Device and method for realizing interconnection between chips of different material platforms

Abstract

The invention discloses a device and method for realizing interconnection between chips of different material platforms, and the method comprises the following steps: S1, providing a first chip and a second chip, respectively fixing the first chip and the second chip in a chip clamp provided with a sliding rail, and enabling the clamp to move in the X direction, the Y direction and the Z direction and to carry out angle adjustment; s2, a coupling lens is arranged between the chips, and the light beams of the chips and the optical axis of the lens are preliminarily aligned; s3, adjusting the chip clamp to enable the emitted light beam to be accurately aligned with the lens; s4, finely adjusting the positions and angles of the chip and the lens by using a six-axis alignment platform; s5, transmitting a test light signal to detect the light intensity; s6, continuously adjusting the position and the angle according to the result; s7, locking the chip clamp and the lens; and S8, performing a final test after interconnection is completed. The method is suitable for high-precision optical interconnection between heterogeneous chips.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic packaging, and particularly to a device and method for realizing interconnection between chips on different material platforms. Background Art

[0002] With the development of optical communication and optical computing technologies, high-speed interconnection between chips on different material platforms has become an important research direction in the fields of optoelectronics and semiconductors. In application scenarios such as high-performance computing, optical communication, and photonic integration, traditional electrical interconnection methods are difficult to meet the requirements of high-density packaging and high-speed data transmission due to problems such as limited bandwidth, high power consumption, and degraded signal integrity. Therefore, optical interconnection has gradually become one of the key technologies for data transmission between chips. However, due to the differences in optical characteristics, packaging processes, and manufacturing accuracies of chips on different material platforms, achieving stable and efficient optical interconnection still faces many challenges.

[0003] Currently, common optical interconnection methods between chips include direct coupling, optical waveguide coupling, and lens coupling. The direct coupling method relies on optical interfaces on optical fibers or chips for optical signal transmission. This method has extremely high requirements for chip processing accuracy and alignment accuracy. Tiny displacements or angular deviations will cause serious optical signal losses. In addition, due to the different refractive indices and optical modes of chips on different material platforms, direct coupling is difficult to be universal in heterogeneous chip systems.

[0004] The optical waveguide coupling method integrates optical waveguide structures on the chip surface or packaging substrate, enabling optical signals to propagate inside the waveguide and couple to the target chip. Although this method can reduce the requirements for alignment accuracy to a certain extent, due to the complexity of optical waveguide mode matching, it is difficult to adapt between chips on different material platforms. In addition, the optical waveguide manufacturing process is complex and vulnerable to environmental factors, resulting in high optical signal losses, which limits its application in the interconnection of chips on multiple material platforms.

[0005] Lens coupling technology uses optical lenses to focus light beams to improve the coupling efficiency of optical signals. Lenses can reduce beam divergence and improve the stability of optical interconnection between chips. However, existing lens coupling methods mainly rely on fixed installation, and the position and angle adjustment of lenses are usually manual, lacking an accurate automatic adjustment mechanism. This method has high requirements for alignment accuracy and is difficult to maintain consistency during mass packaging. In addition, existing lens coupling systems lack dynamic adjustment capabilities and are difficult to adapt to the optical characteristics of chips on different material platforms, affecting the stable transmission of optical signals.

[0006] Existing technologies still have deficiencies in terms of alignment accuracy, stability, and automatic adjustment capabilities for optical interconnection between chips on different material platforms, and are difficult to meet the requirements of efficient and low-loss optical signal transmission.

[0007] Therefore, how to provide a device and method for interconnecting chips between different material platforms is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0008] An object of the present invention is to propose a method for interconnecting chips between different material platforms. The present invention makes full use of a six-axis alignment platform, optical lens coupling, high-precision slide rail adjustment and mechanical locking technology, and details a method for realizing stable optical interconnection between chips on different material platforms by precisely adjusting the chips, lenses and optical signal transmission paths, which has the advantages of high alignment accuracy, high optical signal transmission efficiency, being applicable to a variety of heterogeneous chip materials, and strong packaging stability.

