ADAS binocular camera module structure

Abstract

The invention provides an ADAS binocular camera module structure which is characterized in that two lens seats are arranged at the front end of a front outer frame, a multi-layer anti-seismic buffer structure is arranged between the lens seats and lenses, and the multi-layer anti-seismic buffer structure comprises an inner layer formed by a high-elasticity silica gel pad, a middle layer formed by a spring damper array and an outer layer formed by a soft rubber sleeve; compared with the prior art, in the assembling process, the spring damper array is pre-pressed into the clamping groove of the front outer frame, the high-elasticity silica gel pad is embedded in the periphery of the base of the lens in an interference fit mode, and finally the soft rubber sleeve is connected in a sleeved mode to form a triple buffering structure; the image sensor module realizes high-density signal transmission with the PCB through the flexible circuit board, the BTB connector and the PCB, the sealing structure forms a sealing structure on a connecting surface of the front outer frame and the two rear outer frames, and a wire is led out from an interface.

Description

Technical Field

[0001] The present invention relates to the technical field of ADAS binocular camera modules, and particularly to a structure of an ADAS binocular camera module. Background Art

[0002] With the acceleration of the intelligentization process of automobiles, the ADAS system is becoming increasingly crucial for improving vehicle driving safety and intelligent driving experience. As the core vision sensor of the ADAS system, the performance of the binocular camera module directly affects the accuracy and reliability of the system. The structures of traditional ADAS binocular camera modules have many drawbacks. In terms of integration, the layout of each component is loose, resulting in a relatively large overall volume. In the limited internal space of the vehicle, not only is the installation position restricted, but also the wiring difficulty and complexity are increased. In terms of seismic performance, the existing structures are difficult to effectively cope with the continuous vibrations and bumps during vehicle driving. The lens and the image sensor are prone to relative displacement due to vibrations, resulting in blurred imaging and binocular vision matching deviation, seriously affecting the recognition accuracy of key information such as obstacles and lane lines in the road environment. At the same time, in terms of the optical protection structure, in the face of complex outdoor lighting conditions, such as direct sunlight, backlight, and low-light conditions at night, the ordinary structures cannot fully guarantee the optical performance of the lens, and are prone to problems such as glare and ghost images, reducing the image quality and interfering with the accurate judgment of the road conditions by the ADAS system. Moreover, the imperfect heat dissipation structure causes the heat generated by heat-generating components such as the image sensor to accumulate during long-term operation, leading to performance degradation and shortening the service life of the module. Therefore, a structure of an ADAS binocular camera module is proposed. Summary of the Invention

[0003] To solve the above at least one technical shortcoming, the present invention provides a structure of an ADAS binocular camera module, including: a frame composed of a front outer frame and two rear outer frames, a lens, a multi-layer seismic buffer structure, a flexible circuit board, an image sensor module, a BTB connector, a PCB board, a sealing structure, and an interface. Two lens seats are provided at the front end of the front outer frame, and a multi-layer seismic buffer structure is arranged between the lens seats and the lens. The multi-layer seismic buffer structure includes an inner layer composed of a highly elastic silicone pad, a middle layer composed of a spring damper array, and an outer layer composed of a soft rubber sleeve.

[0004] Furthermore, the interior of the front outer frame forms two independent cavities. A flexible circuit board and a PCB board are fixedly connected inside each cavity. Image sensor modules aligned with the lenses are provided on the front surfaces of the flexible circuit boards. BTB connectors are arranged between the flexible circuit boards and the PCB boards. Sealing structures are arranged between the edges of the cavities and the connection surfaces of the rear outer frames. Interfaces are fixedly connected to the PCB boards.

[0005] Further, the interface includes a connector fixedly connected to the PCB board. The end of the connector is inserted with a sealed interface. The outer end of the sealed interface passes through the outer wall of the rear outer frame. The outer end of the sealed interface is provided with an outer interface. The inner end of the sealed interface is provided with an inner interface inserted with the connector. The top of the outer end of the inner interface is provided with a sealing ring hermetically connected to the inner wall of the rear outer frame.

