Gluing control method and device and electronic equipment

Abstract

The invention relates to the technical field of industrial automation control, and provides a gluing control method and device and electronic equipment, and the method comprises the steps: obtaining first images of N first target objects after gluing treatment of target gluing equipment; wherein N is a positive integer; acquiring first offset data of a gluing track of the first target object according to the first image; determining a first pose compensation value of a gluing mechanism of the target gluing equipment according to the first offset data; and correcting the posture of the gluing mechanism according to the first posture compensation value.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of industrial automation control technology, and more specifically, to a glue application control method, device, and electronic device. Background Art

[0002] In industrial production, especially in manufacturing scenarios involving precision bonding, glue application and other processes, the processing accuracy and yield of products are restricted by multiple factors. Taking the bonding and glue application process of a diaphragm and a steel ring as an example, the current production mode faces significant challenges.

[0003] On the one hand, material characteristics and tooling tolerances bring quality fluctuations. In the bonding process of the diaphragm and the steel ring, due to comprehensive factors such as the bonding accuracy of the material itself, the mating tolerance of the transfer tooling, and the product structure limitations, it is difficult to stably control the concentricity of the glue application, directly resulting in large fluctuations in the comprehensive state of the project, and the product yield remaining in an unstable state, seriously affecting production efficiency and product quality, and increasing production costs and after-sales risks.

[0004] On the other hand, the long-term operation of the glue application equipment causes precision deterioration. During the long-term processing of the glue application equipment, the mechanical structure will have mechanical displacement due to continuous operation. At the same time, key components such as the glue spraying valve body will have performance losses after long-term operation, resulting in frequent problems of glue path deviation during glue application. This precision deterioration during equipment operation further exacerbates the product quality fluctuations. The traditional production control system lacks effective means for dynamic monitoring of equipment status, real-time data feedback, and precise correction, and it is difficult to ensure the stability of product processing accuracy and yield in a complex production environment. Summary of the Invention

[0005] An object of embodiments of the present disclosure is to provide a new technical solution for improving the glue application accuracy.

[0006] According to a first aspect of embodiments of the present disclosure, there is provided a glue application control method, including: Obtaining first images of N first target objects after glue application processing by a target glue application device; where N is a positive integer; Obtaining first offset data of the glue application trajectories of the first target objects according to the first images; Determining a first pose compensation value of a glue application mechanism of the target glue application device according to the first offset data; Performing pose correction processing on the pose of the glue application mechanism according to the first pose compensation value.

[0007] Optionally, the determining the first pose compensation value of the glue application mechanism of the target glue application device according to the first offset data includes: Determining an average value of the first offset data of the glue application trajectories of N first target objects; Determine the first pose compensation value according to the average value.

[0008] Optionally, the determining the first pose compensation value according to the average value includes: Obtain the set pulse number of the driving mechanism in the target glue application device, where the set pulse number is the driving pulse number corresponding to the driving mechanism driving the glue application mechanism to move a unit distance; Obtain the first pose compensation value according to the average value and the set pulse number.

[0009] Optionally, the obtaining the first offset data of the glue application trajectory in the first target object according to the first image includes: Determine the first position information of the glue application trajectory of the first target object according to the first image; Obtain the first offset data of the glue application trajectory corresponding to the first target object according to the first position information and the reference position information of the glue application trajectory.

[0010] Optionally, the method further includes: Eliminate the first offset data that exceeds the set range.

[0011] Optionally, before obtaining the first images of the N first target objects after the glue application process of the target glue application device, the method further includes: Obtain the second position information of the second target object in the target tooling that has not been subjected to the glue application process of the target glue application device; Determine the second offset data of the second target object relative to the target tooling according to the second position information; Determine the second pose compensation value of the glue application mechanism according to the second offset data; Perform deviation correction processing on the pose of the glue application mechanism according to the second pose compensation value.

[0012] Optionally, the method further includes: Determine the cumulative pose compensation value of the target glue application device corresponding to each deviation correction process according to the first pose compensation value and the second pose compensation value; Generate and display a chart reflecting the change trend of the cumulative pose compensation value of the target glue application device corresponding to each deviation correction process.

[0013] Optionally, the performing deviation correction processing on the pose of the glue application mechanism according to the first pose compensation value includes: Send the first pose compensation value to the driving mechanism of the target glue application device, so that the driving mechanism drives the glue application mechanism according to the first pose compensation value.

