Pluggable mainboard configuration framework integrated with heat dissipation function

Abstract

The invention provides an integrated heat dissipation plug-in mainboard configuration architecture, and relates to the technical field of mainboard configuration architecture.The integrated heat dissipation plug-in mainboard configuration architecture comprises a mainboard body, a heat dissipation device and a fixing device.The mainboard body is provided with a CPU mounting base, a power interface, a memory slot, a PCUE slot, a chipset and an SATA interface; the heat dissipation device is installed on the surface of the mainboard body through a fixing device, the heat dissipation device conducts dredging and dissipation on heat generated in the operation process of the mainboard body through a guide pipe and a water tank, the heat dissipation device comprises the water tank, and the water tank is installed at the bottom of the mainboard body through the fixing device. When the mainboard of the computer is used, high-temperature heat generated by all parts on the surface of the mainboard can be efficiently and rapidly cooled and dissipated, so that the heat dissipation structure has certain connectivity, use and subsequent overhaul and maintenance are facilitated, mounting and dismounting are also facilitated, and the use convenience and efficiency of the heat dissipation structure are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of motherboard configuration architectures, and in particular to a pluggable motherboard configuration architecture with integrated heat dissipation. Background Art

[0002] A pluggable motherboard (also known as a pluggable circuit board) is a motherboard design in which the core components of the motherboard (such as a processor, memory, hard disk, graphics card, etc.) are not directly soldered onto the motherboard, but are connected to the motherboard through slots, interfaces, or connectors, and users can plug, upgrade, or replace these components as needed.

[0003] Existing computers will select corresponding accessories such as a processor, memory, hard disk, graphics card, etc. according to their own needs and preferences, and then install these accessories at positions such as slots, interfaces, or connectors on the surface of the motherboard. In actual use, it is found that general motherboards are equipped with corresponding heat dissipation structures during use, but existing motherboards install different heat dissipation structures according to different accessories. For example, different structural models of heat dissipation components are respectively equipped at the positions of the CPU and the chip. However, this method will make the heat dissipation components relatively scattered, and it is also more cumbersome during installation, requiring individual assembly, and it also increases the workload of the staff during maintenance and repair, which is very inconvenient, reducing the use effect and convenience of the heat dissipation structure. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: Existing computers will select corresponding accessories such as a processor, memory, hard disk, graphics card, etc. according to their own needs and preferences, and then install these accessories at positions such as slots, interfaces, or connectors on the surface of the motherboard. In actual use, it is found that general motherboards are equipped with corresponding heat dissipation structures during use, but existing motherboards install different heat dissipation structures according to different accessories. For example, different structural models of heat dissipation components are respectively equipped at the positions of the CPU and the chip. However, this method will make the heat dissipation components relatively scattered, and it is also more cumbersome during installation, requiring individual assembly, and it also increases the workload of the staff during maintenance and repair, which is very inconvenient, reducing the use effect and convenience of the heat dissipation structure.

[0005] The technical solution adopted by the present invention to solve its technical problem is: A pluggable motherboard configuration architecture with integrated heat dissipation, including a motherboard body, a heat dissipation device, and a fixing device. The motherboard body is provided with a CPU mounting seat, a power interface, a memory slot, a PCUE slot, a chipset, and a SATA interface. The heat dissipation device is installed on the surface of the motherboard body by means of the fixing device, and the heat dissipation device dissipates the heat generated during the operation of the motherboard body through a conduit and a water tank.

[0006] The effects achieved by the above components are as follows: When the motherboard body is installed on the chassis for use, first, the corresponding components on the computer are sequentially and orderly installed at the CPU mounting base, power interface, memory slot, PCUE slot, chipset, and SATA interface positions. Then, the heat dissipation device is assembled on the surface of the motherboard body. When the computer is in use, the heat dissipation device is enabled simultaneously to dissipate and cool the heat generated during the operation of the motherboard body.

[0007] Preferably, the heat dissipation device includes a water tank. The water tank is installed at the bottom position of the motherboard body by means of a fixing device. A water pump is connected and arranged on one side of the water tank. The output end on the other side of the water pump penetrates into the interior of the liquid nitrogen tank. An output pipe is installed on the surface of the liquid nitrogen tank. An input pipe is installed on one side of the water tank. A conduit is jointly installed on the side where the output pipe and the input pipe are close to each other. A motor is installed on the surface of the water tank. The output end of the motor is installed with a fan blade by means of a coupling.

