Server

Abstract

The invention discloses a server, and relates to the technical field of servers, a backboard module in the server comprises a first backboard and a second backboard, a circuit in the first backboard is a printed wire, a circuit in the second backboard is a cable, and a power module is connected with a memory module and a calculation module through the first backboard. A low-speed signal and a power supply can be transmitted through a printed conductor, the memory module is connected with the calculation module through the second backboard, a high-speed signal can be transmitted through a cable, the cable can adopt a low-loss medium to improve the transmission quality of the high-speed signal, the cost is lower compared with the cost of transmitting the high-speed signal through a printed circuit board, and the problem that the high-speed signal is transmitted is solved. The technical problem that the cost of the circuit board is increased due to the fact that the requirement for the board of the circuit board is high is solved, and the technical effect that the cost of the backboard module is reduced, so that the cost of the server is reduced is achieved.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to servers. Background Art

[0002] Currently, in the memory all-in-one machine, the signal and power interconnection scheme adopts the circuit board backplane connection method. The main control unit is connected to the backplane through a board-to-board connector to transmit signals and power, and the backplane is connected to the terminal device or other sub-nodes through a board-to-board connector to transmit signals and power.

[0003] However, for signals with relatively fast transmission speeds, generally, higher requirements are imposed on the board material of the circuit board, resulting in an increase in the cost of the circuit board. Summary of the Invention

[0004] This application provides a server to at least solve the problem in the related art that for signals with relatively fast transmission speeds, higher requirements are imposed on the board material of the circuit board, resulting in an increase in the cost of the circuit board.

[0005] This application provides a server, including: a memory module, a plurality of computing modules, a power module, and a backplane module; The backplane module includes a first backplane and a second backplane. The power module is connected to the memory module and the plurality of computing modules through the printed conductors of the first backplane, and the memory module is connected to the plurality of computing modules through the cables of the second backplane; The speed of signal transmission through the cable is greater than the speed of signal transmission through the printed conductor.

[0006] Through this application, since the backplane module in the server includes a first backplane and a second backplane, the circuit in the first backplane is a printed conductor, and the circuit in the second backplane is a cable. The power module is connected to the memory module and the computing modules through the first backplane. Low-speed signals and power can be transmitted through the printed conductors. The memory module is connected to the computing modules through the second backplane, and high-speed signals can be transmitted through the cables. The cables can use low-loss media to improve the quality of high-speed signal transmission, and the cost of transmitting high-speed signals is lower than that of printed circuit boards. Therefore, the technical problem that for signals with relatively fast transmission speeds, higher requirements are imposed on the board material of the circuit board, resulting in an increase in the cost of the circuit board can be solved, and the technical effect of reducing the cost of the backplane module and thus reducing the cost of the server can be achieved. Brief Description of the Drawings

[0007] In order to more clearly illustrate the embodiments of this application, the following will briefly introduce the drawings required for the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0008] Figure 1 One of the schematic structural diagrams of the server provided by the embodiment of the present application; Figure 2 One of the schematic structural diagrams of the server in the related art; Figure 3 Another schematic structural diagram of the server in the related art; Figure 4 Schematic structural diagram of the first backplane provided by the embodiment of the present application; Figure 5 Schematic structural diagram of the second backplane provided by the embodiment of the present application; Figure 6 Schematic structural diagram of the backplane module provided by the embodiment of the present application; Figure 7 Another schematic structural diagram of the server provided by the embodiment of the present application.

[0009] Reference numerals: Server 100, memory module 110, computing module 120, power supply module 130, main power supply 131, Standby power supply 132, backplane module 140, first backplane 141, first connection terminal 141a, Second connection terminal 141b, third connection terminal 141c, second backplane 142, Fourth connection terminal 142a, fifth connection terminal 142b, cable 142c, ventilation opening 150, Power supply board 160, heat dissipation module 170. Detailed implementation manners

[0010] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0011] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such a process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0012] To enable those skilled in the art of this technology to better understand the solution of this application, the following further detailed description of this application will be given in conjunction with the accompanying drawings and specific embodiments.

[0013] An embodiment of this application provides a server 100.

[0014] As Figure 1 shown, the server 100 includes a memory module 110, multiple computing modules 120, a power supply module 130, and a backplane module 140.

[0015] Among them, the memory module 110 is a module that can store data and instructions, the computing module 120 is a module responsible for executing computing tasks, the computing module 120 may include a Central Processing Unit (CPU), the power supply module 130 is a module that can provide power supply for components in the server 100, and the backplane module 140 is used to connect the memory module 110, multiple computing modules 120, the power supply module 130, and components in the server 100 to achieve power distribution and signal transmission.

[0016] In this embodiment, the backplane module 140 includes a first backplane 141 and a second backplane 142.

