A temperature intelligent management method and system for integrated circuits

Abstract

The application discloses a temperature intelligent management method and system of an integrated circuit, which is used for different temperature control of different functional modules in different regions, improves the heat distribution uniformity inside the integrated circuit, and reduces aging caused by uneven heat. The method comprises the following steps: acquiring temperature measurement point data of multiple different positions of a to-be-tested chip; calculating temperature value variation rates of multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determining a high dynamic hot spot region set in combination with a preset threshold; calculating temperature gradient values of each high dynamic hot spot region and an adjacent region by using spatial heterogeneity to generate a heat distribution path; controlling a heat dissipation device to perform a heat transfer action based on the heat distribution path, and calculating a heat transfer index of each high dynamic hot spot region; determining a high dynamic hot spot region with an unqualified heat transfer index as a target region; and adjusting parameters of functional modules in the target region to adjust the heat generation of the functional modules.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and in particular to a method and system for intelligent temperature management of integrated circuits. Background Technology

[0002] An integrated circuit (IC) is a miniature electronic device or component. It integrates numerous electronic components, such as transistors, resistors, and capacitors, onto a tiny semiconductor chip using semiconductor manufacturing processes, forming an electronic circuit system with a specific function. An IC can be a single functional module or a combination of multiple functional modules to achieve more complex electronic functions. As a core pillar of modern electronic technology, the performance and reliability of ICs directly determine the lifeline of the information industry. With the continuous increase in chip integration and the dramatic increase in power consumption density, thermal management has become a key bottleneck affecting the lifespan and operating efficiency of ICs. Effective temperature control is not only a necessary condition for improving chip performance but also an indispensable foundation for ensuring stable system operation. However, existing thermal management typically relies on global cooling methods, such as air cooling or liquid cooling. However, when the number of functional modules integrated into the chip is large and their operating temperatures vary significantly, global cooling methods cannot dynamically adjust for different areas, leading to uneven heat distribution within the IC and thus accelerating its aging. Summary of the Invention

[0003] This application provides a method and system for intelligent temperature management of integrated circuits, which is used to perform different temperature control on functional modules in different areas, improve the uniformity of heat distribution inside the integrated circuit, and reduce aging caused by uneven heat distribution.

[0004] The first aspect of this application provides a method for intelligent temperature management of integrated circuits, including:

[0005] Acquire temperature measurement data at multiple different locations of the chip under test. The temperature measurement data includes the temperature value and spatial coordinates of different temperature measurement points.

[0006] The rate of change of temperature values ​​at the multiple different temperature measuring points within a preset time period is calculated based on the temperature measuring point data, and a set of high dynamic hotspot areas is determined in combination with a preset threshold.

[0007] Based on each grid point and the regional center point of the high dynamic hot spot region set, the distance and temperature difference between the two are calculated using spatial heterogeneity. The quotient of the distance and temperature difference is determined as the temperature gradient value. The heat flux density vector is calculated by combining Fourier's law and the temperature gradient value to determine the heat distribution path.

[0008] Based on the heat distribution path, the heat dissipation equipment is controlled to perform heat transfer actions, and the heat transfer index of each high dynamic hot spot area is calculated.

[0009] The high dynamic hotspot areas where the heat transfer index did not meet the standard were identified as the target areas;

[0010] The parameters of the functional modules within the target area are adjusted to regulate the heat generation of the functional modules.

[0011] Optionally, the step of calculating the rate of change of temperature values ​​at multiple different temperature measuring points within a preset time period based on the temperature measuring point data, and determining a set of high-dynamic hotspot areas in combination with a preset threshold, includes:

[0012] Determine whether the temperature value at each temperature measuring point is greater than the temperature threshold.

[0013] If so, then a set of potential hotspot regions is generated based on the spatial coordinates corresponding to the temperature measurement points;

[0014] Calculate the rate of change of temperature values ​​in each potential hotspot area over a preset time period;

[0015] Potential hotspot regions with a temperature change rate greater than a preset threshold are identified as high-dynamic hotspot regions, thus obtaining a set of high-dynamic hotspot regions.

