Heat dissipation device for preventing fluid medium leakage and electronic equipment

Abstract

The utility model discloses a heat dissipation device for preventing fluid medium leakage and electronic equipment, the heat dissipation device is suitable for heat dissipation of high-power electronic components, the heat dissipation device comprises a heat dissipation base and a plurality of heat dissipation fins, the heat dissipation base is internally provided with a cavity used for accommodating fluid medium, the heat dissipation base is provided with two surfaces arranged on opposite sides, and the heat dissipation fins are arranged in the cavity. One surface is used for being in contact with a heating element, the other surface is provided with a mounting through groove communicated with the cavity, and the periphery of an opening of the mounting through groove is chamfered to form an annular flow guide face surrounding the mounting through groove; flow channels are arranged in the cooling fins, and flow channel connector parts are arranged on the cooling fins and correspond to outlets and inlets of the flow channels respectively. The flow channel connector part is inserted into the mounting through groove, an annular gap is formed between the peripheral surface of the flow channel connector part and the annular flow guide surface, and a whole circle of welding flux is formed in the annular gap, so that the peripheral surface of the flow channel connector part and the annular flow guide surface are sealed, welded and fixed. The problem that the hidden danger of working fluid medium leakage easily exists at the welding position in the prior art is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for preventing fluid medium leakage and an electronic device. Background Art

[0002] Heat dissipation devices are widely used in electronic devices. For example, in communication devices, heat dissipation devices are often used to dissipate heat from chips, power supplies, etc. The heat dissipation device usually includes a heat dissipation substrate and a plurality of heat dissipation fins arranged on the heat dissipation substrate. The heating element is generally attached to the heat dissipation substrate, and the heating element and the heat dissipation fins are distributed on two opposite sides of the heat dissipation substrate. A cavity and a flow channel are preset in the heat dissipation substrate and the heat dissipation fins, and a working fluid medium (also referred to as a refrigerant) flows inside. Since the heat dissipation fins are welded to the heat dissipation substrate, the problem of working fluid medium leakage is likely to occur at the weld. Therefore, those skilled in the art are committed to how to improve the problem of working fluid medium leakage.

[0003] For example: CN 117222184 A discloses a phase change heat dissipation device and a communication device, including: a substrate having a first hollow cavity; a plurality of fin arrays, each fin having a second hollow cavity, and the second hollow cavities of the fins are communicated through a connecting portion located outside the fins; the fins include a first fin and a second fin located at both ends of the fin array in the first extension direction, the bottom of the first fin has a first inlet communicated with its second hollow cavity, the bottom of the second fin has a first outlet communicated with its second hollow cavity, and each fin array is fixedly connected to the substrate through the first inlet and the first outlet. The substrate absorbs the heat of the heating element, so that the working medium undergoes a phase change cycle in the first hollow cavity and the second hollow cavity to dissipate the heat through the fins. Each fin array flow channel and the cavity of the substrate have only two butting interfaces to reduce the number of solder joints and leakage, thereby improving the use reliability of the heat dissipation device. However, its butting interface needs to be connected to a connecting pipe, and then the connecting pipe is welded to the substrate. The welding operation is troublesome. Especially in the link of adding the connecting pipe, there is still a risk of false soldering, and there is still a hidden danger of working fluid medium leakage.

[0004] For another example, CN 117222183 A discloses a phase change radiator and a communication device. The phase change radiator includes a substrate unit and a fin unit. The substrate unit includes a first surface and a second surface. The first surface is for facing a heat generating element, and the second surface is for mounting the fin unit. The fin unit includes a mounting portion abutting against the second surface and a heat dissipation portion extending from the mounting portion. The mounting portion is provided with a second opening communicating with a refrigerant channel in the heat dissipation portion, and the second surface is provided with a first opening communicating with a hollow inner cavity inside the substrate unit. When the mounting portion abuts against the second surface, the first opening and the second opening are fixed by welding. By welding and fixing the two openings of the mounting portion and the substrate unit, the welding area is small and the weld is short, reducing the welding difficulty and improving the process yield, so that refrigerant leakage is not easily caused. During actual welding, it is equivalent to fitting and welding the surfaces where the two openings are located respectively. Limited by the flatness of the surfaces, it is difficult to achieve an ideal fit between the two surfaces. As a result, although the fitting and welding are carried out, there is still a hidden danger of leakage of the working fluid medium at the welded joint subsequently.

[0005] Therefore, it is necessary to study a new technical solution to solve the above problems. Summary of the Utility Model

[0006] In view of this, in view of the deficiencies of the existing technology, the main purpose of the present utility model is to provide a heat dissipation device and an electronic device for preventing fluid medium leakage, which effectively solve the problem that there is a hidden danger of leakage of the working fluid medium at the welded joint in the traditional technology.

