Glue supply heat preservation system

By setting up an insulation flow path on the outer sleeve of the supply hose and using the heat exchange principle, combining the secondary heating components and controller, the problem of difficult control of the photoresist temperature is solved, and the efficient and stable supply of the photoresist and precise temperature control are achieved, and the coating quality and energy utilization are improved.

CN120346951APending Publication Date: 2025-07-22HUANCHENG INTELLIGENT EQUIP (CHENGDU) CO LTD
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Patent Information

Application Number
CN202510696716.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-28
Publication Date
2025-07-22

AI Technical Summary

Technical Problem

The prior art is difficult to effectively insulate the photoresist in two supply hoses simultaneously, resulting in the photoresist temperature not easily maintained within a predetermined temperature range, affecting the coating quality.

Method used

A rubber supply and insulation system is designed, including first and second insulation flow paths, which are sleeved outside the hose, and the photoresist is insulated through cyclic heat exchange of the insulation medium, and optionally a secondary heating component and a controller are added for temperature adjustment.

Benefits of technology

It realizes efficient and stable insulation of photoresist in the two supply hoses, ensures that the photoresist temperature is within a predetermined range, improves the coating quality, and improves the accuracy of energy utilization and temperature control.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a glue supply heat preservation system which comprises a first glue supply pipe, a second glue supply pipe and a heat preservation unit. The heat preservation unit comprises a first heat preservation flow path and a second heat preservation flow path; the first heat preservation flow path sleeves the first glue supply pipe, so that a first heat preservation flow channel is formed between the first heat preservation flow path and the first glue supply pipe; the second heat preservation flow path sleeves the second glue supply pipe, so that a second heat preservation flow channel is formed between the second glue supply pipe and the second heat preservation flow path. Through the unique heat preservation unit design, heat preservation can be carried out on the photoresist in the two photoresist supply pipes at the same time, so that efficient and stable photoresist supply and accurate temperature control are achieved. Moreover, in the glue supply heat preservation system, the two glue supply pipes can work independently at the same time, the heat preservation flow paths arranged outside the glue supply pipes in a sleeving mode sequentially flow through the first heat preservation flow channel and the second heat preservation flow channel through the heat preservation medium, and heat preservation is conducted on the photoresist in the glue supply pipes according to the heat exchange principle; and the temperature of the photoresist flowing out of each photoresist supply pipe can be maintained in a preset temperature range.
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Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and more particularly, to a glue supply heat preservation system. Background Art

[0002] The content of this part only provides background information related to the present invention, which may not constitute prior art.

[0003] In the field of wafer processing, there is a step of using two glue supply tubes in a glue coating system to supply photoresist for photoresist coating on a wafer, thereby laying a foundation for subsequent processes such as photolithography and etching.

[0004] Among them, in order to ensure the coating quality of the photoresist, it is necessary to maintain the temperature of the photoresist supplied by the glue supply tube within a predetermined temperature range. Therefore, it is necessary to design a glue supply heat preservation system that can heat-preserve the photoresist flowing in the two glue supply tubes to maintain the temperature of the photoresist within the predetermined temperature range. Summary of the Invention

[0005] The purpose of the present invention is to provide a glue supply heat preservation system, which is expected to reliably heat-preserve the photoresist flowing through two glue supply tubes at the same time, so that the temperature of the photoresist flowing out of the glue supply tube is maintained within a predetermined temperature range.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] The present invention discloses a glue supply heat preservation system, including a first glue supply tube, a second glue supply tube, and a heat preservation unit;

[0008] The heat preservation unit includes:

[0009] A first heat preservation flow path, sleeved outside the first glue supply tube, to form a first heat preservation flow channel extending along the axial direction of the first glue supply tube between the inner wall of the first heat preservation flow path and the outer wall of the first glue supply tube; the first heat preservation flow path includes a first inlet and a first outlet that are simultaneously communicated with the first heat preservation flow channel; the first inlet is close to the first end of the first glue supply tube, and the first outlet is close to the second end of the first glue supply tube; the first inlet is configured to receive a heat preservation medium, so that the heat preservation medium can flow through the first heat preservation flow channel and flow out from the first outlet;

[0010] The second heat-insulating flow path is sleeved outside the second glue supply pipe to form a second heat-insulating flow channel extending along the axial direction of the second glue supply pipe between the inner wall of the second heat-insulating flow path and the outer wall of the second glue supply pipe; the second heat-insulating flow path includes a second inlet and a second outlet that are both communicated with the second heat-insulating flow channel; the second inlet is close to the second end of the second glue supply pipe, and the second outlet is close to the first end of the second glue supply pipe; the second inlet is configured to receive the heat-insulating medium flowing out from the first outlet so that the heat-insulating medium can flow through the second heat-insulating flow channel and flow out from the second outlet.