[0016] Optionally, the step of calculating the distance and temperature difference between each grid point and the regional center point of the high-dynamic hotspot region set using spatial heterogeneity, determining the quotient of the distance and temperature difference as the temperature gradient value, and calculating the heat flux density vector by combining Fourier's law and the temperature gradient value to determine the heat distribution path includes:

[0017] Several adjacent regions adjacent to the highly dynamic hotspot regions are selected as analysis windows;

[0018] Within the analysis window, calculate the distance and temperature difference between each grid point and the center point of the high dynamic hotspot region, and determine the temperature gradient value as the quotient of the temperature difference and the distance.

[0019] The heat flux density vector is calculated based on the temperature gradient value and Fourier's law.

[0020] The heat distribution path is determined based on the heat flux density vector.

[0021] Optionally, controlling the heat dissipation device to perform heat transfer actions based on the heat distribution path includes:

[0022] Generate heat transfer instructions based on the heat distribution path;

[0023] Send the heat transfer command to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer command.

[0024] Optionally, the calculation of the heat transfer index for each high-dynamic hotspot region includes:

[0025] Determine the total heat generation of each high-dynamic hotspot area;

[0026] Calculate the heat dissipation of each high-dynamic hotspot area along the corresponding heat distribution path;

[0027] The heat transfer index is calculated based on the total heat generation and the heat dissipation, combined with a heat extraction rate algorithm.

[0028] Optionally, the heat transfer index includes heat extraction rate, heat flux, and heat transfer efficiency.

[0029] A second aspect of this application provides an integrated circuit-based intelligent temperature management system, comprising:

[0030] The acquisition unit is used to acquire temperature measurement data at multiple different locations of the chip under test. The temperature measurement data includes the temperature value and spatial coordinates of different temperature measurement points.

[0031] The first calculation unit is used to calculate the rate of change of temperature values ​​of the multiple different temperature measuring points within a preset time based on the temperature measuring point data, and to determine the set of high dynamic hotspot areas in combination with a preset threshold.

[0032] The second calculation unit is used to calculate the distance and temperature difference between each grid point and the regional center point of the high dynamic hot spot region set based on spatial heterogeneity, determine the quotient of the distance and temperature difference as the temperature gradient value, and calculate the heat flux density vector by combining Fourier's law and the temperature gradient value to determine the heat distribution path.

[0033] The control unit is used to control the heat dissipation device to perform heat transfer actions based on the heat distribution path, and to calculate the heat transfer index of each high dynamic hot spot area;

[0034] The determination unit is used to determine the high dynamic hotspot area where the heat transfer index does not meet the standard as the target area;

[0035] An adjustment unit is used to adjust the parameters of the functional modules within the target area to regulate the heat generation of the functional modules.

[0036] Optionally, the first computing unit is specifically used for:

[0037] Determine whether the temperature value at each temperature measuring point is greater than the temperature threshold.

[0038] If so, then a set of potential hotspot regions is generated based on the spatial coordinates corresponding to the temperature measurement points;

[0039] Calculate the rate of change of temperature values ​​in each potential hotspot area over a preset time period;

[0040] Potential hotspot regions with a temperature change rate greater than a preset threshold are identified as high-dynamic hotspot regions, thus obtaining a set of high-dynamic hotspot regions.

[0041] Optionally, the second computing unit is specifically used for:

[0042] Several adjacent regions adjacent to the highly dynamic hotspot regions are selected as analysis windows;

[0043] Within the analysis window, calculate the distance and temperature difference between each grid point and the center point of the high dynamic hotspot region, and determine the temperature gradient value as the quotient of the temperature difference and the distance.

[0044] The heat flux density vector is calculated based on the temperature gradient value and Fourier's law.

[0045] The heat distribution path is determined based on the heat flux density vector.

[0046] Optionally, the control unit is specifically used for:

[0047] Generate heat transfer instructions based on the heat distribution path;

[0048] Send the heat transfer command to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer command.

