A smart inspection system for semiconductor integrated circuit housings

Abstract

This invention relates to the field of intelligent inspection equipment for semiconductor chip packaging shells, specifically an intelligent inspection system for semiconductor integrated circuit shells. The system includes an automatic loading and unloading device, a positioning camera, a picker, a robotic arm, an appearance inspection camera, a conveyor belt, a housing, a cross slide, and a controller. By improving the cartridge hopper in the automatic loading and unloading device, after the chip is loaded into the cartridge hopper, it is immediately fixed and supported by the upper and lower clamping heads, allowing the chip to be suspended in the cartridge hopper without contact with the carrier plate. Even during input and output processes, the chip will not experience any friction, ensuring the chip packaging shell is always in optimal condition. Furthermore, during each chip input and output process, a dust removal airbag performs an air sweep on the chip, preventing impurities from adhering to the chip surface due to prolonged storage in the cartridge hopper.

Description

Technical Field

[0001] This invention relates to the field of intelligent inspection equipment for semiconductor chip packaging shells, specifically to an intelligent inspection system for semiconductor integrated circuit shells. Background Technology

[0002] A chip package is a casing used to protect and encapsulate integrated circuit chips. It provides functions such as mechanical protection, thermal management, and electromagnetic shielding, and also provides leads or pads for connection with other electronic components.

[0003] After the chip is packaged, the packaged chip casing needs to be inspected. The inspection includes pin connectivity testing, casing integrity testing, size and geometry testing, soldering quality testing, temperature cycling testing, electromagnetic shielding performance testing of the casing, etc. The main reason is to ensure the quality and reliability of the packaging.

[0004] In the early days, when performing integrity testing, size and geometry testing of packaged shells, the chip shells were inspected one by one manually using testing equipment. In recent years, automatic testing equipment has also been developed. The principle of automatic testing equipment is to use visual inspection combined with intelligent control to achieve machine vision to replace manual visual inspection. Since the consistency of machine vision is much higher than that of manual visual inspection, automatic testing equipment is also developing rapidly in the semiconductor industry.

[0005] The applicant filed an invention patent application on April 25, 2023, with application number 2023104511452. This patent specifically discloses an AI inspection system for packaging shells, including an automatic loading and unloading device, a positioning camera, a picker, a robotic arm, an appearance inspection camera, a conveyor belt, a housing, a cross slide, and a controller. The conveyor belt is horizontally arranged, and the automatic loading and unloading device is respectively located near the inlet and outlet ends to move the chip clips to the upper position A and upper position B. The positioning camera captures the upper position A in real time. Appearance inspection cameras are respectively located between the conveyor belt and the upper position A, and above the middle of the conveyor belt, with opposite shooting directions. The appearance inspection camera located above the middle of the conveyor belt can be driven by the cross slide to move vertically to adjust its height or move perpendicular to the conveying direction of the conveyor belt. The conveyor belt and the two sets of automatic loading and unloading devices are respectively equipped with robotic arms with pickers. The whole process is a continuous flow, which can effectively improve work efficiency and is less likely to contaminate or damage the chips.

[0006] However, according to the applicant, when using an automatic loading and unloading device to automatically output and input the packaged chips, repeated input and output are required to perform visual inspection of the chip casing. The chips are repeatedly transferred and picked up, which inevitably leads to friction between the chips and the cartridge, causing wear and scratches on the package casing. It also causes the chip package casing to become contaminated with dust from the air. Summary of the Invention

[0007] To address the above problems, this invention provides an intelligent inspection system for semiconductor integrated circuit casings. By improving the cartridge hopper in the automatic loading and unloading device, after the chip is loaded into the cartridge hopper, it is immediately fixed and supported by the upper and lower clamping heads, so that the chip is suspended in the cartridge hopper and there is no contact between the chip and the carrier board. Even during the input and output process, the chip will not experience any friction, so that the chip's packaging casing is always in optimal condition. In addition, during each chip input and output process, the chip is air-swept by a dust removal airbag to prevent impurities from adhering to the chip surface due to prolonged storage in the cartridge hopper.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] A smart inspection system for semiconductor integrated circuit housings includes an automatic loading and unloading device, a positioning camera, a material handler, a robotic arm, a visual inspection camera, a conveyor belt, a housing, a cross slide, and a controller. A fresh air unit is installed within the housing. The system is characterized by:

[0010] The automatic loading and unloading device includes a storage mechanism and a feeding mechanism. The storage mechanism includes a support base and a clip compartment. The clip compartment has an opening facing the feeding mechanism. Several horizontally arranged loading units are arranged from top to bottom inside the clip compartment. Each loading unit includes a loading plate, an upper clamping head, and a lower clamping head. Several notches are provided on the loading plate for the lower clamping head to pass through. The upper clamping head and the lower clamping head are respectively located above and below the loading plate. The upper clamping head and the lower clamping head cooperate to clamp and fix the semiconductor chip loaded on the loading plate.

