Intelligent temperature control device and method for optical communication device coupling production

Abstract

The application provides an intelligent temperature control device and method for coupling production of optical communication devices, and relates to the technical field of optical communication. The device comprises an environment acquisition unit configured to acquire an environment data set of a coupling packaging station; a data reading unit configured to obtain device material data and an optimal coupling temperature value, and configure an expansion displacement of a temperature drift mapping; a strategy configuration unit configured to configure a temperature control response strategy according to the environment data set of the station and the optimal coupling temperature value, and establish a cooperative displacement correction parameter in combination with the expansion displacement; and a feedback correction unit configured to execute feedback adjustment of the temperature control response strategy and the cooperative displacement correction parameter after coupling packaging. The application solves the technical problem that, due to the lack of joint modeling and cooperative control mechanism for temperature spatial distribution and device material thermal response in the coupling process in the prior art, the coupling positioning accuracy is reduced, and the optical power output is unstable, and improves the coupling accuracy and power output stability of optical communication devices.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, specifically to an intelligent temperature control device and method for the coupled production of optical communication devices. Background Technology

[0002] In the coupling production process of optical communication devices, precise alignment, bonding, and thermosetting of multiple microstructure components are involved, and the entire process is extremely sensitive to temperature changes. Existing optical communication device coupling production processes largely rely on temperature control equipment (such as temperature-controlled platforms and chambers) to maintain the thermal stability of the working environment, supplemented by temperature sensors to monitor the temperature of key nodes. Some solutions introduce PID closed-loop temperature control logic to improve the adjustment response speed. However, these methods, on the one hand, often rely on single-point or local temperature control strategies, failing to perceive the entire temperature field of the workstation and thermal interference from adjacent workstations; on the other hand, they ignore the inconsistencies in the thermal response of various materials in the device structure, making it difficult to effectively compensate for non-uniform expansion displacement caused by temperature. These problems lead to decreased positioning accuracy and unstable optical power in optical communication devices during coupling, hindering further improvements in assembly yield and coupling efficiency. Summary of the Invention

[0003] This application provides an intelligent temperature control device and method for the coupling production of optical communication devices. It solves the technical problem in the prior art that the lack of a joint modeling and collaborative control mechanism for the spatial temperature distribution and thermal response of the device material during the coupling process leads to a decrease in positioning accuracy and unstable optical power output during the coupling process of optical communication devices. It achieves the technical effect of improving the coupling accuracy and power output stability of optical communication devices.

[0004] In view of the above problems, this application provides an intelligent temperature control device for the coupling production of optical communication devices. The device includes: an environment acquisition unit for acquiring the workstation environment during the coupling and packaging of optical communication devices, establishing a workstation environment dataset, the workstation environment dataset including a workstation environment temperature field and a neighboring environment temperature field; a data reading unit for acquiring device material data of the optical communication devices, obtaining an optimal coupling temperature value based on the device material data, and configuring an expansion displacement for temperature drift mapping; a strategy configuration unit for configuring a temperature control response strategy based on the workstation environment dataset and the optimal coupling temperature value, and establishing a collaborative displacement correction parameter based on the temperature control response strategy and the expansion displacement; and a feedback correction unit for performing optical communication device coupling and packaging using the collaborative displacement correction parameter and the temperature control response strategy, testing the coupled optical power after packaging, generating adjustment feedback based on the coupled optical power, and optimizing the temperature control response strategy and the collaborative displacement correction parameter using the adjustment feedback.

[0005] On the other hand, this application also provides an intelligent temperature control method for the coupling production of optical communication devices. The method includes: performing workstation environment acquisition for optical communication device coupling and packaging, establishing a workstation environment dataset, the workstation environment dataset including a workstation environment temperature field and an adjacent environment temperature field; acquiring device material data of the optical communication device, obtaining an optimal coupling temperature value based on the device material data, and configuring an expansion displacement for temperature drift mapping; configuring a temperature control response strategy based on the workstation environment dataset and the optimal coupling temperature value, and establishing a collaborative displacement correction parameter based on the temperature control response strategy and the expansion displacement; performing optical communication device coupling and packaging using the collaborative displacement correction parameter and the temperature control response strategy, and testing the coupled optical power after packaging, generating adjustment feedback based on the coupled optical power, and using the adjustment feedback to optimize the temperature control response strategy and the collaborative displacement correction parameter.

