Semiconductor transport vehicle obstacle avoidance device and semiconductor manufacturing and carrying system

Abstract

The invention relates to a semiconductor transport vehicle obstacle avoidance device and a semiconductor manufacturing and carrying system, and a turning detection part is arranged at a first position of a transport vehicle and is used for sending out a wireless detection signal for detecting whether an obstacle exists in a target area or not; the turning inner side of the transport vehicle comprises at least one target obstacle; the shielding part is arranged on at least one target obstacle and used for preventing generation of a target reverse signal generated according to the wireless detection signal in the process that the transport vehicle approaches the at least one target obstacle, and the target area is higher than the top surface of the semiconductor material box; the control part is connected with the turning detection part and used for controlling the transport vehicle to decelerate and avoid the obstacle when receiving the target return signal of the obstacle in the target area, and at least the accident that the transport vehicle is parked by mistake due to the fact that the transport vehicle is close to the obstacle in the turning process can be effectively avoided.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technologies, and particularly to an obstacle avoidance device for a semiconductor transport vehicle and a semiconductor manufacturing handling system. Background Art

[0002] The Automated Material Handling System (AMHS) is a core technology for efficient and precise material handling in semiconductor manufacturing, and is widely used in wafer manufacturing, packaging and testing, etc. AMHS includes an OverHead-Hoist-Transportation (OHT) system, Rail Guided Vehicle (RGV), Automated Guided Vehicle (AGV), stacker crane, etc.

[0003] In a semiconductor device production factory, different production equipment is partitioned, and materials are transported between different areas through an OHT and a trolley traveling between different areas. When the RGV is moving, it needs to intelligently detect and judge surrounding obstacles to avoid collisions.

[0004] In traditional technologies, when the RGV turns, it inevitably gets close to obstacles, which easily induces false detection and leads to false stop events, seriously affecting the efficiency, intelligence, and reliability of the semiconductor automated material handling system. Summary of the Invention

[0005] Based on this, in view of the technical problems in the above background art, it is necessary to provide an obstacle avoidance device for a semiconductor transport vehicle and a semiconductor manufacturing handling system, which can at least effectively avoid false stop events caused by the transport vehicle getting too close to obstacles during the turning process.

[0006] One aspect of this application provides an obstacle avoidance device, including a turning detection unit, a shielding component, and a control unit.

[0007] The turning detection unit is arranged at a first position of the transport vehicle and is configured to emit a wireless detection signal for detecting whether there are obstacles in a target area; at least one target obstacle is included on the inner side of the turn of the transport vehicle; the shielding component is arranged on at least one target obstacle and is used to prevent the generation of a target return signal generated according to the wireless detection signal during the process of the transport vehicle approaching at least one target obstacle, and the target area is higher than the top surface of the semiconductor material box on the inner side of the turn of the transport vehicle; the control unit is connected to the turning detection unit and is used to control the transport vehicle to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area.

[0008] The obstacle avoidance device in the above embodiments sets a shielding component on the target obstacle that the transport vehicle turns close to, and sets a turning detection unit at the first position of the transport vehicle. The turning detection unit emits a wireless detection signal for detecting whether there is an obstacle in the target area, and the target area is higher than the top surface of the semiconductor material box on the inner side of the transport vehicle's turn; during the process that the transport vehicle approaches at least one target obstacle on the inner side of the turn, the shielding component on the target obstacle is used to prevent the generation of a target return signal generated according to the wireless detection signal, so as to avoid the control unit connected to the turning detection unit controlling the transport vehicle to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area, effectively avoiding the occurrence of misstop events due to the transport vehicle being close to the obstacle during the turning process. Since in this embodiment, only the shielding component is set on the target obstacle that the transport vehicle turns close to, the obstacles that the transport vehicle approaches without the shielding component during the turning process can still trigger the deceleration and obstacle avoidance action of the transport vehicle. Compared with the traditional technical solution of changing the graphic of the obstacle detection target area of the transport vehicle, the complexity and cost of the technical solution in this embodiment are significantly reduced. And this embodiment can be widely applied to a variety of different complex application scenarios, and can meet the complex and changeable process scenario requirements of the semiconductor manufacturing handling system.

[0009] In some embodiments, the target area starts from the emission surface of the turning detection unit; the target area includes a first deceleration area, a second deceleration area, and a third deceleration area that are sequentially distributed in the direction away from the emission surface of the turning detection unit and do not overlap each other; the target return signals of the obstacles in the first deceleration area, the second deceleration area, and the third deceleration area trigger the driving speed of the transport vehicle to increase in sequence. By setting the target area to start from the emission surface of the turning detection unit, extend in the direction away from the emission surface of the turning detection unit, and setting the target area to include the first deceleration area, the second deceleration area, and the third deceleration area that are sequentially distributed in the direction away from the emission surface of the turning detection unit and do not overlap each other, and the target return signals of the obstacles in the first deceleration area, the second deceleration area, and the third deceleration area trigger the driving speed of the transport vehicle to increase in sequence, it can be realized that, for example, the target return signal of the obstacle in the first deceleration area triggers the transport vehicle to stop, the target return signal of the obstacle in the second deceleration area triggers the transport vehicle to decelerate to low-speed driving, and the target return signal of the obstacle in the third deceleration area triggers the transport vehicle to decelerate to medium-speed driving, so as to realize intelligent obstacle avoidance detection during the normal driving process and effectively avoid the occurrence of misstop events due to the transport vehicle being close to the obstacle during the turning process.

