A cooling device for semiconductor production with uniform cooling function

Abstract

The application discloses a cooling equipment with uniform cooling function for semiconductor production, and relates to the technical field of semiconductor production.The cooling equipment comprises a base and a box body, the box body is arranged above the base, and the inner wall of the box body is provided with a cooling cavity.Compared with the current cooling equipment, the cooling equipment is provided with a cooling mechanism, the cooling mechanism is composed of a first fixing ring and a second fixing ring, and the first fixing ring and the second fixing ring are respectively provided with first air holes and second air holes with opposite inclined directions.Low-temperature air acts on the surface of the semiconductor device in the form of oblique cross air flow from the upper side and the lower side, so that the problem of local thermal stress concentration of the semiconductor device during cooling is avoided.In addition, through the cooperation of the rotating assembly and the supporting assembly, the position of the semiconductor device is dynamically adjusted during the cooling process, so that the contact probability of each part with the air flow is equal.The application also integrates vacuum heating and low-temperature cooling in the same equipment, and realizes seamless connection of functions through intelligent switching of the exhaust system.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, specifically a cooling device for semiconductor manufacturing with uniform cooling function. Background Technology

[0002] The semiconductor industry typically involves heating processes, especially in the production of silicon wafers. Processes such as oxidation, impurity diffusion, and annealing for crystal defect repair are indispensable. After heating, semiconductor devices need to be cooled down quickly. During the cooling process, precise temperature control plays a decisive role in ensuring product quality and performance.

[0003] For example, patents "CN220997644U A Cooling Component for Semiconductor Packaging" and "CN218821151U A Cooling Device for Semiconductor Processing" disclose technical solutions for cooling semiconductors. However, traditional semiconductor cooling equipment still has the following problems: First, in terms of cooling methods, it is impossible to achieve all-round synchronous cooling. This method will lead to uneven heating on the surface of semiconductor devices and local thermal stress concentration, which can easily affect the performance and service life of the devices and make it difficult to meet the strict requirements of modern semiconductor production for cooling uniformity. Second, in terms of functional integration, traditional cooling equipment often separates heating and cooling functions, which not only occupies a lot of space, but also easily leads to poor connection when switching functions. In addition, during the heating stage, the temperature of the outer wall of the equipment is too high, posing a safety hazard of burns to operators. Finally, in terms of semiconductor device fixation, traditional clamps are difficult to effectively fix semiconductors of various sizes. At the same time, it is difficult to ensure the stability of fixation during the device rotation cooling process, affecting the cooling effect. Summary of the Invention

[0004] The purpose of this invention is to provide a cooling device for semiconductor manufacturing with uniform cooling function, so as to solve the problems mentioned in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a cooling device for semiconductor production with uniform cooling function, the cooling device comprising a base and a housing, the housing being disposed above the base, a cooling cavity being disposed on the inner wall of the housing, a cooling pipe being disposed inside the cooling cavity, a partition being disposed at one end of the cooling cavity near the center of the housing, the cooling pipe being connected to an external chiller, a cooling mechanism being disposed inside the housing, and an exhaust system being disposed below the base, both the cooling mechanism and the exhaust system being connected to the cooling cavity. Before operation, the semiconductor device can be placed on the cooling mechanism. When operating, the external chiller and the exhaust system are turned on, the external chiller supplies coolant to the cooling pipe, and the exhaust system delivers outside air into the cooling cavity, converting it into low-temperature air. As the exhaust system continues to operate, the low-temperature air enters the cooling mechanism and is evenly discharged onto the upper and lower surfaces of the semiconductor device, thereby uniformly cooling the semiconductor device.

[0006] Furthermore, the cooling mechanism is a ring structure, and a heating element is provided at the bottom of the box. The heating element is connected to the base via a cylinder.

[0007] Furthermore, the coolant used in the external chiller is ethylene glycol, and a top cover is provided on the upper part of the housing, with a sealing ring provided at the end of the housing near the top cover.

