Edge computing device with heat dissipation function

By setting up a shock absorbing pad on the guide rail of the edge computing device and installing a shock absorbing mechanism on the fan assembly, the noise problem caused by fan vibration is solved, and a more silent heat dissipation effect is achieved.

CN120335559APending Publication Date: 2025-07-18GUANGZHOU KETENG INFORMATION TECH
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Patent Information

Application Number
CN202510242207.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-03
Publication Date
2025-07-18

AI Technical Summary

Technical Problem

During the heat dissipation process of edge computing equipment, due to the gap between the fan and the guide rail, the fan vibrates and makes large noise when it is working, affecting the noise problem of the equipment.

Method used

An edge computing device with heat dissipation function is designed, using a shock absorbing pad with transverse grooves on the guide rail and a shock absorbing mechanism on the fan assembly. The shock absorbing pad is controlled to squeeze or separate it from the shock absorbing mechanism to reduce vibration and noise between the fan and the guide rail.

Benefits of technology

It effectively reduces the noise generated by collision between fan components and guide rails, improves assembly accuracy, and improves the silent performance of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an edge computing device with a heat dissipation function. The edge computing device comprises a shell; the edge computing body is arranged in the shell; the heat dissipation module comprises a guide rail arranged in the shell, a fan assembly movably arranged on the guide rail and a translation driving part in driving connection with the fan assembly, the guide rail and one edge of the edge calculation body are arranged in parallel, the fan assembly is arranged towards the edge calculation body, and the translation driving part is used for driving the fan assembly to move along the guide rail; wherein the guide rail is provided with a transverse groove extending in the length direction of the guide rail, a shock pad is arranged in the transverse groove, a shock absorption mechanism is arranged on the fan assembly, the shock absorption mechanism is arranged towards the shock pad, and the shock absorption mechanism can be controlled to extrude the shock pad or be separated from the shock pad. According to the edge computing equipment with the heat dissipation function, the noise problem can be solved.
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Description

Technical Field

[0001] The present invention relates to the technical field of computing devices, and particularly to an edge computing device with a heat dissipation function. Background Art

[0002] Edge computing refers to an open platform that integrates network, computing, storage, and application core capabilities on one side close to the object or the data source to provide the nearest-end services nearby. Its application programs are initiated on the edge side, generating faster network service responses and meeting the basic needs of the industry in aspects such as real-time services, application intelligence, security, and privacy protection.

[0003] When the edge computing device is in use, heat is generated inside it. In related technologies, a fan is used for heat dissipation. Additionally, to ensure the heat dissipation effect, a driving member is also used to drive the fan to move on the guide rail, so that the fan can focus on dissipating heat from the areas with higher temperatures. However, due to a certain gap between the fan and the guide rail, the vibration generated during the operation of the fan will cause the fan to continuously collide with the guide rail, resulting in a relatively large noise. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides an edge computing device with a heat dissipation function, which can improve the problem of relatively large noise.

[0005] An edge computing device with a heat dissipation function according to some embodiments of the present invention includes: a housing; an edge computing body disposed inside the housing; a heat dissipation module including a guide rail disposed inside the housing, a fan assembly movably disposed on the guide rail, and a translation driving member drivingly connected to the fan assembly, wherein the guide rail is disposed parallel to one side of the edge computing body, the fan assembly faces the edge computing body, and the translation driving member is used to drive the fan assembly to move along the guide rail; wherein, the guide rail is provided with a transverse groove extending along the length direction of the guide rail, a shock-absorbing pad is disposed inside the transverse groove, a shock-absorbing mechanism is disposed on the fan assembly, the shock-absorbing mechanism faces the shock-absorbing pad, and the shock-absorbing mechanism can be controlled to squeeze the shock-absorbing pad or separate from the shock-absorbing pad.