[0010] In some embodiments, the target area starts from the emission surface of the turning detection unit and extends in a direction away from the emission surface; the target area includes a first deceleration area, and a second deceleration area and a third deceleration area that are sequentially distributed and non-overlapping in the direction away from the emission surface. The target return signals of the obstacles in the first deceleration area, the second deceleration area, and the third deceleration area trigger the driving speed of the transport vehicle to increase in sequence; both the first deceleration area and the second deceleration area start from the emission surface of the turning detection unit. It is convenient to set the detection range of the first deceleration area according to the closest distance to the obstacle in the specific turning scenario of the transport vehicle, and at the same time, it can avoid the event that the obstacle in the second deceleration area cannot be effectively detected due to the too small detection range of the first deceleration area.

[0011] In some embodiments, the target return signal of the obstacle in the first deceleration area triggers the transport vehicle to stop, avoiding the event of damage to the transport vehicle and / or the semiconductor device caused by the transport vehicle hitting the obstacle.

[0012] In some embodiments, the turning detection unit includes a radar sensor, a laser sensor, an infrared sensor, or a combination thereof, which is convenient for using at least one of the wireless detection signals emitted by the radar sensor, the laser sensor, the infrared sensor, etc. to intelligently detect the obstacles around the transport vehicle and avoid the event of touching / hitting the obstacle.

[0013] In some embodiments, the shielding component includes an absorbing material and / or a wireless detection signal absorbing material, which uses the absorbing material and / or the wireless detection signal absorbing material to absorb the wireless detection signal or reduce the reflectivity of the wireless detection signal, avoiding the generation of a target return signal of the target obstacle according to the wireless detection signal, and avoiding the control unit connected to the turning detection unit from controlling the transport vehicle to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area, effectively avoiding the event of mis-stopping due to the transport vehicle being close to the obstacle during the turning process.

[0014] In some embodiments, the obstacle avoidance device further includes a straight-line detection unit, which is arranged at the second position of the transport vehicle, connected to the control unit, and configured to emit a wireless detection signal for detecting whether there is an obstacle in the straight-line detection area of the transport vehicle; the second position of the transport vehicle is located between the bottom surface and the top surface of the semiconductor material box, and the extending direction of the straight-line detection area is consistent with the straight-line direction of the transport vehicle; the straight-line detection area is lower than the top surface of the semiconductor material box, higher than the bottom surface of the semiconductor material box, and does not touch the semiconductor material box outside the straight-line path of the transport vehicle. It is convenient to use the straight-line detection unit to intelligently detect the obstacles in the straight-line detection area of the transport vehicle during the straight-line driving process of the transport vehicle, and avoid the event of damage to the transport vehicle and / or the semiconductor device.

[0015] In some embodiments, the straight-line detection area starts from the emission surface of the straight-line detection unit; the straight-line detection area includes a first detection area, a second detection area, and a third detection area that are sequentially distributed in the direction away from the emission surface of the straight-line detection unit and do not overlap with each other; the target return signals of obstacles in the first detection area, the second detection area, and the third detection area trigger the traveling speed of the transport vehicle to increase sequentially, and are less than the normal straight-line speed value of the transport vehicle during the period when obstacle avoidance deceleration is not triggered. By setting the straight-line detection area to start from the emission surface of the straight-line detection unit, extend in the direction away from the emission surface of the straight-line detection unit, and setting the straight-line detection area to include a first detection area, a second detection area, and a third detection area that are sequentially distributed in the direction away from the emission surface of the straight-line detection unit and do not overlap with each other, and the target return signals of obstacles in the first detection area, the second detection area, and the third detection area trigger the traveling speed of the transport vehicle to increase sequentially, and are less than the normal straight-line speed value of the transport vehicle during the period when obstacle avoidance deceleration is not triggered, it is possible to achieve, for example, the target return signal of an obstacle in the first detection area triggering the transport vehicle to stop, the target return signal of an obstacle in the second detection area triggering the transport vehicle to decelerate to a low speed, and the target return signal of an obstacle in the third detection area triggering the transport vehicle to decelerate to a medium speed, so as to realize intelligent obstacle avoidance detection during normal straight-line driving and effectively avoid the occurrence of false stop events due to the transport vehicle being close to an obstacle during turning.

[0016] In some embodiments, the control unit is configured to: if the target return signal of an obstacle in the straight-line detection area is not obtained, control the transport vehicle to travel at a first speed; if the target return signal of the obstacle in the third detection area is obtained, control the transport vehicle to travel at a second speed; if the target return signal of an obstacle in the second detection area is obtained, control the transport vehicle to travel at a third speed; if the target return signal of an obstacle in the first detection area is obtained, control the transport vehicle to travel at a fourth speed; wherein, the first speed > the second speed > the third speed > the fourth speed.

[0017] In some embodiments, the fourth speed is the stop speed.