[0011] Optionally, the heat-insulating unit further includes a conversion box that defines a transition chamber;

[0012] The first heat-insulating flow path further includes a first joint and a first heat-insulating pipe; a first channel is defined inside the first joint, and the first inlet is arranged on the first joint and communicated with the first channel;

[0013] One end of the first heat-insulating pipe is connected to the first joint, and the inside of the first heat-insulating pipe connected to the first joint is communicated with the first channel; the other end of the first heat-insulating pipe serves as the first outlet, and the first outlet is communicated with the transition chamber;

[0014] The second end of the first glue supply pipe sequentially passes through the first channel and the first heat-insulating pipe, then extends out through the first outlet and penetrates through the transition chamber;

[0015] The gap between the inner wall of the first channel and the outer wall of the first glue supply pipe and the gap between the inner wall of the first heat-insulating pipe and the outer wall of the first glue supply pipe together form the first heat-insulating flow channel.

[0016] Optionally, the second heat-insulating flow path further includes a second joint and a second heat-insulating pipe; a second channel is defined inside the second joint, and the second outlet is arranged on the second joint and communicated with the second channel;

[0017] One end of the second heat-insulating pipe is connected to the second joint, and the inside of the second heat-insulating pipe connected to the second joint is communicated with the second channel; the other end of the second heat-insulating pipe serves as the second inlet, and the second inlet is communicated with the transition chamber;

[0018] The second end of the second glue supply pipe sequentially passes through the second channel and the second heat-insulating pipe, then extends out through the second inlet and penetrates through the transition chamber;

[0019] The gap between the inner wall of the second channel and the outer wall of the second glue supply pipe, and the gap between the inner wall of the second heat preservation pipe and the outer wall of the second glue supply pipe together constitute the second heat preservation flow channel.

[0020] Optionally, the conversion box is configured to be capable of making a reciprocating linear motion in the horizontal direction.

[0021] Optionally, the glue supply and heat preservation system further includes a flexible cable carrier. One end of the flexible cable carrier is fixed, and the other end of the flexible cable carrier is configured to move following the conversion box;

[0022] The first heat preservation pipe and the second heat preservation pipe are arranged through the flexible cable carrier.

[0023] Optionally, both the first heat preservation pipe and the second heat preservation pipe are flexible pipe fittings.

[0024] Optionally, the glue supply and heat preservation system further includes a secondary heating component; the secondary heating component is arranged between the first outlet and the second inlet to selectively heat the heat preservation medium between the first outlet and the second inlet.

[0025] Optionally, the glue supply and heat preservation system further includes a controller and a first temperature detection component; both the first temperature detection component and the secondary heating component are communicatively connected to the controller;

[0026] The first temperature detection component is configured to obtain the first temperature information of the heat preservation medium flowing out from the first outlet and send the first temperature information to the controller;

[0027] The controller is configured to determine whether the heat preservation medium needs to be secondarily heated based on the first temperature information. If so, the controller controls the secondary heating component to heat the heat preservation medium.

[0028] Optionally, the process for the controller to determine whether the heat preservation medium needs to be secondarily heated is: the controller compares the temperature of the heat preservation medium flowing through the first outlet with a preset temperature threshold; if the temperature of the heat preservation medium flowing through the first outlet is less than the preset temperature threshold, it indicates that the heat preservation medium needs to be secondarily heated;

[0029] The preset temperature threshold is set to be consistent with the temperature of the heat preservation medium flowing through the first inlet.

[0030] Optionally, the glue supply and heat preservation system further includes a second temperature detection component communicatively connected to the controller;

[0031] The second temperature detection component is configured to obtain second temperature information of the heat preservation medium flowing through the first inlet, and send the second temperature information to the controller;

[0032] The controller is further configured to dynamically adjust the preset temperature threshold based on the second temperature information.