[0006] Further, one corner of the sealing surface of the rear outer frame is fixedly connected with a protruding positioning post. The sealing surface of the front outer frame is provided with a positioning hole corresponding to the positioning post. A sealing groove is opened inside the sealing surface of the rear outer frame. The sealing structure is arranged inside the sealing groove. The sealing structure includes a sealing member connected to the inside of the sealing groove. The inner surface of the sealing member is evenly provided with at least four elastic connecting members. The elastic connecting members are arranged in a T shape. The ends of the elastic connecting members are connected to the surface edge of the PCB board.

[0007] Further, an acceleration sensor is arranged inside the frame.

[0008] Further, intelligent temperature control chips are arranged on the PCB board. A high thermal conductivity phase change material is filled between the heating element inside the frame and the frame. Ventilation holes penetrating both ends are arranged inside the outer wall of the frame. Miniature cooling fans are arranged inside the ventilation holes.

[0009] Further, annular V-shaped grooves are opened on the connecting surfaces of the lens mount and the lens. The top and bottom of the high-elastic silicone pad, the spring damper array, and the soft rubber sleeve are provided with inclined surfaces fitting the V-shaped grooves.

[0010] Further, the cross-sections of the high-elastic silicone pad and the soft rubber sleeve are both arranged in an isosceles trapezoid shape. The cross-section of the spring damper array is arranged in a hexagonal shape.

[0011] Further, the front outer frame and the two rear outer frames are both made of magnesium alloy and are formed by precision die-casting. A plurality of heat dissipation fins are arranged on the outer walls of the front outer frame and the two rear outer frames. The heat dissipation fins are integrally formed with the frame and the surface is blackened.

[0012] Further, both ends of the front outer frame are provided with buckles and fixing plates parallel to the installation plane. A plurality of through holes are arranged on the fixing plates. Beneficial effects

[0013] Compared with the prior art, during assembly of the present invention, the spring damper array is pre-pressed into the card slot of the front outer frame. The high-elastic silicone pad is nested around the base of the lens in an interference fit manner. Finally, the soft rubber sleeve is sleeved to form a triple buffering structure. The image sensor module realizes high-density signal transmission with the PCB board through a flexible circuit board and a BTB connector. The sealing structure forms a sealing structure on the connecting surface of the front outer frame and the two rear outer frames, and the interface leads out the wire.

[0014] When damping, increasing firmness, and achieving precise positioning, when connecting the lens mount and the lens, a multi-layer seismic buffer structure formed by concentrically assembling a high-elastic silicone pad, a spring damper array, and a soft rubber sleeve first. At this time, the top and bottom of the multi-layer seismic buffer structure are just V-shaped inclined planes that fit the V-shaped grooves. Through the setting of the inclined plane and the V-shaped groove, the contact area between the lens mount, the lens, and the connection surface of the multi-layer seismic buffer structure can be effectively increased. When performing adhesive fixation, the firmness of the adhesion can be improved. At the same time, the setting of the V-shaped groove and the inclined plane can achieve precise positioning through the inclined plane and the V-shaped groove. When the inclined planes at the top and bottom of the high-elastic silicone pad, the spring damper array, and the soft rubber sleeve are just completely placed inside the V-shaped groove for bonding, at this time, the lens mount, the lens, the high-elastic silicone pad, the spring damper array, and the soft rubber sleeve are coaxial, thus achieving precise positioning.

[0015] The combination of mechanical damping and electronic compensation, a three-stage buffer mechanism: an inner silicone pad (absorbing high-frequency vibrations) + a middle spring damper (attenuating low-frequency impacts) + an outer rubber sleeve (mechanical limit protection), and an acceleration sensor is provided inside the frame to monitor vibrations and trigger imaging parameter adjustments, thereby achieving electronic compensation.

[0016] The space between the heating element inside the frame and the frame is filled with a high thermal conductivity phase change material. A micro cooling fan controlled by an intelligent temperature control chip is installed inside the frame, and ventilation holes are set to optimize air circulation and improve the heat dissipation efficiency. The frame adopts a large-area heat sink fin design. The fins are integrally formed with the frame and the surface is blackened and cooperates with the micro cooling fan controlled by the intelligent temperature control chip. The combination of the material layer, the mechanical layer, and the electronic control layer significantly improves the heat dissipation efficiency.

[0017] The realization, functional features, and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings. Brief Description of the Drawings

[0018] Figure 1 It is an isometric view of the whole of the present invention.

