Composite liquid cooling radiator

Abstract

A composite liquid-cooled heat sink comprises a vapor chamber element and a semi-open housing, the vapor chamber element comprises an upper cover with an opening and a lower plate, the upper cover is provided with an upper cover upper surface, the lower plate is provided with a lower plate upper surface, the lower plate upper surface is provided with a concave opening relative to the opening and an annular cavity, and when the upper cover is coupled to the lower plate, the annular cavity is provided with an annular cavity. The annular cavity forms a closed air cavity, the opening of the upper cover is communicated with the concave opening of the lower plate, the semi-open shell is coupled to the lower plate of the steam cavity element to form a heat exchange cavity, the semi-open shell comprises a spraying head and is provided with an input port and an output port, the input port is used for inputting cooling liquid, the spraying head is connected to the input port, and the output port is used for outputting cooling liquid. The cooling liquid is splashed on the surface of the opening through the open hole and the concave opening, then flows through the upper surface of the upper cover and the heat exchange cavity and is output through the output port; therefore, the cooling device can be applied to cooling and heat dissipation of wafers with ultra-high power and ultra-high power density, triple wafer heat dissipation and temperature equalization effects can be achieved at the same time, and the heat dissipation effect is better provided.

Description

Technical Field

[0001] The present invention relates to a liquid-cooled radiator, in particular to a composite liquid-cooled radiator integrating jet flow cooling technology, vapor chamber two-phase flow circulation heat dissipation technology, and shovel-tooth microchannel heat dissipation technology, especially a jet-flow type composite liquid-cooled radiator that uses the upper surface of the cover of the condensation area of the vapor chamber component to form microchannels to greatly increase the heat dissipation area. Background Art

[0002] When the thermal design power (TDP) and power density of high-computing power chips and communication chips in servers and communication switches are gradually soaring, the temperature of the chips is also gradually soaring, and the heat generated by the bottom-layer chips in 3D stacked IC packages is also difficult to dissipate. Traditional air-cooled heat dissipation technology has faced bottlenecks, and liquid-cooled heat dissipation technology has thus emerged. Among them, cold plate liquid-cooled heat dissipation technology has gradually become the mainstream.

[0003] However, the conventional cold plate heat dissipation technology can be roughly divided into shovel-tooth microchannel cold plates, jet-flow cold plates, and two-phase cold plates. However, when the chip power exceeds 1,000W, the power density exceeds 100W / cm2, and it is a 3D stacked package structure, the current conventional cold plate heat dissipation technology also faces bottlenecks in heat dissipation and cooling. Generally, a pure jet-flow cold plate can effectively reduce the temperature of the chips in the coolant impact area, but it will also cause the problem of too large a temperature difference across the entire chip; generally, a shovel-tooth microchannel cold plate that relies on heat dissipation fins also faces difficulties in reducing thermal resistance and temperature uniformity problems; and the two-phase cold plate also faces problems of complex and expensive two-phase coolant circulation systems and insufficient heat dissipation area.

[0004] Therefore, in order to solve the heat dissipation and cooling challenges brought about by the gradual soar of the chip power and power density of various conventional cold plate liquid-cooled radiators, it is necessary to invent and provide a more efficient chip heat dissipation and heat equalization solution.

[0005] The composite liquid-cooled radiator technology of the present invention draws on the advantages of jet flow and two-phase flow circulation and large-area shovel-tooth microchannels, and integrates various technologies into a liquid-cooled radiator, so that the ultra-high power and ultra-high power density chips cooled and dissipated by the technology of the present invention can achieve lower temperatures and temperature uniformity. Summary of the Invention

[0006] In view of this, the purpose of the present invention is to provide a composite liquid-cooled radiator that can overcome the defects of the prior art, can be applied to the heat dissipation and cooling of ultra-high power and ultra-high power density chips, can simultaneously achieve triple chip heat dissipation and heat equalization effects, and better provide heat dissipation effects.