[0007] To achieve the above object, the present utility model adopts the following technical solutions:

[0008] A heat dissipation device for preventing fluid medium leakage, comprising:

[0009] A heat dissipation base, which has a cavity for accommodating a fluid medium therein. The heat dissipation base has two opposite surfaces. One surface is for contacting a heat generating element, and the other surface is provided with a mounting through groove communicating with the cavity. The opening periphery of the mounting through groove is chamfered to form an annular guiding surface surrounding the mounting through groove;

[0010] A plurality of heat dissipation fins, which have flow channels therein. Flow channel interface portions are respectively provided at the inlets and outlets of the flow channels on the heat dissipation fins. The flow channel interface portions are inserted into the mounting through groove. The inside of the flow channel interface portions communicates downward with the cavity. An annular gap is formed between the outer peripheral surface of the flow channel interface portions and the annular guiding surface. A whole circle of solder is formed in the annular gap, thereby forming a sealed welding and fixing between the outer peripheral surface of the flow channel interface portions and the annular guiding surface.

[0011] As a preferred solution, a first solder layer is provided on the other surface. During vacuum soldering, after the first solder layer melts, it flows into the annular gap along the annular flow guiding surface to form a complete circle of solder.

[0012] As a preferred solution, two sets of riveting convex parts are respectively arranged at the two ends of the installation through groove corresponding to the inner top wall of the cavity. Each set of riveting convex parts includes two riveting convex parts arranged at a left - right interval. The flow channel interface part is located between the two lower riveting convex parts, and the flow channel interface part is tightly fixed by riveting the riveting convex parts.

[0013] As a preferred solution, the heat sink includes a heat dissipation single piece A and a heat dissipation single piece B; on the overlapping side surfaces of the heat dissipation single piece A and the heat dissipation single piece B, there are correspondingly matched flow channel wall surfaces. And, the heat dissipation single piece A and the heat dissipation single piece B extend downward at the ends of the corresponding flow channel wall surfaces to form connection parts, and the connection parts are stacked to form the flow channel interface part.

[0014] As a preferred solution, a butt - joint surface is provided at the front end and / or the rear end of the flow channel interface part. After the flow channel interface part is inserted into the installation through groove, the butt - joint surface abuts against the top surface of the heat dissipation base.

[0015] As a preferred solution, the connection part includes a flow channel enclosing wall and first wall body parts respectively connected to both ends of the flow channel enclosing wall. The flow channel enclosing wall encloses to form a flow channel interface, and the first wall body parts at both ends are correspondingly attached to form a widened part, and the first wall body parts at both ends extend into the space between the two riveting convex parts.

[0016] As a preferred solution, a second solder layer is provided on the overlapping side surface of the heat dissipation single piece A and / or the heat dissipation single piece B, and the overlapping side surfaces of the heat dissipation single piece A and the heat dissipation single piece B are welded and fixed to each other.

[0017] As a preferred solution, a first capillary filler is filled in the flow channel.

[0018] As a preferred solution, a second capillary filler is filled in the cavity.

[0019] An electronic device includes a heating element and a heat dissipation device; the heat dissipation device is a heat dissipation device for preventing fluid medium leakage as described in any one of the above.

[0020] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly forms an annular diversion surface around the installation through groove by chamfering the opening periphery of the installation through groove opened on the surface of the heat dissipation base to communicate with the cavity; and flow channel interface parts are respectively arranged on the heat dissipation fins corresponding to the inlets and outlets of the flow channels, the flow channel interface parts are inserted into the installation through groove, an annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular diversion surface, and a whole circle of solder is formed in the annular gap, so as to form a sealed welding and fixation between the outer peripheral surface of the flow channel interface part and the annular diversion surface. The welding effect is good, and it is not easy to have problems such as false soldering, loosening or cracking at the welding place, effectively solving the problem of potential leakage of the working fluid medium at the welding place in the traditional technology.

[0021] To more clearly illustrate the structural features and functions of the utility model, the following will combine the drawings and specific embodiments to detail the utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is an exploded view of the heat dissipation device of the embodiment of the utility model (the number of heat dissipation A single pieces and heat dissipation B single pieces is not limited);

[0023] Figure 2 is another exploded view of the heat dissipation device of the embodiment of the utility model (the heat dissipation A single pieces and heat dissipation B single pieces have been combined into one before insertion, and the number of heat dissipation fins is not limited);

[0024] Figure 3 is an exploded view of the heat dissipation A single piece and heat dissipation B single piece of the embodiment of the utility model;

[0025] Figure 4 is an assembled view after overlapping the heat dissipation A single piece and heat dissipation B single piece of the embodiment of the utility model;

[0026] Figure 5 is a partial structural view of a group of heat dissipation fins arranged on the heat dissipation base in the embodiment of the utility model;

