A laser with wide temperature adaptive enhancement based on temperature-controlled pump angle

Abstract

This invention belongs to the field of solid-state laser technology, and more particularly, relates to a laser that achieves wide-temperature adaptive enhancement based on temperature-controlled pump angle. The laser comprises, arranged from left to right, a differentiated heat sink system, an LD array pump, a focusing coupling system, an input mirror, a temperature-controlled gain crystal system, and an output mirror, along with a temperature-controlled feedback line, a temperature feedback line, and an intelligent central processing system. The differentiated heat sink system and the temperature-controlled gain crystal system are connected to the intelligent central processing system via the temperature-controlled feedback line and the temperature feedback line, respectively. This invention utilizes an organic combination of the differentiated heat sink system, the temperature-controlled gain crystal system, and the intelligent central processing system to optimize laser gain over a wide temperature range through dynamic adjustment of the pump angle and thermal focal length compensation, effectively addressing the gain loss problem caused by the thermal lensing effect during long-term laser operation. The laser has a simple structure and is highly efficient and adaptive.

Description

Technical Field

[0001] The present invention relates to the technical field of solid-state lasers, and in particular to a laser capable of achieving wide-temperature adaptive enhancement based on temperature-controlled pumping angle. Background Art

[0002] LD array pumping, which primarily involves side pumping and end pumping, has been widely used in high-power and high-energy lasers. Compared to side array pumping, end pumping offers superior beam quality and stability. In the field of solid-state lasers, it exhibits higher gain characteristics for crystals with small stimulated emission cross-sections or severe thermal effects. Therefore, this technology has become an important research direction in fields such as ultraprecision cold processing and high-field physics.

[0003] However, when end-face array LDs are pumped for extended periods, each LD converts some of its energy into heat during the electro-optical conversion process and conducts it to the surrounding LD housing, causing a significant temperature rise. This, in turn, leads to issues such as increased LD threshold current density and spot distortion. Furthermore, the gain medium excited by end-face pumping experiences heat accumulation over extended periods, resulting in a thermal lensing effect. These issues reduce the crystal gain, further degrading the laser's output performance and making efficient laser output difficult to achieve. Summary of the Invention

[0004] (1) Technical problems solved

[0005] In view of the shortcomings of the existing technology, the present invention provides a laser that realizes wide-temperature adaptive enhancement based on temperature-controlled pumping angle, which solves the problems raised in the above background technology.

[0006] (2) Technical solution

[0007] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0008] A laser that achieves wide-temperature adaptive enhancement based on temperature-controlled pump angle, comprising, arranged from left to right, a differentiated heat sink system, an LD array pump, a focusing coupling system, an input mirror, a temperature-controlled gain crystal system, and an output mirror, as well as a temperature-controlled feedback line, a temperature feedback line, and an intelligent central processing system. The differentiated heat sink system and the temperature-controlled gain crystal system are connected to the intelligent central processing system via the temperature-controlled feedback line and the temperature feedback line, respectively.

[0009] The differentiated heat sink system includes an LD customized hole, a circulating water cooling unit, a first temperature feedback unit, a second temperature feedback unit, a first semiconductor refrigeration plate temperature control unit and a second semiconductor refrigeration plate temperature control unit, a thermal expansion unit and a heat conduction unit. The LD array pump is placed in the LD customized hole. There is a gap of a certain distance between the LD customized hole and the upper and lower end surfaces of the LD array pump to ensure that the thermal expansion material in the differentiated heat sink system has a certain expansion space. The upper and lower end surfaces of the LD customized hole are respectively installed with a thermal expansion unit and a heat conduction unit. The circulating water cooling unit is installed on the side surface of the differentiated heat sink system. The first temperature feedback unit, the second temperature feedback unit, the first semiconductor refrigeration plate temperature control unit and the second semiconductor refrigeration plate temperature control unit are installed on the back of the differentiated heat sink system.

[0010] The temperature-controlled gain crystal system includes a gain medium, a gain medium fixture, a temperature sensing unit and a temperature control module. The gain medium is arranged on the surface of the gain medium fixture, the temperature sensing unit is arranged in a hole on the side surface of the gain medium fixture, and the gain medium fixture is arranged on the surface of the temperature control module.

