Fluid sensing assembly with interposer

Abstract

A sensor assembly may include an integrated circuit die. A sensor assembly may include an interconnect connected to an integrated circuit die. A sensor assembly may include an interposer mounted over and connected to an interconnect. A sensor assembly may include a sensor configured to convert properties of one or more sample fluids, a thermal pathway between the sensor and an integrated circuit die, the thermal pathway extending through an interposer and an interconnect.

Description

Background Art

[0001] This application relates to a sensor assembly for fluid sensing. In many cases, it is desirable to sense a fluid to obtain information about the fluid. Sensing of various constituent materials of a biological fluid such as blood is typically performed in a medical environment. The sensor assembly can be better designed for fluid sensing to sense the fluid more conveniently and economically. Summary of the Invention

[0002] To summarize the present disclosure and the advantages achieved over the prior art, certain objects and advantages of the present disclosure are described herein. Not all of these objects or advantages may be achieved in any particular embodiment. Thus, for example, those skilled in the art will recognize that the invention can be practiced or carried out in a manner that achieves or optimizes one advantage or a group of advantages taught herein without necessarily achieving other objects or advantages taught or suggested herein.

[0003] All such specific embodiments are within the scope of the invention disclosed herein. From the following detailed description of the preferred embodiments with reference to the accompanying drawings, these and other specific embodiments will become apparent to those skilled in the art, and the invention is not limited to any particular preferred embodiment disclosed.

[0004] In one embodiment, the techniques described herein relate to a sensor assembly. The sensor assembly can include an integrated circuit die. The sensor assembly can include interconnects that are connected to the integrated circuit die. The sensor assembly can include an interposer that is mounted over and connected to the interconnects. The sensor assembly can include a sensor configured to convert the properties of one or more sample fluids, and a thermal path is located between the sensor and the integrated circuit die and extends through the interposer and the interconnects.

[0005] In some embodiments, the sensor assembly may further include a heating element configured to heat one or more sample fluids. In some embodiments, the sensor assembly may further include a thermal layer mounted to the interposer, wherein the sensor is disposed on the thermal layer. In some embodiments, the sensor assembly may further include a resistive layer mounted to the interposer, wherein the sensor is disposed on the resistive layer. In some embodiments, during use of the sensor assembly, the resistive layer electrically isolates the sensor and the interposer. In some embodiments, the resistive layer is thermally conductive. In an embodiment, the resistive layer is a photoresistive layer. In some embodiments, the heating element is disposed between the interconnect and the integrated circuit die. In some embodiments, the heating element is disposed between the resistive layer and the integrated circuit die. In some embodiments, the heating element is disposed in or on the interposer. In some embodiments, the heating element is disposed in or on the integrated circuit die. In some embodiments, during use of the sensor assembly, the integrated circuit die does not contact the liquid. In some embodiments, the integrated circuit die includes silicon. In some embodiments, the integrated circuit die includes one or more amplifiers. In some embodiments, the integrated circuit die includes one or more converters. In some embodiments, the interconnect includes a plurality of copper pillars. In some embodiments, the interconnect is thermally conductive. In some embodiments, the interposer is electrically connected to the integrated circuit die through the interconnect. In some embodiments, the interposer is electrically connected to the integrated circuit die. In some embodiments, the interposer includes vias connected to the interconnect and traces connected to the heating element. In some embodiments, the heating element includes a resistive heater. In some embodiments, the heating element includes a serpentine pattern. In some embodiments, the heating element has a resistance in the range of 80 ohms to 120 ohms. In some embodiments, during use of the sensor assembly, the thermal layer conducts heat between the sensor and the heating element. In some embodiments, during use of the sensor assembly, the thermal layer electrically isolates the sensor and the interposer. In some embodiments, the thermal layer includes polyimide. In some embodiments, the thermal layer includes silicon nitride. In some embodiments, the sensor is electrically isolated from the interposer. In some embodiments, the sensor includes gold pads. In some embodiments, the sensor includes functionalized pads. In some embodiments, the sensor assembly may further include a plurality of electrodes disposed on the interposer above a plurality of vias passing through the interposer. In some embodiments, the sensor assembly may further include a plurality of electrodes disposed on the resistive layer. In some embodiments, each of one or more of the plurality of electrodes on the interposer is disposed along an edge of the interposer. In some embodiments, the sensor assembly may further include a bottom fill layer located between the interposer and the integrated circuit die and surrounding the interconnect. In some embodiments, the sensor assembly may further include an electrical passivation layer disposed on at least the heating element to electrically passivate a local area.In some embodiments, the sensor assembly may further include one or more heater control pads disposed in or on an integrated circuit die, and the one or more heater control pads are configured to provide power to a heating element. In some embodiments, the sensor assembly may further include one or more electrode control pads disposed in or on an integrated circuit die, and the one or more electrode control pads are electrically connected to a plurality of electrodes on a resistive layer. In some embodiments, the sensor is exposed to a fluid passage through which one or more sample fluids will be conveyed. In some embodiments, the sensor assembly may further include a plurality of integrated circuit dies, a plurality of interconnects attached to the plurality of integrated circuit dies, a plurality of interposers mounted to the plurality of interconnects, a plurality of sensors configured to transform the properties of one or more sample fluids, and a plurality of heating elements configured to heat one or more sample fluids passing through the corresponding plurality of interposers. In some embodiments, the sensor assembly may further include a reinforcement that provides support for the sensor assembly. In some embodiments, the sensor assembly may further include a flow cell that is coupled to the plurality of integrated circuit dies and forms a fluid passage on a first side of the plurality of integrated circuit dies. In some embodiments, the sensor assembly may further include a cooling block that is coupled to a second side of the plurality of integrated circuit dies, the second side being opposite the first side of the plurality of integrated circuit dies, and the cooling block is configured to cool the sensor assembly in use. In an embodiment, the cooling block is coupled to the plurality of integrated circuit dies by a thermally conductive adhesive. In some embodiments, the sensor assembly may further include a connector configured to electrically connect the plurality of integrated circuit dies to one or more external devices.

[0006] In another embodiment, the techniques described herein relate to a sensor assembly. The sensor assembly may include an integrated circuit die. The sensor assembly may include an interconnect that is connected to the integrated circuit die. The sensor assembly may include an interposer that is mounted above and connected to the interconnect. The sensor assembly may include a sensor configured to transform the properties of one or more sample fluids. The sensor assembly may include a heating element configured to heat one or more sample fluids. The sensor assembly may include a thermal path that is located between the sensor and the heating element.

[0007] In some embodiments, the heating element is disposed in or on the interposer. In some embodiments, the heating element is disposed in or on the integrated circuit die.

[0008] In another embodiment, the techniques described herein relate to a sensor assembly. The sensor assembly can include an integrated circuit die. The sensor assembly can include interconnects that are connected to the integrated circuit die. The sensor assembly can include an interposer that is mounted over and connected to the interconnects. The sensor assembly can include a heating element that is disposed in or on the interposer. The sensor assembly can include a sensor that is configured to convert a property of one or more sample fluids. The sensor assembly can include a thermal pathway that is located between the sensor and the heating element.

[0009] In some embodiments, the sensor assembly can include a resistive layer that is mounted to the interposer, wherein the sensor is disposed on the resistive layer. In some embodiments, the sensor assembly can include an electrical passivation layer that is disposed on the heating element.

[0010] In another embodiment, the techniques described herein relate to a sensor assembly. The sensor assembly can include an integrated circuit die that forms a thermal platform. The sensor assembly can include one or more interconnects that are connected to the integrated circuit die. The sensor assembly can include an interposer that is mounted over and connected to the one or more interconnects. The sensor assembly can include a resistive layer that is mounted over and connected to the interposer. The sensor assembly can include reaction sites that are disposed in or on the resistive layer and that are configured to convert a property of one or more sample fluids. The sensor assembly can include a heating element that is disposed on the integrated circuit die and that is configured to heat one or more sample fluids, wherein at least one of the interposer and the one or more interconnects forms a thermal pathway between the reaction sites and the heating element.

[0011] In some embodiments, the resistive layer includes a thermally conductive layer that includes at least one of polyimide or silicon nitride. In some embodiments, the resistive layer includes a photoresist. In some embodiments, the resistive layer electrically isolates the reaction site and the interposer layer. In some embodiments, the integrated circuit die includes one or more amplifiers and one or more converters. In some embodiments, the sensor assembly may further include a plurality of electrodes disposed on the interposer layer and above a plurality of vias through the interposer layer, wherein the plurality of electrodes are coupled to at least one of the one or more interconnects, and wherein each of the plurality of electrodes is configured to transmit an electrical signal received from the integrated circuit die through at least one interconnect. In some embodiments, the sensor assembly may further include one or more electrode control pads disposed in or on the integrated circuit die, the one or more electrode control pads being electrically connected to the plurality of electrodes on the resistive layer. In some embodiments, the sensor assembly may further include an underfill layer disposed between the interposer layer and the integrated circuit die, the underfill layer filling the space surrounding the one or more interconnects. In some embodiments, the sensor assembly may further include an electrical passivation layer disposed on at least the heating element to electrically passivate a local area. In some embodiments, the sensor assembly may further include one or more heater control pads disposed in or on the integrated circuit die, the one or more heater control pads being configured to supply power to the heating element. In some embodiments, the reaction site is exposed to a fluid passage through which one or more sample fluids will be conveyed.

