Cooling equipment with uniform cooling function for semiconductor production

Abstract

The invention discloses semiconductor production cooling equipment with a uniform cooling function, and relates to the technical field of semiconductor production. The cooling equipment comprises a base and a box body, the box body is arranged above the base, and a cooling cavity is formed in the inner wall of the box body. The cooling mechanism is composed of a first fixing ring and a second fixing ring which are respectively provided with a first air hole and a second air hole which are opposite in inclination direction, low-temperature air acts on the surface of the semiconductor device from the upper side and the lower side in an inclined cross airflow mode, and the problem of local thermal stress concentration of semiconductor device cooling is avoided. In addition, through cooperation of the rotating assembly and the supporting assembly, the position of the semiconductor device is dynamically adjusted in the cooling process, it is ensured that the contact probability of all parts and airflow is equal, vacuum heating and low-temperature cooling are integrated into the same equipment, and seamless function connection is achieved through intelligent switching of an exhaust system.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and specifically, it is a cooling device for semiconductor production with a uniform cooling function. Background Art

[0002] The semiconductor industry usually has heating processes. Especially in the production process of silicon wafers, processes such as oxidation, impurity diffusion, and annealing for crystal defect repair are indispensable. After heating, it is necessary to quickly cool the semiconductor device. During the cooling process of the semiconductor, precise temperature control plays a decisive role in ensuring product quality and performance.

[0003] For example, the patents "CN220997644U A Cooling Component for Semiconductor Packaging" and "CN218821151U A Cooling Device for Semiconductor Processing" respectively disclose a technical solution for cooling semiconductors. However, the current traditional semiconductor cooling and temperature reduction devices still have the following problems: First, in terms of the cooling method, it is impossible to achieve full - range synchronous cooling. This method will cause uneven heat absorption on the surface of the semiconductor device, local thermal stress concentration, which is likely to affect the performance and service life of the device and is difficult to meet the strict requirements for cooling uniformity in modern semiconductor production. Second, in terms of function integration, traditional cooling and temperature reduction devices often separate the heating and cooling functions, not only occupying a large space, but also prone to smooth connection problems during function switching. And during the heating stage, the temperature of the outer wall of the device is too high, posing a safety hazard of scalding operators. Finally, in terms of fixing the semiconductor device, traditional jigs are difficult to effectively fix semiconductors of various sizes, and it is difficult to ensure the stability of fixation during the rotation cooling process of the device, affecting the cooling effect. Summary of the Invention

[0004] The purpose of the present invention is to provide a cooling device for semiconductor production with a uniform cooling function to solve the problems raised in the prior art.

[0005] To achieve the above object, the present invention provides the following technical solution: A cooling device for semiconductor production with a uniform cooling function. The cooling device includes a base and a box body. The box body is arranged above the base. The inner wall of the box body is provided with a cooling cavity. A cooling pipe is arranged inside the cooling cavity. A partition is arranged at one end of the cooling cavity close to the center of the box body. The cooling pipe is connected to an external chiller. A cooling mechanism is arranged inside the box body. An exhaust system is arranged below the base. Both the cooling mechanism and the exhaust system are communicated with the cooling cavity. Before the work of the present invention, semiconductor devices can be placed on the cooling mechanism. When working, the external chiller and the exhaust system are turned on. The external chiller conveys coolant into the cooling pipe, and the exhaust system conveys external air into the cooling cavity to be converted into low-temperature air. With the continuous operation of the exhaust system, the low-temperature air will enter the cooling mechanism and be evenly discharged to the upper and lower surfaces of the semiconductor devices, and the semiconductor devices are evenly cooled by the low-temperature air.

[0006] Further, the cooling mechanism is of an annular structure. A heating component is arranged at the bottom of the box body. The heating component is connected to the base through a cylinder.

[0007] Further, the coolant of the external chiller is ethylene glycol. An upper cover is arranged above the box body. A sealing ring is arranged at one end of the box body close to the upper cover.