[0011] The clamping ends of the upper clamping head and the lower clamping head are both flexibly designed. A dust removal airbag is provided between the upper clamping head and the lower clamping head in the adjacent material carrying unit. The dust removal airbag expands and contracts under the drive of the upper clamping head and the lower clamping head to remove dust from the outer shell of the semiconductor chip.

[0012] As an improvement, all clamping ends are configured with clamping airbag structures.

[0013] As an improvement, the airbag at the clamping end is connected to the dust removal airbag, and a one-way valve is directly provided between the clamping end and the dust removal airbag.

[0014] As an improvement, the dust removal airbag has several air jet holes facing the sidewall of the semiconductor chip.

[0015] As an improvement, the upper clamping head and the lower clamping head are arranged in a set facing each other, and the upper clamping head and the lower clamping head are both located at the center line of the semiconductor chip.

[0016] As an improvement, two sets of upper clamping heads and lower clamping heads are arranged facing each other, and the upper clamping heads and lower clamping heads are symmetrically arranged at both ends of the semiconductor chip.

[0017] As an improvement, the upper clamping head and the lower clamping head are each mounted on a corresponding clamping mounting plate. The clamping mounting plate is driven to move up and down by a corresponding electric push rod, and the electric push rod is mounted at the bottom of the spring clamping chamber.

[0018] As an improvement, the clamping mounting plate is provided with a vertical sealing plate at the opening of the spring clip compartment.

[0019] As an improvement, the two side walls of the magazine are provided with sliding grooves for inserting and installing the material carrier plate.

[0020] As an improvement, the feeding mechanism includes a horizontal drive module, a module support frame, a vertical drive module, and a tray, wherein the tray has a strip-shaped opening corresponding to the notch.

[0021] The beneficial effects of this invention are as follows:

[0022] (1) By improving the magazine in the automatic loading and unloading device, after the chip is loaded into the magazine, it will be immediately fixed and supported by the upper and lower clamping heads, so that the chip is suspended in the magazine and there is no contact between the chip and the carrier plate. Even during the input and output process, the chip will not experience any friction, so that the chip's packaging shell is always in the best state.

[0023] (2) In the process of each input and output of the chip in this invention, the dust removal airbag is driven by the cooperation of the upper clamping head and the lower clamping head. The expansion and contraction of the dust removal airbag blows out air to perform air sweeping treatment on the chip repeatedly, so as to avoid the chip being located in the spring clamping chamber and the chip surface being covered by impurities.

[0024] (3) In this invention, when setting the clamping mounting plate, a vertical sealing plate is set at the part of the clamping mounting plate located at the opening of the spring clamping compartment. When the upper clamping head and the lower clamping head clamp the chip, the sealing plate will close. Together with the clamping mounting plate and the side arm of the spring clamping compartment, a set of storage space is formed around the chip to protect the chip.

[0025] In summary, this invention has advantages such as automatic detection, structural stability, effective chip protection, and avoidance of wear, and is particularly suitable for the field of chip packaging shell detection structure technology. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of Embodiment 1 of the present invention;

[0027] Figure 2 This is a three-dimensional structural diagram of the automatic loading and unloading device according to Embodiment 1 of the present invention;

[0028] Figure 3 This is a three-dimensional structural diagram of the feeding mechanism according to Embodiment 1 of the present invention;

[0029] Figure 4 This is a schematic diagram of the tray three-dimensional structure according to Embodiment 1 of the present invention;

[0030] Figure 5 This is a schematic diagram of the three-dimensional structure of the magazine compartment according to Embodiment 1 of the present invention. Figure 1 ;

[0031] Figure 6 This is a schematic diagram of the three-dimensional structure of the material loading unit in Embodiment 1 of the present invention. Figure 1 ;

[0032] Figure 7 This is a schematic diagram of the three-dimensional structure of the magazine compartment according to Embodiment 1 of the present invention. Figure 2 ;

[0033] Figure 8 This is a schematic diagram of the three-dimensional structure of the magazine compartment according to Embodiment 1 of the present invention. Figure 3 ;