[0006] One or more technical solutions provided in this application have at least the following beneficial effects:

[0007] The environmental acquisition unit establishes the spatial temperature field sensing capability of the coupled packaging station, collecting ambient temperature data of the station and adjacent locations to construct a dynamic temperature distribution model, providing an environmental sensing foundation for subsequent temperature control strategies. The data reading unit identifies the thermal properties of the materials used in the optical communication devices, extracts their optimal coupling temperature values, and maps the structural expansion displacement caused by temperature drift based on thermal expansion behavior, providing data support for displacement compensation. Based on the known ambient temperature field and device thermal response characteristics, the strategy configuration unit formulates a temperature control response strategy and, combined with material expansion displacement, constructs collaborative displacement correction parameters linked to temperature control for precise compensation. The feedback correction unit executes the temperature control strategy and displacement compensation during the actual packaging process and generates adjustment feedback by detecting the coupled optical power after packaging, used to dynamically optimize the temperature control response strategy and collaborative displacement correction parameters, forming an adaptive closed-loop control.

[0008] In summary, this application achieves the technical effect of improving the coupling positioning accuracy and optical power output stability of optical communication devices and reducing the defect rate in the production process by optimizing intelligent temperature control and displacement compensation based on the synergistic driving of environmental perception and material properties.

[0009] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0010] Figure 1This is a schematic diagram of the structure of an intelligent temperature control device produced by coupling optical communication devices according to an embodiment of this application.

[0011] Figure 2 A flowchart illustrating the intelligent temperature control method for the coupled production of optical communication devices provided in this application embodiment.

[0012] Figure labeling: Environmental acquisition unit 10, data reading unit 20, strategy configuration unit 30, feedback correction unit 40. Detailed Implementation

[0013] This application provides an intelligent temperature control device and method for the coupling production of optical communication devices. This solves the technical problem in the prior art where the lack of a joint modeling and collaborative control mechanism for the spatial distribution of temperature and the thermal response of device materials during the coupling process leads to a decrease in positioning accuracy and unstable optical power output during the coupling process. This achieves the technical effect of improving the coupling accuracy and power output stability of optical communication devices.

[0014] Example 1, as Figure 1 As shown in the embodiment of this application, an intelligent temperature control device for the coupling production of optical communication devices is provided. The device includes:

[0015] The environment acquisition unit 10 is used to perform workstation environment acquisition for optical communication device coupling and packaging, and to establish a workstation environment dataset, which includes the workstation environment temperature field and the adjacent environment temperature field.

[0016] Specifically, a workstation is a location or platform for a specific packaging operation, such as an automatic coupling station or a fiber optic bonding station. Multi-point temperature sensors (such as thermocouple arrays or infrared temperature measurement modules) are deployed as acquisition nodes in and around the coupling and packaging workstation to periodically collect temperature data and establish a temperature field distribution model in both time and space dimensions. This data is then uniformly uploaded to the control system to form a workstation environment dataset, including the workstation's environmental temperature field and the temperature fields of adjacent environments. This dataset reflects the heat distribution, thermal interference trends, and temperature drift patterns of the workstation and its neighbors, providing a high-precision environmental data foundation for subsequent temperature control and displacement compensation.

[0017] The data reading unit 20 is used to acquire device material data of the optical communication device, obtain the optimal coupling temperature value based on the device material data, and configure the expansion displacement of the temperature drift mapping.

[0018] Specifically, this involves accessing materials databases or experimental data to obtain material data for optical communication devices, including the coefficient of thermal expansion and thermal conductivity of materials used in the device structure (such as glass, silicon, and metal casings). A thermodynamic model (such as finite element analysis software) is used to calculate the optimal coupling temperature, which ensures the device performs at its best during encapsulation. Combining the package structure dimensions with the temperature range ΔT (from the operating temperature to the optimal coupling temperature), the formula ΔL = αLΔT (where α is the coefficient of thermal expansion of the device material and L is the device size) is used to calculate the physical displacement caused by thermal expansion due to temperature changes (temperature drift). This establishes a mapping relationship between temperature and expansion displacement, providing a physical quantitative model for temperature control compensation strategies.

[0019] The strategy configuration unit 30 is used to configure a temperature control response strategy based on the workstation environment dataset and the optimal coupling temperature value, and to establish a collaborative displacement correction parameter based on the temperature control response strategy and the expansion displacement.

[0020] Specifically, the workstation environment dataset and optimal coupling temperature value are input into the control algorithm (such as a fuzzy controller or PID controller) within the strategy configuration unit 30 to formulate a temperature control response strategy. For example, when local thermal interference occurs, the power of the micro-heater in a certain area is automatically adjusted, or the assembly path is adjusted. Simultaneously, by combining expansion displacement data, collaborative displacement correction parameters are determined to adjust the device position. Through the coupling optimization of thermal control logic and mechanical displacement control, the system moves from single temperature control to coordinated structural control, significantly improving the dynamic stability of the coupled positioning.

[0021] The feedback correction unit 40 is used to perform optical communication device coupling and packaging by executing the cooperative displacement correction parameters and the temperature control response strategy, and to test the coupled optical power after packaging is completed. It generates adjustment feedback based on the coupled optical power and uses the adjustment feedback to optimize the temperature control response strategy and the cooperative displacement correction parameters.