[0008] The present invention controls the heating component to make a lifting movement in the box body through a cylinder, and controls the flow direction of the external gas and the gas in the box body through the exhaust system. After the semiconductor devices are placed on the cooling mechanism, the staff can cover the upper cover on the box body to make the box body in a closed state. At this time, the exhaust system is turned on, and the gas in the box body is pumped to the external environment through the exhaust system to make the environment in the box body in a vacuum state. In the vacuum state, the staff can turn on the heating component to heat the semiconductor devices. During the heating process, the external chiller continuously conveys the coolant ethylene glycol into the cooling pipe to ensure that the box body is always at room temperature and avoid the staff being accidentally injured when touching the box body. After the semiconductor devices are heated, the staff can control the heating component to descend through the cylinder to be away from the semiconductor devices. The air in the external environment is pumped into the cooling cavity through the exhaust system to be converted into low-temperature air. With the continuous operation of the exhaust system, the low-temperature air will enter the cooling mechanism and be evenly discharged to the upper and lower surfaces of the semiconductor devices, and the semiconductor devices are evenly cooled by the low-temperature air.

[0009] Further, the exhaust system includes an installation box, inside which an air pump, a first three-way valve, and a second three-way valve are provided. One end of the first three-way valve is communicated with the intake end of the air pump, the other end of the first three-way valve is communicated with the box body through a first conduit, and the last end of the first three-way valve is provided with a filter and is communicated with the external environment. One end of the second three-way valve is communicated with the outlet end of the air pump, the other end of the second three-way valve is communicated with the cooling cavity through a second conduit, and the last end of the second three-way valve is communicated with the external environment. When it is necessary to evacuate the box body, the staff can change the communication paths of the first three-way valve and the second three-way valve (the functions and structures realized by the first three-way valve and the second three-way valve belong to the conventional technical means in the art, and the specific working principle will not be described), so that the first conduit is communicated with the intake end of the air pump, and the outlet end of the air pump is communicated with the external environment. At this time, after the air pump is turned on, the gas in the box body will be pumped to the external environment to facilitate the subsequent heating of the semiconductor device in a vacuum environment. If it is necessary to pump the external environment into the cooling cavity, the staff can change the communication paths of the first three-way valve and the second three-way valve, so that the external environment is communicated with the intake end of the air pump, and the outlet end of the air pump is communicated with the second conduit. At this time, after the air pump is turned on, the gas in the external environment will be pumped into the cooling cavity and converted into low-temperature air after passing through the filter to facilitate the uniform cooling of the semiconductor device.

[0010] Further, the cooling mechanism includes a first fixing ring and a second fixing ring, which are connected by bolts. A first annular cavity is arranged inside the first fixing ring, and several groups of first air holes are arranged on the inner wall of the first fixing ring. All the several groups of first air holes are communicated with the first annular cavity. A second annular cavity is arranged inside the second fixing ring, and several groups of second air holes are arranged on the inner wall of the second fixing ring. All the several groups of second air holes are communicated with the second annular cavity. In the process of cooling down the semiconductor device in the present invention, the air transported to the cooling cavity by the exhaust system will enter the first annular cavity and the second annular cavity after being cooled down, and finally be discharged from the several groups of first air holes and the several groups of second air holes to uniformly cool down the semiconductor device.

[0011] Further, the outlet ends of several groups of first air holes are all inclined downward, and the outlet ends of several groups of second air holes are all inclined upward. When the semiconductor device is placed on the cooling mechanism, it is located at the position between several groups of first air holes and several groups of second air holes. Through the above technical solution, the low-temperature air discharged from the first air holes flows obliquely downward, and the low-temperature air discharged from the second air holes flows obliquely upward, thereby improving the utilization efficiency of the low-temperature air.

[0012] Furthermore, a rotating assembly is provided between the first fixing ring and the second fixing ring. A plurality of groups of supporting assemblies are provided at one end of the rotating assembly close to the center of the box body. The plurality of groups of supporting assemblies are used to support the semiconductor device. During the cooling process of the semiconductor device, the rotating assembly drives the plurality of groups of supporting assemblies to drive the semiconductor device to rotate, so as to ensure the uniformity of cooling.

[0013] Furthermore, the rotating assembly includes a first gear and a second gear. A plurality of groups of first gears are provided. The plurality of groups of first gears are evenly arranged outside the second gear. A plurality of groups of supporting assemblies are evenly arranged at one end of the second gear close to the center of the box body. A rotating motor is provided above the first fixing ring. The rotating shaft of the rotating motor is connected to one of the first gears. Under the action of the plurality of groups of first gears, the present invention only needs to start the rotating motor to drive the second gear to drive the plurality of groups of supporting assemblies to rotate, so as to ensure the uniformity of the subsequent cooling of the semiconductor device.