[0018] In some embodiments, the control unit is configured to: determine the type of path that the transport vehicle is about to pass through according to the map data of the semiconductor manufacturing automatic material handling system and the position data of the transport vehicle; if the type of path that the transport vehicle is about to pass through is a straight path, control the transport vehicle to decelerate and avoid obstacles during straight-line driving according to the detection result of the straight-line detection unit; if the type of path that the transport vehicle is about to pass through is a turning path, control the transport vehicle to decelerate and avoid obstacles during turning according to the detection result of the turning detection unit. Avoid the transport vehicle triggering the turning detection function during straight-line driving, and avoid the transport vehicle triggering the straight-line detection function during turning.

[0019] In some embodiments, another aspect of the present application provides a semiconductor manufacturing handling system, including a transport vehicle, an overhead track for the transport vehicle to travel, the transport vehicle stores and retrieves the semiconductor material boxes it transports at the workstations of corresponding processes, and an obstacle avoidance device in any embodiment of the present application; the turning detection part of the obstacle avoidance device is arranged on the transport vehicle, and the shielding component of the obstacle avoidance device is arranged on the target obstacle close to the turning of the transport vehicle. By arranging the turning detection part at the first position of the transport vehicle and using the turning detection part to emit a wireless detection signal for detecting whether there is an obstacle in the target area, during the process of the transport vehicle approaching at least one target obstacle, the shielding component on the target obstacle is used to prevent the generation of a target return signal generated according to the wireless detection signal, avoiding the control part connected to the turning detection part from controlling the transport vehicle to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area, effectively avoiding the occurrence of false parking events due to the transport vehicle being too close to the obstacle during the turning process. Obstacles without shielding components that the transport vehicle approaches during the turning process can still trigger the decelerating and obstacle avoidance actions of the transport vehicle. Compared with the traditional technical solution of changing the graphic of the obstacle detection target area of the transport vehicle, this embodiment significantly reduces the complexity and cost of the technical solution, and effectively improves the efficiency, intelligence and reliability of the semiconductor automatic handling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 It is a schematic diagram of the application scenario of an obstacle avoidance device provided in an embodiment of the present application;

[0022] Figure 2 It is a schematic diagram of the working principle of an obstacle avoidance device provided in an embodiment of the present application;

[0023] Figure 3 It is a schematic diagram of the target area of the turning detection part in an obstacle avoidance device provided in an embodiment of the present application;

[0024] Figure 4 It is a schematic diagram of the target area of the turning detection part in an obstacle avoidance device provided in another embodiment of the present application;

[0025] Figure 5 It is a schematic diagram of the application scenario of an obstacle avoidance device provided in another embodiment of the present application;

[0026] Figure 6 ForFigure 5 Schematic diagram of the working principle of the obstacle avoidance device

[0027] Figure 7 Schematic diagram of the straight-line detection area of the straight-line detection part in an obstacle avoidance device provided in an embodiment of the present application

[0028] Figure 8 Schematic diagram of a transport vehicle in an obstacle avoidance device provided in an embodiment of the present application

[0029] Wherein:

[0030] 100, obstacle avoidance device; 200, transport vehicle; 101, turning detection part; 102, shielding component; 103, control part; 104, straight-line detection part; 1011, target area; 1041, straight-line detection area; 300, semiconductor material box; 400, target obstacle; FU1, first deceleration area; FU2, first deceleration area; FU1, first deceleration area; FU2, second deceleration area; FU3, third deceleration area; FD1, first detection area; FD2, second detection area; FD3, third detection area; 10, transverse movement mechanism; 20, lifting mechanism; 30, clamping mechanism; 40, traveling mechanism. Detailed implementation manners

[0031] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0033] When using "including", "having", and "comprising" described herein, unless a clear limiting term is used, such as "only", "consisting of", etc., another component can also be added. Unless otherwise mentioned, terms in the singular form can include the plural form and should not be construed as having a quantity of one.

[0034] In this application, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In addition, terms such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features.

[0036] With the substantial increase in the market demand for integrated circuit products, most semiconductor manufacturing enterprises prioritize improving production capacity and qualification rate. In semiconductor manufacturing enterprises, wafers are usually transported in batches. However, manual transportation not only has low efficiency but also is prone to danger, and there are uncertain factors such as chip contamination and chip damage during the transportation process. To address the risks and uncertainties brought by manual transportation, AMHS has emerged and has been widely used in the semiconductor manufacturing industry.

[0037] In the track system of AMHS, including turnout tracks, turning tracks, and complex environmental layout settings around the tracks, etc., it is almost necessary to set detection sensors such as radars that match the shape of the detection area for each position where the transport vehicle turns or approaches an obstacle such as a wall during driving. This makes the software or firmware configuration related to obstacle detection very complex. When the equipment layout on and near the tracks changes, the costs of modification, debugging, and maintenance are very high, and the efficiency is low.

[0038] In addition, during the turning process of the transport vehicle, it will inevitably be close to the obstacle, which will trigger the obstacle avoidance action and even cause false parking. If the detection area pattern of the detection sensor during turning is specifically reduced, the safety during non-turning operation will be reduced.