[0033] The technical solution of the embodiment of the present invention has at least the following advantages and beneficial effects:

[0034] The glue supply heat preservation system disclosed by the present invention can simultaneously heat-preserve the photoresist in two glue supply pipes through a unique heat preservation unit design, so as to facilitate the realization of efficient and stable photoresist supply and precise temperature control. Moreover, in this glue supply heat preservation system, the two glue supply pipes can work independently at the same time. The heat preservation flow paths sleeved outside each glue supply pipe sequentially flow through the first and second heat preservation channels with the heat preservation medium, and the photoresist in each glue supply pipe is heat-preserved by using the principle of heat exchange, which is beneficial to ensuring that the temperature of the photoresist finally flowing out of each glue supply pipe is maintained within a predetermined temperature range, thereby providing the possibility for improving the coating quality of the photoresist. In addition, the design of the circulating heat preservation medium improves the energy utilization rate. Description of the Drawings

[0035] Figure 1 is a schematic structural diagram of the glue supply heat preservation system provided by the embodiment of the present invention;

[0036] Figure 2 is Figure 1 a partial structural schematic diagram of the glue supply heat preservation system shown in;

[0037] Figure 3 is Figure 2 a cross-sectional view of;

[0038] Figure 4 is a partial structural cross-sectional view of the first joint provided by the embodiment of the present invention.

[0039] Reference numerals: 10 - heat preservation unit, 11 - first heat preservation flow path, 111 - first inlet, 112 - first outlet, 113 - first joint, 1131 - first channel, 114 - first heat preservation pipe, 12 - second heat preservation flow path, 121 - second inlet, 122 - second outlet, 123 - second joint, 124 - second heat preservation pipe, 13 - conversion box, 131 - transition chamber, 20 - first glue supply pipe, 30 - second glue supply pipe, 40 - nozzle, 50 - flexible cable chain. Detailed Embodiments

[0040] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0041] Compared with the embodiments shown in the drawings, the feasible embodiments within the scope of protection of the present invention may have fewer components, have other components not shown in the drawings, different components, differently arranged components, or differently connected components, etc. In addition, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0042] Embodiment 1

[0043] Embodiment 1 of the present invention discloses a glue supply and insulation system. Figure 1 is a schematic structural diagram of an exemplary glue supply and insulation system disclosed in Embodiment 1 of the present invention. In Figure 1 the shown embodiment, the glue supply and insulation system may include two glue supply pipes and an insulation unit 10.

[0044] The two glue supply pipes are mainly used to independently transport photoresist. For the convenience of description, the embodiments of the present invention define the two glue supply pipes as the first glue supply pipe 20 and the second glue supply pipe 30 respectively.

[0045] Both the first glue supply pipe 20 and the second glue supply pipe 30 include a first end and a second end that are opposite to each other in the axial direction. The first ends of the first glue supply pipe 20 and the second glue supply pipe 30 can both be connected to a photoresist supply source (not shown in the figure) to simultaneously supply photoresist to the first glue supply pipe 20 and the second glue supply pipe 30 through the photoresist supply source.

[0046] For a single glue supply pipe, the photoresist flows into the glue supply pipe from the first end and flows out from the second end of the glue supply pipe. Among them, nozzles 40 can be provided at the second ends of both the first glue supply pipe 20 and the second glue supply pipe 30. On this basis, the photoresist flowing out from the second end of the glue supply pipe will flow out from the corresponding nozzle 40, as shown in Figure 3 . Through the setting of the nozzle 40, it is beneficial to control the amount of photoresist flowing out of the glue supply pipe.

[0047] The heat preservation unit 10 is mainly used to simultaneously heat-preserve the photoresist flowing through the first glue supply pipe 20 and the second glue supply pipe 30, so that the temperature of the photoresist flowing out from the second ends of the respective glue supply pipes, especially the nozzles 40 at the second ends of the respective glue supply pipes, is maintained within a predetermined temperature range. Among them, the predetermined temperature range is determined according to actual coating requirements and is not limited herein.

[0048] Combined with Figure 1 the content shown, the heat preservation unit 10 may include a fluid medium supply source (not shown in the figure), a first heat preservation flow path 11, and a second heat preservation flow path 12.

[0049] The fluid medium supply source is mainly used to supply a fluid medium with a predetermined temperature to the first heat preservation flow path 11. The fluid medium with a predetermined temperature provided by the fluid medium supply source can enter the second heat preservation flow path 12 after flowing through the first heat preservation flow path 11, and finally return to the fluid medium supply source through the second heat preservation flow path 12 to realize the circulation of the fluid medium. Among them, the fluid medium with a predetermined temperature can be but is not limited to constant temperature water or constant temperature heat-conducting oil. For the convenience of description, hereinafter, the fluid medium with a predetermined temperature provided by the fluid medium supply source is simply referred to as "heat preservation medium".

