A temperature control system for processing a ceramic copper clad plate

Abstract

The application provides a temperature control system for processing ceramic copper-clad plate, which determines the adjustment value of the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data of oxygen-free copper in the surface oxidation process in the heating equipment, ensures the quality of the oxygen-free copper oxidation layer, determines the power adjustment value of the heating element in the laminating process based on the feature difference between the resin glue melting characteristics and the standard melting characteristics in the laminating process, so that the laminating process can be fully melted, determines the adjustment value of the heating power of the hot press based on the relationship between the real-time heating temperature of the ceramic copper-clad plate in the hot press and the preset temperature range, ensures the final performance of the ceramic copper-clad plate, determines the adjustment parameter of the etching temperature control device based on the etching rate of the ceramic copper-clad plate in the etching process, ensures the precision and quality of etching, and determines the cooling parameter of the laser cutting based on the heat generated by the ceramic copper-clad plate during laser cutting, so as to ensure the cutting quality.

Description

Technical Field

[0001] This invention relates to the field of ceramic copper-clad laminate processing technology, and in particular to a temperature control system for ceramic copper-clad laminate processing. Background Technology

[0002] Ceramic-clad copper laminate (CCL) is a substrate in which copper is bonded to one or both surfaces of a ceramic substrate using a special process. It is primarily used for packaging and electrical connections in power semiconductor products. CCL is widely used in power semiconductor products, second only to the chip itself in importance, and is one of the core packaging materials for high-power, high-heat-dissipation products.

[0003] The process of ceramic copper-clad laminate is as follows: 1) oxidation of oxygen-free copper surface; 2) lamination with resin adhesive; 3) ceramic substrate; 4) hot pressing; 5) etching; 6) surface treatment and laser cutting.

[0004] In the aforementioned process of ceramic copper clad laminate, there are corresponding processing temperature ranges for oxygen-free copper surface oxidation, resin lamination, hot pressing, etching, and laser cutting. Temperature control has a significant impact on the quality of each processing step. Therefore, achieving precise temperature control in the processing of ceramic copper clad laminate to ensure its quality is of paramount importance. Summary of the Invention

[0005] This invention provides a temperature control system for processing copper-clad ceramic sheets to solve the problems mentioned in the background art.

[0006] A temperature control system for processing copper-clad ceramic sheets, preferably comprising:

[0007] The oxidation control module is used to determine the adjustment value of the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data of oxygen-free copper during the surface oxidation process in the heating equipment.

[0008] The lamination control module is used to determine the power adjustment value of the heating element during the lamination process based on the characteristic difference between the melting characteristics of the resin adhesive during the lamination process and the standard melting characteristics.

[0009] The hot press control module is used to determine the adjustment value of the heating power of the hot press based on the relationship between the real-time heating temperature of the ceramic copper-clad laminate in the hot press and the preset temperature range.

[0010] The etching control module is used to determine the adjustment parameters of the etching temperature control device based on the etching rate of the ceramic copper-clad laminate during the etching process.

[0011] The cutting control module is used to determine the cooling parameters for laser cutting based on the heat generated during laser cutting of the ceramic copper-clad laminate.

[0012] Preferably, the oxidation control module includes:

[0013] The temperature judgment unit is used to acquire oxidation temperature data in real time and determine whether the oxidation temperature data is consistent with the preset oxidation temperature. If so, it is determined that no adjustment of the temperature control device is required; otherwise, it is determined that the temperature control device needs to be adjusted.

[0014] The temperature control adjustment unit is used to determine the adjustment value based on the difference between the oxidation temperature data and the preset oxidation temperature when it is determined that the temperature control device needs to be adjusted. If the oxidation temperature data is greater than the preset oxidation temperature, the direction of the adjustment value is determined to be downward; if the oxidation temperature data is less than the preset oxidation temperature, the direction of the adjustment value is determined to be upward.

[0015] Preferably, the lamination control module includes:

[0016] The feature determination unit is used to acquire resin images during the lamination process and extract resin melting features based on the resin images.

[0017] The feature comparison unit is used to compare the melting characteristics of the resin glue with the standard melting characteristics to obtain the feature differences;

[0018] A temperature determination unit is used to determine the morphological parameters of the resin adhesive melting process based on the aforementioned characteristic differences, and to determine the target temperature required to achieve the target morphological parameters based on the morphological parameters and the current temperature.