[0006] The edge computing device with a heat dissipation function according to the embodiments of the present invention has at least the following beneficial effects:

[0007] In the edge computing device with heat dissipation function according to the present invention, after the fan assembly moves to the corresponding position under the drive of the translation driving member, the shock absorption mechanism is controlled to squeeze the shock absorption pad, thereby pressing the shock absorption pad tightly. In this way, when the fan assembly is working, the vibration generated by the fan assembly will be reduced after being transmitted to the shock absorption mechanism and the shock absorption pad, thereby reducing the noise generated by the collision between the fan assembly and the guide rail. In addition, the vibration between the guide rail and the fan assembly can also be reduced, thereby improving the problem that the assembly accuracy between the guide rail and the fan assembly decreases due to long-term vibration. In addition, when the position of the fan assembly needs to be adjusted, the shock absorption mechanism is controlled to separate from the shock absorption pad, so that the fixing between the fan assembly and the guide rail is released, and the fan assembly can move to other positions under the action of the translation driving member.

[0008] According to some embodiments of the present invention, the shock absorption mechanism includes a lifting driving member fixed to the fan assembly and a pressing strip drivingly connected to the lifting driving member. The pressing strip is disposed opposite to the shock absorption pad, and the lifting driving member is configured to drive the pressing strip to approach or separate from the shock absorption pad.

[0009] According to some embodiments of the present invention, the pressing strip is an elastic pressing strip.

[0010] According to some embodiments of the present invention, the lifting driving member has a rotatable screw rod, the pressing strip has a screw hole for the screw rod to pass through, and the groove wall of the transverse groove is configured to limit the rotation of the pressing strip.

[0011] According to some embodiments of the present invention, the fan assembly includes a bracket movably disposed in the housing, a fan disposed on the bracket, and a fixing unit for fixing the fan to the bracket.

[0012] According to some embodiments of the present invention, the bracket includes a base and two columns disposed on the base at intervals and in parallel along the length direction of the guide rail. The fan is slidably disposed between the two columns, and the fixing unit is detachably connected to the column and abuts against the top of the fan to place the fan on the base.

[0013] According to some embodiments of the present invention, the fixing unit includes a pressing block pressing on the top of the fan and a screw passing through the pressing block. The pressing block presses on the top of the fan, the column is configured to limit the movement of the pressing block along the length direction of the guide rail, and the screw abuts against the column.

[0014] According to some embodiments of the present invention, the fixing unit further includes a buffer pad disposed at the bottom of the pressing block, and the buffer pad abuts against the top of the fan.

[0015] According to some embodiments of the present invention, a vertical groove extending vertically is provided on one side of each of the columns close to the other column, and both sides of the fan extend into the vertical grooves of the two columns respectively.

[0016] According to some embodiments of the present invention, the vertical groove includes two first side walls arranged at intervals and opposite to each other, and a second side wall connected between the two first side walls. Wherein, the interval direction of the two first side walls is perpendicular to the length direction of the guide rail, and the interval direction of the two first side walls is perpendicular to the vertical direction of the column;

[0017] The first side wall is provided with a guide groove extending vertically, and the pressing block has a guiding portion inserted into the guide groove.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the drawings and embodiments, where:

[0020] Figure 1 is a schematic structural diagram of an edge computing device with a heat dissipation function according to an embodiment of the present invention;

[0021] Figure 2 is a schematic internal structural diagram of an edge computing device with a heat dissipation function according to an embodiment of the present invention;

[0022] Figure 3 is a schematic structural diagram of a heat dissipation module according to an embodiment of the present invention;

[0023] Figure 4 is a schematic structural diagram of the heat dissipation module from another perspective according to an embodiment of the present invention;

[0024] Figure 5 is a schematic cross-sectional structural diagram of a heat dissipation module according to an embodiment of the present invention;

[0025] Figure 6 is Figure 5 a partial enlarged view of the shown figure;

[0026] Figure 7 is Figure 6 an enlarged view of part A in;

[0027] Figure 8 is a schematic structural diagram of a fan assembly according to an embodiment of the present invention;

[0028] Figure 9 is Figure 8 an enlarged view of part B in.