[0050] The first heat preservation flow path 11 is mainly used to heat-preserve the photoresist flowing through the first glue supply pipe 20. The second heat preservation flow path 12 is mainly used to heat-preserve the photoresist flowing through the second glue supply pipe 30.

[0051] Specifically, the first heat preservation flow path 11 is sleeved outside the first glue supply pipe 20 to form a first heat preservation flow channel extending along the axial direction of the first glue supply pipe 20 between the inner wall of the first heat preservation flow path 11 and the outer wall of the first glue supply pipe 20. And, the first heat preservation flow path 11 includes a first inlet 111 and a first outlet 112, as shown in Figure 1 and Figure 3 . The first inlet 111 is close to the first end of the first glue supply pipe 20, and the first outlet 112 is close to the second end of the first glue supply pipe 20. Both the first inlet 111 and the first outlet 112 are communicated with the first heat preservation flow channel, and the first inlet 111 is communicated with the fluid medium supply source, so as to receive the heat preservation medium provided by the fluid medium supply source through the first inlet 111, so that the heat preservation medium can flow through the first heat preservation flow channel and flow out from the first outlet 112.

[0052] The second heat preservation flow path 12 is sleeved outside the second glue supply pipe 30 to form a second heat preservation flow channel extending along the axial direction of the second glue supply pipe 30 between the inner wall of the second heat preservation flow path 12 and the outer wall of the second glue supply pipe 30. And, the second heat preservation flow path 12 includes a second inlet 121 and a second outlet 122, as shown in Figure 1 and Figure 3。The second inlet 121 is close to the second end of the second glue supply pipe 30, and the second outlet 122 is close to the first end of the second glue supply pipe 30. Both the second inlet 121 and the second outlet 122 are communicated with the first heat-insulating flow channel, and the second inlet 121 is communicated with the first outlet 112 of the first heat-insulating flow path 11, and the second outlet 122 is communicated with the fluid medium supply source, so as to receive the heat-insulating medium flowing out from the first outlet 112 through the second inlet 121, so that the heat-insulating medium can flow through the second heat-insulating flow channel and flow back to the fluid medium supply source after flowing out from the second outlet 122.

[0053] Based on the above settings, when it is necessary to keep the photoresist flowing through the first glue supply pipe 20 and the second glue supply pipe 30 warm, the heat-insulating medium provided by the fluid medium supply source enters the first heat-insulating flow channel through the first inlet 111, so that the heat-insulating medium flows towards the first outlet 112 in the first heat-insulating flow channel. Since the first glue supply pipe 20 is covered by the heat-insulating medium flowing through the first heat-insulating flow channel, the temperature of the photoresist in the first glue supply pipe 20 can be maintained within a predetermined temperature range as much as possible through heat exchange, thereby achieving the purpose of keeping the photoresist in the first glue supply pipe 20 warm.

[0054] For the photoresist in the second glue supply pipe 30, after the heat-insulating medium flows out from the first outlet 112, it will enter the second heat-insulating flow channel from the second inlet 121 and flow towards the second outlet 122 in the second heat-insulating channel. Similarly, since the second glue supply pipe 30 is covered by the heat-insulating medium flowing through the second heat-insulating flow channel, the temperature of the photoresist in the second glue supply pipe 30 can be maintained within a predetermined temperature range as much as possible through heat exchange, thereby achieving the purpose of keeping the photoresist in the second glue supply pipe 30 warm.

[0055] It can be seen that the glue supply heat preservation system disclosed in the embodiment of the present invention can keep the photoresist in two glue supply pipes warm at the same time through the unique design of the heat preservation unit 10, so as to facilitate the realization of efficient and stable photoresist supply and accurate temperature control. Moreover, in this glue supply heat preservation system, the two glue supply pipes can work independently at the same time. The heat-insulating flow paths sleeved outside each glue supply pipe allow the heat-insulating medium to flow through the first and second heat-insulating flow channels in sequence, and use the principle of heat exchange to keep the photoresist in each glue supply pipe warm, which is beneficial to ensuring that the temperature of the photoresist flowing out of each glue supply pipe is maintained within a predetermined temperature range, thereby providing the possibility for improving the coating quality of the photoresist. In addition, the design of the circulating heat-insulating medium improves the energy utilization rate.

[0056] In some embodiments, the connection and cooperation between the first glue supply pipe 20 and the first heat-insulating flow path 11, and between the second glue supply pipe 30 and the second heat-insulating flow path 12 can be achieved in the following manner, but are not limited thereto.