[0017] The power supply module 130 is connected to the memory module 110 and multiple computing modules 120 through the printed conductors of the first backplane 141, and the memory module 110 is connected to multiple computing modules 120 through the cable 142c of the second backplane 142.

[0018] The speed at which the cable 142c transmits signals is greater than the speed at which the printed conductors transmit signals.

[0019] Among them, the first backplane 141 may be a Printed Circuit Board (PCB), the circuit in the first backplane 141 may be printed conductors, and the circuit in the second backplane 142 may be a conductive cable 142c.

[0020] In this embodiment, the first connection terminal 141a of the first backplane 141 is connected to the power supply module 130, the second connection terminal 141b is connected to the memory module 110, and the third connection terminal 141c is connected to multiple computing modules 120.

[0021] Among them, the first connection terminal 141a is the connection terminal in the first backplane 141 for connecting to the power supply module 130, the second connection terminal 141b is the connection terminal in the first backplane 141 for connecting to the memory module 110, and the third connection terminal 141c is the connection terminal in the first backplane 141 for connecting to multiple computing modules 120.

[0022] The first backplane 141 may include a plurality of third connection terminals 141c, and each third connection terminal 141c is connected to one computing module 120.

[0023] In this embodiment, the first connection terminal 141a and the second connection terminal 141b are connected by a printed wire on the first backplane 141, and the first connection terminal 141a and the third connection terminal 141c are connected by a printed wire on the first backplane 141.

[0024] The first connection terminal 141a and the second connection terminal 141b are connected by a printed wire on the first backplane 141, so that the power supply module 130 can supply power to the memory module 110 through the printed wire. The first connection terminal 141a and the third connection terminal 141c are connected by a printed wire on the first backplane 141, so that the power supply module 130 can supply power to the computing module 120 through the printed wire.

[0025] It should be noted that power pins are provided in the first connection terminal 141a, the second connection terminal 141b, and the third connection terminal 141c. The power pin of the first connection terminal 141a is connected to the power pin of the second connection terminal 141b by a printed wire, and the power pin of the first connection terminal 141a is connected to the power pin of the third connection terminal 141c by a printed wire.

[0026] First signal pins are provided in the first connection terminal 141a, the second connection terminal 141b, and the third connection terminal 141c. The first signal pins are used to transmit low-speed signals. The low-speed signals are signals with a transmission speed less than a set speed threshold, and the low-speed signals may include control signals and status detection signals for the power supply module 130 and other components.

[0027] The first signal pin of the first connection terminal 141a is connected to the first signal pin of the second connection terminal 141b by a printed wire, and the first signal pin of the first connection terminal 141a is connected to the first signal pin of the third connection terminal 141c by a printed wire.

[0028] For example, the memory module 110 may output a power control signal. The power control signal is transmitted to the first signal pin of the second connection terminal 141b and then transmitted to the power supply module 130 connected to the first signal pin of the first connection terminal 141a through a printed wire to control the power supply module 130 to output power.

[0029] In this embodiment, the fourth connection terminal 142a of the second backplane 142 is connected to the memory module 110, and the fifth connection terminal 142b is connected to a plurality of computing modules 120.

[0030] Among them, the fourth connection terminal 142a is the connection terminal in the second backplane 142 for connecting to the memory module 110, and the fifth connection terminal 142b is the connection terminal in the second backplane 142 for connecting to the computing module 120.

[0031] The second backplane 142 may include a plurality of fifth connection terminals 142b, and each fifth connection terminal 142b is connected to one computing module 120.

[0032] In this embodiment, the fourth connection terminal 142a and the fifth connection terminal 142b are connected by a cable 142c in the second backplane 142, and second signal pins are provided in the fourth connection terminal 142a and the fifth connection terminal 142b.

[0033] Among them, the speed of transmitting signals by the second signal pins is greater than the speed of transmitting signals by the first signal pins. The second signal pins are used to transmit high-speed signals. The high-speed signals are signals whose transmission speed is greater than the set speed threshold. The high-speed signals may include data transmission signals transmitted between the memory module 110 and the computing module 120, etc.

[0034] The second signal pins of the fourth connection terminal 142a and the second signal pins of the fifth connection terminal 142b are connected by a cable 142c, so that the high-speed signals between the memory module 110 and the computing module 120 are transmitted in the cable 142c.

[0035] In the related art, as Figure 2 shown, in the signal and power interconnection scheme of the memory all-in-one machine, the circuit board backplane connection method is adopted. The main control unit is connected to the backplane through a board-to-board connector to transmit signals and power supply. The backplane and the terminal device or other sub-nodes are then connected through a board-to-board connector to transmit signals and power. However, for signals with relatively fast transmission speeds, usually higher requirements are imposed on the board material of the circuit board, resulting in an increase in the cost of the circuit board.