[0008] The effects achieved by the above components are as follows: When the motherboard body is installed on the chassis for use, first, the corresponding components on the computer are sequentially and orderly installed at the CPU mounting base, power interface, memory slot, PCUE slot, chipset, and SATA interface positions. Then, the heat dissipation device is assembled on the surface of the motherboard body by means of a fixing device. When the computer is in use, the water pump on one side of the motherboard body will start, driving the water in the water tank to flow. At this time, the water in the water tank will pass through the interior of the liquid nitrogen tank through the pipeline, enabling the water temperature to conduct heat exchange with the liquid nitrogen in the liquid nitrogen tank. The water will continue to flow into the conduit through the output pipe. At this time, the components on the motherboard body will operate and generate a certain amount of heat. The heat will rise and come into contact with the copper conduit. The conduit will transfer the heat to the flowing water inside. At this time, the water temperature will rise, and the temperature on the surface of the motherboard body will decrease, preventing high-temperature accumulation. Finally, the water will enter the water tank through the input pipe. At this time, the water tank made of polyimide material has good thermal conductivity, enabling the absorbed temperature of the water to dissipate. The motor on the water tank will operate to drive the fan blade to rotate, thereby blowing away the heat on the surface of the water tank. Then, the water will flow in a reciprocating cycle under the drive of the water pump. At this time, when the computer motherboard is in use, it can efficiently and quickly cool and dissipate the high-temperature heat generated by the components on the motherboard surface, making the heat dissipation structure have a certain connectivity, facilitating use and subsequent maintenance and repair, and also being convenient for installation and disassembly, improving the convenience and efficiency of using the heat dissipation structure.

[0009] Preferably, the heat dissipation device further includes strengthening covers installed on both sides of the surface of the water tank. The strengthening covers are installed on the surface of the water tank by means of support rods to enhance the heat dissipation effect of the fan blades.

[0010] The effects achieved by the above components are as follows: By setting the reinforcing cover, when the motor drives the fan blade to blow the high temperature on the surface of the water tank made of polyimide material, the stability of the wind direction can be ensured, and the situation of secondary heating of the main board body and the components on the surface is not likely to occur, improving the functionality of the heat dissipation device.

[0011] Preferably, the heat dissipation device further includes an auxiliary sleeve installed on the arc surface of the output pipe, and the auxiliary sleeve insulates the temperature of the cooling water for cooling.

[0012] The effects achieved by the above components are as follows: By setting the auxiliary sleeve made of aluminum foil material, the circulating water cooled by the fan blade and the liquid nitrogen tank can ensure the low temperature state of the water when passing through the output pipe, so that when passing through the copper conduit, the circulating water can maintain a persistent low temperature state, and the low water temperature is not likely to rise prematurely, improving the use effect of the heat dissipation device.

[0013] Preferably, the heat dissipation device further includes a plurality of support plates installed on the conduit, and the support plates assist in the stable assembly of the conduit.

[0014] The effects achieved by the above components are as follows: By setting the support plates, when the conduit is in use, a plurality of support plates will come into contact with the surface of the main board body, making the position of the conduit more stable and not likely to shake, ensuring its stable use.

[0015] Preferably, the fixing device includes a mounting frame, wherein the water tank, the water pump and the liquid nitrogen tank are all connected to the inner wall of the mounting frame. Fixing frames are respectively inserted into the two end surfaces of the mounting frame, and the fixing frames are connected to the bottom of the main board body. The mounting frame and the fixing frames are connected by nuts, and nuts are threadedly connected to the arc surface of the screw.

[0016] The effects achieved by the above components are as follows: When assembling the heat dissipation device on the surface of the main board body, first set the heat dissipation device to the assembly position, then insert the two ends of the mounting frame into the inner walls of the two fixing frames fixedly connected to the surface of the main board body respectively, and finally pass the screw through the surfaces of the mounting frame and the fixing frames, and then threadedly connect the nut to the surface of the screw until the nut contacts and presses against the surface of the fixing frame. At this time, the heat dissipation device can be used more conveniently and quickly, improving the convenience of use, and also making the components of the heat dissipation device more convenient for overhaul and maintenance, ensuring the normal use of the heat dissipation device.

[0017] Preferably, the fixing device further includes a knob installed on the screw, and the knob assists in the disassembly and assembly fixation of the mounting frame.

