Heat pipe assembly and manufacturing method thereof
By using a fill layer in the heat pipe assembly to fill the gap and weld it with the heat pipe, the high temperature problem caused by the heat pipe structure gap is solved, which improves the heat dissipation efficiency and reduces the thermal resistance.
Patent Information
- Application Number
- CN202410072408.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-18
- Publication Date
- 2025-07-18
AI Technical Summary
The existing heat pipe structure has gaps or depressions on the graphics card, resulting in high temperatures and additional welding of copper sheets increases thermal resistance and cost.
The combined structure of a plurality of heat pipes and fill layers is adopted to fill the gap between the heat pipes through the filling layer, and the filling layer and the heat pipes are welded by high-temperature heating to form a closely fit heat dissipation part.
It improves the heat dissipation efficiency of the heat pipe assembly, improves the temperature inhomogeneity of the graphics card, reduces thermal resistance and simplifies process steps.
Smart Images
Figure CN120335569A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a heat dissipation device, and particularly to a heat pipe assembly and a manufacturing method thereof. Background Art
[0002] Most of the existing heat pipe structures applied to graphics cards adopt a rolling process. After welding multiple adjacent heat pipes, rolling is carried out to increase the flatness of the heat pipe structure, which is beneficial to improving the heat dissipation efficiency. However, there will still be gaps or depressions between the rolled heat pipe structures, resulting in the disadvantage of poor fitting of the heat pipe structure. When the existing heat pipe structure contacts the graphics card, the gaps or depressions of the heat pipe structure do not contact the graphics card, causing the temperature at specific positions of the graphics card to be too high, which is not conducive to the operation of the graphics card.
[0003] The existing solution is to additionally weld copper sheets at the gaps or depressions, but the copper sheets will also increase the thermal resistance, resulting in a reduction in the computing performance of the graphics card. In addition, welding additional copper sheets will also increase the cost and process steps. Therefore, developing a heat pipe structure that can solve the problem of too high temperature and has a simple process has become the primary problem to be solved at present. Summary of the Invention
[0004] The purpose of the present invention is to provide a heat pipe assembly and a manufacturing method thereof, which combine a heat pipe and a filling layer, and fill the gaps between the heat pipes through the filling layer to improve the overall heat dissipation efficiency of the heat pipe assembly.
[0005] The heat pipe assembly of the present invention includes a plurality of heat pipes and a plurality of filling layers. The plurality of heat pipes are arranged in parallel, and each heat pipe has a support surface and a bending surface. The plurality of support surfaces together form a heat dissipation part. The plurality of filling layers are respectively arranged between the corresponding plurality of heat pipes. A heat source is adapted to be in surface contact with the heat dissipation part and the plurality of filling layers.
[0006] The manufacturing method of the heat pipe assembly of the present invention includes: arranging a plurality of heat pipes in parallel; rolling the plurality of heat pipes to form a plurality of support surfaces; filling the plurality of filling layers into the plurality of gaps between the plurality of heat pipes; heating the plurality of heat pipes and the plurality of filling layers at a high temperature to melt the plurality of filling layers and weld the plurality of heat pipes; performing a milling process on the plurality of filling layers to make the plurality of filling layers flush with the plurality of support surfaces.
[0007] The manufacturing method of the heat pipe assembly of the present invention includes: arranging a plurality of heat pipes in parallel; arranging the plurality of filling layers on an outer surface of each heat pipe; installing a jig to cover the plurality of filling layers and the plurality of heat pipes; heating the plurality of filling layers at a high temperature to melt the plurality of filling layers and weld the plurality of heat pipes; removing the jig after the plurality of filling layers solidify, and the plurality of filling layers form a rectangular appearance.
[0008] Based on the above, for the heat pipe assembly of the present invention, multiple heat pipes are arranged parallel to each other. Then, multiple filling layers are disposed on the multiple heat pipes to fill the gaps and depressions between the multiple heat pipes, and the multiple filling layers are flush with the supporting surfaces of the multiple heat pipes. When the heat pipe assembly contacts the heat source, the multiple filling layers and the multiple supporting surfaces of the heat pipe assembly will closely adhere to the heat source, thereby improving the heat dissipation efficiency of the heat pipe assembly. Compared with the existing heat pipe structure with gaps, it can improve the drawback that the temperature of the heat source is relatively high at the corresponding gap positions. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1A FIG. is a perspective schematic view of a heat pipe assembly combined with a heat sink fin and a heat source according to an embodiment of the present invention.