[0022] Specifically, after coupling and packaging optical communication devices using collaborative displacement correction parameters and temperature control response strategies, the optical power transmission efficiency between the two devices, i.e., the coupled optical power, is measured using an optical power meter or integrated photodetector. The measurement result is compared with the expected target optical power, and adjustment feedback is generated based on the comparison result to adjust the temperature control response strategy and collaborative displacement correction parameters. For example, if the coupled optical power is too low, the heating or cooling intensity in the temperature control response strategy or the displacement correction coefficient in the collaborative displacement correction parameters needs to be adjusted. Algorithms such as genetic algorithms and gradient descent are used to automatically adjust the original temperature control strategy, fine-tuning the station temperature to a more optimal value, and recalculating the collaborative displacement correction parameters to achieve closed-loop optimization. By introducing a closed-loop feedback mechanism based on coupling effects, the device possesses self-learning, self-adaptive, and self-optimizing capabilities, significantly enhancing its stability and robustness under complex temperature change scenarios.

[0023] Furthermore, the environmental acquisition unit 10 includes:

[0024] The interaction unit is used to connect to the multi-station collaborative temperature control system and read the preset temperature control strategies of adjacent stations.

[0025] The measurement unit is used to collect temperature data at multiple points at the current workstation and adjacent workstations, and to construct the ambient temperature field of the workstation and the real-time temperature field of the adjacent workstations based on the results of the multi-point temperature collection.

[0026] The fitting unit is used to perform environmental simulation on the neighboring real-time temperature field according to the preset temperature control strategy, and to establish the neighboring environmental temperature field.

[0027] Specifically, the interaction unit interacts with the multi-station collaborative temperature control system based on a communication protocol. Following the communication rules set by the temperature control system, it reads pre-set temperature control operation schemes from adjacent workstations to obtain preset temperature control strategies. The multi-station collaborative temperature control system is a system used in the coupling and packaging process of optical communication devices to manage the temperature control of multiple workstations. It can coordinate the temperature control strategies between different workstations to achieve overall temperature optimization. For example, in a production environment based on industrial Ethernet, the interaction unit uses the TCP / IP protocol to send requests to the multi-station collaborative temperature control system to obtain preset temperature control strategy data from adjacent workstations and stores it in a local cache or database for later use.

[0028] The measurement unit acquires real-time temperature data at various key locations (such as the surface of packaging equipment, brackets, etc.) in the current and adjacent workstations. The acquired ambient temperature data is transmitted to the measurement unit's microcontroller or data acquisition system via the sensor's interface circuit. Interpolation algorithms (such as bilinear interpolation, Kriging method, etc.) are used to generate isothermal surfaces or thermal gradient maps between various measurement points in each workstation, constructing the workstation's ambient temperature field and the adjacent real-time temperature field.

[0029] The fitting unit, based on the preset temperature control strategy obtained by the interaction unit and the real-time temperature field data of the adjacent environment provided by the measurement unit, uses physical models (such as the heat diffusion equation) and mathematical models (such as the finite difference method and neural networks) to perform environmental simulation, predicts the temperature change trend of the adjacent environment, and establishes the temperature field of the adjacent environment based on the simulation results. For example, the heat conduction equation can be used, with known temperature points in the real-time temperature field of the adjacent environment as boundary conditions. Combined with information such as heating or cooling rates in the preset temperature control strategy, the heat conduction equation is solved using the finite difference method to establish the temperature field of the adjacent environment. By simulating the environment and predicting the temperature changes of the adjacent environment in advance, potential monitoring blind spots of the measurement unit can be supplemented, reflecting the temperature situation of the adjacent environment more comprehensively and accurately. This provides more complete environmental temperature data for temperature control during the entire coupling and packaging process of the optical communication device, reduces coupling errors caused by local temperature fluctuations and adjacent temperature changes, and improves the coupling accuracy of the optical communication device.

[0030] Furthermore, the measurement unit also includes:

[0031] The structure acquisition unit is used to acquire the structure of the current workstation and adjacent workstations, and to acquire the heat source distribution of the workstations.

[0032] The distributed configuration unit is used to optimize the location configuration of monitoring points based on monitoring accuracy, heat source distribution, and workstation results, establish the location configuration optimization results, and distribute monitoring sensors according to the location configuration optimization results to complete multi-point temperature acquisition.

[0033] Specifically, the structural acquisition unit reads CAD files or performs three-dimensional visual reconstruction using a 3D scanner or LiDAR to identify and acquire physical structural information of the current workstation and its adjacent workstations, such as workbench dimensions, component distribution, and heat-sensitive parts. It also collects information on the distribution of heat sources on the workstation, such as heater locations, laser sources, and hot air nozzles, using a thermal imager or infrared sensor. This provides basic data for subsequent optimization of monitoring point configuration and ensures a reasonable layout of monitoring points.