[0012] In another embodiment, the techniques described herein relate to a fluid sensor package. The fluid sensor package may include a plurality of sensor assemblies, each of the plurality of sensor assemblies including: an integrated circuit die that forms a thermal platform; one or more interconnects that are connected to the integrated circuit die; an interposer layer that is mounted and connected to the one or more interconnects; a reaction site that is disposed on the interposer layer and is configured to transform the properties of one or more sample fluids; and a heating element that is disposed on the integrated circuit die and is configured to heat the one or more sample fluids. The fluid sensor package may include a flow cell that is coupled to the plurality of sensor assemblies and forms a fluid passage for one or more sample fluids on a first side of the plurality of sensor assemblies.

[0013] In some embodiments, the fluid sensor package may further include a reinforcement that provides support for a plurality of sensor components. In some embodiments, the fluid sensor package may further include a cooling block that is coupled to a second side of the plurality of sensor components, the second side being opposite the first side of the plurality of sensor components, the cooling block being configured to dissipate heat from the plurality of sensor components. In some embodiments, the cooling block is coupled to the plurality of sensor components by a thermally conductive adhesive. In some embodiments, the fluid sensor package may further include a connector that is configured to electrically connect the plurality of sensor components to one or more external devices. In some embodiments, each sensor component of the plurality of sensor components further includes: a plurality of electrodes disposed on an interposer and above a plurality of vias through the interposer, the plurality of electrodes being coupled to at least one of one or more interconnects, and at least a portion of the plurality of electrodes being electrically coupled to at least a portion of the plurality of electrodes of another sensor component of the plurality of sensor components, and transmitting an electrical signal received from an integrated circuit die through at least one interconnect. In some embodiments, each sensor component of the plurality of sensor components further includes: one or more electrode control pads disposed in or on the integrated circuit die, the one or more electrode control pads being electrically connected to the plurality of electrodes on a resistive layer.

[0014] In another embodiment, the techniques described herein relate to an electronic component. The electronic component may include a sensor component that includes: a first integrated circuit die that forms at least a first portion of a thermal platform; a first one or more interconnects that are connected to the first integrated circuit die; an interposer that is mounted above and connected to the first one or more interconnects; a reaction site disposed in or on the interposer, the reaction site being configured to transform the properties of one or more sample fluids; and a heating element disposed on the first integrated circuit die, the heating element being configured to heat one or more sample fluids. The electronic component may include one or more electrical connectors that are configured to receive a control signal from an external device, the one or more electrical connectors including: one or more electrical traces that are electrically coupled to the external device; a second integrated circuit die that forms at least a second portion of the thermal platform; and a second one or more interconnects that are connected to the second integrated circuit die.

[0015] In some embodiments, the sensor component and the one or more electrical connectors are electrically and physically connected via the thermal platform.

[0016] In another embodiment, the techniques described herein relate to a sensor assembly. The sensor assembly may include an integrated circuit. The sensor assembly may include one or more interconnects coupled to the integrated circuit. The sensor assembly may include a substrate mounted over and connected to the one or more interconnects, the substrate including: an interposer; a heating element disposed on the interposer; a photoresist layer mounted over and connected to the interposer; and a reaction pad disposed on the interposer and over the heating element, the reaction pad configured to transform the properties of one or more sample fluids; wherein the heating element is configured to heat the one or more sample fluids.

[0017] In some embodiments, the sensor assembly may further include an electrical passivation layer disposed on the heating element, wherein the electrical passivation layer electrically isolates the reaction pad and the heating element. In some embodiments, the photoresist layer and the electrical passivation layer are thermally conductive, and the electrical passivation layer includes at least one of polyimide or silicon nitride. In some embodiments, the photoresist layer and the electrical passivation layer form a thermal path between the reaction pad and the heating element. In some embodiments, the integrated circuit includes one or more amplifiers and one or more converters. In some embodiments, the substrate is made of a flexible material, and the substrate further includes: a plurality of electrodes disposed in the photoresist layer and electrically connected to a plurality of electrical connectors disposed on the interposer and over a plurality of vias through the interposer, the plurality of electrodes being electrically coupled to at least one of the one or more interconnects via the plurality of electrical connectors, and each of the plurality of electrodes being configured to transmit an electrical signal received from the integrated circuit through at least one interconnect. In some embodiments, the substrate further includes an underfill layer coupled to a side of the interposer in contact with the integrated circuit, the underfill layer configured to receive the one or more interconnects. In some embodiments, the substrate further includes one or more heater control circuits disposed in or on the integrated circuit, the one or more heater control circuits configured to provide power to the heating element and convert a heat flow from the reaction pad into one or more electrical signals. In some embodiments, the reaction pad is exposed to a fluid passage through which the one or more sample fluids will be conveyed.

[0018] In another embodiment, the techniques described herein relate to a fluid sensor package. The fluid sensor package can include a plurality of sensor components, each of the plurality of sensor components including: an integrated circuit; one or more interconnects coupled to the integrated circuit; and a substrate mounted over and connected to the one or more interconnects, the substrate including: a heating element configured to heat one or more sample fluids; a photoresist layer mounted over the heating element; and a reaction pad disposed on the photoresist layer and over the heating element, the reaction pad configured to transform the properties of one or more sample fluids. The fluid sensor package can include a flow cell coupled to the plurality of sensor components and forming a fluid pathway for one or more sample fluids on a first side of the plurality of sensor components.

[0019] In some embodiments, the fluid sensor package can further include a reinforcement providing support for the plurality of sensor components. In some embodiments, the fluid sensor package can further include a cooling block coupled to a second side of the plurality of sensor components, the second side being opposite the first side of the plurality of sensor components, the cooling block configured to dissipate heat from the plurality of sensor components. In some embodiments, the cooling block is coupled to the plurality of sensor components by a thermally conductive adhesive. In some embodiments, the fluid sensor package can further include a connector configured to electrically connect the plurality of sensor components to one or more external devices.

[0020] In some embodiments, each of the plurality of sensor components further includes: a plurality of electrodes disposed in the photoresist layer and electrically connected to a plurality of electrical connectors. In these embodiments, the plurality of electrodes can be electrically coupled to at least one of the one or more interconnects via the plurality of electrical connectors. In these embodiments, each of the plurality of electrodes can be configured to transmit an electrical signal received from the integrated circuit through at least one interconnect. In these embodiments, at least a portion of the plurality of electrodes can be electrically coupled to at least a portion of the plurality of electrodes of another sensor component of the plurality of sensor components and transmit an electrical signal received from the integrated circuit through at least one interconnect.

[0021] In another embodiment, the techniques described herein relate to an electronic component. The electronic component can include a sensor component that includes: a first integrated circuit; a first one or more interconnects coupled to the first integrated circuit; and a substrate mounted over and connected to the first one or more interconnects, the substrate including: an interposer; a heating element disposed on the interposer and configured to heat one or more sample fluids; and a reaction pad disposed on the interposer and above the heating element, the reaction pad being configured to transform the properties of one or more sample fluids. The electronic component can include one or more electrical connectors configured to receive control signals from an external device, the one or more electrical connectors including: one or more electrical traces electrically coupled to the external device; a second integrated circuit; and a second one or more interconnects connected to the second integrated circuit.

[0022] In some embodiments, the first integrated circuit and the second integrated circuit are electrically and physically coupled. In some embodiments, the substrate further includes an electrical passivation layer disposed on the heating element, wherein the electrical passivation layer electrically isolates the reaction pad and the heating element. In some embodiments, the substrate further includes a photoresist layer; and wherein the photoresist layer and the electrical passivation layer are thermally conductive. In some embodiments, the substrate further includes: a plurality of electrodes disposed in the photoresist layer; and wherein the plurality of electrodes are electrically coupled to at least one of the first one or more interconnects, and each electrode of the plurality of electrodes is configured to transmit an electrical signal received from the first integrated circuit through at least one interconnect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Various specific embodiments will be described hereinafter with reference to the drawings. These specific embodiments are illustrated and described only by way of example and are not intended to limit the scope of the present disclosure. In the drawings, like elements have like reference numerals.

[0024] Figure 1A An exploded view of a sensor component according to an embodiment is illustrated.

[0025] Figure 1B An assembled sensor component according to an embodiment is illustrated.

[0026] Figures 1C to 1E A sensor component according to an embodiment and electrical connectors that can provide input / output connections to the sensor component are schematically illustrated.

[0027] Figure 2A An exploded view of another sensor component according to an embodiment is illustrated.

[0028] Figure 2B An assembled sensor assembly according to an embodiment is illustrated.

[0029] Figures 2C to 2E A sensor assembly according to an embodiment and an electrical connector that can provide input / output connections to the sensor assembly are schematically illustrated.

[0030] Figure 3A An exploded view of another sensor assembly according to an embodiment is illustrated.

[0031] Figure 3B An assembled sensor assembly according to an embodiment is illustrated.

[0032] Figures 3C to 3E A sensor assembly according to an embodiment and an electrical connector that can provide input / output connections to the sensor assembly are schematically illustrated.

[0033] Figure 4A An exploded view of another sensor assembly according to an embodiment is illustrated.