[0027] Figure 6A is a partial structural view after assembling the flow channel interface part and the upper cover plate in the embodiment of the utility model (before welding);

[0028] Figure 6B is a partial structural view after assembling the flow channel interface part and the upper cover plate in the embodiment of the utility model (after welding);

[0029] Figure 7 is a partial three-dimensional view of the heat dissipation A single piece and heat dissipation B single piece arranged on the upper cover plate in the embodiment of the utility model (showing the bottom structure of the upper cover plate);

[0030] Figure 8 It is a cross-sectional view showing that a first capillary filler is provided in the middle of the heat dissipation A single piece and the heat dissipation B single piece of another embodiment of the present utility model;

[0031] Figure 9 It is an exploded view showing that a second capillary filler is provided in the bottom cavity of another embodiment of the present utility model;

[0032] Figure 10 It is an assembled view showing that a second capillary filler is provided in the bottom cavity of another embodiment of the present utility model;

[0033] Figure 11 It is a step diagram showing a manufacturing method of a heat dissipation device according to an embodiment of the present utility model;

[0034] Figure 12 It is an exploded view of a heat dissipation device with a connecting plate further provided at the top of the heat sink and preventing fluid medium leakage;

[0035] Figure 13 It shows an exploded view of another heat dissipation device with folded pieces provided on the heat sink itself and preventing fluid medium leakage. Detailed implementation manners

[0036] Please refer to Figures 1 to 13 As shown, it shows the specific structures of various embodiments of the present utility model.

[0037] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0038] A heat dissipation device for preventing fluid medium leakage is suitable for dissipating heat from high-power electronic components, with good heat dissipation effect and high heat dissipation efficiency. It includes a heat dissipation base 100 and a plurality of heat sinks 200 provided on the heat dissipation base 100.

[0039] The heat dissipation base 100 has a cavity 201 for accommodating a fluid medium. The heat dissipation base 100 has two opposite surfaces. One surface is used to contact the heat generating element, and an installation through groove 101 communicating with the cavity 201 is opened on the other surface. The opening periphery of the installation through groove 101 is chamfered to form an annular flow guiding surface 102 around the installation through groove 101;

[0040] The heat sink 200 has a flow channel inside. Flow channel interface parts 347 are respectively arranged on the heat sink 200 corresponding to the outlet and inlet of the flow channel. Each heat sink can be provided with an independent flow channel and flow channel interface parts 347, or the flow channels of multiple heat sinks can be connected and communicated. In this way, it is not limited to each heat sink being configured with (outlet and inlet) two flow channel interface parts 347. In the present utility model, the structure and manufacturing method of the heat sink 200 are not limited. The flow channel interface part 347 is inserted into the installation through groove 101. The inside of the flow channel interface part 347 communicates downward with the cavity 201. An annular gap is formed between the outer peripheral surface of the flow channel interface part 347 and the annular diversion surface 102. A complete circle of solder D is formed in the annular gap, thereby forming a sealed welding and fixing between the outer peripheral surface of the flow channel interface part 347 and the annular diversion surface 102. Further, a first capillary filler 6 can be filled and arranged in the flow channel, and a second capillary filler 7 is filled in the cavity 201.

[0041] A first solder layer C1 is covered on the other surface. When performing vacuum welding, the first solder layer C1 melts and flows into the annular gap along the annular diversion surface 102 to form a complete circle of solder D.

[0042] The heat dissipation base 100 includes a bottom cavity 2 and an upper cover plate 1 stacked and assembled on the top of the bottom cavity 2. The upper cover plate 1 and the bottom cavity 2 enclose to form the cavity 201. The cavity 201 is located below the upper cover plate 1. The first solder layer C1 is arranged on the top surface of the upper cover plate 1. The installation through groove 101 communicates with the top and bottom ends of the upper cover plate 1. The annular diversion surface 102 is exposed on the top of the upper cover plate 1. Two groups of riveting convex parts are respectively arranged on the inner top wall of the cavity 201 corresponding to the two ends of the installation through groove 101. Specifically, two groups of riveting convex parts are respectively arranged on the bottom of the upper cover plate 1 corresponding to the two ends of the installation through groove 101. Each group of riveting convex parts includes two riveting convex parts 104 arranged at a left-right interval. The flow channel interface part 347 extends downward out of the bottom of the upper cover plate 1 and extends into the space between the two riveting convex parts 104. The flow channel interface part 347 is fixed by pressing the riveting convex parts 104 to fix the heat sink 200.