[0008] This invention uses a cylinder to control the heating element's lifting and lowering movement within the chamber, and an exhaust system to control the flow direction of external and internal gases. After the semiconductor device is placed on the cooling mechanism, the operator can cover the chamber with the top cover to create a sealed environment. The exhaust system is then activated to draw the gas out of the chamber, creating a vacuum. Under this vacuum, the operator can activate the heating element to heat the semiconductor device. During heating, an external chiller continuously supplies ethylene glycol coolant to the cooling pipes to maintain the chamber at room temperature and prevent accidental contact with the chamber. After heating, the operator can lower the heating element using the cylinder to move it away from the semiconductor device. The exhaust system draws air from the outside environment into the cooling chamber, converting it into low-temperature air. As the exhaust system continues to operate, this low-temperature air enters the cooling mechanism and is evenly distributed across the upper and lower surfaces of the semiconductor device, thus uniformly cooling it.

[0009] Furthermore, the exhaust system includes a mounting box, inside which are installed an air pump, a first three-way valve, and a second three-way valve. One end of the first three-way valve is connected to the air inlet of the air pump, and the other end of the first three-way valve is connected to the box body via a first conduit. The last end of the first three-way valve is equipped with a filter and is connected to the external environment. One end of the second three-way valve is connected to the air outlet of the air pump, and the other end of the second three-way valve is connected to the cooling chamber via a second conduit. The last end of the second three-way valve is connected to the external environment. When it is necessary to evacuate the box, the operator can change the connection path of the first three-way valve and the second three-way valve (the functions performed by the first three-way valve and the second three-way valve). The structure is a conventional technical means in this field, and the specific working principle is not described. The first conduit is connected to the air inlet of the air pump, and the air outlet of the air pump is connected to the external environment. When the air pump is turned on, the gas in the chamber will be drawn to the external environment to facilitate the subsequent heating of the semiconductor device in a vacuum environment. If it is necessary to draw the external environment into the cooling chamber, the operator can change the connection path of the first three-way valve and the second three-way valve to connect the external environment to the air inlet of the air pump and the air outlet of the air pump to the second conduit. When the air pump is turned on, the gas in the external environment will be drawn into the cooling chamber after being filtered by the filter and converted into low-temperature air to facilitate uniform cooling of the semiconductor device.

[0010] Furthermore, the cooling mechanism includes a first fixing ring and a second fixing ring, which are connected by bolts. The first fixing ring has a first annular cavity inside, and a plurality of first air holes are provided on the inner wall of the first fixing ring, all of which are connected to the first annular cavity. The second fixing ring has a second annular cavity inside, and a plurality of second air holes are provided on the inner wall of the second fixing ring, all of which are connected to the second annular cavity. In the process of cooling the semiconductor device, the air delivered to the cooling chamber by the exhaust system will enter the first annular cavity and the second annular cavity after being cooled, and finally be discharged from the plurality of first air holes and the plurality of second air holes, so as to uniformly cool the semiconductor device.

[0011] Furthermore, the outlet ends of several sets of first air holes are all inclined downwards, and the outlet ends of several sets of second air holes are all inclined upwards. When the semiconductor device is placed on the cooling mechanism, it is located between several sets of first air holes and several sets of second air holes. Through the above technical solution, the low-temperature air discharged from the first air holes flows obliquely downwards, and the low-temperature air discharged from the second air holes flows obliquely upwards, thereby improving the utilization efficiency of low-temperature air.

[0012] Furthermore, a rotating assembly is provided between the first fixed ring and the second fixed ring. Several sets of support components are provided at one end of the rotating assembly near the center of the housing. These sets of support components serve to support the semiconductor device. During the cooling process of the semiconductor device, the rotating assembly drives the sets of support components to rotate the semiconductor device, thereby ensuring the uniformity of cooling.

[0013] Furthermore, the rotating assembly includes a first gear and a second gear. The first gear is provided in several groups, and the several groups of first gears are evenly arranged on the outside of the second gear. Several groups of support components are evenly arranged at one end of the second gear near the center of the housing. A rotary motor is provided above the first fixing ring. The rotating shaft of the rotary motor is connected to one of the groups of first gears. Under the action of the several groups of first gears, the present invention only needs to turn on the rotary motor to drive the second gear to rotate with the several groups of support components, thereby ensuring the cooling uniformity of the subsequent semiconductor device.

