Compute nodes and servers

Abstract

The present application discloses a computing node and a server, which relates to the field of server technology. The computing node includes a cold plate tray, a mainboard and a functional device. The mainboard is carried on the cold plate tray to dissipate heat through the cold plate tray. The functional device is fixed to the cold plate tray and electrically connected to the mainboard. The cold plate tray is provided with a groove. The groove is located on the side of the cold plate tray away from the mainboard. The groove is used to cooperate with the partition of the server. The cold plate tray integrates the functions of the tray and the cold plate, thereby saving the thickness space of the computing node. The functional device is fixed to the cold plate tray and electrically connected to the mainboard. This design not only simplifies the layout of the components, but also avoids the overly close arrangement between the components, reducing the problem of blockage of the heat dissipation channel. The cold plate tray is provided with a groove to offset the influence of the thickness of the partition between the computing nodes on the height direction of the server. Therefore, the computing node of the present invention improves the computing expansion capability and heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a computing node and a server. Background Art

[0002] With the economic development of society, especially with the development of artificial intelligence technology, higher demands are placed on the computing power of IT equipment such as servers.

[0003] Related technologies, constrained by traditional chassis design and component layout, lack computing scalability, making it difficult to achieve high-density deployment of CPUs and meet the data processing density requirements of data-intensive applications. Furthermore, in pursuit of high integration, internal computing, storage, and networking components are arranged too closely together, resulting in narrow heat dissipation channels. This makes it difficult for air cooling systems to effectively remove heat, and limits the space for laying liquid cooling pipes, severely restricting the stable operation of equipment in high-density environments. Summary of the Invention

[0004] The present application provides a computing node and a server to at least solve the problems of insufficient computing expansion capability and low heat dissipation efficiency in related technologies.

[0005] The present application provides a computing node, including a cold plate tray, a motherboard and a functional device. The motherboard is carried on the cold plate tray for heat dissipation through the cold plate tray. The functional device is fixed to the cold plate tray and electrically connected to the motherboard. The cold plate tray is provided with a groove, which is located on the side of the cold plate tray away from the motherboard. The groove is used to cooperate with the partition of the server.

[0006] The present application also provides a server, including a chassis, a partition, and a plurality of the above-mentioned computing nodes, wherein the computing nodes are inserted into the chassis through the partition.

[0007] The compute nodes and servers of this application utilize a cold plate tray design, with the motherboard directly supported on the cold plate tray. This allows heat to be more efficiently conducted and dissipated through the cold plate tray. Compared to traditional air-cooling systems, the cold plate tray provides a larger heat dissipation surface area, significantly improving heat dissipation efficiency and ensuring stable operation in high-density deployments. Compared to traditional liquid cooling systems, the cold plate tray integrates the functions of both the tray and the cold plate, saving space and thickness in the compute node. Functional devices are fixed to the cold plate tray and electrically connected to the motherboard. This design not only simplifies component layout but also avoids overly close arrangement of components, reducing heat dissipation channel blockage. Through a rational layout design, the compute node can achieve higher integration without increasing its size. The cold plate tray features grooves that mate with the server's partitions, providing flexible installation and adaptability. Furthermore, the groove design offsets the effect of the thickness of the partitions between compute nodes on the server's height. This design allows for rapid deployment of compute nodes in various server environments, improving the device's compatibility and adaptability. Therefore, the computing node of the present invention not only improves the computing expansion capability and heat dissipation efficiency, but also enhances the stability and applicability of the equipment, and can better meet the needs of data-intensive applications for high-density data processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 A schematic diagram of the structure of a server provided in an embodiment of the present application;

[0010] Figure 2 for Figure 1 A schematic diagram of a partially decomposed structure of a computing node of the server shown;

[0011] Figure 3 for Figure 1 A schematic diagram of the structure of the computing node from another perspective;

[0012] Figure 4 for Figure 1 A schematic diagram of the structure of the computing nodes and partitions in the server shown;

[0013] Figure 5 for Figure 2 A schematic diagram of the structure of the cold plate tray and the processor on the computing node shown;

[0014] Figure 6 for Figure 5 One of the structural diagrams of the shrapnel screw shown;

[0015] Figure 7 for Figure 5 The second structural diagram of the spring screw shown;

[0016] Figure 8 for Figure 2 One of the structural diagrams of the cold plate tray of the computing node shown;

[0017] Figure 9 for Figure 2 The second structural diagram of the cold plate tray of the computing node shown;

[0018] Figure 10 for Figure 2 A schematic diagram of the structure of the functional device of the computing node shown;

[0019] Figure 11 for Figure 2 A schematic diagram of the structure of the functional device of the computing node and the hard disk backplane;

[0020] Figure 12 for Figure 2 The schematic diagram of the structure of the computing node and the power backplane shown;

[0021] Figure 13 for Figure 2 A schematic diagram of the structure of the memory of the computing node and the cold plate tray;

[0022] Figure 14 for Figure 13 A schematic diagram of the structure of the second memory and the memory cold plate;

[0023] Figure 15 for Figure 2 The diagram shows the structure of the computing node and the water distributor.