[0018] The effects achieved by the above components are as follows: By setting the knob, the screw can be rotated more conveniently and quickly, making the assembly of the mounting frame more convenient, and also improving the convenience of use of the heat dissipation device.

[0019] Preferably, the fixing device further includes protective frames installed at the four corners of the mounting frame, and the protective frames provide a certain degree of protection for the components on the mounting frame.

[0020] The effect achieved by the above components is that through the setting of the protective frames, a certain protective structure is formed at the four corners of the mounting frame, so that the components on the mounting frame are not easily in contact and collision with other components during the assembly and use process, improving the use effect of the fixing device.

[0021] The beneficial effects of the present invention are:

[0022] 1. In the present invention, when the main board body is installed on the chassis for use, first, the corresponding components on the computer are sequentially and orderly installed on the CPU mounting seat, power interface, memory slot, PCUE slot, chipset, and SATA interface positions. Then, the heat dissipation device is assembled on the surface of the main board body by means of the fixing device. When the computer is in use, the water pump on one side of the main board body will start, driving the water in the water tank to flow. At this time, the water in the water tank will pass through the pipeline through the inside of the liquid nitrogen tank, and the temperature of the water will be heat-exchanged by the liquid nitrogen in the liquid nitrogen tank. The water will continue to flow into the conduit through the output pipe. At this time, the components on the main board body will operate and generate a certain amount of heat. The heat will rise and come into contact with the copper conduit, and the conduit will transfer the heat to the water flowing inside. At this time, the water temperature will rise, and the temperature on the surface of the main board body will decrease, preventing high-temperature accumulation. Finally, the water will enter the water tank through the input pipe. At this time, the water tank made of polyimide material has good thermal conductivity, dissipating the temperature absorbed by the water. And the motor on the water tank will operate to drive the fan blades to rotate, thereby blowing away the heat on the surface of the water tank. Then the water will flow in a reciprocating cycle under the drive of the water pump. At this time, when the main board of the computer is in use, it can efficiently and quickly cool and dissipate the high-temperature heat generated by the components on the surface of the main board, making the heat dissipation structure have a certain connectivity, convenient for use and subsequent maintenance, and also convenient for installation and disassembly, improving the convenience and efficiency of the heat dissipation structure.

[0023] 2. In the present invention, when the heat dissipation device is assembled on the surface of the main board body, first, the heat dissipation device is set to the assembly position. Then, the two ends of the mounting frame are respectively inserted into the inner walls of the two fixing frames fixedly connected to the surface of the main board body. Finally, the screw penetrates through the surfaces of the mounting frame and the fixing frame, and the nut is threadedly connected to the surface of the screw until the nut contacts and presses against the surface of the fixing frame. At this time, when the heat dissipation device is in use, it can be more convenient and fast, improving the convenience of use, and also making the components of the heat dissipation device more convenient for maintenance during overhaul, ensuring the normal use of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the drawings and embodiments.

[0025] Figure 1 is a schematic structural diagram of a pluggable motherboard configuration architecture with integrated heat dissipation proposed by the present invention;

[0026] Figure 2 in a pluggable motherboard configuration architecture with integrated heat dissipation proposed by the present invention Figure 1 schematic side view;

[0027] Figure 3 is a schematic structural diagram of the heat dissipation device in a pluggable motherboard configuration architecture with integrated heat dissipation proposed by the present invention;

[0028] Figure 4 in a pluggable motherboard configuration architecture with integrated heat dissipation proposed by the present invention Figure 3 schematic side view;

[0029] Figure 5 in a pluggable motherboard configuration architecture with integrated heat dissipation proposed by the present invention Figure 3 schematic diagram of a partial structure;

[0030] Figure 6 is a schematic structural diagram of the fixing device in a pluggable motherboard configuration architecture with integrated heat dissipation proposed by the present invention;

[0031] Figure 7 in a pluggable motherboard configuration architecture with integrated heat dissipation proposed by the present invention Figure 6 schematic side view.

[0032] Legend: 1, motherboard body; 2, heat dissipation device; 21, water tank; 22, water pump; 23, liquid nitrogen tank; 24, output pipe; 25, conduit; 26, input pipe; 27, motor; 28, fan blade; 29, reinforcement cover; 210, support plate; 211, auxiliary sleeve; 3, fixing device; 31, mounting bracket; 32, fixing frame; 33, screw; 34, nut; 35, knob; 36, protective frame; 4, CPU mounting seat; 5, power interface; 6, memory slot; 7, PCUE slot; 8, chipset; 9, SATA interface. Detailed Description of the Invention

[0033] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner, and therefore only showing the components related to the present invention.