[0014] According to a second aspect of the present disclosure, there is provided a glue application control device, including: An image acquisition module, configured to acquire a first image of N first target objects after glue application processing by a target glue application device; where N is a positive integer; An offset acquisition module, configured to acquire first offset data of the glue application trajectory of the first target object according to the first image; A compensation determination module, configured to determine a first pose compensation value of the glue application mechanism of the target glue application device according to the first offset data; A deviation correction processing module, configured to perform deviation correction processing on the pose of the glue application mechanism according to the first pose compensation value.

[0015] According to a third aspect of the present disclosure, there is provided an electronic device, including a processor and a memory, where the memory is used to store a computer program, and the processor is configured to execute the method according to the first aspect of the present disclosure under the control of the computer program.

[0016] According to a fourth aspect of the present disclosure, there is provided a computer-readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the method according to the first aspect of the present disclosure.

[0017] Through the embodiments of the present disclosure, first offset data of the glue application trajectory of the first target object is acquired according to the first image of N first target objects after glue application processing by a target glue application device, a first pose compensation value of the glue application mechanism of the target glue application device is determined according to the first offset data, and then deviation correction processing is performed on the pose of the glue application mechanism according to the first pose compensation value. In this way, the glue application accuracy of the target glue application device can be improved, and further, the yield of the target objects processed by the target glue application device can be improved.

[0018] Through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0020] Figure 1 is a block diagram showing the hardware configuration of a glue application system that can implement the embodiments of the present disclosure; Figure 2 is a flowchart of a glue application control method according to an embodiment of the present disclosure; Figure 3 is a block diagram of a glue application control device according to an embodiment of the present disclosure; Figure 4It is a block diagram of an electronic device according to an embodiment of the present disclosure. Detailed Embodiments

[0021] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

[0022] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way limits the present invention, its application, or its use.

[0023] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the specification.

[0024] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0025] It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0026] <Hardware Configuration> Figure 1 It is a block diagram showing the hardware configuration of a glue application system 1000 that can implement the embodiments of the present disclosure.

[0027] As Figure 1 shown, the glue application system 1000 may include a glue application device 1100, an automatic optical inspection device 1200, and an electronic device 1300.

[0028] The glue application device 1100 may include a glue application mechanism 1110 and a driving mechanism 1120. The driving mechanism 1120 may drive the glue application mechanism 1110 to move for performing a glue application process on a target object. Among them, the driving mechanism 1120 may include a Programmable Logic Controller (PLC) and a motor corresponding to each axis.

[0029] In this embodiment, the driving mechanism 1120 of the glue application device 1100 and the automatic optical inspection device 1200 may communicate with the electronic device 1300. The specific communication method may be wired or wireless, which is not limited herein.

[0030] The electronic device 1300 may be a laptop computer, a desktop computer, a mobile phone, a tablet computer, etc., or may also be a server. AsFigure 1 As shown in the figure, the electronic device 1300 may include a processor 1310, a memory 1320, an interface device 1330, a communication device 1340, a display device 1350, an input device 1360, a speaker 1370, a microphone 1380, and so on. Among them, the processor 1310 may be a processor CPU, a microprocessor MCU, etc. The memory 1320 includes, for example, a ROM (read-only memory), a RAM (random access memory), a non-volatile memory such as a hard disk, etc. The interface device 1330 includes, for example, a USB interface, a headphone interface, etc. The communication device 1340 can perform wired or wireless communication, specifically, it may include Wifi communication, Bluetooth communication, 2G / 3G / 4G / 5G communication, etc. The display device 1350 is, for example, a liquid crystal display screen, a touch display screen, etc. The input device 1360 may include, for example, a touch screen, a keyboard, a somatosensory input, etc. The user can input / output voice information through the speaker 1370 and the microphone 1380.

[0031] Figure 1 The electronic device shown is merely illustrative and in no way implies any limitation to the present disclosure, its applications, or uses. In the embodiments applied to the present disclosure, the memory 1320 of the electronic device 1300 is used to store instructions for controlling the processor 1310 to operate to execute any one of the methods provided by the embodiments of the present disclosure. Those skilled in the art should understand that although multiple devices are shown for the electronic device 1300 in Figure 1 , the present disclosure may only relate to some of the devices. For example, the electronic device 1300 only relates to the processor 1310 and the memory 1320. Those skilled in the art can design instructions according to the solutions disclosed in the present disclosure. How the instructions control the processor to operate is well known in the art and will not be described in detail here.

