Equipment reliability test system

Abstract

The invention relates to the technical field of performance testing, and discloses an equipment reliability testing system which comprises a refrigeration assembly, a testing assembly and a signal processing assembly. The refrigeration assembly comprises a vacuum container and a cold conduction platform arranged in the vacuum container; the test assembly comprises at least one test unit in thermodynamic connection with the cold conduction platform; wherein at least one test unit comprises a magnet exciting coil and a mounting table, and the mounting table is used for mounting tested equipment; the signal processing assembly is connected with the excitation coil; and when the reliability of the tested equipment is tested, the signal processing assembly is also connected with the tested equipment. By arranging the vacuum container, arranging the cold conduction platform in the vacuum container to guide the cold energy to the at least one test unit, and arranging the magnet exciting coil for the at least one test unit, a vacuum, low-temperature and magnetic field multichannel test environment is provided for the superconducting quantum interference device, so that the reliability test of the superconducting quantum interference device is realized.

Description

Technical Field

[0001] This application relates to the technical field of performance testing, for example, to a device reliability testing system. Background Art

[0002] Currently, superconducting quantum interference devices need to work continuously for a long time in geomagnetic detection and magnetocardiography applications. However, the manufacturing and packaging processes of the devices are complex, and the performance and reliability of the devices may be affected by the superposition of many processes. Therefore, it is necessary to screen the reliability of superconducting quantum interference devices. On the one hand, it is used to screen the processing and packaging processes of superconducting quantum interference devices, and on the other hand, it is used to test the reliability of superconducting quantum interference devices working for a long time and the performance of superconducting quantum interference devices working for a long time. However, there is no direct solution for reliability detection of superconducting quantum interference devices in the prior art.

[0003] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0004] To have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. The summary is not a general review, nor is it intended to identify key / important elements or delineate the protection scope of these embodiments, but rather serves as a preface to the following detailed description.

[0005] Embodiments of the present disclosure provide a device reliability testing system to achieve the reliability testing of superconducting quantum interference devices.

[0006] In some embodiments, the device reliability testing system includes: a refrigeration component, including a vacuum container and a cold conduction platform disposed inside the vacuum container; a testing component, including at least one testing unit thermally connected to the cold conduction platform; wherein at least one testing unit includes an excitation coil and / or a mounting table, and the mounting table is used to mount the device under test; a signal processing component, connected to the excitation coil; wherein when performing reliability testing on the device under test, the signal processing component is also connected to the device under test.

[0007] Optionally, the vacuum container includes: a container outer shell, including a first opening; a container inner liner, disposed inside the container outer shell, including a second opening corresponding to the first opening, and the cold conduction platform is fixedly disposed inside the container inner liner; wherein the first opening and the second opening are connected to form a refrigeration channel communicating the outside of the container outer shell and the inside of the container inner liner, and part of the refrigeration component is installed in the refrigeration channel.

[0008] Optionally, the inner surface of the container outer shell, the outer surface of the container inner liner, and the outer surface of the refrigeration channel together form a first cavity.

[0009] Optionally, the refrigeration assembly further includes: a refrigerator including a cold source and a cold head connected to the cold source; wherein, the cold source provides cooling capacity for the cold head, and the cold head is configured to pass through the refrigeration channel and be thermally connected to the cold conduction platform.

[0010] Optionally, the cold head is connected to the cold conduction platform through a cold chain.

[0011] Optionally, the refrigeration assembly further includes: a cold shield disposed inside the vacuum container, and both the cold conduction platform and the test assembly are disposed inside the cold shield.

[0012] Optionally, the test unit includes: a coil frame on which an exciting coil is installed, and a mounting table is disposed in the middle of the coil frame.

[0013] Optionally, the test assembly further includes: a magnetic shield installed on the cold conduction platform, and at least one test unit is disposed inside the magnetic shield.

[0014] Optionally, the signal processing assembly includes: a current source connected to the exciting coil; a signal module connected to the device under test; and a host computer connected to the current source and the device under test.