[0019] The power adjustment unit is used to determine the power adjustment value for the heating element based on the difference between the current temperature and the target temperature.

[0020] Preferably, the hot-press control module includes:

[0021] The temperature acquisition unit is used to obtain the real-time heating temperature of the ceramic copper-clad laminate at various locations in the hot press based on the temperature sensor.

[0022] The power determination unit is used to determine the heating power adjustment value for each heating plate of the hot press based on the relationship between the real-time heating temperature at each location and the preset temperature range.

[0023] Preferably, the etching control module includes:

[0024] The etching temperature acquisition unit is used to acquire the etching rate of the ceramic copper-clad laminate during the etching process, as well as the real-time liquid temperature of the etching solution.

[0025] The relationship determination unit is used to determine the temperature-rate correlation based on the correspondence between historical real-time liquid temperature and historical etching rate.

[0026] The etching temperature adjustment unit is used to obtain the liquid temperature corresponding to the target etching rate from the relevant change relationship, and to determine the adjustment parameters of the etching temperature control device based on the rate difference between the etching rate and the target etching rate and the temperature difference between the real-time liquid temperature and the liquid temperature.

[0027] Preferably, the cutting control module includes:

[0028] The heat determination unit is used to collect the heat generated during the laser cutting of the ceramic copper-clad laminate;

[0029] The cooling determination unit is used to determine the excess heat to be absorbed by the water cooling device based on the generated heat, and to determine the cooling parameters of the water cooling device based on the excess heat.

[0030] Preferably, the feature determination unit includes:

[0031] The preprocessing unit is used to preprocess the resin glue image to obtain a standard image and extract the target image where the resin glue region is located in the standard image;

[0032] The feature extraction unit is used to segment the target image into multiple image blocks, extract the color features, texture features, and bubble features of each image block, and extract the shape features of the melted resin glue based on all image blocks.

[0033] The feature integration unit is used to integrate the color feature, texture feature, bubble feature, and shape feature as resin glue melting features.

[0034] Preferably, the temperature determining unit includes:

[0035] The difference acquisition unit is used to acquire color feature differences, texture feature differences, bubble feature differences, and shape feature differences from the feature differences;

[0036] The difference analysis unit is used to determine the transparency coefficient based on the color feature difference, the melting level based on the texture feature difference, the melting uniformity coefficient based on the bubble feature difference, and the edge smoothness and volume expansion coefficient based on the shape feature difference.

[0037] The process determination unit is used to calculate the current process coefficient of the resin adhesive melting based on the transparency coefficient, melting level, melting uniformity coefficient, edge smoothness, and volume expansion coefficient.

[0038] The parameter determination unit is used to determine the stage of resin melting based on the process coefficient, and to obtain the morphological parameters corresponding to the stage from the database as the morphological parameters of the resin melting process.

[0039] The heat determination unit is used to determine the required heat based on the difference between the morphological parameters and the target morphological parameters, and, in conjunction with the current temperature, determine the target temperature required to achieve the target morphological parameters.

[0040] Preferably, the power determination unit includes:

[0041] The heating temperature determination unit is used to obtain the difference between the real-time heating temperature of each location and the preset temperature range, and construct a difference array based on the difference values ​​according to the distribution characteristics of each location, and preliminarily determine the heating temperature required for each location based on the difference array to obtain the heating temperature array.

[0042] The fluctuation determination unit is used to determine the heat dissipation capacity coefficient of each position based on the distribution characteristics of each position, and to set the heat fluctuation amplitude for each position of the differential array based on the heat dissipation capacity coefficient, so as to obtain the fluctuation amplitude array corresponding to the differential array.

[0043] The prediction unit is used to determine the heat required at each location in the future based on the heating temperature array, and to perform weighted processing on the heat required in the future based on the fluctuation amplitude array to obtain the target predicted heat and obtain the predicted heat array.

[0044] The power determination unit is used to determine the power-time set that the heating plate meets the predicted heat array, and based on the heating rate requirement at each location, to obtain the candidate power-time set that meets the heating rate requirement from the power-time set, and to obtain multiple heating plate power operating parameter arrays based on the power-time set.