[0009] A method for interconnecting chips between different material platforms according to an embodiment of the present invention includes the following steps:

[0010] S1. Provide a first chip and a second chip, and fix the first chip and the second chip in a chip fixture provided with a slide rail. The chip fixture can move in the XYZ directions and perform angle adjustment;

[0011] S2. Set a coupling lens between the first chip and the second chip to preliminarily align the optical axis of the lens with the emission beam of the first chip and the receiving area of the second chip;

[0012] S3. Adjust the position of the chip fixture so that the emission beam of the first chip is aligned with the center of the lens, and the outgoing beam of the lens is aligned with the receiving area of the second chip;

[0013] S4. Use a six-axis alignment platform to finely adjust the spatial positions, pitch angles, yaw angles and roll angles of the first chip, the second chip and the lens;

[0014] S5. Transmit a test optical signal and use a detection device to monitor the intensity of the optical signal received by the second chip;

[0015] S6. According to the monitoring results, continue to adjust the positions and angles of the first chip, the second chip and the lens until the set requirements are met;

[0016] S7. Lock the positions of the chip fixture and the lens;

[0017] S8. Perform a final test to confirm that the optical signal is emitted from the first chip and transmitted to the second chip through the lens.

[0018] Optionally, the S2 specifically includes:

[0019] S21. Provide a coupling lens and set it on the optical transmission path between the first chip and the second chip, so that the emission beam of the first chip is transmitted to the optical receiving end of the second chip after passing through the lens;

[0020] S22. Adjust the position of the lens in the X direction so that the optical axis of the lens is aligned with the center of the beam emitted by the first chip;

[0021] S23. Adjust the position of the lens in the Y direction so that the beam can uniformly cover the light receiving area of the second chip after passing through the lens;

[0022] S24. Adjust the position of the lens in the Z direction so that the beam forms a minimum spot at the focal point after passing through the lens and coincides with the light receiving surface of the second chip;

[0023] S25. Rotate the pitch angle α of the lens to adjust the propagation angle of the beam so that the beam propagates in a set direction after passing through the lens;

[0024] S26. Rotate the yaw angle β of the lens to adjust the beam propagation path so that the beam enters at the center position of the light receiving surface of the second chip after passing through the lens;

[0025] S27. Rotate the roll angle γ of the lens to adjust the polarization direction of the beam so that its incident direction meets the optical incident requirements of the second chip;

[0026] S28. After completing the position and angle adjustment of the lens, fix the lens to prevent its position from changing.

[0027] Optionally, the specific steps of S4 are as follows:

[0028] S41. Provide a six-axis alignment platform, which includes an X-direction moving unit, a Y-direction moving unit, a Z-direction moving unit, a pitch angle adjustment unit, a yaw angle adjustment unit, and a roll angle adjustment unit;

[0029] S42. Adjust the X-direction position of the first chip so that the center of the beam emitted by the first chip is aligned with the center of the optical axis of the lens, and adjust the X-direction position of the second chip so that the center of the beam after focusing by the lens is aligned with the center of the light receiving area of the second chip;

[0030] S43. Adjust the Y-direction position of the first chip so that the incident position of its emitted beam at the lens meets the preset parameters, and adjust the Y-direction position of the second chip so that the beam emitted by the lens uniformly covers the light receiving area of the second chip;

[0031] S44. Adjust the Z-direction positions of the first chip and the second chip so that the beam emitted by the first chip can be incident on the light receiving surface of the second chip after focusing by the lens, and adjust the Z-direction position of the lens so that the focal point is located on the light receiving surface of the second chip;

[0032] S45. Adjust the pitch angle α1 of the first chip and the pitch angle α2 of the second chip so that the beam propagation direction and the optical axis direction of the lens meet the preset angle, and adjust the pitch angle α of the lens T, align the optical axis of the lens with the beam propagation direction;

[0033] S46. Adjust the yaw angle β1 of the first chip and the yaw angle β2 of the second chip so that the emitted beam of the first chip propagates in a set direction after passing through the lens, and adjust the yaw angle β of the lens T , so that the propagation direction of the beam after the lens conforms to the set parameters;

[0034] S47. Adjust the roll angle γ1 of the first chip and the roll angle γ2 of the second chip so that the polarization direction of the emitted beam of the first chip meets the light reception requirements of the second chip, and adjust the roll angle γ of the lens T , so that the polarization direction of the beam emitted from the lens conforms to the set requirements;

[0035] S48. After completing the position and angle adjustment of the first chip, the second chip and the lens, fix the positions of the first chip fixture, the second chip fixture and the lens so that their relative positions remain stable during subsequent operations.