[0032] <Method Embodiment> The present disclosure provides a glue application control method, which can be implemented by an electronic device. Specifically, it can be implemented by an electronic device 1300 as shown in Figure 1 .

[0033] Figure 2 It is a flowchart of the glue application control method according to the embodiments of the present disclosure.

[0034] As shown in Figure 2 , the glue application control method includes the following steps S2100 to S2400: Step S2100, obtain first images of N first target objects after glue application processing by a target glue application device; where N is a positive integer.

[0035] In this embodiment, the first target object may be the target object after being coated by the target coating device, and the target object may be a diaphragm.

[0036] To protect the target object, the target object may be placed on the target tooling. Specifically, at least one target object may be placed on one target tooling.

[0037] In this embodiment, after the target object is coated by the target coating device to obtain the first target object, the first target object may be photographed by the automatic optical detection device 1200 to obtain a first image, and the first image is uploaded to the electronic device 1300.

[0038] Step S2200, obtain the first offset data of the coating trajectory of the first target object according to the first image.

[0039] In this embodiment, the first offset data may include offset components relative to each axis of the driving mechanism. When the driving mechanism includes an X-axis and a Y-axis perpendicular to each other, the first offset data may include an offset component relative to the X-axis and an offset component relative to the Y-axis. When the driving mechanism includes a rotation axis R-axis and an X-axis and a Y-axis perpendicular to each other, the first offset data may include an offset component relative to the R-axis, an offset component relative to the X-axis, and an offset component relative to the Y-axis.

[0040] In some embodiments, it may be to determine the offset pixel value of the coating trajectory of the first target object in the first image relative to the coating position, and then obtain the first offset data according to the mapping relationship between the image pixels and the actual distance.

[0041] The offset pixel value may be the pixel displacement from the reference point of the first target object in the first image to the target point of the coating trajectory.

[0042] When the coating trajectory is circular, the target point of the coating trajectory may be the center of the coating trajectory, and the reference point of the first target object may be the center of the area to be coated of the first target object.

[0043] In some embodiments, obtaining the first offset data of the coating trajectory in the first target object according to the first image includes: determining the first position information of the coating trajectory of the first target object according to the first image; obtaining the first offset data of the coating trajectory corresponding to the first target object according to the first position information and the reference position information of the coating trajectory.

[0044] In this embodiment, the first position information of the glue application trajectory may be the actual position information of the target point of the glue application trajectory, and the reference position information may be the actual position information of the reference point of the glue application area of the first target object. When the glue application trajectory is circular, the target point of the glue application trajectory may be the center of the circle of the glue application trajectory, and the reference point of the first target object may be the center of the circle of the glue application area of the first target object.

[0045] In this embodiment, it may be to determine the first pixel position of the glue application trajectory of the first target object in the first image, and then obtain the first position information of the glue application trajectory according to the mapping relationship between the pixel position and the actual position and the first pixel position.

[0046] In this embodiment, the reference position information of the glue application trajectory may be the position information of the glue application area of the first target object.

[0047] In this embodiment, the first offset data may represent the displacement of the target point of the glue application trajectory to the reference point of the glue application area of the first target object.

[0048] Through this embodiment, the first offset data of the glue application trajectory of each first target object can be quickly and accurately obtained according to the first image.

[0049] In some embodiments, the method further includes: eliminating the first offset data that exceeds the set range.

[0050] In this embodiment, the first offset data that exceeds the set range may be caused by the abnormality of the first target object or the abnormal position of the first target object in the target tooling, rather than the position deviation of the glue application mechanism. Therefore, it is necessary to eliminate the first offset data that exceeds the set range.

[0051] In this embodiment, the set range relative to each axis of the driving mechanism may be preset. When the offset component corresponding to at least one axis in the first offset data exceeds the corresponding set range, the first offset threshold is eliminated.

[0052] Through this embodiment, it is possible to prevent the first offset data of the glue application trajectory of the first object with unqualified glue application from affecting the pose of the glue application mechanism, improve the glue application accuracy of the target glue application equipment, and improve the yield of the target object.