[0015] Optionally, the device under test is a superconducting quantum interference device.

[0016] The device reliability test system provided by the embodiments of the present disclosure can achieve the following technical effects: The device reliability test system includes a refrigeration assembly, a test assembly, and a signal processing assembly. The refrigeration assembly includes a vacuum container and a cold conduction platform disposed inside the vacuum container; the test assembly includes at least one test unit thermally connected to the cold conduction platform; wherein, at least one test unit includes an exciting coil and / or a mounting table, and the mounting table is used to mount the device under test; the signal processing assembly is connected to the exciting coil; wherein, when performing a reliability test on the device under test, the signal processing assembly is further connected to the device under test. By providing a vacuum container, a cold conduction platform is disposed inside the vacuum container to direct the cooling capacity to at least one test unit, and an exciting coil is provided for at least one test unit, providing a multi-channel test environment of vacuum, low temperature, and magnetic field for the superconducting quantum interference device, thereby realizing the reliability test of the superconducting quantum interference device.

[0017] The above general description and the following description are only exemplary and explanatory, and are not used to limit the present application. Description of the Drawings

[0018] One or more embodiments are illustrated by corresponding drawings. These exemplary illustrations and the drawings do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation, and wherein: Figure 1 It is a schematic diagram of a device reliability test system provided by an embodiment of the present disclosure.

[0019] Reference numerals: 1: Cold source; 2: Hose; 3: Electromagnetic shielding cavity; 4: Container shell; 5: Container inner liner; 6: Cold platform fixing rod; 7: Vibration damping structure; 8: Cold head; 9: Cold shield; 10: Magnetic shield; 11: Excitation coil; 12: Cold chain; 13: Heat conduction platform; 14: Installation table; 15: Device under test; 16: Coil frame; 17: Container support; 18: Signal module; 19: Current source; 20: Host computer. Detailed implementation manners

[0020] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The attached drawings are only for reference and explanation, and are not used to limit the embodiments of the present disclosure. In the following technical descriptions, for the sake of convenience of explanation, multiple details are provided to provide a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, well-known structures and devices can be shown in a simplified manner to simplify the drawings.

[0021] In the embodiments of the present disclosure, terms such as "first", "second", etc. in the specification, claims and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to implement the embodiments of the present disclosure described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0022] In the embodiments of the present disclosure, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "middle", "outer", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the embodiments of the present disclosure and their embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation. And, in addition to being able to represent an orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0023] In addition, the terms "arranged", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0024] Unless otherwise specified, the term "plurality" means two or more.

[0025] In the embodiments of the present disclosure, the character " / " indicates that the objects before and after are in an "or" relationship. For example, A / B means: A or B.

[0026] The term "and / or" is an associative relationship describing objects, indicating that there can be three relationships. For example, A and / or B means: A or B, or, A and B.

[0027] It should be noted that, without conflict, the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other.

[0028] Combined Figure 1 As shown, the embodiments of the present disclosure disclose a device reliability test system, including a refrigeration component, a test component, and a signal processing component. The refrigeration component includes a vacuum container and a cold conduction platform 13 arranged inside the vacuum container. The test component includes at least one test unit thermally connected to the cold conduction platform 13; wherein, at least one test unit includes an excitation coil 11 and / or a mounting table 14, and the mounting table 14 is used for mounting the device under test 15. The signal processing component is connected to the excitation coil 11; wherein, when performing a reliability test on the device under test 15, the signal processing component is also connected to the device under test 15.

[0029] In the embodiments of the present disclosure, the test component includes at least one test unit thermally connected to the cold conduction platform 13. The number of test units thermally connected to the cold conduction platform 13 can be one or more, and the specific number can be determined according to the number of devices under test 15 to be tested. Specifically, the number of test units can be the same as the number of devices under test 15, greater than the number of devices under test 15, or less than the number of devices under test 15. For example, when it is necessary to perform a reliability test on all devices under test 15 at one time, the number of test units is greater than or equal to the number of devices under test 15, which can improve the test efficiency. When it is not necessary to perform a reliability test on all devices under test 15 at one time, the number of test units is less than the number of devices under test 15, which can reduce the test cost by increasing the test duration. Multiple test units can be evenly distributed at the bottom of the vacuum container and connected to the upper cold conduction platform 13.

