater 21 provided on the lower platen 6L. Thus, even when the heat capacities of the upper die 1U and the lower die 1L are different, appropriate temperature control can be performed, that is, temperature control for suppressing the temperature difference between the stamping surface 8a of the upper die 8U and the stamping surface 8a of the lower die 8L can be implemented.

[0095] After starting the heating of the die 8 by the heater 21, wait until a predetermined time has elapsed (step S3).

[0096] In addition, the specified time is the time required for the temperature of the mold 8 heated by the heater 21 to reach the specified temperature (e.g., 60°C) at the stamping surface 8a.

[0097] Instead of waiting for the specified time, the temperature of the stamping surface 8a can be appropriately measured and waited until the stamping surface 8a reaches the specified temperature.

[0098] After the above waiting, the work piece 11 is placed on the stamping surface 8a of the lower mold 8L (step S7), and stamping is performed by the molding press 3 (step S7).

[0099] After that, the work piece 11 that has been stamped is taken out from the mold device 1 (step S9).

[0100] After that, if the molding operation is finished (positive judgment in step S11), the stamping process ends, and if the molding operation continues (negative judgment in step S11), it returns to the above step S5.

[0101] In this way, in the stamping method of the present embodiment, using the mold device 1 of one embodiment, the work piece 11 is stamped by the molding press 3.

[0102] Thereby, even without extending the holding time of maintaining the pressurized state of the work piece 11 or increasing the pressurizing pressure, the molding accuracy of the work piece 11 stamped by the molding press 3 can be stabilized.

[0103] The present disclosure is not limited to the above-described embodiments, and also includes modified forms of the above-described embodiments and forms in which these forms are appropriately combined.

[0104] For example, the above work piece 11 is a thin stainless steel plate with a thickness of 0.8 mm, for example, but the thickness and material of the work piece 11 are not limited to the above thickness and material.

[0105] In the mold device 1 of one embodiment, the thickness of the work piece 11 can be, for example, 1.0 mm or less. In addition, in the mold device 1 of one embodiment, the material of the work piece 11 is not limited to stainless steel, but can be various metal materials such as titanium, aluminum, and phosphor bronze.

[0106] The usage environment of the mold device 1 of one embodiment may not be the above-described environment with a low ambient temperature such as winter. For example, even in a relatively warm temperature environment, for example, when stamping is performed to suppress the tensile strength of the work piece 11, the mold device 1 of one embodiment can be used.

[0107] The content described in each of the above embodiments can be understood as follows, for example.

[0108] (1) The die device 1 for forming stamping according to at least one embodiment of the present disclosure is a die device 1 for forming stamping used in a forming press 3, and includes a pair of upper and lower dies 8 and a heater 21 for heating the die 8.

[0109] According to the configuration of the above (1), when the workpiece 11 is stamped and formed by the die 8 heated by the heater 21, heat is transferred from the die 8 to the workpiece 11, and the temperature of the workpiece 11 rises. Due to this temperature rise, the tensile strength of the workpiece 11 is suppressed. Thus, even without extending the holding time of maintaining the pressurized state of the workpiece 11 or increasing the pressing pressure, the forming accuracy of the workpiece 11 stamped and formed by the forming press 3 can be stabilized.

[0110] (2) In some embodiments, in the configuration of the above (1), it may be provided with liners (upper liner 6U, lower liner 6L), on which the heater 21 is installed, and which are different components from the pair of upper and lower dies 8.

[0111] According to the configuration of the above (2), since it is not necessary to machine the die 8 to provide the heater 21, the strength of the die 8 can be ensured.

[0112] (3) In some embodiments, in the configuration of the above (2), the pair of upper and lower dies 8 includes an upper die 8U and a lower die 8L. In some embodiments, in the configuration of the above (2), it includes: an upper retainer 5U that holds the upper die 8U in the pair of upper and lower dies 8; and a lower retainer 5L that holds the lower die 8L in the pair of upper and lower dies 8. The above liners (upper liner 6U, lower liner 6L) may include: an upper liner 6U that is held together with the upper die 8U by the upper retainer 5U; and a lower liner 6L that is held together with the lower die 8L by the lower retainer 5L. The heater 21 may be installed on the upper liner 6U and the lower liner 6L respectively.

[0113] According to the configuration of the above (3), the upper die 8U can be heated by the upper liner 6U having the heater 21, and the lower die 8L can be heated by the lower liner 6L having the heater 21. Thus, during stamping and forming, the workpiece 11 can be stably heated, and the forming accuracy of the workpiece 11 subjected to stamping and forming can be stabilized.

[0114] (4) In some embodiments, in the configuration of (3) above, it may also be that the upper lining plate 6U is held by the upper holder 5U at a position above the upper die 8U, and the lower lining plate 6L is held by the lower holder 5L at a position below the lower die 8L.