[0049] As can be seen from the above technical solutions, this application has the following effects:

[0050] First, temperature measurement data from multiple locations on the chip under test is acquired, including temperature values ​​and spatial coordinates. Then, the rate of temperature change at these measurement points over a preset time period is calculated, and a set of high-dynamic hotspot regions is determined based on a preset threshold. Next, spatial heterogeneity is utilized to calculate the temperature gradient between each high-dynamic hotspot region and its adjacent regions, generating heat distribution paths. Further, heat transfer is controlled based on these paths, and the heat transfer index for each high-dynamic hotspot region is calculated. High-dynamic hotspot regions with substandard heat transfer indices are then identified as target regions. Finally, parameters of functional modules within the target regions are adjusted to regulate their heat generation. This allows for real-time monitoring of high-dynamic hotspot regions and the acquisition of heat distribution paths to achieve heat transfer between different regions, thus enabling initial temperature control of different functional modules. When heat transfer relying on heat distribution paths is insufficient to meet cooling requirements, further temperature control can be achieved by adjusting the parameters of each functional module within the target region to alter their heat generation. This allows for different temperature controls on functional modules in different areas, improving the uniformity of heat distribution within the integrated circuit and reducing aging caused by uneven heat distribution. Attached Figure Description

[0051] Figure 1 This is a schematic diagram of an embodiment of an intelligent temperature management method for an integrated circuit according to this application;

[0052] Figure 2-1 and Figure 2-2 This is a schematic diagram of another embodiment of the intelligent temperature management method for an integrated circuit in this application;

[0053] Figure 3 This is a schematic diagram of an embodiment of an integrated circuit temperature intelligent management system according to this application. Detailed Implementation

[0054] This application provides a method and system for intelligent temperature management of integrated circuits, which is used to perform different temperature control on functional modules in different areas, improve the uniformity of heat distribution inside the integrated circuit, and reduce aging caused by uneven heat distribution.

[0055] The implementation described in this application is applicable to systems or servers. Please refer to [link / reference]. Figure 1 As shown, one embodiment of the integrated circuit temperature intelligent management method in this application includes:

[0056] 101. Obtain temperature measurement data at multiple different locations on the chip under test. This temperature measurement data includes the temperature value and spatial coordinates of different temperature measurement points.

[0057] An integrated circuit (IC) is a miniature electronic device or component that integrates numerous electronic components, such as transistors, resistors, and capacitors, onto a tiny semiconductor chip using semiconductor manufacturing processes, forming an electronic circuit system with a specific function. An IC can be a single functional module or a combination of multiple functional modules to achieve more complex electronic functions. A chip, on the other hand, typically refers to the carrier of an IC; it is a thin film made of semiconductor material on which a large number of electronic components and circuits are integrated. A chip is the physical manifestation of an IC; it is a concrete object that can be mounted on a circuit board and, together with other electronic components, constitutes a complete electronic device.

[0058] In this embodiment, the chip under test (DUT) has multiple functional modules of different types arranged on it. Therefore, temperature sensors are placed at multiple different locations on the DUT to obtain temperature values ​​at multiple temperature measurement points. Simultaneously, position sensors are placed near the temperature measurement points to detect the real-time position of the temperature measurement points or the temperature sensors themselves, thus obtaining the spatial coordinates of the temperature measurement points. By rationally arranging the temperature and position sensors, the temperature distribution and spatial location of each functional module of the chip can be comprehensively and accurately monitored. For example, temperature and position sensors can be placed in critical locations such as the core area of ​​the DUT or near functional modules that are prone to heat generation.

[0059] 102. Calculate the rate of change of temperature values ​​at multiple different temperature measurement points within a preset time based on the temperature measurement data, and determine the set of high dynamic hotspot areas in combination with the preset threshold.

[0060] In this embodiment, the rate of temperature change reflects the speed of temperature change at each temperature measuring point. By analyzing the rate of temperature change, it is possible to determine which areas experience more drastic temperature changes. A preset threshold is then set to filter out areas with drastic temperature changes as high-dynamic hotspot areas. This preset threshold can be set based on factors such as the type of chip under test, performance requirements, and the actual application scenario. When the rate of temperature change at a certain temperature measuring point exceeds the preset threshold, the area where that temperature measuring point is located can be identified as a high-dynamic hotspot area.

[0061] 103. Based on each grid point and the regional center point of the high dynamic hot spot region set, the distance and temperature difference between the two are calculated using spatial heterogeneity. The quotient of the distance and temperature difference is determined as the temperature gradient value. The heat flux density vector is calculated by combining Fourier's law and the temperature gradient value to determine the heat distribution path.