[0014] Furthermore, the support assembly includes a first support frame and a second support frame. The first support frame is fixedly connected to a second gear. A groove is provided inside the first support frame, and one end of the second support frame extends into the groove. The first and second support frames are connected by a first compression spring. A first electromagnet is provided on the side of the groove away from the second support frame, and a magnetic block is provided on the end of the second support frame near the first electromagnet. Before operation, the operator can place the semiconductor device on the second support frame, which supports the semiconductor device. When the diameter of the semiconductor device is small, the operator can activate the first electromagnet, which generates a magnetic field that repels the magnetic block. Since the magnetic block is fixed on the second support frame, the second support frame will move away from the first support frame under the action of magnetic force. Through the above technical solution, the present invention can change the length of the second support frame extending out of the groove by adjusting the magnetic force of the first electromagnet, thereby facilitating the operator to place semiconductor devices of different sizes on the second support frame.

[0015] Furthermore, the second support frame has an internal cavity. A second electromagnet is installed inside the cavity at the end closest to the first support frame, and a through hole is provided above the end of the cavity furthest from the first support frame. A sealing block is installed inside the cavity at the end furthest from the first support frame. The sealing block is movably mounted inside the cavity by a second compression spring. The sealing block is made of ferromagnetic material. Before operation, when the semiconductor device is placed on the second support frame, the operator can turn on the second electromagnet. The second electromagnet generates a magnetic field that attracts the sealing block. At this time, the sealing block will move towards the second electromagnet, thereby creating a negative pressure state at the through hole. Under the action of air pressure, the semiconductor device will be attracted and fixed to the second support frame to prevent the semiconductor device from shaking during rotational cooling.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. Compared with current cooling devices, the present invention is equipped with a cooling mechanism, which consists of a first fixed ring and a second fixed ring. The two rings are respectively provided with a first air hole and a second air hole with opposite inclination directions. Low temperature air acts on the surface of the semiconductor device simultaneously from the top and bottom sides in the form of oblique cross airflow. This symmetrical airflow distribution avoids the problem of local thermal stress concentration caused by traditional single-sided cooling, and significantly improves the cooling uniformity of the semiconductor device. In addition, the rotating component can make the support component rotate actively, thereby enabling the semiconductor device to dynamically adjust its position during the cooling process, ensuring that the contact probability between each part and the airflow is equal.

[0018] 2. This invention also integrates vacuum heating and low-temperature cooling into the same device, achieving seamless functional connection through intelligent switching of the exhaust system. During the heating stage, the air pump draws gas from the chamber through the first three-way valve to form a vacuum environment, effectively isolating oxidation reactions; at the same time, the ethylene glycol solution in the cooling pipe continuously circulates to maintain the outer wall of the chamber at room temperature, preventing burns to operators. This dual protection design solves the hidden danger of high temperature on the outer wall during heating in traditional equipment. During the cooling stage, the exhaust system draws air from the external environment into the cooling chamber and converts it into low-temperature air. As the exhaust system continues to work, the low-temperature air enters the first annular cavity and the second annular cavity, and finally exits from several sets of first air holes and several sets of second air holes to cool down the semiconductor device.

[0019] 3. Finally, the present invention also achieves intelligent adaptation of the support component to semiconductor devices of different sizes through the composite structure of electromagnetic regulation and negative pressure adsorption. The first electromagnet in the first support frame drives the extension and retraction of the second support frame through the principle of magnetic repulsion. Its stroke can be precisely controlled by current. The second electromagnet built into the second support frame and the iron sealing block constitute a negative pressure adsorption unit. When energized, the sealing block moves to generate negative pressure in the through hole, which firmly fixes the device. This mechanical-magnetic dual locking mode avoids the risk of physical damage of traditional clamps and ensures stability during rotation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the internal structure of the housing of the present invention;

[0022] Figure 3 This is a schematic diagram of the exhaust system structure of the present invention;

[0023] Figure 4 This is a schematic diagram showing the location of the cooling mechanism of the present invention;

[0024] Figure 5 This is a schematic diagram of the cooling mechanism of the present invention;

[0025] Figure 6 This is a schematic diagram of the internal structure of the cooling mechanism of the present invention;

[0026] Figure 7 This is a schematic diagram of the rotating component structure of the present invention;

[0027] Figure 8 This is a schematic diagram of the support component structure of the present invention;

[0028] Figure 9 For the present invention Figure 8 Schematic diagram of the AA section.

