Testing device, system and method for low dropout regulator circuit

Abstract

The invention discloses a testing device, system and method for a low dropout regulator circuit, in the testing device, a daughter board is electrically connected with a mother board, and a connection interface module of the daughter board is connected with the low dropout regulator circuit; the control module is used for controlling the temperature acquisition module to acquire the temperature of the low dropout linear regulator circuit and controlling the electricity acquisition module to acquire an electric signal of the low dropout linear regulator circuit; and the test interface module is used for receiving a test electrical signal of the test equipment and sending the test electrical signal to the daughter board through the daughter board and mother board interface module. According to the testing device of the low dropout linear regulator circuit, the mother board and the at least one daughter board work cooperatively through electrical connection, the mother board has the functions of electricity collection and temperature collection, and the daughter board only needs to be adapted to devices of different packaging specifications. According to the invention, the compatibility of testing different low-dropout linear voltage regulator circuits and the real-time performance of temperature acquisition are improved through the daughter board and mother board structure.

Description

Technical Field

[0001] The present invention relates to the technical field of power supply testing for aerospace equipment, and particularly to a testing device, system and method for a low dropout linear regulator circuit. Background Art

[0002] To meet the requirement of 100% independent control of electronic components in aerospace equipment, it is an inevitable trend to carry out selection and substitution based on domestic products. Among them, the low dropout linear regulator circuit products are widely used in each model system single machine due to their versatility, and the application environment is complex and diverse. However, in the domestic market of low dropout linear regulator circuits, there are differences in the design rules and process levels of domestic research and development units, resulting in a series of problems with domestic low dropout linear regulator circuits in equipment. It is necessary to carry out targeted application adaptability assessment in combination with the actual application conditions of users, that is, to systematically verify the tolerance of the product on the whole machine.

[0003] As one of the common component varieties in aerospace equipment, the performance of the low dropout linear regulator circuit affects the overall performance of aerospace equipment. In the low dropout linear regulator circuit, the reliability of the thermal protection function is highly valued.

[0004] In the prior art, in the reliability evaluation of low dropout linear regulator circuits, the test method for low dropout linear regulator circuits is to carry out verification only for the specific application scenarios of single model specifications of low dropout linear regulator circuits. Due to the rich variety of low dropout linear regulator circuits, different detection devices and detection methods need to be designed for different types of low dropout linear regulator circuits. If the requirements of aerospace models are to be fully covered, specific boards need to be developed for each low dropout linear regulator circuit and verification tests need to be carried out for its specific application scenarios. At the same time, in the prior art, for the temperature acquisition of low dropout linear regulator circuits, a thermal imager is used to measure the temperature. In the temperature acquisition device using a thermal imager, the volume of the thermal imager is large and the portability of the temperature acquisition device is small, so real-time acquisition cannot be carried out. Summary of the Invention

[0005] The present invention provides a testing device, system and method for a low dropout linear regulator circuit to solve the problems of low applicability of the current testing device for the reliability of the thermal protection function of low dropout linear regulator circuits and inability to perform real-time acquisition of the temperature of low dropout linear regulators.

[0006] According to the first aspect of the present invention, there is provided a testing device for a low dropout linear regulator circuit, comprising:

[0007] A motherboard and at least one daughter board;

[0008] The daughter board includes at least one connection interface module, and the connection interface module is used to connect the low dropout linear regulator circuit;

[0009] The daughter board and the mother board are electrically connected;

[0010] The mother board includes: a control module, a test interface module, a mother-daughter board interface module, an electrical acquisition module, and at least one temperature acquisition module. At least one of the daughter boards is correspondingly arranged with at least one of the temperature acquisition modules;

[0011] The control module is respectively connected to the temperature acquisition module and the electrical acquisition module. The electrical acquisition module is connected to the daughter board through the mother-daughter board interface module; the control module is used to control the temperature acquisition module to acquire the temperature of the low dropout linear regulator circuit, and the control module is also used to control the electrical acquisition module to acquire the electrical signal output by the low dropout linear regulator circuit; the test interface module is connected to the daughter board through the mother-daughter board interface module, and the test interface module is used to receive the test electrical signal of the test device and send the test electrical signal to the daughter board through the mother-daughter board interface module.

[0012] According to the second aspect of the present invention, a low dropout linear regulator circuit test system is provided. The low dropout linear regulator circuit test system includes:

[0013] A test device, a host computer, and a test device for the low dropout linear regulator circuit according to any embodiment of the present invention;

[0014] The output end of the test device is connected to the test interface module of the mother board of the test device for the low dropout linear regulator circuit, and the test device is used to provide a test electrical signal to the test device for the low dropout linear regulator circuit;

[0015] The host computer is connected to the control module; the host computer is used to receive the housing temperature data collected by the temperature acquisition module, receive the electrical signal of the low dropout linear regulator circuit under the test electrical signal collected by the electrical acquisition module, and send the control signal of the low dropout linear regulator circuit;

[0016] The host computer is also connected to the control end of the test device; the host computer is also used to control the test device to output a test electrical signal.

[0017] According to the third aspect of the present invention, a low dropout linear regulator circuit test method is provided. The low dropout linear regulator circuit test method includes:

[0018] Electrically connect the low dropout linear regulator circuit to the daughter board, electrically connect the mother board and the daughter board, and make the temperature acquisition terminal of the temperature acquisition module contact the housing of the low dropout linear regulator circuit; electrically connect the test equipment to the test interface module of the mother board;

[0019] The host computer and the test equipment output test electrical signals to the mother board; the test electrical signals are input into the low dropout linear regulator circuit through the mother board;

[0020] The electrical acquisition module of the mother board acquires the electrical signals of the low dropout linear regulator circuit under the test electrical signals through the daughter board, and the temperature acquisition module of the mother board acquires the housing temperature data of the low dropout linear regulator circuit under the test electrical signals;

[0021] The mother board sends the electrical signals and the housing temperature data to the host computer;

[0022] The host computer verifies the thermal protection function of the low dropout linear regulator circuit according to the electrical signals and the housing temperature data.

[0023] In the test device of the low dropout linear regulator circuit according to the embodiment of the present invention, the mother board integrates a control module, a test interface module and an acquisition module. The control module controls the working states of the electrical acquisition module and the temperature acquisition module. The electrical acquisition module is used to acquire the electrical signals sent by the mother-daughter board interface module. The temperature acquisition module acquires the temperature data of the low dropout linear regulator circuit. The test interface module is used to connect the test equipment and the daughter board to realize the transmission of test signals and data interaction. The daughter board is responsible for connecting the low dropout linear regulator circuit to be tested to adapt to low dropout linear regulator circuits of different models and specifications. The test device of the low dropout linear regulator circuit according to the embodiment of the present invention integrates control, electrical signal acquisition, temperature monitoring and interface expansion functions through the mother board, and cooperates with the pluggable daughter board to adapt to different low dropout linear regulator circuit devices, realizing efficient and accurate generalization testing, and realizing fast and accurate testing of different low dropout linear regulator circuits through the mother-daughter board structure. The temperature data acquisition module integrated on the mother board also reduces the dependence on external test equipment. The temperature data acquisition module can be "carried with the board", with strong portability, and can collect the temperature data of the low dropout linear regulator circuit in real time, improving the overall test efficiency. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0025] Figure 1 It is a schematic structural diagram of a test device for a low dropout linear regulator circuit provided by an embodiment of the present invention;