[0007] To achieve the above purpose, the present invention discloses a composite liquid-cooled radiator, which is characterized by comprising:

[0008] A three-dimensional vapor chamber component, comprising:

[0009] An upper cover having an opening and an upper surface; and

[0010] A lower plate disposed opposite to the upper cover, having a lower plate upper surface, the lower plate upper surface having a recessed opening opposite to the opening and an annular cavity, the recessed opening having an opening surface, when the upper cover is coupled to the lower plate, the annular cavity forms a sealed air cavity, and the opening and the recessed opening communicate with each other; and

[0011] A semi-open housing coupled to the lower plate of the three-dimensional vapor chamber component to form a heat exchange cavity, the semi-open housing including a spray head and having an input port and an output port, the input port being used to input a coolant, the spray head being connected to the input port for spraying the coolant onto the opening surface first through the opening and the recessed opening, and then flowing through the upper surface of the upper cover and the heat exchange cavity and outputting the coolant through the output port.

[0012] Wherein, the three-dimensional vapor chamber component further includes a plurality of microchannels, the microchannels are disposed on the upper surface of the upper cover, and the microchannels communicate with the recessed opening respectively and are located in the heat exchange cavity.

[0013] Wherein, the channel width of the microchannels is less than or equal to 1 mm.

[0014] Wherein, the spray head is used to spray the coolant onto the opening surface first through the opening and the recessed opening, and then flow through the microchannels on the upper surface of the upper cover and the heat exchange cavity, and output the coolant through the output port.

[0015] Wherein, the lower plate further has a lower plate lower surface for contacting a heat source, and a plurality of heat dissipation structures are provided on the opening surface, and the opening surface is located at a hot spot of the heat source.

[0016] Wherein, the semi-open housing further has a top plate and a side plate, the input port is disposed on the top plate, and the output port is disposed on the top plate or the side plate.

[0017] Wherein, the spray head is disposed on the top plate and is located in the heat exchange cavity.

[0018] Wherein, the spray head has a spray opening, the spray opening is located in the recessed opening for spraying the coolant onto the opening surface located in the recessed opening nearby.

[0019] Wherein, the semi-open housing further has a top plate and a side plate. A top plate flow channel is provided in the top plate and has a top plate side end. The input port is provided at the top plate side end. The top plate flow channel is used to connect the input port and the spray head, and the output port is provided on the side plate.

[0020] Wherein, the three-dimensional vapor chamber element further includes a continuous porous capillary structure and a plurality of support columns with porous capillary structures respectively disposed between the upper cover and the lower plate in the sealed gas chamber.

[0021] In summary, the present invention provides a composite liquid cooling radiator. First, heat energy is absorbed through the lower surface of the lower plate of the vapor chamber element that is preferentially in close contact with the heat source. Directly through the working fluid inside the lower plate, phase change and two-phase flow circulation occur in the porous capillary structure and the sealed gas chamber. The heat energy is taken away through the phase change and the two-phase flow circulation between the heat absorption area and the condensation area, and heat exchange is carried out with the coolant in the heat exchange cavity. Further, the heat equalization effect of the heat source relative to the annular vapor chamber can be achieved, thereby reducing the temperature difference on the heat source. Then, by arranging the spray head in the semi-open housing, the coolant can be directly sprayed and impinged on the opening surface of the concave opening that is in close contact with the hot spot of the heat source for forced heat exchange. Further, the composite liquid cooling radiator provided by the present invention forms a large-area heat dissipation structure with a micro-channel structure on the upper surface of the upper cover in the three-dimensional vapor chamber condensation area. In addition to increasing the heat dissipation surface area in the two-phase flow circulation of the vapor chamber element, when the coolant impinges on the opening surface of the concave opening, the coolant can be drained and flow along the direction of the micro-channel over the large-area fins and further perform forced heat exchange, allowing the coolant to take away the heat energy from the radiator. Compared with the prior art, the composite liquid cooling radiator provided by the present invention has the following advantages: First, the composite liquid cooling radiator of the present invention can mainly be applied to the heat dissipation of wafers with ultra-high power and ultra-high power density. First, the coolant is impinged on the opening surface of the upper surface of the lower plate that contacts the wafer hot spot by the spray head located above the wafer hot spot to perform forced heat exchange on the high-density heat energy generated by the wafer hot spot to reduce the temperature of the wafer hot spot. At the same time, due to the two-phase flow circulation inside the three-dimensional vapor chamber element, the entire wafer can reach a uniform temperature. And at the same time, the heat energy released in the three-dimensional vapor chamber condensation area is subjected to forced heat exchange with the large-area fins of the micro-channel on the upper surface of the upper cover and the drained coolant, and the heat energy is taken away from the liquid cooling radiator through the heat exchange cavity and the output port, achieving a triple effect of wafer heat dissipation and temperature equalization at the same time. Brief Description of the Drawings

[0022] Figure 1 Shows a cross-sectional view of a composite liquid cooling radiator according to a specific embodiment of the present invention.