[0029] In the diagram: 1. Base; 11. Mounting box; 111. First three-way valve; 112. Second three-way valve; 113. Air pump; 114. First conduit; 115. Second conduit; 2. Box body; 21. Cooling chamber; 211. Cooling pipe; 22. Partition; 3. Top cover; 4. Cooling mechanism; 41. First fixing ring; 411. Rotary motor; 412. First air hole; 413. First annular cavity; 42. Second fixing ring; 421. Second air hole; 422. Second annular cavity; 423. First gear; 424. Second gear; 43. Support assembly; 431. First support frame; 4311. First electromagnet; 4312. Slide groove; 432. Second support frame; 4321. Sealing block; 4322. Cavity; 4323. Second electromagnet; 5. Semiconductor device; 6. Heating component; 7. Cylinder. Detailed Implementation

[0030] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example: Figures 1-9 As shown, the present invention provides a technical solution: a cooling device for semiconductor production with uniform cooling function. The cooling device includes a base 1 and a housing 2. The housing 2 is located above the base 1. A cooling cavity 21 is provided on the inner wall of the housing 2. A cooling pipe 211 is provided inside the cooling cavity 21. A partition 22 is provided at one end of the cooling cavity 21 near the center of the housing 2. The cooling pipe 211 is connected to an external chiller. A cooling mechanism 4 is provided inside the housing 2. An exhaust system is provided below the base 1. Both the cooling mechanism 4 and the exhaust system are connected to the cooling cavity 21. Before operation, the semiconductor device 5 can be placed on the cooling mechanism 4. When operating, the external chiller and the exhaust system are turned on. The external chiller delivers coolant to the cooling pipe 211, and the exhaust system delivers outside air to the cooling cavity 21, converting it into low-temperature air. As the exhaust system continues to operate, the low-temperature air enters the cooling mechanism 4 and is evenly discharged onto the upper and lower surfaces of the semiconductor device 5, thereby uniformly cooling the semiconductor device 5.

[0032] like Figure 2 , Figures 4-5 As shown, the cooling mechanism 4 is a ring structure, and a heating element 6 is provided at the bottom of the box 2. The heating element 6 is connected to the base 1 through a cylinder 7.

[0033] like Figure 1 , Figures 2-4 As shown, the coolant of the external chiller is ethylene glycol, and a top cover 3 is provided on the top of the housing 2. A sealing ring is provided at the end of the housing 2 near the top cover 3.

[0034] This invention controls the heating element 6 to move up and down within the housing 2 via cylinder 7, and controls the flow direction of external gas and gas within the housing 2 via an exhaust system. After the semiconductor device 5 is placed on the cooling mechanism 4, the operator can cover the housing 2 with the top cover 3 to seal it. At this time, the exhaust system is activated to evacuate the gas from the housing 2 to the external environment, creating a vacuum within the housing 2. Under this vacuum, the operator can activate the heating element 6 to heat the semiconductor device 5. During the heating process, external gas flows freely. The chiller continuously supplies ethylene glycol coolant into the cooling pipe 211 to ensure that the chamber 2 is always at room temperature, preventing personnel from accidentally touching the chamber 2 and getting injured. After the semiconductor device 5 finishes heating, the personnel can control the heating component 6 to descend through the cylinder 7 to move away from the semiconductor device 5. The exhaust system draws air from the outside environment into the cooling chamber 21 and converts it into low-temperature air. As the exhaust system continues to work, the low-temperature air will enter the cooling mechanism 4 and be evenly discharged onto the upper and lower surfaces of the semiconductor device 5, thereby uniformly cooling the semiconductor device 5.