[0014] Furthermore, the supporting assembly includes a first support frame and a second support frame. The first support frame is fixedly connected to the second gear. A chute is provided inside the first support frame. One end of the second support frame extends into the chute. The first support frame and the second support frame are connected by a first compression spring. A first electromagnet is provided on one side of the chute away from the second support frame. A magnetic block is provided at one end of the second support frame close to the first electromagnet. Before the present invention works, the staff can place the semiconductor device on the second support frame to support the semiconductor device through the second support frame. When the diameter of the semiconductor device is small, the staff can turn on the first electromagnet to generate a magnetic field that repels the magnetic block through the first electromagnet. Since the magnetic block is fixed on the second support frame, under the action of the magnetic force, the second support frame will move away from the first support frame. Through the above technical solution, the present invention can change the length of the second support frame extending out of the chute by adjusting the magnetic force of the first electromagnet, so as to facilitate the staff to place semiconductor devices of different sizes on the second support frame.

[0015] Further, a cavity is provided inside the second support frame. A second electromagnet is provided inside one end of the cavity close to the first support frame. A through hole is provided above one end of the cavity far from the first support frame. A sealing block is provided inside one end of the cavity far from the first support frame. The sealing block is movably installed in the cavity through a second compression spring. The sealing block is made of ferromagnetic material. Before the present invention works, when the semiconductor device is placed on the second support frame, the staff can turn on the second electromagnet to generate a magnetic field that attracts the sealing block. At this time, the sealing block will move towards the direction of the second electromagnet, so that the through hole is in a negative pressure state. Under the action of air pressure, the semiconductor device will be sucked and fixed on the second support frame to prevent the semiconductor device from shaking when it rotates and cools.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. Compared with the current cooling equipment, the present invention is provided with a cooling mechanism. The cooling mechanism is composed of a first fixing ring and a second fixing ring, which are respectively provided with first air holes and second air holes with opposite inclination directions. The low-temperature air acts on the surface of the semiconductor device simultaneously from the upper and lower sides in the form of an oblique cross-flow of air. This symmetric air flow distribution avoids the problem of local thermal stress concentration caused by traditional single-sided cooling, significantly improves the cooling uniformity of the semiconductor device. In addition, through the rotating assembly, the supporting assembly can be actively rotated, so that the semiconductor device dynamically adjusts its position during the cooling process to ensure that the contact probability of each part with the air flow is equal.

[0018] 2. The present invention also integrates vacuum heating and low-temperature cooling in the same device, and realizes seamless connection of functions through the intelligent switching of the exhaust system. During the heating stage, the air pump extracts the gas in the box body through the first three-way valve to form a vacuum environment, effectively isolating the oxidation reaction. At the same time, the ethylene glycol solution in the cooling pipe continuously circulates to maintain the normal temperature of the outer wall of the box to avoid scalding the operator. This double protection design solves the hidden danger of the high temperature of the outer wall during heating of traditional equipment. During the cooling stage, the air in the external environment is pumped into the cooling cavity through the exhaust system to be converted into low-temperature air. As the exhaust system continues to work, the low-temperature air will enter the first annular cavity and the second annular cavity, and finally be discharged from a plurality of groups of first air holes and a plurality of groups of second air holes to cool down the semiconductor device.

[0019] 3. Finally, the present invention also realizes the intelligent adaptation of the support component of the present invention to semiconductor devices of different sizes through the composite structure of electromagnetic regulation and negative pressure adsorption. The first electromagnet in the first support frame drives the second support frame to expand and contract through the principle of magnetic repulsion, and its stroke can be accurately controlled by current. The second electromagnet built in the second support frame and the iron sealing block form a negative pressure adsorption unit. When energized, the sealing block moves to generate negative pressure in the through hole, firmly fixing the device. This mechanical-magnetic double locking mode not only avoids the risk of physical damage of traditional clamps but also ensures the stability during rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 is a schematic diagram of the internal structure of the box of the present invention;

[0022] Figure 3 is a schematic diagram of the exhaust system structure of the present invention;

[0023] Figure 4 is a schematic diagram of the position of the cooling mechanism of the present invention;