[0034] Figure 4B An assembled sensor assembly according to an embodiment is illustrated.

[0035] Figures 4C to 4E A sensor assembly according to an embodiment and an electrical connector that can provide input / output connections to the sensor assembly are schematically illustrated.

[0036] Figure 5A Is an exploded view of a sensor assembly according to an embodiment.

[0037] Figure 5B A cross-section of a sensor assembly according to an embodiment is illustrated.

[0038] Figure 5C A top view of a sensor assembly with a transparent thermal layer according to an embodiment is illustrated.

[0039] Figure 5D An exploded view of a sensor assembly with a transparent intermediate layer according to an embodiment is illustrated.

[0040] Figure 6 Another embodiment of a sensor assembly according to the present disclosure is illustrated.

[0041] Figures 7A to 7D An embodiment of a fluid sensor package utilizing multiple sensor assemblies is illustrated. Detailed Description

[0042] The present disclosure can be understood by reference to the following detailed description. Note that, for illustrative clarity, some elements in the various figures may not be drawn to scale, may be represented schematically or conceptually, or may not exactly correspond to some physical configurations of the embodiments.

[0043] Generally, one or more aspects of the present disclosure relate to sensor assemblies for fluid sensing. In certain embodiments, the present disclosure relates to sensor assemblies for fluid sensing having an interposer layer that can isolate the die from the sample fluid. Conventional integrated circuits for sensing fluids have integrated circuit dies exposed to the liquid and thus are specifically packaged with wires and conductors separated from the liquid. In the various embodiments disclosed herein, the interposer layer can be used to separate the integrated circuit die from the liquid to improve packaging and make the manufacture of integrated circuits for fluid sensing easier.

[0044] Figures 1A to 1E An embodiment of a sensor assembly 100 according to the present disclosure is illustrated. Figure 1A is an exploded view of the sensor assembly 100. Figure 1B illustrates the assembled sensor assembly 100, while Figures 1C to 1E schematically shows the assembled sensor assembly 100 in an electronic assembly having electrical connectors 130 that can provide input / output connections for the sensor assembly 100. As Figure 1A and Figure 1BAs illustrated, the sensor assembly 100 may include a thermal interposer 102 and a thermal platform 104. In some embodiments, the thermal platform 104 may be a monolithic chip. In some embodiments, the thermal platform 104 may include an integrated circuit chip or die and / or be formed by an integrated circuit chip or die. In some embodiments, the thermal platform 104 may include a heating element 106 (also referred to as a heater) and a plurality of heater control pads 108 (also referred to as control electrodes) connected to the heating element 106. The heating element 106 may be resistive. The heating element 106 may be formed of any suitable material, such as nickel phosphide (“NiP”), ruthenium (“Ru”), etc. In some embodiments, the heating element 106 may be located in a central region of the thermal platform 104, near the top side of the thermal platform 104. In some embodiments, the thermal platform 104 may further include an electrical passivation layer 110 disposed on the top side of the thermal platform 104. The electrical passivation layer 110 may electrically passivate a local region. In some embodiments, the electrical passivation layer 110 may electrically isolate the heating element 106 and / or the heater control pads 108 on the thermal platform 104 from other components (e.g., the interconnects 120 in the thermal interposer 102). The electrical passivation layer 110 may be formed of an electrically insulating material to electrically passivate. In some embodiments, the electrical passivation layer 110 may be formed of a material having a high thermal conductivity to transfer heat from the heating element 106. In some embodiments, the electrical passivation layer 110 may be formed of, for example, silicon nitride (“Si3N4”), polyimide, etc.

[0045] According to various embodiments disclosed herein, the thermal interposer 102 may be disposed on top of the thermal platform 104. In some embodiments, the thermal interposer 102 may include a fluid interposer 112 (also referred to as a substrate) configured to separate a sample to be sensed on top of the sensor assembly 100 from other components of the sensor assembly 100. The thermal interposer 102 may further include a resistive layer 114 disposed on the fluid interposer 112. In some embodiments, reaction sites 116 may be disposed on the thermal interposer 102. The reaction sites 116 may be disposed on the resistive layer 114 or directly on the fluid interposer 112. In some embodiments, the resistive layer 114 may be a biocompatible and / or photoresistive layer and may further define the surface properties, geometric patterns, and other mechanical or biochemical properties of the sensor assembly 100.

[0046] The thermal interposer 102 may also include an underfill 118 disposed between the fluid interposer 112 and the thermal platform 104. One or more interconnects 120 may be embedded in the underfill 118 and configured to thermally connect the thermal platform 104 and the thermal interposer 102. In some embodiments, the interconnect 120 may be a copper pillar having a copper body and a solder cap. In some embodiments, the thermal interposer 102 may also include one or more conductive vias 122 disposed in the fluid interposer 112 to thermally connect the reaction site 116 to the bottom side of the fluid interposer 112. When the heating element 106 is connected to a power source, heat may be generated and transferred from the heating element 106 through the electrical passivation layer 110, the interconnects 120, and the vias 122 to the reaction site 116. The reaction site 116 may be electrically isolated from the heating element 106. As Figure 1A and Figure 1B shown, the heating element 106, the interconnects 120, the vias 122, and the reaction site 116 may have comparable diameters to achieve efficient heat transfer between components.

[0047] In some embodiments, the sensor assembly 100 may be connected to a set of electrical connectors 130 through the thermal platform 104, as Figures 1C to 1E shown. The electrical connectors 130 may similarly include a thermal platform 132 having an integrated circuit (e.g., a complementary metal oxide semiconductor application specific integrated circuit (“CMOS ASIC”)). In some embodiments, the thermal platform 132 of the electrical connectors 130 and the thermal platform 104 of the sensor assembly 100 may be connected or form a single body. In some embodiments, the electrical connectors 130 may also include interconnects 134 (e.g., copper pillars) embedded in an underfill 136 on top of the thermal platform 132. In some embodiments, the electrical connectors 130 may also include a flexible circuit board 138 having vias 140 and traces 142 on top of the interconnects 134.

[0048] In some embodiments, the electrical connectors 130 may be further connected to an external device, such as a package substrate (e.g., a PCB) or another device (e.g., another die), through any suitable electrical connector (such as wire bonding) connected to the traces 142. For example, the traces 142 may be electrically coupled to the external device such that the traces 142 may receive input signals of the electrical connectors 130 and transmit output signals to the external device.

[0049] In some embodiments, a control signal can be sent, for example, from an external device to the electrical connector 130, and then through the heating platform 132 and / or the heating platform 104 and through the heater control pad 108 to the heating element 106 and / or the reaction site 116 on the resistive layer 114. In some embodiments, an electric current can be transmitted through the sensor assembly 100 to the heating element 106 to generate heat, and the heating element 106 can transfer the heat through the electrical passivation layer 110, the interconnect 120, the fluid interlayer 112, the resistive layer 114, and / or the reaction site 116 to at least a portion of the sample fluid surrounding the reaction site 116. In some embodiments, the heating element 106 can transfer the heat to at least a portion of the sample fluid only through the resistive layer 114 and the reaction site 116. The generated heat can heat the portion of the sample fluid such that a chemical, mechanical, or biological reaction occurs in the portion of the sample fluid to achieve a desired sensing condition. Then, the integrated circuit die can be configured to turn off the electric current to the heating element 106 and stop generating heat at the heating element 106. When the heating element 106 stops providing heat to the reaction site 116, the reaction site 116 can be configured to convert and transfer temperature information (e.g., a temperature change) to the thermal platform 104 through the fluid interlayer 112 and one or more interconnects 120.

[0050] Figures 2A to 2E Another embodiment of a sensor assembly 200 in accordance with the present disclosure is shown. Figure 2A is an exploded view of the sensor assembly 200. Figure 2B The assembled sensor assembly 200 is shown, and Figures 2C to 2E schematically shows the assembled sensor assembly 200 in an electronic assembly having electrical connectors 230 that can provide input / output connections for the sensor assembly 200. Similar to Figures 1A to 1E the sensor assembly 100, the sensor assembly 200 can include a thermal platform 204 and a thermal interlayer 202, but with additional electrodes 217 disposed on the thermal interlayer 202, as Figure 2A shown. The thermal platform 204 can include a monolithic chip 205 and an electrical passivation layer 210 disposed on the chip. The electrical passivation layer 210 can be, for example, a thin Si3N4 layer or other suitable material. In some embodiments, the heating element 206 can be disposed below the electrical passivation layer 210. The heating element 206 can be resistive. In some embodiments, the thermal platform 204 can include a plurality of electrodes, such as heater control pads 208 and electrode control pads 209. In some embodiments, the heater control pad 208 can be configured to control the heating element 206 and is disposed below the electrical passivation layer 210. In some embodiments, the electrode control pad 209 is configured to control the electrode 217 on top of the thermal interlayer 202 and is not covered by the electrical passivation layer 210.