[0034] The distribution configuration unit determines the required number of monitoring points based on the monitoring accuracy. Then, combining the heat source distribution and workstation structure, it optimizes the monitoring point location configuration using algorithms (such as genetic algorithms and simulated annealing algorithms). Taking the genetic algorithm as an example, the location of the monitoring point is used as chromosome encoding. A fitness function is constructed based on factors such as monitoring accuracy, heat source distribution, and workstation structure. Through continuous iterative evolution, the monitoring point location configuration scheme with the highest fitness (i.e., the one that best meets the monitoring accuracy requirements and effectively covers the characteristics of heat sources and workstation structure) is found, and the output is the location configuration optimization result. Temperature sensors are installed at the corresponding locations in the workstation according to the location configuration optimization result to complete multi-point temperature acquisition. By considering multiple factors to optimize the monitoring point location configuration, comprehensive and accurate monitoring of workstation temperature can be achieved with the fewest monitoring points while meeting the monitoring accuracy requirements, reducing unnecessary sensor installation costs.

[0035] Furthermore, the strategy configuration unit 30 includes:

[0036] The disturbance trend fitting unit is used to predict the thermal disturbance trend based on the neighboring ambient temperature field and the ambient temperature field of the workstation environment dataset, and to establish a time-series disturbance factor.

[0037] The fitting curve establishment unit is used to establish a target fitting temperature curve based on the workstation ambient temperature field and the optimal coupling temperature value.

[0038] The temperature control response strategy establishment unit is used to establish the temperature control response strategy by using the target fitted temperature curve as the node control target and performing control optimization under the constraint of the time-series disturbance factor.

[0039] Specifically, the disturbance trend fitting unit analyzes the time-series data of the neighboring ambient temperature fields and the ambient temperature fields at the workstation in the workstation environment dataset. Using time-series analysis methods (such as ARIMA models and LSTM neural networks), it predicts the thermal disturbance trend, fits a disturbance trend function, and generates a time-series disturbance factor. This time-series disturbance factor is a quantifiable time-series indicator used to describe the intensity and duration of the disturbance over time, helping the strategy algorithm understand "when and how much" to respond to the disturbance.

[0040] The fitting curve establishment unit uses polynomial fitting, spline interpolation and other methods to take the actual temperature data in the work station environment temperature field as the basic data points, and the optimal coupling temperature value as the target value. It finds a curve that can best fit these data points and tend to the optimal coupling temperature value, and establishes the target fitting temperature curve so that the coupling environment can be stably maintained near the optimal coupling temperature value. This curve usually shows the shape of "smooth temperature rise - plateau period - slow drop".

[0041] The temperature control response strategy establishment unit uses the target fitted temperature curve as the control objective. Under the constraint of the time-series disturbance factor, it uses control algorithms (such as PID controllers, particle swarm optimization, etc.) to optimize control. While satisfying control accuracy and response speed, it selects the optimal control parameters such as heating power and cooling rate to establish the temperature control response strategy. Taking particle swarm optimization as an example, the parameters of the temperature control strategy (heating power, cooling rate, etc.) are used as the position vectors of the particles, and the deviation between the actual temperature and the target fitted temperature curve, as well as the satisfaction of the time-series disturbance factor, are used as the fitness function. Through iterative search of the particle swarm, the position of the particle with the highest fitness is found, which is the optimal temperature control response strategy.

[0042] For example, the optimal coupling temperature of a certain optical communication device is set to 35℃, but the adjacent station B will release thermal interference during the period of 10 to 20 seconds, causing the temperature of this station to rise to 36.2℃. The strategy configuration unit 30 fits the disturbance factor curve based on historical disturbance samples, pre-cools the device 10 seconds in advance, and simultaneously controls the target temperature curve to be reduced to 34.2℃ in the period of 9 to 11 seconds. Based on this, the controller issues an early cooling command to offset the upcoming temperature rise and achieve thermal stability of the coupling process.

[0043] Through the coordinated operation of the above-mentioned sub-units, the strategy configuration unit 30 realizes multi-objective optimization control that takes into account both disturbance compensation and target achievement. The established temperature control response strategy can control the temperature more accurately, effectively cope with thermal disturbances, improve the temperature control accuracy in the coupling and packaging process of optical communication devices, and thus improve the quality of coupling and packaging.

[0044] Furthermore, the policy configuration unit 30 also includes:

[0045] The matching unit is used to perform displacement matching of expansion displacement based on the target fitted temperature curve and the temperature drift mapping, and to establish expansion displacement matching results.

[0046] A collaborative displacement matching unit is used to generate collaborative displacement correction parameters based on the expansion displacement matching results.

[0047] Specifically, the matching unit obtains temperature values ​​at different time points from the target fitted temperature curve. Then, it substitutes these temperature values ​​into the temperature drift mapping relationship, maps the expansion displacement value at each moment according to the temperature-time point, and obtains the expansion displacement matching result.