[0011] Furthermore, the thermal expansion unit is used to compensate for structural thermal strain through material expansion, thereby improving the temperature adaptability of the system; the heat conduction unit is used to efficiently conduct heat under different temperature conditions; the first semiconductor refrigeration chip temperature control unit and the second semiconductor refrigeration chip temperature control unit are respectively used to adjust the temperature of the heat dissipation module to achieve two-way dynamic temperature compensation; the circulating water cooling heat dissipation unit is used to quickly remove excess heat generated during the operation of the first semiconductor refrigeration chip temperature control unit and the second semiconductor refrigeration chip temperature control unit; the first temperature feedback unit and the second temperature feedback unit are respectively used to monitor the temperature status of the differentiated heat sink system in real time, and feed back the data / receive instructions from the intelligent central processing system; the gain medium fixture is used to fix the gain medium and provide a stable heat conduction process; the temperature sensing unit is used to monitor the temperature of the gain medium in real time and transmit the data to the intelligent central processing system; the temperature control module adopts a semiconductor refrigeration chip or a circulating water cooling device to protect the gain medium from thermal damage.

[0012] Furthermore, the thermal expansion unit is made of shape memory alloy, vapor-grown carbon fiber reinforced shape memory polyurethane foam or multi-walled carbon nanotube / epoxy resin-based composite material to provide efficient thermal expansion compensation performance; the heat conduction unit is made of copper, aluminum nitride or silicon nitride material to ensure high thermal conductivity and structural stability.

[0013] Furthermore, the gain medium is made of Nd:YAG, Nd:YVO, Nd:GdVO or MgO:PPLN material to achieve wide-temperature and high-efficiency gain; the surface of the gain medium is coated with an anti-pump light reflection film layer to achieve high-efficiency optical gain, and the pump light wavelength emitted by the LD array pump corresponds to different absorption characteristics of the gain medium, namely 813nm, 808nm, 880nm, 879nm or 1064nm, to ensure an efficient gain process.

[0014] Furthermore, the temperature control module adopts a semiconductor refrigeration plate, a circulating water cooling device or a temperature control furnace. The temperature control module is controlled by an intelligent central processing system and adjusts the temperature control parameters according to real-time feedback / received signals to compensate for the thermal focal length effect and gain of the gain medium.

[0015] Furthermore, the circulating water-cooling heat dissipation unit is designed as a high-efficiency fluid channel structure, which realizes uniform heat dissipation over a large area through water-cooling circulation.

[0016] Furthermore, the first temperature feedback unit and the second temperature feedback unit are communicatively connected to the intelligent central processing system via temperature sensors, and are used to dynamically control the operating status of each heat dissipation module in the differentiated heat sink system.

[0017] Furthermore, the intelligent central processing system includes a temperature data acquisition module, an algorithm control module and an instruction output module; the temperature data acquisition module is used to receive real-time data from the temperature sensing unit, the first temperature feedback unit and the second temperature feedback unit; the algorithm control module is used to calculate the thermal focal length change of the gain medium and the temperature difference state of the differentiated heat sink system; the instruction output module is used to issue control instructions to the temperature control module and the differentiated heat sink system.

[0018] Furthermore, the input mirror and the output mirror are respectively coated with a pump light total reflection film layer and a target laser anti-reflection film layer to improve the utilization rate of the pump light and the optical quality of the output laser.