[0036] In the embodiment of the present application, the backplane module 140 includes a first backplane 141 and a second backplane 142. The circuit in the first backplane 141 is a printed wire, and the circuit in the second backplane 142 is a cable 142c. The first backplane 141 is connected to the power supply module 130, the memory module 110, and the computing module 120. First signal pins are provided in the connection terminals of the first backplane 141, so that low-speed signals and power can be transmitted through the printed wires. The second backplane 142 is connected to the memory module 110 and the computing module 120. Second signal pins are provided in the connection terminals of the second backplane 142, so that high-speed signals can be transmitted through the cable 142c. The cable 142c can use a low-loss medium to improve the quality of high-speed signal transmission. Compared with the cost of transmitting high-speed signals by a printed circuit board, the cost can be lower, the cost of the backplane module 140 can be reduced, and thus the cost of the server 100 can be reduced.

[0037] In related technologies, as Figure 3 shown, in the memory all-in-one machine, the signal and power interconnection scheme adopts a cable connection method. Through the cable connection method, both the main control unit and the terminal device transfer signals and power through a board-to-wire connection method. However, the cable connection method makes the maintenance of the all-in-one machine difficult. Each terminal device inside the machine needs to manually plug and unplug the cables by completely opening the chassis, and then replace the device or board card. The maintenance difficulty and cost are high. At the same time, a large number of cables for device interconnection occupy a lot of space inside the chassis, are difficult to identify, and are difficult to manage.

[0038] In the embodiment of the present application, the backplane module 140 includes a first backplane 141 and a second backplane 142. The circuit in the first backplane 141 is a printed wire, and the circuit in the second backplane 142 is a cable 142c. The first backplane 141 is connected to the power supply module 130, the memory module 110, and the computing module 120. The connection terminals of the first backplane 141 are provided with first signal pins, so that low-speed signals and power can be transmitted through the printed wire. The second backplane 142 is connected to the memory module 110 and the computing module 120. The connection terminals of the second backplane 142 are provided with second signal pins, so that high-speed signals can be transmitted through the cable 142c. The amount of the cable 142c can be reduced, and the cable 142c is arranged on the second backplane 142, so that the distribution of the cable 142c is more integrated, the space occupied by the cable 142c inside the chassis can be reduced, and the distribution of the cable 142c is clearer, thereby reducing the maintenance difficulty and cost.

[0039] According to the server 100 provided by the embodiment of the present application, the backplane module 140 includes a first backplane 141 and a second backplane 142. The circuit in the first backplane 141 is a printed wire, and the circuit in the second backplane 142 is a cable 142c. The power supply module 130 is connected to the memory module 110 and the computing module 120 through the first backplane 141. Low-speed signals and power can be transmitted through the printed wire. The memory module 110 is connected to the computing module 120 through the second backplane 142. High-speed signals can be transmitted through the cable 142c. The cable 142c can use a low-loss medium to improve the quality of high-speed signal transmission, and the cost of transmitting high-speed signals is lower than that of a printed circuit board, which can reduce the cost of the backplane module 140, thereby reducing the cost of the server 100.

[0040] In some embodiments, the first backplane 141 and the second backplane 142 are arranged on the same plate-like structure, so that the connection terminals of the first backplane 141 and the second backplane 142 are in the same plane. The memory module 110, multiple computing modules 120, and the power supply module 130 are assembled to the first backplane 141 and / or the second backplane 142 through the connection terminals.

[0041] Among them, the plate-like structure is a plate-like support substrate for supporting and fixing the first backplane 141 and the second backplane 142.

[0042] In this embodiment, the first backplane 141 and the second backplane 142 are arranged on the same plate-like structure, such that a plurality of connection terminals are in the same plane, and the contact surfaces of the first connection terminal 141a, the second connection terminal 141b, the third connection terminal 141c, the fourth connection terminal 142a, and the fifth connection terminal 142b are at the same height.

[0043] The first connection terminal 141a is inserted and mated with the power supply module 130 to achieve connection, the second connection terminal 141b is inserted and mated with the memory module 110 to achieve connection, the third connection terminal 141c is inserted and mated with a plurality of computing modules 120 to achieve connection, the fourth connection terminal 142a is inserted and mated with the memory module 110 to achieve connection, and the fifth connection terminal 142b is inserted and mated with a plurality of computing modules 120 to achieve connection.

[0044] In this embodiment, the first connection terminal 141a, the second connection terminal 141b, the third connection terminal 141c, the fourth connection terminal 142a, and the fifth connection terminal 142b are in the same plane. When the power supply module 130, the memory module 110, and the computing module 120 are inserted into the backplane module 140, there is no need for segmented docking, which can support the blind insertion and assembly of the power supply module 130, the memory module 110, and the computing module 120, and reduce poor contact.

[0045] In some embodiments, the first backplane 141 and the second backplane 142 are integrally provided.