[0048] The collaborative displacement matching unit extracts the displacement values ​​corresponding to each time node based on the expansion displacement matching results, generating collaborative displacement correction parameters for adjusting the position of the optical communication device. For example, if the ambient temperature required for coupling of a certain optical device is 34℃, and the thermal expansion of the material will cause an axial displacement of 0.9μm, then at time point t=10s (i.e., at the start of coupling), the displacement Δx = +0.9μm is obtained. This axial backward offset of 0.9μm is written as a correction parameter into the configuration table of the coupling device (platform positioning system, tooling fixture configuration system, etc.). Before starting the encapsulation process, the initial position of the platform or fiber optic positioning kit can be adjusted in advance according to this correction parameter to compensate for displacement errors caused by temperature changes.

[0049] By generating precise displacement correction parameters, the displacement error caused by thermal expansion is converted into static compensation parameters, ensuring the positioning accuracy of optical communication devices during the coupling process, reducing displacement errors caused by temperature changes, thereby improving the coupling initial alignment accuracy and reducing power loss caused by thermal drift.

[0050] Furthermore, the device also includes:

[0051] The judgment unit is used to perform device temperature monitoring during the coupling and packaging process of optical communication devices and establish nodes to achieve feedback.

[0052] The feedback response unit is used to update the temperature control response strategy based on the feedback from the node, and to complete the coupling and packaging of the optical communication device based on the feedback update.

[0053] Specifically, during the coupling and packaging process, the judgment unit uses temperature sensors (such as thermocouples, infrared sensors, etc.) to monitor the local or overall temperature of the optical communication device. It compares the monitored temperature data with the target fitted temperature curve to determine whether the device temperature has entered or reached a certain stage node. Based on the judgment result, it generates node achievement feedback. If the node state meets the set conditions (e.g., stable within ±0.3℃ for 2 seconds), it outputs an achievement feedback signal. If the node state does not meet the set conditions, it outputs delayed achievement or failure feedback, indicating that the strategy may need adjustment.

[0054] The feedback response unit updates the temperature control response strategy based on feedback information from the nodes, using control algorithms (such as PID control, adaptive control, fuzzy control, etc.). For example, if the feedback indicates that the device temperature is significantly lower than the target temperature, the heating power needs to be increased; if the node overshoots, the isothermal time is shortened or the temperature control amplitude is adjusted. Then, the coupling and packaging process of the optical communication device continues according to the updated temperature control response strategy, ensuring that the device temperature follows the target fitted temperature curve and improving the temperature stability of the entire packaging process. This, in turn, improves the success rate of coupling and packaging and the quality of the optical communication device.

[0055] Furthermore, the device also includes:

[0056] The early warning unit is used to receive feedback from the node, perform anomaly verification, and if the anomaly verification result meets the preset anomaly threshold, generate a temperature control anomaly early warning, and shut down the system based on the temperature control anomaly early warning and report the early warning signal.

[0057] Specifically, the early warning unit receives node achievement feedback information from the judgment unit, analyzes the feedback information, calculates the deviation value from the normal situation to verify the achievement anomaly, and obtains the achievement anomaly verification result. The achievement anomaly verification result is then compared with a preset anomaly threshold. If the achievement anomaly verification result meets the preset anomaly threshold, a temperature control anomaly early warning is generated. For example, based on the target fitted temperature curve, the normal temperature range corresponding to each node is calculated. If the temperature value in the node achievement feedback is not within this range, the degree of deviation between the actual temperature and the normal temperature range is calculated. This deviation degree is compared with the preset anomaly threshold. If the deviation is greater than or equal to the preset anomaly threshold, a temperature control anomaly early warning is generated, a stop command is sent to the optical communication device coupling and packaging control system to stop the equipment in the optical communication device coupling and packaging process, and an early warning signal is sent to the monitoring system or operator.

[0058] By achieving anomaly verification, temperature anomalies during the coupling and packaging process of optical communication devices can be detected and handled in a timely manner, reducing production accidents and product losses caused by temperature anomalies and improving the safety and reliability of the entire coupling and packaging process.

[0059] Furthermore, the feedback correction unit 40 is also used for:

[0060] The coupled optical power is continuously recorded, and the impact of individual anomalies is weakened based on the continuous recording results; a general adjustment feedback is generated using the results of weakening the impact of individual anomalies, and the temperature control response strategy and the cooperative displacement correction parameters are optimized using the general adjustment feedback.