[0045] The power selection unit is used to determine the heating uniformity array caused by the mutual influence of adjacent heating plates under the heating plate power operating parameter array based on the positional distribution between the heating plates, select the heating plate power operating parameter array corresponding to the most uniform heating array, and determine the heating power adjustment value for each heating plate of the hot press.

[0046] Preferably, the hot pressing control module further includes a preheating unit, which preheats the hot pressing mold process based on the hot pressing temperature before hot pressing molding.

[0047] Compared with the prior art, the present invention has achieved the following beneficial effects:

[0048] By analyzing the difference between the preset oxidation temperature and the oxidation temperature data of oxygen-free copper during the surface oxidation process in the heating equipment, the adjustment value of the temperature control device is determined to ensure the quality of the oxygen-free copper oxide layer formation and provide a bonding basis for subsequent processes. Based on the difference between the resin melting characteristics and standard melting characteristics during the lamination process, the power adjustment value of the heating element during lamination is determined to ensure sufficient melting and flow during lamination, resulting in good bonding with the ceramic substrate and the oxidized copper foil, while avoiding excessive temperature leading to resin performance degradation. Based on the relationship between the real-time heating temperature of the ceramic copper-clad laminate in the hot press and the preset temperature range, the heating power adjustment value of the hot press is determined to achieve precise control of the hot pressing temperature and ensure the final performance of the ceramic copper-clad laminate. Based on the etching rate during the etching process of the ceramic copper-clad laminate, the adjustment parameters of the etching temperature control device are determined to ensure etching accuracy and quality. Based on the heat generated during laser cutting of the ceramic copper-clad laminate, the cooling parameters for laser cutting are determined to remove the heat generated during cutting in a timely manner, preventing excessively high local temperatures and ensuring cutting quality.

[0049] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in this application.

[0050] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0051] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0052] Figure 1 This is a structural diagram of a temperature control system for processing ceramic copper-clad laminates according to an embodiment of the present invention;

[0053] Figure 2 This is a structural diagram of the oxidation control module described in an embodiment of the present invention;

[0054] Figure 3 This is a structural diagram of the etching control module described in an embodiment of the present invention. Detailed Implementation

[0055] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0056] Example 1: This embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates, such as... Figure 1As shown, it includes:

[0057] The oxidation control module is used to determine the adjustment value of the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data of oxygen-free copper during the surface oxidation process in the heating equipment.

[0058] The lamination control module is used to determine the power adjustment value of the heating element during the lamination process based on the characteristic difference between the melting characteristics of the resin adhesive during the lamination process and the standard melting characteristics.

[0059] The hot press control module is used to determine the adjustment value of the heating power of the hot press based on the relationship between the real-time heating temperature of the ceramic copper-clad laminate in the hot press and the preset temperature range.

[0060] The etching control module is used to determine the adjustment parameters of the etching temperature control device based on the etching rate of the ceramic copper-clad laminate during the etching process.

[0061] The cutting control module is used to determine the cooling parameters for laser cutting based on the heat generated during laser cutting of the ceramic copper-clad laminate.

[0062] In this embodiment, the real-time temperature values ​​of each process step are determined by temperature sensors.

[0063] In this embodiment, the standard melting feature ensures sufficient melting and prevents excessive melting.

[0064] In this embodiment, when the real-time heating temperature fluctuates and exceeds the preset temperature range, the heating power of the hot press needs to be adjusted.

[0065] In this embodiment, the adjustment parameters of the etching temperature control device can be either cooling or heating.

[0066] The beneficial effects of the above design scheme are as follows: By determining the adjustment value of the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data of oxygen-free copper during the surface oxidation process in the heating equipment, the quality of the oxygen-free copper oxide layer formation is guaranteed, providing a bonding basis for subsequent processes. By determining the power adjustment value of the heating element during the lamination process based on the difference between the resin melting characteristics and the standard melting characteristics of the resin adhesive during the lamination process, the lamination process can fully melt and flow, and bond well with the ceramic substrate and the oxidized copper foil, while avoiding excessive temperature leading to resin adhesive performance degradation. By determining the adjustment value of the heating power of the hot press based on the relationship between the real-time heating temperature of the ceramic copper-clad laminate in the hot press and the preset temperature range, the hot press temperature can be precisely controlled to ensure the final performance of the ceramic copper-clad laminate. Based on the etching rate of the ceramic copper-clad laminate during the etching process, the etching temperature control device adjustment parameters are determined to ensure the etching accuracy and quality. Based on the heat generated by the ceramic copper-clad laminate during laser cutting, the laser cutting cooling parameters are determined to remove the heat generated by cutting in a timely manner, prevent local overheating, and ensure cutting quality.