[0035] like Figure 3 As shown, the exhaust system includes a mounting box 11. Inside the mounting box 11 are an air pump 113, a first three-way valve 111, and a second three-way valve 112. One end of the first three-way valve 111 is connected to the air inlet of the air pump 113, and the other end is connected to the housing 2 via a first conduit 114. The last end of the first three-way valve 111 is equipped with a filter and is connected to the external environment. One end of the second three-way valve 112 is connected to the air outlet of the air pump 113, and the other end is connected to the cooling chamber 21 via a second conduit 115. The last end of the second three-way valve 112 is connected to the external environment. When it is necessary to evacuate the housing 2, the operator can change the connection path of the first three-way valve 111 and the second three-way valve 112 (the connection path achieved by the first three-way valve 111 and the second three-way valve 112 is changed). (The function and structure are conventional technical means in this field, and the specific working principle is not described) so that the first conduit 114 is connected to the air inlet of the air pump 113, and the air outlet of the air pump 113 is connected to the external environment. When the air pump 113 is turned on, the gas in the box 2 will be drawn to the external environment to facilitate the subsequent heating of the semiconductor device 5 in a vacuum environment. If it is necessary to draw the external environment into the cooling chamber 21, the operator can change the connection path of the first three-way valve 111 and the second three-way valve 112 so that the external environment is connected to the air inlet of the air pump 113, and the air outlet of the air pump 113 is connected to the second conduit 115. When the air pump 113 is turned on, the gas in the external environment will be drawn into the cooling chamber 21 after being filtered by the filter and converted into low-temperature air to facilitate uniform cooling of the semiconductor device 5.

[0036] like Figures 4-6 As shown, the cooling mechanism 4 includes a first fixing ring 41 and a second fixing ring 42, which are connected by bolts. The first fixing ring 41 has a first annular cavity 413 inside, and a plurality of first air holes 412 are provided on the inner wall of the first fixing ring 41, all of which are connected to the first annular cavity 413. The second fixing ring 42 has a second annular cavity 422 inside, and a plurality of second air holes 421 are provided on the inner wall of the second fixing ring 42, all of which are connected to the second annular cavity 422. In the process of cooling the semiconductor device 5, the air delivered to the cooling chamber 21 by the exhaust system will enter the first annular cavity 413 and the second annular cavity 422 after being cooled, and finally be discharged from the plurality of first air holes 412 and the plurality of second air holes 421 to uniformly cool the semiconductor device 5.

[0037] like Figure 6 As shown, the outlet ends of several sets of first air holes 412 are all inclined downwards, and the outlet ends of several sets of second air holes 421 are all inclined upwards. When the semiconductor device 5 is placed on the cooling mechanism 4, it is located between several sets of first air holes 412 and several sets of second air holes 421. Through the above technical solution, the low-temperature air discharged from the first air holes 412 flows obliquely downwards, and the low-temperature air discharged from the second air holes 421 flows obliquely upwards, thereby improving the utilization efficiency of low-temperature air.

[0038] like Figures 6-7 As shown, a rotating assembly is provided between the first fixing ring 41 and the second fixing ring 42. Several sets of support components 43 are provided at one end of the rotating assembly near the center of the housing 2. The several sets of support components 43 serve to support the semiconductor device 5. During the cooling process of the semiconductor device 5, the rotating assembly drives the several sets of support components 43 to rotate the semiconductor device 5, thereby ensuring the uniformity of cooling.

[0039] like Figures 6-7 As shown, the rotating assembly includes a first gear 423 and a second gear 424. Several sets of first gears 423 are arranged evenly on the outside of the second gear 424. Several sets of support components 43 are evenly arranged at one end of the second gear 424 near the center of the housing 2. A rotary motor 411 is arranged above the first fixing ring 41. The rotating shaft of the rotary motor 411 is connected to one set of first gears 423. Under the action of several sets of first gears 423, the present invention only needs to turn on the rotary motor 411 to drive the second gear 424 to rotate with several sets of support components 43, thereby ensuring the cooling uniformity of the subsequent semiconductor device 5.