[0036] Optionally, the S7 specifically includes:

[0037] S71. Provide a locking mechanism, which includes a mechanical locking component and an electronic locking component. The mechanical locking component is used to fix the first chip fixture and the second chip fixture, and the electronic locking component is used to record the final positions of the chip and the lens;

[0038] S72. After completing the precise alignment of the first chip, the second chip and the lens, lock the first chip fixture so that its position in the XYZ directions and the angles of the pitch angle, yaw angle and roll angle remain unchanged;

[0039] S73. Lock the second chip fixture so that its position in the XYZ directions and the angles of the pitch angle, yaw angle and roll angle are aligned with the first chip;

[0040] S74. Lock the position of the lens so that its optical axis is fixed relative to the emitted beam of the first chip and the light reception area of the second chip, and prevent it from shifting during subsequent use;

[0041] S75. Fix the chip fixture using a mechanical locking component. The mechanical locking component includes a locking bolt, a positioning pin or a spring clamp. When locking, the movement of the fixture is restricted by tightening the bolt or inserting the positioning pin;

[0042] S76. Lock the lens using an electronic locking component. The electronic locking component includes a position sensor and an electromagnetic locking mechanism. The position sensor is used to record the position data of the lens, and the electromagnetic locking mechanism is used to keep the lens in a fixed state after reaching the set position;

[0043] S77. After the locking mechanism completes the operation, perform position verification, including using a position sensor to detect the XYZ coordinates and angular values of the first chip, the second chip, and the lens after locking, and comparing with the recorded data before locking;

[0044] S78. If the position verification result meets the preset standard, complete the locking process; otherwise, unlock and readjust the positions of the first chip, the second chip, and the lens, and then perform the locking operation again.

[0045] A device for interconnecting chips between different material platforms according to an embodiment of the present invention includes:

[0046] A base made of aluminum alloy or steel, with dimensions of 150 mm in length, 100 mm in width, and 10 mm in thickness, and used to provide a stable support structure;

[0047] A vertical bracket made of stainless steel or carbon fiber material, provided on the base, with a bracket height of 200 mm and a diameter of 10 mm, and fixed to the base by screws or welding;

[0048] A slide rail structure provided on the vertical bracket, made of stainless steel or aluminum material, with an adjustment range of 50 mm, and used to achieve high-precision displacement adjustment during the chip alignment process;

[0049] A chip fixture installed on a six-axis alignment platform, made of PEEK material, with a clamping force controlled between 5 and 10 Newtons and an adjustment accuracy of 1 micron, and capable of fixing and adjusting the positions of the first chip and the second chip respectively;

[0050] A six-axis alignment platform including linear adjustment units in the X direction, Y direction, and Z direction, and angle adjustment units for pitch angle, yaw angle, and roll angle, and used to finely adjust the relative positions and angles of the chips and optical components;

[0051] A coupling lens made of optical-grade glass, with a lens diameter of 5 mm, a focal length matching a wavelength of 1550 nm, and a lens type of plano-convex lens or biconvex lens, provided between the first chip and the second chip, and used to focus and transmit the light beam emitted by the first chip to the light receiving area of the second chip;

[0052] An optical alignment mechanism used to control the relative positions between the chip, the lens, and the light beam, so that the angular deviation of the optical alignment is controlled within 1°;

[0053] An optical signal transmission module used to detect and optimize the optical signal transmission between chips, so that the transmission efficiency of the optical signal between chips reaches more than 90% under standard conditions.

[0054] The beneficial effects of the present invention are as follows:

[0055] The present invention provides a device and method for realizing interconnection between chips on different material platforms. Aiming at the problems of low alignment accuracy, poor adaptability, unstable structure, etc. existing in the prior art, by introducing a six-axis alignment platform, a high-precision slide rail structure, a chip fixture and an optical lens coupling component, multi-dimensional precise adjustment of the spatial position and angle of the chip and the lens is realized. This method effectively solves the differences in optical characteristics, packaging structure and process compatibility of different material chips, and provides a solution with strong universality and high repeatability for efficient optical interconnection between heterogeneous platforms.

[0056] Through precise adjustment of the chip in the XYZ directions and the pitch, yaw and roll angles, the light beam emitted by the chip can be stably focused and accurately aligned with the light receiving area of the receiving chip, significantly reducing the dependence on the chip processing accuracy and improving the coupling efficiency. The present invention uses an optical lens as an intermediate coupling element to enable effective transition of the light beam between chips of different materials, reducing the energy loss caused by mode mismatch. At the same time, combined with the structural design of the slide rail and the fixture, the chip position has controllable coarse adjustment and fine adjustment capabilities, improving the adjustment range and adjustment resolution of the entire device.

[0057] In addition, after the chip alignment is completed, the device fixes the positions of each component by mechanical locking or electronic locking methods to ensure the stability of the chip interconnection structure in the actual operating environment is not disturbed. The entire method and device structure are compact and easy to operate, and are suitable for both chip interconnection research in the laboratory environment and can be extended to large-scale photon packaging and integrated manufacturing processes. Generally speaking, the present invention improves the accuracy, efficiency and stability of optical interconnection between heterogeneous chips, and has good practicality and engineering promotion prospects. Description of the Drawings

[0058] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0059] Figure 1 is a flowchart of a method for realizing interconnection between chips on different material platforms proposed by the present invention;

[0060] Figure 2 is a schematic structural diagram of optical interconnection between different material chips of the present invention. Detailed Embodiments

[0061] Now, the present invention will be further described in detail with reference to the drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner, so they only show the components related to the present invention.

