Liquid cooling heat dissipation device

Abstract

The invention relates to a liquid cooling heat dissipation device, which comprises a water cooling head group, a heat dissipation module and a water cooling row group, the water-cooling head set comprises a water-cooling plate attached to the heat source and a water-cooling shell base combined with the water-cooling plate, the water-cooling plate is provided with at least one caulking groove on the periphery of the corresponding position of the water-cooling shell base and on one side facing the water-cooling shell base, and the water-cooling shell base is provided with a plurality of pipe connectors. The radiating module comprises a plurality of radiating fins and at least one heat pipe, one end of the heat pipe penetrates through the radiating fins, and the other end of the heat pipe is combined in the caulking groove. The water-cooling row group comprises a water-cooling row and a plurality of connecting pipes, one ends of the connecting pipes are connected with the water-cooling row, and the other ends are respectively connected with the pipe connectors; therefore, the temperature of the water cooling plate is reduced, and the heat dissipation efficiency of the liquid cooling heat dissipation device is improved.

Description

Technical Field

[0001] This case is related to a heat dissipation device, especially a liquid cooling heat dissipation device. Background Art

[0002] Traditional air-cooled heat dissipation methods are difficult to discharge a large amount of heat to the outside in a short time, so they are gradually insufficient for use. Therefore, water-cooled heat dissipation has been widely used in high-performance electronic devices. Moreover, the use of a water-cooled heat dissipation device is to attach a water-cooled head to a heat source for heat exchange and conduct it through a water-cooling liquid to a radiator for dissipation.

[0003] However, after the water-cooled head operates for a period of time, the temperature of its housing also rises, which in turn leads to a decrease in heat conduction efficiency. In this regard, how to reduce the temperature of the housing of the water-cooled head to effectively transfer the heat generated by the electronic device and improve the heat dissipation efficiency is the research motivation of the applicant. Summary of the Invention

[0004] The purpose of this case is to provide a liquid cooling heat dissipation device to reduce the temperature of the water-cooled plate and thus improve the heat dissipation efficiency of the liquid cooling heat dissipation device.

[0005] To achieve the above purpose, this case is a liquid cooling heat dissipation device for dissipating heat from a heat source, including a water-cooled head group, a heat dissipation module, and a water-cooled radiator group. The water-cooled head group includes a water-cooled plate attached to the heat source and a water-cooled housing combined with the water-cooled plate. At least one groove is provided on the outer periphery of the water-cooled plate corresponding to the position of the water-cooled housing and facing the water-cooled housing. The water-cooled housing is provided with a plurality of pipe interfaces. The heat dissipation module includes a plurality of heat sinks and at least one heat pipe. One end of the heat pipe penetrates through the heat sink and the other end is combined in the groove. The water-cooled radiator group includes a water-cooled radiator and a plurality of connecting pipes. One end of the connecting pipe is connected to the water-cooled radiator and the other ends are respectively connected to the pipe interfaces.

[0006] In an embodiment of this case, the water-cooled head group includes a plurality of water-cooled fins arranged at intervals on the water-cooled plate, and the water-cooled fins protrude into the interior of the water-cooled housing.

[0007] In an embodiment of this case, a groove is formed at the center position of the water-cooled plate, and the water-cooled fins are arranged in the groove.

[0008] In an embodiment of this case, a boss is formed at the periphery of the water-cooled plate, and the groove is provided on the boss.

[0009] In an embodiment of this case, the combination between the water-cooled plate and the water-cooled housing is combined by locking with a plurality of screws after being overlapped.

[0010] In an embodiment of this case, the heat dissipation module further includes a heat dissipation fan, and the heat dissipation fan is combined on one side of the heat sink.

[0011] In an embodiment of the present case, the number of the slots and the heat pipes is plural, and the plural slots are respectively located on different sides of the periphery of the water cooling plate.

[0012] In an embodiment of the present case, the heat dissipation module further includes a fan frame combined with a heat dissipation fan. The fan frame has a plurality of convex tabs facing the water cooling head group. The heat sink is provided with a plurality of locking pieces. The fan frame passes through the convex tabs and the locking pieces by a plurality of locking members, so as to combine the heat dissipation fan on one side of the heat sink.