[0051] The thermal interposer 202 may similarly include a fluid interposer 212 and a resistive layer 214 on top of the fluid interposer 212. One or more reaction sites 216 or electrodes 217 may be disposed on top of the thermal interposer 202 and are electrically or thermally connected to the thermal platform 204 through vias 222 or traces in the fluid interposer 212. In some embodiments, the thermal interposer 202 may also include an underfill 218 having one or more interconnects 220 (e.g., copper pillars) configured to electrically or thermally connect one or more reaction sites 216 and / or electrodes 217 on top of the thermal interposer 202 to the heater control pads 208 and / or electrode control pads 209 in the thermal platform 204. For example, as Figure 2A shown, the sensor assembly 200 may include a central reaction site and four electrodes 217. In some embodiments, as described above, the central reaction site may be configured to be thermally connected to the heating element 206 below the electrical passivation layer 210. In some embodiments, the electrodes 217 may be electrically connected to the electrode control pads 209 disposed on the thermal platform 204. In some embodiments, the electrical connection between the electrodes 217 and the thermal platform 204 may be achieved by selectively exposing one or more of the electrode control pads 209 through the passivation layer such that one or more of the electrode control pads 209 are not electrically insulated from the components above. The electrical connection between one or more reaction sites 216 or electrodes 217 and the thermal platform 204 enables information transfer between the two.

[0052] In certain embodiments, each of the electrodes 217 may be positioned along the edge of the thermal interposer 202 such that another sensor assembly 200 according to the present disclosure may be positioned next to the current sensor assembly and is electrically connected by a set of electrical leads on the electrodes 217 exposed on the edge of the thermal interposer 202. In certain embodiments, the electrodes 217 have an approximate "M" shape, as Figures 2A to 2E illustrated, where the set of electrical leads is located on the edge of the thermal interposer 202. When more than one sensor assembly 200 is connected along the edge by the electrodes 217, not all of the electrodes 217 on any single sensor assembly 200 need to be connected to the electrode control pads 209 on the thermal platform 204. For example, in Figure 2A the configuration shown, only two adjacent electrodes 217 are electrically connected to the electrode control pads 209 on the heating platform 204. In some embodiments, as Figure 2A illustrated, a third electrode control pad 209 may also be electrically connected to the central reaction site 216.

[0053] In some embodiments, the sensor assembly 200 may be connected to a set of electrical connectors 230 through the thermal platform 204, asFigures 2C to 2E As shown. The electrical connector 230 may similarly include a thermal platform 232 having an integrated circuit (e.g., a complementary metal oxide semiconductor application specific integrated circuit (“CMOS ASIC”)). In some embodiments, the thermal platform 232 of the electrical connector 230 and the thermal platform 204 of the sensor assembly 200 may be connected or form a single body. In some embodiments, the electrical connector 230 may further include interconnects 234 (e.g., copper pillars) embedded in underfill 236 on top of the thermal platform 232. In some embodiments, the electrical connection 230 may further include a flexible circuit 238 having vias 240 and traces 242 on top of the interconnects 234.

[0054] In some embodiments, the electrical connector 230 may be further connected to an external device, such as a package substrate (e.g., a PCB) or another device (e.g., another die), through any suitable electrical connector (such as wire bonding) connected to the traces 242. For example, the traces 242 may be electrically coupled to the external device such that the traces 242 may receive input signals of the electrical connector 230 and transmit output signals to the external device.

[0055] In some embodiments, a control signal may be sent, for example, from an external device to the electrical connector 230, and then through the heating platform 232 and / or the heating platform 204 and through the heater control pad 208 to the reaction sites 216 on the heating element 206 and / or the resistive layer 214. In some embodiments, a control signal may be sent, for example, from an external device to the electrical connector 230, and then through the thermal platform 232 and / or the thermal platform 204 and through the electrode control pad 209 to the electrode 217 and into another sensor assembly 200. Similarly, in some embodiments, a control signal may be received by the sensor assembly 200 through the electrode 217, through the electrode control pad 209, and through the heater control pad 208 to the reaction sites 216 in the thermal platform 204 and / or the resistive layer. Thus, the control signal of the sensor assembly 200 may be received directly from an external device or through an adjacent sensor assembly 200.

[0056] In some embodiments, current can be transmitted through the sensor assembly 200 to the heating element 206 to generate heat, and the heating element 206 can transfer the heat to at least a portion of the sample fluid surrounding the reaction site 216 through the electrical passivation layer 210, the interconnect 220, the fluid interposer layer 212, the resist layer 214, and / or the reaction site 216. In some embodiments, the heating element 106 can transfer the heat to at least the portion of the sample fluid only through the resist layer 214 and the reaction site 216. The heat generated can heat the portion of the sample fluid such that a chemical, mechanical, or biological reaction occurs in the portion of the sample fluid to achieve a desired sensing condition. The integrated circuit die can then be configured to turn off the current to the heating element 206 and stop generating heat at the heating element 206. When the heating element 206 stops providing heat to the reaction site 216, the reaction site 216 can be configured to convert and transfer temperature information (e.g., temperature change) to the thermal platform 204 through the fluid interposer layer 212 and one or more interconnects 220.

[0057] Figures 3A to 3E Another embodiment of a sensor assembly 300 in accordance with the present disclosure is shown. Figure 3A is an exploded view of the sensor assembly 300. Figure 3B The assembled sensor assembly 300 is shown, and Figures 3C to 3E the assembled sensor assembly 300 in an electronic assembly with electrical connectors 330 is schematically shown, and these electrical connectors can provide input / output connections for the sensor assembly 300. In some embodiments, the sensor assembly 300 can include an integrated circuit 304 (e.g., a CMOS ASIC). In some embodiments, the integrated circuit 304 can be a monolithic chip. The integrated circuit 304 can include a plurality of electrical connection sites (e.g., aluminum pads) disposed on the top side of the integrated circuit 304. The integrated circuit 304 can also include interconnects 320 (e.g., copper pillars) disposed on the plurality of electrical connection sites.

[0058] In certain embodiments, the sensor assembly 300 can further include a flexible circuit 302 (e.g., an active flexible board) disposed on top of the integrated circuit 304. The flexible circuit 302 can include a fluid interposer layer 312 (e.g., a flexible substrate). The fluid interposer layer 312 can include one or more heating elements 306 and associated electrical connectors 308 coupled to the fluid interposer layer 312. For example, as Figure 3AAs shown, the fluid interposer 312 may include a resistive heating element 306 (e.g., Ru, Ni, etc.) sputtered or deposited on the fluid interposer 312. In some embodiments, one or more of the electrical connectors 308 may include electrodes on the surface of the fluid interposer 312 and vias / traces 322 through the fluid interposer 312. One or more of the electrical connectors 308 may be connected to the heating element 306 to provide power and generate heat.

[0059] The electrical connector 308 may be electrically and / or thermally connected to the interconnect 320 on the integrated circuit 304. In some embodiments, the flexible circuit 302 may further include a bottom-side resist layer 318 (e.g., underfill), which is coupled to the bottom side of the fluid interposer 312 and is configured to receive the interconnect 320 on the integrated circuit 304, thereby ensuring a stable connection between the interconnect 320 on the integrated circuit 304 and the electrical connector 308 on the fluid interposer 312.

[0060] According to various embodiments disclosed herein, an electrical passivation layer 310 (e.g., Si3N4) may be disposed at least on top of the heating element 306 to at least coat the top side of the heating element 306, thereby electrically passivating the local area, while one or more of the electrical connectors 308 on the fluid interposer 312 are exposed through the passivation layer 310. A reactive pad 316 (e.g., gold pad) with an appropriate thickness may be sputtered on the electrical passivation layer 310. In some embodiments, the reactive pad 316 and the rest of the sensor assembly 300 may be thermally connected to the heating element 306 and are electrically isolated by the passivation layer 310. The thickness of the reactive pad 316 may be further defined by an electroplating process. In some embodiments, a photoresist layer 314 (e.g., biocompatible resist layer) may be added on top of the fluid interposer 312 to further define the surface properties, geometric patterns, and other mechanical or biochemical properties of the sensor assembly 300. The reactive pad 316 may be embedded in the photoresist layer 314, exposing the top side and the bottom side.

[0061] According to various embodiments, heat can flow bidirectionally between the reaction pad 316 and the heating element 306. In some embodiments, heat can flow between the reaction pad 316 and the heating element 306 through at least the electrical passivation layer 310. The heating element 306 can include a control circuit 309 to convert the heat flow from the reaction pad 316 into one or more electrical signals (e.g., temperature signals). In some embodiments, a signal can be sent to the heating element 306 through the interconnect 320 to generate heat that is transferred upward to the reaction pad 316. In such embodiments, heat is intentionally not allowed to flow downward through the interconnect 320. In some embodiments, the electrical signal from the control circuit 309 in the heating element 306 can be transmitted downward to the integrated circuit 304 through one or more electrical connectors 308 and the interconnect 320 on the fluid interposer 312. Examples of the control circuit 309 that can be included in the heating element 306 can be found in U.S. Patent Publication No. US20220126300, the entire contents of which are incorporated herein by reference in their entirety and for all purposes.

[0062] In some embodiments, the sensor assembly 300 can be connected to a set of electrical connectors 330 through the integrated circuit 304, as Figures 3C to 3E shown. The electrical connectors 330 can similarly include a thermal platform 332 having an integrated circuit (e.g., a complementary metal oxide semiconductor application specific integrated circuit (“CMOS ASIC”)). In some embodiments, the thermal platform 332 of the electrical connectors 330 and the integrated circuit 304 of the sensor assembly 300 can be connected or formed as a single body. In some embodiments, the electrical connectors 330 can further include interconnects 334 (e.g., copper pillars) embedded in underfill 336 on top of the thermal platform 332. In some embodiments, the electrical connection 330 can further include a flexible circuit 338 having vias 340 and traces 342 on top of the interconnects 334.