[0062] Spatial heterogeneity refers to the phenomenon that ecosystems, environmental elements, or other related variables differ at different locations within a specific spatial range. Spatial heterogeneity emphasizes spatial non-uniformity and variability. In ecology, it manifests in various aspects, such as variations in the composition of biological communities, species distribution, soil properties, and climatic conditions at different locations. This heterogeneity is a fundamental characteristic of natural ecosystems, significantly impacting ecological processes and biodiversity. In this embodiment, spatial heterogeneity can be used to visualize the temperature gradient distribution results in map form. Different colors, symbols, or contour lines can be used to represent the magnitude and trend of temperature gradients, allowing for a more intuitive observation of the temperature gradient distribution characteristics between hotspot areas and adjacent areas. For example, red indicates areas with larger temperature gradients, and blue indicates areas with smaller temperature gradients. Based on the specific temperature gradient values, the heat transfer path from highly dynamic hotspot areas to adjacent low-temperature areas can be determined, thereby identifying the heat distribution path for each highly dynamic hotspot area.

[0063] 104. Control the heat dissipation equipment to perform heat transfer actions based on the heat distribution path, and calculate the heat transfer index of each high dynamic hot spot area;

[0064] In this embodiment, the heat dissipation device may include heat sinks, fans, heat pipes, etc. By adjusting the operating parameters of the heat dissipation device, such as fan speed and heat sink efficiency, heat is guided to transfer along the heat distribution path. During the heat transfer process, the heat transfer index of each high-dynamic hot spot area is calculated. The heat transfer index reflects the efficiency of heat transfer from the high-dynamic hot spot area, and its calculation method can comprehensively consider factors such as temperature changes and time.

[0065] 105. Identify high-dynamic hotspot areas where the heat transfer index does not meet the standard as target areas;

[0066] In this embodiment, a heat transfer standard is set according to the actual heat dissipation requirements of the integrated circuit. After obtaining the heat transfer index, the heat transfer index is compared with the heat transfer standard. If the heat transfer index is less than the heat transfer standard, it means that the heat transfer index has not met the standard, and the heat transfer efficiency of the corresponding high dynamic hot spot area is low. At this time, the high dynamic hot spot area can be determined as the target area.

[0067] 106. Adjust the parameters of the functional modules within the target area to regulate the heat generation of the functional modules.

[0068] Once the target area is selected, the parameters of the functional modules within the target area need to be adjusted, such as reducing the operating frequency of the functional modules or adjusting the operating mode, in order to reduce the heat generation of the functional modules. This allows for heat transfer while further reducing the heat generation of the functional modules, achieving dual temperature control and improving the reliability of temperature control.

[0069] In this embodiment, temperature measurement data from multiple locations on the chip under test is first acquired. This data includes the temperature values ​​and spatial coordinates of each measurement point. Then, the rate of change of temperature values ​​at these measurement points over a preset time period is calculated based on the temperature measurement data, and a set of high-dynamic hotspot regions is determined by combining this data with a preset threshold. Next, spatial heterogeneity is utilized to calculate the temperature gradient between each high-dynamic hotspot region and its adjacent regions, generating a heat distribution path. Furthermore, the heat dissipation equipment is controlled to perform heat transfer actions based on this heat distribution path, and the heat transfer index for each high-dynamic hotspot region is calculated. High-dynamic hotspot regions where the heat transfer index does not meet the target are then identified as target regions. Finally, the parameters of the functional modules within the target region are adjusted to regulate their heat generation. This allows for real-time monitoring of high-dynamic hotspot regions, enabling heat transfer between different regions by acquiring heat distribution paths based on each region, thus achieving initial temperature control of different functional modules. When heat transfer relying on heat distribution paths cannot meet cooling requirements, the parameters of each functional module within the target region can be adjusted to change its own heat generation, achieving further temperature control. This allows for different temperature controls on functional modules in different areas, improving the uniformity of heat distribution within the integrated circuit and reducing aging caused by uneven heat distribution.

[0070] Please see Figure 2-1 and Figure 2-2 As shown, another embodiment of the integrated circuit temperature intelligent management method in this application includes:

[0071] 201. Obtain temperature measurement data at multiple different locations on the chip under test. This temperature measurement data includes the temperature value and spatial coordinates of different temperature measurement points.