[0019] (3) Beneficial effects

[0020] Compared with the prior art, the present invention provides a laser that realizes wide temperature adaptive enhancement based on temperature-controlled pump angle, which has the following beneficial effects:

[0021] This invention utilizes a differentiated heat sink system, a temperature-controlled gain crystal system, and an intelligent central processing system. By dynamically adjusting the pump angle and thermal focal length compensation, it optimizes laser gain over a wide temperature range, effectively addressing the gain loss problem caused by thermal lensing during long-term laser operation. Its structure is simple, yet highly efficient and adaptive. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an overall schematic diagram of the present invention;

[0023] Figure 2 is a front view schematic diagram of a differentiated heat sink system;

[0024] Figure 3 is a left-side schematic diagram of a differentiated heat sink system;

[0025] Figure 4 is a rear view schematic diagram of a differentiated heat sink system;

[0026] Figure 5 is a schematic cross-sectional view of a differentiated heat sink system;

[0027] Figure 6 It is a schematic diagram of the positions of the thermal expansion unit and the heat conduction unit;

[0028] Figure 7 It is a schematic diagram of the temperature controlled crystal gain system;

[0029] Figure 8 It is the intelligent central processing system judgment process;

[0030] Figure 9 This is a schematic diagram of the initial operating state of the laser that achieves wide-temperature adaptive enhancement by temperature-controlled pump angle;

[0031] Figure 10 This is a schematic diagram of the operating status of a laser after temperature-controlled pumping angle to achieve wide-temperature adaptive enhancement.

[0032] In the figure: 1. Differentiated heat sink system; 2. LD array pump; 3. Focus coupling system; 4. Input mirror; 5. Temperature-controlled gain crystal system; 6. Output mirror; 7. Temperature-controlled feedback line; 8. Temperature feedback line; 9. Intelligent central processing system; 10. LD customized hole position; 11. Circulating water cooling unit; 12. First temperature feedback unit; 13. Second temperature feedback unit; 14. First semiconductor refrigeration chip temperature control unit; 15. Second semiconductor refrigeration chip temperature control unit; 16. Thermal expansion unit; 17. Heat conduction unit; 18. Gain medium; 19. Gain medium fixture; 20. Temperature sensing unit; 21. Temperature control module. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] Example

[0035] like Figure 1-10 As shown, a laser that achieves wide-temperature adaptive enhancement based on temperature-controlled pump angle, proposed in one embodiment of the present invention, includes, from left to right, a differentiated heat sink system 1, an LD array pump 2, a focusing coupling system 3, an input mirror 4, a temperature-controlled gain crystal system 5, and an output mirror 6, as well as a temperature-controlled feedback line 7, a temperature feedback line 8, and an intelligent central processing system 9. The differentiated heat sink system 1 and the temperature-controlled gain crystal system 5 are connected to the intelligent central processing system 9 via the temperature-controlled feedback line 7 and the temperature feedback line 8, respectively.

[0036] The differentiated heat sink system 1 includes an LD customized hole 10, a circulating water cooling heat dissipation unit 11, a first temperature feedback unit 12, a second temperature feedback unit 13, a first semiconductor refrigeration plate temperature control unit 14 and a second semiconductor refrigeration plate temperature control unit 15, a thermal expansion unit 16 and a heat conduction unit 17. The LD array pump 2 is placed in the LD customized hole 10. There is a certain distance between the LD customized hole 10 and the upper and lower end surfaces of the LD array pump 2 to ensure that the thermal expansion material in the differentiated heat sink system 1 has a certain expansion space. The upper and lower end surfaces of the LD customized hole 10 are respectively installed with a thermal expansion unit 16 and a heat conduction unit 17. The circulating water cooling heat dissipation unit 11 is installed on the side surface of the differentiated heat sink system 1. The first temperature feedback unit 12, the second temperature feedback unit 13, the first semiconductor refrigeration plate temperature control unit 14 and the second semiconductor refrigeration plate temperature control unit 15 are installed on the back of the differentiated heat sink system 1;

[0037] The temperature-controlled gain crystal system 5 includes a gain medium 18, a gain medium fixture 19, a temperature sensing unit 20 and a temperature control module 21. The gain medium 18 is arranged on the surface of the gain medium fixture 19, the temperature sensing unit 20 is arranged in a hole on the side surface of the gain medium fixture 19, and the gain medium fixture 19 is arranged on the surface of the temperature control module 21.