[0030] In an embodiment of the present disclosure, at least one test unit includes devices for providing a test environment, such as an excitation coil 11 and / or a mounting table 14, etc. The devices for providing a test environment of at least one test unit may be disposed in a cavity having an electromagnetic shielding 10 function. Among them, the devices for providing a test environment of multiple test units may be jointly disposed in a cavity having an electromagnetic shielding 10 function, or may be respectively disposed in different cavities having an electromagnetic shielding 10 function. By respectively disposing the devices for providing a test environment of multiple test units in different cavities having an electromagnetic shielding 10 function, the mutual influence between multiple test units can be reduced. The devices for providing a test environment may also be disposed in a non-closed cavity, or directly all exposed in a vacuum container, as long as the function of realizing the reliability of the test equipment can be achieved.

[0031] In an embodiment of the present disclosure, the test unit including the excitation coil 11 and / or the mounting table 14 may be one or multiple, and the specific number may be determined according to the number of the devices under test 15 to be tested and the requirements of the reliability test. Specifically, the device under test 15 may be any magnetic measurement device. When only characterizing the performance of the magnetic measurement device itself, the test unit may only include the mounting table 14. When characterizing the performance of the magnetic measurement device for measuring magnetic properties, the test unit needs to include the excitation coil 11 and the mounting table 14. Therefore, the number of test units including the excitation coil 11 and the mounting table 14 may be determined according to the number of magnetic measurement devices for which the performance of measuring magnetic properties needs to be characterized, and the number of test units only including the mounting table 14 may be determined according to the number of magnetic measurement devices for which only the performance of itself needs to be characterized. Among them, the number of the above test units may be the same as the number of the corresponding devices under test 15, may also be greater than the number of the devices under test 15, or may also be less than the number of the devices under test 15. For example, when it is necessary to perform a reliability test on all the devices under test 15 at one time, the number of test units is greater than or equal to the number of the devices under test 15. When it is not necessary to perform a reliability test on all the devices under test 15 at one time, the number of test units is less than the number of the devices under test 15.

[0032] By using the device reliability test system provided by the embodiments of the present disclosure, a vacuum and low-temperature test environment is provided for the system by arranging the conduction-cooling platform 13 in the vacuum container and installing the test components through the conduction-cooling platform 13 to test the device under test 15. The conduction-cooling platform 13 is arranged in the vacuum container to direct the cooling capacity to at least one test unit, and an excitation coil 11 is arranged for at least one test unit, providing a multi-channel test environment of vacuum, low temperature and magnetic field for the superconducting quantum interference device, thereby realizing the reliability test of the superconducting quantum interference device. Moreover, by arranging a plurality of test units, a multi-channel test environment is realized, and the reliability tests of a plurality of devices under test 15 can be carried out simultaneously, improving the efficiency of the reliability test. In addition, since the working environment of magnetic measurement devices such as superconducting quantum interference devices is usually low temperature, the traditional usage method is to use a cryogenic container and liquid refrigerant to cool the device under test 15. For reliability tests, the test time may be relatively long. If liquid refrigerant is still used, in the case of long-term reliability screening and the use of multi-channel test units to conduct reliability tests on the device under test 15, the consumption of liquid refrigerant will increase significantly, and liquid refrigerant needs to be replenished during the test process, making the operation cumbersome. The embodiments of the present disclosure direct the cooling capacity to a plurality of test units through the conduction-cooling platform 13, and can provide cooling capacity for the multi-channel test units through one conduction-cooling platform 13, enabling the device under test 15 to always be in a working state, thereby enabling long-term reliability tests on the device under test 15, improving the accuracy of the reliability test, and eliminating the need to frequently replace the liquid refrigerant, simplifying the operation of the reliability test.