[0061] Specifically, the feedback correction unit 40 continuously collects coupled optical power data during the coupling and packaging process of optical communication devices using devices such as optical power sensors, and stores this data in chronological order. Data analysis algorithms (such as filtering algorithms and machine learning algorithms) are used to process the continuously recorded optical power data, identifying and mitigating the impact of individual abnormal data or conditions on the overall result. Short-term abnormal fluctuations (such as instantaneous power drops or slight thermal disturbances) are removed from the overall dataset to obtain a smoother and more stable power change curve. For example, a moving average filter can be used to smooth the optical power data, or an isolated forest algorithm can be used to detect and remove outliers. Based on the coupled optical power data after mitigating the impact of individual abnormalities, the overall optical power trend, fluctuation range, and other characteristics are analyzed to generate a general adjustment feedback that includes appropriately increasing heating power and adjusting the displacement correction direction. Control algorithms (such as PID control and adaptive control) are used to optimize the temperature control response strategy and cooperative displacement correction parameters, improving the accuracy and stability of temperature control and displacement correction during the coupling and packaging process of optical communication devices, thereby improving the coupling and packaging quality.

[0062] Furthermore, the device also includes:

[0063] The emergency management unit interacts with the environment acquisition unit 10 to perform real-time updates of the current workstation environment and identify sudden change triggers in the real-time update results. If a sudden change trigger identification result is generated, an emergency temperature compensation instruction is generated, and the temperature control response strategy is optimized according to the emergency temperature compensation instruction.

[0064] Specifically, the emergency management unit interacts with the environmental acquisition unit 10, using a communication protocol to acquire real-time environmental data of the current workstation. A sudden change threshold is set based on the type of environmental data and the normal range of change. The unit updates the workstation environment data and the sudden change threshold in real time to identify any temperature sudden changes. For example, for temperature data, a temperature change rate threshold k = 0.5℃ / second is set. The temperature change rate ΔT / t between the current time and the last update time is calculated (where ΔT is the temperature change and t is the time interval). If ΔT / t > k, a sudden temperature change is detected, and a sudden change trigger identification result is generated. Then, based on the sudden change trigger identification result, the direction and magnitude of temperature compensation are determined, an emergency temperature compensation command is generated, and the temperature control response strategy is adjusted and optimized to avoid a decrease in coupling accuracy or unstable optical power due to sudden temperature changes. For example, during a coupling process, the workstation temperature is detected to suddenly rise from 34℃ to 35.2℃ within 1 second, exceeding the set temperature change threshold (±0.5℃ / second). At this time, the emergency management unit generates an emergency temperature compensation command through its internal control algorithm, requiring the temperature control system to immediately slow down the heating rate from 0.5℃ / second to 0.3℃ / second to ensure stable temperature changes.

[0065] In summary, the intelligent temperature control device for optical communication device coupling production provided in this application embodiment has the following beneficial effects:

[0066] The environmental acquisition unit 10 establishes the spatial temperature field sensing capability of the coupled packaging station, collects ambient temperature data of the station and adjacent locations, and constructs a dynamic temperature distribution model to provide an environmental sensing basis for subsequent temperature control strategies. The data reading unit 20 identifies the thermal characteristics of the materials used in the optical communication device, extracts its optimal coupling temperature value, and maps the structural expansion displacement law caused by temperature drift based on thermal expansion behavior, providing data support for displacement compensation. The strategy configuration unit 30, based on the known ambient temperature field and device thermal response law, formulates a temperature control response strategy and, combined with material expansion displacement, constructs a collaborative displacement correction parameter linked to temperature control to achieve precise compensation. The feedback correction unit 40 executes the temperature control strategy and displacement compensation during the actual packaging process, and generates adjustment feedback by detecting the coupled optical power after packaging, used to dynamically optimize the temperature control response strategy and collaborative displacement correction parameters, forming an adaptive closed-loop control. The early warning unit and judgment unit, combined with node feedback and anomaly verification, ensure real-time early warning and emergency handling under any temperature fluctuation conditions, guaranteeing the normal operation of the coupled packaging. In addition, the emergency management unit ensures a rapid response and adjustment of temperature control strategies in the event of sudden temperature changes by identifying sudden mutations and generating emergency temperature compensation commands, thus avoiding abnormal fluctuations from affecting the coupling effect.

[0067] Overall, the embodiments of this application reduce coupling deviations caused by factors such as temperature and displacement by optimizing intelligent temperature control and displacement based on the synergistic driving of environmental perception and material properties. This achieves the technical effect of improving the coupling positioning accuracy and optical power output stability of optical communication devices and reducing the defect rate in the production process.

[0068] Example 2, as Figure 2 As shown, based on the same inventive concept as in Embodiment 1 above, this application provides an intelligent temperature control method for the coupling production of optical communication devices, the method comprising:

[0069] Step S1: Perform workstation environment acquisition for optical communication device coupling and packaging, and establish workstation environment dataset, which includes workstation environment temperature field and adjacent environment temperature field.

[0070] Step S2: Obtain the device material data of the optical communication device, obtain the optimal coupling temperature value based on the device material data, and configure the expansion displacement of the temperature drift mapping.