[0038] In this embodiment, the thermal expansion unit 16 is used to compensate for the thermal strain of the structure through material expansion, thereby improving the temperature adaptability of the system; the heat conduction unit 17 is used to efficiently conduct heat under different temperature conditions; the first semiconductor refrigeration plate temperature control unit 14 and the second semiconductor refrigeration plate temperature control unit 15 are respectively used to adjust the temperature of the heat dissipation module to achieve two-way dynamic temperature compensation; the circulating water cooling heat dissipation unit 11 is used to quickly remove the excess heat generated during the operation of the first semiconductor refrigeration plate temperature control unit 14 and the second semiconductor refrigeration plate temperature control unit 15; the first temperature feedback unit 12 and the second temperature feedback unit 13 are respectively used to monitor the temperature status of the differentiated heat sink system 1 in real time, and to feed back data / receive instructions from the intelligent central processing system 9; the gain medium fixture 19 is used to fix the gain medium 18 and provide a stable heat conduction process; the temperature sensing unit 20 is used to monitor the temperature of the gain medium 18 in real time and transmit data to the intelligent central processing system 9; the temperature control module 21 uses a semiconductor refrigeration plate or a circulating water cooling device to protect the gain medium 18 from thermal damage.

[0039] In this embodiment, the thermal expansion unit 16 is made of shape memory alloy, vapor-grown carbon fiber reinforced shape memory polyurethane foam, or multi-walled carbon nanotube / epoxy resin-based composite material to provide efficient thermal expansion compensation performance; the heat conduction unit 17 is made of copper, aluminum nitride, or silicon nitride to ensure high thermal conductivity and structural stability.

[0040] In this embodiment, the material of the gain medium 18 is Nd:YAG, Nd:YVO4, Nd:GdVO4 or MgO:PPLN material, which is used to achieve wide temperature and high-efficiency gain; the surface of the gain medium 18 is coated with an anti-pump light reflection film layer, which is used to achieve high-efficiency optical gain. The pump light wavelength emitted by the LD array pump 2 corresponds to the different absorption characteristics of the gain medium 18, which is 813nm, 808nm, 880nm, 879nm or 1064nm, to ensure an efficient gain process.

[0041] In this embodiment, the temperature control module 21 adopts a semiconductor refrigeration plate, a circulating water cooling device or a temperature control furnace. The temperature control module 21 is controlled by the intelligent central processing system 9 and adjusts the temperature control parameters according to the real-time feedback / received signal to compensate for the thermal focal length effect and gain of the gain medium 18.

[0042] In this embodiment, the circulating water-cooling heat dissipation unit 11 is designed as a high-efficiency fluid channel structure, which realizes uniform heat dissipation over a large area through water-cooling circulation.

[0043] In this embodiment, the first temperature feedback unit 12 and the second temperature feedback unit 13 are connected to the intelligent central processing system 9 via temperature sensors for dynamically adjusting the operating status of each heat dissipation module in the differentiated heat sink system 1 .

[0044] In this embodiment, the intelligent central processing system 9 includes a temperature data acquisition module, an algorithm control module and an instruction output module; the temperature data acquisition module is used to receive real-time data from the temperature sensing unit 20, the first temperature feedback unit 12 and the second temperature feedback unit 13; the algorithm control module is used to calculate the thermal focal length change of the gain medium 18 and the temperature difference state of the differentiated heat sink system 1; and the instruction output module is used to issue control instructions to the temperature control module 21 and the differentiated heat sink system 1.

[0045] In this embodiment, the input mirror 4 and the output mirror 6 are respectively coated with a pump light total reflection film layer and a target laser anti-reflection film layer to improve the utilization rate of the pump light and the optical quality of the output laser.

[0046] The control process of the laser for achieving wide temperature adaptive enhancement based on temperature-controlled pump angle of the present invention is as follows: S1: The temperature sensing unit 20 in the temperature-controlled gain crystal system 5 collects the temperature change of the gain medium 18 and transmits it to the intelligent central processing system 9 in real time through the temperature feedback line 8;

[0047] S2: The first temperature feedback unit 12 and the second temperature feedback unit 13 communicate with the intelligent central processing system 9 via the temperature control feedback line 7 to transmit the temperature change of the differentiated heat sink system 1 in real time;