[0023] Figure 2 Shows according to Figure 1Exploded view of the composite liquid-cooled radiator.

[0024] Figure 3 Shows according to Figure 2 Schematic diagram of the upper cover.

[0025] Figure 4 Shows a cross-sectional view of the composite liquid-cooled radiator of another specific embodiment of the present invention.

[0026] Figure 5 Shows a cross-sectional view of the composite liquid-cooled radiator of another specific embodiment of the present invention.

[0027] Figure 6 Shows a cross-sectional view of the composite liquid-cooled radiator of another specific embodiment of the present invention. Detailed Description of the Invention

[0028] In order to make the advantages, spirit, and features of the present invention more easily and clearly understood, the following will be described in detail and discussed with specific embodiments and with reference to the accompanying drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. Also, the elements in the drawings are only used to express their relative positions and are not drawn to their actual proportions. The step numbers of the present invention are only used to distinguish different steps and do not represent the order of the steps. This is stated first for clarification.

[0029] Please refer to Figure 1 , Figure 1 Shows a cross-sectional view of the composite liquid-cooled radiator 1 of a specific embodiment of the present invention. As Figure 1 shown, the present invention provides a composite liquid-cooled radiator 1, which includes a three-dimensional vapor chamber element 10 and a semi-open housing 30. The three-dimensional vapor chamber element 10 further includes an upper cover 11 and a lower plate 12. This lower plate is a lower plate that can be used to simultaneously form the cavity of the three-dimensional vapor chamber element and the base of the entire liquid-cooled radiator, and its thickness is greater than 2 mm. The upper cover 11 has an opening 111. The lower plate 12 has a lower plate upper surface 121, and the lower plate upper surface 121 has a recessed opening 122 relative to the opening 111 and an annular cavity ( Figure 1(not marked in the figure), the recessed opening 122 has an opening surface 1221. When the upper cover 11 is coupled to the lower plate 12, an annular cavity forms a sealed air cavity 124, and the opening 111 and the recessed opening 122 communicate with each other. The semi-open housing 30 is coupled to the lower plate 12 of the three-dimensional vapor chamber element 10 to form a heat exchange chamber 31. The semi-open housing 30 includes a spray head 301, an input port 302, and an output port 303. The input port 302 is used to input the coolant. The spray head 301 is connected to the input port 302 and is used to spray the coolant onto the opening surface 1221 through the opening 111 and the recessed opening 122 first, and then flow through the upper surface 112 of the upper cover of the condensation area of the vapor chamber 10 and the heat exchange chamber 31 and output the coolant through the output port 303.

[0030] Next, the three-dimensional vapor chamber element 10, the upper cover 11, the lower plate 12, and the semi-open housing 30 in the composite liquid-cooled radiator 1 will be described in detail below. Please refer to Figure 1 , Figure 2 and Figure 3 . Figure 2 shows an exploded view of the composite liquid-cooled radiator 1 according to Figure 1 , Figure 3 shows a schematic diagram of the upper cover according to Figure 2 . Please refer to Figure 1 , Figure 2 and Figure 3 . In practical applications, the three-dimensional vapor chamber element 10 of the present invention further includes a plurality of microchannels 41 disposed on the upper surface 112 of the upper cover 11. Among them, the overall structure of the plurality of microchannels 41 is quadrilateral, and the four corners of the quadrilateral are chamfered structures. It should be noted that after the upper cover 11 is coupled to the lower plate 12, the plurality of microchannels 41 communicate with the recessed opening 122 respectively and are located in the heat exchange chamber 31. Specifically, there is a hole in the middle of the entire structure with microchannels 41. The position of the hole is relative to the opening 111 and the recessed opening 122, and the hole can just accommodate the spray head 301 therein. And further, as Figure 3 shows, in practice, the overall microchannel structure 41 can be milled out of the upper cover copper metal material by the shovel tooth process, such as the chamfers on the four sides and the hole in the middle, and then the drainage channels of the microchannels 41 are processed in sequence so that the coolant can flow through the fins of each microchannel more evenly. Considering the heat exchange area of the microchannels and the flow velocity of the coolant flowing through, the channel width d of the microchannels 41 is less than or equal to 1 mm. For the sake of clarity of the drawing, Figure 2 the upper cover 11 in does not show the characteristics of the microchannels. In practical applications, the overall contour of the microchannel structure, the channel width of the microchannels, the thickness of the copper metal between the microchannels, the drainage structure, etc. are not limited to this and can be adjusted according to the design.