[0033] Optionally, the vacuum container includes a container outer shell 4 and a container inner liner 5. The container outer shell 4 includes a first opening. The container inner liner 5 is arranged inside the container outer shell 4 and includes a second opening corresponding to the first opening. The conduction-cooling platform 13 is fixedly arranged inside the container inner liner 5; wherein, the first opening and the second opening are connected to form a refrigeration channel communicating the outside of the container outer shell 4 and the inside of the container inner liner 5, and part of the refrigeration assembly is installed in the refrigeration channel.

[0034] In the embodiments of the present disclosure, the container outer shell 4 can be of any shape, such as a quasi-cylindrical shape or a quasi-rectangular parallelepiped shape, etc. The shape of the container inner liner 5 matches the shape of the container outer shell 4. The first opening and the second opening can be respectively arranged at the upper parts of the container outer shell 4 and the container inner liner 5, specifically in the middle of the upper surfaces of the container outer shell 4 and the container inner liner 5.

[0035] In an embodiment of the present disclosure, at least one cold platform fixing rod 6 may be provided on the container inner liner 5, and the cold conduction platform 13 may be fixed inside the container inner liner 5 through at least one cold platform fixing rod 6. For example, a plurality of cold platform fixing rods 6 that are centrosymmetric about the center of the container inner liner 5 may be provided to connect the container inner liner 5 and the cold conduction platform 13. Specifically, one end of the cold platform fixing rod 6 may be connected to the upper part of the container inner liner 5, and the other end may be connected to the cold conduction platform 13. The cold conduction platform 13 may be connected to the bottom of the container inner liner 5 or may not be connected to the bottom of the container inner liner 5. In this way, if the cold conduction platform 13 is connected to the bottom of the container inner liner 5, the cold conduction platform 13 can be made more stable. If the cold conduction platform 13 is not connected to the bottom of the container inner liner 5, during the test, when the vibration of the cold source 1 is transmitted to the cold platform fixing rod 6, since the vibration frequency of the cold source 1 is high and the period is short, while the rod arm of the cold platform fixing rod 6 is long, the vibration frequency is low and the period is large. Therefore, by hoisting the cold conduction platform 13 through the cold platform fixing rod 6, the vibration transmission can be reduced to a certain extent, and the stability of the test environment is improved.

[0036] In this way, the vacuum container is provided with two layers, the outer container shell 4 and the inner container inner liner 5. Through the double-layer structure design, better thermal insulation can be achieved, the low temperature inside the container inner liner 5 is ensured, and at the same time, the influence of cold quantity on the outside is reduced. In addition, the container shell 4 is provided with a first opening, and the container inner liner 5 is provided with a second opening corresponding to the first opening. The connection between the first opening and the second opening can form a refrigeration channel connecting the outside of the container shell 4 and the inside of the container inner liner 5. In order to cool the equipment inside the container inner liner 5, some refrigeration components (such as the cold head 8 or the equipment composed of the cold head 8) may be arranged in the refrigeration channel to cool the equipment inside the container inner liner 5, so as to provide a low-temperature environment for the reliability test.

[0037] Optionally, the inner surface of the container shell 4, the outer surface of the container inner liner 5, and the outer surface of the refrigeration channel together form a first cavity.