[0062] Reference Figure 1-2 , a method for realizing the interconnection between chips on different material platforms, comprising the following steps:

[0063] S1. Provide a first chip and a second chip, and fix the first chip and the second chip in a chip fixture provided with a slide rail. The chip fixture can move in the XYZ directions and adjust the angle;

[0064] S2. Set a coupling lens between the first chip and the second chip to initially align the optical axis of the lens with the emission beam of the first chip and the receiving area of the second chip;

[0065] S3. Adjust the position of the chip fixture so that the emission beam of the first chip is aligned with the center of the lens, and the outgoing beam of the lens is aligned with the receiving area of the second chip;

[0066] S4. Use a six-axis alignment platform to finely adjust the spatial positions, pitch angles, yaw angles, and roll angles of the first chip, the second chip, and the lens;

[0067] S5. Transmit a test optical signal and use a detection device to monitor the intensity of the optical signal received by the second chip;

[0068] S6. According to the monitoring results, continue to adjust the positions and angles of the first chip, the second chip, and the lens until the set requirements are met;

[0069] S7. Lock the positions of the chip fixture and the lens;

[0070] S8. Conduct a final test to confirm that the optical signal is emitted by the first chip and transmitted to the second chip through the lens.

[0071] In the present invention, by setting a chip fixture and a slide rail structure that can move in the XYZ directions and adjust the angle, the flexible and controllable adjustment of the chip position is realized, the accuracy of the initial alignment of the chips is significantly improved, and the requirements for the manufacturing and processing accuracy of the chips are reduced; the lens coupling method is adopted, and the initial beam alignment and focusing are carried out through an optical lens, which enhances the optical compatibility between the chips, reduces the mode mismatch and transmission loss of the optical signal; the six-axis alignment platform is used to finely adjust the spatial positions and angles of the chips and the lens, effectively improving the accuracy and stability of the optical interconnection between the chips; the chip interconnection effect is monitored in real time by combining the test optical signal, and the alignment state is continuously optimized according to the feedback results to ensure that the optical signal transmission efficiency reaches the predetermined standard; after the alignment is completed, by locking the positions of the chip fixture and the lens, the position shift is avoided under long-term use or environmental change conditions, thereby improving the reliability of the chip interconnection structure. Generally speaking, the method of the present claim can realize the efficient, stable and accurate optical interconnection between chips on different material platforms.

[0072] In this embodiment, the S2 specifically includes:

[0073] S21. Provide a coupling lens and set it on the optical transmission path between the first chip and the second chip, so that the emitted light beam of the first chip is transmitted to the light receiving end of the second chip after passing through the lens;

[0074] S22. Adjust the position of the lens in the X direction to align the optical axis of the lens with the center of the light beam emitted by the first chip;

[0075] S23. Adjust the position of the lens in the Y direction so that the light beam can evenly cover the light receiving area of the second chip after passing through the lens;

[0076] S24. Adjust the position of the lens in the Z direction so that the light beam forms a minimum light spot at the focal point after passing through the lens and coincides with the light receiving surface of the second chip;

[0077] S25. Rotate the pitch angle α of the lens to adjust the propagation angle of the light beam so that the light beam propagates along the set direction after passing through the lens;

[0078] S26. Rotate the yaw angle β of the lens to adjust the propagation path of the light beam so that the light beam is incident at the center position of the light receiving surface of the second chip after passing through the lens;

[0079] S27. Rotate the roll angle γ of the lens to adjust the polarization direction of the light beam so that its incident direction meets the optical incident requirements of the second chip;

[0080] S28. After completing the position and angle adjustment of the lens, fix the lens to prevent its position from changing.

[0081] In the present invention, by precisely adjusting the position of the coupling lens in the XYZ directions and the pitch, yaw, and roll angles, the optical axis of the lens is precisely matched with the light beam path between the chips, effectively improving the optical signal coupling efficiency between the chips; through fine-tuning in the X and Y directions, it is ensured that the light beam is accurately focused on the center of the light receiving area of the chip and uniform coverage of the light beam is achieved; through the adjustment of the position in the Z direction, precise focusing of the light spot is realized, further reducing the loss of optical signals during transmission; through the adjustment of the pitch angle, yaw angle, and roll angle of the lens, the incident direction and polarization state of the light beam are optimized, effectively improving the stability and adaptability of the optical interconnection between the chips; after completing all the adjustments, the position of the lens is firmly fixed to prevent position deviation caused by environmental changes or vibrations and other factors, thereby significantly improving the long-term reliability and stability of the chip interconnection device in practical applications.