[0039] The present application aims to provide an obstacle avoidance device for a semiconductor transport vehicle and a semiconductor manufacturing handling system, which can avoid triggering false detection and parking events without reducing the detection area pattern of the detection sensor during turning, improve the maintenance efficiency, and ensure a larger and safer detection area pattern range.

[0040] Please refer to Figures 1-2, in some embodiments, the present application provides an obstacle avoidance device 100, including a turning detection unit 101, a shielding component 102, and a control unit 103. The turning detection unit 101 is disposed at a first position of the transport vehicle 200 and is configured to emit a wireless detection signal for detecting whether there is an obstacle in the target area 1011. The extending direction of the target area 1011 (for example, the oq direction) is higher than the top surface of the semiconductor material box 300; on the same side of the moving direction of the transport vehicle 200 and the target area 1011, there is at least one target obstacle 400, that is, the target obstacle 400 close to the inner side of the turn when the transport vehicle 200 turns. The extending direction of the target obstacle 400 may intersect with the target area 1011. In this embodiment, the target obstacle 400 may be a column, a wall, a hanging object, etc.; the shielding component 102 is disposed on at least one target obstacle 400 and is configured to prevent the generation of a target return signal generated according to the wireless detection signal during the process of the transport vehicle 200 approaching at least one target obstacle 400. The target area 1011 is higher than the top surface of the semiconductor material box 300; the control unit 103 is connected to the turning detection unit 101 and is configured to control the transport vehicle 200 to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area 1011.

[0041] As an example, please continue to refer to Figures 1-2 , the turning detection unit 101 includes a radar sensor, a laser sensor, an infrared sensor, or a combination thereof, facilitating the intelligent detection of obstacles around the transport vehicle 200 by using the wireless detection signal emitted by at least one of the radar sensor, the laser sensor, the infrared sensor, etc., and avoiding the occurrence of events of touching / hitting obstacles.

[0042] As an example, please continue to refer to Figures 1-2 , the shielding component 102 includes an absorbing material and / or a wireless detection signal absorbing material, using the absorbing material and / or the wireless detection signal absorbing material to absorb the wireless detection signal or reduce the reflectivity of the wireless detection signal, avoiding the target obstacle 400 from causing the generation of a target return signal according to the wireless detection signal, and avoiding the control unit 103 connected to the turning detection unit 101 from controlling the transport vehicle 200 to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area 1011, effectively avoiding the occurrence of false parking events due to the transport vehicle 200 being close to the obstacle during the turning process.

[0043] As an example, the absorbing material or the wireless detection signal absorbing material may include one or more of carbon nanotubes, nano metal powders, ferrite materials, carbon-based materials, polycrystalline iron fibers, and ceramic materials, etc., to achieve the radar, infrared, and visible light stealth functions.

[0044] As an example, on the surface where the target obstacle may come into contact with the wireless detection signal, an electromagnetic wave absorbing material or a wireless detection signal absorbing material can be covered or attached to avoid or effectively reduce the target return signal caused by the wireless detection signal contacting the target obstacle, thereby achieving the stealth function for the target obstacle.

[0045] As an example, please continue to refer to Figures 1-2 , the turning detection unit 101 includes an infrared emission unit and an infrared reception unit. In the corresponding shielding component 102, the infrared reception unit is turned off, covered or removed to prevent the corresponding target obstacle 400 from triggering an obstacle avoidance action.

[0046] As an example, please continue to refer to Figures 1-2 , the shielding component 102 includes an electromagnetic wave absorbing material or a wireless detection signal absorbing material. By arranging an electromagnetic wave absorbing material or a wireless detection signal absorbing material on the target obstacle 400 that the transport vehicle 200 approaches during a turn, during the process of the transport vehicle 200 turning and approaching the target obstacle 400, the wireless detection signal emitted by the turning detection unit 101 is absorbed by the electromagnetic wave absorbing material or the wireless detection signal absorbing material, reducing or avoiding the target return signal, and preventing the control unit 103 connected to the turning detection unit 101 from controlling the transport vehicle 200 to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area 1011, effectively avoiding the occurrence of false stop events due to the transport vehicle 200 being close to the obstacle during the turning process.

[0047] Furthermore, the wireless detection signal emitted by the turning detection unit 101 is used to detect whether there is an obstacle in the target area 1011, where the target area 1011 is higher than the top surface of the semiconductor material box 300; since the shielding component 102 is only arranged on the target obstacle 400 that the transport vehicle 200 approaches during a turn, obstacles such as a human body or a random object that the transport vehicle 200 approaches during the turning process and do not have the shielding component 102 can still trigger the deceleration and obstacle avoidance action of the transport vehicle 200. Therefore, there is no need to reduce or modify the target area 1011 due to the presence of the target obstacle 400. Compared with the conventional technical solution of changing the shape of the obstacle detection target area 1011 of the transport vehicle 200, the complexity and cost of the technical solution in this embodiment are significantly reduced. And this embodiment can be widely applied to a variety of different complex application scenarios and can meet the complex and changeable process scenario requirements of the semiconductor manufacturing handling system.