[0013] In an embodiment of the present case, the number of the heat dissipation modules is plural, and the plural heat dissipation modules are arranged on opposite sides of the water cooling head group.

[0014] In an embodiment of the present case, the liquid cooling heat dissipation device further includes a water pump, and the water pump is arranged in the water cooling shell base.

[0015] Compared with the prior art, the water cooling head group of the liquid cooling heat dissipation device in the present case includes a water cooling plate and a water cooling shell base combined with the water cooling plate, and a slot is arranged on the outer periphery of the water cooling plate at the corresponding position of the water cooling shell base and on the side facing the water cooling shell base. Moreover, the heat dissipation module of the liquid cooling heat dissipation device in the present case includes a plurality of heat sinks and heat pipes, and one end of the heat pipe passes through the heat sink and the other end is combined in the slot of the water cooling plate; accordingly, the heat pipe can absorb the heat of the water cooling plate and conduct the heat to the heat dissipation module, so as to quickly take away and dissipate the heat, thereby cooling the water cooling plate to achieve the purpose of continuously dissipating heat from the heating element. Description of the Drawings

[0016] The above characteristics, technical features, advantages and their implementation manners of a liquid cooling heat dissipation device will be further described below in a clear and understandable manner in combination with the drawings and the preferred embodiments.

[0017] Figure 1 It is a three-dimensional external view schematic diagram of the liquid cooling heat dissipation device in the present case.

[0018] Figure 2 It is a combined schematic diagram of the water cooling head group in the present case.

[0019] Figure 3 It is a plane arrangement schematic diagram of the heat dissipation module in the present case.

[0020] Figure 4 It is a combined schematic diagram of the heat dissipation module in the present case.

[0021] Figure 5 It is a combined sectional view of the water cooling head group in the present case.

[0022] Description of the Reference Numerals in the Drawings:

[0023] 1: Liquid cooling heat dissipation device, 10: Water cooling head group, 11: Water cooling plate, 111: Embedded groove, 112: Boss, 113: Groove, 12: Water cooling housing base, 121: Pipe interface, 13: Water cooling fins, 14: Screw, 20: Heat dissipation module, 21: Heat sink, 211: Locking piece, 22: Heat pipe, 23: Heat dissipation fan, 24: Fan bracket, 241: Tab, 25: Fastener, 30: Water cooling row group, 31: Water cooling row, 32: Connecting pipe, 40: Water pump. Detailed implementation mode

[0024] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by terms such as "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "transverse", "vertical", "top", "bottom", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting conditions of the present invention.

[0025] As used herein, terms such as "first", "second", "third", "fourth", and "fifth" describe various elements, components, regions, levels, or parts. These elements, components, regions, levels, or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, level, or part from another. Unless the context clearly indicates otherwise, the terms such as "first", "second", "third", "fourth", and "fifth" used herein do not imply an order or sequence.

[0026] Used herein and not otherwise defined, terms such as "substantially" and "about" are used to describe and account for small variations. When combined with an event or situation, the term can include both the exact moment when the event or situation occurs and a point close to the approximation of the event or situation. For example, when combined with a numerical value, the term can include a variation range less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0027] The detailed description and technical content of this case are described below in conjunction with the drawings. However, the attached drawings are only for reference and illustration purposes and are not used to limit this case.

[0028] Please refer to Figure 1 and Figure 2, which is a three-dimensional external view schematic diagram of the liquid cooling heat dissipation device of this case and a combined schematic diagram of the water cooling head group. This case is a liquid cooling heat dissipation device 1, including a water cooling head group 10, a heat dissipation module 20 and a water cooling row group 30. The heat dissipation module 20 is combined on one side of the water cooling head group 10. The water cooling row group 30 is connected to the water cooling head group 10 and forms a circulation loop with the water cooling head group 10.