[0072] Step 201 in this embodiment is the same as described above. Figure 1 Step 101 in the illustrated embodiment is similar and will not be described again here.

[0073] 202. Determine whether the temperature value at each temperature measuring point is greater than the temperature threshold. If so, proceed to step 203.

[0074] 203. Generate a set of potential hotspot regions based on the spatial coordinates of the temperature measurement points;

[0075] 204. Calculate the rate of change of temperature values ​​in each potential hotspot area within a preset time period;

[0076] 205. Identify potential hotspot regions with a temperature change rate greater than a preset threshold as high dynamic hotspot regions, and obtain a set of high dynamic hotspot regions;

[0077] Optionally, in this embodiment, the temperature values ​​corresponding to multiple temperature measuring points arranged in the integrated circuit are first obtained. By comparing the current temperature value of each temperature measuring point with the temperature threshold, potential hotspots are initially screened. Then, based on the spatial coordinates of the temperature measuring points whose current temperature value is greater than the temperature threshold, and combined with the physical structure and layout information of the integrated circuit, other adjacent temperature measuring points can be determined, and the area covered by these temperature measuring points is defined as a potential hotspot region. The temperature threshold is a pre-set temperature value based on the performance and reliability requirements of the integrated circuit, and its specific value is not limited here.

[0078] The preset time is a unit time period pre-set based on actual needs and the operating characteristics of the integrated circuit. For each potential hotspot area in the potential hotspot area set, the temperature change rate is obtained by calculating the relationship between its temperature value change and time within the preset time. It should be noted that the temperature change rate can be obtained by dividing the difference in temperature values ​​of all temperature measuring points within the potential hotspot area at the start and end of the preset time by the preset time. After obtaining the temperature change rate of each potential hotspot area, the temperature change rate of each potential hotspot area is compared with a preset threshold. When the temperature change rate of a potential hotspot area is greater than the preset threshold, it indicates that the temperature change of the potential hotspot area is relatively drastic, and it is identified as a high-dynamic hotspot area. Identifying high-dynamic hotspot areas in integrated circuits can improve the monitoring accuracy of local temperature changes in integrated circuits, effectively reduce the thermal stress of integrated circuits, improve the performance and reliability of integrated circuits, and extend their service life.

[0079] 206. Select several adjacent regions that are adjacent to the high-dynamic hotspot region as analysis windows;

[0080] 207. Calculate the distance and temperature difference between each grid point and the center point of the high dynamic hot spot area in the analysis window, and determine the temperature gradient value as the quotient of the temperature difference and the distance.

[0081] 208. Calculate the heat flux density vector based on the temperature gradient value and Fourier's law;

[0082] 209. Determine the heat distribution path based on the heat flux density vector;

[0083] Optionally, in this embodiment, an area of ​​a certain size adjacent to or close to the highly dynamic hotspot region is selected as the analysis window. The selection of the analysis window can be determined according to actual needs. For example, a grid region directly adjacent to the highly dynamic hotspot region can be selected, or an adjacent region within a certain radius can be selected. The size and shape of the analysis window can be reasonably selected according to the specific application scenario, and are not limited here.

[0084] When calculating the temperature gradient, the analysis window is first divided into several grid points, each representing a small region. Then, the distance between each grid point and the center point of the high-dynamic hotspot region is calculated, which can be done using the Euclidean distance formula, i.e., for two points... and The distance between them Next, the temperature difference between each grid point and the center point of the high-dynamic hotspot region is calculated, and this temperature difference is divided by the distance between the two points to obtain the temperature gradient value. Fourier's law states that the heat flux density vector is proportional to the temperature gradient vector; therefore, the heat flux density vector of each grid point can be calculated according to Fourier's law. It should be noted that the direction of the heat flux density vector is opposite to the direction of the temperature gradient vector, meaning that heat always flows from the high-temperature region to the low-temperature region. The heat flux density vector represents the direction and intensity of heat flow at each grid point. By analyzing and integrating the heat flux density vectors of all grid points within the analysis window, the distribution path of heat flowing from the high-dynamic hotspot region to the surrounding area can be determined. Streamline tracing and other methods can be used to determine the heat distribution path. Specifically, starting from the center point of the high-dynamic hotspot region, the heat flux density vector is traced along its direction until the boundary of the analysis window or other specific areas is reached. During the tracing process, the grid points passed are recorded; the path formed by these grid points is the heat distribution path.