[0057] Combined with Figures 1 to 4As shown, the heat preservation unit 10 may further include a conversion box 13, and the conversion box 13 defines a transition chamber 131 (see Figure 3 ).

[0058] The first heat preservation flow path 11 may further include a first joint 113 and a first heat preservation pipe 114. The first joint 113 internally defines a first channel 1131 (see Figure 4 ). The first inlet 111 is provided on the first joint 113 and communicates with the first channel 1131.

[0059] One end of the first heat preservation pipe 114 is detachably connected to the first joint 113, and the interior of the first heat preservation pipe 114 connected to the first joint 113 communicates with the first channel 1131; the other end of the first heat preservation pipe 114 serves as the first outlet 112, and the first heat preservation pipe 114 is detachably connected to the conversion box 13 so that the first outlet 112 communicates with the transition chamber 131. The second end of the first glue supply pipe 20 passes through the first channel 1131, the first heat preservation pipe 114 in sequence away from the end of the first heat preservation pipe 114, and then extends out through the first outlet 112 and penetrates the transition chamber 131, see Figure 3 . Wherein, the nozzle 40 corresponding to the first glue supply pipe 20 may be provided on the conversion box 13, for example, at the bottom of the conversion box 13, so that the second end of the first glue supply pipe 20 can be directly connected to the corresponding nozzle 40 after penetrating the transition chamber 131.

[0060] At this time, the gap between the inner wall of the first channel 1131 and the outer wall of the first glue supply pipe 20 and the gap between the inner wall of the first heat preservation pipe 114 and the outer wall of the first glue supply pipe 20 together form the first heat preservation flow path.

[0061] The second heat preservation flow path 12 may further include a second joint 123 and a second heat preservation pipe 124. The second joint 123 internally defines a second channel (not shown in the figure). The second outlet 122 is provided on the second joint 123 and communicates with the second channel.

[0062] One end of the second heat preservation pipe 124 is detachably connected to the second joint 123, and the interior of the second heat preservation pipe 124 connected to the second joint 123 communicates with the second channel; the other end of the second heat preservation pipe 124 serves as the second inlet 121, and the second heat preservation pipe 124 is detachably connected to the conversion box 13 so that the second inlet 121 communicates with the transition chamber 131. The second end of the second glue supply pipe 30 passes through the second channel, the second heat preservation pipe 124 in sequence away from the end of the second heat preservation pipe 124, and then extends out through the second inlet 121 and penetrates the transition chamber 131, see Figure 3Among them, the nozzle 40 corresponding to the second glue supply pipe 30 can be arranged on the conversion box 13, for example, at the bottom of the conversion box 13, so that the second end of the second glue supply pipe 30 can be directly connected to the corresponding nozzle 40 after passing through the transition chamber 131.

[0063] At this time, the gap between the inner wall of the second channel and the outer wall of the second glue supply pipe 30 and the gap between the inner wall of the second heat preservation pipe 124 and the outer wall of the second glue supply pipe 30 together form the second heat preservation flow channel.

[0064] Based on the above settings, when heat-preserving the photoresist in the first glue supply pipe 20 and the second glue supply pipe 30, the heat-preserving medium provided by the liquid medium supply source first enters the first channel 1131 of the first joint 113 from the first inlet 111, and then flows into the first heat preservation pipe 114 to heat-preserve the photoresist in the first glue supply pipe 20; thereafter, the heat-preserving medium flowing through the first heat preservation pipe 114 flows into the transition chamber 131 from the first outlet 112, and enters the second heat preservation pipe 124 from the transition chamber 131 through the second inlet 121 to heat-preserve the photoresist in the second glue supply pipe 30; the heat-preserving medium flowing through the second heat preservation pipe 124 finally flows into the second channel of the second joint 123 and returns to the fluid medium supply source from the second outlet 122 to achieve circulation.

[0065] In some embodiments, the conversion box 13 is further configured to be able to perform a reciprocating linear motion in the horizontal direction. For example, the conversion box 13 can move under the drive of a known linear drive device suitable for outputting a reciprocating linear motion. Among them, the linear drive device can be a cylinder, an electric push rod, a linear motor, etc.

[0066] By setting the conversion box 13 to be movable in the horizontal direction, it is helpful to adjust the position of the nozzle 40 communicated with each glue supply pipe as needed when using this glue supply and heat preservation system to supply photoresist to the wafer, so as to improve the flexibility of using this glue supply and heat preservation system.

[0067] In some embodiments, on the basis that the conversion box 13 can perform a reciprocating linear motion in the horizontal direction, referring to Figure 1 As shown, this glue supply and heat preservation system can further include a flexible tank chain 50.