[0053] Step S2300, determine the first pose compensation value of the glue application mechanism of the target glue application equipment according to the first offset data.

[0054] In this embodiment, the first offset data may include offset components with respect to each axis of the driving mechanism. Correspondingly, the first pose compensation value also includes compensation value components with respect to each axis. When the driving mechanism includes an X-axis and a Y-axis that are perpendicular to each other, the first pose compensation value may include a compensation value component with respect to the X-axis and a compensation value component with respect to the Y-axis. When the driving mechanism includes a rotation axis R-axis, and an X-axis and a Y-axis that are perpendicular to each other, the pose compensation value may include a compensation value component with respect to the R-axis, a compensation value component with respect to the X-axis, and a compensation value component with respect to the Y-axis.

[0055] In this embodiment, the compensation value components with respect to each axis in the first pose compensation value may be positive or negative numbers, and the corresponding compensation directions can be represented by positive and negative signs.

[0056] In some embodiments, determining the first pose compensation value of the coating mechanism of the target coating device according to the first offset data includes: determining the average value of the first offset data of the coating trajectories of N first target objects; determining the first pose compensation value according to the average value of the first offset data.

[0057] In this embodiment, the average value of the first offset data of the coating trajectories of N first target objects may be, for each axis, respectively determining the average value of the offset components of the first offset data of the coating trajectories of N first target objects with respect to this axis, that is, obtaining the average value of the first offset data.

[0058] In one embodiment, the first pose compensation value may be obtained according to the average value of the first offset data and the offset direction of the target point of the coating trajectory with respect to the reference point of the area to be coated of the first target object.

[0059] In this embodiment, the numerical value of the first pose compensation value may be the same as the numerical value of the average value of the first offset data, and the sign of the first pose compensation value may be determined by the offset direction of the target point of the coating trajectory with respect to the reference point of the area to be coated of the first target object.

[0060] In some embodiments, the PLC of the driving mechanism drives the motor to rotate to adjust the pose of the coating mechanism. Then, determining the first pose compensation value according to the average value of the first offset data includes: obtaining the set number of pulses of the driving mechanism in the target coating device, where the set number of pulses is the number of driving pulses corresponding to the driving mechanism driving the coating mechanism to move a unit distance; obtaining the first pose compensation value according to the average value of the first offset data and the set number of pulses.

[0061] In this embodiment, the set number of pulses may be the ratio between the number of driving pulses and the distance that it can drive the coating mechanism to move. This set number of pulses may be determined by the motor of the driving mechanism.

[0062] The first pose compensation value obtained according to this embodiment can represent the number of drive pulses corresponding to each axis, and the sign of each number of drive pulses represents the drive direction.

[0063] Through this embodiment, the first pose compensation value is obtained based on the average value of the first offset data and the set number of pulses. The PLC can directly control the motor to adjust the pose of the glue application mechanism according to this first pose compensation value.

[0064] Step S2400: Correct the pose of the glue application mechanism according to the first pose compensation value.

[0065] In this embodiment, correcting the pose of the glue application mechanism according to the first pose compensation value may be that the electronic device sends the obtained first pose compensation value to the drive mechanism of the target glue application device, so that the drive mechanism drives the glue application mechanism according to the first pose compensation value.

[0066] Specifically, the electronic device may be a PLC that sends the first pose compensation value to the drive mechanism of the target glue application device. When the PLC receives this first pose compensation value, it generates drive signals corresponding to each axis corresponding to this first pose compensation value, and drives the corresponding motor to rotate to adjust the pose of the glue application mechanism.

[0067] The drive signals corresponding to each axis corresponding to this first pose compensation value contain the same number of pulses as the numerical value of the compensation value component of the first pose compensation value corresponding to this axis, and the direction of the pulses contained therein matches the sign of the compensation value component of the first pose compensation value corresponding to this axis.

[0068] In this embodiment, correcting the pose of the glue application mechanism according to the first pose compensation value can make the moving displacement of the glue application mechanism the same as the displacement from the target point of the glue application trajectory represented by the average value of the first offset data to the reference point of the to-be-glued area of the first target object.