[0031] Next, please continue to refer to Figure 1 and Figure 2 , as Figure 1 and Figure 2 shown. The three-dimensional vapor chamber element 10 further includes a plurality of support columns 42 having a porous capillary structure. The support columns 42 are pre-set on the lower plate 12. Then, when the upper cover 11 is coupled with the lower plate 12, the plurality of support columns 42 having a porous capillary structure are located between the upper cover 11 and the lower plate 12, and at this time, a continuous capillary structure is formed with the capillary structure on the lower surface of the upper cover and the capillary structure on the lower plate. Then, the working fluid is injected into the closed air cavity and evacuated to form the three-dimensional vapor chamber element 10. In practice, the working fluid can be water; or a mixture of water and ethylene glycol or propylene glycol, or it can also be a two-phase coolant, such as R134a.

[0032] Next, the cylindrical structure in the middle of the lower plate 12 forms a recessed opening 122, and the opening surface 1221 in the recessed opening 122 can further form a plurality of heat dissipation structures 126 to increase the surface area for impinging forced heat exchange with the coolant. The heat dissipation structures 126 can be small cylinders, which can extend upward or recess downward from the opening surface 1221. However, the shape, quantity, and arrangement of the heat dissipation structures 126 can all be optimized according to actual requirements.

[0033] Next, in Figure 2 the square groove shown in the middle of the lower plate 12 corresponds to the space of the annular cavity 123. Please refer to Figure 1 and Figure 2 together. When the upper cover 11 is coupled with the lower plate 12, the annular cavity 123 of the lower plate 12 further forms a closed air cavity 124, and a plurality of support columns 42 having a porous capillary structure are arranged between the upper cover 11 and the lower plate 12. However, when the upper cover 11 is coupled with the lower plate 12, since the opening 111 of the upper cover 11 communicates with the recessed opening 122 of the lower plate 12, therefore, compared with the support columns 42 on the lower plate, a plurality of heat dissipation structures 126 on the lower plate 12 are separated at this time. Specifically, for the three-dimensional vapor chamber element 10 formed after the upper cover 11 is coupled with the lower plate 12, the characteristics of the heat dissipation structures 126 provided on the lower plate 12 can be directly seen from directly above the three-dimensional vapor chamber element 10 in a top-down view.

[0034] Next, please continue to refer to Figure 1 and Figure 2, the lower surface 125 of the lower plate 12 of the three-dimensional vapor chamber component 10 contacts the heat source 90. In practical applications, the lower surface 125 of the lower plate 12 of the three-dimensional vapor chamber component 10, as the heat absorption end, preferentially receives the heat energy emitted from the heat source 90. Then, the working fluid in the porous capillary structure on the upper surface 121 of the lower plate inside the three-dimensional vapor chamber component 10 undergoes a phase change to a gaseous working fluid due to heat absorption. Further, the gaseous working fluid drifts upward in the sealed gas chamber 124 to the upper cover 11. At this time, since the microchannel 41 fins on the upper surface 112 of the upper cover can increase the heat dissipation surface area, the gaseous working fluid undergoes a phase change back to a liquid-phase working fluid, and finally returns to the bottom of the three-dimensional vapor chamber component 10 along the capillary structure inside the three-dimensional vapor chamber component 10 by capillary action, completing the two-phase flow cycle.