[0082] In this embodiment, the specific content of S4 includes:

[0083] S41. Provide a six-axis alignment platform, which includes an X-direction movement unit, a Y-direction movement unit, a Z-direction movement unit, a pitch angle adjustment unit, a yaw angle adjustment unit, and a roll angle adjustment unit;

[0084] S42. Adjust the X-direction position of the first chip to align the center of the emitted light beam of the first chip with the optical axis center of the lens, and adjust the X-direction position of the second chip to align the center of the light beam after focusing by the lens with the center of the light receiving area of the second chip;

[0085] S43. Adjust the Y-direction position of the first chip so that the incident position of its emitted light beam at the lens meets the preset parameters, and adjust the Y-direction position of the second chip so that the light beam emitted from the lens evenly covers the light receiving area of the second chip;

[0086] S44. Adjust the Z-direction positions of the first chip and the second chip so that the emitted light beam of the first chip can be incident on the light receiving surface of the second chip after being focused by the lens, and adjust the Z-direction position of the lens so that the focal point is located on the light receiving surface of the second chip;

[0087] S45. Adjust the pitch angle α1 of the first chip and the pitch angle α2 of the second chip so that the light beam propagation direction and the optical axis direction of the lens meet the preset angle, and adjust the pitch angle α of the lens T so that the optical axis of the lens is consistent with the light beam propagation direction;

[0088] S46. Adjust the yaw angle β1 of the first chip and the yaw angle β2 of the second chip so that the emitted light beam of the first chip propagates in the set direction after passing through the lens, and adjust the yaw angle β of the lens T so that the light beam propagation direction after the lens meets the set parameters;

[0089] S47. Adjust the roll angle γ1 of the first chip and the roll angle γ2 of the second chip so that the polarization direction of the emitted light beam of the first chip meets the light receiving requirements of the second chip, and adjust the roll angle γ of the lens T so that the polarization direction of the light beam emitted from the lens meets the set requirements;

[0090] S48. After completing the position and angle adjustments of the first chip, the second chip, and the lens, fix the positions of the first chip fixture, the second chip fixture, and the lens so that their relative positions remain stable during subsequent operations.

[0091] In the present invention, by adopting a six-axis alignment platform, the chip and the lens are precisely adjusted in the X, Y, and Z directions, as well as in the pitch angle, yaw angle, and roll angle, so that the emitted light beam of the chip is accurately aligned with the optical axis of the lens, effectively improving the accuracy of optical coupling between chips; the precise adjustment of the positions in the X and Y directions ensures the accurate matching of the light beam with the chip receiving area, realizing the efficient transmission and coverage of the light beam; the adjustment in the Z direction realizes the accurate focusing of the light beam, reducing the signal loss during the transmission process; the precise adjustment of the pitch angle, yaw angle, and roll angle of the chip and the lens enables both the propagation direction and the polarization direction of the light beam to reach the optimal incident state, enhancing the stability and compatibility of optical communication between chips; finally, by fixing the positions of the chip fixture and the lens, the position offset caused by subsequent environmental factors is avoided, further enhancing the long-term stability and reliability of the optical interconnection device.

[0092] In this embodiment, the S7 specifically includes:

[0093] S71. Provide a locking mechanism, the locking mechanism includes a mechanical locking component and an electronic locking component, the mechanical locking component is used to fix the first chip fixture and the second chip fixture, and the electronic locking component is used to record the final positions of the chip and the lens;

[0094] S72. After the precise alignment of the first chip, the second chip, and the lens is completed, lock the first chip fixture so that its positions in the XYZ directions and the angles of the pitch angle, yaw angle, and roll angle remain unchanged;

[0095] S73. Lock the second chip fixture so that its positions in the XYZ directions and the angles of the pitch angle, yaw angle, and roll angle are aligned with the first chip;

[0096] S74. Lock the position of the lens so that the relative positions of its optical axis with the emitted light beam of the first chip and the light receiving area of the second chip are fixed and prevent offset during subsequent use;

[0097] S75. Fix the chip fixture by using the mechanical locking component, the mechanical locking component includes a locking bolt, a positioning pin, or a spring clamp, and when locking, the movement of the fixture is restricted by tightening the bolt or inserting the positioning pin;

[0098] S76. Lock the lens by using the electronic locking component, the electronic locking component includes a position sensor and an electromagnetic locking mechanism, the position sensor is used to record the position data of the lens, and the electromagnetic locking mechanism is used to keep the lens in a fixed state after reaching the set position;

[0099] S77. After the locking mechanism completes the operation, position verification is performed, including using a position sensor to detect the XYZ coordinates and angular values of the first chip, the second chip, and the lens after locking, and comparing the recorded data before locking;

[0100] S78. If the position verification result meets the preset standard, the locking process is completed; otherwise, the locking is released, the positions of the first chip, the second chip, and the lens are readjusted, and the locking operation is performed again.