[0026] Figure 2 It is a schematic structural diagram of another test device for a low dropout linear regulator circuit provided by an embodiment of the present invention;

[0027] Figure 3 It is a schematic structural diagram of another test device for a low dropout linear regulator circuit provided by an embodiment of the present invention;

[0028] Figure 4 It is a schematic structural diagram of a temperature acquisition module provided by an embodiment of the present invention;

[0029] Figure 5 It is a schematic structural diagram of another test device for a low dropout linear regulator circuit provided by an embodiment of the present invention;

[0030] Figure 6 It is a schematic structural diagram of a low dropout linear regulator circuit test system provided by an embodiment of the present invention;

[0031] Figure 7 It is a flowchart of a low dropout linear regulator circuit test method provided by an embodiment of the present invention;

[0032] Figure 8 It is a flowchart of another low dropout linear regulator circuit test method provided by an embodiment of the present invention;

[0033] Figure 9 It is a flowchart of another low dropout linear regulator circuit test method provided by an embodiment of the present invention;

[0034] Figure 10 It is a flowchart of another low dropout linear regulator circuit test method provided by an embodiment of the present invention. Detailed implementation manners

[0035] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present invention are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0037] The low dropout linear regulator circuit is a bipolar or field effect transistor operating in a linear mode. Through the internal negative feedback network, a regulated and stable output voltage is generated for use by various subsequent electronic systems. The low dropout linear regulator circuit is used as a three-level power supply in each system. After the secondary power supply system is regulated by the voltage regulator, it provides a stable voltage for the subsequent circuit system respectively. The stability of its output voltage is directly related to the performance of the system. It is necessary to pay attention to the board-level functional performance, electrical environment adaptability, thermal environment adaptability and assembly process adaptability of the device in the board-level application state. At the same time, for the low dropout linear regulator circuit product with thermal protection function, it is necessary to verify whether the product can be turned off in time at the thermal protection temperature point for the low dropout linear regulator circuit.

[0038] Figure 1 It is a schematic structural diagram of a test device for a low dropout linear regulator circuit provided by an embodiment of the present invention, as Figure 1As shown in the figure, the test device for a low-dropout linear regulator circuit includes: a motherboard 01 and at least one daughter board 02; the daughter board 02 includes at least one connection interface module 201, and the connection interface module 201 is used to connect the low-dropout linear regulator circuit; the daughter board 02 and the motherboard 01 are electrically connected; the motherboard 01 includes: a control module 101, a test interface module 102, a mother-daughter board interface module 105, an electrical acquisition module 103, and at least one temperature acquisition module 104, and at least one daughter board 02 is correspondingly arranged with at least one temperature acquisition module 104; the control module 101 is respectively connected to the temperature acquisition module 104 and the electrical acquisition module 103, and the electrical acquisition module 103 is connected to the daughter board 02 through the mother-daughter board interface module 105; the control module 101 is used to control the temperature acquisition module 104 to acquire the temperature of the low-dropout linear regulator circuit, and the control module 101 is also used to control the electrical acquisition module 103 to acquire the electrical signal output by the low-dropout linear regulator circuit; the test interface module 102 is connected to the daughter board 02 through the mother-daughter board interface module 105, and the test interface module 102 is used to receive the test electrical signal of the test device and send the test electrical signal to the daughter board 02 through the mother-daughter board interface module 105.

[0039] The low-dropout linear regulator circuit includes: a low-dropout linear regulator device or a circuit formed by multiple low-dropout linear regulator devices.

[0040] Specifically, the motherboard 01 integrates the control module 101, the test interface module 102, the electrical acquisition module 103, and the temperature acquisition module 104. The control module 101 is responsible for controlling the entire test process. Optionally, the control module 101 controls the working states of the electrical acquisition module 103 and the temperature acquisition module 104, and controls the conduction of the test interface module 102. The electrical acquisition module 103 is used to acquire the electrical signals sent by the daughter board 02, and these signals reflect the working state and performance of the low-dropout linear regulator circuit. The test interface module 102 is used to receive the test electrical signal of the test device and send the test electrical signal to the daughter board 02 through the mother-daughter board interface module 105, so that the test device can send test signals to the low-dropout linear regulator circuit. The temperature acquisition module 104 is used to acquire the shell temperature of the low-dropout linear regulator circuit. Optionally, after the low-dropout linear regulator circuit receives the test signals sent by the test device through the mother-daughter board, the temperature acquisition module 104 real-time tests the temperature data of the low-dropout linear regulator circuit under such test signals.

[0041] The daughter board 02 includes at least one connection interface module 201. The connection interface module 201 is used to connect the low-dropout linear regulator circuit to be tested to ensure stable and reliable electrical connection between the circuit and the test device. By designing different daughter boards, low-dropout linear regulator circuits with different package specifications and models can be adapted, thereby improving the versatility and flexibility of the test device.

[0042] Exemplarily, an external test device is connected to the test interface module 102, and the test signal of the test device is sent to the connection interface module 201 of the daughter board 02 through the test interface module 102 and the mother-daughter board interface module 105. The low-dropout linear regulator circuit is connected to the connection interface module 201, so that the test signal is input into the low-dropout linear regulator circuit. After receiving the test signal, the electrical acquisition module 103 of the mother board 01 acquires the output signal of the low-dropout linear regulator circuit under the test signal due to the connection relationship with the connection interface 201. At the same time, the temperature acquisition module 104 acquires the temperature data of the low-dropout linear regulator circuit. Through the output signal of the low-dropout linear regulator circuit under the test signal and the temperature data of the low-dropout linear regulator circuit, the thermal protection function of the low-dropout linear regulator circuit is verified according to the electrical signal and the case temperature data. Optionally, the upper computer determines the overheat shutdown temperature point of the low-dropout linear regulator circuit under the input test electrical signal according to the electrical signal and the temperature data, and determines whether the overheat shutdown temperature point meets the preset requirements, thereby realizing the reliability test of the low-dropout linear regulator circuit.

[0043] Signal transmission and data interaction are realized between the daughter board 02 and the mother board 01 through electrical connection. Optionally, the electrical connection can be a direct physical connection, such as the cooperation of a pin and a socket, or other forms such as wireless connection, which are not limited herein.

[0044] The motherboard 01 and the daughter board 02 are separately arranged, the functions of the test device are modularly divided, and each module is organically combined through electrical connection. Among them, the motherboard 01 is designed with the maximum functionality, and the modules related to acquisition, control, and data transmission are designed on the motherboard. The execution module for testing the low dropout linear regulator circuit is integrated on the motherboard 01. Since the daughter board 02 is separately arranged from the motherboard 01, the daughter board 02 can be separately designed for different types of low dropout linear regulator circuits. Exemplarily, for some low dropout linear regulator circuits with different interfaces, the daughter board 02 can be provided with daughter boards 02 with different connection interfaces corresponding to each type of low dropout linear regulator circuit. Or, for some types of low dropout linear regulator circuits that are incompatible with the electrical acquisition module 103 and the test interface module 102 of the test device or the motherboard 01, the connection interface module 201 can be set to match the low dropout linear regulator circuit with the electrical acquisition module 103 and the test interface module 102 of the test device or the motherboard 01. In this way, the motherboard 01 can only perform general, universal, and maximum functionality designs, and different types of low dropout linear regulator circuits are only adapted through the daughter board 02. On the one hand, when different types of low dropout linear regulator circuits need to be tested, only the corresponding daughter board 02 needs to be replaced, greatly improving the universality and flexibility of the test. On the other hand, the design of the motherboard 01 does not need to be redesigned for each type of low dropout linear regulator circuit.