[0067] Example 2: Based on Example 1, this embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates, such as... Figure 2 As shown, the oxidation control module includes:

[0068] The temperature judgment unit is used to acquire oxidation temperature data in real time and determine whether the oxidation temperature data is consistent with the preset oxidation temperature. If so, it is determined that no adjustment of the temperature control device is required; otherwise, it is determined that the temperature control device needs to be adjusted.

[0069] The temperature control adjustment unit is used to determine the adjustment value based on the difference between the oxidation temperature data and the preset oxidation temperature when it is determined that the temperature control device needs to be adjusted. If the oxidation temperature data is greater than the preset oxidation temperature, the direction of the adjustment value is determined to be downward; if the oxidation temperature data is less than the preset oxidation temperature, the direction of the adjustment value is determined to be upward.

[0070] In this embodiment, the oxidation temperature data of oxygen-free copper in the heating equipment is guaranteed to ensure the formation of a uniform and high-performance oxide layer on the copper surface, providing a good bonding foundation for subsequent processes.

[0071] The beneficial effects of the above design scheme are: by determining the adjustment value of the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data of oxygen-free copper in the surface oxidation process of the heating equipment, a uniform and high-performance oxide layer is formed on the copper surface, providing a good bonding foundation for subsequent processes.

[0072] Example 3: Based on Example 1, this embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates. The lamination control module includes:

[0073] The feature determination unit is used to acquire resin images during the lamination process and extract resin melting features based on the resin images.

[0074] The feature comparison unit is used to compare the melting characteristics of the resin glue with the standard melting characteristics to obtain the feature differences;

[0075] A temperature determination unit is used to determine the morphological parameters of the resin adhesive melting process based on the aforementioned characteristic differences, and to determine the target temperature required to achieve the target morphological parameters based on the morphological parameters and the current temperature.

[0076] The power adjustment unit is used to determine the power adjustment value for the heating element based on the difference between the current temperature and the target temperature.

[0077] In this embodiment, the resin adhesive melting feature and the standard melting feature are image features.

[0078] In this embodiment, morphological parameters include fluidity, uniformity, viscosity characteristics, etc.

[0079] In this embodiment, the power adjustment value of the heating element is determined based on the difference; the larger the difference, the larger the corresponding power adjustment value.

[0080] The beneficial effects of the above design scheme are as follows: By acquiring resin images during the lamination process and extracting resin melting characteristics from these images, a foundation is provided for further analysis of the resin melting process. The resin melting characteristics are compared with standard melting characteristics to identify feature differences. Based on these differences, the morphological parameters of the resin melting process are determined. Based on these morphological parameters and the current temperature, the target temperature required to achieve the target morphological parameters is determined. Based on the difference between the current temperature and the target temperature, the power adjustment value for the heating element is determined. This allows for real-time power adjustment of the heating element to ensure the reasonableness of the resin melting process temperature, enabling the lamination process to fully melt, flow, and bond well with the ceramic substrate and the oxidized copper foil, while avoiding excessively high temperatures that could degrade the resin performance.

[0081] Example 4: Based on Example 1, this embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates. The hot pressing control module includes:

[0082] The temperature acquisition unit is used to obtain the real-time heating temperature of the ceramic copper-clad laminate at various locations in the hot press based on the temperature sensor.

[0083] The power determination unit is used to determine the heating power adjustment value for each heating plate of the hot press based on the relationship between the real-time heating temperature at each location and the preset temperature range.

[0084] In this embodiment, each heating plate of the hot press heats its respective location, and the heating is controlled by zones to ensure uniform heating.

[0085] The beneficial effects of the above design scheme are: by obtaining the real-time heating temperature of the ceramic copper-clad laminate at various positions in the hot press based on temperature sensors, and by determining the adjustment value of the heating power of each heating plate of the hot press based on the relationship between the real-time heating temperature at each position and the preset temperature range, the uniformity of heating is ensured through zoned heating control, and the hot pressing temperature is precisely controlled to ensure the final performance of the ceramic copper-clad laminate.