[0034] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] Figure 1 and Figure 2 An integrated heat dissipation pluggable motherboard configuration architecture as shown, which includes a motherboard body 1, a heat dissipation device 2, and a fixing device 3. The motherboard body 1 is equipped with a CPU socket 4, a power interface 5, a memory slot 6, a PCIE slot 7, a chipset 8, and a SATA interface 9. The heat dissipation device 2 is installed on the surface of the motherboard body 1 by means of the fixing device 3, wherein the heat dissipation device 2 dissipates the heat generated during the operation of the motherboard body 1 through a conduit 25 and a water tank 21.

[0036] Figure 1 - Figure 5The shown heat dissipation device 2 includes a water tank 21, which is installed at the bottom position of the main board body 1 by means of a fixing device 3. One side of the water tank 21 is communicated with a water pump 22. The output end on the other side of the water pump 22 penetrates through the interior of the liquid nitrogen tank 23. An output pipe 24 is installed on the surface of the liquid nitrogen tank 23. An input pipe 26 is installed on one side of the water tank 21. A conduit 25 is jointly installed on the sides of the output pipe 24 and 26 that are close to each other. A motor 27 is installed on the surface of the water tank 21. The output end of the motor 27 is installed with a fan blade 28 by means of a coupling. When the main board body 1 is installed on the chassis for use, first, the corresponding components on the computer are sequentially and orderly installed at the positions of the CPU mounting seat 4, power supply interface 5, memory slot 6, PCI-E slot 7, chipset 8, and SATA interface 9. Then, the heat dissipation device 2 is assembled on the surface of the main board body 1 by means of the fixing device 3. When the computer is in use, the water pump 22 on one side of the main board body 1 will start, driving the water in the water tank 21 to flow. At this time, the water in the water tank 21 will pass through the interior of the liquid nitrogen tank 23 through the pipeline, enabling the temperature of the water to be heat-exchanged with the liquid nitrogen in the liquid nitrogen tank 23. The water will continue to flow into the conduit 25 through the output pipe 24. At this time, the components on the main board body 1 will operate and generate a certain amount of heat, which will rise and come into contact with the copper conduit 25. The conduit 25 will transfer the heat to the flowing water inside. At this time, the water temperature will rise, and the temperature on the surface of the main board body 1 will decrease, preventing high-temperature accumulation. Finally, the water will enter the water tank 21 through the input pipe 26. At this time, the water tank 21 made of polyimide material has good thermal conductivity, enabling the absorbed temperature of the water to dissipate. The motor 27 on the water tank 21 will operate to drive the fan blade 28 to rotate, thereby blowing away the heat on the surface of the water tank 21. Then, the water will flow in a reciprocating cycle under the drive of the water pump 22. At this time, when the computer main board is in use, it can efficiently and quickly cool and dissipate the high-temperature heat generated by the components on the surface of the main board, making the heat dissipation structure have a certain connectivity, convenient for use and subsequent maintenance, and also easy to install and disassemble, improving the convenience and efficiency of the heat dissipation structure in use.

[0037] Figure 1 - Figure 5The heat dissipation device 2 shown also includes a reinforcement cover 29 installed on both sides of the surface of the water tank 21, wherein the reinforcement cover 29 is installed on the surface of the water tank 21 by means of a support rod to enhance the heat dissipation effect of the fan blades 28. By setting the reinforcement cover 29, when the motor 27 drives the fan blades 28 to blow away the high temperature on the surface of the polyimide water tank 21, the wind direction can be guaranteed to be stable, and it is not easy to cause the main board body 1 and the components on the surface to be heated twice, thereby improving the functionality of the heat dissipation device 2. The heat dissipation device 2 also includes an auxiliary sleeve 211 installed on the arc surface of the output pipe 24, wherein the auxiliary sleeve 211 isolates the temperature of the cooling water for cooling and refrigeration, and the auxiliary sleeve made of aluminum foil is used to The arrangement of 211 ensures that the circulating water cooled by the fan blades 28 and the liquid nitrogen tank 23 can maintain a low temperature state when passing through the output pipe 24, thereby ensuring that the circulating water maintains a lasting low temperature state when passing through the copper conduit 25, and is not prone to premature low water temperature rise, thereby improving the use effect of the heat dissipation device 2. The heat dissipation device 2 also includes a plurality of support plates 210 installed on the conduit 25, wherein the support plates 210 assist in the stable assembly of the conduit 25. Through the arrangement of the support plates 210, when the conduit 25 is in use, the plurality of support plates 210 will come into contact with the surface of the mainboard body 1, thereby making the position of the conduit 25 more stable and not prone to shaking, thereby ensuring its stable use.