[0045] At the same time, at least one temperature acquisition module 104 is integrally designed on the motherboard 01. The temperature acquisition module 104 can acquire the temperature of different low dropout linear regulator circuits electrically connected to the motherboard 01; by processing the combined temperature data and the output signal of the low dropout linear regulator circuit under the test signal, it can judge the overheat protection shutdown of the low dropout linear regulator circuit under test and the working temperature change under different test signal inputs. The integrated temperature acquisition module 104 reduces the dependence on external test equipment, simplifies the test process, and improves the overall test efficiency.

[0046] The temperature acquisition module 104 is integrated on the motherboard 01. The temperature acquisition module 104 is small in size, and the temperature acquisition end of the temperature acquisition module 104 can be attached to the low dropout linear regulator circuit for a long time without affecting the operation of the low dropout linear regulator circuit. The test device for the low dropout linear regulator circuit realizes real-time temperature acquisition of the low dropout linear regulator circuit.

[0047] Meanwhile, due to the small size of the temperature acquisition module 104, the transferability of the test device for the low-dropout linear regulator circuit is relatively high. Among the test items of the low-dropout linear regulator circuit, it includes setting the low-dropout linear regulator circuit in different ambient temperatures to collect the case temperature data of the low-dropout linear regulator circuit. The smaller temperature acquisition module 104 and the low-dropout linear regulator circuit can follow and transfer to a temperature device such as an incubator together to collect the case temperature data of the low-dropout linear regulator circuit under different environments.

[0048] In the test device for the low-dropout linear regulator circuit according to the embodiment of the present invention, the motherboard integrates multiple functional modules such as a control module, a test interface module, and an acquisition module. The control module controls the working states of the electrical acquisition module and the temperature acquisition module. The electrical acquisition module is used to acquire the electrical signals sent by the mother-daughter board interface module, and these signals can reflect the working state and performance of the low-dropout linear regulator circuit. The temperature acquisition module acquires the temperature data of the low-dropout linear regulator circuit. The test interface module is used to connect the test equipment and the daughter board to realize the transmission of test signals and data interaction. The daughter board is responsible for connecting the low-dropout linear regulator circuit to be tested to adapt to different models and specifications of low-dropout linear regulator circuits. The test device for the low-dropout linear regulator circuit according to the embodiment of the present invention integrates control, electrical signal acquisition, temperature monitoring, and interface expansion functions through the motherboard, and cooperates with the pluggable daughter board to adapt to different low-dropout linear regulator circuit devices, realizing efficient and accurate universal testing, and realizing fast and accurate testing of different low-dropout linear regulator circuits through the mother-daughter board structure. The temperature data acquisition module integrated on the motherboard also reduces the dependence on external test equipment. The temperature data acquisition module can achieve "component following the board", with strong portability, and can collect the temperature data of the low-dropout linear regulator circuit in real time.

[0049] On the basis of the above embodiments, Figure 2 is a schematic structural diagram of another test device for a low-dropout linear regulator circuit provided by the embodiment of the present invention. As Figure 2 shown, the test device for the low-dropout linear regulator circuit includes: at least two daughter boards 02, and the interface types of the connection interface modules 201 of the at least two daughter boards 02 are different; the interface types of at least two connection interface modules 201 of the same daughter board 02 are different. The motherboard 01 and the daughter board 02 are detachably connected.

[0050] Specifically, the test device for the low dropout linear regulator circuit is designed with at least two daughter boards 02, which can test multiple low dropout linear regulator circuits simultaneously or separately, improving the test efficiency. The connection interface modules 201 of each daughter board 02 have different interface types to adapt to low dropout linear regulator circuits with different package specifications and models. By designing daughter boards with multiple interface types, a wider range of test requirements for low dropout linear regulator circuits can be covered.

[0051] The interface types of at least two connection interface modules 201 on the same daughter board 02 can also be different. Designing connection interface modules 201 with multiple interface types on the same daughter board 02 to adapt to low dropout linear regulator circuits with complex connection requirements enables the test device to test more types of low dropout linear regulator circuits. At the same time, setting multiple connection interface modules 201 with different interface types on the same daughter board 02 can design the connection methods of the low dropout linear regulator circuits on the daughter board 02. Exemplarily, connection interface modules 201 with similar interface types are designed on one daughter board 02; or, when verifying the reliability of low dropout linear regulator circuits already installed on a launch vehicle, for low dropout linear regulator circuits in close physical positions, the connection interface modules 201 corresponding to the interface types of these low dropout linear regulator circuits can be set on the same daughter board 02. This way, multiple test requirements of multiple low dropout linear regulator circuits can be met simultaneously without replacing the daughter board, reducing the test cost.

[0052] Optionally, at least one temperature acquisition module 104 is provided on the motherboard 01, where the number of temperature acquisition modules 104 provided on the motherboard 01 is related to the number of connection interface modules 201 that the motherboard can connect. Among them, the number of temperature acquisition modules 104 is greater than or equal to the number of connection interface modules 201 that the motherboard can connect. A connection interface module 201 in a daughter board 02 can be electrically connected to a low dropout linear regulator circuit to test the low dropout linear regulator circuit, so the number of temperature acquisition modules 104 is greater than or equal to the number of connection interface modules to ensure that the temperature acquisition module 104 on the motherboard 01 can simultaneously acquire the temperature data of each electrically connected low dropout linear regulator circuit. The number of temperature acquisition modules 104 can also be less than the number of connection interface modules 201 that the motherboard can connect; and the number of temperature acquisition modules 104 is at least one. This realizes that the temperature acquisition module 104 takes turns to acquire the temperature data of the low dropout linear regulator circuits connected by the connection interface modules 201. The specific number of temperature acquisition modules 104 is not limited here.

[0053] A detachable connection method such as pins, sockets, board - to - board connectors or other forms is adopted between the motherboard 01 and the daughter board 02, enabling the daughter board 02 to be conveniently replaced or upgraded. When the daughter board 02 fails, it can be quickly replaced with a new one to ensure the continuity of the test work. With the change of test requirements, the daughter board 02 can be conveniently upgraded or replaced to meet the new test requirements. The upgrade and replacement of the daughter board 02 can be achieved without replacing the entire test device, reducing the maintenance cost.

[0054] Based on the above embodiments, Figure 3 is a schematic structural diagram of another test device for a low - dropout linear regulator circuit provided by an embodiment of the present invention. Figure 4 is a schematic structural diagram of a temperature acquisition module provided by an embodiment of the present invention. As Figure 3 、 4 shown, the temperature acquisition module 104 includes: a temperature data receiving unit 1041 and a temperature data acquisition unit 1042; the temperature data receiving unit 1041 is disposed on the motherboard 01, and the temperature measurement end of the temperature data acquisition unit 1042 is in contact with the outer shell of the low - dropout linear regulator circuit 03; the temperature data receiving unit 1041 and the temperature data acquisition unit 1042 are electrically connected, and the temperature data receiving unit 1041 is used to receive the temperature data of the outer shell of the low - dropout linear regulator circuit 03 collected by the temperature data acquisition unit 1042. The temperature acquisition module 104 further includes: a cover plate component 1043 and a limiting component 1044; at least one fixing post 1045 is further included on the first surface of the cover plate component 1043, the first end of the fixing post 1045 is connected to the first surface of the cover plate component 1043, and the second end of the fixing post 1045 is detachably connected to the surface of the daughter board 02; the limiting component 1044 is disposed on the first surface of the cover plate component 1043, and the cover plate component 1043 and the limiting component 1044 are used to fix the temperature measurement end of the temperature data acquisition unit 1042 in contact with the outer shell of the low - dropout linear regulator circuit 03. The limiting component 1044 includes: an elastic member, and the elastic member is disposed between the surface of the temperature data acquisition unit 1042 away from the temperature measurement end and the first surface of the cover plate component 1043.