[0043] The heat sink 200 includes a single heat dissipation piece A 3 and a single heat dissipation piece B 4; on the overlapping side surfaces of the single heat dissipation piece A 3 and the single heat dissipation piece B 4, there are provided corresponding and matching flow channel wall surfaces, and at the ends of the corresponding flow channel wall surfaces of the single heat dissipation piece A 3 and the single heat dissipation piece B 4, connection parts 342 are formed and extend downward, and the connection parts 342 are stacked to form the flow channel interface part 347. At the front end and / or the rear end of the flow channel interface part 347, there is provided an abutting surface. After the flow channel interface part 347 is inserted into the installation through groove 101, the abutting surface abuts against the top surface of the upper cover plate 1. The connection part 342 includes a flow channel enclosing wall 343 and first wall body parts 345 respectively connected to both ends of the flow channel enclosing wall 343. The flow channel enclosing wall 343 encloses to form a flow channel interface, and the first wall body parts 345 at both ends are correspondingly attached to form a widened part, and the first wall body parts 345 at both ends extend into the space between the two riveting convex parts 104. On the overlapping side surfaces of the single heat dissipation piece A 3 and / or the single heat dissipation piece B 4, a second solder layer is covered, and the overlapping side surfaces of the single heat dissipation piece A 3 and the single heat dissipation piece B 4 are mutually attached and welded and fixed.

[0044] Specifically, a heat dissipation device for preventing fluid medium leakage is provided, including an upper cover plate 1, a bottom cavity 2, a single heat dissipation piece A 3, and a single heat dissipation piece B 4.

[0045] Wherein, a first solder layer (such as a brazing layer) is covered on the top surface of the upper cover plate 1. An installation through groove 101 is provided on the top surface of the upper cover plate 1. The top peripheral edge of the installation through groove 101 is chamfered (which can be an inclined chamfer or an arc chamfer) to form an annular diversion surface 102 around the installation through groove 101. Matching corresponding flow channel wall surfaces are provided on the overlapping side surfaces of the heat dissipation single piece A 3 and the heat dissipation single piece B 4. Moreover, the heat dissipation single piece A 3 and the heat dissipation single piece B 4 extend downward at the ends of the corresponding flow channel wall surfaces to form connecting parts 342. The heat dissipation single piece A 3 and the heat dissipation single piece B 4 are inserted into the installation through groove 101 in an overlapping manner to form a first-stage semi-finished product. Among them, the connecting parts 342 are overlapped to form a flow channel interface part 347, and an annular gap is formed between the outer peripheral surface of the flow channel interface part 347 and the annular diversion surface 102. Since two groups of riveting convex parts 104 are respectively provided at both ends of the installation through groove 101 corresponding to the bottom of the upper cover plate 1, each group of riveting convex parts 104 includes two riveting convex parts 104 arranged at a left-right interval. The connecting part 342 extends downward out of the bottom of the upper cover plate 1 and extends into the space between the two riveting convex parts 104. The connecting part 342 of the heat dissipation single piece A 3 and the heat dissipation single piece B 4 is fixed by pressing the riveting convex parts 104. Here, the connecting part 342 includes a flow channel enclosing wall 343 and first wall parts 345 respectively connected to both ends of the flow channel enclosing wall 343. The flow channel enclosing wall 343 encloses to form a closed flow channel interface. The first wall parts 345 at both ends are correspondingly attached to form a widened part. The first wall parts 345 at both ends extend into the space between the two riveting convex parts 104. A second wall part 346 also extends at the outer end of the first wall part 345. The lower end surface of the second wall part 346 is higher than the lower end surface of the first wall part 345, so that the lower end surface of the second wall part 346 serves as an abutting surface. After the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are inserted into the installation through groove 101 in an overlapping manner, the abutting surface abuts against the top surface of the upper cover plate 1. Therefore, when the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are inserted into the installation through groove 101 in an overlapping manner, the lower end surface of the second wall part 346 plays a role in limiting the insertion depth and also plays a role in pre-insertion positioning. Moreover, two riveting convex parts 104 can be riveted at the bottom of the upper cover plate 1 to fix the heat dissipation single piece A 3 and the heat dissipation single piece B 4.

[0046] Then, the semi-finished product of the first stage is loaded into the bottom cavity 2 to form a semi-finished product of the second stage. The upper cover plate 1 and the bottom cavity 2 enclose a cavity. This assembly process can achieve the airtight assembly of the upper cover plate 1 and the bottom cavity 2, or it may still rely on subsequent vacuum welding to play the role of welding and fixing the upper cover plate 1 and the bottom cavity 2. The inside of the flow channel interface portion 347 communicates downward with the cavity. The semi-finished product of the second stage is subjected to vacuum welding. After the first solder layer on the top surface of the upper cover melts, it flows into the annular gap along the annular guiding surface 102, and then a sealed weld is formed between the outer peripheral surface of the flow channel interface portion 347 and the annular guiding surface 102.