[0086] Example 5: Based on Example 1, this embodiment of the invention provides a temperature control system for the processing of ceramic copper-clad laminates, such as... Figure 3 As shown, the etching control module includes:

[0087] The etching temperature acquisition unit is used to acquire the etching rate of the ceramic copper-clad laminate during the etching process, as well as the real-time liquid temperature of the etching solution.

[0088] The relationship determination unit is used to determine the temperature-rate correlation based on the correspondence between historical real-time liquid temperature and historical etching rate.

[0089] The etching temperature adjustment unit is used to obtain the liquid temperature corresponding to the target etching rate from the relevant change relationship, and to determine the adjustment parameters of the etching temperature control device based on the rate difference between the etching rate and the target etching rate and the temperature difference between the real-time liquid temperature and the liquid temperature.

[0090] In this embodiment, the greater the rate difference, the larger the single adjustment range of the adjustment parameter, and the longer the adjustment time of the adjustment parameter corresponding to the temperature difference, to ensure that the liquid temperature is reached quickly and accurately and maintained.

[0091] The beneficial effects of the above design scheme are: by determining the adjustment parameters of the etching temperature control device based on the etching rate of the ceramic copper-clad laminate during the etching process, the liquid temperature can be quickly and accurately reached and maintained, ensuring the precision and quality of etching.

[0092] Example 6: Based on Example 1, this embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates, wherein the cutting control module includes:

[0093] The heat determination unit is used to collect the heat generated during the laser cutting of the ceramic copper-clad laminate;

[0094] The cooling determination unit is used to determine the excess heat to be absorbed by the water cooling device based on the generated heat, and to determine the cooling parameters of the water cooling device based on the excess heat.

[0095] In this embodiment, the cooling parameters include power and flow rate.

[0096] The beneficial effects of the above-mentioned solution are: by collecting the heat generated during laser cutting of the ceramic copper-clad laminate, determining the excess heat to be absorbed by the water cooling device based on the generated heat, and determining the cooling parameters of the water cooling device based on the excess heat, the heat generated during cutting can be removed in time, preventing local overheating and ensuring cutting quality.

[0097] Example 7: Based on Example 3, this embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates, wherein the feature determination unit includes:

[0098] The preprocessing unit is used to preprocess the resin glue image to obtain a standard image and extract the target image where the resin glue region is located in the standard image;

[0099] The feature extraction unit is used to segment the target image into multiple image blocks, extract the color features, texture features, and bubble features of each image block, and extract the shape features of the melted resin glue based on all image blocks.

[0100] The feature integration unit is used to integrate the color feature, texture feature, bubble feature, and shape feature as resin glue melting features.

[0101] In this embodiment, the preprocessing methods for the resin glue image include image enhancement, image denoising, and image normalization.

[0102] The beneficial effects of the above design scheme are as follows: by segmenting the target image to obtain multiple image blocks, the color features, texture features, and bubble features of each image block are extracted, and based on the shape features of the resin glue melting obtained from all image blocks, the color features, texture features, bubble features, and shape features are used as resin glue melting features. This enables the determination of features from four factors affecting the melting effect: color, texture, bubble, and shape, providing a basis for determining the morphological parameters of the resin glue melting process.

[0103] Example 8: Based on Example 7, this embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates, wherein the temperature determination unit includes:

[0104] The difference acquisition unit is used to acquire color feature differences, texture feature differences, bubble feature differences, and shape feature differences from the feature differences;

[0105] The difference analysis unit is used to determine the transparency coefficient based on the color feature difference, the melting level based on the texture feature difference, the melting uniformity coefficient based on the bubble feature difference, and the edge smoothness and volume expansion coefficient based on the shape feature difference.

[0106] The process determination unit is used to calculate the current process coefficient of the resin adhesive melting based on the transparency coefficient, melting level, melting uniformity coefficient, edge smoothness, and volume expansion coefficient.