[0029] Reference Numerals in the Drawings:

[0030] 100, housing; 101, heat dissipation holes;

[0031] 200, heat dissipation module; 210, temperature detection module; 220, translation drive member; 230, fan assembly; 231, bracket; 2311, base; 2312, column; 23121, vertical groove; 23121a, first side wall; 23121b, second side wall; 231211, guide groove; 232, fan; 233, fixing unit; 2331, pressing block; 23311, extending portion; 2332, screw; 2333, buffer pad; 234, elastic plate; 240, guide rail; 241, horizontal groove; 242, shock pad; 243, oil groove; 250, sliding member; 251, oil groove; 260, shock absorption mechanism; 261, lifting drive member; 2611, screw rod; 262, pressing strip;

[0032] 300, edge computing body. Detailed Embodiment

[0033] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0034] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0035] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0036] As Figure 1 , Figure 2 shown, an edge computing device provided by an embodiment of the present invention includes a housing 100, a heat dissipation module 200, and an edge computing body 300.

[0037] The housing 100 has a hollow structure, and a heat dissipation hole 101 is provided on the housing 100.

[0038] The edge computing body 300 is disposed inside the housing 100.

[0039] It can be understood that the edge computing body 300 is the core of the edge computing device, and it will generate heat during the working process, and with the increase of the working time, the generated heat will be more and more.

[0040] The heat dissipation module 200 is disposed inside the housing 100, and the heat dissipation module 200 is used to dissipate heat from the edge computing body 300 to ensure the working performance of the edge computing body 300.

[0041] Combined with Figure 3 and Figure 4 , specifically, the heat dissipation module 200 includes a guide rail 240 disposed inside the housing 100, a fan assembly 230 movably disposed on the guide rail 240, and a translation driving member 220 drivingly connected to the fan assembly 230.

[0042] Combined with Figure 2 and Figure 3 , specifically, the guide rail 240 is disposed in parallel with one side of the edge computing body 300, the fan assembly 230 is slidably connected to the guide rail 240 and is disposed facing the edge computing body 300, and the translation driving member 220 can drive the fan assembly 230 to move along the guide rail.

[0043] As Figure 4 shown, specifically, the fan assembly 230 is connected with a sliding member 250, and the sliding member 250 is slidably engaged with the guide rail 240. The translation driving member 220 is an electric guide rail extending along the length direction of the guide rail 240, the sliding member 250 is slidably connected to the guide rail 240, and the sliding member 250 is connected to the electric guide rail.

[0044] Combined withFigure 2 And Figure 3 The fan assembly 230 is arranged facing the edge computing body 300. When the fan assembly 230 is started, it can blow air in front of it, thereby dissipating heat from the edge computing body 300. Among them, the fan assembly 230 can be driven by the translation driving member 220 to move along the guide rail 240.

[0045] Furthermore, the heat dissipation module 200 further includes a temperature detection module 210. The temperature detection module 210 is arranged facing the edge computing body 300, and the temperature detection module 210 can detect the temperature of different regions of the edge computing body 300. Specifically, the temperature detection module 210 includes a plurality of temperature probes arranged at intervals along the length direction of the guide rail 240, and different temperature probes detect the temperature of different regions of the edge computing body 300 along the length direction of the guide rail.

[0046] The translation driving member 220 can work based on the detection result of the temperature detection module 210. Specifically, the translation driving member 220 can drive the fan assembly 230 to move to a position opposite to the region with the highest temperature of the edge computing body 300 based on the detection result of the temperature detection module 210.

[0047] It should be noted that the edge computing body 300 can control the translation driving member 220, that is, the temperature detection module 210 is electrically connected to the input end of the edge computing body 300, and the translation driving member 220 is electrically connected to the output end of the edge computing body 300. The edge computing body 300 can control the translation driving member 220 to work based on the detection result of the temperature detection module 210. In some other embodiments, the heat dissipation module 200 further includes an independent controller different from the edge computing body 300. The temperature detection module 210 is electrically connected to the input end of the controller, and the translation driving member 220 is electrically connected to the output end of the controller. The controller can control the translation driving member 220 to work based on the detection result of the temperature detection module 210.