[0085] 210. Generate heat transfer instructions based on heat distribution paths;

[0086] 211. Send a heat transfer command to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer command;

[0087] Optionally, in this embodiment, after determining the heat distribution path, a corresponding heat transfer instruction can be generated based on the heat distribution path. This heat transfer instruction contains the specific heat transfer actions that the heat dissipation device needs to perform, including information such as the direction, speed, and target temperature of the heat transfer. For example, if the heat distribution path indicates that a certain part of the integrated circuit is overheating, and it is necessary to transfer the heat from that part to other parts with better heat dissipation, the generated heat transfer instruction will instruct the heat dissipation device to transfer the heat from that part in the specified direction and set an appropriate transfer speed to ensure that the temperature of that part is reduced to the target temperature within a certain time. After generating the heat transfer instruction, it can be sent to the heat dissipation device via wired or wireless communication. Upon receiving the heat transfer instruction, the heat dissipation device will execute the heat transfer actions according to the specific requirements in the instruction. For example, if the instruction requires transferring heat from the top to the bottom of the device, the heat dissipation device will activate the corresponding heat dissipation equipment (such as heat sinks, fans, and heat pipes) and adjust its operating status to achieve effective heat transfer. In this way, the heat dissipation device can perform precise heat transfer according to actual needs, avoiding unnecessary energy consumption and thus reducing energy waste.

[0088] 212. Determine the total heat generation of each high-dynamic hotspot area;

[0089] 213. Calculate the heat dissipation of each high-dynamic hotspot area along the corresponding heat distribution path;

[0090] 214. Calculate the heat transfer index based on the total heat generation and heat dissipation, combined with the heat extraction rate algorithm;

[0091] Optionally, in this embodiment, the total heat generation of the high-dynamic hotspot area refers to the sum of the heat generated by all functional modules within that area over a certain period of time. Since different types of functional modules have different power consumption characteristics, such as the processor core and memory modules, their power consumption varies greatly during operation. Therefore, the power consumption data of each functional module can be obtained by consulting its technical manual or through actual measurement. Furthermore, the operating state of a functional module also affects its heat generation; for example, the heat generation of a processor under high load is much higher than under low load. Therefore, it is necessary to monitor the operating state of the functional modules in real time and adjust their power consumption data according to different operating states. After obtaining the heat generation of each functional module, the total heat generation of the area is obtained by summing the heat generation of all functional modules within the high-dynamic hotspot area. Heat transfer along the heat distribution path is achieved through heat dissipation devices such as heat sinks, fans, and heat pipes. Therefore, the heat dissipation of each high-dynamic hotspot area along the corresponding heat distribution path can be calculated based on the heat dissipation efficiency of the heat dissipation devices and the thermal resistance of the heat distribution path. Specifically, the following formula can be used to calculate it:

[0092]

[0093] in, This represents the temperature difference between a highly dynamic hotspot area and its surrounding environment or heat dissipation equipment. Thermal resistance, representing the heat distribution path. This indicates the heat dissipation efficiency of the heat dissipation component.

[0094] Finally, substituting the calculated total heat generation and heat dissipation into the heat extraction rate calculation formula, we obtain the heat extraction rate. The heat extraction rate can be used as a heat transfer index. In another possible approach, heat flux and heat transfer efficiency can also be used as heat transfer indices to improve the comprehensiveness and reliability of the heat transfer index.

[0095] 215. Identify high-dynamic hotspot areas where the heat transfer index does not meet the standard as target areas;

[0096] 216. Adjust the parameters of the functional modules within the target area to regulate the heat generation of the functional modules.

[0097] Steps 215 and 216 in this embodiment are the same as those described above. Figure 1 Steps 105 and 106 in the illustrated embodiment are similar and will not be described again here.

[0098] Please see Figure 3 As shown, one embodiment of the integrated circuit temperature intelligent management system in this application includes:

[0099] The acquisition unit 301 is used to acquire temperature measurement point data at multiple different locations of the chip under test. The temperature measurement point data includes the temperature value and spatial coordinates of different temperature measurement points.

