Heat preservation device for temperature test of integrated circuit
By designing the insulation device for the load plate and shell structure, the problem of uncontrollable temperature in the integrated circuit temperature test is solved, stable control of the circuit temperature is achieved, and the accuracy and consistency of the test are improved.
Patent Information
- Application Number
- CN202510809379.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-17
- Publication Date
- 2025-07-22
AI Technical Summary
In the existing integrated circuit temperature test, the temperature of the circuit is uncontrollable after being taken out from the high and low temperature tank, which affects the accuracy and consistency of the test.
A thermal insulation device including a load plate, a first housing and a second housing is designed. The first housing is provided with a through hole and a rubber sealing gasket. The second housing is transparent, and sealing and insulation are achieved through a thermal flow cover and through holes to prevent temperature loss.
The stable control of circuit temperature during the test is achieved, and the accuracy and consistency of the test is improved.
Smart Images
Figure CN120352756A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of integrated circuit testing, and more specifically, it is a heat preservation device for integrated circuit temperature testing. Background Art
[0002] An integrated circuit is a complete circuit formed by integrating components such as diodes, transistors, resistors, capacitors, and inductors on a micro-sized semiconductor wafer or dielectric substrate using semiconductor process technology, and then encapsulating it in a package to form a micro-structure with circuit functions. Integrated circuits are currently widely used in fields such as aerospace, military, and electronics industry. The main purpose of integrated circuit testing is to ensure that the device can fully achieve the functions and performance indicators specified in the design specification under harsh environmental conditions.
[0003] Generally, the operating temperature range of industrial-grade integrated circuits is: -40°C to 85°C, the operating temperature range of military-grade circuits is wider: -55°C to 125°C, and the aerospace-grade even exceeds 150°C. Therefore, the performance testing of circuits at high and low temperatures is particularly important.
[0004] Currently, the means for high and low temperature testing of circuits are as follows: Set the temperature using a high and low temperature chamber. For example, set the low temperature to -55°C and the high temperature to 125°C. Place the entire batch of circuits to be tested in the chamber. After half an hour, quickly take out the circuits from the high and low temperature chamber and place them in a test fixture for testing. The disadvantages of this testing method are: After the circuits are taken out, they come into contact with air, and the temperature dissipates more or less and cannot maintain the low or high temperature, resulting in uncontrollable temperature and affecting the test accuracy. When the high and low temperature testing time of the circuits is relatively long, the temperature consistency cannot be guaranteed to be completely the same. Therefore, it will affect the accuracy of the data during integrated circuit temperature testing. Summary of the Invention
[0005] The present invention aims to overcome the deficiencies in the prior art and provides a heat preservation device for integrated circuit temperature testing.
[0006] The present application provides the following technical solutions: A heat preservation device for integrated circuit temperature testing, characterized in that: it includes a load board, a first housing is covered on the load board, at least one through hole corresponding to and cooperating with a heat flow cover is provided on the first housing, a second housing is also covered on the load board outside the first housing, and an opening corresponding to and cooperating with the heat flow cover is provided on the second housing.
[0007] Based on the above technical solutions, the following further technical solutions may be available: The first housing includes a top plate, two layers of annular outer walls are connected to the top plate, and an annular rubber gasket is connected to one end of the two outer walls.
[0008] The second housing is made of a transparent material.
[0009] A number of through holes are provided on the first housing, one of which has a larger diameter, and a rubber cushion layer is provided on the inner wall of each through hole.
[0010] A positioning knob corresponding to the output end of the heat flow cover is provided on the first housing.
[0011] The outer wall is made of a transparent material.
[0012] Advantages of the invention: The invention has a simple structure and is convenient to use. Since a soft rubber sealing sleeve is bonded in the through hole, it can play a sealing role when the heat flow cover air pipe is inserted. The double-layer structure of the first housing has good heat insulation and heat preservation effects, and the transparent color is convenient for observing the test circuit; while the rubber sealing pad can prevent the device from bumping against the test machine table and play a sealing effect when the device is buckled on the test fixture and the circuit. Description of the drawings
[0013] Figure 1 is a schematic structural diagram of the invention; Figure 2 is a three-dimensional schematic diagram of the invention. Detailed implementation manners
[0014] As Figure 1 and 2 shown, a heat preservation device for integrated circuit temperature testing includes a load board 1, and a test fixture 1a is installed on the load board 1.
[0015] A first housing 2 is covered on the load board 1. The first housing 2 includes a top plate 2a, and an inner and outer two-layer annular outer wall 2b is connected to the bottom surface of the top plate 2a. An annular rubber sealing pad 2c is connected to the lower ends of the two outer walls 2b. The outer wall 2b is made of transparent acrylic material.
[0016] A group of through holes 4 are provided on the top plate 2a of the first housing 2. The group of through holes 4 includes a through hole 4 with a larger diameter and three through holes 4 with smaller diameters. A rubber cushion layer 4a is connected to the inner wall of each through hole 4. The through hole 4 with a larger diameter is located at the center of the top plate 2a, and the three through holes 4 with smaller diameters are evenly distributed around the through hole 4 with a larger diameter in a triangular distribution.
[0017] A group of positioning knobs 2d corresponding to the output end of the heat flow cover 3 are evenly distributed on the top plate 2a between the three through holes 4 with smaller diameters and the through hole 4 with a larger diameter.
[0018] A second housing 5 is also covered on the load board 1 outside the first housing 2. An opening 5a corresponding to and cooperating with the heat flow cover 3 is provided on the second housing 5. The second housing 5 is also made of transparent acrylic material.
[0019] Usage process: First, connect the integrated circuit to be tested to the test fixture 1a, and then cover one side of the first housing 2 and the second housing 5 on the load board 1. Make the test fixture 1a located inside the first housing 2.
[0020] Then, snap the output end of the heat flow cover 3 onto the positioning knob 2d. At this time, the air pipe 3a at the output end of the heat flow cover 3 will be inserted into the through hole 4, and the rubber cushion layer 4a is compressed to play a sealing role. The rubber gasket 2c on the first housing 2 also plays a sealing role, making the first housing have an effective heat preservation effect.
Claims
1. An insulation device for integrated circuit temperature testing, characterized in that: It includes a load board (1), on which a first housing (2) is covered. At least one through hole (4) corresponding to and cooperating with a heat flow cover (3) is provided on the first housing (2). A second housing (5) is also covered on the load board (1) outside the first housing (2), and an opening (5a) corresponding to and cooperating with the heat flow cover (3) is provided on the second housing (5).
2. The thermal insulation device for integrated circuit temperature testing according to claim 1, wherein: The first housing (2) includes a top plate (2a), two layers of annular outer walls (2b) are connected to the top plate (2a), and an annular rubber gasket (2c) is connected to one end of the two outer walls (2b).
3. A heat preservation device for integrated circuit temperature testing according to claim 1, characterized in that: The second housing (5) is made of a transparent material.
4. A heat preservation device for integrated circuit temperature testing according to claim 1, characterized in that: A number of through holes (4) are provided on the first housing (2), one of the through holes (4) has a larger diameter, and a rubber lining layer (4a) is provided on the inner wall of each through hole (4).
5. The thermal insulation device for integrated circuit temperature testing according to claim 1, characterized in that: A positioning knob (2d) corresponding to and cooperating with the output end of the heat flow cover (3) is provided on the first housing (2).
6. The thermal insulation device for integrated circuit temperature testing according to claim 2, characterized in that: The outer wall (2b) is made of a transparent material.