[0068] One end of the flexible tank chain 50 is fixed, and the other end of the flexible tank chain 50 is configured to follow the movement of the conversion box 13, so that the flexible tank chain 50 can stretch and bend as the conversion box 13 moves to adapt to the movement of the conversion box 13.

[0069] For example, one end of the flexible cable carrier 50 away from its fixed end can be connected to the conversion box 13, or one end of the flexible cable carrier 50 away from its fixed end can be arranged to slide horizontally, so that the flexible cable carrier 50 can move following the conversion box 13.

[0070] The first heat preservation pipe 114 and the second heat preservation pipe 124 are passed through the flexible cable carrier 50.

[0071] By arranging the flexible cable carrier 50, it can protect the first heat preservation pipe 114 and the second heat preservation pipe 124, and at the same time enable the first heat preservation pipe 114 and the second heat preservation pipe 124 to adapt to the movement of the conversion box 13 and play a role in reasonably managing the first heat preservation pipe 114 and the second heat preservation pipe 124.

[0072] In some embodiments, both the first heat preservation pipe 114 and the second heat preservation pipe 124 can be flexible pipe fittings, such as corrugated pipes, so that the first heat preservation pipe 114 and the second heat preservation pipe 124 can adapt to the telescopic and bending of the flexible cable carrier 50.

[0073] Embodiment 2

[0074] Considering that when the heat preservation medium supplied by the liquid medium supply source flows through the first heat preservation flow channel of the first heat preservation flow path 11 to heat the photoresist in the first glue supply pipe 20, the temperature of the heat preservation medium will decrease due to heat exchange. On this basis, if the temperature-reduced heat preservation medium is directly allowed to flow into the second heat preservation flow channel of the second heat preservation flow path 12, it may not be able to reliably heat the photoresist in the second glue supply pipe 30.

[0075] Therefore, on the basis of Embodiment 1, Embodiment 2 of the present invention discloses another glue supply heat preservation system. Different from Embodiment 1, the glue supply heat preservation system disclosed in Embodiment 2 of the present invention may further include a secondary heating component (not shown in the figure).

[0076] The secondary heating component can be arranged between the first outlet 112 and the second inlet 121 to selectively heat the heat preservation medium between the first outlet 112 and the second inlet 121. That is to say, the heat preservation medium flowing out of the first outlet 112 will first flow through the secondary heating component and then enter the second inlet 121. During this process, the secondary heating component can heat the heat preservation medium flowing out of the first outlet 112 as needed, specifically when the temperature of the heat preservation medium flowing out of the first outlet 112 is lower than the temperature requirement for heating the photoresist in the glue supply pipe, the secondary heating component can heat the heat preservation medium flowing out of the first outlet 112.

[0077] Specifically, in practical applications, after the heat preservation medium flows through the first heat preservation flow channel to heat the photoresist in the first supply hose 20, if the temperature of the heat preservation medium drops to the point where it can no longer reliably heat the photoresist in the second supply hose 30, the secondary heating component heats the heat preservation medium flowing out of the first outlet 112 to raise the temperature of the heat preservation medium to meet the corresponding heat preservation requirements. Subsequently, the heat preservation medium after secondary heating flows into the second heat preservation flow channel from the second inlet 121 to heat the photoresist in the second supply hose 30.

[0078] It can be understood that by setting the secondary heating component, selective heating compensation can be performed on the heat preservation medium whose temperature drops due to heat exchange, thereby ensuring that the temperature of the heat preservation medium flowing into the second heat preservation flow channel always meets the heat preservation requirements of the photoresist. This not only effectively solves the problem of heat preservation reliability caused by the temperature attenuation of the heat preservation medium in the second heat preservation flow channel, but also helps to improve the temperature uniformity of the photoresist in each supply hose, avoiding the influence of temperature fluctuations on the coating quality of the photoresist. At the same time, this design adopts an on-demand heating mechanism, starting heating only when the temperature of the heat preservation medium flowing out of the first outlet 112 is insufficient, which is beneficial to energy consumption control.

[0079] In some embodiments, the secondary heating component can be, but is not limited to, conventional heating devices such as electric heaters and heat exchangers. Of course, in combination with the content described in Embodiment 1, when the heat preservation unit 10 includes a conversion box 13 and there is a transition chamber 131 in the conversion box 13 for connecting the first outlet 112 and the second inlet 121, the secondary heating component can also be heating devices such as an electric heating plate and an electric heating wire arranged in the transition chamber 131, so that the secondary heating component can directly heat the heat preservation medium in the transition chamber 131.