[0055] Specifically, as Figure 3As shown, in the test device of the low dropout linear regulator circuit, the temperature data receiving unit 1041 is fixed on the surface of the motherboard 01, and receives and transmits the temperature data of the outer shell of the low dropout linear regulator circuit acquired by the temperature data acquisition unit 1042. The temperature data acquisition unit 1042 is the temperature measurement end. The temperature data acquisition unit 1042 is in direct contact with the outer shell of the low dropout linear regulator circuit 03 to ensure the accuracy of temperature measurement. At the same time, the temperature data acquisition unit 1042 is electrically connected to the temperature data receiving unit 1041, and the temperature data acquisition unit 1042 sends the temperature data to the temperature data receiving unit 1041 through the electrical connection. Exemplarily, as Figure 3 and Figure 4 shown, the temperature data acquisition unit 1042 and the temperature data receiving unit 1041 are electrically connected by a flying wire. Optionally, the temperature data acquisition unit 1042 is a thermocouple, and the temperature data is an electrical signal converted by the temperature data acquisition unit 1042 according to the real-time outer shell temperature of the low dropout linear regulator circuit 03.

[0056] Combined with Figure 3 and Figure 4 as described, the cover plate component 1043 is arranged on the side of the low dropout linear regulator circuit 03 where the temperature is to be measured, and the cover plate component 1043 is designed to limit the temperature data acquisition unit 1042 to be in close contact with the shell surface of the low dropout linear regulator circuit 03 where the temperature is to be measured.

[0057] The cover plate component 1043 includes fixing posts 1045. One end of the fixing post 1045 is fixed to the lower surface of the cover plate, and the other end is detachably connected to the surface of the daughter board 02. The fixing post 1045 realizes the stable installation of the cover plate component 1043 and the daughter board 02, and also provides stable support for the temperature acquisition unit 1042. Optionally, the fixing post 1045 and the surface of the daughter board 02 are detachably connected by screws or snaps.

[0058] Furthermore, the cover plate component 1043 includes at least three fixing posts 1045. The fixing posts 1045 are spaced equally and are arranged around the low dropout linear regulator circuit 03 to be measured, so as to realize the surrounding arrangement of the low dropout linear regulator circuit 03. The surrounding fixing post 1045 arrangement and the limiting component 1044 in the cover plate component 1043 are used to fix the temperature measurement end of the temperature data acquisition unit 1042 to be in close contact with the outer shell of the low dropout linear regulator circuit 03. The close contact between the temperature measurement end of the temperature data acquisition unit 1042 and the outer shell of the low dropout linear regulator circuit 03 also ensures the accuracy of temperature data acquisition. The equal spacing and surrounding arrangement of the fixing posts 1045 also ensure that when the temperature measurement end of the temperature data acquisition unit 1042 is limited, the stress received by the temperature data acquisition unit 1042 is uniform, and the accuracy of data acquisition by the temperature data acquisition unit 1042 will not be affected.

[0059] Exemplarily, in Figure 4 the cover plate component 1043 includes four fixing posts 1045, and the fixing posts 1045 are located at the four corners of the cover plate component 1043 to achieve a surrounding arrangement for the low-dropout linear regulator circuit 03 and the temperature data acquisition unit 1042. At the same time, a fixing component 1046 is further provided at one end of the fixing post 1045 away from the first surface, and the fixing component 1046 realizes the installation between the cover plate component 1043 and the daughter board. Optionally, the fixing component 1046 is a screw or a buckle.

[0060] Continuing to refer to Figure 3 and Figure 4 , exemplarily, the limiting component 1044 includes an elastic member, the elastic member is a spring, and the spring is arranged between the surface of the temperature data acquisition unit 1042 on the side away from the temperature measurement end and the first surface of the cover plate component 1043 to apply a force between the temperature data acquisition unit 1042 and the cover plate component 1043 to ensure the close contact between the temperature data acquisition unit 1042 and the low-dropout linear regulator circuit 03.

[0061] The temperature acquisition module 104 includes a temperature data receiving unit 1041, a temperature data acquisition unit 1042, a cover plate component 1043 and a limiting component 1044. The temperature acquisition module 104 is small in volume. Under the limitation of the cover plate component 1043 and the limiting component 1044, the temperature data acquisition unit 1042 of the temperature acquisition module 104 can be attached to the low-dropout linear regulator circuit for a long time without affecting the operation of the low-dropout linear regulator circuit. The test device of the low-dropout linear regulator circuit realizes the real-time acquisition of the temperature of the low-dropout linear regulator circuit. Also, due to the small volume of the temperature acquisition module 104, the transferability of the entire test device of the low-dropout linear regulator circuit is relatively high. In the test items of the low-dropout linear regulator circuit, it includes setting the low-dropout linear regulator circuit in different ambient temperatures to collect the case temperature data of the low-dropout linear regulator circuit. The smaller temperature acquisition module 104 and the low-dropout linear regulator circuit can follow and transfer to a temperature device such as an incubator together to collect the case temperature data of the low-dropout linear regulator circuit in different environments. The separate arrangement of the temperature data receiving unit 1041 and the temperature data acquisition unit 1042 further reduces the overall volume of the temperature acquisition module 104.

[0062] Based on the above embodiments, Figure 5 is a schematic structural diagram of another test device for a low-dropout linear regulator circuit provided by an embodiment of the present invention, as shown in Figure 5As shown in the figure, a daughter-board interface module 105 is provided on the motherboard 01, and the daughter-board 02 is arranged in the daughter-board interface module 105 on the motherboard 01 to achieve the electrical connection between the daughter-board 02 and the motherboard 01. Exemplarily, the daughter-board interface module 105 of the motherboard 01 is a female card pin socket, and correspondingly, card pins are arranged on the daughter-board 02, and the card pins and the female card pin socket achieve the electrical connection between the daughter-board 02 and the motherboard 01.

[0063] The motherboard 01 also includes a power supply module 106. The power supply module 106 includes an external port to connect to an external power supply. One path of the power supply module 106 is connected to the control module 101 to supply power to the control module 101; another path of the power supply module 106 is connected to the daughter-board interface module 105 to provide a working voltage to the low-dropout linear regulator circuit electrically connected in the daughter-board 02. Optionally, the power supply module 106 receives a 28V voltage and is converted to 5V voltage through a DC / DC to supply power to the subsequent circuits.

[0064] Optionally, the control module 101 includes an FPGA unit, a clock oscillator unit, and a memory unit; the clock oscillator unit and the memory unit are respectively connected to the FPGA unit; the clock oscillator unit is used to provide a clock signal for the FPGA unit; the memory unit is used to store at least one of the program of the FPGA unit, the voltage and current signals sent by the daughter-board.