[0048] It can be understood that the temperature detection module 210 can detect the temperatures of different regions of the edge computing body 300, so as to know which region of the edge computing body 300 has the highest temperature. For example, the temperature detection module 210 has three temperature sensors arranged at intervals along the length direction of the guide rail 240, and the three temperature sensors respectively detect the temperatures of three different regions of the edge computing body 300. The translation driving member 220 can drive the fan assembly 230 to move along the length direction of the guide rail 240, so that the fan assembly 230 is opposite to the region of the edge computing body 300 with the highest temperature. In this way, the fan assembly 230 can concentrate on dissipating heat from the region of the edge computing body 300 with the highest temperature. Moreover, as the edge computing body 300 continuously operates and the fan assembly 230 continuously dissipates heat, the region of the edge computing body 300 with the highest temperature will change, and the translation driving member 220 can adjust the position of the fan assembly 230 in real time, so that the fan assembly 230 can always be opposite to the position with the highest temperature on the edge computing body 300, thus ensuring the heat dissipation effect.

[0049] Combined with Figure 5 With Figure 6 , further, the guide rail 240 is provided with a transverse groove 241 extending along the length direction of the guide rail 240, and a shock pad 242 is arranged inside the transverse groove 241. A shock absorption mechanism 260 is arranged on the fan assembly 230, and the shock absorption mechanism 260 faces the shock pad 242, and the shock absorption mechanism 260 can be controlled to squeeze the shock pad 242 or separate from the shock pad 242.

[0050] It can be understood that after the fan assembly 230 moves to the corresponding position under the drive of the translation driving member 220, the shock absorption mechanism 260 is controlled to squeeze the shock pad 242, so as to press the shock pad 242 tightly. In this way, when the fan assembly 230 works, the vibration generated by the fan assembly 230 will be reduced after being transmitted to the shock absorption mechanism 260 and the shock pad 242, thereby reducing the generation of noise. In addition, the vibration between the guide rail 240 and the fan assembly 230 can also be reduced, thereby improving the problem that the assembly accuracy between the guide rail 240 and the fan assembly 230 decreases due to long-term vibration. In addition, when the fan assembly 230 needs to adjust its position, the shock absorption mechanism 260 is controlled to separate from the shock pad 242, so that the fixation between the fan assembly 230 and the guide rail 240 is released, and the fan assembly 230 can move to other positions under the action of the translation driving member 220.

[0051] It should be noted that the temperature detection module 210 is electrically connected to the input end of the edge computing body 300, the translation driving member 220 is electrically connected to the output end of the edge computing body 300, and the shock absorption mechanism 260 is connected to the output end of the edge computing body 300.

[0052] It can be understood that the temperature detection module 210 can detect the temperatures of different regions of the edge computing body 300, so that the edge computing body 300 can know which region of the edge computing body 300 has the highest temperature. For example, the temperature detection module 210 has three temperature sensors arranged at intervals along the length direction of the guide rail 240, and the three temperature sensors respectively detect the temperatures of three different regions of the edge computing body 300. Based on the detection results of the temperature detection module 210, the edge computing body 300 can control the translation driving member 220 to drive the fan assembly 230 to move to a position opposite to the region with the highest temperature of the edge computing body 300; when the fan assembly 230 moves in place, the edge computing body 300 controls the shock absorption mechanism 260 to squeeze the shock absorption pad 242; as the edge computing body 300 continuously operates and the fan assembly 230 continuously dissipates heat, the region with the highest temperature of the edge computing body 300 will change. When it is necessary to adjust the position of the fan assembly 230 again, the shock absorption mechanism 260 is controlled by the edge computing body 300 to separate from the shock absorption pad 242, so that the fixation between the fan assembly 230 and the guide rail 240 is released, and then the edge computing body 300 controls the translation driving member 220 to drive the fan assembly 230 to move to other positions.