[0048] S3: The intelligent central processing system 9 judges the laser operation data fed back by the first temperature feedback unit 12, the second temperature feedback unit 13 and the temperature sensing unit 20. When the temperature fed back by the first temperature feedback unit 12, the second temperature feedback unit 13 and the temperature sensing unit 20 is normal, the existing laser operation state is maintained. When the temperature fed back by the first temperature feedback unit 12, the second temperature feedback unit 13 and the temperature sensing unit 20 is abnormal, the operating temperature of the first semiconductor refrigeration chip temperature control unit 14 and the second semiconductor refrigeration chip temperature control unit 15 is regulated to expand the thermal expansion unit 16 and regulate the working angle of the LD array pump 2 to increase the gain of the gain medium 18. Figure 8 As shown;

[0049] S4: When the laser operation data is normal, the intelligent central processing system 9 controls the first semiconductor refrigeration chip temperature control unit 14 and the second semiconductor refrigeration chip temperature control unit 15 in the differentiated heat sink system 1 to maintain the existing state, such as Figure 9 As shown;

[0050] S5: When the first temperature feedback unit 12, the second temperature feedback unit 13 and the temperature sensing unit 20 have abnormal feedback, the intelligent central processing system 9 controls the temperature of the first semiconductor refrigeration chip temperature control unit 14 and the second semiconductor refrigeration chip temperature control unit 15 in the differentiated heat sink system 1 in real time, and determines the upward and / or downward tilt angle of the thermal expansion unit 16 through the first temperature feedback unit 12 and the second temperature feedback unit 13 to increase its gain effect, such as Figure 10 shown.

[0051] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A laser that achieves wide-temperature adaptive enhancement based on temperature-controlled pump angle, characterized in that: The invention comprises a differential heat sink system (1), an LD array pump (2), a focusing coupling system (3), an input mirror (4), a temperature-controlled gain crystal system (5), and an output mirror (6), as well as a temperature-controlled feedback line (7), a temperature feedback line (8), and an intelligent central processing system (9), which are arranged in sequence from left to right. The differential heat sink system (1) and the temperature-controlled gain crystal system (5) are connected to the intelligent central processing system (9) via the temperature-controlled feedback line (7) and the temperature feedback line (8), respectively. The differentiated heat sink system (1) includes an LD customized hole (10), a circulating water cooling unit (11), a first temperature feedback unit (12), a second temperature feedback unit (13), a first semiconductor refrigeration plate temperature control unit (14), a second semiconductor refrigeration plate temperature control unit (15), a thermal expansion unit (16), and a heat conduction unit (17). The LD array pump (2) is placed in the LD customized hole (10), and a gap of a certain distance is formed between the LD customized hole (10) and the upper and lower end surfaces of the LD array pump (2). , ensuring that the thermal expansion material in the differentiated heat sink system (1) has a certain expansion space, the upper and lower end surfaces of the LD customized hole (10) are respectively installed with a thermal expansion unit (16) and a heat conduction unit (17), the circulating water cooling heat dissipation unit (11) is installed on the side surface of the differentiated heat sink system (1), and the first temperature feedback unit (12), the second temperature feedback unit (13), the first semiconductor refrigeration plate temperature control unit (14) and the second semiconductor refrigeration plate temperature control unit (15) are installed on the back of the differentiated heat sink system (1); The temperature-controlled gain crystal system (5) comprises a gain medium (18), a gain medium fixture (19), a temperature sensing unit (20) and a temperature control module (21), wherein the gain medium (18) is arranged on the surface of the gain medium fixture (19), the temperature sensing unit (20) is arranged in a hole on the side surface of the gain medium fixture (19), and the gain medium fixture (19) is arranged on the surface of the temperature control module (21).