[0046] In this embodiment, the first backplane 141 and the second backplane 142 being a whole structure can enable the backplane module 140 to have higher structural rigidity and stability.

[0047] In some embodiments, the first backplane 141 and the second backplane 142 are fixedly installed on the plate-like structure through connecting members.

[0048] Among them, the connecting member is an element for connecting two components together, and the connecting member may include bolts, buckles, rivets, etc.

[0049] In this embodiment, the first backplane 141 and the second backplane 142 are separately manufactured and fixed together through connecting members, which can enable the first backplane 141 and the second backplane 142 to be separately disassembled and replaced, and can increase the maintainability and scalability of the backplane module 140.

[0050] In some embodiments, the backplane module 140 is provided with a ventilation opening 150, and the ventilation opening 150 is spaced apart from the circuit on the backplane module 140.

[0051] Among them, the ventilation opening 150 is a hole-shaped structure provided in the backplane module 140, which is used to promote air circulation so as to achieve heat dissipation.

[0052] In this embodiment, the backplane module 140 is provided with a ventilation opening 150, and the ventilation opening 150 is kept at a certain distance from the circuit on the backplane module 140. While achieving ventilation and heat dissipation, it will not affect the safety and normal operation of the circuit in the backplane module 140.

[0053] In some embodiments, the computing module 120 includes a central processing unit. A plurality of central processing units are arranged in an array along the direction parallel to the backplane module 140 inside the chassis of the server 100. The first number of central processing units are arranged in the width direction of the chassis, and the second number of central processing units are arranged in the height direction of the chassis.

[0054] Among them, the central processing unit is a component that can process computing tasks and perform data processing. The chassis of the server 100 is the outer shell structure of the server 100, which is used to accommodate and protect the power supply module 130, the memory module 110, the computing module 120 and the backplane module 140.

[0055] The width direction of the chassis is the horizontal direction from one side of the chassis to the other side, and the height direction of the chassis is the vertical direction from the top of the chassis to the bottom, which can be measured in units (U).

[0056] For example, when the chassis is placed upright on the desktop and facing the front window, the vertical direction from the top of the chassis to the desktop is the height direction, and the horizontal direction from the left side panel to the right side panel is the width direction.

[0057] The first number and the second number can be set according to the size specification of the chassis.

[0058] In this embodiment, the backplane module 140 is arranged parallel to the front window of the chassis in the chassis. A plurality of central processing units are arranged in an array along the direction parallel to the backplane module 140 inside the chassis of the server 100. The first number of central processing units are arranged in the width direction, and the second number of central processing units are stacked in the height direction of the chassis.

[0059] The row direction of the central processing unit array corresponds to the width direction, and the column direction corresponds to the height direction. For example, if the first number is 2 and the second number is 4, then a plurality of central processing units are arranged in a 4-row 2-column array form, occupying the height space and width space of the chassis.

[0060] In some embodiments, the backplane module 140 includes a first number of backplane units. Each backplane unit includes at least one first backplane 141 and at least two second backplanes 142. At least two second backplanes 142 in the backplane unit are disposed on both sides of the first backplane 141 in the width direction. The backplane unit is connected to a second number of central processing units arranged in the height direction.

[0061] Wherein, the backplane unit is the basic constituent unit of the backplane module 140. Each backplane unit can be the same, and each backplane unit can be arranged in the width direction of the chassis.

[0062] Each backplane unit may include one first backplane 141 and two second backplanes 142, arranged in the width direction, and the two second backplanes 142 are disposed on both sides of the first backplane 141.

[0063] In this embodiment, the backplane module 140 is provided with a plurality of backplane units. One backplane unit is connected to a column of central processing units arranged in the height direction. Ventilation openings 150 can be provided between the backplane units, which is beneficial to heat dissipation.

[0064] In some embodiments, the computing module 120 includes a first number of central processing units, or the computing module 120 includes one central processing unit.

[0065] In this embodiment, when the computing module 120 includes a first number of central processing units, one central processing unit can be arranged in the width direction of the chassis, and a second number of computing modules 120 are arranged in the height direction of the chassis inside the chassis.

[0066] When the computing module 120 includes one central processing unit, the arrangement mode of the plurality of computing modules 120 is the same as that of the plurality of central processing units. The first number of computing modules 120 are arranged in the width direction of the chassis, and the second number of computing modules 120 are arranged in the height direction of the chassis. The computing modules 120 are arranged in an array.

[0067] In some embodiments, the server 100 further includes a heat dissipation module 170.

[0068] The heat dissipation module 170 is connected to the power supply module 130, and the power supply module 130 is used to supply power to the heat dissipation module 170.

[0069] Wherein, the heat dissipation module 170 is a module that can remove the excess heat of each component inside the chassis to the outside of the chassis. The heat dissipation module 170 may include a fan.