[0101] Through the combination of a mechanical locking component and an electronic locking component, the present invention realizes the precise and reliable fixation of the chip fixture and the lens position; the mechanical locking component can effectively prevent position deviation caused by mechanical vibration or external interference through bolts, positioning pins, or spring clamps; the electronic locking component uses a position sensor to record the precise position information of the chip and the lens in real time, and stabilizes the position of the lens through an electromagnetic locking mechanism, further ensuring the position stability of the device under environmental change conditions; through the position verification step after locking, position errors can be detected and corrected in a timely manner, so as to ensure that the optical alignment between chips continuously maintains a precise state during long-term operation; if the position verification does not meet the standard, it can be readjusted and locked again in a timely manner to ensure the stability, reliability, and long-term operation effect of the optical interconnection between chips.

[0102] A device for realizing interconnection between chips on different material platforms, comprising:

[0103] A base, which is made of aluminum alloy or steel, has a size of 150 mm in length, 100 mm in width, and 10 mm in thickness, and is used to provide a stable support structure;

[0104] A vertical bracket, which is made of stainless steel or carbon fiber material, is arranged on the base, has a height of 200 mm and a diameter of 10 mm, and is fixed to the base by screws or welding;

[0105] A slide rail structure, which is arranged on the vertical bracket, is made of stainless steel or aluminum material, has an adjustment range of 50 mm, and is used to achieve high-precision displacement adjustment during the chip alignment process;

[0106] A chip fixture, which is installed on a six-axis alignment platform, is made of PEEK material, has a clamping force controlled between 5 and 10 Newtons, and has an adjustment accuracy of 1 micron, and can fix and adjust the positions of the first chip and the second chip respectively;

[0107] A six-axis alignment platform, which includes linear adjustment units in the X direction, Y direction, and Z direction, and angle adjustment units for pitch angle, yaw angle, and roll angle, and is used to finely adjust the relative positions and angles of the chip and the optical component;

[0108] Coupling lens, which is made of optical-grade glass, has a lens diameter of 5 mm, a focal length matching the 1550-nm wavelength, and a lens type of plano-convex lens or biconvex lens. It is set between the first chip and the second chip to focus and transmit the light beam emitted by the first chip to the light receiving area of the second chip;

[0109] Optical alignment mechanism, which is used to control the relative positions among the chips, the lens, and the light beam, and control the angular deviation of the optical alignment within 1°;

[0110] Optical signal transmission module, which is used to detect and optimize the optical signal transmission between chips, so that the transmission efficiency of the optical signal between chips reaches more than 90% under standard conditions.

[0111] Embodiment 1:

[0112] To verify the feasibility of the present invention in implementation, the present invention is applied to the optical communication laboratory of an optoelectronic research institute to improve the optical signal transmission efficiency, stability, and alignment accuracy between chips. This laboratory studies the high-speed data transmission of heterogeneous chips, involving the high-precision optical interconnection of silicon-based chips and InP-based chips. In traditional chip interconnection methods, due to chip manufacturing errors, insufficient alignment accuracy, and environmental factor impacts, the optical signal loss is large, resulting in the signal transmission efficiency usually being difficult to exceed 80%, and the stability is not good during long-term operation. Especially under the conditions of slight vibration and environmental temperature changes in the laboratory, the efficiency is significantly reduced, seriously affecting the reliability of optical communication chips.

[0113] In this embodiment, the chip interconnection device of the present invention is deployed to the above-mentioned laboratory to achieve the efficient optical signal interconnection between the silicon-based transmitting chip and the InP receiving chip. First, the two chips are fixed in a chip fixture with a high-precision slide rail and placed on a six-axis alignment platform to ensure that the chips can be precisely adjusted in position and angle. Then, an optical glass lens with a diameter of 5 mm and a focal length of 8 mm is placed between the chips to preliminarily align the light beam transmission path between the chips. The researchers then use the six-axis alignment platform to continuously optimize the relative positions and angles of the chips and the lens through precise XYZ-direction adjustment and fine adjustment of the pitch, yaw, and roll angles, and real-time monitor the optical signal power intensity at the receiving chip end. After repeatedly adjusting to reach the ideal transmission efficiency, the chip fixture and the lens positions are fixed using mechanical locking bolts and positioning pins combined with an electromagnetic locking component.