[0034] Figure 9 This is a three-dimensional structural diagram of the upper clamping head according to Embodiment 1 of the present invention;

[0035] Figure 10 This is a schematic diagram of the three-dimensional structure of the carrier plate according to Embodiment 1 of the present invention;

[0036] Figure 11 This is a schematic diagram of the three-dimensional structure of the material loading unit in Embodiment 1 of the present invention. Figure 2 ;

[0037] Figure 12 This is a schematic diagram of the clamping end structure in Embodiment 2 of the present invention;

[0038] Figure 13 This is a side view of the material-carrying unit in Embodiment 3 of the present invention;

[0039] Figure 14 This is a side view of the material-carrying unit in Embodiment 4 of the present invention;

[0040] Figure 15 This is a schematic diagram of the three-dimensional structure of the carrier plate in Embodiment 5 of the present invention. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] Example 1:

[0045] like Figures 1 to 11As shown, an intelligent inspection system for semiconductor integrated circuit housings includes an automatic loading and unloading device 1, a positioning camera 2, a material picker 3, a robotic arm 4, an appearance inspection camera 5, a conveyor belt 6, a housing 7, a cross slide 8, and a controller. A fresh air unit 9 is installed in the housing 7. The specific structure, arrangement, and functions of the automatic loading and unloading device 1, the positioning camera 2, the material picker 3, the robotic arm 4, the appearance inspection camera 5, the conveyor belt 6, the housing 7, the cross slide 8, the controller, and the fresh air unit 9 are described in detail and clearly in the applicant's prior patent application with patent number 2023104511452, and will not be repeated here. This application mainly focuses on the differences between the automatic loading and unloading device 1 and the prior patent application.

[0046] The automatic loading and unloading device 1 of this application includes a storage mechanism 11 and a feeding mechanism 12. The storage mechanism 11 includes a support base 111 and a magazine 112. The magazine 112 has an opening facing the feeding mechanism 12, and several horizontally arranged loading units 113 are arranged from top to bottom inside the magazine 112. Each loading unit 113 includes a loading plate 1331, an upper clamping head 1132, and a lower clamping head 1133. The loading plate 1331 has several notches 1134 for the lower clamping head 1133 to pass through. The upper clamping head 1132 and the lower clamping head 1133 are respectively located above and below the loading plate 1331. The clamping head 1132 and the lower clamping head 1133 are evenly installed on the corresponding clamping mounting plate 1137. The clamping mounting plate 1137 is driven to move up and down by the corresponding electric push rod 1138, and the clamping mounting plate 1137 is guided and supported by the guide rod. The electric push rod 1138 is installed at the bottom of the spring clamping compartment 112. The electric push rod 1138 is powered by the battery pack and is also provided with a control switch. The control switch can control the upper clamping head 1132 and the lower clamping head 1133 to move individually or simultaneously. The upper clamping head 1132 and the lower clamping head 1133 cooperate to clamp and fix the semiconductor chip 10 loaded on the carrier plate 1331.

[0047] The magazine 112 has a sliding groove 1121 on each of its two side walls. The sliding groove 1121 is used to insert and install the carrier plate 1331. The carrier plate 1331 is used to lower the clamping head 1133 in case of misoperation. The carrier plate 1131 is used to support the semiconductor chip 10.

[0048] The clamping ends 1135 of the upper clamping head 1132 and the lower clamping head 1133 are both flexibly configured. A dust removal airbag 1130 is provided between the upper clamping head 1132 and the lower clamping head 1133 in the adjacent material loading unit 113. In addition, a dust removal airbag 1130 is also provided between the top plate of the spring clip hopper and the upper clamping head 1132, and between the bottom plate of the spring clip hopper and the lower clamping head 1133. The dust removal airbag 1130 has several air jet holes 1136 facing the side wall of the semiconductor chip 10. The dust removal airbag 1130 expands and contracts under the drive of the upper clamping head 1132 and the lower clamping head 1133 to remove dust from the outer shell of the semiconductor chip 10.

[0049] The aforementioned electric linear actuator 1138 was purchased from Thomson, preferably a DC electric linear actuator. The battery pack is a lithium battery pack purchased from EVE Energy, and the control switch was purchased from Chint Electric.

[0050] The clamping ends 1135 are all configured with clamping airbag structures. When the upper clamping head 1132 and the lower clamping head 1133 clamp the chip and form a suspended configuration, the clamping ends 1135 will deform due to compression, ensuring that the clamping ends 1135 clamp the chip without rigidly compressing and damaging the chip's packaging shell.