[0071] Step S3: Configure a temperature control response strategy based on the workstation environment dataset and the optimal coupling temperature value, and establish collaborative displacement correction parameters based on the temperature control response strategy and the expansion displacement.

[0072] Step S4: Perform optical communication device coupling and packaging using the cooperative displacement correction parameters and the temperature control response strategy, and test the coupled optical power after packaging is completed. Generate adjustment feedback based on the coupled optical power, and use the adjustment feedback to optimize the temperature control response strategy and the cooperative displacement correction parameters.

[0073] Furthermore, step S1 in the embodiments of this application includes:

[0074] Connect to the multi-station collaborative temperature control system and read the preset temperature control strategies of adjacent stations; collect multi-point temperatures for the current station and adjacent stations respectively, and construct the station's ambient temperature field and the adjacent station's real-time temperature field based on the multi-point temperature collection results; perform environmental simulation on the adjacent station's real-time temperature field according to the preset temperature control strategies to establish the adjacent station's ambient temperature field.

[0075] Furthermore, multi-point temperature data is collected for the current workstation and adjacent workstations. Based on the multi-point temperature collection results, an ambient temperature field for the current workstation and a real-time temperature field for adjacent workstations are constructed, including:

[0076] The system acquires the workstation structure of the current workstation and adjacent workstations, and obtains the heat source distribution of the workstations. Based on the monitoring accuracy, heat source distribution, and workstation results, it optimizes the location configuration of monitoring points, establishes the location configuration optimization results, and distributes monitoring sensors in the location configuration optimization results to complete multi-point temperature acquisition.

[0077] Furthermore, step S3 in this embodiment includes:

[0078] Based on the temperature fields of neighboring environments and the temperature field of the workstation environment in the workstation environment dataset, thermal disturbance trend prediction is performed, and a time-series disturbance factor is established; based on the temperature field of the workstation environment and the optimal coupling temperature value, a target fitted temperature curve is established; using the target fitted temperature curve as the node control target, control optimization is performed under the constraint of the time-series disturbance factor, and the temperature control response strategy is established.

[0079] Furthermore, step S3 in this embodiment of the application also includes:

[0080] Based on the target fitted temperature curve and the temperature drift mapping, displacement matching of expansion displacement is performed to establish expansion displacement matching results; based on the expansion displacement matching results, cooperative displacement correction parameters are generated.

[0081] Furthermore, the method described in the embodiments of this application includes:

[0082] During the coupling and packaging process of optical communication devices, device temperature monitoring is performed, and node achievement feedback is established; based on the node achievement feedback, the temperature control response strategy is updated, and the coupling and packaging of optical communication devices is completed based on the feedback update.

[0083] Furthermore, the method described in the embodiments of this application includes:

[0084] After receiving the node's achievement feedback, an achievement anomaly verification is performed. If the achievement anomaly verification result meets the preset anomaly threshold, a temperature control anomaly warning is generated, and the system is shut down based on the temperature control anomaly warning, and a warning signal is reported.

[0085] Furthermore, step S4 in this embodiment of the application also includes:

[0086] The coupled optical power is continuously recorded, and the influence of individual anomalies is weakened based on the continuous recording results; a general adjustment feedback is generated using the individual anomaly influence weakening results, and the temperature control response strategy and the cooperative displacement correction parameters are optimized using the general adjustment feedback.

[0087] Furthermore, the method described in the embodiments of this application includes:

[0088] The interactive environment acquisition unit 10 performs real-time updates of the current workstation environment and identifies sudden change triggers in the real-time update results. If a sudden change trigger identification result is generated, an emergency temperature compensation command is generated, and the temperature control response strategy is optimized according to the emergency temperature compensation command.

[0089] Through the foregoing detailed description of the intelligent temperature control device for optical communication device coupling production, those skilled in the art can clearly understand the intelligent temperature control method for optical communication device coupling production in this embodiment. As for the method disclosed in Embodiment 2, since it corresponds to the device disclosed in Embodiment 1, it has corresponding execution steps and beneficial effects. For relevant details, please refer to the device section description.

[0090] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An intelligent temperature control device for the coupling production of optical communication devices, characterized in that, The device includes: An environmental acquisition unit is used to perform workstation environmental acquisition for optical communication device coupling and packaging, and to establish a workstation environmental dataset, which includes the workstation environmental temperature field and the adjacent environmental temperature field. The data reading unit is used to acquire device material data of optical communication devices, obtain the optimal coupling temperature value based on the device material data, and configure the expansion displacement of temperature drift mapping. The strategy configuration unit is used to configure a temperature control response strategy based on the workstation environment dataset and the optimal coupling temperature value, and to establish a collaborative displacement correction parameter based on the temperature control response strategy and the expansion displacement. The feedback correction unit is used to perform optical communication device coupling and packaging by executing the cooperative displacement correction parameters and the temperature control response strategy, and to test the coupled optical power after packaging is completed. The unit generates adjustment feedback based on the coupled optical power and uses the adjustment feedback to optimize the temperature control response strategy and the cooperative displacement correction parameters.