[0024] Figure 5 is a schematic diagram of the appearance of the cooling mechanism of the present invention;

[0025] Figure 6 is a schematic diagram of the internal structure of the cooling mechanism of the present invention;

[0026] Figure 7 is a schematic diagram of the structure of the rotating component of the present invention;

[0027] Figure 8 is a schematic diagram of the structure of the support component of the present invention;

[0028] Figure 9 is of the present invention Figure 8 schematic diagram of the structure of part A-A in

[0029] In the figure: 1. Base; 11. Installation box; 111. First three-way valve; 112. Second three-way valve; 113. Air pump; 114. First conduit; 115. Second conduit; 2. Box body; 21. Cooling cavity; 211. Cooling pipe; 22. Partition board; 3. Upper cover; 4. Cooling mechanism; 41. First fixing ring; 411. Rotating motor; 412. First air hole; 413. First annular cavity; 42. Second fixing ring; 421. Second air hole; 422. Second annular cavity; 423. First gear; 424. Second gear; 43. Support assembly; 431. First support frame; 4311. First electromagnet; 4312. Chute; 432. Second support frame; 4321. Sealing block; 4322. Cavity; 4323. Second electromagnet; 5. Semiconductor device; 6. Heating component; 7. Cylinder. Detailed implementation mode

[0030] Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] Embodiment: As Figures 1-9 shown, the present invention provides a technical solution, a temperature reduction device for semiconductor production with a uniform temperature reduction function. The temperature reduction device includes a base 1 and a box body 2. The box body 2 is arranged above the base 1. The inner wall of the box body 2 is provided with a cooling cavity 21. The inside of the cooling cavity 21 is provided with a cooling pipe 211. One end of the cooling cavity 21 close to the center of the box body 2 is provided with a partition board 22. The cooling pipe 211 is connected to an external chiller. The inside of the box body 2 is provided with a cooling mechanism 4. The lower part of the base 1 is provided with an exhaust system. Both the cooling mechanism 4 and the exhaust system are communicated with the cooling cavity 21. Before the present invention works, the semiconductor device 5 can be placed on the cooling mechanism 4. When working, the external chiller and the exhaust system are turned on. The external chiller conveys the coolant into the cooling pipe 211, and the external air is conveyed into the cooling cavity 21 through the exhaust system and converted into low-temperature air. As the exhaust system continues to work, the low-temperature air will enter the cooling mechanism 4 and be evenly discharged to the upper and lower surfaces of the semiconductor device 5, and the semiconductor device 5 is evenly cooled by the low-temperature air.

[0032] As Figure 2 、 Figures 4-5 shown, the cooling mechanism 4 is of an annular structure. A heating component 6 is arranged at the bottom of the box body 2. The heating component 6 is connected to the base 1 through a cylinder 7.

[0033] As Figure 1 、 Figures 2-4 shown, the coolant of the external chiller is ethylene glycol. An upper cover 3 is arranged above the box body 2. A sealing ring is arranged at one end of the box body 2 close to the upper cover 3.

[0034] The present invention controls the lifting movement of the heating component 6 in the box body 2 through the cylinder 7, and controls the flow direction of the external gas and the gas in the box body 2 through the exhaust system. After the semiconductor device 5 is placed on the cooling mechanism 4, the operator can cover the upper cover 3 on the box body 2 to make the box body 2 in a sealed state. At this time, the exhaust system is turned on, and the gas in the box body 2 is pumped to the external environment through the exhaust system, so that the environment in the box body 2 is in a vacuum state. In the vacuum state, the operator can turn on the heating component 6 to heat the semiconductor device 5 through the heating component 6. During the heating process, the external chiller continuously transports the coolant ethylene glycol into the cooling pipe 211 to ensure that the box body 2 is always at room temperature, avoiding the operator being accidentally injured when touching the box body 2. After the semiconductor device 5 is heated, the operator can control the heating component 6 to descend through the cylinder 7 to move away from the semiconductor device 5, and pump the air in the external environment into the cooling cavity 21 to be converted into low-temperature air through the exhaust system. As the exhaust system continues to work, the low-temperature air will enter the cooling mechanism 4 and be evenly discharged to the upper and lower surfaces of the semiconductor device 5, and the semiconductor device 5 is evenly cooled by the low-temperature air.