[0070] In this embodiment, the heat dissipation module 170 is connected to the power supply module 130, and the power supply module 130 supplies power to the heat dissipation module 170 to enable the heat dissipation module 170 to operate.

[0071] In some embodiments, a first installation cavity is formed between the front window of the chassis of the server 100 and the backplane module 140, and a second installation cavity is formed between the backplane module 140 and the rear window of the chassis. The memory module 110 and multiple computing modules 120 are arranged in the first installation cavity, the heat dissipation module 170 is arranged in the second installation cavity, and a part of the power supply module 130 is arranged in the first installation cavity and another part is arranged in the second installation cavity.

[0072] Among them, the front window is the panel at the front of the chassis, which can be provided with ventilation holes or a mesh structure to promote air circulation. The rear window is the panel at the rear of the chassis, which can also be provided with ventilation holes or a mesh structure to promote air circulation.

[0073] The first installation cavity and the second installation cavity are two spatial regions inside the chassis separated by the backplane module 140. The first installation cavity is between the front window and the backplane module 140, and the second installation cavity is between the backplane module 140 and the rear window.

[0074] In this embodiment, a part of the memory module 110, the computing module 120, and the power supply module 130 can be arranged in the first installation cavity, and another part of the heat dissipation module 170 and the power supply module 130 can be arranged in the second installation cavity. Separating the components for data processing and calculation from the heat dissipation module 170 can reduce the impact on heat dissipation.

[0075] In some embodiments, the power supply module 130 is divided into a first power supply module and a second power supply module. In the first installation cavity, the memory module 110, multiple computing modules 120, and the second power supply module are arranged in sequence along the height direction of the chassis. In the second installation cavity, the first power supply module, the heat dissipation module 170, and the second power supply module are arranged in sequence along the height direction.

[0076] Among them, the first power supply module is the power supply module 130 arranged at the top of the chassis, and the second power supply module is the power supply module 130 arranged at the bottom of the chassis.

[0077] In this embodiment, the height of the chassis can be 8U. In the first installation cavity, the memory module 110 is arranged in the topmost 3U, multiple computing modules 120 are arranged in the 4U below the memory module 110, and the second power supply module is arranged in the bottommost 1U.

[0078] In the second installation cavity, the first power supply module is arranged in the topmost 1U, the heat dissipation module 170 is arranged in the middle 6U, and the second power supply module is arranged in the bottommost 1U.

[0079] In some embodiments, the first power supply module is connected to the memory module 110 through the first printed wire of the first backplane 141, and the second power supply module is connected to multiple computing modules 120 through the second printed wire of the first backplane 141. The first printed wire and the second printed wire are not connected.

[0080] Among them, the first printed wire is the printed wire connecting the first power module and the memory module 110, and the second printed wire is the printed wire connecting the second power module and the computing module 120.

[0081] In this embodiment, the first power module located at the top of the chassis is close to the memory module 110. The first power module is connected to the memory module 110 through the first printed wire to form a power plane. The second power module located at the bottom of the chassis is close to the multiple computing modules 120. The second power module is connected to the multiple computing modules 120 through the second printed wire to form another power plane.

[0082] In this embodiment, the design of multiple power planes can enable each component in the server 100 to support brute-force hot plugging or more reliable notification-based hot plugging.

[0083] In some embodiments, the multiple computing modules 120 occupy a second number of unit heights in the chassis. The first backplane 141 may include a second number of second sub-printed wires. The second power module is connected to the computing module 120 in each unit height through each second sub-printed wire in the first backplane 141, and the second sub-printed wires are not connected to each other.

[0084] Among them, the unit height may be 1U. The multiple computing modules 120 occupy a height of a second number of U in the chassis. The computing module 120 in one unit height is connected to a third connection terminal 141c.

[0085] In this embodiment, the second power module is connected to the computing module 120 in the corresponding unit height through the second sub-printed wire between the first connection terminal 141a and the third connection terminal 141c to form a power plane.

[0086] In this embodiment, further dividing the power planes corresponding to the multiple computing modules 120 can further enhance the ability of the computing modules 120 in the server 100 to support brute-force hot plugging.

[0087] In some embodiments, the power module 130 is disposed on the power board 160, and the power board 160 is detachably disposed inside the chassis of the server 100.

[0088] Among them, the power board 160 is a structure that can install and fix the power module 130. The power module 130 may include multiple power supplies. The multiple power supplies are disposed on the power board 160, with a high degree of integration. The power board 160 can be conveniently inserted into or pulled out of the chassis, facilitating maintenance and upgrade.

[0089] In some embodiments, the power module 130 includes a main power supply 131 and a backup power supply 132.

[0090] Among them, the main power supply 131 is a power supply that provides stable power supply for each component in the server 100 when the server 100 is operating normally, and the backup power supply 132 is a power supply for auxiliary power supply.