[0048] As an example, please continue to refer to Figures 1-3, the target area 1011 starts from the emission surface s1 of the turning detection unit 101; the target area 1011 includes a first deceleration area FU1, a second deceleration area FU2, and a third deceleration area FU3 that are sequentially distributed and non-overlapping along the direction away from the emission surface s1 of the turning detection unit 101 (such as the oq direction); the illustrated oq direction is only an exemplary direction, and those skilled in the art can undoubtedly determine that the direction away from the emission surface s1 of the turning detection unit 101 includes multiple different directions, so that the target area 1011 is at least fan-shaped. The target return signals of obstacles in the first deceleration area FU1, the second deceleration area FU2, and the third deceleration area FU3 trigger the driving speed of the transport vehicle 200 to increase in sequence. The first deceleration area FU1, the second deceleration area FU2, and the third deceleration area FU3 are all areas that trigger the deceleration of the transport vehicle 200, and the trigger priorities of the third deceleration area FU3, the second deceleration area FU2, and the first deceleration area FU1 decrease in sequence, so that the transport vehicle 200 gradually decelerates to avoid unnecessary collision events caused by untimely deceleration actions. By setting the target area 1011 to start from the emission surface s1 of the turning detection unit 101 and extend along the direction away from the emission surface of the turning detection unit 101, and setting the target area 1011 to include the first deceleration area FU1, the second deceleration area FU2, and the third deceleration area FU3 that are sequentially distributed and non-overlapping along the direction away from the emission surface of the turning detection unit 101, and the target return signals of obstacles in the first deceleration area FU1, the second deceleration area FU2, and the third deceleration area FU3 trigger the driving speed of the transport vehicle 200 to increase in sequence, it can be realized that, for example, the target return signal of an obstacle in the first deceleration area FU1 triggers the transport vehicle 200 to stop, the target return signal of an obstacle in the second deceleration area FU2 triggers the transport vehicle 200 to decelerate to low-speed driving, the target return signal of an obstacle in the third deceleration area FU3 triggers the transport vehicle 200 to decelerate to medium-speed driving, and objects outside the target area 1011 do not trigger the transport vehicle 200 to decelerate, so as to realize intelligent obstacle avoidance detection during normal driving, ensure the normal high-speed driving of the transport vehicle 200, and effectively avoid the occurrence of mis-stop events due to the transport vehicle 200 being too close to an obstacle during the turning process.

[0049] As an example, please continue to refer to Figures 1-2 , Figure 4, the target area 1011 starts from the emission surface s1 of the turning detection unit 101 and extends in the direction away from the emission surface s1 of the turning detection unit 101 (e.g., the oq direction); the target area 1011 includes a first deceleration area FU1, and a second deceleration area FU2 and a third deceleration area FU3 that are sequentially distributed in the direction away from the emission surface and do not overlap with each other. The target return signals of the obstacles in the first deceleration area FU1, the second deceleration area FU2, and the third deceleration area FU3 trigger the driving speed of the transport vehicle 200 to increase in sequence; the first deceleration area FU1 and the second deceleration area FU2 both start from the emission surface of the turning detection unit 101. The first deceleration area FU1 can be set within the second deceleration area FU2, which is convenient for setting the detection range of the first deceleration area FU1 according to the closest distance to the obstacle in the specific turning scenario of the transport vehicle 200, and at the same time can avoid the event that the obstacle in the second deceleration area FU2 cannot be effectively detected due to the too small detection range of the first deceleration area FU1.

[0050] As an example, please continue to refer to Figures 1-4 , the target return signal of the obstacle in the first deceleration area FU1 triggers the transport vehicle 200 to stop, avoiding the event of damage to the transport vehicle 200 and / or the semiconductor device caused by the transport vehicle 200 hitting the obstacle.

[0051] Please refer to Figures 5-6 , in some embodiments, the obstacle avoidance device 100 further includes a straight-line detection unit 104. The straight-line detection unit 104 is disposed at the second position of the transport vehicle 200 and is connected to the control unit 103, and is used to emit a wireless detection signal for detecting whether there is an obstacle in the straight-line detection area of the transport vehicle 200; the second position of the transport vehicle 200 is located between the bottom surface and the top surface of the semiconductor material box 300. The extending direction of the straight-line detection area 1041 is consistent with the straight-line direction of the transport vehicle 200; the straight-line detection area is lower than the top surface of the semiconductor material box 300, higher than the bottom surface of the semiconductor material box 300, and does not contact the semiconductor material box 300 outside the straight-line path of the transport vehicle 200. It is convenient to use the straight-line detection unit 104 to intelligently detect the obstacles in the straight-line detection area of the transport vehicle 200 during the straight-line driving of the transport vehicle 200, avoiding the event of damage to the transport vehicle 200 and / or the semiconductor device.

[0052] As an example, please refer to Figures 5-7, the straight - line detection area 1041 starts from the emission surface s2 of the straight - line detection unit 104; the straight - line detection area 1041 includes a first detection area FD1, a second detection area FD2, and a third detection area FD3 that are sequentially distributed and non - overlapping along the direction away from the emission surface s2 of the straight - line detection unit 104 (e.g., the ov direction); the target return signals of the obstacles in the first detection area FD1, the second detection area FD2, and the third detection area FD3 trigger the driving speed of the transport vehicle 200 to increase sequentially, and are less than the normal straight - line speed value of the transport vehicle 200 during the period when obstacle - avoidance deceleration is not triggered. The shapes of the second detection area FD2 and the third detection area FD3 can be strip - shaped, and the size of the part of the first detection area FD1 close to the emission surface s2 of the straight - line detection unit 104 gradually decreases along the direction towards the emission surface s2 of the straight - line detection unit 104.