[0035] As Figure 3 shown, the exhaust system includes an installation box 11. An air pump 113, a first three-way valve 111 and a second three-way valve 112 are arranged inside the installation box 11. One end of the first three-way valve 111 is connected to the intake end of the air pump 113, the other end of the first three-way valve 111 is connected to the box body 2 through a first conduit 114, and a filter is arranged at the last end of the first three-way valve 111 and is connected to the external environment. One end of the second three-way valve 112 is connected to the outlet end of the air pump 113, the other end of the second three-way valve 112 is connected to the cooling cavity 21 through a second conduit 115, and the last end of the second three-way valve 112 is connected to the external environment. When it is necessary to evacuate the box body 2, the operator can change the connection paths of the first three-way valve 111 and the second three-way valve 112 (the functions and structures realized by the first three-way valve 111 and the second three-way valve 112 belong to the conventional technical means in the art, and the specific working principle will not be described), so that the first conduit 114 is connected to the intake end of the air pump 113, and the outlet end of the air pump 113 is connected to the external environment. At this time, after the air pump 113 is turned on, the gas in the box body 2 will be pumped to the external environment to facilitate the subsequent heating of the semiconductor device 5 in a vacuum environment. If it is necessary to pump the external environment into the cooling cavity 21, the operator can change the connection paths of the first three-way valve 111 and the second three-way valve 112, so that the external environment is connected to the intake end of the air pump 113, and the outlet end of the air pump 113 is connected to the second conduit 115. At this time, after the air pump 113 is turned on, the gas in the external environment will be pumped into the cooling cavity 21 and converted into low-temperature air after passing through the filter to facilitate the uniform cooling of the semiconductor device 5.

[0036] AsFigures 4-6 As shown in the figure, the cooling mechanism 4 includes a first fixing ring 41 and a second fixing ring 42. The first fixing ring 41 and the second fixing ring 42 are connected by bolts. A first annular cavity 413 is provided inside the first fixing ring 41. A plurality of groups of first air holes 412 are provided on the inner wall of the first fixing ring 41. The plurality of groups of first air holes 412 are all communicated with the first annular cavity 413. A second annular cavity 422 is provided inside the second fixing ring 42. A plurality of groups of second air holes 421 are provided on the inner wall of the second fixing ring 42. The plurality of groups of second air holes 421 are all communicated with the second annular cavity 422. In the process of cooling the semiconductor device 5 in the present invention, the air transported into the cooling cavity 21 by the exhaust system will enter the first annular cavity 413 and the second annular cavity 422 after being cooled down, and finally be discharged from the plurality of groups of first air holes 412 and the plurality of groups of second air holes 421 to uniformly cool and cool down the semiconductor device 5.

[0037] As Figure 6 shown, the outlet ends of the plurality of groups of first air holes 412 are all inclined downward, and the outlet ends of the plurality of groups of second air holes 421 are all inclined upward. When the semiconductor device 5 is placed on the cooling mechanism 4, at the position between the plurality of groups of first air holes 412 and the plurality of groups of second air holes 421, through the above technical solution, the low-temperature air discharged from the first air holes 412 flows obliquely downward, and the low-temperature air discharged from the second air holes 421 flows obliquely upward, thereby improving the utilization efficiency of the low-temperature air.

[0038] As Figures 6-7 shown, a rotating assembly is provided between the first fixing ring 41 and the second fixing ring 42. A plurality of groups of support assemblies 43 are provided at one end of the rotating assembly close to the center of the box body 2. The purpose of supporting the semiconductor device 5 is achieved through the plurality of groups of support assemblies 43. During the cooling process of the semiconductor device 5, the rotating assembly drives the plurality of groups of support assemblies 43 to drive the semiconductor device 5 to rotate, thereby ensuring the uniformity of cooling.

[0039] As Figures 6-7 shown, the rotating assembly includes a first gear 423 and a second gear 424. A plurality of groups of first gears 423 are provided. The plurality of groups of first gears 423 are uniformly arranged outside the second gear 424. A plurality of groups of support assemblies 43 are uniformly arranged at one end of the second gear 424 close to the center of the box body 2. A rotating motor 411 is provided above the first fixing ring 41. The rotating shaft of the rotating motor 411 is connected to one of the first gears 423. Under the action of the plurality of groups of first gears 423, in the present invention, only by turning on the rotating motor 411 can the second gear 424 be driven to drive the plurality of groups of support assemblies 43 to rotate, thereby ensuring the uniformity of subsequent cooling of the semiconductor device 5.