[0080] In some embodiments, in order to enable the secondary heating component to automatically perform secondary heating on the heat preservation medium as needed. The supply hose heat preservation system can also include a controller (not shown in the figure) and a first temperature detection component (not shown in the figure).

[0081] Both the first temperature detection component and the secondary heating component are communicatively connected to the controller. Among them, the first temperature detection component is configured to obtain the first temperature information of the heat preservation medium flowing out of the first outlet 112 and send the first temperature information to the controller. For example, the first temperature detection component can be a temperature sensor arranged at the first outlet 112.

[0082] The controller is configured to determine whether secondary heating of the heat preservation medium is required based on the first temperature information sent by the first temperature detection component. If so, the controller controls the secondary heating component to heat the heat preservation medium. For example, the heat preservation medium flowing out from the first outlet 112 is heated to the same temperature as the heat preservation medium flowing through the first inlet 111. If not, the controller continuously receives the first temperature information sent by the first temperature detection component until secondary heating of the heat preservation medium is required.

[0083] Among them, the process of using the controller to determine whether secondary heating of the heat preservation medium is required is as follows: The controller compares the temperature of the heat preservation medium flowing through the first outlet 112 with a preset temperature threshold. If the temperature of the heat preservation medium flowing through the first outlet 112 is lower than the preset temperature threshold, it indicates that secondary heating of the heat preservation medium is required.

[0084] It can be understood that by setting the first temperature detection component and forming a closed-loop control system with the controller and the secondary heating component, the temperature of the heat preservation medium flowing out from the first outlet 112 can be monitored in real time. When the detected temperature is lower than the preset threshold, the controller automatically triggers the secondary heating component to perform precise temperature control compensation on the heat preservation medium. Otherwise, it remains in the monitoring state, thereby realizing the intelligentization and adaptive adjustment of the heating process of the heat preservation medium. This not only ensures the temperature stability of the heat preservation medium in the second heat preservation flow channel, avoids the hysteresis and error of manual intervention, but also optimizes the energy consumption efficiency through dynamic temperature control.

[0085] In some embodiments, the preset temperature threshold can be set to be the same as the temperature of the heat preservation medium flowing through the first inlet 111. In this way, it is beneficial to further ensure the temperature uniformity of the photoresist in the first glue supply pipe 20 and the second glue supply pipe 30.

[0086] In some embodiments, the glue supply heat preservation system may further include a second temperature detection component (not shown in the figure) communicatively connected to the controller. Among them, the second temperature detection component is configured to obtain the second temperature information of the heat preservation medium flowing through the first inlet 111 and send the second temperature information to the controller. For example, the second temperature detection component can be a temperature sensor provided at the first inlet 111.

[0087] The controller is further configured to dynamically adjust the preset temperature threshold based on the second temperature information sent by the second temperature detection component so that the preset temperature threshold is the same as the temperature of the heat preservation medium currently flowing through the first inlet 111.

[0088] That is to say, by setting the second temperature detection component, the temperature of the heat preservation medium flowing through the first inlet 111 can be monitored in real time, so that the controller can dynamically adjust the preset temperature threshold according to the temperature of the heat preservation medium flowing through the first inlet 111. This design not only solves the problem of the reference drift of the temperature threshold caused by the temperature fluctuation of the fluid medium supply source, but also can adapt to environmental or process changes (such as seasonal temperature differences or temperature control requirements of different photoresist models). Through dual temperature feedback, the two-stage flow path can maintain good temperature consistency under any working conditions, and at the same time avoid the operation burden of manual repeated calibration of the threshold, significantly improving the adaptive ability and long-term temperature control stability of the system.

[0089] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A glue supply and heat preservation system, characterized in that, It includes a first glue supply pipe, a second glue supply pipe, and a heat preservation unit; The heat preservation unit includes: A first heat preservation flow path, sleeved outside the first glue supply pipe, to form a first heat preservation flow channel extending along the axial direction of the first glue supply pipe between the inner wall of the first heat preservation flow path and the outer wall of the first glue supply pipe; the first heat preservation flow path includes a first inlet and a first outlet that are simultaneously communicated with the first heat preservation flow channel; the first inlet is close to the first end of the first glue supply pipe, and the first outlet is close to the second end of the first glue supply pipe; the first inlet is configured to receive a heat preservation medium, so that the heat preservation medium can flow through the first heat preservation flow channel and flow out from the first outlet; A second heat preservation flow path, sleeved outside the second glue supply pipe, to form a second heat preservation flow channel extending along the axial direction of the second glue supply pipe between the inner wall of the second heat preservation flow path and the outer wall of the second glue supply pipe; the second heat preservation flow path includes a second inlet and a second outlet that are simultaneously communicated with the second heat preservation flow channel; the second inlet is close to the second end of the second glue supply pipe, and the second outlet is close to the first end of the second glue supply pipe; the second inlet is configured to receive the heat preservation medium flowing out from the first outlet, so that the heat preservation medium can flow through the second heat preservation flow channel and flow out from the second outlet.