[0040] like Figures 7-9As shown, the support assembly 43 includes a first support frame 431 and a second support frame 432. The first support frame 431 is fixedly connected to the second gear 424. A sliding groove 4312 is provided inside the first support frame 431. One end of the second support frame 432 extends into the sliding groove 4312. The first support frame 431 and the second support frame 432 are connected by a first compression spring. A first electromagnet 4311 is provided on the side of the sliding groove 4312 away from the second support frame 432. A magnetic block (not shown in the figure) is provided on the end of the second support frame 432 near the first electromagnet 4311. Before operation, the operator can place the semiconductor device 5 onto the second support frame 431. 2. The second support frame 432 serves to support the semiconductor device 5. When the diameter of the semiconductor device 5 is small, the operator can turn on the first electromagnet 4311. The first electromagnet 4311 generates a magnetic field that repels the magnetic block. Since the magnetic block is fixed on the second support frame 432, the second support frame 432 will move away from the first support frame 431 under the action of the magnetic force. Through the above technical solution, the present invention can change the length of the second support frame 432 extending out of the slide groove 4312 by adjusting the magnetic force of the first electromagnet 4311, thereby facilitating the operator to place semiconductor devices 5 of different sizes on the second support frame 432.

[0041] like Figures 8-9 As shown, the second support frame 432 has a cavity 4322 inside, and the inner wall of the cavity 4322 is coated with a heat-insulating coating. A second electromagnet 4323 is installed inside the cavity 4322 at the end closest to the first support frame 431. A through hole is provided above the end of the cavity 4322 away from the first support frame 431. A sealing block 4321 is installed inside the end of the cavity 4322 away from the first support frame 431. The sealing block 4321 is movably mounted inside the cavity 4322 by a second compression spring. The sealing block 4321 is made of ferromagnetic material. In this invention, before operation, when the semiconductor device 5 is placed on the second support frame 432, the operator can turn on the second electromagnet 4323. The second electromagnet 4323 generates a magnetic field that attracts the sealing block 4321. At this time, the sealing block 4321 will move towards the second electromagnet 4323, thereby making the through hole a negative pressure state. Under the action of air pressure, the semiconductor device 5 will be attracted and fixed on the second support frame 432 to prevent the semiconductor device 5 from shaking when rotating and cooling.

[0042] The working principle of this invention is as follows: Before operation, the length of the second support frame 432 extending out of the slide groove 4312 is adjusted by the first electromagnet 4311. Then, the semiconductor device 5 is placed on the second support frame 432. Next, the second electromagnet 4323 is turned on, which attracts the semiconductor device 5 to the second support frame 432. Finally, the operator can cover the box 2 with the top cover 3 to make the box 2 sealed. The gas in the box 2 is evacuated to the outside environment through the exhaust system, so that the environment in the box 2 is in a vacuum state. Under vacuum, the operator can turn on the heating component 6 to heat the semiconductor device 5. During the heating process, an external chiller continuously supplies water to the cooling pipe 211. Ethylene glycol is used as coolant to ensure that the chamber 2 is always at room temperature, preventing personnel from being injured by accidental contact with the chamber 2. After the semiconductor device 5 finishes heating, the personnel can control the heating component 6 to descend through the cylinder 7 to move away from the semiconductor device 5. The exhaust system draws air from the outside environment into the cooling chamber 21 and converts it into low-temperature air. As the exhaust system continues to work, the low-temperature air will enter the first annular chamber 413 and the second annular chamber 422, and finally be discharged from several sets of first air holes 412 and several sets of second air holes 421 to cool down the semiconductor device 5. During the cooling process, the rotary motor 411 drives several sets of support components 43 to rotate the semiconductor device 5 to ensure the uniformity of cooling of the semiconductor device 5.