[0010] Figure 1B is Figure 1A a perspective schematic view of the heat pipe assembly.
[0011] Figure 1C is Figure 1B a cross-sectional schematic view of the heat pipe assembly.
[0012] Figure 2 is Figure 1A a flowchart of the manufacturing process of the heat pipe assembly.
[0013] Figure 3A FIG. is a perspective schematic view of a heat pipe assembly according to another embodiment of the present invention.
[0014] Figure 3B is Figure 3A a plan schematic view of the heat pipe assembly combined with a jig.
[0015] Figure 3C is Figure 3A a partial cross-sectional schematic view of the heat pipe assembly combined with a heat source.
[0016] Figure 4 is Figure 3A a flowchart of the manufacturing process of the heat pipe assembly.
[0017] The reference numerals are as follows:
[0018] 100, 100A: Heat pipe assemblies
[0019] 110, 110a: Heat pipes
[0020] 120, 120a: Filling layers
[0021] 200: Heat dissipation base
[0022] 300: Heat sink fins
[0023] 400: Heat source
[0024] 500: Jig
[0025] CS: Curved surface
[0026] FS: Support surface
[0027] HP: Heat dissipation part
[0028] GP: Gap
[0029] S1 to S6: Steps Detailed implementation mode
[0030] Figure 1A It is a three-dimensional schematic diagram of a heat pipe assembly combined with heat dissipation fins and a heat source according to an embodiment of the present invention.
[0031] Refer to Figure 1A , the heat pipe assembly 100 of the present invention is applicable to connecting a heat sink 200 and a plurality of heat dissipation fins 300, and the heat pipe assembly 100 is used for surface contact with the heat source 400. Additionally, the heat source 400 is, for example, a central processing unit, a graphics chip, or other similar electronic components.
[0032] Figure 1B is Figure 1A a three-dimensional schematic diagram of the heat pipe assembly. Figure 1C is Figure 1B a cross-sectional schematic diagram of the heat pipe assembly.
[0033] Refer to Figure 1B and Figure 1C , the heat pipe assembly 100 of this embodiment includes a plurality of heat pipes 110 and a plurality of filling layers 120. The plurality of heat pipes 110 are arranged in parallel with each other, and each heat pipe 110 has a support surface FS and a curved surface CS relative to the support surface FS. The plurality of support surfaces FS together form a heat dissipation part HP. The plurality of filling layers 120 are respectively disposed between the corresponding plurality of heat pipes 110.
[0034] Specifically, there is a gap GP between adjacent heat pipes 110. Each filling layer 120 is filled in the corresponding gap GP and is flush with the support surfaces FS of the adjacent two heat pipes 110. Further, each filling layer 120 is flush with one end point of the curved surfaces CS of the adjacent two heat pipes 110. Therefore, the filling layer 120 completely fills the gap GP between the adjacent two heat pipes 110. Refer to Figure 1C , each filling layer 120 is closely attached to the inner wall surface of the heat sink 200, which increases the contact area between the heat pipe assembly 100 and the heat sink 200 and is beneficial to improving the heat dissipation efficiency.
[0035] Refer to Figure 1A and Figure 1C, the heat source 400 is adapted to the surface contact heat dissipation part HP and the plurality of filling layers 120, thereby transferring heat to the plurality of heat pipes 110 through the heat dissipation part HP and the plurality of filling layers 120. The heat pipe assembly 100 then conducts the heat to the heat sink 200 and the plurality of heat dissipation fins 300. Finally, the heat sink 200 and the plurality of heat dissipation fins 300 conduct the heat to the air to complete the heat dissipation process.
[0036] Furthermore, the composition of each filling layer 120 includes a metal powder, a solder paste, and a thermal conductive adhesive. In a preferred embodiment, the mixing ratio of each filling layer 120 is 70% metal powder, 20% solder paste, and 10% thermal conductive adhesive.
[0037] Using the metal powder and the solder paste as the materials of the filling layer 120, since the metal powder, the solder paste, and the thermal conductive adhesive all have good thermal conductivity, they can effectively conduct the heat of the plurality of heat pipes 110. In addition, the copper powder, the solder paste, and the thermal conductive adhesive have good fluidity and can fully fit into the gaps GP between the plurality of heat pipes 110.
[0038] In practical applications, the metal powder is copper powder, aluminum powder, or other metal powders with high thermal conductivity.