[0065] The motherboard 01 also includes an oscilloscope interface module 107 and a multimeter interface module 108. The oscilloscope interface module 107 and the multimeter interface module 108 are connected to the control module 101 to display the electrical signals of the low-dropout linear regulator circuit received by the control module 101 under the test electrical signals.

[0066] Based on the above embodiments, Figure 6 is a schematic structural diagram of a low-dropout linear regulator circuit test system provided by an embodiment of the present invention. As Figure 6 shown, the low-dropout linear regulator circuit test system includes: a test device 30, a host computer 20, and a test device 10 of the low-dropout linear regulator circuit according to any embodiment of the present invention;

[0067] The output end of the test device 30 is connected to the test interface module 102 of the motherboard 01 of the test device 10 for the low-dropout linear regulator circuit. The test device 30 is used to provide test electrical signals to the test device 10 for the low-dropout linear regulator circuit; the host computer 20 is connected to the control module 101; the host computer 20 is used to receive the case temperature data sent by the test device 10 for the low-dropout linear regulator circuit, receive the electrical signals of the low-dropout linear regulator circuit under the test electrical signals collected by the electrical acquisition module, and send the control signals of the low-dropout linear regulator circuit; the host computer 20 is also connected to the control end of the test device 30; the host computer 20 is also used to control the test device 30 to output test electrical signals.

[0068] Specifically, the test device 30 provides the electrical signals required for testing, simulating the working conditions of the low-dropout linear regulator circuit in actual applications. The output end of the test device 30 is connected to the test interface module 102 of the motherboard 01 of the test device 10 to ensure the stable transmission of electrical signals to the low-dropout linear regulator circuit. Exemplarily, the electrical signals provided by the test device 30 for testing include at least one of voltage signals, current signals, and enable signals.

[0069] The host computer 20 can obtain the case temperature data of the low-dropout linear regulator circuit sent by the test device 10 for the low-dropout linear regulator circuit and the electrical signals output under the test signals. At the same time, the host computer 20 performs real-time analysis, recording, and visualization of the received test data, facilitating users to evaluate the performance of the low-dropout linear regulator circuit. Exemplarily, the host computer 20 receives the case temperature data of the low-dropout linear regulator circuit sent by the test device 10 for the low-dropout linear regulator circuit and the electrical signals output under the test signals through the control module 101 of the motherboard 01.

[0070] The host computer 20 is also connected to the control end of the test device 30, and controls the output of the test device 30 by sending control instructions to achieve the automation and intelligence of the test process.

[0071] The test device 10 for the low-dropout linear regulator circuit is used to connect the low-dropout linear regulator circuit to be tested and collect and transmit test data. The test device 10 for the low-dropout linear regulator circuit receives the test electrical signals provided by the test device 30 through the test interface module 102 on the motherboard 01, and communicates with the host computer 20 through the control module 101 to achieve the upload of test data and the control of the test process.

[0072] In the low dropout linear regulator circuit test system provided by the embodiments of the present invention, the output end of the test equipment is connected to the test interface module of the motherboard of the test device for the low dropout linear regulator circuit, and the host computer is connected to the control module of the motherboard of the test device for the low dropout linear regulator circuit, and is used to receive the electrical signals sent by the test device for the low dropout linear regulator circuit and control the test equipment to output test electrical signals. The host computer and the test equipment are used to provide test electrical signals to the test device for the low dropout linear regulator circuit. In the low dropout linear regulator circuit test system according to the embodiments of the present invention, by the host computer cooperatively controlling the test equipment and the test device, a comprehensive and accurate evaluation of the electrical performance and thermal performance of the low dropout linear regulator circuit is realized. Among them, the automated test process reduces manual intervention and significantly improves the test efficiency. Synchronously collecting electrical signals and temperature data can comprehensively evaluate the performance of the low dropout linear regulator circuit.

[0073] Figure 7 The figure is a flowchart of a method for testing a low dropout linear regulator circuit provided by an embodiment of the present invention. This embodiment is applicable to the test of the reliability of the low dropout linear regulator circuit. This method can be executed by the test device for the low dropout linear regulator circuit in the above embodiments, such as Figure 7 shown, the method includes:

[0074] S401. Electrically connect the low dropout linear regulator circuit to the daughter board, electrically connect the motherboard and the daughter board, and make the temperature acquisition end of the temperature acquisition module contact the outer shell of the low dropout linear regulator circuit; electrically connect the test equipment to the test interface module of the motherboard.

[0075] Such as Figures 1-6 shown, specifically, electrically connect the low dropout linear regulator circuit to the daughter board 02 to ensure accurate signal transmission. Electrically connect the motherboard 01 and the daughter board 02, and electrically connect the test equipment 30 to the test interface module 102 of the motherboard 01 to provide test electrical signals to the low dropout linear regulator circuit. The temperature acquisition end of the temperature acquisition module 104 contacts the outer shell of the low dropout linear regulator circuit to acquire the temperature data of the low dropout linear regulator circuit.

[0076] S402. The host computer and the test equipment output test electrical signals to the motherboard; the test electrical signals are input into the low dropout linear regulator circuit through the motherboard.

[0077] The test device 30 outputs a test electrical signal to the motherboard; illustratively, the test electrical signal includes: a DC voltage, an AC signal or other specific test signals. The daughter board 02 receives the test electrical signals sent by the motherboard 01, and inputs these signals to the low-voltage difference linear regulator circuit through the connection interface module to simulate the electrical environment under actual working conditions. The host computer 20 outputs the test electrical signal to the motherboard 01, including an enable signal of the low-voltage difference linear regulator circuit.

[0078] Exemplarily, the host computer 20 uses a host computer software program to switch between high and low levels using a short-circuit cap to implement verification of the enable and reset signals of the low-dropout linear regulator circuit.

[0079] S403, the electrical acquisition module of the motherboard acquires electrical signals of the low voltage difference linear regulator circuit under the test electrical signals through the daughterboard, and the temperature acquisition module of the motherboard acquires shell temperature data of the low voltage difference linear regulator circuit under the test electrical signals.

[0080] The electrical acquisition module 103 of the motherboard 01 acquires the electrical signal of the low-voltage difference linear regulator circuit under the test electrical signal, and the electrical signal reflects the performance of the low-voltage difference linear regulator circuit under specific test conditions. The temperature acquisition module 103 of the motherboard 01 acquires the shell temperature data of the low-voltage difference linear regulator circuit under the test electrical signal. Exemplarily, the temperature data includes the change of the temperature of the low-voltage difference linear regulator circuit under the test electrical signal.

[0081] S404, the motherboard sends the electrical signal and the shell temperature data to the host computer; the host computer verifies the thermal protection function of the low voltage difference linear regulator circuit according to the electrical signal and the shell temperature data.

[0082] After receiving the electrical signal and the shell temperature data sent by the motherboard 01 , the host computer 20 verifies the thermal protection function of the low voltage difference linear regulator circuit according to the electrical signal and the shell temperature data.

[0083] Exemplarily, the host computer 20 determines the overheat shutdown temperature point of the low voltage difference linear regulator circuit when the test electrical signal is input based on the electrical signal and the shell temperature data, and determines whether the overheat shutdown temperature point meets the preset requirements, thereby realizing the reliability test of the low voltage difference linear regulator circuit.