[0114] To evaluate the performance of the present invention, the researchers conducted a 24-hour optical signal transmission test and a comparative experiment on the impact of environmental factors, covering different temperature, humidity, and vibration conditions. The specific experimental data are as follows:

[0115] Table 1 Stability test table of the transmission efficiency of the device of the present invention under environmental change conditions

[0116]

[0117] As can be seen from the data in Table 1, under the conditions of temperature, humidity and slight vibration in the laboratory, the transmission efficiency of the method of the present invention fluctuates very little and remains above 92%, indicating that the present invention has excellent adaptability to environmental factors.

[0118] In summary, through the cooperation of the six-axis alignment platform, the precision slide rail fixture and the mechatronic locking device, the present invention significantly improves the performance stability and transmission efficiency of heterogeneous chip optical interconnection, successfully solves the problems of large alignment difficulty, low transmission efficiency and insufficient stability existing in the traditional chip interconnection method, and provides a reliable and efficient optical interconnection solution for the field of optoelectronic technology.

[0119] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and all should be covered by the protection scope of the present invention.

Claims

1. A method for realizing interconnection between chips on different material platforms, characterized in that, The steps include the following: S1. Provide a first chip and a second chip, and fix the first chip and the second chip in a chip fixture provided with a slide rail. The chip fixture can move in the XYZ directions and perform angle adjustment; S2. Set a coupling lens between the first chip and the second chip to preliminarily align the optical axis of the lens with the emission beam of the first chip and the receiving area of the second chip; S3. Adjust the position of the chip fixture so that the emission beam of the first chip is aligned with the center of the lens, and the outgoing beam of the lens is aligned with the receiving area of the second chip; S4. Use a six-axis alignment platform to finely adjust the spatial positions, pitch angles, yaw angles, and roll angles of the first chip, the second chip, and the lens; S5. Transmit a test optical signal and use a detection device to monitor the intensity of the optical signal received by the second chip; S6. According to the monitoring results, continue to adjust the positions and angles of the first chip, the second chip, and the lens until the set requirements are met; S7. Lock the positions of the chip fixture and the lens; S8. Perform a final test to confirm that the optical signal is emitted from the first chip and transmitted to the second chip through the lens.

2. The method for realizing interconnection between chips on different material platforms according to claim 1, wherein The specific content of S2 includes: S21. Provide a coupling lens and set it on the optical transmission path between the first chip and the second chip, so that the emission beam of the first chip is transmitted to the optical receiving end of the second chip after passing through the lens; S22. Adjust the position of the lens in the X direction to align the optical axis of the lens with the center of the emission beam of the first chip; S23. Adjust the position of the lens in the Y direction so that the beam can evenly cover the optical receiving area of the second chip after passing through the lens; S24. Adjust the position of the lens in the Z direction so that the beam forms a minimum spot at the focus after passing through the lens and coincides with the optical receiving surface of the second chip; S25. Rotate the pitch angle α of the lens to adjust the propagation angle of the beam so that the beam propagates along a set direction after passing through the lens; S26. Rotate the yaw angle β of the lens to adjust the propagation path of the beam so that the beam is incident on the center position of the optical receiving surface of the second chip after passing through the lens; S27. Rotate the roll angle γ of the lens to adjust the polarization direction of the beam so that its incident direction meets the optical incident requirements of the second chip; S28. After completing the position and angle adjustment of the lens, fix the lens to prevent its position from changing.