[0019] Figure 2 It is an isometric view of the lens mount of the present invention.

[0020] Figure 3 It is an isometric view of the V-shaped groove of the present invention.

[0021] Figure 4 It is a cross-sectional view of the whole of the present invention.

[0022] Figure 5 It is an isometric view of the multi-layer seismic buffer structure of the present invention.

[0023] Figure 6 It is an exploded view of the multi-layer seismic buffer structure of the present invention.

[0024] Figure 7 A cross-sectional view of the multi-layer seismic buffer structure of the present invention.

[0025] Figure 8 An isometric view of the image sensor module of the present invention.

[0026] Figure 9 An isometric view of the sealing structure of the present invention.

[0027] Figure 10 An isometric view of the PCB board of the present invention.

[0028] Figure 11 A cross-sectional view of the interface of the present invention.

[0029] Figure 12 An isometric view of the interface of the present invention.

[0030] Figure 13 An isometric view of the sealing groove of the present invention.

[0031] In Figures 1 to 13 , the corresponding relationship between the component names or lines and the drawing numbers is as follows: frame 1, front outer frame 101, rear outer frame 102, sealing groove 121, positioning post 122, lens holder 103, V-shaped groove 131, buckle 104, fixing plate 105, heat dissipation fin 106, lens 2, multi-layer seismic buffer structure 3, high-elastic silicone pad 301, spring damper array 302, soft rubber sleeve 303, flexible circuit board 4, image sensor module 5, BTB connector 6, PCB board 7, acceleration sensor 701, intelligent temperature control chip 702, sealing structure 8, seal 801, elastic connection member 802, interface 9, connection seat 901, sealed interface 902, external interface 921, internal interface 922, sealing ring 903. Detailed implementation manners

[0032] Please refer to Figures 1 to 13 ; This embodiment provides an ADAS binocular camera module structure. Referring to Figures 1 to 7 , it includes: a frame 1 composed of a front outer frame 101 and two rear outer frames 102, a lens 2, a multi-layer seismic buffer structure 3, a flexible circuit board 4, an image sensor module 5, a BTB connector 6, a PCB board 7, a sealing structure 8, and an interface 9. Two lens holders 103 are provided at the front end of the front outer frame 101. A multi-layer seismic buffer structure 3 is arranged between the lens holder 103 and the lens 2. The multi-layer seismic buffer structure 3 includes an inner layer composed of a high-elastic silicone pad 301, a middle layer composed of a spring damper array 302, and an outer layer composed of a soft rubber sleeve 303.

[0033] In specific implementation, during assembly, the spring damper array 302 is pre-pressed into the card slot of the front outer frame 101, the high-elastic silicone pad 301 is nested around the base of the lens 2 in an interference fit manner, and finally the flexible rubber sleeve 303 is sleeved to form a triple buffering structure. The image sensor module 5 realizes high-density signal transmission with the PCB board 7 through the flexible circuit board 4 and the BTB connector 6. The sealing structure 8 forms a sealing structure at the connection surface of the front outer frame 101 and the two rear outer frames 102, and the interface 9 leads out the wire.

[0034] Verification test of seismic performance: Three-level buffering mechanism: inner silicone pad (absorb high-frequency vibration) + middle spring damper (attenuate low-frequency impact) + outer rubber sleeve (mechanical limit protection).

[0035] Between the lens 2 and the frame 1, a multi-layer seismic buffering structure 3 is provided.

[0036] The innermost layer is the high-elastic silicone pad 301, which closely adheres to the lens housing and can effectively absorb high-frequency micro-vibrations.

[0037] The middle layer adopts a spring damper array 302, which is evenly distributed around the lens and is used to buffer low-frequency large vibrations.

[0038] The outer layer is a layer of flexible rubber sleeve 303, which not only further enhances the damping effect but also plays a protective role to prevent the lens from directly colliding with the frame.

[0039] Further, referring to Figure 4 , the interior of the front outer frame 101 forms two independent cavities. Inside the cavities, a flexible circuit board 4 and a PCB board 7 are fixedly connected. On the front surface of the flexible circuit board 4, an image sensor module 5 aligned with the lens 2 is provided. Between the flexible circuit board 4 and the PCB board 7, a BTB connector 6 is provided. Between the edge of the cavity and the connection surface of the rear outer frame 102, a sealing structure 8 is provided. On the PCB board 7, an interface 9 is fixedly connected.