[0053] Combined with Figure 6 With Figure 7 , further, the shock absorption mechanism 260 includes a lifting driving member 261 fixed to the fan assembly 230 and a pressure strip 262 drivingly connected to the lifting driving member 261. The pressure strip 262 is disposed opposite to the shock absorption pad 242, and the lifting driving member 261 is used to drive the pressure strip 262 to approach or move away from the shock absorption pad 242. Among them, the pressure strip 262 is an elastic pressure strip.

[0054] It can be understood that the lifting driving member 261 is disposed on the sliding member 250, the pressure strip 262 is connected to the lifting driving member 261, and the lifting driving member 261 can drive the pressure strip 262 to approach the shock absorption pad 242 and abut against the shock absorption pad 242, and the lifting driving member 261 can also drive the pressure strip 262 to move away from the shock absorption pad 242 and separate from the shock absorption pad 242. Among them, the lifting driving member 261 is electrically connected to the edge computing body 300 and is controlled by the edge computing body 300.

[0055] Further, the lifting driving member 261 has a rotatable screw rod 2611, the pressure strip 262 has a screw hole for the screw rod 2611 to pass through, and the groove wall of the transverse groove 241 is used to limit the rotation of the pressure strip 262. In this way, when the screw rod 2611 rotates, it can drive the pressure strip 262 to move up and down, so that the pressure strip 262 approaches or moves away from the shock absorption pad 242.

[0056] Specifically, the lifting drive member 261 includes a motor, and a screw rod 2611 is connected to the output shaft of the motor. The motor can drive the screw rod 2611 to rotate.

[0057] As Figure 7 shown, an oil groove 251 is provided on the sliding member 250. One end of the oil groove 251 penetrates the upper surface of the sliding member 250, and the other end extends toward the screw rod 2611. Lubricating oil can be injected into the oil groove 251 to lubricate the screw rod 2611, thereby ensuring the lubrication effect between the pressing strip 260 and the screw rod 2611.

[0058] Combined Figure 8 with Figure 9 In some embodiments, the fan assembly 230 includes a bracket 231 movably disposed on the housing 100, a fan 232 disposed on the bracket 231, and a fixing unit 233 for fixing the fan 232 to the bracket 231.

[0059] It can be understood that the bracket 231 is used to support the fan 232, and the fixing unit 233 is used to fix the fan 232 on the bracket 231. Among them, the bracket 231 is slidably connected to the housing 100, and the bracket 231 can move along the length direction of the guide rail 240, so that the entire fan assembly 230 moves along the length direction of the guide rail 240. The fan 232 can blow air, and the fan 232 is disposed toward the edge computing body 300. The fan 232 can dissipate heat from the edge computing body 300.

[0060] The bracket 231 includes a base 2311 and two columns 2312 arranged at intervals and side by side on the base 2311 along the length direction of the guide rail 240. The fan 232 is slidably disposed between the two columns 2312. The fixing unit 233 is detachably connected to the column 2312 and abuts against the top of the fan 232 to place the fan 232 on the base 2311.

[0061] It can be understood that the columns 2312 are used to limit the two sides of the fan 232 along the length direction of the guide rail 240, the fixing unit 233 is used to limit the top of the fan 232, and the base 2311 is used to limit the bottom of the fan 232, so as to fix the fan 232. When the fixing unit 233 is detached from the column 2312, the top limit of the fan 232 is cancelled, and the fan 232 can slide upward and be detached, which is convenient to operate.

[0062] It should be noted that after the fixing unit 233 is detached from the column 2312, the fan 232 can slide upward and be detached.

[0063] Combined Figure 8 with Figure 9, Further, the fixing unit 233 includes a pressing block 2331 pressing on the top of the blower 232 and a screw 2332 passing through the pressing block 2331. The pressing block 2331 is connected to the column 2312 and presses on the top of the blower 232. The column 2312 is used to restrict the pressing block 2331 from moving along the length direction of the guide rail 240, and the screw 2332 abuts against the column 2312.