[0091] In this embodiment, the backup power supply 132 can take over the power supply task of the main power supply 131 when the main power supply 131 fails or loses power, so that the server 100 will not suddenly lose power, thereby reducing the probability of data loss or hardware damage.

[0092] In some embodiments, the server 100 supports the Compute Express Link protocol.

[0093] Among them, the Compute Express Link (CXL) protocol is a high-speed interconnection protocol.

[0094] In this embodiment, the server 100 supports the Compute Express Link protocol, which can enable fast and reliable data transmission between different components inside the server 100.

[0095] A specific embodiment of the server 100 is introduced below.

[0096] In this embodiment, the server 100 can be a memory all-in-one machine, or a multi-node all-in-one machine, including a memory module 110, multiple computing modules 120, a power supply module 130, a backplane module 140, and a heat dissipation module 170. The memory module 110 can be called a memory node, and the computing module 120 can be called a computing node.

[0097] Among them, the heat dissipation module 170 can be a fan. The power supply module 130 is arranged on the power supply board 160. The power supply module 130 can include a main power supply 131 and a backup power supply 132. The power supply board 160 can be a Power Distribution Board (PDB), the main power supply 131 can be a Power Supply Unit (PSU), and the backup power supply 132 can be a Battery Backup Unit (BBU).

[0098] The backplane module 140 includes a first backplane 141 and a second backplane 142. The circuit in the first backplane 141 is a printed wire, and the circuit in the second backplane 142 is a cable 142c.

[0099] In this embodiment, the chassis of the server 100 is a standard 8U 19-inch chassis. The inside of the chassis is divided into a first installation cavity and a second installation cavity by the backplane module 140. The top 3U in the first installation cavity is the memory module 110.

[0100] Below the memory module 110, there are multiple computing modules 120 in 4U. Among them, each 1U is adapted to one full-width computing module 120 or two half-width computing modules 120. When using the half-width computing module 120, that is, the half-width computing node, with the chassis placed normally facing the front window as the reference, from left to right and from top to bottom are defined as computing node 0 and computing node 1, computing node 2 and computing node 3, computing node 4 and computing node 5, computing node 6 and computing node 7. When using the full-width computing module 120, that is, the full-width computing node, from top to bottom are computing nodes 0 - 3.

[0101] In the bottom 1U, four BBUs are arranged in parallel.

[0102] In this embodiment, in the middle 6U of the second installation cavity is the heat dissipation module 170 to ensure the heat dissipation requirements of the server 100. In the top 1U and the bottom 1U, four standard 185mm common redundant power supplies (CRPS) are each arranged, with a total of eight PSUs to achieve redundant power supply. In the bottom 1U, another BBU is arranged to synchronously achieve backup power supply with the four BBUs in the first installation cavity.

[0103] In this embodiment, the backplane module 140 includes two first backplanes 141 and four second backplanes 142. Among them, the first backplane 141 is respectively connected to the upper power board and the lower power board for power supply interconnection, so that eight PSUs achieve parallel redundant power supply. The first backplane 141 is also interconnected with the computing module 120, the memory module 110, and the heat dissipation module 170 to enable low-speed signal interconnection and to supply power to each node.

[0104] As Figure 4 shown, the first backplane 141 may include two first connection terminals 141a, upper and lower. The two first connection terminals 141a are respectively connected to the power board 160 at the top of the chassis and the power board 160 at the bottom of the chassis. The first connection terminals 141a include multiple power pins and first signal pins for connecting multiple power supplies in the power board 160 to supply power to different nodes, connecting the power management signal to the first backplane 141, and further connecting to the computing module 120 or the memory module 110 for power management.

[0105] The second connection terminal 141b of the first backplane 141 is connected to the memory module 110. The second connection terminal 141b includes multiple power pins and first signal pins for connecting the power input of the memory module 110 to supply power to the memory module 110, connecting the power management signal, and realizing overall management through the management chip of the memory module 110.

[0106] The first backplane 141 includes a plurality of third connection terminals 141c, which are connected to the computing module 120. When the system configures the half-width computing module 120, from top to bottom, it is sequentially connected to computing node 0, computing node 2, computing node 4, and computing node 6. When the system configures the full-width computing module 120, it is sequentially connected to computing node 0, computing node 1, computing node 2, and computing node 3. The third connection terminals 141c include a plurality of power pins and first signal pins, which are used to connect the power input of the computing module 120 to supply power to the computing module 120. When the connection terminals are in place, the Inter-Integrated Circuit (I2C) bus realizes real-time communication such as nodes and power supply. While ensuring good power supply, the first backplane 141 realizes the maximum opening to reduce the influence of the backplane design in the vertical direction on the system wind resistance.