[0069] Through the embodiments of the present disclosure, based on the first images of N first target objects after the glue application treatment by the target glue application device, the first offset data of the glue application trajectory of the first target object is obtained. The first pose compensation value of the glue application mechanism of the target glue application device is determined according to the first offset data, and then the pose of the glue application mechanism is corrected according to the first pose compensation value. In this way, the glue application accuracy of the target glue application device can be improved, and further the yield of the target objects subjected to the glue application treatment by the target glue application device can be improved.

[0070] In some embodiments, after correcting the pose of the glue application mechanism according to the first pose compensation value, the method may further include: controlling the target glue application device to perform glue application treatment on N third target objects to be glued to obtain N first target objects.

[0071] Further, in the case of obtaining N first target objects, steps S2100 to S2400 can be continuously executed for the obtained N first target objects.

[0072] In some embodiments, before the target gluing device starts gluing the target object, the method further includes: obtaining second position information of a second target object in the target tooling that has not been processed by the target gluing device; determining second offset data of the second target object relative to the target tooling according to the second position information; determining a second pose compensation value of the gluing mechanism according to the second offset data; and performing deviation correction processing on the pose of the gluing mechanism according to the second pose compensation value.

[0073] In this embodiment, the second target object may be a target object that has not been processed by gluing.

[0074] In one embodiment, obtaining the second position information of the second target object includes: obtaining a second image of the second target object; and obtaining the second position information of the second target object according to the second image.

[0075] In this embodiment, the second position information of the second target object may be the actual position information of the reference point of the second target object.

[0076] Further, it may be to determine the second offset data according to the second position information of the second target object and the set initial position information of the second target object. The second offset data may represent the displacement from the initial position information to the second position information.

[0077] Wherein, the initial position information may be set in advance when setting the movement trajectory during the process of controlling the gluing mechanism to process the target object by gluing.

[0078] For the specific manner of determining the second pose compensation value of the gluing mechanism according to the second offset data and performing deviation correction processing on the pose of the gluing mechanism according to the second pose compensation value, reference may be made to the specific manner of determining the first pose compensation value of the gluing mechanism according to the first offset data and performing deviation correction processing on the pose of the gluing mechanism according to the first pose compensation value, which will not be elaborated herein.

[0079] Through this embodiment, the pose of the gluing mechanism can be corrected in advance according to the gluing scenario of the target gluing device, ensuring the yield rate of the N target objects that are first processed by gluing by the target gluing device this time.

[0080] In some embodiments, the method further includes: determining a cumulative pose compensation value of the target gluing device corresponding to each deviation correction process according to the first pose compensation value and the second pose compensation value; and generating and displaying a chart reflecting the change trend of the cumulative pose compensation value of the target gluing device corresponding to each deviation correction process.

[0081] In this embodiment, the cumulative pose compensation value in the first rectification process is equal to the second pose compensation value; the cumulative pose compensation value in the second rectification process is equal to the sum of the cumulative pose compensation value in the first rectification process and the first pose compensation value in the second rectification process; the cumulative pose compensation value in the i-th rectification process is equal to the sum of the cumulative pose compensation value in the (i - 1)-th rectification process and the first pose compensation value in the i-th rectification process. Here, i is an integer greater than 1.

[0082] In this embodiment, the generated chart can be a line chart or a line graph.

[0083] In some embodiments, a chart reflecting the change trend of the pose compensation value corresponding to each rectification process of the target glue application device can also be generated and displayed.

[0084] In this embodiment, the pose compensation value in the first rectification process is equal to the second pose compensation value; the cumulative pose compensation value in the second rectification process is equal to the first pose compensation value in the second rectification process; the pose compensation value in the i-th rectification process is equal to the first pose compensation value in the i-th rectification process. Here, i is an integer greater than 1.

[0085] Through this embodiment, the change trend of the cumulative pose compensation value corresponding to each rectification process of the target glue application device and the change trend of the pose compensation value corresponding to each rectification process of the target glue application device can be visually displayed, so as to facilitate the staff to view in time.

[0086] <Device Embodiment> The present disclosure also provides a glue application control device 3000, as Figure 3 shown. The glue application control device 3000 includes an image acquisition module 3100, an offset acquisition module 3200, a compensation determination module 3300, and a rectification processing module 3400.

[0087] The image acquisition module 3100 is configured to acquire first images of N first target objects after the glue application process of the target glue application device; where N is a positive integer.

[0088] The offset acquisition module 3200 is configured to acquire first offset data of the glue application trajectory of the first target object according to the first images.