2. The glue supply and heat preservation system according to claim 1, wherein The heat preservation unit further includes a conversion box, and the conversion box defines a transition chamber; The first heat preservation flow path further includes a first joint and a first heat preservation pipe; a first channel is defined inside the first joint, and the first inlet is arranged on the first joint and communicated with the first channel; One end of the first heat preservation pipe is connected to the first joint, and the inside of the first heat preservation pipe connected to the first joint is communicated with the first channel; the other end of the first heat preservation pipe serves as the first outlet, and the first outlet is communicated with the transition chamber; The second end of the first glue supply pipe sequentially passes through the first channel and the first heat preservation pipe, and then extends out through the first outlet and penetrates the transition chamber; The gap between the inner wall of the first channel and the outer wall of the first glue supply pipe and the gap between the inner wall of the first heat preservation pipe and the outer wall of the first glue supply pipe together constitute the first heat preservation flow channel.

3. The glue supply and heat preservation system according to claim 2, wherein, The second heat preservation flow path further includes a second joint and a second heat preservation pipe; a second channel is defined inside the second joint, and the second outlet is arranged on the second joint and communicated with the second channel; One end of the second heat preservation pipe is connected to the second joint, and the inside of the second heat preservation pipe connected to the second joint is communicated with the second channel; the other end of the second heat preservation pipe serves as the second inlet, and the second inlet is communicated with the transition chamber; The second end of the second glue supply pipe sequentially passes through the second channel and the second heat preservation pipe, and then extends out through the second inlet and penetrates the transition chamber; The gap between the inner wall of the second channel and the outer wall of the second glue supply pipe and the gap between the inner wall of the second heat preservation pipe and the outer wall of the second glue supply pipe together constitute the second heat preservation flow channel.

4. The glue supply and heat preservation system according to claim 3, characterized in that, The conversion box is configured to be able to perform reciprocating linear motion in the horizontal direction.

5. The glue supply and heat preservation system according to claim 4, wherein, It further includes a flexible cable carrier, one end of the flexible cable carrier is fixed, and the other end of the flexible cable carrier is configured to move following the conversion box; The first heat preservation pipe and the second heat preservation pipe are arranged through the flexible cable carrier.

6. The glue supply and heat preservation system according to claim 5, characterized in that, Both the first heat preservation pipe and the second heat preservation pipe are flexible pipe fittings.

7. The glue supply and heat preservation system according to claim 1, wherein It further includes a secondary heating component; the secondary heating component is arranged between the first outlet and the second inlet to selectively heat the heat preservation medium between the first outlet and the second inlet.

8. The glue supply and heat preservation system according to claim 7, characterized in that, It further includes a controller and a first temperature detection component; both the first temperature detection component and the secondary heating component are communicatively connected to the controller; The first temperature detection component is configured to obtain first temperature information of the heat preservation medium flowing out from the first outlet and send the first temperature information to the controller; The controller is configured to determine whether it is necessary to perform secondary heating on the heat preservation medium based on the first temperature information. If so, the controller controls the secondary heating component to heat the heat preservation medium.

9. The glue supply and heat preservation system according to claim 8, wherein, The process for the controller to determine whether it is necessary to perform secondary heating on the heat preservation medium is: the controller compares the temperature of the heat preservation medium flowing through the first outlet with a preset temperature threshold; If the temperature of the heat preservation medium flowing through the first outlet is less than the preset temperature threshold, it indicates that it is necessary to perform secondary heating on the heat preservation medium; The preset temperature threshold is set to be consistent with the temperature of the heat preservation medium flowing through the first inlet.

10. The glue supply and heat preservation system according to claim 9, characterized in that, It further includes a second temperature detection component communicatively connected to the controller; The second temperature detection component is configured to obtain second temperature information of the heat preservation medium flowing through the first inlet and send the second temperature information to the controller; The controller is further configured to dynamically adjust the preset temperature threshold based on the second temperature information.