[0063] In some embodiments, the electrical connectors 330 can be further connected to an external device, such as a package substrate (e.g., a PCB) or another device (e.g., another die), through any suitable electrical connector (such as wire bonding) connected to the traces 342. For example, the traces 342 can be electrically coupled to the external device such that the traces 342 can receive input signals from the electrical connectors 330 and transmit output signals to the external device. In some embodiments, control signals and / or current can be sent, for example, from the external device to the electrical connectors 330 and then transmitted through the thermal platform 332 and / or the integrated circuit 304, through the interconnect 320 and into the control circuit 309 of the heating element 306.

[0064] Figures 4A to 4E Another embodiment of a sensor assembly 400 according to the present disclosure is shown. Figure 4Ais an exploded view of the sensor assembly 400. Figure 4B The assembled sensor assembly 400 is shown, Figures 4C to 4E schematically showing the assembled sensor assembly 400 in an electronic assembly having electrical connectors 430 that can provide input / output connections to the sensor assembly 400. The sensor assembly 400 can similarly include an integrated circuit 404 (e.g., a CMOS ASIC) and a flexible circuit 402 (e.g., a flexible board). In some embodiments, the integrated circuit 404 can include a plurality of interconnects 420 (e.g., copper pillars). The flexible circuit 402 can similarly include a fluid interposer 412 and a plurality of electrical connectors 408 that connect to the interconnects 420 on the integrated circuit 404. In some embodiments, the flexible circuit 402 can further include a bottom-side resist 418 that is configured to receive the interconnects 420, thereby allowing a stable connection between the electrical connectors 408 on the fluid interposer 412 and the interconnects 420 on the integrated circuit 404. In some embodiments, the fluid interposer 412 can include a heating element 406, where one or more of the electrical connectors 408 supply power to the heating element 406.

[0065] As described in more detail above with respect to Figures 3A to 3E a passivation layer 410 can be disposed on top of the heating element 406 to at least coat the top side of the heating element 406, thereby electrically passivating a local area. A reactive pad 416 can be sputtered on the passivation layer 410. In some embodiments, the flexible circuit 402 can further include a photoresist layer 414 (e.g., a biocompatible resist layer). The reactive pad 416 can be embedded in the photoresist layer 414, exposing the top side and the bottom side. In some embodiments, the reactive pad 416 and the remainder of the sensor assembly 400 can be thermally connected to the heating element 406 and electrically isolated by the passivation layer 410. The thickness of the reactive pad 416 can be further defined by an electroplating process. In some embodiments, the photoresist layer 414 can further define the surface properties, geometric patterns, and other mechanical or biochemical properties of the sensor assembly 400. The reactive pad 416 can be embedded in the photoresist layer 414, exposing the top side and the bottom side.

[0066] As described in more detail above with respect to Figures 3A to 3EAs described in more detail, heat can flow bidirectionally between the reaction pad 416 and the heating element 406. In some embodiments, heat can flow between the reaction pad 416 and the heating element 406 through at least the electrical passivation layer 410. The heating element 406 can include a control circuit 409 to convert the heat flow from the reaction pad 416 into one or more electrical signals (e.g., temperature signals). In some embodiments, signals can be sent to the heating element 406 through the interconnect 420 to generate heat that is transferred upward to the reaction pad 416. In such embodiments, heat is intentionally not allowed to flow downward through the interconnect 420. In some embodiments, the electrical signals from the control circuit 409 in the heating element 406 can be transmitted downward to the integrated circuit 404 through one or more electrical connectors 408 on the fluid interposer 412 and the interconnect 420.

[0067] As Figure 4A shown, the flexible circuit 402 can also include one or more additional reaction electrodes 417 (e.g., four electrodes 417) embedded in the photoresist layer 414. In certain embodiments, the electrodes 417 have an approximate "M" shape, as Figures 4A to 4E illustrated, where a set of electrical leads is located on the edge of the flexible circuit 402. In some embodiments, each of the electrodes 417 can be positioned along the edge of the flexible circuit 402 such that another sensor assembly 400 according to the present disclosure can be positioned next to the current sensor assembly and electrically connected through the set of electrical leads on the electrodes 417, as described above with respect to Figures 2A to 2E described. In some embodiments, the electrodes 417 can be electrically connected to the integrated circuit 404 through the electrical connectors on the fluid interposer 412 and the interconnect 420 on the integrated device to allow the transmission of electrical signals and / or information signals.

[0068] In some embodiments, the sensor assembly 400 can be connected to a set of electrical connectors 430 through the integrated circuit 404, as Figures 4C to 4E shown. The electrical connectors 430 can similarly include a thermal platform 432 having an integrated circuit (e.g., a complementary metal oxide semiconductor application specific integrated circuit ("CMOS ASIC")). In some embodiments, the thermal platform 432 of the electrical connectors 430 and the integrated circuit 404 of the sensor assembly 400 can be connected or formed as a single body. In some embodiments, the electrical connectors 430 can also include interconnects 434 (e.g., copper pillars) embedded in the underfill 436 on the top of the thermal platform 432. In some embodiments, the electrical connectors 430 can also include a flexible circuit 438 having vias 440 and traces 442 on the top of the interconnects 434.

[0069] In some embodiments, the electrical connector 430 can be further connected to an external device, such as a package substrate (e.g., a PCB) or another device (e.g., another die), via any suitable electrical connector (such as wire bonding) that connects to the trace 442. For example, the trace 442 can be electrically coupled to the external device such that the trace 442 can receive an input signal from the electrical connector 430 and transmit an output signal to the external device.

[0070] In some embodiments, a control signal and / or current can be sent, for example, from an external device to the electrical connector 430 and then transmitted through the thermal platform 432 and / or the integrated circuit 404, through the interconnect 420 and into the control circuit 409 of the heating element 406. As more detailed in Figures 2A to 2E the control signal and / or current can also be transmitted from the external device to the adjacent sensor assembly 400 via a connection path through the thermal platform 432 and / or the integrated circuit 404, the interconnect 420, and the electrode 417. Similarly, the control signal and / or current can be provided to the control circuit 409 of the heating element 406 from the adjacent sensor assembly 400 rather than from the external device via a connection path through the electrode 417, the interconnect 420, and the integrated circuit 404.

[0071] Figures 5A to 5D Another embodiment of a sensor assembly 500 in accordance with the present disclosure is shown. Figure 5A is an exploded view of the sensor assembly 500. Figure 5B Illustrates a cross-section of the sensor assembly 500. Figure 5C Illustrates a top view of the sensor assembly 500 with a transparent thermal layer 512. Figure 5D Illustrates an exploded view of the sensor assembly 500 with a transparent interposer layer 502 such that the vias 510 are visible.

[0072] As Figures 5A to 5D shown, the sensor assembly 500 can include an interposer layer 502 and an integrated circuit die 504 configured to be electrically connected to the interposer layer 502. In some embodiments, the integrated circuit die 504 can include one or more converters and / or one or more amplifiers. In some embodiments, the interposer layer 502 and the integrated circuit die 504 can be electrically connected by one or more interconnects 506. The one or more interconnects 506 can include copper pillars or other suitable conductive or semiconductive materials.

[0073] In some embodiments, the interposer layer 502 can be a substrate. In some embodiments, the interposer layer 502 can be a flexible substrate, such as an insulating material (e.g., a polymer such as polyimide) with embedded conductive traces 511 and pads 509. In some embodiments, the interposer layer 502 can be made of a dielectric material. The interposer layer 502 can include a heater 508 embedded within the interposer layer 502. The heater 508 can be configured to generate heat energy when supplied with current. In various embodiments, the heater 508 can include a resistive heater. In some embodiments, the heater 508 can have a serpentine pattern. In some embodiments, the heater 508 can have a resistance in the range of 50 ohms to 250 ohms (or in the range of 80 ohms to 120 ohms, e.g., about 100 ohms). The interposer layer 502 can also include one or more vias 510 to permit electrical and / or thermal connection between two opposing sides of the interposer layer 502.

[0074] The sensor assembly 500 can also include a thermal layer 512 disposed on the interposer layer 502. The sensor assembly 500 can also include a sensor 514 (e.g., a metal pad) disposed on the thermal layer 512. The sensor 514 can be configured to contact a sample fluid and sense or measure a property of the sample fluid (e.g., temperature, material property, etc.). In some embodiments, the sensor 514 can include a functionalized electrode, where a functionalized material is disposed on the pad. In some embodiments, the sensor 514 can be configured to be thermally coupled and electrically isolated from the heater 508 of the interposer layer 502. In some embodiments, the sensor 514 can be configured to be electrically isolated from the heater 508 of the interposer layer 502. In some embodiments, the sensor 514 can be configured to be thermally coupled and electrically isolated from the interposer layer 502. In some embodiments, the sensor 514 includes a gold pad.