[0053] As an example, please continue to refer to Figures 5-7 , by setting that the straight - line detection area 1041 starts from the emission surface s2 of the straight - line detection unit 104, extends along the direction away from the emission surface s2 of the straight - line detection unit 104, and setting that the straight - line detection area 1041 includes a first detection area FD1, a second detection area FD2, and a third detection area FD3 that are sequentially distributed and non - overlapping along the direction away from the emission surface s2 of the straight - line detection unit 104, and the target return signals of the obstacles in the first detection area FD1, the second detection area FD2, and the third detection area FD3 trigger the driving speed of the transport vehicle 200 to increase sequentially, and are less than the normal straight - line speed value of the transport vehicle 200 during the period when obstacle - avoidance deceleration is not triggered, it can be realized that, for example, the target return signal of the obstacle in the first detection area FD1 triggers the transport vehicle 200 to stop, the target return signal of the obstacle in the second detection area FD2 triggers the transport vehicle 200 to decelerate to low - speed driving, and the target return signal of the obstacle in the third detection area FD3 triggers the transport vehicle 200 to decelerate to medium - speed driving, so as to realize intelligent obstacle - avoidance detection during normal straight - line driving and effectively avoid the event of false stopping due to the transport vehicle 200 being too close to the obstacle during turning.

[0054] As an example, the control unit is configured to: if the target return signal of the obstacle in the straight - line detection area is not obtained, control the transport vehicle to travel at a first speed; if the target return signal of the obstacle in the third detection area is obtained, control the transport vehicle to travel at a second speed; if the target return signal of the obstacle in the second detection area is obtained, control the transport vehicle to travel at a third speed; if the target return signal of the obstacle in the first detection area is obtained, control the transport vehicle to travel at a fourth speed; where the first speed > the second speed > the third speed > the fourth speed. Exemplarily, the first speed is used to indicate high - speed driving of the transport vehicle, the second speed is used to indicate medium - speed driving of the transport vehicle, the third speed is used to indicate low - speed driving of the transport vehicle, and the fourth speed is the stop speed. As an example, please continue to refer to Figures 5-7, the control unit 103 is configured to: determine the type of path that the transporter 200 will pass through according to the map data of the semiconductor manufacturing automatic material handling system and the position data of the transporter 200; if the type of path that the transporter 200 will pass through is a straight path, control the transporter 200 to decelerate and avoid obstacles while going straight according to the detection result of the straight-line detection unit 104; if the type of path that the transporter 200 will pass through is a turning path, control the transporter 200 to decelerate and avoid obstacles while turning according to the detection result of the turning detection unit 101. This can prevent the transporter 200 from triggering the turning detection function during straight-line travel and prevent the transporter 200 from triggering the straight-line detection function during turning.

[0055] Exemplarily, the control unit 103 determines the type of radar map to be called and judges whether the current running track of the transporter 200 is a straight line or a curve according to the position of the current transporter 200 and the map data of the AMHS workshop where the running track is located. Among them, the map data can be constructed according to the overhead track.

[0056] Exemplarily, the control unit 103 can adapt to curve types such as 90-degree curves, S-curves, and U-curves by only judging whether the current running track of the transporter 200 is a left turn or a right turn without judging multiple turning scenarios, which simplifies the processing method of the control program and the distinction and drawing of radar scenarios, and is convenient for modification and maintenance.

[0057] Exemplarily, the turning detection unit 101 includes an upper radar, and the straight-line detection unit 104 includes a lower radar. The upper radar and the lower radar can use the same scenario call, and the feedback signals of the upper radar and the lower radar can be collected simultaneously. The control unit 103 judges only the corresponding radar feedback signal according to the position of the transporter 200. For example, when going straight, only the front lower radar with high sensitivity and rapid response is used, and when turning, only whether the front upper radar detects an obstacle is judged.

[0058] Exemplarily, the same radar scenario can be set for multiple curves. Some curves may detect fixed obstacles around the track, such as columns, walls, or hanging objects, etc. Absorbing materials are wrapped around them, and the front upper radar can shield the absorbing materials to achieve the effect of eliminating false detections, and at the same time maintain effective detection of normal objects or personnel.

[0059] Before the dual-radar solution is used, the detection ranges required in different scenarios may be different. For example, although it is the same type of bend, there is no Overhead Buffer (OHB) or wall near Bend A, while there is an OHB or wall near Bend B. In this case, different scenarios need to be set separately, different graphics need to be drawn, and the control program also needs to determine when to call different scenarios. On the one hand, the efficiency of drawing the graphics of the detection ranges in different scenarios is low, and the development cost is high. On the other hand, when the transport vehicle travels to a specific position, the graphics matching the corresponding scenario need to be called, and the program is complex. After using this solution, the radar scenarios and graphic drawing are reduced, the workload and maintenance cost are reduced, and the control program only needs to consider fewer scenarios.