[0047] The overlapping side surfaces of the heat dissipation single piece A 3 and / or the heat dissipation single piece B 4 are covered with a second solder layer, and the overlapping side surfaces of the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are mutually bonded and fixed by welding. The heat dissipation single piece A 3 and the heat dissipation single piece B 4 may have been welded together before being inserted into the installation through groove 101, or after the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are inserted into the installation through groove 101, a finished product is welded at one time when the semi-finished product of the second stage is subjected to vacuum welding.

[0048] Before inserting the heat dissipation single piece A 3 and the heat dissipation single piece B 4 into the installation through groove 101 of the upper cover plate 1, a first capillary filler may be filled between the heat dissipation single piece A 3 and the heat dissipation single piece B 4, that is, on the flow channel wall surface. It is also possible to first fill the cavity 201 of the bottom cavity 2 with a second capillary filler before loading the first semi-finished product into the bottom cavity 2.

[0049] Provide an electronic device, such as a communication device, which includes a heating element and a heat dissipation device. Generally, the bottom of the bottom cavity 22 of the heat dissipation device is attached to the heating element, and the heat dissipation device is the heat dissipation device for preventing leakage of fluid medium described above.

[0050] As described above, the heat dissipation single piece A and the heat dissipation single piece B may be welded together in advance, or welded at one time after being inserted into the installation through groove. Next, introduce a manufacturing method for assembling and welding a finished product at one time with components such as the upper cover plate 1, the bottom cavity 2, a plurality of heat dissipation single piece A 3, and a plurality of heat dissipation single piece B 4, which includes the following steps (the following description of the heat dissipation device structure is not the only structure limitation under this manufacturing method. For the heat dissipation device of the present invention, when implemented by other manufacturing methods, the same or similar structures can still be designed or further designed):

[0051] Step 1, prepare the upper cover plate 1, the bottom cavity 2, a plurality of heat dissipation single piece A 3, and a plurality of heat dissipation single piece B 4;

[0052] Among them, the upper cover plate 1 is a composite layer material with a solder layer, such as an aluminum-based brazing composite layer material. Therefore, a first solder layer C1 is provided on its top surface. A plurality of mounting through grooves 101 are arranged at intervals in the left-right direction on the top surface of the upper cover plate 1, which means that the mounting through grooves 101 communicate with the top surface and the bottom surface of the upper cover plate 1. The top peripheral edge of the mounting through groove 101 is chamfered to form an annular flow guiding surface 102 around the mounting through groove 101.

[0053] A cavity 201 is provided in the bottom cavity body 2. A plurality of convex columns 202 are arranged at intervals in the cavity 201 to divide the cavity 201 into a plurality of zigzag flow channels. An installation column 203 protrudes upward from the top peripheral edge of the bottom cavity body 2. Correspondingly, installation holes 103 are provided at the periphery of the upper cover plate 1. The installation column 203 extends into the corresponding installation hole 103 to form the mutual assembly and positioning of the upper cover plate 1 and the bottom cavity body 2. Further, installation columns 203 can also be provided in the cavity 201, and corresponding installation holes 103 are provided on the upper cover plate 1 to improve the assembly stability of the upper cover plate 1 and the bottom cavity body 2. In the subsequent welding process, the installation column 203 and the installation hole 103 are welded and fixed. Specifically, an integral welding and sealing fixation is formed between the outer peripheral surface of the installation column 203 and the inner peripheral surface of the installation hole 103, as well as the top surface of the upper cover plate 1, and even between the top peripheral edge of the bottom cavity body 2 and the bottom surface of the upper cover plate 1, the outer peripheral surface of the installation column 203, and the inner peripheral surface of the installation hole 103.

[0054] The heat dissipation single piece 3 and / or the heat dissipation single piece 4 are also composite layer materials with solder layers, such as aluminum-based brazed composite layer materials. Therefore, a second solder layer is provided on the overlapping side thereof. Preferably, second solder layers are provided on the overlapping sides of the heat dissipation single piece 3 and the heat dissipation single piece 4. Compared with the case where only the overlapping side of the heat dissipation single piece 3 or the heat dissipation single piece 4 is provided with a second solder layer, it is easier to weld and the welding effect is better. Moreover, the heat dissipation single piece 3 and the heat dissipation single piece 4 can be designed with the same structure (such as a symmetric structure), enabling the same design and production of the heat dissipation single pieces, which is conducive to mass production, better control of production quality, and reduction of production costs. Matching corresponding flow channel wall surfaces 341 (such as recessed) are provided on the overlapping sides of the heat dissipation single piece 3 and the heat dissipation single piece 4. In this embodiment, flow channel wall surfaces 341 are recessed on the overlapping sides of the heat dissipation single piece 3 and the heat dissipation single piece 4. It is also possible to only have a flow channel wall surface 341 recessed on one overlapping side, while the other overlapping side is a flat surface, which is equivalent to the flow channel wall surface 341 on the other overlapping side being a flat surface. And, connection portions 342 are formed by the heat dissipation single piece 3 and the heat dissipation single piece 4 extending downward at the ends of the corresponding flow channel wall surfaces 341; the second solder layer can be on the entire overlapping side, or be provided on the area of the overlapping side except for the flow channel wall surface 341, or at least meet the requirement that a closed flow channel 348 can be formed after the heat dissipation single piece 3 and the heat dissipation single piece 4 are stacked and welded.