[0107] The formula for calculating the process coefficient K is as follows:

[0108]

[0109] in, Indicates edge smoothness. Let C represent the coefficient of volumetric expansion, and C represent the natural constant, with a value of 3. Indicates the transparency coefficient. Indicates the melting level. Indicates the melting uniformity coefficient;

[0110] The parameter determination unit is used to determine the stage of resin melting based on the process coefficient, and to obtain the morphological parameters corresponding to the stage from the database as the morphological parameters of the resin melting process.

[0111] The heat determination unit is used to determine the required heat based on the difference between the morphological parameters and the target morphological parameters, and, in conjunction with the current temperature, determine the target temperature required to achieve the target morphological parameters.

[0112] In this embodiment, the larger the process coefficient, the closer the process is to the state of complete melting.

[0113] In this embodiment, the transparency coefficient, melting level, melting uniformity coefficient, edge smoothness, and volume expansion coefficient are all standardized in the process coefficient calculation and are set to (0, 1).

[0114] In this embodiment, the higher the melting degree, the higher the transparency; the fewer the textures, the higher the fusion level; the fewer the bubbles, the greater the melting uniformity coefficient; and the higher the melting degree, the greater the edge smoothness and volume expansion coefficient.

[0115] The beneficial effects of the above design scheme are as follows: By calculating the current process coefficient of resin adhesive melting based on transparency coefficient, melting level, melting uniformity coefficient, edge smoothness, and volume expansion coefficient, the process is determined comprehensively based on multiple factors, ensuring the rationality and accuracy of the process. Based on the process coefficient, the stage of resin adhesive melting is determined, and the morphological parameters corresponding to the stage are obtained from the database as the morphological parameters of the resin adhesive melting process. Based on the difference between the morphological parameters and the target morphological parameters, the required heat is determined. Combined with the current temperature, the target temperature required to reach the target morphological parameters is determined, realizing the accurate determination of the temperature required in the lamination process, providing a strong basis for temperature regulation, thereby ensuring the lamination effect and the processing quality of ceramic copper-clad laminate.

[0116] Example 9: Based on Example 4, this embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates, wherein the power determination unit includes:

[0117] The heating temperature determination unit is used to obtain the difference between the real-time heating temperature of each location and the preset temperature range, and construct a difference array based on the difference values ​​according to the distribution characteristics of each location, and preliminarily determine the heating temperature required for each location based on the difference array to obtain the heating temperature array.

[0118] The fluctuation determination unit is used to determine the heat dissipation capacity coefficient of each position based on the distribution characteristics of each position, and to set the heat fluctuation amplitude for each position of the differential array based on the heat dissipation capacity coefficient, so as to obtain the fluctuation amplitude array corresponding to the differential array.

[0119] The prediction unit is used to determine the heat required at each location in the future based on the heating temperature array, and to perform weighted processing on the heat required in the future based on the fluctuation amplitude array to obtain the target predicted heat and obtain the predicted heat array.

[0120] The power determination unit is used to determine the power-time set that the heating plate meets the predicted heat array, and based on the heating rate requirement at each location, to obtain the candidate power-time set that meets the heating rate requirement from the power-time set, and to obtain multiple heating plate power operating parameter arrays based on the power-time set.

[0121] The power selection unit is used to determine the heating uniformity array caused by the mutual influence of adjacent heating plates under the heating plate power operating parameter array based on the positional distribution between the heating plates, select the heating plate power operating parameter array corresponding to the most uniform heating array, and determine the heating power adjustment value for each heating plate of the hot press.

[0122] In this embodiment, the array distribution is consistent with the positional distribution.

[0123] In this embodiment, the fluctuation amplitude array is determined based on the heat dissipation capacity of each location. The heat dissipation is faster at the edge and more concentrated at the center. The predicted heat array is determined under the premise of eliminating the differences caused by the heat dissipation capacity, so as to ensure the accuracy of the predicted heat.

[0124] In this embodiment, the power-time set gemstone combines different power levels and different times to meet the requirements of predicted heat.

[0125] In this embodiment, if the parameters of adjacent heating plates differ too much, it will cause uneven heating. Selecting the heating plate power operating parameter array corresponding to the array with the most average heating uniformity eliminates this effect.