[0107] As Figure 5 shown, the second backplane 142 includes four fourth connection terminals 142a and four fifth connection terminals 142b. Each connection terminal is fixed to the architecture casting by means of screw locking to realize the blind plug function of the cable 142c to the computing module 120 and the memory module 110. Through structural design such as guide grooves, buckles, and anti-fooling interfaces, the connection of the cable 142c to the node can be completed quickly and accurately. There are four cables 142c in the second backplane 142, and each cable 142c supports a group of 16-channel Peripheral Component Interconnect Express (PCIE) high-speed signal interconnection.

[0108] When the system configures the half-width computing module 120, the memory module 110 is connected to two computing modules 120 through a cable 142c between a fourth connection terminal 142a and a fifth connection terminal 142b.

[0109] As Figure 7 shown, the server 100 configures eight main power supplies 131 to output transmission information 1, transmission information 2, and transmission information 3. Among them, transmission information 1 is used for the management of the main power supply 131, transmission information 2 provides power for the computing module 120, and transmission information 3 provides power for the memory module 110 and the heat dissipation module 170. Transmission information 2 and transmission information 3 correspond to two power planes. In the power supply board 160, the power supply of the computing module 120 is further divided into four power planes and connected to the first backplane 141, corresponding to transmission information 4, transmission information 5, transmission information 6, and transmission information 7.

[0110] Server 100 is configured with five backup power supplies 132. The backup power supplies 132 transmit and receive transmission information 8, transmission information 3, transmission information 4, transmission information 5, transmission information 6, and transmission information 7. Among them, transmission information 8 is used for the management of the backup power supplies 132, and transmission information 3 - transmission information 7 are respectively connected to the above five power planes to supply power to the computing module 120, the memory module 110, and the heat dissipation module 170.

[0111] Meanwhile, each full-width computing module 120 or two half-width computing modules 120 share a power plane through the first backplane 141. In terms of high-speed signals, taking the half-width computing module 120 as an example, each computing module 120 outputs two groups of 16-channel PCIE (PCIEx16) high-speed signals to be connected to the second backplane 142. The high-speed signals are connected to the memory module 110 through the second backplane 142 for memory expansion, corresponding to transmission information 9.

[0112] Each computing module 120 is simultaneously connected to some low-speed signals, corresponding to transmission information 10, including but not limited to a group of I2C for the management of the computing module 120, node presence, power module 130 presence, and alarm signals.

[0113] The memory module 110 is connected to the corresponding power plane through the first backplane 141 to obtain power supply, and at the same time, it connects the low-speed management signals to the first backplane 141, corresponding to transmission information 11. The signals include but not limited to node management signals, management signals of the heat dissipation module 170, and management signals of the power module 130.

[0114] The heat dissipation module 170 can obtain power supply by connecting to the corresponding power plane through the first backplane 141, and realizes the management of the heat dissipation module 170 through the connection of low-speed signals, corresponding to transmission information 12.

[0115] In this embodiment, during normal operation, the heat dissipation module 170 takes power from the first power module. When the backup power supplies, it takes power from the second power module, and is transmitted to the first power module through the first backplane 141, and then supplies power to the heat dissipation module 170.

[0116] As Figure 6 shown, the backplane module 140 includes two first backplanes 141 and four second backplanes 142. The first backplane 141 and the second backplane 142 are both fixed to the plate-like structure by screwing, so that each connection terminal is in the same vertical plane, supporting the blind insertion and assembly of the memory module 110 and the computing module 120.

[0117] There are multiple ventilation openings 150 in the backplane module 140 for ventilation and heat dissipation.

[0118] The backplane module 140 is designed to support sharing a power plane within a 1U chassis for one memory module 110 and two first backplanes 141, achieving a compatibility design for the all-in-one machine to support up to four full-width computing modules 120 or eight half-width computing modules 120 and two first backplanes 141. A full-width computing module 120 has two CPUs in one computing module 120, and a half-width computing module 120 has one CPU in one computing module 120.

[0119] It supports two standard PCIe x16 links per CPU to connect to the memory module 110 for memory expansion, supports efficient power supply for the memory module 110 and the computing module 120, and supports I2C and low-speed signal interconnection among the memory module 110, the computing module 120, the PSU, the heat dissipation module 170, and the BBU for system power management and fan speed regulation, etc.

[0120] In this embodiment, the server 100 supports the CXL protocol. Through a multi-level switch architecture and resource pool technology, multiple devices can share memory and achieve dynamic combination, improving resource utilization.

[0121] In this embodiment, high-speed signals are connected through the cable 142c. The professional high-speed cable 142c can use low-loss media, with better loss control at high frequencies. Compared with transmission through printed circuits, signal integrity is more controllable.

[0122] Connecting high-speed signals through the cable 142c can occupy less vertical plane space, greatly increasing the opening rate of the backplane module 140, resulting in lower air resistance and better heat dissipation effect inside the chassis.