[0039] Furthermore, the characteristic of the metal powder is high thermal conductivity, and the proportion of the metal powder in the filling layer 120 is the largest to facilitate improving the thermal conductivity of the filling layer 120. The function of the thermal conductive adhesive is to improve the viscosity of the filling layer 120. After the filling layer 120 is filled into the gaps GP of the plurality of heat pipes 110, the filling layer 120 will form a specific shape and is not easy to flow, which is beneficial to the subsequent heating and welding process. The characteristic of the solder paste is low melting point. When heated at a high temperature, the solder paste will melt and thus weld the filling layer 120 and the heat pipe 110.
[0040] The mixing ratio of the metal powder, the solder paste, and the thermal conductive adhesive can be adjusted according to requirements. For example, if the thermal conductivity of the filling layer 120 is pursued, the proportion of the metal powder is increased. If the welding strength between the filling layer 120 and the plurality of heat pipes 110 is to be enhanced, the proportion of the solder paste is increased. If the filling layer 120 is to be easily shaped between the plurality of heat pipes 110, the proportion of the thermal conductive adhesive is increased.
[0041] Figure 2 is Figure 1A a block diagram of the manufacturing process of the heat pipe assembly.
[0042] Refer to Figure 2 , the following describes the manufacturing process of the heat pipe assembly 100 of this embodiment. Step S1, arrange a plurality of heat pipes 110 in parallel (see Figure 1B) Step S2: Roll a plurality of heat pipes 110 arranged in parallel using a tool to form a plurality of support surfaces FS, where each support surface FS presents a flat plate appearance. Step S3: Fill a plurality of filling layers 120 into a plurality of gaps GP between the plurality of heat pipes 110 respectively. Specifically, the filling layer 120 is realized by a dedicated filling device to ensure the uniformity and consistency of the filling layer 120. After filling, appropriate curing treatment is required to enhance the bonding force and stability of the filling material. At this time, step S4 is adopted to heat the plurality of heat pipes 110 and the plurality of filling layers 120 at a high temperature, so that the solder paste in the plurality of filling layers 120 melts and welds the support surfaces FS and the curved surfaces CS of the plurality of heat pipes 110. After the filling layer 120 solidifies, the curing treatment is completed. Step S5: Perform a milling process on the plurality of filling layers 120 to make the plurality of filling layers 120 flush with the plurality of support surfaces FS. Specifically, the plurality of filling layers 120 are milled flat by a computer-aided processing machine to eliminate unevenness or protrusions on the surface of the filling layer 120. After the milling process, the support surfaces FS of the heat pipes 110 and the plurality of filling layers 120 are made smoother and more uniform. Step S6: Perform laser detection to detect the flatness of the plurality of filling layers 120 and the plurality of heat pipes 110.
[0043] Figure 3A is a three-dimensional schematic diagram of a heat pipe assembly according to another embodiment of the present invention. Figure 3B is Figure 3A a plan schematic diagram of a jig for combining a heat pipe assembly. Figure 3C is Figure 3A a partial cross-sectional schematic diagram of a heat pipe assembly combined with a heat source.
[0044] Refer to Figure 3A , the heat pipe assembly 100A of this embodiment is different from Figure 1B the heat pipe assembly 100A shown, the difference being that a plurality of heat pipes 110a are arranged parallel to each other and each heat pipe 110a has a support surface FS and a curved surface CS relative to the support surface FS, and the plurality of support surfaces FS together form a heat dissipation part HP. A plurality of filling layers 120a are respectively arranged around the support surface FS and the curved surface CS of each heat pipe 110a, and the cross-section of the plurality of filling layers 120a presents a rectangular appearance.
[0045] Refer to Figure 3C , specifically, there is a gap GP between adjacent heat pipes 110a, and each filling layer 120a is filled in the corresponding gap GP and is flush with the support surfaces FS and the curved surfaces CS of the adjacent two heat pipes 110.