2. The laser capable of achieving wide temperature adaptive enhancement based on temperature-controlled pump angle according to claim 1, characterized in that: The thermal expansion unit (16) is used to compensate for the thermal strain of the structure through material expansion, thereby improving the temperature adaptability of the system; the heat conduction unit (17) is used to efficiently conduct heat under different temperature conditions; the first semiconductor refrigeration plate temperature control unit (14) and the second semiconductor refrigeration plate temperature control unit (15) are respectively used to adjust the temperature of the heat dissipation module to achieve two-way dynamic temperature compensation; the circulating water cooling heat dissipation unit (11) is used to quickly remove the excess heat generated by the first semiconductor refrigeration plate temperature control unit (14) and the second semiconductor refrigeration plate temperature control unit (15) during operation; the first temperature feedback unit (12) and the second temperature feedback unit (13) are respectively used to monitor the temperature state of the differentiated heat sink system (1) in real time, and feed back the data / receive instructions from the intelligent central processing system (9); the gain medium fixture (19) is used to fix the gain medium (18) and provide a stable heat conduction process; the temperature sensing unit (20) is used to monitor the temperature of the gain medium (18) in real time, and transmit the data to the intelligent central processing system (9); the temperature control module (21) uses a semiconductor refrigeration plate or a circulating water cooling device to protect the gain medium (18) from thermal damage.

3. The laser capable of achieving wide temperature adaptive enhancement based on temperature-controlled pump angle according to claim 1, characterized in that: The thermal expansion unit (16) is made of shape memory alloy, vapor-phase grown carbon fiber reinforced shape memory polyurethane foam or multi-walled carbon nanotube / epoxy resin-based composite material to provide efficient thermal expansion compensation performance; the heat conduction unit (17) is made of copper, aluminum nitride or silicon nitride material to ensure high thermal conductivity and structural stability.

4. The laser capable of achieving wide temperature adaptive enhancement based on temperature-controlled pump angle according to claim 1, characterized in that: The material of the gain medium (18) is Nd:YAG, Nd:YVO4, Nd:GdVO4 or MgO:PPLN material, which is used to achieve wide temperature and high efficiency gain; the surface of the gain medium (18) is coated with an anti-pump light reflection film layer, which is used to achieve high efficiency optical gain, and the pump light wavelength emitted by the LD array pump (2) corresponds to the different absorption characteristics of the gain medium (18) of 813nm, 808nm, 880nm, 879nm or 1064nm, so as to ensure a high efficiency gain process.

5. The laser capable of achieving wide temperature adaptive enhancement based on temperature-controlled pump angle according to claim 1, characterized in that: The temperature control module (21) adopts a semiconductor refrigeration plate, a circulating water cooling device or a temperature control furnace. The temperature control module (21) is controlled by an intelligent central processing system (9) and adjusts the temperature control parameters according to real-time feedback / received signals to compensate for the thermal focal length effect and gain of the gain medium (18).

6. The laser capable of achieving wide temperature adaptive enhancement based on temperature-controlled pump angle according to claim 1, characterized in that: The circulating water cooling and heat dissipation unit (11) is designed as a high-efficiency fluid channel structure, and achieves uniform heat dissipation over a large area through water cooling circulation.

7. The laser capable of achieving wide temperature adaptive enhancement based on temperature-controlled pump angle according to claim 1, characterized in that: The first temperature feedback unit (12) and the second temperature feedback unit (13) are connected to the intelligent central processing system (9) via temperature sensors and are used to dynamically control the operating state of each heat dissipation module in the differentiated heat sink system (1).

8. The laser capable of achieving wide temperature adaptive enhancement based on temperature-controlled pump angle according to claim 1, characterized in that: The intelligent central processing system (9) includes a temperature data acquisition module, an algorithm control module and an instruction output module; the temperature data acquisition module is used to receive real-time data from the temperature sensing unit (20), the first temperature feedback unit (12) and the second temperature feedback unit (13); the algorithm control module is used to calculate the thermal focal length change of the gain medium (18) and the temperature difference state of the differential heat sink system (1); and the instruction output module is used to issue control instructions to the temperature control module (21) and the differential heat sink system (1).

9. The laser capable of achieving wide temperature adaptive enhancement based on temperature-controlled pump angle according to claim 1, characterized in that: The input mirror (4) and the output mirror (6) are respectively coated with a pump light total reflection film layer and a target laser anti-reflection film layer, so as to improve the utilization rate of the pump light and the optical quality of the output laser.

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