[0084] A low-voltage difference linear regulator circuit testing method provided in an embodiment of the present invention is applied to the reliability testing of the low-voltage difference linear regulator circuit. The method can be executed by the testing device of the low-voltage difference linear regulator circuit of the above-mentioned embodiments, and has the beneficial effects of the testing device of the low-voltage difference linear regulator circuit of any of the above-mentioned embodiments of the present invention.

[0085] Based on the above embodiments,Figure 8 The flowchart of another method for testing a low dropout linear regulator circuit provided by an embodiment of the present invention is as follows. As Figure 8 shown, the method includes: The test equipment includes a DC power supply and an electronic load;

[0086] S501. Electrically connect the low dropout linear regulator circuit to the daughter board, electrically connect the mother board and the daughter board, and make the temperature acquisition end of the temperature acquisition module contact the shell of the low dropout linear regulator circuit; Electrically connect the test equipment to the test interface module of the mother board.

[0087] S502. The host computer and the test equipment output at least one of an output function test signal, an enable function verification signal, a power supply offset test signal, a load offset test signal, and an input transient test signal to the mother board; The host computer provides an enable turn-on signal and an enable turn-off signal for the low dropout linear regulator circuit to the mother board; The test electrical signal is input to the low dropout linear regulator circuit through the mother board.

[0088] Specifically, step S502 includes multiple test items for the low dropout linear regulator circuit. In different test items, the test electrical signals output by the test equipment 30 to the mother board 01 are different.

[0089] The test electrical signal includes at least one of an output function test signal, an enable function verification signal, a power supply offset test signal, a load offset test signal, and an input transient test signal;

[0090] The output function test signal output by the test equipment to the mother board includes: The DC power supply provides a first input signal for the low dropout linear regulator circuit to the mother board; The level of the first input signal is a preset working voltage, and the preset working voltage is at least one working voltage within the input voltage range of the low dropout linear regulator circuit;

[0091] The enable function verification signal output by the host computer and the test equipment to the mother board includes: After the DC power supply provides the first input signal for the low dropout linear regulator circuit to the mother board, the host computer provides an enable turn-on signal and an enable turn-off signal for the low dropout linear regulator circuit to the mother board;

[0092] The power supply offset test signal output by the test equipment to the mother board includes: The DC power supply provides a second input signal and a third input signal for the low dropout linear regulator circuit to the mother board; Among them, the level of the second input signal is less than the level of the first input signal, and the level of the third input signal is greater than the level of the first input signal;

[0093] The load offset test signal output by the test equipment to the mother board includes: The electronic load provides a first output condition for the low dropout linear regulator circuit to the mother board, and the first output condition includes a full load output condition of the low dropout linear regulator circuit;

[0094] The test equipment outputs an input transient test signal to the motherboard, including: an electronic load provides a first output condition of the low-dropout linear regulator circuit to the motherboard, and a DC power supply provides a first step signal of the low-dropout linear regulator circuit to the motherboard; wherein, the level of the first step signal is from a first voltage value to a second voltage value, and the first voltage value is less than the second voltage value.

[0095] S503. The electrical acquisition module of the motherboard collects the electrical signals of the low-dropout linear regulator circuit under the test electrical signal through the daughter board, and the thermal acquisition module of the motherboard collects the case temperature data of the low-dropout linear regulator circuit under the test electrical signal.

[0096] In this embodiment, the test electrical signal includes at least one of an output function test signal, an enable function verification signal, a power supply offset test signal, a load offset test signal, and an input transient test signal. When different test electrical signals are input, the output electrical signals and the case temperature data of the low-dropout linear regulator circuit under the test electrical signal are collected.

[0097] S504. The motherboard sends the electrical signal and the case temperature data to the host computer; the host computer verifies the thermal protection function of the low-dropout linear regulator circuit according to the electrical signal and the case temperature data.

[0098] Exemplarily, according to the output electrical signal and the case temperature data of the low-dropout linear regulator circuit under the test electrical signal, the temperature point of overheat shutdown of the low-dropout linear regulator circuit under the input test electrical signal is judged, and whether the overheat shutdown temperature point meets the preset requirements is judged, thereby realizing the reliability test of the low-dropout linear regulator circuit.

[0099] Optionally, the test electrical signal includes at least one of an output function test signal, an enable function verification signal, a power supply offset test signal, a load offset test signal, and an input transient test signal; correspondingly, the electrical signals of the low-dropout linear regulator circuit under the test electrical signal can be verified, and the verification contents are shown in Table 1 below, including: evaluation of the output function of the low-dropout linear regulator circuit, evaluation of the enable function, power supply offset test, load offset test, and input transient test. After the test equipment and the host computer output the test electrical signal to the motherboard, the output voltage accuracy of the low-dropout linear regulator circuit is collected, and it is judged whether the output voltage accuracy of the low-dropout linear regulator circuit meets the preset conditions. If the output voltage accuracy of the low-dropout linear regulator circuit meets the preset conditions, it is judged that the reliability of the measured low-dropout linear regulator circuit is good in the corresponding test item; if the output voltage accuracy of the low-dropout linear regulator circuit does not meet the preset conditions, it is judged that the reliability of the measured low-dropout linear regulator circuit is poor in the corresponding test item. Wherein, the preset conditions include the product definition of the measured low-dropout linear regulator circuit.

[0100] Table 1

[0101]

[0102] In the low-dropout linear regulator circuit test method provided by the embodiments of the present invention, by outputting a variety of test signals, this method can comprehensively evaluate the output performance and temperature performance of the low-dropout linear regulator circuit under different input signals. The low-dropout linear regulator circuit test method provided by the embodiments of the present invention can select different test signals for output according to actual needs to implement a flexible test scheme. It helps to meet the test requirements of different projects of different low-dropout linear regulator circuits and improve the test efficiency.

[0103] On the basis of the above embodiments, Figure 9 is a flowchart of another low-dropout linear regulator circuit test method provided by the embodiments of the present invention. As Figure 9 shown, this method includes:

[0104] S601. Electrically connect the low-dropout linear regulator circuit to the daughter board, electrically connect the mother board and the daughter board, and make the temperature acquisition end of the temperature acquisition module contact the housing of the low-dropout linear regulator circuit; electrically connect the test equipment to the test interface module of the mother board.

[0105] S602. The DC power supply provides the first input signal of the low-dropout linear regulator circuit to the mother board, the electronic load provides the first load condition of the low-dropout linear regulator circuit to the mother board, and the low-dropout linear regulator circuit is in the first temperature test condition or the second temperature test condition; the test electrical signal is input to the low-dropout linear regulator circuit through the mother board.

[0106] Specifically, the test equipment includes a DC power supply and an electronic load; the test equipment outputs a test electrical signal to the mother board, and further includes: the DC power supply provides the first input signal of the low-dropout linear regulator circuit to the mother board, the electronic load provides the first load condition of the low-dropout linear regulator circuit to the mother board, and the low-dropout linear regulator circuit is in the first temperature test condition or the second temperature test condition;

[0107] The level of the first input signal is the rated input voltage of the low-dropout linear regulator circuit, and the first load condition is the full-load output condition of the low-dropout linear regulator circuit;

[0108] The first temperature test condition includes: the low-dropout linear regulator circuit performs a preset number of temperature transition cycles between the first temperature condition and the second temperature condition, and the first temperature condition and the second temperature condition are the high temperature condition and the low temperature condition respectively;

[0109] The second temperature test condition includes: the low-dropout linear regulator circuit operates for a preset duration under the third temperature condition; wherein, the third temperature condition is greater than the second temperature condition.