[0035] In this specific embodiment, the semi-open housing 30 is locked to the lower plate 12 and is hermetically joined to the lower plate 12. That is to say, after the three-dimensional vapor chamber component 10 is manufactured, the semi-open housing 30 is further coupled to the three-dimensional vapor chamber component 10. The space formed by the semi-open housing 30 and the lower plate 12 is the heat exchange cavity 31. Among them, the upper surface 112 of the upper cover 11 of the three-dimensional vapor chamber component 10 with a plurality of microchannel 41 structures is also accommodated in the heat exchange cavity 31.

[0036] Next, please continue to refer to Figure 1 and Figure 2 , the semi-open housing 30 further has a top plate 305 and a side plate 306, and the input port 302 and the spray head 301 are arranged on the top plate 305; the output port 303 is arranged on the side plate 306. The output port 303 can also be arranged on the top plate 305. Further, when the semi-open housing 30 is coupled to the three-dimensional vapor chamber component 10, at this time, the spray head 301 of the semi-open housing 30 is located in the heat exchange cavity 31, and further, the spray orifice (not shown in the figure) of the spray head 301 is located in the recessed opening 122 of the upper cover. That is to say, the opening in the middle of the entire heat dissipation structure with the microchannel 41 mentioned above is used to accommodate the spray head 301.

[0037] In practical applications, as Figure 1 shown, Figure 1The dashed arrow in [it] indicates the flow direction F of the coolant. After the coolant flows into from the input port 302 of the top plate 305, it then sprays the coolant at the spray port along the spray head 301 onto the opening surface 1221 located in the recessed opening 122. The opening surface 1221 at this time corresponds to the relative position of the hot spot of the heat source 90, and is also the closest distance to the heat source 90. Therefore, when the coolant is directly sprayed onto the opening surface 1221, it can directly impact the area with the highest temperature of the heat source for forced heat exchange and heat dissipation. Then, the coolant sprayed onto the opening surface 1221 will flow along the multiple microchannel structures on the upper surface 112 of the upper cover 11 of the upper cover 11. After the coolant is sprayed from the bottom and flows upstream and through the microchannels 41 and the heat exchange cavity 31. Finally, it is discharged from the output port 303 on the side plate 306 to complete a liquid cooling cycle of heat exchange. It should be noted that for the composite liquid cooling radiator 1 of the present invention, during the process of heat exchange and heat dissipation, in addition to increasing the heat dissipation surface area by the multiple microchannel structures on the upper cover, the coolant can also be further forced to flow orderly along the trajectory of the microchannels, and during the process of flowing through each microchannel, it can further perform forced heat exchange with the fins to take away the heat energy, thereby increasing the overall heat dissipation efficiency.

[0038] In summary, when the composite liquid cooling radiator provided by the present invention is actually applied for heat dissipation, first, the two-phase flow cycle inside the three-dimensional vapor chamber element 10 can perform temperature equalization and heat dissipation. In addition, the coolant can be directly sprayed and impacted at the recessed opening 122, allowing the coolant to directly perform forced heat exchange and heat dissipation at the place with the highest temperature, greatly increasing the overall heat dissipation efficiency. In addition, the composite liquid cooling radiator provided by the present invention further forms a large-area fin heat dissipation device with microchannel structures in the three-dimensional vapor chamber condensation area. In addition to increasing the heat dissipation surface area for the two-phase flow cycle of the three-dimensional vapor chamber element, when the coolant impacts the recessed opening 122, the coolant can flow along the flow direction of the microchannels and further perform forced heat exchange with the large-area heat dissipation fins, thereby greatly increasing the overall heat dissipation efficiency again.

[0039] The above three-dimensional vapor chamber element 10 can be applied to electronic components with relatively large sizes near the heat source, but the three-dimensional vapor chamber element can also be in other forms. Please refer to Figure 4 , Figure 4 which shows a cross-sectional view of the composite liquid cooling radiator of another specific embodiment of the present invention. As Figure 4As shown, the composite liquid cooling radiator 2 of this specific embodiment includes a three-dimensional vapor chamber element 100 and a semi-open housing 30. The lower surface 1250 of the lower plate 120 of the three-dimensional vapor chamber element 100 contacts the heat source 90. At this time, the size specification of the heat source 90 is relatively large, and the three-dimensional vapor chamber element 100 can be applied to heat sources 90 of any specification. The other devices of this specific embodiment are substantially the same as the corresponding devices of the foregoing specific embodiment, so they will not be described herein again.