[0126] The beneficial effects of the above design scheme are as follows: By constructing a difference array based on the difference values, and preliminarily determining the required heating temperature for each position based on the difference array, a heating temperature array is obtained. Based on the heat dissipation capacity coefficient, the heat fluctuation amplitude is set for each position of the difference array, resulting in a fluctuation amplitude array corresponding to the difference array. The predicted heat array is determined under the premise of eliminating the differences caused by heat dissipation capacity, ensuring the accuracy of the predicted heat, ensuring that the heat required for the hot pressing process in the future meets the actual requirements, determining that the heating plate meets the power-time set of the predicted heat array, and based on the heating rate requirements of each position. The process involves obtaining a candidate power-time set that meets the heating rate requirements from the power-time set, ensuring that the candidate power-time set satisfies the heating rate requirements and guarantees the quality of the hot pressing process. Based on the positional distribution between the heating plates, the heating uniformity array caused by the mutual influence of adjacent heating plates under the heating plate power operating parameter array is determined. The heating plate power operating parameter array corresponding to the most uniform heating array is selected, and the heating power adjustment value for each heating plate of the hot press is determined to eliminate uneven heating. By controlling the heating in zones, the heating uniformity is guaranteed, and the hot pressing temperature is precisely controlled to ensure the final performance of the ceramic copper-clad laminate.

[0127] Example 10: Based on Example 4, this embodiment of the invention provides a temperature control system for processing ceramic copper-clad laminates. The hot pressing control module further includes a preheating unit, which preheats the hot pressing mold process based on the hot pressing temperature before hot pressing.

[0128] The beneficial effect of the above design scheme is that by preheating the hot pressing mold process based on the hot pressing temperature before hot pressing, the temperature uniformity and stability of the entire hot pressing process are guaranteed.

[0129] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of this application and its equivalents, this invention also intends to include these modifications and variations.

Claims

1. A temperature control system for processing copper-clad ceramic sheets, characterized in that, include: The oxidation control module is used to determine the adjustment value of the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data of oxygen-free copper during the surface oxidation process in the heating equipment. The lamination control module is used to determine the power adjustment value of the heating element during the lamination process based on the difference between the resin melting characteristics and the standard melting characteristics of the resin during the lamination process, including: The feature determination unit is used to acquire resin images during the lamination process and extract resin melting features based on the resin images. The feature comparison unit is used to compare the melting characteristics of the resin glue with the standard melting characteristics to obtain the feature differences; A temperature determination unit is used to determine the morphological parameters of the resin adhesive melting process based on the aforementioned characteristic differences, and to determine the target temperature required to achieve the target morphological parameters based on the morphological parameters and the current temperature. A power adjustment unit is used to determine the power adjustment value for the heating element based on the difference between the current temperature and the target temperature. The hot press control module is used to determine the adjustment value of the heating power of the hot press based on the relationship between the real-time heating temperature of the ceramic copper-clad laminate in the hot press and the preset temperature range. The etching control module is used to determine the adjustment parameters of the etching temperature control device based on the etching rate of the ceramic copper-clad laminate during the etching process. The cutting control module is used to determine the cooling parameters for laser cutting based on the heat generated during laser cutting of the ceramic copper-clad laminate.

2. The temperature control system for processing copper-clad ceramic plates according to claim 1, characterized in that, The oxidation control module includes: The temperature judgment unit is used to acquire oxidation temperature data in real time and determine whether the oxidation temperature data is consistent with the preset oxidation temperature. If so, it is determined that no adjustment of the temperature control device is required; otherwise, it is determined that the temperature control device needs to be adjusted. The temperature control adjustment unit is used to determine the adjustment value based on the difference between the oxidation temperature data and the preset oxidation temperature when it is determined that the temperature control device needs to be adjusted. If the oxidation temperature data is greater than the preset oxidation temperature, the direction of the adjustment value is determined to be downward; if the oxidation temperature data is less than the preset oxidation temperature, the direction of the adjustment value is determined to be upward.

3. The temperature control system for processing copper-clad ceramic plates according to claim 1, characterized in that, The hot-press control module includes: The temperature acquisition unit is used to obtain the real-time heating temperature of the ceramic copper-clad laminate at various locations in the hot press based on the temperature sensor. The power determination unit is used to determine the heating power adjustment value for each heating plate of the hot press based on the relationship between the real-time heating temperature at each location and the preset temperature range.