[0060] The OHB is suspended and located on both sides of the track, so that a space allowing the vehicle body to pass through is formed below the track. When going straight, the OHB has no impact on the driving of the overhead transport vehicle. The detection range of the lower radar in front of the vehicle body can be set to a certain range in front of the vehicle body. The maximum width of this range can be roughly matched with the width of the vehicle body (generally slightly wider than the width of the vehicle), and this detection range does not extend to the positions of the OHBs on both sides.

[0061] The OHB mainly includes 4 OHB columns and storage shelves. The specific setting method of the 4 OHB columns can refer to the patent document with the publication number CN212557851U and the patent name "A Hoisting Intelligent Cleaning and Storage Device". A number of storage positions are set on the storage shelves, and each storage position can place a FOUP, where the number of storage positions is determined according to the scenario and usage requirements.

[0062] Please refer to Figure 5, in some embodiments, a semiconductor manufacturing handling system is provided, including a plurality of semiconductor cassettes 300, a transport vehicle 200, an overhead track (not shown) for carrying the transport vehicle 200 to travel, the transport vehicle 200 stores and retrieves the semiconductor cassettes 300 it transports at the workstations of corresponding processes, and an obstacle avoidance device 100 in any embodiment of the present application. The semiconductor cassette 300 can be a Front Opening Unified Pod (FOUP); the turning detection unit 101 of the obstacle avoidance device 100 is disposed on the transport vehicle 200, and the shielding member 102 of the obstacle avoidance device 100 is disposed on the target obstacle 400 close to the turn of the transport vehicle 200. By setting the turning detection unit 101 at the first position of the transport vehicle 200, using the turning detection unit 101 to emit a wireless detection signal for detecting whether there is an obstacle in the target area 1011, during the process of the transport vehicle 200 approaching at least one target obstacle 400, using the shielding member 102 on the target obstacle 400 to prevent the generation of a target return signal generated according to the wireless detection signal, so as to avoid the control unit 103 connected to the turning detection unit 101 from controlling the transport vehicle 200 to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area 1011, effectively avoiding the occurrence of mis-stop events due to the transport vehicle 200 being close to the obstacle during the turning process. The obstacle that the transport vehicle 200 approaches during the turning process and does not have the shielding member 102 can still trigger the deceleration and obstacle avoidance action of the transport vehicle 200. Compared with the traditional technical solution of changing the shape of the obstacle detection target area 1011 of the transport vehicle 200, this embodiment significantly reduces the complexity and cost of the technical solution, and effectively improves the efficiency, intelligence and reliability of the semiconductor automatic handling system.

[0063] It should be noted that the target obstacle provided with the shielding member in the embodiment of the present application is located within the range of a preset distance from the transport path of the transport vehicle. For example, the target obstacle is located at the edge of the target area to be detected, or at a specified distance inward from the edge of the target area to be detected.

[0064] Please refer to Figure 8 , in some embodiments, a lateral movement mechanism 10, a lifting mechanism 20, a clamping mechanism 30, and a traveling mechanism 40 are provided on the transport vehicle 200. A suspension track (not shown) may be provided on the top of the transport vehicle 200, and the suspension track carries the traveling mechanism 40 of the transport vehicle 200, and the suspension track defines the moving path of the transport vehicle 200. The lateral movement mechanism 10 is connected to the vehicle body of the transport vehicle 200 through a coupling shaft, and the lateral movement mechanism 10 is configured to drive the lifting mechanism 20 to extend laterally outward from the vehicle body or retract from the outside into the vehicle body; the lifting mechanism 20 is configured to drive the clamping mechanism 30 to lift or lower; the clamping mechanism 30 is configured to grasp or release the FOUP.

[0065] As an example, a slewing mechanism (not shown) is further provided between the transverse movement mechanism 10 and the lifting mechanism 20. The clamping mechanism 30 is liftably connected to the lifting mechanism 20 through a flexible belt assembly (not shown), so that the lifting mechanism 20 and the clamping mechanism 30 can rotate integrally to meet the more flexible and efficient product transportation requirements.

[0066] As an example, please continue to refer to Figures 5-6 、 Figure 8 The transport vehicle 200 further includes a position detection mechanism (not shown). During the process of the clamping mechanism 30 grasping or discharging materials, it can be set that when the detection rod (not shown) is in the first preset position, it is determined that the grasping action is completed, and when the detection rod is in the second preset position, it is determined that the discharging action is completed; or, it can be set that when the detection rod is in the first preset position, it is determined that the discharging action is completed, and when the detection rod is in the second preset position, it is determined that the grasping action is completed.

[0067] In some embodiments, the clamping mechanism 30 can be driven by a linear drive method, so that the clamping mechanism 30 supports the FOUP from below to clamp it, or the clamping mechanism 30 releases the FOUP. Among them, the linear drive method here can adopt feasible linear drive structural components such as linear motors, lead screws, and cylinder mechanisms.

[0068] Please refer to Figure 8 , in some embodiments, the semiconductor cassette 300 can be a 6-inch semiconductor cassette 300 or an 8-inch semiconductor cassette 300, etc.