[0038] In the embodiments of the present disclosure, the inner surface of the container housing 4 refers to the surface close to the container inner liner 5, the outer surface of the container inner liner 5 refers to the surface close to the container housing 4, and the outer surface of the refrigeration channel refers to the surface away from the refrigeration channel. The first chamber is the space between the container housing 4 and the container inner liner 5, and is separated from the refrigeration channel by the connecting wall of the first opening and the second opening. Among them, the connecting wall of the refrigeration channel can be composed of any material, such as a metal material or a flexible material, etc. Specifically, the connecting wall of the refrigeration channel can be a corrugated pipe. In this way, by using a flexible material (such as a corrugated pipe) to form the connecting wall of the refrigeration channel and arranging some refrigeration components (such as the cold head 8 or the device composed of the cold head 8) in the refrigeration channel, based on the characteristics of the flexible material, the vibration transmitted to the cold conduction platform 13 can be reduced. Moreover, the length of the connecting wall is adjustable. By adjusting the length of the connecting wall, the volume of the space of the first chamber can be adjusted. Its volume is determined by the distance at the corresponding position between the container housing 4 and the container inner liner 5. The greater the length of the connecting wall, the greater the distance between the container housing 4 and the container inner liner 5, and the larger the volume of the first chamber. The smaller the length of the connecting wall, the smaller the distance between the container housing 4 and the container inner liner 5, and the smaller the volume of the first chamber. The volume of the first chamber can be set according to the amount of cooling capacity. The greater the cooling capacity, the greater the distance at the corresponding position between the container housing 4 and the container inner liner 5 can be increased to enhance the isolation effect of the first chamber. The smaller the cooling capacity, the smaller the distance at the corresponding position between the container housing 4 and the container inner liner 5 can be reduced to appropriately reduce the isolation effect of the first chamber and save the internal space of the vacuum container.

[0039] In the embodiments of the present disclosure, the vacuum container can achieve an internal vacuum environment by means of evacuation. The air extraction port can be arranged on the container inner liner 5 or air extraction ports are arranged on both the container inner liner 5 and the first chamber. By arranging air extraction ports on both the first chamber and the container inner liner 5, a vacuum environment can be achieved in both the first chamber and the container inner liner 5. Thus, when there is a leakage in the container inner liner 5, the vacuum first chamber serves as a buffer space between the container inner liner 5 and the outside of the vacuum container, preventing the gas outside the vacuum container from entering the container inner liner 5 and affecting the vacuum test environment.

[0040] In this way, the inner surface of the container housing 4, the outer surface of the container inner liner 5, and the outer surface of the refrigeration channel jointly form the first cavity. By setting the first cavity to isolate the inside of the container inner liner 5 and the outside of the container housing 4, heat transfer can be further isolated, ensuring that the low temperature inside the container inner liner 5 meets the requirements of the test environment while reducing the impact of cold leakage on the external environment.

[0041] Optionally, the refrigeration component further includes a refrigerator. The refrigerator includes a cold source 1 and a cold head 8 connected to the cold source 1; wherein, the cold source 1 provides cooling capacity for the cold head 8, and the cold head 8 is arranged to pass through the refrigeration channel and is thermally connected to the cold conduction platform 13.

[0042] In an embodiment of the present disclosure, the cold head 8 is disposed at the refrigeration channel. Specifically, the diameter of the end of the cold head 8 connected to the cold source 1 is greater than the diameter of the refrigeration channel. The portion of the end protruding from the refrigeration channel along the circumferential side is connected to the outer surface of the container housing 4 through the vibration damping structure 7 to reduce the influence of the vibration of the refrigerator on the test and improve the test accuracy.

[0043] In an embodiment of the present disclosure, the cold head 8 and the cold conduction platform 13 can be thermally connected in any manner as long as the cold quantity can be transferred from the cold head 8 to the cold conduction platform 13. For example, the cold head 8 and the cold conduction platform 13 can be connected through the cold chain 12, or the cold head 8 and the cold conduction platform 13 are directly connected, etc.