[0075] In some embodiments, the thermal layer 512 can be made of a material having electrical insulation and thermal insulation properties. However, the thickness of the thermal layer 512 can be provided to be thin enough to conduct heat between the sensor 514 and the heater 508 or the vias 510. Heat generated by the heater 508 can be configured to heat at least a portion of the sample fluid to a desired temperature or for a desired amount of time. In some embodiments, the heat can reach the portion of the sample fluid by passing through the thermal layer 512.

[0076] The thermal layer 512 may have a composition and thickness that electrically isolates or separates the sensor 514 (e.g., pad) from the heating elements and vias 510 of the interposer 502. In various embodiments, the thermal layer 512 may include a thermally and electrically insulating material, however the thermally and electrically insulating material is dimensioned thin enough to conduct heat vertically between the sensor 514 and the underlying vias 510 and heaters 508 of the interposer 502. In various embodiments, the thermal layer 512 may include a polymer (such as polyimide) provided on the interposer 502 via an adhesive. In other embodiments, an inorganic dielectric layer (such as silicon nitride) may be provided above the interposer 502.

[0077] In various embodiments, when using the sensor assembly 500, the heater 508 may be turned on to heat the sensor assembly 500 and / or at least a portion of the fluid surrounding the sensor 514 to a desired temperature. In some embodiments, the heater 508 may be turned on by supplying current to the heater 508, for example, via the interconnect 506, the vias 510 of the interposer 502, and the traces 511. Then, the heater 508 may be turned off to allow the sensor 514 to sense or measure information about the fluid (e.g., temperature, etc.). For example, heat may flow from the fluid sample to the pad, through the thermal layer 512 to the vias 510 of the interposer 502, and through the interconnect 506 to the integrated circuit die 504. The sensed information (e.g., temperature or temperature change) may be processed by the integrated circuit die 504. In some embodiments, the sensed information from the sensor 514 may be transmitted to the integrated circuit die 504 via the vias 510, the interconnect 506, the contact pads 509, and / or the solder bumps. Then, the integrated circuit die 504 may transmit the sensed information (processed or unprocessed) to an external device via a connector.

[0078] For example, when using Figures 5A to 5D the sensor assembly 500 shown, the integrated circuit die 504 may be configured to transmit current to the heating element via the interconnect 506 and the vias 510 (and the traces 511 and / or pads 509 connected to the vias 510) to generate heat at the heating element. The heating element may transfer heat to at least a portion of the sample fluid surrounding the heater 508 through the thermal layer 512 and the heater 508. The generated heat may heat the portion of the sample fluid such that a chemical, mechanical, or biological reaction occurs in the portion of the sample fluid to achieve a desired sensing condition. Then, the integrated circuit die 504 may be configured to turn off the current to the heater 508 and stop generating heat at the heater 508. When the heater 508 stops providing heat, the sensor 514 may be configured to convert and transmit temperature information (e.g., temperature change) to the integrated circuit die 504 through the interposer 502 and the interconnect 506.

[0079] Figure 6 Shows another embodiment of the sensor assembly 600 according to the present disclosure. The sensor assembly 600 may similarly include an interposer 602 and an integrated circuit die 604 electrically connected to the interposer 602. The interposer 602 and the integrated circuit die 604 may be electrically connected by interconnects 606 (e.g., copper pillars). In some embodiments, the interposer 602 may include one or more vias 608 to electrically connect two opposite sides of the interposer 602. The sensor assembly 600 may further include a sensor 610 configured to contact a sample fluid 612 and sense or measure information about the sample fluid 612 (e.g., temperature, voltage, etc.).

[0080] The sensor assembly 600 may further include a heater 614 disposed in or on the integrated circuit die. The heater 614 may be configured to generate heat when a current is supplied. In some embodiments, the heater 614 may be disposed between one or more interconnects 606 and the integrated circuit die. In some embodiments, the heater 614 may be configured to heat at least a portion of the sample fluid 612 by generating heat that passes through the interconnects 606, the interposer 602, and the sensor 610.

[0081] Figure 6 The sensor assembly 600 shown in may operate similarly to that described above to sense and convert information with the sensor 610 and transmit the information to the integrated circuit die 604 for processing. For example, when using Figure 6 the sensor assembly 600 shown in, the integrated circuit die 604 may be configured to turn on the heater 614. The generated heat may reach the sensor 610 and at least a portion of the sample fluid 612 surrounding the sensor 610 through one or more interconnects 606 and the interposer 602. The generated heat may heat the portion of the sample fluid 612 such that a chemical, mechanical, or biological reaction occurs in the portion of the sample fluid 612 to achieve a desired sensing condition. Then, the heater 614 may be turned off and heat generation may stop. When no more heat is supplied to the sensor 610, the sensor 610 may convert and transmit temperature information (e.g., temperature change) to the integrated circuit die 604 through the interposer 602 and the interconnects 606.

[0082] Figures 7A to 7D Illustrates an embodiment of a fluid sensor package 700 that utilizes a plurality of sensor assemblies 702. Figure 7A Illustrates a perspective view of the fluid sensor package 700, Figure 7B Illustrates a cross-section of the fluid sensor package 700, Figure 7C is a top view of the flow cell 710 on the fluid sensor package 700, and Figure 7DIt is a bottom view of the fluid sensor package 700. The plurality of sensor components 702 can correspond to any implementation of the sensor components described herein (such as the sensor component 100, sensor component 200, sensor component 300, sensor component 400, sensor component 500, or sensor component 600 described above).

[0083] As Figures 7A to 7D shown, the plurality of sensor components 702 can be coupled to each other and implemented in the fluid sensor package 700. The fluid sensor package 700 can include any desired number of sensor components 702 to achieve the desired result. In some implementations, the fluid sensor package 700 can have eight sensor chips 703, each sensor chip having 384 sensor components 702.

[0084] The fluid sensor package 700 can also include a reinforcement 704 configured to provide a rigid structure to the fluid sensor package 700. As needed, various electrical components 706 can be coupled to the reinforcement 704. In some implementations, a connector 708 can be coupled to the reinforcement 704 and configured to transmit signals from the sensor components 702 to an external device. The fluid sensor package 700 can also include a flow cell 710 mounted to the reinforcement 704. In some implementations, the flow cell 710 can be mounted to the first side of the reinforcement 704. The flow cell 710 can include a fluid inlet hole 712a and a fluid outlet hole 712b configured to allow one or more sample fluids to enter, flow through, and / or remain in the flow cell 710. In some implementations, the reinforcement 704 can include a gasket 716 configured to seal the flow cell 710 such that fluid can only pass through the fluid inlet hole 712a and the fluid outlet hole 712b.

[0085] The plurality of sensor components 702 disclosed herein can be coupled to the reinforcement 704 such that the sensors of the sensor chips 703 are exposed. A single sensor component 702 of the plurality of sensor components can include a fluid interposer configured to separate the fluid inside the flow cell 710 and an integrated circuit or chip below the fluid interposer. In some implementations, the fluid interposer can be a substrate. In some implementations, the interposer can be a flexible substrate (e.g., polyimide).

[0086] In some embodiments, the plurality of sensor chips 703 may be coupled to a second side of the stiffener 704 opposite to the first side. The stiffener 704 may include an opening to allow the sensors of the sensor chips 703 to be exposed to the contents of the flow cell 710. In some embodiments, the plurality of sensor chips 703 may be coupled to the stiffener 704 at the first side of the sensor chip. The fluid sensor package 700 may also include a cooling block 714 coupled to a second side of the plurality of sensor chips 703, the second side being opposite to the first side of the plurality of sensor chips 703. The cooling block 714 may be coupled to the plurality of sensor chips 703 via a thermal interface material 715 (e.g., a thermally conductive adhesive). The cooling block 714 may be configured to provide a cooling effect to the fluid sensor package 700.

[0087] Throughout the specification, references to "some embodiments" or "embodiments" mean that the specific features, structures, elements, actions or characteristics described in conjunction with the embodiments are included in at least one embodiment. Therefore, the phrases "in some embodiments" or "in embodiments" that appear in various places in this specification do not necessarily all refer to the same embodiment, but may refer to one or more identical or different embodiments. In addition, in other embodiments, specific features, structures, elements, actions or characteristics can be combined in any suitable manner (including in a manner different from that shown or described). In addition, in various embodiments, features, structures, elements, actions or characteristics can be combined, merged, rearranged, reordered or completely omitted. Therefore, for each embodiment, no single feature, structure, element, action or characteristic or a group of features, structures, elements, actions or characteristics are necessary or required. All possible combinations and sub-combinations are intended to fall within the scope of the present disclosure.

[0088] As used in this application, the terms "comprising," "including," "having," etc. are synonymous and are used inclusively in an open manner and do not exclude additional elements, features, actions, operations, etc. In addition, the term "or" is used in its inclusive sense (rather than its exclusive sense), so when used, for example, to connect a series of elements, the term "or" means one, some, or all of the elements in the series.

[0089] Similarly, it should be understood that in the above description of the embodiments, various features are sometimes combined in a single embodiment, figure, or description thereof in order to simplify the disclosure and aid in understanding one or more various inventive aspects. However, this disclosure method should not be interpreted as reflecting the intention that any claim requires more features than those explicitly recited in the claim. On the contrary, the inventive aspect lies in the combination of less than all features of any single aforementioned disclosed embodiment.