[0051] It should be noted that the difference between this application and the prior invention patent is that this application has made an innovative improvement to the magazine 112, which ensures that the chip packaging shell will not have friction scratches or wear after being input into the magazine 112, whether it is input or output again or during transportation.

[0052] Specifically, the existing chip packaging materials are mostly plastic, ceramic, metal, glass, and composite materials formed from the first four, such as plastic / metal composites and ceramic / metal composites. Regardless of the packaging material, after repeated handling and transfer, scratches or even damage will form on the surface of the packaging shell. This is especially true when the chip is stored in the cartridge compartment and is transferred with the cartridge compartment or when the chip is output from the cartridge compartment, which will cause scratches on the chip packaging shell. For some ceramic packaging shells, the shell may also be damaged due to impact.

[0053] In this application, after the chip is input into the cartridge compartment, the lower clamping head 1133 located below the chip rises to support the chip, preventing the chip from contacting the carrier plate 1331. Furthermore, the clamping end 1135 of the carrier plate 1331 is designed with a flexible airbag structure, which will not cause any scratches on the chip surface. Then, the upper clamping head 1132 located above the chip descends and cooperates with the lower clamping head 1133 to clamp and fix the chip. The clamping end will not cause any squeezing damage to the chip, thus ensuring both chip clamping and storage and protection of the chip casing.

[0054] Furthermore, although the chip manufacturing process is conducted in a cleanroom environment, hair and dust from processing personnel can still enter the processing environment with the air. Even with various dust removal methods, some impurities and dust can still adhere to the chip's packaging shell, leading to a decrease in chip yield. Therefore, in order to ensure the cleanliness of the chip, this application expands or compresses the dust removal airbag 1130 to form an airflow on the chip each time the chip is input and removed from the cartridge hopper, thus cleaning the chip with gas.

[0055] Correspondingly, the feeding mechanism 12 includes a horizontal drive module 121, a module support frame 122, a vertical drive module 123, and a tray 124. The tray 124 has a strip opening 1241 that corresponds to the notch 1134.

[0056] It should be noted that when the tray 124 moves the semiconductor chip 10 to above the carrier plate 1331, the upper clamping head 1132 will lift up, lifting the semiconductor chip 10 through the strip opening 1241 and leaving the tray 124. After that, the tray 124 will be output from the magazine 112.

[0057] Example 2:

[0058] Referring to Example 1, the difference between this embodiment and Example 1 lies in:

[0059] like Figure 12 As shown, the airbag at the clamping end 1135 is connected to the dust removal airbag 1130, and a one-way valve is directly provided between the clamping end 1135 and the dust removal airbag 1130.

[0060] It should be noted that the clamping end 1135 adopts an airbag structure. During repeated use, the gas inside the airbag will gradually be lost, causing the clamping end 1135 to lose its flexibility. However, during each expansion and contraction of the airbag to expel gas, a portion of the gas inside the airbag will enter the dust removal airbag 1130 through a one-way valve, ensuring the air filling of the clamping end 1135 and allowing the clamping end 1135 to maintain a long-term working state.

[0061] Example 3:

[0062] Referring to Example 1, the difference between this embodiment and Example 1 lies in:

[0063] like Figure 13 As shown, the upper clamping head 1132 and the lower clamping head 1133 are arranged in a set facing each other, and the upper clamping head 1132 and the lower clamping head 1133 are both located at the center line position of the semiconductor chip 10.

[0064] It should be noted that only one set of the upper clamping head 1132 and the lower clamping head 1133 is provided, which clamps the center position of the semiconductor chip 10, so that the semiconductor chip 10 is in a clamped state.

[0065] Example 4:

[0066] Referring to Example 3, the difference between this embodiment and Example 3 is as follows:

[0067] like Figure 14 As shown, there are two sets of upper clamping heads 1132 and lower clamping heads 1133 arranged facing each other, and the upper clamping heads 1132 and lower clamping heads 1133 are symmetrically arranged at both ends of the semiconductor chip 10.

[0068] It should be noted that when two sets of upper clamping head 1132 and lower clamping head 1133 are provided, one set clamps one end of semiconductor chip 10 and the other set clamps the other end of semiconductor chip 10. Both ends of semiconductor chip 10 are clamped, which ensures the stability of semiconductor chip 10. Moreover, the clamping of both ends of semiconductor chip 10 can be replaced to ensure that semiconductor chip 10 will not move.