2. The intelligent temperature control device for optical communication device coupling production as described in claim 1, characterized in that, The environmental acquisition unit includes: The interaction unit is used to connect to the multi-station collaborative temperature control system and read the preset temperature control strategies of adjacent stations. The measurement unit is used to collect temperature data at multiple points in the current workstation and adjacent workstations, and to construct the ambient temperature field of the workstation and the real-time temperature field of the adjacent workstations based on the results of the multi-point temperature collection. The fitting unit is used to perform environmental simulation on the neighboring real-time temperature field according to the preset temperature control strategy, and to establish the neighboring environmental temperature field.

3. The intelligent temperature control device for optical communication device coupling production as described in claim 2, characterized in that, The measurement unit also includes: The structure acquisition unit is used to acquire the structure of the current workstation and adjacent workstations, and to acquire the heat source distribution of the workstations; The distributed configuration unit is used to optimize the location configuration of monitoring points based on monitoring accuracy, heat source distribution, and workstation results, establish the location configuration optimization results, and distribute monitoring sensors according to the location configuration optimization results to complete multi-point temperature acquisition.

4. The intelligent temperature control device for optical communication device coupling production as described in claim 2, characterized in that, The policy configuration unit includes: The disturbance trend fitting unit is used to predict the thermal disturbance trend based on the neighboring ambient temperature field and the ambient temperature field of the workstation environment dataset, and to establish a time-series disturbance factor. The fitting curve establishment unit is used to establish a target fitting temperature curve based on the workstation ambient temperature field and the optimal coupling temperature value. The temperature control response strategy establishment unit is used to establish the temperature control response strategy by using the target fitted temperature curve as the node control target and performing control optimization under the constraint of the time-series disturbance factor.

5. The intelligent temperature control device for optical communication device coupling production as described in claim 4, characterized in that, The policy configuration unit also includes: The matching unit is used to perform displacement matching of expansion displacement based on the target fitted temperature curve and the temperature drift mapping, and to establish expansion displacement matching results; A collaborative displacement matching unit is used to generate collaborative displacement correction parameters based on the expansion displacement matching results.

6. The intelligent temperature control device for optical communication device coupling production as described in claim 1, characterized in that, The device further includes: The judgment unit is used to perform device temperature monitoring during the coupling and packaging process of optical communication devices and establish nodes to achieve feedback. The feedback response unit is used to update the temperature control response strategy based on the feedback from the node, and to complete the coupling and packaging of the optical communication device based on the feedback update.

7. The intelligent temperature control device for optical communication device coupling production as described in claim 6, characterized in that, The device further includes: The early warning unit is used to receive feedback from the node, perform anomaly verification, and if the anomaly verification result meets the preset anomaly threshold, generate a temperature control anomaly early warning, and shut down the system based on the temperature control anomaly early warning and report the early warning signal.

8. The intelligent temperature control device for optical communication device coupling production as described in claim 1, characterized in that, The feedback correction unit is also used for: The coupled optical power is continuously recorded, and the impact of individual anomalies is weakened based on the continuous recording results; A general adjustment feedback is generated by utilizing the weakening effect of individual anomalies, and the temperature control response strategy and the cooperative displacement correction parameters are optimized using the general adjustment feedback.

9. The intelligent temperature control device for optical communication device coupling production as described in claim 1, characterized in that, The device further includes: The emergency management unit interacts with the environment acquisition unit, performs real-time updates of the current workstation's environment, and identifies sudden change triggers in the real-time update results. If a sudden change trigger identification result is generated, an emergency temperature compensation instruction is generated, and the temperature control response strategy is optimized based on the emergency temperature compensation instruction.

10. A smart temperature control method for the coupled production of optical communication devices, characterized in that, The method is executed by an intelligent temperature control device coupled to the optical communication device according to any one of claims 1-9, comprising: The workstation environment of the coupled packaging of optical communication devices is collected to establish a workstation environment dataset, which includes the workstation environment temperature field and the adjacent environment temperature field. Obtain the device material data of the optical communication device, obtain the optimal coupling temperature value based on the device material data, and configure the expansion displacement of the temperature drift mapping; Configure a temperature control response strategy based on the workstation environment dataset and the optimal coupling temperature value, and establish a collaborative displacement correction parameter based on the temperature control response strategy and the expansion displacement. The optical communication device is coupled and packaged using the cooperative displacement correction parameters and the temperature control response strategy. After the packaging is completed, the coupled optical power is tested. Adjustment feedback is generated based on the coupled optical power, and the temperature control response strategy and the cooperative displacement correction parameters are optimized using the adjustment feedback.

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