[0110] Specifically, the first temperature test condition is the temperature condition during the temperature cycle test for the low-dropout linear regulator circuit. The specific temperature values in the first temperature condition and the second temperature condition are selected according to the characteristics of the low-dropout linear regulator circuit, which are the highest and lowest temperatures within the actual operating temperature range of the low-dropout linear regulator circuit, and are not limited herein.

[0111] Exemplarily, the first temperature test condition further includes the temperature conditions in Table 2 below:

[0112] Table 2

[0113]

[0114] The second temperature test condition includes: the low-dropout linear regulator circuit operates for a preset duration under the third temperature condition. The specific temperature value of the third temperature condition is selected according to the characteristics of the low-dropout linear regulator circuit, which is the maximum value of the actual operating temperature of the low-dropout linear regulator circuit, and is not limited herein. The second temperature test condition is the temperature condition during the temperature cycle test for the low-dropout linear regulator circuit. Exemplarily, the second temperature condition further includes the temperature conditions in Table 3 below:

[0115] Table 3

[0116]

[0117] S603. The electrical acquisition module of the motherboard acquires the electrical signals of the low-dropout linear regulator circuit under the test electrical signals through the daughter board, and the thermal acquisition module of the motherboard acquires the case temperature data of the low-dropout linear regulator circuit under the test electrical signals.

[0118] The test device of the low-dropout linear regulator circuit can be placed in an incubator for setting the ambient temperature. Under different temperature conditions, the test device of the low-dropout linear regulator circuit acquires the output electrical signals and the case temperature data of the low-dropout linear regulator circuit under the test electrical signals. The thermal protection function of the low-dropout linear regulator circuit is verified according to the electrical signals and the case temperature data.

[0119] Optionally, the test method for the low dropout linear regulator circuit further includes evaluating the electrical signals output by the low dropout linear regulator circuit under different temperature test conditions. The DC power supply provides the first input signal of the low dropout linear regulator circuit to the motherboard, and the electronic load provides the first load condition of the low dropout linear regulator circuit to the motherboard, and the low dropout linear regulator circuit is under the first temperature test condition or the second temperature test condition. Among them, the first temperature test condition and the second temperature test condition correspond to temperature cycle test and stability test. In the temperature cycle test or stability test, the verification contents corresponding to different test items are shown in Table 4 below. Correspondingly, collect the output voltage accuracy of the low dropout linear regulator circuit, and judge whether the output voltage accuracy of the low dropout linear regulator circuit meets the preset conditions. If the output voltage accuracy of the low dropout linear regulator circuit meets the preset conditions, it is judged that the reliability of the low dropout linear regulator circuit under test is good in the corresponding test item; if the output voltage accuracy of the low dropout linear regulator circuit does not meet the preset conditions, it is judged that the reliability of the low dropout linear regulator circuit under test is poor in the corresponding test item. Among them, the preset conditions include the product definition of the low dropout linear regulator circuit under test.

[0120] Table 4

[0121]

[0122] Optionally, the test method for the low dropout linear regulator circuit further includes the test of the assembly process adaptability of the low dropout linear regulator circuit. After the test of the low dropout linear regulator circuit described in any embodiment of the present invention, visually inspect the lead welding of the low dropout linear regulator circuit, and judge whether the lead welding quality of the circuit is intact and consistent with that before the test. If the lead welding quality of the circuit is intact and the welding situation is consistent with that before the test, it is judged that the assembly process adaptability of the low dropout linear regulator circuit is good; if there is a problem with the lead welding quality of the circuit and the welding situation is inconsistent with that before the test, it is judged that the assembly process adaptability of the low dropout linear regulator circuit is poor.

[0123] S604. The motherboard sends the electrical signal and the housing temperature data to the host computer; the host computer verifies the thermal protection function of the low dropout linear regulator circuit according to the electrical signal and the housing temperature data.

[0124] In the test method for the low dropout linear regulator circuit provided by the embodiments of the present invention, by simulating the electrical and temperature conditions of the low dropout linear regulator circuit in the actual working environment, including the full-load output performance under the rated input voltage, the stability under high and low temperature conditions, and the low-temperature startup performance, etc. The test method for the low dropout linear regulator circuit provided by the embodiments of the present invention selects different temperature test conditions according to actual needs to implement a flexible test scheme.

[0125] Based on the above embodiments, Figure 10 FIG. is a flowchart of another method for testing a low dropout linear regulator circuit provided by an embodiment of the present invention. As Figure 10 shown, the method includes:

[0126] S701, electrically connect the low dropout linear regulator circuit to the daughter board, electrically connect the mother board and the daughter board, and make the temperature acquisition end of the temperature acquisition module contact the outer shell of the low dropout linear regulator circuit; electrically connect the test equipment to the test interface module of the mother board.

[0127] S702, the DC power supply and the electronic load provide a charged bias condition and an uncharged bias condition to the mother board, and the low dropout linear regulator circuit is under the radiation environment test condition, and the test electrical signal is input to the low dropout linear regulator circuit through the mother board.

[0128] Specifically, the charged bias condition includes: the DC power supply provides a first input signal of the low dropout linear regulator circuit to the mother board, and the electronic load provides a first load condition of the low dropout linear regulator circuit to the mother board. The level of the first input signal is the rated input voltage of the low dropout linear regulator circuit, and the first load condition is the full load output condition of the low dropout linear regulator circuit. The uncharged bias condition includes that the DC power supply and the electronic load do not provide input signals and load conditions to the mother board.

[0129] Under the radiation environment test condition, the low dropout linear regulator circuit to be tested on the daughter board is placed in the irradiation chamber for irradiation test at a specified dose rate. This includes: irradiating the low dropout linear regulator circuit at a preset dose rate.

[0130] Optionally, the preset dose rate includes 0.0lrad(Si / s).

[0131] S703, the electrical acquisition module of the mother board acquires the electrical signal of the low dropout linear regulator circuit under the test electrical signal through the daughter board, and the thermal acquisition module of the mother board acquires the outer shell temperature data of the low dropout linear regulator circuit under the test electrical signal.

[0132] Specifically, at least one preset radiation dose node is set. When the radiation dose reaches the preset radiation dose node, the daughter board collects the electrical signal of the low dropout regulator circuit and sends it to the mother board, and correspondingly collects the output voltage accuracy of the low dropout regulator circuit, and determines whether the output voltage accuracy of the low dropout regulator circuit meets the preset conditions. If the output voltage accuracy of the low dropout regulator circuit meets the preset conditions, it is determined that the reliability of the low dropout regulator circuit under test is good in the corresponding applicability evaluation item; if the output voltage accuracy of the low dropout regulator circuit does not meet the preset conditions, it is determined that the reliability of the low dropout regulator circuit under test is poor in the corresponding applicability evaluation item. When the radiation dose reaches the preset radiation dose node, the test device of the low dropout regulator circuit collects the case temperature data of the low dropout regulator circuit under the test electrical signal. The thermal protection function of the low dropout regulator circuit under different preset radiation dose nodes is verified according to the case temperature data.

[0133] Optionally, the at least one preset radiation dose node includes: 3 Krad, 5 Krad, 8 Krad, 10 Krad, 13 Krad, 15 Krad.