[0044] In an embodiment of the present disclosure, the cold source 1 can be any device capable of providing cold quantity for the cold head 8. Specifically, the cold source 1 can be a separate refrigeration cycle system, such as an absorption refrigeration cycle system or a vapor compression refrigeration cycle system, etc. At this time, the cold source 1 can be thermally connected to the cold head 8 through the evaporation side in the refrigeration cycle system, so as to provide cold quantity for the cold head 8. The cold head 8 can also be a part of the refrigeration cycle system. At this time, the cold source 1 and the cold head 8 jointly form a refrigeration cycle system. The cold source 1 can be a reciprocating compressor or a centrifugal compressor, etc. At this time, the cold head 8 can be the evaporation side of the refrigeration cycle system, or the cold head 8 is disposed on the branch pipeline for circulating the low-temperature refrigerant in the refrigeration cycle system, so that the low-temperature refrigerant flows through the cold head 8, etc. The cold source 1 and the cold head 8 can be connected through the hose 2, and the cold source 1 transmits the refrigerant to the cold head 8 side through the hose 2 to complete the refrigeration cycle.

[0045] In an embodiment of the present disclosure, the cold source 1 can be disposed at any position, such as above the cold head 8 or on the side of the cold head 8, etc. In the actual application process, the cold source 1 can be disposed on the side of the test assembly. By disposing the cold source 1 separately, the influence of the vibration of the cold source 1 on the result of the reliability test can be reduced.

[0046] In an embodiment of the present disclosure, a vacuum container and a cold head 8 are disposed within an electromagnetic shielding cavity 3, and the outer surface of the vacuum container, the outer surface of the cold head 8, and the inner surface of the electromagnetic shielding cavity 3 form a second chamber. Among them, the outer surface of the vacuum container refers to the surface of the vacuum container close to the electron shielding cavity, the outer surface of the cold head 8 refers to the surface of the cold head 8 protruding from the vacuum container, and the inner surface of the electromagnetic shielding cavity 3 refers to the surface of the electromagnetic shielding cavity close to the vacuum container. Specifically, the electromagnetic shielding cavity 3 fixes the vacuum container through a container support 17 disposed within the second chamber. The container support 17 may be provided with a vibration damping structure, such as a rubber shock absorber, a helical spring shock absorber, a leaf spring shock absorber, a pneumatic shock absorber, and / or a pneumatic cushion shock absorber, etc. The container support 17 may be disposed at any position within the electromagnetic shielding cavity 3, such as the lower part and / or the side part, etc. In practical applications, the container supports 17 may be evenly distributed at the lower part of the electromagnetic shielding cavity 3 to support the vacuum container. The cold source 1 is disposed outside the electromagnetic shielding cavity 3 and is connected to the cold head 8 inside the electromagnetic shielding cavity 3 through a hose 2. By separating the cold source 1 from the test component, such as disposing the cold source 1 on the periphery of the electromagnetic shielding cavity 3, such as on the left side, right side, front side, or rear side, etc., the influence of the vibration of the cold source 1 on the reliability test result can be reduced.

[0047] In this way, the cold source 1 provides cooling capacity for the cold head 8, and the cold head 8 is arranged to pass through the refrigeration channel and be thermally connected to the cold conduction platform 13, so as to be able to transfer the cooling capacity of the cold source 1 to the cold conduction platform 13.

[0048] Optionally, the cold head 8 is connected to the cold conduction platform 13 through a cold chain 12.

[0049] In an embodiment of the present disclosure, the cold chain 12 may be a rigid cold chain 12 and / or a flexible cold chain 12. The rigid cold chain 12 may be made of a metal material, such as copper or aluminum, to provide a higher thermal conductivity and a higher structural strength, so as to effectively conduct the cooling capacity. Due to its flexible characteristics, the flexible cold chain 12 can isolate the vibration generated during the operation of the refrigerator and reduce the influence on the test unit. The flexible cold chain 12 may adopt a structure fixed by indium layers to form a tight connection between the copper sheets, reduce the contact thermal resistance, and improve the heat transfer performance.

[0050] In this way, by transferring the cooling capacity of the cold head 8 to the cold conduction platform 13 through the cold chain 12, the influence of the vibration of the refrigerator on the reliability test can be further reduced, thereby improving the accuracy of the equipment reliability test.

[0051] Optionally, the refrigeration component further includes a cold shield 9. The cold shield 9 is disposed inside the vacuum container, and both the cold conduction platform 13 and the test component are disposed inside the cold shield 9.