[0064] It can be understood that the pressing block 2331 is provided with a screw hole, the axial direction of the screw hole is parallel to the length direction of the guide rail 240, the screw 2332 passes through the screw hole and abuts against the column 2312. Since the column 2312 restricts the pressing block 2331 from moving along the length direction of the guide rail 240, when the screw 2332 abuts tightly against the column 2312, the positioning of the pressing block 2331 can be realized, and the pressing block 2331 is tightly pressed against the top of the blower 232. Of course, by rotating the screw 2332, the screw 2332 can also be loosened from the pressing block 2331, so that the entire fixing unit 233 can be disassembled.

[0065] Further, the fixing unit 233 further includes a buffer pad 2333 arranged at the bottom of the pressing block 2331, and the buffer pad 2333 abuts against the top of the blower 232.

[0066] Specifically, the buffer pad 2333 is made of an elastic material, such as silica gel or foam, and the buffer pad 2333 can play a role in buffering and noise reduction.

[0067] Further, a vertically extending vertical groove 23121 is provided on one side of each column 2312 close to the other column 2312, and both sides of the blower 232 extend into the vertical grooves 23121 of the two columns 2312 respectively.

[0068] Wherein, the vertical groove 23121 includes two spaced and oppositely arranged first side walls 23121a and a second side wall 23121b connecting between the two first side walls 23121a. Among them, the spacing direction of the two first side walls 23121a is perpendicular to the length direction of the guide rail, and the spacing direction of the two first side walls 23121a is perpendicular to the vertical direction of the column 2312.

[0069] Further, the first side wall 23121a is provided with a vertically extending guide groove 231211, and the pressing block 2331 has a guiding portion penetrating into the guide groove 231211.

[0070] It can be understood that the briquette 2331 has an insertion portion 23311 extending into the vertical groove 23121. The guiding portion is connected to the insertion portion 23311 and is arranged in the guiding groove 231211. The guiding groove 231211 can guide the entire briquette 2331, and the guiding groove 231211 can also limit the movement of the guiding portion along the length direction of the guide rail, thereby limiting the movement of the briquette 2331 along the length direction of the guide rail. When the screw 2332 is rotated and loosened, the briquette 2331 can be slid upward, so that the briquette 2331 can be disassembled.

[0071] Furthermore, the bracket 231 further includes an elastic plate 234 connected to the second side wall 23121b. The screw 2332 abuts against the elastic plate 234. The elastic plate 234 itself has a certain elasticity. After the elastic plate 234 is abutted by the screw 2332, a reaction force will be generated, so that the connection effect between the screw 2332 and the elastic plate 234 is better.

[0072] In the edge computing device of the present invention, the temperature detection module 210 can detect the temperatures of different regions of the edge computing body 300, so that the edge computing body 300 can know which region of the edge computing body 300 has the highest temperature. For example, the temperature detection module 210 has three temperature sensors arranged at intervals along the length direction of the guide rail 240, and the three temperature sensors respectively detect the temperatures of three different regions of the edge computing body 300. Based on the detection results of the temperature detection module 210, the edge computing body 300 can control the translation driving member 220 to drive the fan assembly 230 to move to a position opposite to the region with the highest temperature of the edge computing body 300; when the fan assembly 230 moves into place, the edge computing body 300 controls the shock absorption mechanism 260 to squeeze the shock absorption pad 242; as the edge computing body 300 continuously operates and the fan assembly 230 continuously dissipates heat, the region with the highest temperature of the edge computing body 300 will change. When it is necessary to adjust the position of the fan assembly 230 again, the shock absorption mechanism 260 is controlled by the edge computing body 300 to separate from the shock absorption pad 242, so that the fixation between the fan assembly 230 and the guide rail 240 is released, and then the edge computing body 300 controls the translation driving member 220 to drive the fan assembly 230 to move to other positions. Wherein, when the fan assembly 230 moves to the corresponding position under the drive of the translation driving member 220, the shock absorption mechanism 260 is controlled to squeeze the shock absorption pad 242, so as to press the shock absorption pad 242 tightly. In this way, when the fan assembly 230 works, the vibration generated by the fan assembly 230 will be reduced after being transmitted to the shock absorption mechanism 260 and the shock absorption pad 242, thereby reducing the noise generated by the collision between the fan assembly 230 and the guide rail 240. In addition, the vibration between the guide rail 240 and the fan assembly 230 can also be reduced, thereby improving the problem that the assembly accuracy between the guide rail 240 and the fan assembly 230 decreases due to long-term vibration. In addition, when the position of the fan assembly 230 needs to be adjusted, the shock absorption mechanism 260 is controlled to separate from the shock absorption pad 242, so that the fixation between the fan assembly 230 and the guide rail 240 is released, and the fan assembly 230 can move to other positions under the action of the translation driving member 220.