[0069] Example 5:

[0070] Referring to Example 1, the difference between this embodiment and Example 1 lies in:

[0071] like Figure 15 As shown, the clamping mounting plate 1137 is provided with a vertical sealing plate 1139 at the opening of the spring clip 112.

[0072] It should be noted that when the upper clamping head 1132 and the lower clamping head 1133 have just finished clamping the semiconductor chip 10, the sealing plate 1139 on the clamping mounting plate 1137 also closes. The sealing plate 1139 cooperates with the side wall of the clamping mounting plate 1137 and the spring clamping chamber 112 to seal the semiconductor chip 10, forming a sealed storage space, effectively ensuring the cleanliness of the semiconductor chip 10 and improving the yield of the semiconductor chip 10.

[0073] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An intelligent inspection system for semiconductor integrated circuit housings, comprising an automatic loading and unloading device (1), a positioning camera (2), a material picker (3), a robotic arm (4), an appearance inspection camera (5), a conveyor belt (6), a housing (7), a cross slide (8), and a controller, wherein a fresh air unit (9) is installed in the housing (7), characterized in that: The automatic loading and unloading device (1) includes a storage mechanism (11) and a feeding mechanism (12). The storage mechanism (11) includes a support base (111) and a magazine (112). The magazine (112) has an opening facing the feeding mechanism (12), and several horizontally arranged loading units (113) are arranged from top to bottom inside the magazine (112). Each loading unit (113) includes a loading plate (1331) and an upper clamping head (1331). The upper clamping head (1132) and the lower clamping head (1133) are provided on the carrier plate (1331), and a number of notches (1134) are provided on the carrier plate (1331) for the lower clamping head (1133) to pass through. The upper clamping head (1132) and the lower clamping head (1133) are respectively located above and below the carrier plate (1331). The upper clamping head (1132) and the lower clamping head (1133) cooperate to clamp and fix the semiconductor chip (10) loaded on the carrier plate (1331). The clamping ends (1135) of the upper clamping head (1132) and the lower clamping head (1133) are both flexibly arranged. A dust removal airbag (1130) is provided between the upper clamping head (1132) and the lower clamping head (1133) in the adjacent material carrying unit (113). The dust removal airbag (1130) expands and contracts under the drive of the upper clamping head (1132) and the lower clamping head (1133) to remove dust from the outer shell of the semiconductor chip (10). The upper clamping head (1132) and the lower clamping head (1133) are equally installed on the corresponding clamping mounting plate (1137). The clamping mounting plate (1137) is driven to move up and down by the corresponding electric push rod (1138), and the electric push rod (1138) is installed at the bottom of the spring clip bin (112). The feeding mechanism (12) includes a horizontal drive module (121), a module support frame (122), a vertical drive module (123) and a tray (124), and the tray (124) has a strip opening (1241) corresponding to the notch (1134).

2. The intelligent detection system for semiconductor integrated circuit casings according to claim 1, characterized in that: The clamping ends (1135) are all configured with clamping airbag structures.

3. The intelligent detection system for semiconductor integrated circuit casings according to claim 2, characterized in that: The airbag at the clamping end (1135) is connected to the dust removal airbag (1130), and a one-way valve is directly provided between the clamping end (1135) and the dust removal airbag (1130).

4. The intelligent detection system for semiconductor integrated circuit casings according to claim 1, characterized in that: The dust removal airbag (1130) has several air jet holes (1136) facing the side wall of the semiconductor chip (10).

5. The intelligent detection system for semiconductor integrated circuit casings according to claim 1, characterized in that: The upper clamping head (1132) and the lower clamping head (1133) are arranged in a set facing each other, and the upper clamping head (1132) and the lower clamping head (1133) are both located at the center line position driven by the semiconductor chip (10).

6. The intelligent detection system for semiconductor integrated circuit casings according to claim 1, characterized in that: The upper clamping head (1132) and the lower clamping head (1133) are arranged in two sets facing each other, and the upper clamping head (1132) and the lower clamping head (1133) are symmetrically arranged at both ends of the semiconductor chip (10).

7. The intelligent detection system for semiconductor integrated circuit casings according to claim 1, characterized in that: The clamping mounting plate (1137) is provided with a vertical sealing plate (1139) at the opening of the spring clip compartment (112).

8. The intelligent detection system for semiconductor integrated circuit housings according to claim 1, characterized in that: The magazine compartment (112) is provided with sliding grooves (1121) on both sides of the side wall, which are used to insert and install the carrier plate (1331).

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