[0052] In the embodiments of the present disclosure, the cold shield 9 may be composed of an epoxy resin-based composite material, metal hydride, and / or other shielding materials. The cold shield 9 may be installed on the cold head 8 to enclose the cold conduction platform 13 and the test component inside. The outer surface of the cold shield 9, the outer surface of the cold head 8, and the inner surface of the container inner liner 5 jointly form a third chamber. By setting the third chamber, direct contact between the internal components of the cold shield 9 and the container inner liner 5 can be avoided, thereby further reducing the loss of cooling capacity.

[0053] In this way, by arranging the cold conduction platform 13 and the test component inside the cold shield 9, external heat sources can be effectively isolated, the loss of cooling capacity can be reduced, and to a certain extent, the space required for refrigeration can be reduced, enabling the cooling capacity to be concentrated in a smaller area, improving the refrigeration efficiency, and thus reducing the heat load of the refrigerator.

[0054] Optionally, the test unit includes a coil frame 16. The excitation coil 11 is installed on the coil frame 16, and the mounting table 14 is arranged in the middle of the coil frame 16.

[0055] In the embodiments of the present disclosure, the coil frame 16 can be of any shape, such as square or circular. Each coil frame 16 has at least one excitation coil 11 installed. When multiple excitation coils 11 are installed, the multiple excitation coils 11 are installed on the coil frame 16 along the axis of the coil frame 16. Among them, a single excitation coil 11 can be centrosymmetric about the axis of the coil frame 16. As shown in combination Figure 1 Two excitation coils 11 can be arranged on the coil frame 16. The two excitation coils 11 are arranged on the upper and lower sides of the device under test 15 along the axis of the coil frame 16, and the device under test 15 is arranged between the two excitation coils 11. Specifically, the device under test 15 is arranged at the central position between the two excitation coils 11.

[0056] In the embodiments of the present disclosure, the excitation coil 11 can be a Helmholtz coil. The Helmholtz coil can be composed of two circular coils with equal radii. When the distance between the two coils is equal to the coil radius, a relatively wide uniform magnetic field region can be generated near the midpoint of the common axis of the two coils, so that the magnetic field intensity of the Helmholtz coil is relatively uniform near the midpoint of the axis, reducing the magnetic field gradient in the space.

[0057] In this way, by installing the excitation coil 11 on the coil frame 16, a stable magnetic field environment can be provided for the device under test 15, thereby realizing the reliability test of the device under test 15. In addition, by arranging the mounting table 14 at the middle position of the coil frame 16, the device under test 15 can be located at the central position of the magnetic field. Since the magnetic field lines are relatively more concentrated at the central position and the magnetic induction intensity is relatively larger, the test results are more reliable.

[0058] Optionally, the test component further includes a magnetic shield 10. The magnetic shield 10 is installed on the heat conduction platform 13, and at least one test unit is arranged inside the magnetic shield 10.

[0059] In this way, when performing a reliability test on the device under test 15, if high-precision magnetic measurement is required for the device under test 15, the influence of the high stray magnetic field in the surrounding environment needs to be avoided during the measurement process. By arranging at least one test unit inside the magnetic shield 10, external electromagnetic noise interference can be effectively isolated, thereby improving the reliability of the reliability test results.

[0060] Optionally, the signal processing component includes a current source 19 and a signal module 18. The current source 19 is connected to the excitation coil 11; the signal module 18 is connected to the device under test 15; and the host computer 20 is connected to the current source 19 and the device under test 15.

[0061] In the embodiment of the present disclosure, the heat conduction platform 13 is provided with at least one electrical feedthrough. Specifically, the electrical feedthrough can be one or more, which are used to lead out electrical signals while maintaining the vacuum tightness of the system to ensure no leakage. The current source 19 and the signal module 18 can be respectively connected to the excitation coil 11 and the device under test 15 through the electrical feedthrough.