[0090] The foregoing description sets forth various exemplary embodiments of the invention disclosed herein and other illustrative but non-limiting embodiments. The description provides details regarding the combinations, patterns, and uses of the disclosed invention. Other variations, combinations, modifications, equivalents, patterns, uses, specific implementations, and / or applications of the disclosed features and aspects of the embodiments are also within the scope of this disclosure, including those that become apparent to those skilled in the art upon reading this specification. Additionally, certain objectives and advantages of the invention are described herein. It should be understood that not all of these objectives or advantages may be achieved in any particular embodiment. Thus, for example, those skilled in the art will recognize that the invention may be implemented or carried out in a manner that achieves or optimizes one advantage or a group of advantages taught herein without necessarily achieving other objectives or advantages taught or suggested herein. Moreover, in any method or process disclosed herein, the acts or operations constituting the method or process may be executed in any suitable order and need not be limited to any particular disclosed order.

Claims

1. A sensor assembly, the sensor assembly comprising: An integrated circuit die; An interconnect that is connected to the integrated circuit die; An interposer that is mounted above the interconnect and connected to the interconnect; And A sensor configured to convert the properties of one or more sample fluids, with a thermal path located between the sensor and the integrated circuit die, the thermal path extending through the interposer and the interconnect.

2. The sensor assembly according to claim 1, the sensor assembly further comprising a heating element configured to heat the one or more sample fluids.

3. The sensor assembly according to claim 2, the sensor assembly further comprising a thermal layer mounted to the interposer, wherein the sensor is disposed on the thermal layer.

4. The sensor assembly according to claim 2, the sensor assembly further comprising a resistive layer mounted to the interposer, wherein the sensor is disposed on the resistive layer.

5. The sensor assembly according to claim 4, wherein in use of the sensor assembly, the resistive layer electrically isolates the sensor from the interposer.

6. The sensor assembly according to claim 4, wherein the resistive layer is thermally conductive.

7. The sensor assembly according to claim 4, wherein the resistive layer is a photoresistive layer.

8. The sensor assembly according to claim 2, wherein the heating element is disposed between the interconnect and the integrated circuit die.

9. The sensor assembly according to claim 4, wherein the heating element is disposed between the resistive layer and the integrated circuit die.

10. The sensor assembly according to claim 2, wherein the heating element is disposed in or on the interposer.

11. The sensor assembly according to claim 2, wherein the heating element is disposed in or on the integrated circuit die.

12. The sensor assembly according to claim 1, wherein during use of the sensor assembly, the integrated circuit die does not contact liquid.

13. The sensor assembly according to claim 1, wherein the integrated circuit die comprises silicon.

14. The sensor assembly according to claim 1, wherein the integrated circuit die comprises one or more amplifiers.

15. The sensor assembly according to claim 1, wherein the integrated circuit die comprises one or more converters.

16. The sensor assembly according to claim 1, wherein the interconnect comprises a plurality of copper pillars.

17. The sensor assembly according to claim 1, wherein the interconnect is thermally conductive.

18. The sensor assembly according to claim 1, wherein the interposer is electrically connected to the integrated circuit die through the interconnect.

19. The sensor assembly according to claim 1, wherein the interposer is electrically connected to the integrated circuit die.

20. The sensor assembly according to claim 2, wherein the interposer comprises vias connected to the interconnect and traces connected to the heating element.

21. The sensor assembly according to claim 2, wherein the heating element comprises a resistive heater.

22. The sensor assembly according to claim 21, wherein the heating element comprises a serpentine pattern.

23. The sensor assembly according to claim 21, wherein the heating element has a resistance in the range of 80 ohms to 120 ohms.

24. The sensor assembly according to claim 3, wherein in use of the sensor assembly, the thermal layer conducts heat between the sensor and the heating element.

25. The sensor assembly according to claim 3, wherein in use of the sensor assembly, the thermal layer electrically isolates the sensor and the interposer layer.

26. The sensor assembly according to claim 3, wherein the thermal layer comprises polyimide.

27. The sensor assembly according to claim 3, wherein the thermal layer comprises silicon nitride.

28. The sensor assembly according to claim 3, wherein the sensor is electrically isolated from the interposer layer.

29. The sensor assembly according to claim 1, wherein the sensor comprises gold pads.

30. The sensor assembly according to claim 1, wherein the sensor comprises functionalized pads.

31. The sensor assembly according to claim 1, the sensor assembly further comprising a plurality of electrodes disposed on the interposer layer and above a plurality of vias through the interposer layer.

32. The sensor assembly according to claim 4, the sensor assembly further comprising a plurality of electrodes disposed on the resistive layer.

33. The sensor assembly according to claim 32, wherein each of one or more of the plurality of electrodes on the interposer layer is disposed along an edge of the interposer layer.

34. The sensor assembly according to claim 1, the sensor assembly further comprising a bottom fill layer located between the interposer layer and the integrated circuit die and surrounding the interconnects.

35. The sensor assembly according to claim 2, the sensor assembly further comprising an electrical passivation layer disposed on at least the heating element to electrically passivate a local area.

36. The sensor assembly according to claim 2, the sensor assembly further comprising one or more heater control pads disposed in or on the integrated circuit die, the one or more heater control pads being configured to supply power to the heating element.

37. The sensor assembly according to claim 32, the sensor assembly further comprising one or more electrode control pads disposed in or on the integrated circuit die, the one or more electrode control pads being electrically connected to the plurality of electrodes on the resistive layer.

38. The sensor assembly according to claim 1, wherein the sensor is exposed to a fluid passage through which the one or more sample fluids will be conveyed.

39. The sensor assembly according to any one of claims 1 to 38, the sensor assembly further comprising a plurality of integrated circuit dies, a plurality of interconnects attached to the plurality of integrated circuit dies, a plurality of interposers mounted to the plurality of interconnects, a plurality of sensors configured to convert the properties of one or more sample fluids, and a plurality of heating elements configured to heat the one or more sample fluids passing through the corresponding plurality of interposers.

40. The sensor assembly according to claim 39, the sensor assembly further comprising a reinforcement providing support for the sensor assembly.

41. The sensor assembly according to claim 39, the sensor assembly further comprising a flow cell, the flow cell being coupled to the plurality of integrated circuit dies and forming a fluid passage on a first side of the plurality of integrated circuit dies.

42. The sensor assembly according to claim 39, the sensor assembly further comprising a cooling block, the cooling block being coupled to a second side of the plurality of integrated circuit dies, the second side being opposite to the first side of the plurality of integrated circuit dies, the cooling block being configured to cool the sensor assembly in use.

43. The sensor assembly according to claim 42, wherein the cooling block is coupled to the plurality of integrated circuit dies by a thermally conductive adhesive.

44. The sensor assembly according to claim 39, the sensor assembly further comprising a connector configured to electrically connect the plurality of integrated circuit dies to one or more external devices.

45. A sensor assembly, the sensor assembly comprising: an integrated circuit die; an interconnect connected to the integrated circuit die; an interposer mounted above and connected to the interconnect; a sensor configured to convert the properties of one or more sample fluids; a heating element configured to heat the one or more sample fluids; and a thermal path located between the sensor and the heating element.

46. The sensor assembly according to claim 45, wherein the heating element is disposed in or on the interposer.

47. The sensor assembly according to claim 45, wherein the heating element is disposed in or on the integrated circuit die.

48. A sensor assembly, the sensor assembly comprising: an integrated circuit die; an interconnect connected to the integrated circuit die; an interposer mounted above and connected to the interconnect; a heating element disposed in or on the interposer; and a sensor configured to convert the properties of one or more sample fluids, a thermal path located between the sensor and the heating element.

49. The sensor assembly according to claim 48, the sensor assembly further comprising a resistive layer mounted to the interposer, wherein the sensor is disposed on the resistive layer.

50. The sensor assembly according to claim 48, wherein the sensor assembly further comprises an electrical passivation layer disposed on the heating element.

51. A sensor assembly, comprising: an integrated circuit die that forms a thermal platform; one or more interconnects connected to the integrated circuit die; an interposer mounted above and connected to the one or more interconnects; a resistive layer mounted above and connected to the interposer; a reaction site disposed in or on the resistive layer, the reaction site being configured to transform the properties of one or more sample fluids; and a heating element disposed on the integrated circuit die, the heating element being configured to heat the one or more sample fluids, wherein at least one of the interposer and the one or more interconnects forms a thermal path between the reaction site and the heating element.

52. The sensor assembly according to claim 51, wherein the resistive layer comprises a thermally conductive layer comprising at least one of polyimide or silicon nitride.

53. The sensor assembly according to claim 51, wherein the resistive layer comprises a photoresist.

54. The sensor assembly according to claim 51, wherein the resistive layer electrically isolates the reaction site and the interposer.

55. The sensor assembly according to claim 51, wherein the integrated circuit die comprises one or more amplifiers and one or more converters.

56. The sensor assembly according to claim 51, wherein the sensor assembly further comprises: a plurality of electrodes disposed on the interposer above a plurality of vias through the interposer; wherein the plurality of electrodes are coupled to at least one of the one or more interconnects, and wherein each of the plurality of electrodes is configured to transmit an electrical signal received from the integrated circuit die through the at least one interconnect.

57. The sensor assembly according to claim 56, wherein the sensor assembly further comprises one or more electrode control pads disposed in or on the integrated circuit die, the one or more electrode control pads being electrically connected to the plurality of electrodes on the resistive layer.