3. A method for realizing interconnection between chips on different material platforms according to claim 1, characterized in that The specific content of S4 includes: S41. Provide a six-axis alignment platform, which includes an X-direction moving unit, a Y-direction moving unit, a Z-direction moving unit, a pitch angle adjustment unit, a yaw angle adjustment unit, and a roll angle adjustment unit; S42. Adjust the X-direction position of the first chip to align the center of the emission beam of the first chip with the center of the optical axis of the lens, and adjust the X-direction position of the second chip to align the center of the beam after focusing by the lens with the center of the optical receiving area of the second chip; S43. Adjust the Y-direction position of the first chip so that the incident position of its emission beam on the lens meets the preset parameters, and adjust the Y-direction position of the second chip so that the beam outgoing from the lens evenly covers the optical receiving area of the second chip; S44. Adjust the Z - direction positions of the first chip and the second chip so that the emitted light beam of the first chip can be incident on the light - receiving surface of the second chip after being focused by the lens, and adjust the Z - direction position of the lens so that the focal point is located on the light - receiving surface of the second chip; S45. Adjust the pitch angle α1 of the first chip and the pitch angle α2 of the second chip to make the beam propagation direction conform to the preset angle with the lens optical axis direction, and adjust the pitch angle α of the lens T so that the optical axis of the lens is consistent with the beam propagation direction; S46. Adjust the yaw angle β1 of the first chip and the yaw angle β2 of the second chip so that the emission beam of the first chip propagates in a set direction after passing through the lens, and adjust the yaw angle β of the lens T so that the propagation direction of the beam after the lens conforms to the set parameters; S47. Adjust the roll angle γ1 of the first chip and the roll angle γ2 of the second chip so that the polarization direction of the light beam emitted by the first chip meets the light reception requirements of the second chip, and adjust the roll angle γ of the lens T so that the polarization direction of the light beam emerging from the lens meets the set requirements; S48. After completing the position and angle adjustments of the first chip, the second chip, and the lens, fix the positions of the first - chip fixture, the second - chip fixture, and the lens to keep their relative positions stable during subsequent operations.

4. A method for realizing interconnection between chips on different material platforms according to claim 1, characterized in that, The specific steps of S7 include S71. Provide a locking mechanism, which includes a mechanical locking component and an electronic locking component. The mechanical locking component is used to fix the first - chip fixture and the second - chip fixture, and the electronic locking component is used to record the final positions of the chip and the lens; S72. After completing the precise alignment of the first chip, the second chip, and the lens, lock the first - chip fixture so that its position in the XYZ directions and the angles of pitch, yaw, and roll remain unchanged; S73. Lock the second - chip fixture so that its position in the XYZ directions and the angles of pitch, yaw, and roll are in an alignment relationship with the first chip; S74. Lock the position of the lens so that the relative positions of its optical axis with respect to the emitted light beam of the first chip and the light - receiving area of the second chip are fixed and prevent displacement during subsequent use; S75. Fix the chip fixture using the mechanical locking component. The mechanical locking component includes a locking bolt, a positioning pin, or a spring clamp. When locking, restrict the movement of the fixture by tightening the bolt or inserting the positioning pin; S76. Lock the lens using the electronic locking component. The electronic locking component includes a position sensor and an electromagnetic locking mechanism. The position sensor is used to record the position data of the lens, and the electromagnetic locking mechanism is used to keep the lens in a fixed state after reaching the set position; S77. After the locking mechanism completes the operation, perform position verification, including using a position sensor to detect the XYZ coordinates and angle values of the locked first chip, second chip, and lens, and comparing with the recorded data before locking; S78. If the position - verification result meets the preset standard, complete the locking process; otherwise, unlock and readjust the positions of the first chip, the second chip, and the lens, and then perform the locking operation again.

5. A device for realizing interconnection between chips on different material platforms, which executes the method for detecting malicious traffic in the Internet of Things according to any one of claims 1 to 4, characterized in that, It includes: A base, which is made of aluminum alloy or steel, with dimensions of 150 mm in length, 100 mm in width, and 10 mm in thickness, and is used to provide a stable support structure; A vertical bracket, which is made of stainless steel or carbon fiber material, is provided on the base. The height of the bracket is 200 mm and the diameter is 10 mm, and it is fixed to the base by screws or welding; A slide - rail structure, which is set on the vertical bracket, is made of stainless steel or aluminum material, has an adjustment range of 50 mm, and is used to achieve high - precision displacement adjustment during chip alignment; Chip fixtures, which are installed on a six - axis alignment platform, are made of PEEK material, with the clamping force controlled between 5 and 10 Newtons and having an adjustment accuracy of 1 micron, and can respectively fix and adjust the positions of the first chip and the second chip; Six-axis alignment platform, the six-axis alignment platform includes linear adjustment units in the X direction, Y direction, and Z direction, as well as angle adjustment units for pitch angle, yaw angle, and roll angle, and is used for fine-tuning the relative position and angle of the chip and the optical component; Coupling lens, the coupling lens is made of optical-grade glass, the lens diameter is 5 mm, the focal length matches the 1550 nm wavelength, the lens type is plano-convex lens or biconvex lens, and is arranged between the first chip and the second chip, and is used for focusing and transmitting the light beam emitted by the first chip to the light receiving area of the second chip; Optical alignment mechanism, the optical alignment mechanism is used to control the relative position between the chip, the lens, and the light beam, so that the angular deviation of the optical alignment is controlled within 1°; Optical signal transmission module, the optical signal transmission module is used to detect and optimize the optical signal transmission between chips, so that the transmission efficiency of the optical signal between chips reaches more than 90% under standard conditions.

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