[0040] As Figures 7-9As shown, the support assembly 43 includes a first support frame 431 and a second support frame 432. The first support frame 431 is fixedly connected to the second gear 424. A chute 4312 is provided inside the first support frame 431. One end of the second support frame 432 extends into the chute 4312. The first support frame 431 and the second support frame 432 are connected by a first compression spring. A first electromagnet 4311 is provided on one side of the chute 4312 away from the second support frame 432. A magnetic block (not shown in the figure) is provided at one end of the second support frame 432 close to the first electromagnet 4311. Before the present invention works, the staff can place the semiconductor device 5 on the second support frame 432 to support the semiconductor device 5 through the second support frame 432. When the diameter of the semiconductor device 5 is small, the staff can turn on the first electromagnet 4311 to generate a magnetic field that repels the magnetic block through the first electromagnet 4311. Since the magnetic block is fixed on the second support frame 432, under the action of the magnetic force, the second support frame 432 will move away from the first support frame 431. Through the above technical solution, the present invention can change the length of the second support frame 432 extending out of the chute 4312 by adjusting the magnetic force of the first electromagnet 4311, so as to facilitate the staff to place semiconductor devices 5 of different sizes on the second support frame 432.

[0041] As Figures 8-9 shown, a cavity 4322 is provided inside the second support frame 432. A heat insulation coating is provided on the inner wall of the cavity 4322. A second electromagnet 4323 is provided inside one end of the cavity 4322 close to the first support frame 431. A through hole is provided above one end of the cavity 4322 away from the first support frame 431. A sealing block 4321 is provided inside one end of the cavity 4322 away from the first support frame 431. The sealing block 4321 is movably installed in the cavity 4322 through a second compression spring. The sealing block 4321 is made of ferromagnetic material. Before the present invention works, when the semiconductor device 5 is placed on the second support frame 432, the staff can turn on the second electromagnet 4323 to generate a magnetic field that attracts the sealing block 4321 through the second electromagnet 4323. At this time, the sealing block 4321 will move towards the second electromagnet 4323, so that the through hole is in a negative pressure state. Under the action of air pressure, the semiconductor device 5 will be sucked and fixed on the second support frame 432 to prevent the semiconductor device 5 from shaking when the semiconductor device 5 is rotationally cooled.

[0042] Working principle of the present invention: Before working, adjust the length of the second support frame 432 extending out of the chute 4312 through the first electromagnet 4311, then place the semiconductor device 5 on the second support frame 432, and then turn on the second electromagnet 4323. The semiconductor device 5 is attracted and fixed on the second support frame 432 by the second electromagnet 4323. Finally, the operator can cover the upper cover 3 on the box body 2 to make the box body 2 in a sealed state. The gas in the box body 2 is pumped to the external environment through the exhaust system to make the environment in the box body 2 in a vacuum state. In the vacuum state, the operator can turn on the heating component 6 to heat the semiconductor device 5. During the heating process, the external chiller continuously delivers the coolant ethylene glycol into the cooling pipe 211 to ensure that the box body 2 is always at room temperature and prevent the operator from being accidentally injured when touching the box body 2. When the heating of the semiconductor device 5 is completed, the operator can control the heating component 6 to descend through the cylinder 7 to be away from the semiconductor device 5. The air in the external environment is pumped into the cooling cavity 21 through the exhaust system and converted into low-temperature air. As the exhaust system continues to work, the low-temperature air will enter the first annular cavity 413 and the second annular cavity 422, and finally be discharged from a plurality of groups of first air holes 412 and a plurality of groups of second air holes 421 to cool down the semiconductor device 5. During the cooling process, the plurality of support components 43 are driven by the rotating motor 411 to rotate with the semiconductor device 5 to ensure the cooling uniformity of the semiconductor device 5.

[0043] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A cooling device for semiconductor production with a uniform cooling function, characterized in that: The cooling device includes a base (1) and a box body (2). The box body (2) is arranged above the base (1). A cooling cavity (21) is arranged on the inner wall of the box body (2). A cooling pipe (211) is arranged inside the cooling cavity (21). A partition plate (22) is arranged at one end of the cooling cavity (21) close to the center of the box body (2). The cooling pipe (211) is connected to an external chiller. A cooling mechanism (4) is arranged inside the box body (2). An exhaust system is arranged below the base (1). Both the cooling mechanism (4) and the exhaust system are communicated with the cooling cavity (21).