[0040] In specific implementation, the two independent cavities and the rear outer frame 102 form a double-cavity encapsulation structure through the sealing structure 8 and the interface 9.

[0041] The flexible circuit board 4, the image sensor module 5 and the lens 2 form a front-end integration layer; The PCB board 7 forms a rear-end processing layer; All the modules necessary for ADAS are provided on the PCB board 7.

[0042] Cross-layer interconnection is realized through the BTB connector 6.

[0043] Mechanical buffering, while maintaining the image stability at the 0.1 px level required by the ADAS system, its power spectral density (PSD) response is significantly reduced compared to the traditional single-layer shock absorption structure.

[0044] Furthermore, referring to Figure 4 and Figure 11 the interface 9 includes a connector block 901 fixedly connected to the PCB board 7. The end of the connector block 901 is inserted with a sealed interface 902. The outer end of the sealed interface 902 passes through the outer wall of the rear outer frame 102. The outer end of the sealed interface 902 is provided with an outer interface 921. The inner end of the sealed interface 902 is provided with an inner interface 922 inserted with the connector block 901. The top of the outer end of the inner interface 922 is provided with a sealing ring 903 hermetically connected to the inner wall of the rear outer frame 102.

[0045] In specific implementation, a standardized external interface 9 is set on the surface of the frame 1, including a power interface, a data transmission interface, etc. A waterproof and dustproof sealed interface design is adopted, which is convenient for integration with the vehicle's ADAS system.

[0046] The sealed interface 902 is connected to the outer wall of the rear outer frame 102 and sealed through the sealing ring 903. At the same time, the connector block 901 is installed on the PCB board 7, so that the PCB board 7 can be connected to the rear outer frame 102 through the connector block 901 and the inner interface 922 by insertion.

[0047] Furthermore, referring to Figure 13 a convex positioning post 122 is fixedly connected to one corner of the sealing surface of the rear outer frame 102. The sealing surface of the front outer frame 101 is provided with a positioning hole corresponding to the positioning post 122. A sealing groove 121 is opened inside the sealing surface of the rear outer frame 102. The sealing structure 8 is arranged inside the sealing groove 121. The sealing structure 8 includes a sealing member 801 connected to the inside of the sealing groove 121. At least four elastic connecting members 802 are evenly arranged on the inner surface of the sealing member 801. The elastic connecting members 802 are arranged in a T shape. The ends of the elastic connecting members 802 are connected to the surface edge of the PCB board 7.

[0048] In specific implementation, through the setting of the positioning post 122 and the positioning hole, the front outer frame 101 and the two rear outer frames 102 are positioned. Through the setting of the sealing groove 121 and the sealing member 801, the connection surface between the front outer frame 101 and the two rear outer frames 102 is sealed. Through the setting of the elastic connecting members 802, the direct contact between the PCB board 7 and the frame 1 is reduced. While the sealing member 801 and the elastic connecting members 802 fix the PCB board 7 by themselves, they can play a role in shock absorption for the PCB board 7.

[0049] Furthermore, an acceleration sensor 701 is provided inside the frame 1.

[0050] In specific implementation, a multi-layer anti-seismic buffer structure 3 is provided between the acceleration sensor 701, the lens 2 and the frame 1, including a high-elastic silica gel pad 301 in the inner layer, a spring damper array 302 in the middle layer, and a soft rubber sleeve 303 in the outer layer. The image sensor module 5 is connected to the frame 1 through a flexible circuit board 4, and an acceleration sensor 701 is provided inside the frame 1 to monitor vibrations and trigger imaging parameter adjustment, thereby realizing electronic compensation.

[0051] Furthermore, an intelligent temperature control chip 702 is provided on the PCB board 7. High thermal conductivity phase change material is filled between the heating elements inside the frame 1 and the frame 1. Ventilation holes penetrating both ends are provided inside the outer wall of the frame 1, and a micro cooling fan is provided inside the ventilation holes.

[0052] In specific implementation, high thermal conductivity phase change material is filled between the heating elements inside the frame 1 and the frame 1. A micro cooling fan controlled by the intelligent temperature control chip 702 is installed inside the frame, and ventilation holes are provided to optimize air circulation and improve the heat dissipation efficiency.