[0040] Further, when the composite liquid cooling radiator is installed in a server, if there is a height limit for the electronic device, for example, a 1U specification server, it is impossible to directly set the input port above the top plate at this time. Therefore, the present invention further provides other forms of composite liquid cooling radiators. Please refer to Figure 5 , Figure 5 shows a sectional view of a composite liquid cooling radiator 3 according to another specific embodiment of the present invention. As Figure 5 shown, the semi-open housing 300 of the composite liquid cooling radiator 3 of this specific embodiment has a top plate 3050 and side plates 306. A top plate flow channel 3051 is provided in the top plate 3050. The input port 302 is provided at the top plate side end 3052 of the top plate flow channel 3051, and the top plate flow channel 3051 connects the input port 302 and the spray head 301. The output port 303 is also provided on the side plate 306. The coolant flows in from the input port 302 on the top plate side end 3052 and then flows along the top plate flow channel 3051 to the spray head 301. Further, the coolant directly splashes and impacts the opening surface 1221 of the concave opening 122 and absorbs the heat energy of the heat source 90 therefrom. Then, the coolant further performs heat exchange along the micro-channel 41 structure on the upper surface 112 of the upper cover 11 of the upper cover 11, takes away the remaining heat energy again, and flows through the heat exchange cavity 31. Finally, it flows out from the output port 303 of the side plate 306 to complete a liquid cooling cycle of heat exchange. In practice, the top plate side end is arranged on the right side of the top plate, but the arrangement position is not limited thereto, and the output port can also be arranged in the top plate.

[0041] Next, the number of spray openings on the spray head is not limited to 1 group. The present invention further provides other forms of composite liquid cooling radiators. Please refer to Figure 6 , Figure 6 shows a sectional view of a composite liquid cooling radiator 4 according to another specific embodiment of the present invention. As Figure 6As shown, the spray head 3010 of the composite liquid cooling radiator 4 of the present specific embodiment is further provided with a plurality of spray openings 3011. In practice, the spray openings can be drilled with a Computer Numerical Control (CNC) processing machine in a semi-open housing to form the flow channels of the spray openings. In this specific embodiment, the number of spray openings is 4, but the number and aperture can be designed according to actual needs. In actual application, after the coolant flows in from the input port 302, the coolant is sprayed and impacts the opening surface 1221 of the recessed opening 122 from the plurality of spray openings 3011. At this time, the recessed opening 122 can be further provided with a heat dissipation structure 126 with a plurality of cylindrical cavities, and directly above each heat dissipation structure 126, there is a corresponding spray opening 3011. At this time, without reducing the structural strength of the three-dimensional vapor chamber component, the heat dissipation degree of heat exchange can be further improved. The composite liquid cooling radiator 4 of the present specific embodiment is substantially the same as the device corresponding to the foregoing specific embodiment, so it will not be elaborated herein again.

[0042] In summary, the present invention provides a composite liquid cooling radiator. First, it absorbs heat energy through the lower surface of the lower plate of the vapor chamber element that is preferentially in close contact with the heat source. Directly through the working fluid inside the lower plate, phase change and two-phase flow circulation occur in the porous capillary structure and the sealed gas chamber. The heat energy is taken away through phase change and the two-phase flow circulation between the heat absorption area and the condensation area, and heat exchange is carried out with the coolant in the heat exchange cavity. Further, it can achieve the effect of heat equalization for the heat source relative to the annular vapor chamber, thereby reducing the temperature difference on the heat source. Then, by arranging the spray head in the semi-open housing, the coolant can be directly sprayed and impinged on the opening surface of the concave opening that is in close contact with the hot spot of the heat source for forced heat exchange. Further, the composite liquid cooling radiator provided by the present invention forms a large-area heat dissipation structure with a microchannel structure on the upper surface of the upper cover of the three-dimensional vapor chamber condensation area. In addition to increasing the heat dissipation surface area in the two-phase flow circulation of the vapor chamber element, when the coolant impinges on the concave opening surface, the coolant can be drained and flow along the direction of the microchannel through the large-area fins and further perform forced heat exchange, allowing the coolant to take away the heat energy from the radiator. Compared with the prior art, the composite liquid cooling radiator provided by the present invention has the following advantages: First, the composite liquid cooling radiator of the present invention can be mainly applied to the heat dissipation of wafers with ultra-high power and ultra-high power density. First, the coolant is impinged on the opening surface of the upper surface of the lower plate that is in contact with the wafer hot spot by the spray head located above the wafer hot spot to perform forced heat exchange on the high-density heat energy generated by the wafer hot spot to reduce the temperature of the wafer hot spot. At the same time, due to the two-phase flow circulation inside the three-dimensional vapor chamber element, the entire wafer can reach the purpose of uniform temperature. And at the same time, the heat energy released by the three-dimensional vapor chamber condensation area is subjected to forced heat exchange with the drained coolant through the large-area fins of the microchannel on the upper surface of the upper cover, and the heat energy is taken away from the liquid cooling radiator through the heat exchange cavity and the output port, achieving a triple effect of wafer heat dissipation and uniform temperature at the same time.