[0073] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0074] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An edge computing device with a heat dissipation function, characterized in that, Comprising: A housing; An edge computing body, disposed inside the housing; A heat dissipation module, including a guide rail disposed inside the housing, a fan assembly movably disposed on the guide rail, and a translation driving member drivingly connected to the fan assembly. The guide rail is arranged side by side with one side of the edge computing body. The fan assembly faces the edge computing body, and the translation driving member is used to drive the fan assembly to move along the guide rail; Wherein, the guide rail is provided with a transverse groove extending along the length direction of the guide rail, a shock absorption pad is disposed inside the transverse groove, a shock absorption mechanism is disposed on the fan assembly, the shock absorption mechanism faces the shock absorption pad, and the shock absorption mechanism can be controlled to squeeze the shock absorption pad or separate from the shock absorption pad.

2. The edge computing device with a heat dissipation function according to claim 1, wherein The shock absorption mechanism includes a lifting driving member fixed to the fan assembly and a pressing strip drivingly connected to the lifting driving member. The pressing strip is disposed opposite to the shock absorption pad, and the lifting driving member is used to drive the pressing strip to approach or move away from the shock absorption pad.

3. The edge computing device with a heat dissipation function according to claim 2, wherein The pressing strip is an elastic pressing strip.

4. The edge computing device with a heat dissipation function according to claim 2, characterized in that, The lifting driving member has a rotatable screw rod, the pressing strip has a screw hole for the screw rod to pass through, and the groove wall of the transverse groove is used to limit the rotation of the pressing strip.

5. The edge computing device with heat dissipation function according to claim 1, characterized in that, The fan assembly includes a bracket movably disposed in the housing, a fan disposed on the bracket, and a fixing unit for fixing the fan to the bracket.

6. The edge computing device with a heat dissipation function according to claim 5, wherein, The bracket includes a base and two columns disposed on the base at intervals and side by side along the length direction of the guide rail. The fan is slidably disposed between the two columns, and the fixing unit is detachably connected to the column and abuts against the top of the fan to place the fan on the base.

7. The edge computing device with a heat dissipation function according to claim 6, wherein The fixing unit includes a pressing block pressing on the top of the fan and a screw passing through the pressing block. The pressing block presses on the top of the fan, the column is used to limit the movement of the pressing block along the length direction of the guide rail, and the screw abuts against the column.

8. The edge computing device with a heat dissipation function according to claim 7, characterized in that, The fixing unit further includes a buffer pad disposed at the bottom of the pressing block, and the buffer pad abuts against the top of the fan.

9. The edge computing device with a heat dissipation function according to claim 7, characterized in that, On one side of each column close to the other column, there is a vertical groove extending vertically. Two sides of the fan respectively extend into the vertical grooves of the two columns.

10. The edge computing device with heat dissipation function according to claim 9, characterized in that, The vertical groove includes two spaced and oppositely disposed first side walls and a second side wall connecting between the two first side walls. Wherein, the spacing direction of the two first side walls is perpendicular to the length direction of the guide rail, and the spacing direction of the two first side walls is perpendicular to the vertical direction of the column; The first side wall is provided with a guide groove extending vertically, and the pressing block has a guiding portion disposed in the guide groove.