[0089] The compensation determination module 3300 is configured to determine the first pose compensation value of the glue application mechanism of the target glue application device according to the first offset data.

[0090] The rectification processing module 3400 is configured to perform rectification processing on the pose of the glue application mechanism according to the first pose compensation value.

[0091] In some embodiments, determining the first pose compensation value of the glue application mechanism of the target glue application device according to the first offset data includes: Determining the average value of the first offset data of the glue application trajectories of N first target objects; Determining the first pose compensation value according to the average value.

[0092] In some embodiments, determining the first pose compensation value according to the average value includes: Obtaining the set pulse number of the driving mechanism in the target glue application device, where the set pulse number is the driving pulse number corresponding to the driving mechanism driving the glue application mechanism to move a unit distance; Obtaining the first pose compensation value according to the average value and the set pulse number.

[0093] In some embodiments, obtaining the first offset data of the glue application trajectory in the first target object according to the first image includes: Determining the first position information of the glue application trajectory of the first target object according to the first image; Obtaining the first offset data of the glue application trajectory corresponding to the first target object according to the first position information and the reference position information of the glue application trajectory.

[0094] In some embodiments, the glue application control device 3000 further includes: A module for eliminating the first offset data exceeding the set range.

[0095] In some embodiments, the glue application control device 3000 further includes: A module for obtaining the second position information of the second target object in the target tooling that has not been processed by the target glue application device; A module for determining the second offset data of the second target object relative to the target tooling according to the second position information; A module for determining the second pose compensation value of the glue application mechanism according to the second offset data; A module for performing a deviation correction process on the pose of the glue application mechanism according to the second pose compensation value.

[0096] In some embodiments, the glue application control device 3000 further includes: A module for determining the cumulative pose compensation value of the target glue application device corresponding to each deviation correction process according to the first pose compensation value and the second pose compensation value; A module for generating and displaying a chart reflecting the change trend of the cumulative pose compensation value of the target glue application device corresponding to each deviation correction process.

[0097] In some embodiments, the rectification processing of the pose of the glue application mechanism according to the first pose compensation value includes: Sending the first pose compensation value to the drive mechanism of the target glue application device, so that the drive mechanism drives the glue application mechanism according to the first pose compensation value.

[0098] <Embodiments of electronic devices> This embodiment provides an electronic device. On the one hand, the electronic device 1300 may include the aforementioned glue application control device 3000.

[0099] On the other hand, as Figure 4 shown, the electronic device 1300 may include a processor 1310 and a memory 1320. The memory 1320 is used to store a computer program, and the processor 1310 is used to control the electronic device to execute the method of any embodiment of the present disclosure under the control of the computer program.

[0100] <Embodiments of readable storage media> This embodiment provides a computer-readable storage medium. A computer program is stored in the storage medium. When the computer program is executed by a processor, it executes the method described in any method embodiment of the present disclosure.

[0101] The present invention may be a system, a method, and / or a computer program product. The computer program product may include a computer-readable storage medium having computer-readable program instructions thereon for causing a processor to implement various aspects of the present invention.

[0102] The computer-readable storage medium may be a tangible device that can hold and store instructions for use by an instruction execution device. The computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (non-exhaustive list) of the computer-readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disc (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punched card or raised structures in grooves storing instructions thereon, and any suitable combination of the foregoing. The computer-readable storage medium used herein is not construed as an instantaneous signal itself, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission medium (e.g., optical pulses through an optical fiber cable), or electrical signals transmitted through wires.

[0103] The computer-readable program instructions described herein can be downloaded to various computing / processing devices from a computer-readable storage medium or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network may include copper transmission cables, optical fiber transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable storage medium in each computing / processing device.

[0104] The computer program instructions for carrying out operations of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state-setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages - such as Smalltalk, C++, etc., and conventional procedural programming languages - such as the "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer, or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network - including a local area network (LAN) or a wide area network (WAN) - or, alternatively, may be connected to an external computer (e.g., through the Internet using an Internet service provider). In some embodiments, by utilizing the state information of the computer-readable program instructions to customize an electronic circuit, such as a programmable logic circuit, a field-programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit can execute the computer-readable program instructions to implement various aspects of the present invention.

[0105] Aspects of the present invention are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.