[0043] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cooling device for semiconductor production having a uniform cooling function, characterized by: The cooling device includes a base (1) and a box body (2), the box body (2) is arranged above the base (1), an inner wall of the box body (2) is provided with a cooling cavity (21), the cooling cavity (21) is internally provided with a cooling pipe (211), one end of the cooling cavity (21) close to the center of the box body (2) is provided with a partition plate (22), the cooling pipe (211) is connected with an external cold water machine, the box body (2) is internally provided with a cooling mechanism (4), the base (1) is provided with an exhaust system below, the cooling mechanism (4) and the exhaust system are both communicated with the cooling cavity (21); The cooling mechanism (4) is in an annular structure, the bottom of the box body (2) is provided with a heating component (6), the heating component (6) is connected with the base (1) through a cylinder (7); The cooling liquid of the external cold water machine adopts ethylene glycol, the top of the box body (2) is provided with an upper cover (3), one end of the box body (2) close to the upper cover (3) is provided with a sealing ring; The exhaust system includes a mounting box (11), the mounting box (11) is internally provided with a gas pump (113), a first three-way valve (111) and a second three-way valve (112), a first outlet end of the first three-way valve (111) is communicated with an air inlet end of the gas pump (113), an inlet end of the first three-way valve (111) is communicated with the box body (2) through a first conduit (114), another outlet end of the first three-way valve (111) is provided with a filter and is communicated with an external environment, an inlet end of the second three-way valve (112) is communicated with an air outlet end of the gas pump (113), a first outlet end of the second three-way valve (112) is communicated with the cooling cavity (21) through a second conduit (115), another outlet end of the second three-way valve (112) is communicated with the external environment; The cooling mechanism (4) includes a first fixed ring (41) and a second fixed ring (42), the first fixed ring (41) and the second fixed ring (42) are connected through bolts, the first fixed ring (41) is internally provided with a first annular cavity (413), a plurality of groups of first air holes (412) are arranged on the inner wall of the first fixed ring (41), the plurality of groups of first air holes (412) are all communicated with the first annular cavity (413), the second fixed ring (42) is internally provided with a second annular cavity (422), a plurality of groups of second air holes (421) are arranged on the inner wall of the second fixed ring (42), the plurality of groups of second air holes (421) are all communicated with the second annular cavity (422); The air outlet ends of the plurality of groups of first air holes (412) are all downwardly inclined, the air outlet ends of the plurality of groups of second air holes (421) are all upwardly inclined; The first fixed ring (41) and the second fixed ring (42) are provided with a rotating assembly therebetween.

2. The cooling device for semiconductor production with uniform cooling function according to claim 1, characterized in that: The rotating assembly is provided with a plurality of groups of support assemblies (43) at one end close to the center of the box body (2).

3. The cooling device for semiconductor production with uniform cooling function according to claim 2, characterized in that: The rotating assembly comprises a first gear (423) and a second gear (424), the first gear (423) is provided with several groups, the several groups of first gears (423) are uniformly arranged outside the second gear (424), the several groups of supporting assemblies (43) are uniformly arranged at one end of the second gear (424) close to the center of the box body (2), the first fixed ring (41) is provided with a rotating motor (411) above, and the rotating shaft of the rotating motor (411) is connected with one group of first gears (423).

4. The cooling device for semiconductor production with uniform cooling function according to claim 3, characterized in that: The supporting assembly (43) comprises a first supporting frame (431) and a second supporting frame (432), the first supporting frame (431) is fixedly connected with the second gear (424), the inside of the first supporting frame (431) is provided with a sliding groove (4312), one end of the second supporting frame (432) extends into the sliding groove (4312), the first supporting frame (431) and the second supporting frame (432) are connected through a first compression spring, the side, away from the second supporting frame (432), of the sliding groove (4312) is provided with a first electromagnet (4311), and one end of the second supporting frame (432), close to the first electromagnet (4311), is provided with a magnetic block.

5. The cooling device for semiconductor production with uniform cooling function according to claim 4, characterized in that: The inside of the second supporting frame (432) is provided with a cavity (4322), the inside of one end of the cavity (4322), close to the first supporting frame (431), is provided with a second electromagnet (4323), the top of one end of the cavity (4322), away from the first supporting frame (431), is provided with a through hole, the inside of one end of the cavity (4322), away from the first supporting frame (431), is provided with a sealing block (4321), the sealing block (4321) is movably arranged in the cavity (4322) through a second compression spring, and the sealing block (4321) is made of ferromagnetic material.

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