[0053] The high thermal conductivity phase change material includes but is not limited to thermal conductive silica gel, and auxiliary heat dissipation is carried out through the micro cooling fan and the ventilation holes.

[0054] Furthermore, referring to Figures 3 to 7 , annular V-shaped grooves 131 are provided on the connection surfaces of the lens mount 103 and the lens 2. The top and bottom of the high-elastic silica gel pad 301, the spring damper array 302, and the soft rubber sleeve 303 are provided with inclined surfaces that fit the V-shaped grooves 131.

[0055] In specific implementation, when damping, increasing firmness, and precise positioning are required, when connecting the lens mount 103 and the lens 2, the high-elastic silica gel pad 301, the spring damper array 302, and the soft rubber sleeve 303 are first concentrically assembled together to form the multi-layer anti-seismic buffer structure 3. At this time, the top and bottom of the multi-layer anti-seismic buffer structure 3 are just the V-shaped inclined surfaces that fit the V-shaped grooves 131. Through the setting of the inclined surfaces and the V-shaped grooves 131, the contact area between the connection surfaces of the lens mount 103, the lens 2, and the multi-layer anti-seismic buffer structure 3 can be effectively increased. When adhesively fixing, the firmness of the adhesion can be improved. At the same time, the setting of the V-shaped grooves 131 and the inclined surfaces can achieve precise positioning through the inclined surfaces and the V-shaped grooves 131. When the inclined surfaces at the top and bottom of the high-elastic silica gel pad 301, the spring damper array 302, and the soft rubber sleeve 303 are just completely placed inside the V-shaped grooves 131 for adhesion, at this time, the lens mount 103, the lens 2, the high-elastic silica gel pad 301, the spring damper array 302, and the soft rubber sleeve 303 are coaxial, thereby realizing precise positioning.

[0056] Furthermore, referring to Figure 7, the cross-sections of the highly elastic silica gel pad 301 and the soft rubber sleeve 303 are both arranged in an isosceles trapezoid shape, and the cross-section of the spring damper array 302 is arranged in a hexagonal shape.

[0057] In specific implementation, after the highly elastic silica gel pad 301, the spring damper array 302, and the soft rubber sleeve 303 are assembled in concentric circles, the top and bottom formed by the overall combination of the highly elastic silica gel pad 301, the spring damper array 302, and the soft rubber sleeve 303 can just form a V-shaped inclined surface structure that fits the V-shaped groove.

[0058] The middle part of the spring damper array 302 is several springs arranged in an annular array, and both the top and bottom are rings made of elastic materials and arranged in an isosceles triangle cross-section.

[0059] The inclined surfaces of the rings are flush with the inclined surfaces of the highly elastic silica gel pad 301 and the soft rubber sleeve 303.

[0060] Furthermore, the front outer frame 101 and the two rear outer frames 102 are both made of magnesium alloy and formed by precision die-casting. Several heat dissipation fins 106 are provided on the outer walls of the front outer frame 101 and the two rear outer frames 102, and the heat dissipation fins 106 are integrally formed with the frame 1 and the surface is blackened.

[0061] In specific implementation, the frame 1 adopts a design of large-area heat dissipation fins 106. The fins are integrally formed with the frame 1 and the surface is blackened and cooperate with the micro heat dissipation fan controlled by the intelligent temperature control chip 702. The combination of the material layer (the frame 1 made of magnesium alloy, the heat dissipation fins 106 are integrally formed with the frame 1 and the surface is blackened, and the high thermal conductivity phase change material is filled between the heating elements inside the frame 1 and the frame 1), the mechanical layer (ventilation holes running through both ends are provided inside the outer wall of the frame 1, and a micro heat dissipation fan is provided inside the ventilation holes), and the electronic control layer (the micro heat dissipation fan controlled by the intelligent temperature control chip 702) significantly improves the heat dissipation efficiency.

[0062] Furthermore, both ends of the front outer frame 101 are provided with buckles 104 and fixing plates 105 parallel to the installation plane, and several through holes are provided on the fixing plates 105.

[0063] In specific implementation, the settings of the buckles 104 and the fixing plates 105 facilitate the installation of the module on the vehicle.