[0038] Figure 1 , Figure 3 and Figure 6 The fixing device 3 shown includes a mounting frame 31, wherein the water tank 21, the water pump 22 and the liquid nitrogen tank 23 are all connected to the inner wall of the mounting frame 31, and the two end surfaces of the mounting frame 31 are respectively plugged with fixing frames 32, wherein the fixing frame 32 is connected to the bottom of the mainboard body 1, and the mounting frame 31 is connected to the fixing frame 32 through a nut 34, wherein the nut 34 is threadedly connected on the arc surface of the screw 33. When the heat sink 2 is assembled on the surface of the mainboard body 1, the heat sink 2 is first set to the assembly position, and then the two ends of the mounting frame 31 are respectively inserted into the inner walls of the two fixing frames 32 fixedly connected to the surface of the mainboard body 1, and finally the screw 33 is passed through the surface of the mounting frame 31 and the fixing frame 32, and then the nut 34 is threadedly connected to the surface of the screw 33 until the nut 34 contacts and squeezes the surface of the fixing frame 32. At this time, the heat sink 2 can be more convenient and quick when used, which improves the convenience of use, and also makes the components of the heat sink 2 more convenient to repair and maintain, ensuring the normal use of the heat sink 2.

[0039] Figure 1 , Figure 3 and Figure 7The shown fixing device 3 further includes a knob 35 mounted on the screw 33, wherein the knob 35 assists in the disassembly and assembly fixation of the mounting bracket 31. Through the setting of the knob 35, the rotation of the screw 33 becomes more convenient and fast, thereby making the assembly of the mounting bracket 31 more convenient, and also improving the convenience of use of the heat dissipation device 2. The fixing device 3 further includes protective frames 36 mounted at the four corners of the mounting bracket 31. The protective frames 36 provide a certain degree of protection for the components on the mounting bracket 31. Through the setting of the protective frames 36, a certain protective structure is formed at the four corners of the mounting bracket 31, so that the components on the mounting bracket 31 are not easily in contact and collision with other components during the assembly and use process, improving the use effect of the fixing device 3.

[0040] Working principle: When the main board body (1) is installed on the chassis for use, first, the corresponding components on the computer are sequentially and orderly installed at the positions of the CPU mounting base (4), power supply interface (5), memory slot (6), PCUE slot (7), chipset (8), and SATA interface (9). Then, the heat dissipation device (2) is assembled on the surface of the main board body (1) with the help of the fixing device (3). When the computer is in use, the water pump (22) on one side of the main board body (1) will start, driving the water in the water tank (21) to flow. At this time, the water in the water tank (21) will pass through the pipe and through the inside of the liquid nitrogen tank (23), so that the temperature of the water is heat-exchanged by the liquid nitrogen in the liquid nitrogen tank (23). The water will continue to flow into the conduit (25) through the output pipe (24). At this time, the components on the main board body (1) will operate and generate a certain amount of heat. The heat will rise and come into contact with the copper conduit (25). The conduit (25) will transfer the heat to the flowing water inside. At this time, the water temperature will rise, and the temperature on the surface of the main board body (1) will decrease, preventing high-temperature accumulation. Finally, the water will enter the water tank (21) through the input pipe (26). At this time, the water tank (21) made of polyimide material has good thermal conductivity, dissipating the temperature absorbed by the water. And the motor (27) on the water tank (21) will operate to drive the fan blade (28) to rotate, thereby blowing away the heat on the surface of the water tank (21). Then the water will flow in a reciprocating cycle under the drive of the water pump (22). At this time, when the main board of the computer is in use, it can efficiently and quickly cool and dissipate the high-temperature heat generated by the components on the surface of the main board, making the heat dissipation structure have a certain connectivity, convenient for use and subsequent maintenance, and also easy to install and disassemble, improving the convenience and efficiency of the heat dissipation structure.