[0029] The water cooling head group 10 includes a water cooling plate 11, a water cooling shell base 12 combined with the water cooling plate 11, and a plurality of water cooling fins 13 arranged at intervals on the water cooling plate 11. In this embodiment, at least one embedding groove 111 is provided on the outer periphery of the water cooling plate 11 at the corresponding position of the water cooling shell base 12 and on the side facing the water cooling shell base 12. The water cooling shell base 12 is provided with a plurality of pipe interfaces 121. In addition, a boss 112 is formed on the periphery of the water cooling plate 11, and a groove 113 is formed at the central position. The embedding groove 111 is provided on the boss 112. The water cooling fins 13 are arranged in the groove 113.

[0030] It should be noted that the water cooling plate 11 and the water cooling shell base 12 are made of copper alloy or a metal with better heat conduction ability. In addition, the combination between the water cooling plate 11 and the water cooling shell base 12 is locked and combined by a plurality of screws 14 after being overlapped.

[0031] The heat dissipation module 20 is arranged on one side of the water cooling head group 10. The heat dissipation module 20 includes a plurality of heat dissipation fins 21 and at least one heat pipe 22. The heat dissipation fins 21 are arranged at intervals. One end of the heat pipe 22 penetrates through the heat dissipation fins 21, and the other end is combined in the embedding groove 111 of the water cooling plate 11. The heat pipe 22 can absorb the heat of the water cooling plate 11 and conduct it to the heat dissipation module 20 to quickly take away and dissipate the heat, thereby improving the heat dissipation efficiency.

[0032] It is worth noting that the liquid cooling heat dissipation device 1 of this case includes a plurality of heat dissipation modules 20. The heat dissipation modules 20 are arranged on the opposite side of the water cooling head group 10 to accelerate the removal of the heat of the water cooling plate 11. In actual use, the number of the heat dissipation modules 20 can be adjusted according to the usage conditions.

[0033] Furthermore, the water cooling row group 30 is arranged on one side of the water cooling head group 10 and is communicated with the water cooling row group 30. The water cooling row group 30 includes a water cooling row 31 and a plurality of connecting pipes 32. One ends of the connecting pipes 32 are connected to the water cooling row 31, and the other ends are respectively connected to the pipe interfaces 121 of the water cooling shell base 12; accordingly, the water cooling row group 30 is connected to the water cooling head group 10 and forms a closed circulation pipeline.

[0034] It should be noted that when the liquid cooling heat dissipation device 1 of this case is in use, a heat generating element is attached to the water cooling plate 11 of the water cooling head group 10. Also, the heat of the heat generating element is conducted to the water cooling plate 11, and a circulation loop is formed through the water cooling head group 10 and the water cooling row group 30 to perform heat exchange and take away the heat of the coolant. In addition, a part of the heat of the water cooling plate 11 is conducted to the heat pipe 22 and transferred to the heat dissipation module 20 through the heat pipe 22, so as to cool the water cooling plate 11, so as to continuously dissipate the heat of the heat generating element.

[0035] Please refer to Figure 3 and Figure 4 , which are the schematic plan view and combined schematic view of the heat dissipation module of this case. In this embodiment, the heat dissipation module 20 further includes a heat dissipation fan 23. The heat dissipation fan 23 is combined on one side of the heat dissipation fins 21. Specifically, the heat dissipation module 20 further includes a fan frame 24 combined with the heat dissipation fan 23. The fan frame 24 has a plurality of tabs 241 facing the water cooling head group 10. In addition, the heat dissipation fins 21 are provided with a plurality of locking pieces 211. The fan frame 24 passes through the plurality of tabs 241 and the plurality of locking pieces 211 through a plurality of locking members 25, so as to combine the heat dissipation fan 23 on one side of the heat dissipation fins 21. The heat dissipation fan 23 can generate a forced air flow to take away the heat of the heat dissipation fins 21.

[0036] It should be noted that the liquid cooling heat dissipation device 1 of this case is provided with a plurality of heat dissipation modules 20, and the heat dissipation fins 21 of each heat dissipation module 20 can be penetrated by different numbers of heat pipes 22. In this embodiment, the number of the embedding grooves 111 of the water cooling plate 11 and the heat pipes 22 of the heat dissipation module 20 is plural. In addition, the embedding grooves 111 are respectively located on different sides of the periphery of the water cooling plate 11.