2. The cooling device for semiconductor production with a uniform cooling function according to claim 1, wherein: The cooling mechanism (4) is of an annular structure. A heating component (6) is arranged at the bottom of the box body (2). The heating component (6) is connected to the base (1) through a cylinder (7).

3. The cooling device for semiconductor production with a uniform cooling function according to claim 1, wherein: The coolant of the external chiller uses ethylene glycol. An upper cover (3) is arranged above the box body (2). A sealing ring is arranged at one end of the box body (2) close to the upper cover (3).

4. A cooling device for semiconductor production with a uniform cooling function according to claim 1, characterized in that: The exhaust system includes an installation box (11). An air pump (113), a first three-way valve (111) and a second three-way valve (112) are arranged inside the installation box (11). One end of the first three-way valve (111) is communicated with the intake end of the air pump (113). The other end of the first three-way valve (111) is communicated with the box body (2) through a first conduit (114). A filter is arranged at the last end of the first three-way valve (111) and is communicated with the external environment. One end of the second three-way valve (112) is communicated with the outlet end of the air pump (113). The other end of the second three-way valve (112) is communicated with the cooling cavity (21) through a second conduit (115). The last end of the second three-way valve (112) is communicated with the external environment.

5. The temperature reduction device for semiconductor production with a uniform temperature reduction function according to claim 1, wherein: The cooling mechanism (4) includes a first fixing ring (41) and a second fixing ring (42). The first fixing ring (41) and the second fixing ring (42) are connected by bolts. A first annular cavity (413) is arranged inside the first fixing ring (41). A number of groups of first air holes (412) are arranged on the inner wall of the first fixing ring (41). All the number of groups of first air holes (412) are communicated with the first annular cavity (413). A second annular cavity (422) is arranged inside the second fixing ring (42). A number of groups of second air holes (421) are arranged on the inner wall of the second fixing ring (42). All the number of groups of second air holes (421) are communicated with the second annular cavity (422).

6. The cooling device for semiconductor production with a uniform cooling function according to claim 5, wherein: The outlet ends of all the number of groups of first air holes (412) incline downward. The outlet ends of all the number of groups of second air holes (421) incline upward.

7. The cooling device for semiconductor production with a uniform cooling function according to claim 5, characterized in that: A rotating assembly is arranged between the first fixing ring (41) and the second fixing ring (42). A number of groups of supporting components (43) are arranged at one end of the rotating assembly close to the center of the box body (2).

8. The cooling device for semiconductor production with a uniform cooling function according to claim 7, characterized in that: The rotating assembly includes a first gear (423) and a second gear (424). The first gear (423) is provided in several groups, and the several groups of first gears (423) are evenly arranged outside the second gear (424). Several groups of support assemblies (43) are evenly arranged at one end of the second gear (424) close to the center of the box body (2). Above the first fixing ring (41), there is a rotating motor (411), and the rotating shaft of the rotating motor (411) is connected to one of the groups of first gears (423).

9. The cooling device for semiconductor production with a uniform cooling function according to claim 8, wherein: The support assembly (43) includes a first support frame (431) and a second support frame (432). The first support frame (431) is fixedly connected to the second gear (424). Inside the first support frame (431), there is a chute (4312). One end of the second support frame (432) extends into the chute (4312). The first support frame (431) and the second support frame (432) are connected by a first compression spring. On one side of the chute (4312) away from the second support frame (432), there is a first electromagnet (4311), and on one end of the second support frame (432) close to the first electromagnet (4311), there is a magnetic block.

10. The cooling device for semiconductor production with a uniform cooling function according to claim 9, characterized in that: Inside the second support frame (432), there is a cavity (4322). Inside one end of the cavity (4322) close to the first support frame (431), there is a second electromagnet (4323). Above one end of the cavity (4322) away from the first support frame (431), there is a through hole. Inside one end of the cavity (4322) away from the first support frame (431), there is a sealing block (4321). The sealing block (4321) is movably installed in the cavity (4322) through a second compression spring. The sealing block (4321) is made of ferromagnetic material.

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