[0041] When assembling the heat dissipation device (2) on the surface of the main board body (1), first set the heat dissipation device (2) to the assembly position, then insert the two ends of the mounting bracket (31) into the inner walls of the two fixing frames (32) fixedly connected to the surface of the main board body (1) respectively. Finally, pass the screw (33) through the surfaces of the mounting bracket (31) and the fixing frame (32), and then thread the nut (34) onto the surface of the screw (33) until the nut (34) contacts and presses against the surface of the fixing frame (32). At this time, when the heat dissipation device (2) is in use, it can be more convenient and faster, improving the convenience of use, and also making it more convenient to repair and maintain the components of the heat dissipation device (2), ensuring the normal use of the heat dissipation device (2).

[0042] Inspired by the above ideal embodiments of the present invention, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An integrated heat dissipation pluggable motherboard configuration architecture, comprising a motherboard body (1), a heat dissipation device (2) and a fixing device (3), characterized in that: The main board body (1) is equipped with a CPU socket (4), a power interface (5), memory slots (6), a PCUE slot (7), a chipset (8), and SATA interfaces (9). The heat dissipation device (2) is installed on the surface of the main board body (1) by means of a fixing device (3). Among them, the heat dissipation device (2) dissipates the heat generated during the operation of the main board body (1) through a conduit (25) and a water tank (21).

2. The pluggable motherboard configuration architecture with integrated heat dissipation according to claim 1, characterized in that: The heat dissipation device (2) includes a water tank (21). The water tank (21) is installed at the bottom of the main board body (1) by means of a fixing device (3). A water pump (22) is connected to one side of the water tank (21). The output end on the other side of the water pump (22) penetrates into the interior of the liquid nitrogen tank (23). An output pipe (24) is installed on the surface of the liquid nitrogen tank (23). An input pipe (26) is installed on one side of the water tank (21). A conduit (25) is jointly installed on the sides of the output pipe (24) and (26) close to each other. A motor (27) is installed on the surface of the water tank (21). The output end of the motor (27) is installed with a fan blade (28) by means of a coupling.

3. The pluggable motherboard configuration architecture with integrated heat dissipation according to claim 2, characterized in that: The heat dissipation device (2) further includes reinforcing covers (29) installed on both sides of the surface of the water tank (21). Among them, the reinforcing covers (29) are installed on the surface of the water tank (21) by means of support rods to enhance the heat dissipation effect of the fan blade (28).

4. An integrated heat dissipation pluggable motherboard configuration architecture according to claim 2, characterized in that: The heat dissipation device (2) further includes an auxiliary sleeve (211) installed on the arc surface of the output pipe (24). Among them, the auxiliary sleeve (211) insulates the temperature of the cooling water for cooling and refrigeration.

5. The pluggable motherboard configuration architecture with integrated heat dissipation according to claim 2, characterized in that: The heat dissipation device (2) further includes a plurality of support plates (210) installed on the conduit (25). Among them, the support plates (210) assist in the stable assembly of the conduit (25).

6. The pluggable motherboard configuration architecture with integrated heat dissipation according to claim 1, characterized in that: The fixing device (3) includes a mounting frame (31). Among them, the water tank (21), the water pump (22), and the liquid nitrogen tank (23) are all connected to the inner wall of the mounting frame (31).

7. An integrated heat dissipation pluggable motherboard configuration architecture according to claim 6, characterized in that: Fixing frames (32) are respectively inserted into the surfaces at both ends of the mounting frame (31). Among them, the fixing frames (32) are connected to the bottom of the main board body (1).

8. An integrated heat dissipation pluggable motherboard configuration architecture according to claim 7, characterized in that: The mounting frame (31) is connected to the fixing frame (32) by a nut (34). A nut (34) is threadedly connected to the arc surface of the screw (33).

9. The pluggable motherboard configuration architecture with integrated heat dissipation according to claim 8, characterized in that: The fixing device (3) further includes a knob (35) installed on the screw (33). Among them, the knob (35) assists in the disassembly, installation, and fixing of the mounting frame (31).

10. An integrated heat dissipation pluggable motherboard configuration architecture according to claim 9, characterized in that: The fixing device (3) further includes protective frames (36) installed at the four corners of the mounting frame (31). Among them, the protective frames (36) provide a certain degree of protection for the components on the mounting frame (31).

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