[0115] According to the configuration of (4) above, the upper lining plate 6U and the lower lining plate 6L having the heater 21 can be efficiently arranged in the molding press die device 1.

[0116] (5) In some embodiments, in the configuration of (3) or (4) above, the upper lining plate 6U is detachably held by the upper holder 5U, and the lower lining plate 6L is detachably held by the lower holder 5L.

[0117] According to the configuration of (5) above, for example, when the temperature environment around the molding press 3 is relatively warm and it is not necessary to heat the die 8 by the heater 21, the upper lining plate 6U and the lower lining plate 6L can be removed from the molding press die device 1.

[0118] Thereby, the burden on the upper lining plate 6U and the lower lining plate 6L can be reduced and the service life can be extended.

[0119] (6) In some embodiments, in any of the configurations of (3) to (5) above, the upper lining plate 6U and the lower lining plate 6L may be formed with grooves 6a or holes 6b for arranging the heater 21.

[0120] According to the configuration of (6) above, the heater 21 can be easily arranged on the upper lining plate 6U and the lower lining plate 6L.

[0121] (7) In some embodiments, in any of the configurations of (1) to (6) above, the surface temperature of the stamping surfaces 8a of the pair of upper and lower dies 8 heated by the heater 21 may be 80 °C or lower.

[0122] According to the configuration of (7) above, for example, the tensile strength can be suppressed without accompanying the quenching and tempering of the general metal workpiece 11.

[0123] (8) In some embodiments, in any of the configurations of (1) to (7) above, the workpiece 11 processed by the pair of upper and lower dies 8 may be a metallic thin plate with a thickness of 1 mm or less.

[0124] According to the configuration of (8) above, the forming accuracy of the metallic thin plate can be stabilized.

[0125] (9) The stamping forming method of at least one embodiment of the present disclosure uses the molding press die device 1 having any of the configurations of (1) to (8) above, and stamps and forms the workpiece 11 by the molding press 3.

[0126] According to the method of (9) above, even without extending the holding time of maintaining the pressure on the workpiece 11 or increasing the pressing pressure, it is possible to stabilize the forming accuracy of the workpiece 11 formed by the forming press 3.

[0127] Explanation of reference numerals

[0128] 1 Mold device for forming stamping (mold device)

[0129] 1U Upper die

[0130] 1L Lower die

[0131] 3 Forming press

[0132] 5U Upper retainer

[0133] 5L Lower retainer

[0134] 6U Upper lining

[0135] 6L Lower lining

[0136] 6a Groove

[0137] 6b Hole

[0138] 7 Die lining

[0139] 8 Die

[0140] 8U Upper die

[0141] 8L Lower die

[0142] 8a Stamping surface

[0143] 9 Heater control device

[0144] 11 Workpiece

[0145] 21 Heater

Claims

1. A die device for forming stamping, which is a die device for forming stamping used in a forming stamping machine, and is characterized in that, Comprising: An upper and a lower pair of molds; and A heater for heating the molds.

2. The mold device for forming and stamping according to claim 1, wherein It comprises a backing plate, on which the heater is mounted, and which is a different component from the upper and lower pair of molds.

3. The mold device for forming and stamping according to claim 2, wherein The upper and lower pair of molds includes an upper mold and a lower mold, The mold device for forming and stamping comprises: An upper cage for holding the upper mold of the upper and lower pair of molds; and A lower cage for holding the lower mold of the upper and lower pair of molds, The backing plate includes: An upper backing plate, which is held together with the upper mold by the upper cage; and A lower backing plate, which is held together with the lower mold by the lower cage, The heaters are respectively mounted on the upper backing plate and the lower backing plate.

4. The mold device for forming and stamping according to claim 3, wherein The upper backing plate is held by the upper cage at a position higher than the upper mold, The lower backing plate is held by the lower cage at a position lower than the lower mold.

5. The mold device for forming and stamping according to claim 3 or 4, wherein The upper backing plate is removably held by the upper cage, The lower backing plate is removably held by the lower cage.

6. The mold device for forming and stamping according to claim 3 or 4, wherein The upper backing plate and the lower backing plate are formed with grooves or holes for arranging the heaters.

7. The mold device for forming and stamping according to claim 1 or 2, wherein The surface temperature of the stamping surfaces of the upper and lower pair of molds heated by the heater is 80°C or lower.

8. The mold device for forming and stamping according to claim 1 or 2, wherein The object to be processed by the upper and lower pair of molds is a metallic thin plate with a thickness of 1 mm or less.

9. A stamping method, characterized in that, Using the mold device for forming and stamping according to claim 1 or 2, the object to be processed is stamped and formed by a forming stamping machine.

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