[0043] From the detailed description of the above preferred specific embodiments, it is hoped that the features and spirit of the present invention can be more clearly described, rather than limiting the scope of the present invention by the above-disclosed preferred specific embodiments. On the contrary, the purpose is to hope to cover various changes and equivalent arrangements within the scope of the patent scope to which the present invention is to be applied. Therefore, the scope of the patent scope applied for by the present invention should be interpreted as broadly as possible according to the above description, so as to cover all possible changes and equivalent arrangements.

Claims

1. A composite liquid-cooled radiator, characterized in that Comprising: A three-dimensional vapor chamber component, comprising: An upper cover having an opening and an upper surface; and A lower plate disposed relative to the upper cover, having a lower plate upper surface with a recessed opening relative to the opening and an annular cavity. The recessed opening has an opening surface. When the upper cover is coupled to the lower plate, the annular cavity forms a sealed air cavity, and the opening and the recessed opening communicate with each other; and A semi-open housing coupled to the lower plate of the three-dimensional vapor chamber component to form a heat exchange cavity. The semi-open housing includes a spray head and has an input port and an output port. The input port is used to input a coolant. The spray head is connected to the input port to first spray the coolant through the opening and the recessed opening onto the opening surface, and then flow through the upper surface of the upper cover and the heat exchange cavity and output the coolant through the output port.

2. The composite liquid-cooled radiator according to claim 1, wherein, The three-dimensional vapor chamber component further includes a plurality of microchannels disposed on the upper surface of the upper cover, and the microchannels communicate with the recessed opening respectively and are located in the heat exchange cavity.

3. The composite liquid-cooled radiator according to claim 2, wherein The channel width of the microchannels is less than or equal to 1 mm.

4. The composite liquid-cooled radiator according to claim 2, wherein The spray head is used to first spray the coolant through the opening and the recessed opening onto the opening surface, and then flow through the microchannels on the upper surface of the upper cover and the heat exchange cavity, and output the coolant through the output port.

5. The composite liquid-cooled radiator according to claim 1, wherein, The lower plate further has a lower plate lower surface for contacting a heat source, and a plurality of heat dissipation structures are provided on the opening surface, and the opening surface is located at a hot spot of the heat source.

6. The composite liquid-cooled radiator according to claim 1, wherein, The semi-open housing further has a top plate and a side plate. The input port is provided on the top plate, and the output port is provided on the top plate or the side plate.

7. The composite liquid-cooled radiator according to claim 6, wherein, The spray head is provided on the top plate and is located in the heat exchange cavity.

8. The composite liquid-cooled radiator according to claim 7, wherein, The spray head has a spray port located in the recessed opening for spraying the coolant in the recessed opening onto the opening surface nearby.

9. The composite liquid-cooled radiator according to claim 1, wherein, The semi-open housing further has a top plate and a side plate. A top plate channel is provided in the top plate and has a top plate side end. The input port is provided at the top plate side end. The top plate channel is used to connect the input port and the spray head, and the output port is provided on the side plate.

10. The composite liquid-cooled radiator according to claim 1, wherein, The three-dimensional vapor chamber component further includes a continuous porous capillary structure and a plurality of support columns with porous capillary structures respectively disposed between the upper cover and the lower plate in the sealed air cavity.

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