[0100] The first calculation unit 302 is used to calculate the rate of change of temperature values ​​of multiple different temperature measuring points within a preset time based on temperature measuring point data, and to determine the set of high dynamic hot spot areas in combination with a preset threshold.

[0101] The second calculation unit 303 is used to calculate the distance and temperature difference between each grid point and the regional center point of the high dynamic hot spot region set based on spatial heterogeneity, determine the quotient of the distance and temperature difference as the temperature gradient value, and calculate the heat flux density vector by combining Fourier's law and the temperature gradient value to determine the heat distribution path.

[0102] The control unit 304 is used to control the heat dissipation equipment to perform heat transfer actions based on the heat distribution path, and to calculate the heat transfer index of each high dynamic hot spot area;

[0103] Unit 305 is used to identify high dynamic hotspot areas where the heat transfer index does not meet the standard as target areas;

[0104] The adjustment unit 306 is used to adjust the parameters of the functional modules within the target area in order to regulate the heat generation of the functional modules.

[0105] In this embodiment, the acquisition unit 301 acquires temperature measurement data from multiple different locations on the chip under test. The temperature measurement data includes the temperature values ​​and spatial coordinates of different temperature measurement points. The first calculation unit 302 calculates the rate of change of temperature values ​​at multiple different temperature measurement points within a preset time based on the temperature measurement data, and determines a set of high dynamic hotspot regions based on a preset threshold. The second calculation unit 303 uses spatial heterogeneity to calculate the temperature gradient values ​​between each high dynamic hotspot region and adjacent regions to generate a heat distribution path. The control unit 304 controls the heat dissipation device to perform heat transfer actions based on the heat distribution path and calculates the heat transfer index of each high dynamic hotspot region. The determination unit 305 determines the high dynamic hotspot regions whose heat transfer index does not meet the standard as target regions. The adjustment unit 306 adjusts the parameters of the functional modules within the target region to adjust the heat generation of the functional modules. In this way, by monitoring the high dynamic hotspot regions in real time and acquiring heat distribution paths based on each high dynamic hotspot region, heat transfer between different regions can be achieved, completing the initial temperature control of different functional modules. When heat transfer relying on heat distribution paths cannot meet cooling requirements, further temperature control can be achieved by adjusting the parameters of each functional module within the target area to change the heat generation of the module itself. This allows for different temperature controls for functional modules in different areas, improving the uniformity of heat distribution within the integrated circuit and reducing aging caused by uneven heat distribution.

[0106] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0107] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.

[0108] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0109] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0110] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A method for intelligent temperature management of integrated circuits, characterized in that, include: Acquire temperature measurement data at multiple different locations of the chip under test. The temperature measurement data includes the temperature value and spatial coordinates of different temperature measurement points. The rate of change of temperature values ​​at the multiple different temperature measuring points within a preset time period is calculated based on the temperature measuring point data, and a set of high dynamic hotspot areas is determined in combination with a preset threshold. Based on each grid point and the regional center point of the high dynamic hot spot region set, the distance and temperature difference between the two are calculated using spatial heterogeneity. The quotient of the distance and temperature difference is determined as the temperature gradient value. The heat flux density vector is calculated by combining Fourier's law and the temperature gradient value to determine the heat distribution path. Based on the heat distribution path, the heat dissipation equipment is controlled to perform heat transfer actions, and the heat transfer index of each high dynamic hot spot area is calculated. The high dynamic hotspot areas where the heat transfer index did not meet the standard were identified as the target areas; The parameters of the functional modules within the target area are adjusted to regulate the heat generation of the functional modules.

2. The intelligent temperature management method for integrated circuits according to claim 1, characterized in that, The step of calculating the rate of change of temperature values ​​at multiple different temperature measuring points within a preset time period based on the temperature measuring point data, and determining a set of high-dynamic hotspot areas in combination with a preset threshold, includes: Determine whether the temperature value at each temperature measuring point is greater than the temperature threshold. If so, then a set of potential hotspot regions is generated based on the spatial coordinates corresponding to the temperature measurement points; Calculate the rate of change of temperature values ​​in each potential hotspot area over a preset time period; Potential hotspot regions with a temperature change rate greater than a preset threshold are identified as high-dynamic hotspot regions, thus obtaining a set of high-dynamic hotspot regions.