58. The sensor assembly according to claim 51, wherein the sensor assembly further comprises an underfill layer between the interposer and the integrated circuit die, the underfill layer filling the space around the one or more interconnects.

59. The sensor assembly according to claim 51, wherein the sensor assembly further comprises an electrical passivation layer disposed on at least the heating element to electrically passivate a local area.

60. The sensor assembly according to claim 51, further comprising one or more heater control pads disposed in or on the integrated circuit die, the one or more heater control pads being configured to supply power to the heating element.

61. The sensor assembly according to claim 51, wherein the reaction site is exposed to a fluid passage through which the one or more sample fluids will be conveyed.

62. A fluid sensor package, the fluid sensor package comprising: a plurality of sensor assemblies, each of the plurality of sensor assemblies comprising: an integrated circuit die forming a thermal platform; one or more interconnects connected to the integrated circuit die; an interposer mounted and connected to the one or more interconnects; a reaction site disposed on the interposer, the reaction site being configured to transform the properties of one or more sample fluids; and a heating element disposed on the integrated circuit die, the heating element being configured to heat the one or more sample fluids; and a flow cell coupled to the plurality of sensor assemblies and forming a fluid passage for the one or more sample fluids on a first side of the plurality of sensor assemblies.

63. The fluid sensor package according to claim 62, the fluid sensor package further comprising a reinforcement providing support for the plurality of sensor assemblies.

64. The fluid sensor package according to claim 62, the fluid sensor package further comprising a cooling block coupled to a second side of the plurality of sensor assemblies, the second side being opposite the first side of the plurality of sensor assemblies, the cooling block being configured to dissipate heat from the plurality of sensor assemblies.

65. The fluid sensor package according to claim 64, wherein the cooling block is coupled to the plurality of sensor assemblies by a thermally conductive adhesive.

66. The fluid sensor package according to claim 62, the fluid sensor package further comprising a connector configured to electrically connect the plurality of sensor assemblies to one or more external devices.

67. The fluid sensor package according to claim 62, wherein each of the plurality of sensor assemblies further comprises: a plurality of electrodes disposed on the interposer above a plurality of vias passing through the interposer; wherein the plurality of electrodes are coupled to at least one of the one or more interconnects, and wherein at least a portion of the plurality of electrodes is electrically coupled to at least a portion of the plurality of electrodes of another sensor assembly of the plurality of sensor assemblies and transmits an electrical signal received from the integrated circuit die through the at least one interconnect.

68. The fluid sensor package according to claim 67, wherein each of the plurality of sensor assemblies further comprises: One or more electrode control pads, the one or more electrode control pads being disposed in or on the integrated circuit die, the one or more electrode control pads being electrically connected to the plurality of electrodes.

69. An electronic assembly, the electronic assembly comprising: A sensor assembly, the sensor assembly comprising: A first integrated circuit die that forms at least a first portion of a thermal platform; A first one or more interconnects that are connected to the first integrated circuit die; An interposer that is mounted over the first one or more interconnects and is connected to the first one or more interconnects; A reaction site that is disposed in or on the interposer, the reaction site being configured to transform the properties of one or more sample fluids; and A heating element that is disposed on the first integrated circuit die, the heating element being configured to heat the one or more sample fluids; and One or more electrical connectors that are configured to receive control signals from an external device, the one or more electrical connectors comprising: One or more electrical traces that are electrically coupled to the external device; A second integrated circuit die that forms at least a second portion of the thermal platform; and A second one or more interconnects that are connected to the second integrated circuit die.

70. The electronic assembly of claim 69, wherein the sensor assembly and the one or more electrical connectors are electrically and physically connected via the thermal platform.

71. A sensor assembly, the sensor assembly comprising: An integrated circuit; One or more interconnects that are coupled to the integrated circuit; And A substrate that is mounted over the one or more interconnects and is connected to the one or more interconnects, the substrate comprising: An interposer; A heating element that is disposed on the interposer; A photoresist layer that is mounted over the interposer and is connected to the interposer; and A reaction pad that is disposed on the interposer, above the heating element, the reaction pad being configured to transform the properties of one or more sample fluids; Wherein the heating element is configured to heat the one or more sample fluids.

72. The sensor assembly of claim 71, the sensor assembly further comprising an electrical passivation layer disposed on the heating element, wherein the electrical passivation layer electrically isolates the reaction pad and the heating element.

73. The sensor assembly of claim 72, wherein the photoresist layer and the electrical passivation layer are thermally conductive, and wherein the electrical passivation layer comprises at least one of polyimide or silicon nitride.

74. The sensor assembly of claim 72, wherein the photoresist layer and the electrical passivation layer form a thermal path between the reaction pad and the heating element.

75. The sensor assembly according to claim 71, wherein the integrated circuit includes one or more amplifiers and one or more converters.

76. The sensor assembly according to claim 71, wherein the substrate is made of a flexible material, and; Wherein the substrate further includes: a plurality of electrodes disposed in the photoresist layer and electrically connected to a plurality of electrical connectors disposed on the interposer above a plurality of vias through the interposer; and wherein the plurality of electrodes are electrically coupled to at least one of the one or more interconnects via the plurality of electrical connectors, and wherein each of the plurality of electrodes is configured to transmit an electrical signal received from the integrated circuit through the at least one interconnect.

77. The sensor assembly according to claim 71, wherein the substrate further includes an underfill layer coupled to a side of the interposer in contact with the integrated circuit, the underfill layer being configured to receive the one or more interconnects.

78. The sensor assembly according to claim 71, wherein the substrate further includes one or more heater control circuits disposed in or on the integrated circuit, the one or more heater control circuits being configured to supply power to the heating element and convert a heat flux from the reaction pad into one or more electrical signals.

79. The sensor assembly according to claim 71, wherein the reaction pad is exposed to a fluid passage through which the one or more sample fluids will be conveyed.

80. A fluid sensor package, the fluid sensor package comprising: a plurality of sensor assemblies, each of the plurality of sensor assemblies including: an integrated circuit; one or more interconnects coupled to the integrated circuit; and a substrate mounted above and connected to the one or more interconnects, the substrate including: a heating element configured to heat one or more sample fluids; a photoresist layer mounted above the heating element; and a reaction pad disposed on the photoresist layer above the heating element, the reaction pad being configured to convert a property of the one or more sample fluids; and a flow cell coupled to the plurality of sensor assemblies and forming a fluid passage for the one or more sample fluids on a first side of the plurality of sensor assemblies.

81. The fluid sensor package according to claim 80, the fluid sensor package further including a reinforcement providing support for the plurality of sensor assemblies.

82. The fluid sensor package according to claim 80, the fluid sensor package further including a cooling block coupled to a second side of the plurality of sensor assemblies, the second side being opposite the first side of the plurality of sensor assemblies, the cooling block being configured to dissipate heat from the plurality of sensor assemblies.

83. The fluid sensor package according to claim 82, wherein the cooling block is coupled to the plurality of sensor components by a thermally conductive adhesive.

84. The fluid sensor package according to claim 80, the fluid sensor package further comprising a connector configured to electrically connect the plurality of sensor components to one or more external devices.

85. The fluid sensor package according to claim 80, wherein each of the plurality of sensor components further comprises: a plurality of electrodes disposed in the photoresist layer and electrically connected to a plurality of electrical connectors; and wherein the plurality of electrodes are electrically coupled to at least one of the one or more interconnects via the plurality of electrical connectors; wherein each of the plurality of electrodes is configured to transmit an electrical signal received from the integrated circuit through the at least one interconnect; and wherein at least a portion of the plurality of electrodes is electrically coupled to at least a portion of the plurality of electrodes of another sensor component of the plurality of sensor components and transmits an electrical signal received from the integrated circuit through the at least one interconnect.

86. An electronic component, the electronic component comprising: a sensor component, the sensor component comprising: a first integrated circuit; a first one or more interconnects coupled to the first integrated circuit; and a substrate mounted above the first one or more interconnects and connected to the first one or more interconnects, the substrate comprising: an interposer; a heating element disposed on the interposer and configured to heat one or more sample fluids; and a reaction pad disposed on the interposer above the heating element, the reaction pad being configured to transform the properties of the one or more sample fluids; and one or more electrical connectors configured to receive control signals from an external device, the one or more electrical connectors comprising: one or more electrical traces electrically coupled to the external device; a second integrated circuit; and a second one or more interconnects connected to the second integrated circuit.

87. The electronic component according to claim 86, wherein the first integrated circuit and the second integrated circuit are electrically and physically coupled.

88. The electronic component according to claim 86, wherein the substrate further comprises an electrical passivation layer disposed on the heating element, wherein the electrical passivation layer electrically isolates the reaction pad and the heating element.

89. The electronic component according to claim 88, wherein the substrate further comprises a photoresist layer; and wherein the photoresist layer and the electrical passivation layer are thermally conductive.

90. The electronic component according to claim 8986, wherein the substrate further comprises: a plurality of electrodes disposed in the photoresist layer; and Wherein the plurality of electrodes are electrically coupled to at least one of the first one or more interconnects, and wherein each of the plurality of electrodes is configured to transmit an electrical signal received from the first integrated circuit through the at least one interconnect.

Images