4. The temperature control system for processing ceramic copper-clad laminates according to claim 1, characterized in that, Etching control module, including: The etching temperature acquisition unit is used to acquire the etching rate of the ceramic copper-clad laminate during the etching process, as well as the real-time liquid temperature of the etching solution. The relationship determination unit is used to determine the temperature-rate correlation based on the correspondence between historical real-time liquid temperature and historical etching rate. The etching temperature adjustment unit is used to obtain the liquid temperature corresponding to the target etching rate from the relevant change relationship, and to determine the adjustment parameters of the etching temperature control device based on the rate difference between the etching rate and the target etching rate and the temperature difference between the real-time liquid temperature and the liquid temperature.

5. The temperature control system for processing copper-clad ceramic plates according to claim 1, characterized in that, The cutting control module includes: The heat determination unit is used to collect the heat generated during the laser cutting of the ceramic copper-clad laminate; The cooling determination unit is used to determine the excess heat to be absorbed by the water cooling device based on the generated heat, and to determine the cooling parameters of the water cooling device based on the excess heat.

6. The temperature control system for processing copper-clad ceramic sheets according to claim 1, characterized in that, The feature determination unit includes: The preprocessing unit is used to preprocess the resin glue image to obtain a standard image and extract the target image where the resin glue region is located in the standard image; The feature extraction unit is used to segment the target image into multiple image blocks, extract the color features, texture features, and bubble features of each image block, and extract the shape features of the melted resin glue based on all image blocks. The feature integration unit is used to integrate the color feature, texture feature, bubble feature, and shape feature as resin glue melting features.

7. The temperature control system for processing copper-clad ceramic sheets according to claim 6, characterized in that, The temperature determination unit includes: The difference acquisition unit is used to acquire color feature differences, texture feature differences, bubble feature differences, and shape feature differences from the feature differences; The difference analysis unit is used to determine the transparency coefficient based on the color feature difference, the melting level based on the texture feature difference, the melting uniformity coefficient based on the bubble feature difference, and the edge smoothness and volume expansion coefficient based on the shape feature difference. The process determination unit is used to calculate the current process coefficient of the resin adhesive melting based on the transparency coefficient, melting level, melting uniformity coefficient, edge smoothness, and volume expansion coefficient. The parameter determination unit is used to determine the stage of resin melting based on the process coefficient, and to obtain the morphological parameters corresponding to the stage from the database as the morphological parameters of the resin melting process. The heat determination unit is used to determine the required heat based on the difference between the morphological parameters and the target morphological parameters, and, in conjunction with the current temperature, determine the target temperature required to achieve the target morphological parameters.

8. The temperature control system for processing copper-clad ceramic plates according to claim 3, characterized in that, The power determination unit includes: The heating temperature determination unit is used to obtain the difference between the real-time heating temperature of each location and the preset temperature range, and construct a difference array based on the difference values ​​according to the distribution characteristics of each location, and preliminarily determine the heating temperature required for each location based on the difference array to obtain the heating temperature array. The fluctuation determination unit is used to determine the heat dissipation capacity coefficient of each position based on the distribution characteristics of each position, and to set the heat fluctuation amplitude for each position of the differential array based on the heat dissipation capacity coefficient, so as to obtain the fluctuation amplitude array corresponding to the differential array. The prediction unit is used to determine the heat required at each location in the future based on the heating temperature array, and to perform weighted processing on the heat required in the future based on the fluctuation amplitude array to obtain the target predicted heat and obtain the predicted heat array. The power determination unit is used to determine the power-time set that the heating plate meets the predicted heat array, and based on the heating rate requirement at each location, to obtain the candidate power-time set that meets the heating rate requirement from the power-time set, and to obtain multiple heating plate power operating parameter arrays based on the power-time set. The power selection unit is used to determine the heating uniformity array caused by the mutual influence of adjacent heating plates under the heating plate power operating parameter array based on the positional distribution between the heating plates, select the heating plate power operating parameter array corresponding to the most uniform heating array, and determine the heating power adjustment value for each heating plate of the hot press.

9. A temperature control system for processing copper-clad ceramic sheets according to claim 3, characterized in that, The hot pressing control module also includes a preheating unit, which preheats the hot pressing mold process based on the hot pressing temperature before hot pressing molding.

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