3. The intelligent temperature management method for integrated circuits according to claim 1, characterized in that, The method involves calculating the distance and temperature difference between each grid point and the center point of the high-dynamic hotspot region set, utilizing spatial heterogeneity. The quotient of this distance and temperature difference is then used as the temperature gradient. Combining Fourier's law and the temperature gradient, a heat flux density vector is calculated to determine the heat distribution path, including: Several adjacent regions adjacent to the highly dynamic hotspot regions are selected as analysis windows; Within the analysis window, calculate the distance and temperature difference between each grid point and the center point of the high dynamic hotspot region, and determine the temperature gradient value as the quotient of the temperature difference and the distance. The heat flux density vector is calculated based on the temperature gradient value and Fourier's law. The heat distribution path is determined based on the heat flux density vector.

4. The intelligent temperature management method for integrated circuits according to claim 1, characterized in that, The step of controlling the heat dissipation device to perform heat transfer actions based on the heat distribution path includes: Generate heat transfer instructions based on the heat distribution path; Send the heat transfer command to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer command.

5. The intelligent temperature management method for integrated circuits according to claim 1, characterized in that, The calculation of the heat transfer index for each high-dynamic hotspot region includes: Determine the total heat generation of each high-dynamic hotspot area; Calculate the heat dissipation of each high-dynamic hotspot area along the corresponding heat distribution path; The heat transfer index is calculated based on the total heat generation and the heat dissipation, combined with a heat extraction rate algorithm.

6. The intelligent temperature management method for an integrated circuit according to any one of claims 1 to 5, characterized in that, The heat transfer index includes heat extraction rate, heat flux, and heat transfer efficiency.

7. A temperature intelligent management system for an integrated circuit, characterized in that, include: The acquisition unit is used to acquire temperature measurement data at multiple different locations of the chip under test. The temperature measurement data includes the temperature value and spatial coordinates of different temperature measurement points. The first calculation unit is used to calculate the rate of change of temperature values ​​of the multiple different temperature measuring points within a preset time based on the temperature measuring point data, and to determine the set of high dynamic hotspot areas in combination with a preset threshold. The second calculation unit is used to calculate the distance and temperature difference between each grid point and the regional center point of the high dynamic hot spot region set based on spatial heterogeneity, determine the quotient of the distance and temperature difference as the temperature gradient value, and calculate the heat flux density vector by combining Fourier's law and the temperature gradient value to determine the heat distribution path. The control unit is used to control the heat dissipation device to perform heat transfer actions based on the heat distribution path, and to calculate the heat transfer index of each high dynamic hot spot area; The determination unit is used to determine the high dynamic hotspot area where the heat transfer index does not meet the standard as the target area; An adjustment unit is used to adjust the parameters of the functional modules within the target area to regulate the heat generation of the functional modules.

8. The temperature intelligent management system of the integrated circuit according to claim 7, characterized in that, The first computing unit is specifically used for: Determine whether the temperature value at each temperature measuring point is greater than the temperature threshold. If so, then a set of potential hotspot regions is generated based on the spatial coordinates corresponding to the temperature measurement points; Calculate the rate of change of temperature values ​​in each potential hotspot area over a preset time period; Potential hotspot regions with a temperature change rate greater than a preset threshold are identified as high-dynamic hotspot regions, thus obtaining a set of high-dynamic hotspot regions.

9. The temperature intelligent management system for the integrated circuit according to claim 7, characterized in that, The second calculation unit is specifically used for: Several adjacent regions adjacent to the highly dynamic hotspot regions are selected as analysis windows; Within the analysis window, calculate the distance and temperature difference between each grid point and the center point of the high dynamic hotspot region, and determine the temperature gradient value as the quotient of the temperature difference and the distance. The heat flux density vector is calculated based on the temperature gradient value and Fourier's law. The heat distribution path is determined based on the heat flux density vector.

10. The temperature intelligent management system of the integrated circuit according to claim 7, characterized in that, The control unit is specifically used for: Generate heat transfer instructions based on the heat distribution path; Send the heat transfer command to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer command.

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