[0046] Refer to Figure 4 , Figure 3B and Figure 3C , the following describes the manufacturing process of the heat pipe assembly 100A of this embodiment. Step S1: Arrange a plurality of heat pipes 110a in parallel (seeFigure 3A )。 Step S2, dispose a plurality of filling layers 120a on the outer surfaces (including the support surface FS and the curved surface CS) of each heat pipe 110a and respectively fill a plurality of gaps GP between the plurality of heat pipes 110a. Specifically, the filling layer 120a is realized by a dedicated filling device to ensure the uniformity and consistency of the filling layer 120a. Step S3, install a jig 500 to cover the plurality of filling layers 120a and the plurality of heat pipes 110a (see Figure 3B ), the inner wall surface of the jig 500 presses the plurality of filling layers 120a. After the jig 500 is installed, appropriate curing treatment needs to be carried out to enhance the bonding force and stability of the filling material. At this time, adopt Step S4 to heat the plurality of heat pipes 110a and the plurality of filling layers 120a at a high temperature, so that the solder paste in the plurality of filling layers 120a melts and welds the plurality of heat pipes 110a. After the filling layer 120a solidifies, the curing treatment is completed. Step S5, remove the jig 500 after the filling layer 120a solidifies (see Figure 3C ), the plurality of filling layers 120a form a rectangular appearance and jointly constitute a heat dissipation part HP, wherein the heat dissipation part HP is used to contact the heat source 400. Step S6, perform laser detection to detect the flatness of the plurality of filling layers 120a and the plurality of heat pipes 110a.
[0047] In summary, for the heat pipe assembly of the present invention, a plurality of heat pipes are arranged parallel to each other, and then a plurality of filling layers are disposed on the plurality of heat pipes to fill the gaps and depressions between the plurality of heat pipes, and the plurality of filling layers are flush with the support surfaces of the plurality of heat pipes. When the heat pipe assembly contacts the heat source, the plurality of filling layers and the plurality of support surfaces of the heat pipe assembly will closely adhere to the heat source, thereby improving the heat dissipation efficiency of the heat pipe assembly. Compared with the existing heat pipe structure with gaps, it can improve the drawback that the temperature of the heat source is too high at the corresponding gap position.
Claims
1. A heat pipe assembly, characterized in that, Comprising: A plurality of heat pipes, arranged parallel to each other, and each heat pipe has a support surface and a curved surface, wherein, the plurality of support surfaces together form a heat dissipation part; and A plurality of filling layers, respectively disposed between the corresponding plurality of heat pipes, wherein, a heat source is adapted to be in surface contact with the heat dissipation part and the plurality of filling layers.
2. The heat pipe assembly according to claim 1, wherein, The composition of each filling layer includes a metal powder, a solder paste, and a thermal conductive adhesive.
3. The heat pipe assembly according to claim 2, wherein, The mixing ratio of each filling layer is 70% metal powder, 20% solder paste, and 10% thermal conductive adhesive.
4. The heat pipe assembly according to claim 3, wherein, The metal powder is copper powder or aluminum powder.
5. The heat pipe assembly according to claim 1, wherein Each filling layer is flush with the plurality of support surfaces.
6. The heat pipe assembly according to claim 5, characterized in that, Each filling layer is flush with one end point of each curved surface.
7. The heat pipe assembly according to claim 1, wherein, Each filling layer is disposed around the support surface and the curved surface of each heat pipe.
8. The heat pipe assembly according to claim 7, wherein The cross sections of the plurality of filling layers present a rectangular appearance.
9. A manufacturing method of a heat pipe assembly, characterized in that Comprising: Arranging a plurality of heat pipes in parallel; Rolling the plurality of heat pipes to form a plurality of support surfaces; Filling a plurality of filling layers into a plurality of gaps between the plurality of heat pipes; Heating the plurality of heat pipes and the plurality of filling layers at a high temperature, so that the plurality of filling layers melt and weld the plurality of heat pipes; and Performing a milling process on the plurality of filling layers, so that the plurality of filling layers are flush with the plurality of support surfaces.
10. The manufacturing method of the heat pipe assembly according to claim 9, characterized in that, The composition of each filling layer includes a metal powder, a solder paste, and a thermal conductive adhesive.
11. The manufacturing method of the heat pipe assembly according to claim 10, wherein the mixing ratio of each filling layer is 70% metal powder, 20% solder paste, and 10% thermal conductive adhesive.
12. The manufacturing method of the heat pipe assembly according to claim 11, wherein the metal powder is copper powder or aluminum powder.
13. The manufacturing method of the heat pipe assembly according to claim 9, wherein each filling layer is flush with a curved surface of each heat pipe.
14. A manufacturing method of a heat pipe assembly, comprising: Arranging a plurality of heat pipes in parallel; Disposing a plurality of filling layers on an outer surface of the plurality of heat pipes; Installing a jig to cover the plurality of filling layers and the plurality of heat pipes; Heating the plurality of filling layers at a high temperature, so that the plurality of filling layers melt and weld the plurality of heat pipes; and After the plurality of filling layers solidify, removing the jig, and the plurality of filling layers form a rectangular appearance.