Claims

1. An ADAS binocular camera module structure, comprising: A frame (1) composed of a front outer frame (101) and two rear outer frames (102), a lens (2), a multi-layer seismic buffer structure (3), a flexible circuit board (4), an image sensor module (5), a BTB connector (6), a PCB board (7), a sealing structure (8), and an interface (9), characterized in that: two lens mounts (103) are provided at the front end of the front outer frame (101), and a multi-layer seismic buffer structure (3) is provided between the lens mounts (103) and the lens (2). The multi-layer seismic buffer structure (3) includes an inner layer composed of a highly elastic silica gel pad (301), a middle layer composed of a spring damper array (302), and an outer layer composed of a soft rubber sleeve (303).

2. The structure of an ADAS binocular camera module according to claim 1, wherein: The interior of the front outer frame (101) forms two independent cavities, and a flexible circuit board (4) and a PCB board (7) are fixedly connected inside the cavities. An image sensor module (5) aligned with the lens (2) is provided on the front surface of the flexible circuit board (4). A BTB connector (6) is provided between the flexible circuit board (4) and the PCB board (7). A sealing structure (8) is provided between the edge of the cavity and the connection surface of the rear outer frame (102). An interface (9) is fixedly connected to the PCB board (7).

3. The structure of an ADAS binocular camera module according to claim 2, wherein: The interface (9) includes a connection seat (901) fixedly connected to the PCB board (7). A sealed interface (902) is inserted at the end of the connection seat (901). The outer end of the sealed interface (902) passes through the outer wall of the rear outer frame (102). An outer interface (921) is provided at the outer end of the sealed interface (902). An inner interface (922) inserted into the connection seat (901) is provided at the inner end of the sealed interface (902). A sealing ring (903) hermetically connected to the inner wall of the rear outer frame (102) is provided at the top of the outer end of the inner interface (922).

4. The structure of an ADAS binocular camera module according to claim 3, wherein: A protruding positioning post (122) is fixedly connected to one corner of the sealing surface of the rear outer frame (102). A positioning hole corresponding to the positioning post (122) is provided on the sealing surface of the front outer frame (101). A sealing groove (121) is opened inside the sealing surface of the rear outer frame (102). The sealing structure (8) is provided inside the sealing groove (121). The sealing structure (8) includes a sealing member (801) connected to the inside of the sealing groove (121). At least four elastic connecting members (802) are evenly provided on the inner surface of the sealing member (801). The elastic connecting members (802) are arranged in a T shape, and the ends of the elastic connecting members (802) are connected to the surface edge of the PCB board (7).

5. The structure of an ADAS binocular camera module according to claim 4, characterized in that: An acceleration sensor (701) is provided inside the frame (1).

6. The structure of an ADAS binocular camera module according to claim 5, characterized in that: An intelligent temperature control chip (702) is provided on the PCB board (7). A highly thermally conductive phase change material is filled between the heating elements inside the frame (1) and the frame (1). Ventilation holes penetrating both ends are provided inside the outer wall of the frame (1), and a micro cooling fan is provided inside the ventilation holes.

7. The structure of an ADAS binocular camera module according to claim 6, wherein: Annular V-shaped grooves (131) are opened on the connection surfaces of the lens mounts (103) and the lens (2). The top and bottom of the highly elastic silica gel pad (301), the spring damper array (302), and the soft rubber sleeve (303) are provided with inclined surfaces that fit the V-shaped grooves (131).

8. The structure of an ADAS binocular camera module according to claim 7, characterized in that: The cross-sections of the highly elastic silica gel pad (301) and the soft rubber sleeve (303) are both arranged in an isosceles trapezoid shape, and the cross-section of the spring damper array (302) is arranged in a hexagonal shape.

9. The structure of an ADAS binocular camera module according to claim 8, wherein: The front outer frame (101) and the two rear outer frames (102) are both made of magnesium alloy and formed by precision die-casting. A plurality of heat dissipation fins (106) are provided on the outer walls of the front outer frame (101) and the two rear outer frames (102). The heat dissipation fins (106) are integrally formed with the frame (1) and the surface is blackened.

10. The structure of an ADAS binocular camera module according to claim 9, characterized in that: Both ends of the front outer frame (101) are provided with buckles (104) and fixing plates (105) parallel to the installation plane. A plurality of through holes are provided on the fixing plates (105).

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