[0055] Step 2, stack and insert the heat dissipation single piece 3 and the heat dissipation single piece 4 into the installation through groove 101. Among them, the connection portions 342 of the heat dissipation single piece 3 and the heat dissipation single piece 4 are stacked to form a flow channel interface portion 347. The flow channel interface portion 347 forms a closed ring. An annular gap is formed between the outer peripheral surface of the flow channel interface portion 347 and the annular diversion surface 102, which is equivalent to the annular gap surrounding the periphery of the outer peripheral surface of the flow channel interface portion 347. The overlapping sides of the heat dissipation single piece 3 and the heat dissipation single piece 4 are in contact. One heat dissipation single piece 3 and one heat dissipation single piece 4 are stacked to form a set of heat dissipation fins 200. Their flow channel wall surfaces 341 are matched to enclose a flow channel, and their connection portions 342 are also correspondingly matched. Two sets of connection portions 342 are formed at the lower end of a set of heat dissipation fins 200, corresponding to the fluid inlet and fluid outlet of this set of heat dissipation fins 200; and, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1; the upper cover plate 1 and the bottom cavity 2 constitute a heat dissipation base 100.

[0056] Step 3: Place the assembled product into a vacuum soldering furnace for soldering operations. Usually, one vacuum soldering is performed. After the first solder layer C1 on the top surface of the upper cover plate 1 melts, it flows into the annular gap along the annular guiding surface 102, forming a complete circle of solder D in the annular gap, thereby forming a sealed soldering between the outer peripheral surface of the flow channel interface portion 347 and the annular guiding surface 102, solving the problem of leakage of the working fluid medium.

[0057] Further, the solder layer is a brazing filler metal layer. In Step 3, brazing operations are performed. The assembled product is placed into a vacuum brazing furnace for brazing operations, and a finished product is brazed out in one operation.

[0058] In Step 1, a first capillary filler 6 is also prepared; the first capillary filler 6 is filled corresponding to the flow channel wall surface 341, so that the flow channel is filled with the first capillary filler 6.

[0059] In Step 1, a second capillary filler 7 is also prepared, such as a capillary net; the second capillary filler 7 is filled corresponding to the bottom cavity 2, so that the cavity formed by overlapping and enclosing the upper cover plate 1 and the bottom cavity 2 is filled with the capillary net.

[0060] In step 2, after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are stacked and inserted into the installation through groove 101, the flow channel interface portion 347 extends downward from the bottom of the upper cover plate 1, and a pressing and fixing operation is performed on the extended portion of the flow channel interface portion 347 to fix the heat dissipation A single piece 3 and the heat dissipation B single piece 4 on the upper cover plate 1. The connecting portion 342 includes a flow channel enclosing wall 343 and widened fitting walls 344 respectively connected to the front and rear ends of the flow channel enclosing wall 343. The widened fitting wall 344 includes a first wall body portion 345 close to the flow channel enclosing wall 343 and a second wall body portion 346 far from the flow channel enclosing wall 343. The lower end surface of the second wall body portion 346 is higher than the lower end surface of the first wall body portion 345, so that the lower end surface of the second wall body portion 346 serves as an abutting surface. After the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are stacked and inserted into the installation through groove 101, the abutting surface abuts against the top surface of the upper cover plate 1. On the one hand, it plays a role in assembly positioning and limits the insertion depth. On the other hand, during the subsequent welding process, the first solder layer C1 on the top surface of the upper cover plate 1 forms a welded fixation with the abutting surface, strengthening the combined stability of the entire set of heat sinks 200 and the upper cover plate 1. At the positions corresponding to the front and rear ends of the installation through groove 101 at the bottom of the upper cover plate 1, two sets of riveting convex portions are respectively provided. Each set of riveting convex portions includes two riveting convex portions 104 arranged at a left-right interval. The first wall body portion 345 extends downward between the two riveting convex portions 104, and the two first wall body portions 345 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are pressed and fixed by pressing the two riveting convex portions 104. During actual operation, the two riveting convex portions 104 can be pressed in two directions, or one riveting convex portion 104 can be extruded towards the other riveting convex portion 104 to press the two first wall body portions 345 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 between the two riveting convex portions 104, forming the fixation of this set of heat sinks 200.