[0062] In the embodiment of the present disclosure, both the current source 19 and the signal module 18 are connected to the host computer 20. The current source 19 is connected to at least one excitation coil 11 and is used to provide electrical energy for the excitation coil 11 to generate a magnetic field. The host computer 20 can control the magnitude of the current of the current source 19, thereby controlling the magnetic field generated by the excitation coil 11. The signal module 18 is connected to at least one device under test 15 and is used to obtain the response signal of at least one device under test 15 under the action of the magnetic field generated by the excitation coil 11, and send the response signal of at least one device under test 15 to the host computer 20 for analysis and processing, so as to evaluate the reliability of at least one device under test 15.

[0063] In this way, by connecting the current source 19 to at least one excitation coil 11, the multi-channel excitation coils 11 can generate magnetic fields simultaneously, and by enabling the signal module 18 to obtain the response signals of at least one device under test 15, multi-channel reliability testing can be achieved.

[0064] Optionally, the device under test 15 is a superconducting quantum interference device.

[0065] In this way, the superconducting quantum interference device can convert magnetic flux into voltage. Specifically, the host computer 20 controls the magnitude of the current of the current source 19, thereby controlling the change in the magnetic field generated by the excitation coil 11. The superconducting quantum interference device responds to the change in the magnetic flux of the magnetic field and is converted into a voltage signal. Therefore, by analyzing the voltage signal and the current signal of the current source 19, the reliability of the superconducting quantum interference device can be tested. In addition, the current source 19 can be turned off to directly characterize the properties of the superconducting quantum interference device itself.

[0066] The above description and the drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, the individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or substituted for parts and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A device reliability test system, characterized in that, Comprising: A refrigeration assembly, including a vacuum container and a cold conduction platform disposed inside the vacuum container; A test assembly, including at least one test unit thermally connected to the cold conduction platform; wherein, at least one test unit includes an excitation coil and / or a mounting table for mounting the device under test; A signal processing assembly, connected to the excitation coil; wherein, when performing a reliability test on the device under test, the signal processing assembly is also connected to the device under test.

2. The method according to claim 1, wherein The vacuum container includes: A container outer shell, including a first opening; A container inner liner, disposed inside the container outer shell, including a second opening corresponding to the first opening, and the cold conduction platform is fixedly disposed inside the container inner liner; Wherein, the first opening and the second opening are connected to form a refrigeration channel communicating the outside of the container outer shell and the inside of the container inner liner, and part of the refrigeration assembly is installed in the refrigeration channel.

3. The method according to claim 2, wherein The inner surface of the container outer shell, the outer surface of the container inner liner, and the outer surface of the refrigeration channel together form a first cavity.

4. The method according to claim 2, wherein The refrigeration assembly further includes: A refrigerator, including a cold source and a cold head connected to the cold source; wherein, the cold source provides cold quantity for the cold head, and the cold head is arranged to pass through the refrigeration channel and is thermally connected to the cold conduction platform.

5. The method according to claim 4, wherein The cold head is connected to the cold conduction platform through a cold chain.

6. The method according to any one of claims 1 to 5, characterized in that, The refrigeration assembly further includes: A cold shield, disposed inside the vacuum container, and both the cold conduction platform and the test assembly are disposed inside the cold shield.

7. The method according to any one of claims 1 to 5, characterized in that, The test unit includes: A coil frame, the excitation coil is installed on the coil frame, and the mounting table is disposed in the middle of the coil frame.

8. The method according to any one of claims 1 to 5, characterized in that, The test assembly further includes: A magnetic shield, installed on the cold conduction platform, and at least one test unit is disposed inside the magnetic shield.

9. The method according to any one of claims 1 to 5, characterized in that The signal processing assembly includes: A current source, connected to the excitation coil; A signal module, connected to the device under test; A host computer, connected to the current source and the device under test.

10. The method according to any one of claims 1 to 5, characterized in that, The device under test is a superconducting quantum interference device.

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