[0106] These computer-readable program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus to produce a machine such that the instructions, when executed by the processor of the computer or other programmable data processing apparatus, create means for implementing the functions / acts specified in one or more boxes of the flowchart and / or block diagram. These computer-readable program instructions may also be stored in a computer-readable storage medium that causes a computer, a programmable data processing apparatus, and / or other devices to operate in a particular manner, such that the computer-readable medium storing the instructions comprises a manufacture, the instructions of which implement various aspects of the functions / acts specified in one or more boxes of the flowchart and / or block diagram.

[0107] The computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device, such that a series of operational steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / acts specified in one or more boxes of the flowchart and / or block diagram.

[0108] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each box in the flowchart or block diagram may represent a module, a segment of code, or a portion of an instruction, which contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions noted in the boxes may occur in a different order than that noted in the figures. For example, two consecutive boxes may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each box in the block diagrams and / or flowcharts, and combinations of boxes in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified functions or acts, or by a combination of dedicated hardware and computer instructions. As is well known to those skilled in the art, implementation by hardware, implementation by software, and implementation by a combination of software and hardware are equivalent.

[0109] The embodiments of the present invention have been described above. The above description is exemplary and not exhaustive, and is also not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or the improvement of technology in the market, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A glue application control method, characterized in that, Including: Obtain first images of N first target objects after glue application processing by a target glue application device; where N is a positive integer; Obtain first offset data of the glue application trajectories of the first target objects according to the first images; Determine a first pose compensation value of the glue application mechanism of the target glue application device according to the first offset data; Perform deviation correction processing on the pose of the glue application mechanism according to the first pose compensation value.

2. The method according to claim 1, wherein The determining the first pose compensation value of the glue application mechanism of the target glue application device according to the first offset data includes: Determine the average value of the first offset data of the glue application trajectories of N first target objects; Determine the first pose compensation value according to the average value.

3. The method according to claim 2, wherein The determining the first pose compensation value according to the average value includes: Obtain the set number of pulses of the driving mechanism in the target glue application device, where the set number of pulses is the number of driving pulses corresponding to the driving mechanism driving the glue application mechanism to move a unit distance; Obtain the first pose compensation value according to the average value and the set number of pulses.

4. The method according to claim 1, characterized in that, The obtaining the first offset data of the glue application trajectory in the first target object according to the first image includes: Determine first position information of the glue application trajectory of the first target object according to the first image; Obtain the first offset data of the glue application trajectory corresponding to the first target object according to the first position information and the reference position information of the glue application trajectory.

5. The method according to claim 4, characterized in that, The method further includes: Eliminate first offset data that exceeds the set range.

6. The method according to claim 1, wherein Before the obtaining the first images of N first target objects after glue application processing by the target glue application device, the method further includes: Obtain second position information of a second target object in a target tooling that has not been processed by the target glue application device; Determine second offset data of the second target object relative to the target tooling according to the second position information; Determine a second pose compensation value of the glue application mechanism according to the second offset data; Perform deviation correction processing on the pose of the glue application mechanism according to the second pose compensation value.

7. The method according to claim 6, wherein The method further includes: Determine a cumulative pose compensation value corresponding to each deviation correction process of the target glue application device according to the first pose compensation value and the second pose compensation value; Generate and display a chart reflecting the change trend of the cumulative pose compensation value corresponding to each deviation correction process of the target glue application device.

8. The method according to claim 1, characterized in that The performing deviation correction processing on the pose of the glue application mechanism according to the first pose compensation value includes: Send the first pose compensation value to the driving mechanism of the target glue application device, so that the driving mechanism drives the glue application mechanism according to the first pose compensation value.

9. A glue application control device, characterized in that, Including: An image acquisition module, configured to obtain first images of N first target objects after glue application processing by a target glue application device; where N is a positive integer; An offset acquisition module, configured to obtain first offset data of the glue application trajectories of the first target objects according to the first images; A compensation determination module, configured to determine a first pose compensation value of the glue application mechanism of the target glue application device according to the first offset data; A deviation correction processing module, configured to perform deviation correction processing on the pose of the glue application mechanism according to the first pose compensation value.

10. An electronic device, characterized in that, It includes a processor and a memory. The memory is used to store a computer program, and the processor is used to execute the method according to any one of claims 1 to 8 under the control of the computer program.

Images