[0061] Preferably, after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are fixed to the upper cover plate 1, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1. A third solder layer is provided on the overlapping side of the bottom cavity 2 and the upper cover plate 1. In step 3, the bottom cavity 2 and the upper cover plate 1 are welded and fixed. The third solder layer is usually a brazing layer, so that in step 3, the upper cover plate 1, the bottom cavity 2, several heat dissipation A single pieces 3, and several heat dissipation B single pieces 4 are brazed at one time to realize the welded fixation of all accessories.

[0062] In the step 1, a connecting plate 5 is also prepared. A plurality of positioning grooves 501 are provided on the connecting plate 5. The top ends of the heat dissipation single piece A 3 and / or the heat dissipation single piece B 4 have positioning parts 349 extending upward. The positioning parts 349 extend into the positioning grooves 501. The upper cover plate 1 and the bottom cavity 2 form a heat dissipation base 100. Generally, the connecting plate 5 and the heat dissipation base 100 are arranged parallel to each other up and down, which is equivalent to positioning the upper and lower ends of several groups of heat dissipation fins 200.

[0063] On the heat dissipation single piece A 3, there are folding pieces 301 that bend and extend towards the heat dissipation single piece B 4. After the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are stacked, the extending ends of the folding pieces 301 extend out of the side of the heat dissipation single piece B 4 away from the heat dissipation single piece A 3, and the extending ends of the folding pieces 301 are in contact and positioned with the adjacent heat dissipation single piece A 3.

[0064] The folding pieces 301 can be arranged at the edge positions such as the front side, rear side, and top of the heat dissipation single piece A 3, so that the heat dissipation single piece A 3 can clamp and position the periphery of the heat dissipation single piece B 4, which is beneficial to the stacking stability of the two. The integrity of the stacked heat dissipation single pieces is good. Folding pieces 301 can also be arranged in the middle area (the middle area here does not refer to the absolutely centered position, but actually refers to the internal area surrounded by the edges) on the plate of the heat dissipation single piece A 3 except for the edges. These folding pieces 301 are bent from the hollow parts 302 on the heat dissipation single piece A. Correspondingly, hollow parts with the same or basically the same shape are also formed on the heat dissipation single piece B 4. Of course, usually the heat dissipation single piece B 4 does not need to retain the folding pieces 301 cut and bent from the hollow parts like the heat dissipation single piece A. The hollow parts on the heat dissipation single piece B 4 are mainly used for the folding pieces 301 of the heat dissipation single piece A of the heat dissipation fins 200 in its own group to pass through, playing an avoidance role. In actual production, if the heat dissipation single piece B 4 also retains the folding pieces 301 cut and bent from the hollow parts like the heat dissipation single piece A, it can also be achieved as long as the folding pieces 301 of the heat dissipation single piece A and the heat dissipation single piece B are stacked. Since one or more folding pieces 301 can be arranged in the middle area, these folding pieces 301 play a good role in positioning adjacent groups of heat dissipation fins 200 in the left-right direction, strengthening the structural connection between groups of heat dissipation fins 200. It is not easy for groups of heat dissipation fins 200 to shake, making the overall structural strength better. Moreover, the folding pieces 301 can also play a role in strengthening the heat conduction between groups of heat dissipation fins 200. Figure 13 The multiple folding pieces 301 in the middle area shown are arranged in multiple rows at vertical intervals, and each row includes multiple folding pieces 301 arranged at horizontal intervals. The arrangement of multiple folding pieces 301 makes the contact positioning stress points between groups of heat dissipation fins 200 dispersed and uniform. After welding, welding fixation will be formed at the contact positioning points, making all heat dissipation fins 200 form a heat dissipation module with good strength and not easy to deform. Compared with Figure 11 andFigure 12 The heat dissipation device shown saves the link of assembling the top connecting plate, is more convenient to assemble, and has better structural stability.

[0065] In addition, regarding the heat dissipation single piece A 3 and the heat dissipation single piece B 4, preferably, they are both composite layer materials with solder layers, which can be single-sided with a solder layer or double-sided with a solder layer. In the case of a single-sided solder layer, the solder layer is located on the overlapping side. In this way, it is ensured that within the same group of heat dissipations, the folded piece 301 of the heat dissipation single piece A 3 contacts and positions with the heat dissipation single piece B 4 during assembly and is fixed by welding during welding.

[0066] Regarding the upper cover plate 1, it is at least a composite layer material with a solder layer, that is, a solder layer is provided on the top surface, and it can also be double-sided with a solder layer, and a solder layer is also provided on the bottom surface. That is, the aforementioned third solder layer is provided on the bottom surface, or the third solder layer can be provided on the top surface of the bottom cavity 2.

[0067] Preferably, within the same heat dissipation device, the provided solder layers are the same, which is convenient for ensuring the vacuum welding effect. The heat dissipation single piece A 3, the heat dissipation single piece B 4, the upper cover plate 1, the bottom cavity 2, and the connecting plate are all metal substrates, such as aluminum substrates, and some also use aluminum alloys, copper, copper alloys, copper-aluminum composite materials, etc.