[0069] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0070] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. An obstacle avoidance device for a semiconductor transport vehicle, characterized in that, Including: A turning detection unit, disposed at a first position of the transport vehicle, configured to emit a wireless detection signal for detecting whether there is an obstacle in a target area, wherein at least one target obstacle is included in the inner side of the turning of the transport vehicle; A shielding component, disposed on the at least one target obstacle, for preventing a target return signal generated according to the wireless detection signal from being generated during the process of the transport vehicle approaching the at least one target obstacle, and the target area is higher than the top surface of the semiconductor material box on the inner side of the turning of the transport vehicle; A control unit, connected to the turning detection unit, for controlling the transport vehicle to decelerate and avoid obstacles when receiving the target return signal of the obstacle in the target area.

2. The semiconductor transport vehicle obstacle avoidance device according to claim 1, wherein, The target area starts from the emission surface of the turning detection unit; The target area includes a first deceleration area, a second deceleration area, and a third deceleration area that are sequentially distributed in a direction away from the emission surface of the turning detection unit and do not overlap with each other; the target return signals of the obstacles in the first deceleration area, the second deceleration area, and the third deceleration area trigger the driving speed of the transport vehicle to increase sequentially.

3. The semiconductor transporter obstacle avoidance device according to claim 1, wherein The target area starts from the emission surface of the turning detection unit and extends in a direction away from the emission surface; The target area includes a first deceleration area, and a second deceleration area and a third deceleration area that are sequentially distributed in a direction away from the emission surface and do not overlap with each other. The target return signals of the obstacles in the first deceleration area, the second deceleration area, and the third deceleration area trigger the driving speed of the transport vehicle to increase sequentially; Both the first deceleration area and the second deceleration area start from the emission surface of the turning detection unit.

4. The semiconductor transport vehicle obstacle avoidance device according to claim 2 or 3, characterized in that The target return signal of the obstacle in the first deceleration area triggers the transport vehicle to stop.

5. The semiconductor transport vehicle obstacle avoidance device according to claim 1, characterized in that, The turning detection unit includes a radar sensor, a laser sensor, an infrared sensor, or a combination thereof.

6. The semiconductor transport vehicle obstacle avoidance device according to claim 1, characterized in that, The shielding component includes an absorbing material and / or a wireless detection signal absorbing material.

7. The semiconductor transport vehicle obstacle avoidance device according to any one of claims 1-3 or claim 5 or 6, characterized in that Further including: A straight-line detection unit, disposed at a second position of the transport vehicle, connected to the control unit, configured to emit a wireless detection signal for detecting whether there is an obstacle in a straight-line detection area of the transport vehicle; the second position is between the bottom surface and the top surface of the semiconductor material box, and the extending direction of the straight-line detection area is the same as the straight-line direction of the transport vehicle; the straight-line detection area is lower than the top surface of the semiconductor material box, higher than the bottom surface of the semiconductor material box, and does not contact the semiconductor material box outside the straight-line path of the transport vehicle.

8. The semiconductor transporter obstacle avoidance device according to claim 7, characterized in that, The straight-line detection area starts from the emission surface of the straight-line detection unit; The straight-line detection area includes a first detection area, a second detection area, and a third detection area that are sequentially distributed in a direction away from the emission surface of the straight-line detection unit and do not overlap with each other; the target return signals of the obstacles in the first detection area, the second detection area, and the third detection area trigger the driving speed of the transport vehicle to increase sequentially, and are less than the normal straight-line speed value of the transport vehicle during the period when obstacle avoidance deceleration is not triggered.

9. The semiconductor transport vehicle obstacle avoidance device according to claim 8, characterized in that, The control unit is configured to: If the target return signal of the obstacle in the straight-line detection area is not obtained, the transport vehicle is controlled to travel at a first speed; If the target return signal of the obstacle in the third detection area is obtained, the transport vehicle is controlled to travel at a second speed; If the target return signal of the obstacle in the second detection area is obtained, the transport vehicle is controlled to travel at a third speed; If the target return signal of the obstacle in the first detection area is obtained, the transport vehicle is controlled to travel at a fourth speed; wherein, the first speed > the second speed > the third speed > the fourth speed.

10. The semiconductor transporter obstacle avoidance device according to claim 7, characterized in that, The control unit is configured to: judge the type of the path that the transport vehicle will pass through according to the map data of the semiconductor manufacturing automatic material handling system and the position data of the transport vehicle; if the type of the path that the transport vehicle will pass through is a straight path, the transport vehicle is controlled to decelerate and avoid obstacles in a straight line according to the detection result of the straight-line detection unit; if the type of the path that the transport vehicle will pass through is a turning path, the transport vehicle is controlled to decelerate and avoid obstacles during turning according to the detection result of the turning detection unit.

11. A semiconductor manufacturing handling system, characterized in that, Comprising: a transport vehicle and an overhead track for the travel of the transport vehicle; the transport vehicle stores and retrieves the semiconductor material box it transports at the workstations of corresponding processes; the semiconductor transport vehicle obstacle avoidance device according to any one of claims 1-10; wherein, the turning detection unit of the obstacle avoidance device is arranged on the transport vehicle, and the shielding component of the obstacle avoidance device is arranged on the target obstacle close to the turning of the transport vehicle.

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