[0123] In the backplane module 140, high-speed signals, low-speed signals, and power connections are all achieved through board-to-board blind plugging, making the assembly of the computing module 120 and the memory module 110 of the server 100 simpler, improving assembly efficiency and operation and maintenance efficiency, and reducing labor costs.

[0124] The first backplane 141 and the power board 160 are interconnected using a multi-connection terminal and multi-power plane design, enabling the computing module 120 to support compatibility with half-width nodes or full-width nodes within 1U, and making the adapter components more flexible in the face of more application scenarios.

[0125] The first backplane 141 and the power board 160 are interconnected using a multi-connection terminal and multi-power plane design, enabling each component in the server 100 to support forced hot plugging or notification-based hot plugging, improving operation and maintenance reliability.

[0126] The server 100 provided in the embodiment of this application can reduce assembly difficulty and cost by reasonably allocating the interconnection methods of high-speed signals, low-speed signals, and power. At the same time, it maximizes the opening rate of the backplane module 140 and improves heat exchange efficiency.

[0127] The terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of this application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally means that the associated objects before and after are in an "or" relationship.

[0128] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0129] In the description of this application, the "first feature", "second feature" may include one or more of such features.

[0130] In the description of this application, the meaning of "a plurality" is two or more.

[0131] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween.

[0132] In the description of this application, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature.

[0133] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0134] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

[0135] The above has introduced in detail a server 100 provided by the present application. Specific examples are used herein to illustrate the principles and implementation manners of the present application. The description of the above embodiments is only for helping to understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the technical field, several improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A server, characterized in that, Including: A memory module, a plurality of computing modules, a power supply module, and a backplane module; The backplane module includes a first backplane and a second backplane. The power supply module is connected to the memory module and the plurality of computing modules through the printed conductors of the first backplane, and the memory module is connected to the plurality of computing modules through the cables of the second backplane; The speed of signal transmission through the cables is greater than the speed of signal transmission through the printed conductors.

2. The server according to claim 1, characterized in that, The first backplane and the second backplane are disposed on the same plate-like structure, so that the respective connection terminals of the first backplane and the second backplane are in the same plane. The memory module, the plurality of computing modules, and the power supply module are assembled to the first backplane and / or the second backplane through the connection terminals.

3. The server according to claim 2, wherein The first backplane and the second backplane are integrally provided.

4. The server according to claim 2, wherein The first backplane and the second backplane are fixedly installed on the plate-like structure through connectors.

5. The server according to claim 1, wherein The backplane module is provided with ventilation openings, and the ventilation openings are spaced apart from the circuits on the backplane module.

6. The server according to claim 1, characterized in that The computing module includes a central processing unit. A plurality of the central processing units are arranged in an array along a direction parallel to the backplane module inside the chassis of the server. A first number of the central processing units are arranged in the width direction of the chassis, and a second number of the central processing units are arranged in the height direction of the chassis.

7. The server according to claim 6, wherein The backplane module includes the first number of backplane units. Each backplane unit includes at least one of the first backplane and at least two of the second backplanes. At least two of the second backplanes in the backplane unit are disposed on both sides of the first backplane in the width direction. The backplane unit is connected to the second number of the central processing units arranged in the height direction.

8. The server according to claim 6, wherein The computing module includes the first number of the central processing units, or the computing module includes one central processing unit.

9. The server according to any one of claims 1-8, characterized in that, Further including: A heat dissipation module. The heat dissipation module is connected to the power supply module, and the power supply module is used to supply power to the heat dissipation module.

10. The server according to claim 9, characterized in that A first installation cavity is formed between the front window of the chassis of the server and the backplane module, and a second installation cavity is formed between the backplane module and the rear window of the chassis. The memory module and the plurality of computing modules are disposed in the first installation cavity, the heat dissipation module is disposed in the second installation cavity, and a part of the power supply module is disposed in the first installation cavity and another part is disposed in the second installation cavity.

11. The server according to claim 10, wherein The power supply module is divided into a first power supply module and a second power supply module. In the first installation cavity, the memory module, the plurality of computing modules, and the second power supply module are arranged in sequence along the height direction of the chassis. In the second installation cavity, the first power supply module, the heat dissipation module, and the second power supply module are arranged in sequence along the height direction.

12. The server according to claim 11, wherein The first power supply module is connected to the memory module through the first printed conductors of the first backplane, and the second power supply module is connected to the plurality of computing modules through the second printed conductors of the first backplane. The first printed conductors and the second printed conductors are not connected.

13. The server according to any one of claims 1-8, characterized in that, The power supply module is disposed on a power supply board, and the power supply board is detachably disposed inside the chassis of the server.

14. The server according to any one of claims 1-8, characterized in that, The power supply module includes a main power supply and a backup power supply.

15. The server according to any one of claims 1-8, characterized in that, The server supports the Compute Express Link protocol.

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