[0134] S704, when the output voltage accuracy of the low dropout regulator circuit does not meet the preset conditions or the total irradiation dose reaches the preset total dose, the test is stopped.

[0135] Optionally, the total irradiation dose includes 15 Krad.

[0136] It should be understood that the various forms of the processes shown above can be used, steps can be reordered, added or deleted. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, which is not limited herein.

[0137] The above specific embodiments do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub - combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A test device for a low dropout linear regulator circuit, characterized in that, Comprising: A motherboard and at least one daughter board; The daughter board includes at least one connection interface module for connecting the low dropout linear regulator circuit; The daughter board and the motherboard are electrically connected; The motherboard includes: a control module, a test interface module, a mother-daughter board interface module, an electrical acquisition module, and at least one temperature acquisition module, and at least one of the daughter boards is correspondingly arranged with at least one of the temperature acquisition modules; The control module is respectively connected to the temperature acquisition module and the electrical acquisition module, and the electrical acquisition module is connected to the daughter board through the mother-daughter board interface module; the control module is used to control the temperature acquisition module to collect the temperature of the low dropout linear regulator circuit, and the control module is also used to control the electrical acquisition module to collect the electrical signal output by the low dropout linear regulator circuit; the test interface module is connected to the daughter board through the mother-daughter board interface module, and the test interface module is used to receive the test electrical signal of the test device and send the test electrical signal to the daughter board through the mother-daughter board interface module.

2. The test device for the low dropout linear regulator circuit according to claim 1, wherein Comprising: At least two of the daughter boards, and the interface types of the connection interface modules of at least two of the daughter boards are different; The interface types of at least two of the connection interface modules of the same daughter board are different.

3. The test device for the low dropout linear regulator circuit according to claim 1, characterized in that The motherboard and the daughter board are detachably connected.

4. The test device for the low dropout linear regulator circuit according to claim 1, characterized in that, The temperature acquisition module includes: a temperature data receiving unit and a temperature data acquisition unit; The temperature data receiving unit is arranged on the motherboard, and the temperature measuring end of the temperature data acquisition unit is in contact with the outer shell of the low dropout linear regulator circuit; the temperature data receiving unit and the temperature data acquisition unit are electrically connected, and the temperature data receiving unit is used to receive the outer shell temperature data of the low dropout linear regulator circuit collected by the temperature data acquisition unit.

5. The test device for the low dropout linear regulator circuit according to claim 4, characterized in that, The temperature acquisition module further includes: a cover plate component and a limiting component; At least one fixing column is further included on the first surface of the cover plate component, the first end of the fixing column is connected to the first surface of the cover plate component, and the second end of the fixing column is detachably connected to the surface of the daughter board; The limiting component is arranged on the first surface of the cover plate component, and the cover plate component and the limiting component are used to fix the temperature measuring end of the temperature data acquisition unit in contact with the outer shell of the low dropout linear regulator circuit.

6. The test device for the low dropout linear regulator circuit according to claim 5, characterized in that, The limiting component includes: an elastic member, and the elastic member is arranged between the surface of the temperature data acquisition unit far from the temperature measuring end and the first surface of the cover plate component.

7. A test system for a low dropout linear regulator circuit, characterized in that, Comprising: A test device, a host computer, and a test device for the low dropout linear regulator circuit according to any one of claims 1-6; The output end of the test device is connected to the test interface module of the motherboard of the test device for the low dropout linear regulator circuit, and the test device is used to provide a test electrical signal to the test device for the low dropout linear regulator circuit. The host computer is connected to the control module; the host computer is configured to receive the housing temperature data collected by the temperature acquisition module, receive the electrical signals of the low-dropout linear regulator circuit under the test electrical signals collected by the electrical acquisition module, and send the control signals of the low-dropout linear regulator circuit. The host computer is also connected to the control end of the test equipment; the host computer is further configured to control the test equipment to output test electrical signals.

8. A test method for a low dropout linear regulator circuit, characterized in that, Including: Electrically connect the low-dropout linear regulator circuit to the daughter board, electrically connect the mother board and the daughter board, and make the temperature acquisition end of the temperature acquisition module contact the housing of the low-dropout linear regulator circuit; electrically connect the test equipment to the test interface module of the mother board. The host computer and the test equipment output test electrical signals to the mother board; the test electrical signals are input into the low-dropout linear regulator circuit through the mother board. The electrical acquisition module of the mother board acquires the electrical signals of the low-dropout linear regulator circuit under the test electrical signals through the daughter board, and the temperature acquisition module of the mother board acquires the housing temperature data of the low-dropout linear regulator circuit under the test electrical signals. The mother board sends the electrical signals and the housing temperature data to the host computer. The host computer verifies the thermal protection function of the low-dropout linear regulator circuit according to the electrical signals and the housing temperature data.

9. The testing method of the low dropout linear regulator circuit according to claim 8, characterized in that The test equipment includes a DC power supply and an electronic load. The test electrical signals include at least one of an output function test signal, an enable function verification signal, a power supply offset test signal, a load offset test signal, and an input transient test signal. The test equipment outputs the output function test signal to the mother board, including: the DC power supply provides a first input signal of the low-dropout linear regulator circuit to the mother board; the level of the first input signal is a preset operating voltage, and the preset operating voltage is at least one operating voltage within the input voltage range of the low-dropout linear regulator circuit. The host computer and the test equipment output the enable function verification signal to the mother board, including: after the DC power supply provides the first input signal of the low-dropout linear regulator circuit to the mother board, the host computer provides an enable open signal and an enable off signal of the low-dropout linear regulator circuit to the mother board. The test equipment outputs the power supply offset test signal to the mother board, including: the DC power supply provides a second input signal and a third input signal of the low-dropout linear regulator circuit to the mother board; wherein, the level of the second input signal is less than the level of the first input signal, and the level of the third input signal is greater than the level of the first input signal. The test equipment outputs the load offset test signal to the mother board, including: the electronic load provides a first output condition of the low-dropout linear regulator circuit to the mother board, and the first output condition includes a full-load output condition of the low-dropout linear regulator circuit. The test device outputs the input transient test signal to the motherboard, including: the electronic load provides the first output condition of the low-dropout linear regulator circuit to the motherboard, and the DC power supply provides the first step signal of the low-dropout linear regulator circuit to the motherboard; wherein, the level of the first step signal is from a first voltage value to a second voltage value, and the first voltage value is less than the second voltage value.

10. The testing method of the low dropout linear regulator circuit according to claim 8, characterized in that, The test device includes a DC power supply and an electronic load; The test device outputs a test electrical signal to the motherboard, further including: the DC power supply provides the first input signal of the low-dropout linear regulator circuit to the motherboard, the electronic load provides the first load condition of the low-dropout linear regulator circuit to the motherboard, and the low-dropout linear regulator circuit is under the first temperature test condition or the second temperature test condition; The level of the first input signal is the rated input voltage of the low-dropout linear regulator circuit, and the first load condition is the full-load output condition of the low-dropout linear regulator circuit; The first temperature test condition includes: the low-dropout linear regulator circuit performs a preset number of temperature transition cycles between a first temperature condition and a second temperature condition, and the first temperature condition and the second temperature condition are a high temperature condition and a low temperature condition respectively; The second temperature test condition includes: the low-dropout linear regulator circuit operates for a preset duration under a third temperature condition; wherein, the third temperature condition is greater than the second temperature condition.

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