[0037] Please refer to Figure 5 , which is the combined cross-sectional view of the water cooling head group of this case. The water cooling head group 10 of this case includes a water cooling plate 11, a water cooling shell seat 12 combined with the water cooling plate 11, and a plurality of water cooling fins 13. The water cooling fins 13 are arranged at intervals in the grooves 113 on the water cooling plate 11. In addition, a boss 112 is formed on the periphery of the water cooling plate 11. The boss 112 is provided with an embedding groove 111, and a heat pipe 22 is embedded in the embedding groove 111. Furthermore, the liquid cooling heat dissipation device 1 of this case further includes a water pump 40. The water pump 40 is arranged in the water cooling shell seat 12 to increase the water pressure and water flow speed in the water cooling head group 10, thereby improving the heat dissipation efficiency of the liquid cooling heat dissipation device 1.

[0038] The above are only the preferred embodiments of this case and are not intended to limit the patent scope of this case. Equivalent changes using the patent spirit of this case should all fall within the patent scope of this case. In addition, of course, there can be various other embodiments not listed in this invention. Without departing from the spirit and essence of this invention, those skilled in the art should be able to evolve various corresponding changes and deformations according to this invention, but these corresponding changes and deformations should all fall within the protection scope of the patent applied for this invention.

Claims

1. A liquid cooling heat dissipation device for dissipating heat from a heat source, characterized in that, Comprising: A water-cooling head assembly, including a water-cooling plate attached to the heat source and a water-cooling shell seat combined with the water-cooling plate. At least one groove is provided on the outer periphery of the water-cooling plate at a position corresponding to the water-cooling shell seat and on the side facing the water-cooling shell seat, and a plurality of pipe interfaces are provided on the water-cooling shell seat; A heat dissipation module, including a plurality of heat sinks and at least one heat pipe. One end of the heat pipe penetrates through these heat sinks, and the other end is combined in the groove; and A water-cooling radiator assembly, including a water-cooling radiator and a plurality of connecting pipes. One ends of these connecting pipes are connected to the water-cooling radiator, and the other ends are respectively connected to these pipe interfaces.

2. The liquid cooling and heat dissipation device according to claim 1, characterized in that, The water-cooling head assembly includes a plurality of water-cooling fins arranged at intervals on the water-cooling plate, and these water-cooling fins protrude into the interior of the water-cooling shell seat.

3. The liquid cooling heat dissipation device according to claim 2, wherein, The water-cooling plate is formed with a groove at the central position, and these water-cooling fins are arranged in the groove.

4. The liquid cooling and heat dissipation device according to claim 1, characterized in that, The water-cooling plate is formed with a boss at the periphery, and the groove is provided on the boss.

5. The liquid cooling and heat dissipation device according to claim 1, characterized in that, The combination between the water-cooling plate and the water-cooling shell seat is combined by locking with a plurality of screws after overlapping.

6. The liquid cooling and heat dissipation device according to claim 1, characterized in that, The number of the at least one groove and the at least one heat pipe is plural, and the plural grooves are respectively located on different sides of the periphery of the water-cooling plate.

7. The liquid cooling and heat dissipation device according to claim 1, characterized in that, The heat dissipation module further includes a heat dissipation fan, and the heat dissipation fan is combined on one side of these heat sinks.

8. The liquid cooling and heat dissipation device according to claim 7, wherein, The heat dissipation module further includes a fan frame combined with the heat dissipation fan. The fan frame has a plurality of protrusions facing the water-cooling head assembly. These heat sinks are provided with a plurality of locking pieces. The fan frame passes through these protrusions and these locking pieces with a plurality of locking members, thereby combining the heat dissipation fan on one side of these heat sinks.

9. The liquid cooling and heat dissipation device according to claim 1, characterized in that, The number of the heat dissipation modules is plural, and the plural heat dissipation modules are arranged on the opposite side of the water-cooling head assembly.

10. The liquid cooling and heat dissipation device according to claim 1, characterized in that, It further includes a water pump, and the water pump is arranged in the water-cooling shell seat.

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