[0068] It should be noted that the heat dissipation base is not limited to the specific structures shown in the previous several embodiments.

[0069] The design focus of the present utility model is that mainly an installation through groove communicating with the cavity is opened on the surface of the heat dissipation base, and the opening periphery of the installation through groove is chamfered to form an annular diversion surface surrounding the installation through groove; and flow channel interface parts are respectively provided on the heat dissipation fins corresponding to the inlets and outlets of the flow channels, the flow channel interface parts are inserted into the installation through groove, and an annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular diversion surface, and a whole circle of solder is formed in the annular gap, thereby forming a sealed welding and fixing between the outer peripheral surface of the flow channel interface part and the annular diversion surface. The welding effect is good, and it is not easy to have problems such as virtual welding, loosening or cracking at the welding place, effectively solving the problem of potential leakage of working fluid medium at the welding place in the traditional technology.

[0070] The above is only the preferred embodiment of the present utility model, and does not impose any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes, and decorations made to the above embodiments according to the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A heat dissipation device for preventing leakage of fluid medium, characterized in that, Comprising: A heat dissipation base, which has a cavity for accommodating a fluid medium therein. The heat dissipation base has two opposite surfaces, one surface is for contacting a heating element, and an installation through groove communicating with the cavity is formed on the other surface. The opening periphery of the installation through groove is chamfered to form an annular diversion surface surrounding the installation through groove; A plurality of heat sinks, each heat sink having a flow channel therein, and flow channel interface parts are respectively arranged corresponding to the outlets and inlets of the flow channels on the heat sinks; the flow channel interface parts are inserted into the installation through groove, the interior of the flow channel interface parts communicates with the cavity downward, and an annular gap is formed between the outer peripheral surface of the flow channel interface parts and the annular diversion surface. A whole ring of solder is formed in the annular gap, thereby forming a sealed welding fixation between the outer peripheral surface of the flow channel interface parts and the annular diversion surface.

2. The heat dissipation device for preventing leakage of fluid medium according to claim 1, characterized in that, A first solder layer is covered on the other surface. When vacuum welding is carried out, the first solder layer melts and flows into the annular gap along the annular diversion surface to form a whole ring of solder.

3. The heat dissipation device for preventing leakage of fluid medium according to claim 2, characterized in that, Two groups of riveting convex parts are respectively arranged at both ends of the installation through groove corresponding to the inner top wall of the cavity. Each group of riveting convex parts includes two riveting convex parts arranged at a left-right interval. The flow channel interface part is between the two downward riveting convex parts, and the flow channel interface part is pressed and fixed by riveting the riveting convex parts.

4. The heat dissipation device for preventing leakage of fluid medium according to claim 3, characterized in that, The heat sink includes a heat dissipation A single piece and a heat dissipation B single piece; matching corresponding flow channel wall surfaces are arranged on the superposed side surfaces of the heat dissipation A single piece and the heat dissipation B single piece, and connecting parts are formed by extending downward at the ends of the corresponding flow channel wall surfaces of the heat dissipation A single piece and the heat dissipation B single piece, and the connecting parts are superposed to form the flow channel interface part.

5. The heat dissipation device for preventing fluid medium leakage according to claim 4, characterized in that, An abutting surface is arranged at the front end and / or the rear end of the flow channel interface part. After the flow channel interface part is inserted into the installation through groove, the abutting surface abuts against the top surface of the heat dissipation base.

6. The heat dissipation device for preventing leakage of fluid medium according to claim 4, characterized in that, The connecting part includes a flow channel enclosing wall and first wall parts respectively connected to both ends of the flow channel enclosing wall. The flow channel enclosing wall encloses to form a flow channel interface, and the two first wall parts at both ends are correspondingly attached to form a widened part, and the two first wall parts at both ends extend into the space between the two riveting convex parts.

7. A heat dissipation device for preventing leakage of a fluid medium according to claim 4, characterized in that, A second solder layer is covered on the superposed side surface of the heat dissipation A single piece and / or the heat dissipation B single piece, and the superposed side surfaces of the heat dissipation A single piece and the heat dissipation B single piece are mutually attached and welded and fixed.

8. The heat dissipation device for preventing leakage of fluid medium according to claim 1, wherein, A first capillary filler is filled in the flow channel.

9. A heat dissipation device for preventing leakage of a fluid medium according to claim 1, characterized in that, A second capillary filler is filled in the cavity.

10. An electronic device, characterized in that, Comprising a heating element and a heat dissipation device; the heat dissipation device is a heat dissipation device for preventing fluid medium leakage according to any one of claims 1 to 9.

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