[0024] The above drawings include the following reference numerals:

[0025] 100 - Compute Node; 10 - Cold Plate Tray; 11 - Main Cold Plate; 111 - Groove; 12 - Main Heat Exchange Channel; 13 - Processor Cold Plate; 14 - Processor Channel; 15 - Blind Plug; 17 - Bottom Plate; 18 - Side Plate; 19 - Receiving Slot; 16 - Fixing Stud; 20 - Motherboard; 21 - Processor; 22 - Shrapnel Screw; 221 - Stud; 222 - Shrapnel; 23 - Power Connector; 24 - Memory; 241 - First Memory; 242 - Second Memory Memory; 25-memory cold plate; 251-cold plate boss; 26-signal connector; 30-functional device; 31-functional component; 32-functional cold plate; 321-thermal block; 33-connector; 34-hard disk unit; 40-hard disk backplane; 41-hard disk connector; 200-server; 201-chassis; 202-partition; 203-power backplane; 204-water inlet manifold; 205-water outlet manifold; 206-water inlet; 207-water outlet. DETAILED DESCRIPTION

[0026] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0027] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0028] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0029] Figure 1 A schematic diagram of the structure of a server provided in an embodiment of the present application. Figure 2 for Figure 1 Schematic diagram of a partially exploded structure of a computing node of the server shown.

[0030] like Figure 1 and Figure 2As shown, the computing node 100 provided in an embodiment of the present application is used in a server 200. The server 200 includes a chassis 201, a partition 202, and a computing node 100. The partition 202 is disposed in the chassis 201. The computing node 100 is inserted into the chassis 201 via the partition 202. Specifically, the partition 202 divides the internal space of the chassis 201 into multiple subspaces for accommodating computing nodes 100. Each subspace is used to accommodate a computing node 100. The computing nodes are inserted into the subspaces, and the partition 202 is located between adjacent computing nodes 100.

[0031] In some possible implementations, a computing node 100 includes a cold plate tray 10, a motherboard 20, and a functional device 30. The cold plate tray 10 is the frame of the computing node 100, providing support and heat dissipation. The motherboard 20 is supported by the cold plate tray 10, dissipating heat through the cold plate tray 10. The functional device 30 is secured to the cold plate tray 10 and electrically connected to the motherboard 20. The functional device 30 also dissipates heat through the cold plate tray 10.

[0032] The cold plate tray 10 utilizes an integrated cold plate, which also serves as a tray for the motherboard 20 , eliminating the cumbersome maintenance of liquid cooling components. Furthermore, the motherboard 20 can be snapped and locked onto the cold plate tray 10 , allowing low-power components to adhere to the cold plate tray 10 , dissipating heat from multiple heat sources simultaneously and achieving a fanless, full liquid cooling design. This reduces the thickness of the chassis 201 .

[0033] In some possible implementations, in the computing node 100 of the present application, the thickness of the cold plate tray 10 is 6 mm, and the thickness of the motherboard 20 is 3 mm. In a conventional computing node 100, the thickness of the single cold plate is 12 mm, and the thickness of the motherboard thereon is 2.4 mm.

[0034] The front window of each computing node 100 is a functional area where functional devices 30 can be arranged.

[0035] Since the computing node 100 adopts the cold plate tray 10 design, the motherboard 20 is directly carried on the cold plate tray 10, so that heat can be more efficiently conducted and dissipated through the cold plate tray 10. Compared with the traditional air cooling system, the cold plate tray 10 provides a larger heat dissipation surface area, significantly improving the heat dissipation efficiency, thereby ensuring the stable operation of the equipment under high-density deployment. Compared with the traditional laying of liquid cooling pipes, the cold plate tray 10 integrates the functions of the tray and the cold plate, thereby saving the thickness space of the computing node 100. The functional device 30 is fixed to the cold plate tray 10 and electrically connected to the motherboard 20. This design not only simplifies the layout of the components, but also avoids the overly close arrangement between the components, reducing the blockage problem of the heat dissipation channel. Through reasonable layout design, the computing node 100 can achieve a higher degree of integration without increasing the volume.

[0036] Figure 3 for Figure 1 A structural diagram of the computing node from another perspective is shown. Figure 4 for Figure 1 Schematic diagram of the structure of the computing node and partition in the server shown.

[0037] like Figure 3 and Figure 4 As shown, the cold plate tray 10 is provided with a groove 111. The groove 111 is located on the side of the cold plate tray 10 facing away from the mainboard 20. The groove 111 is used to cooperate with the partition 202 of the server 200.

[0038] The grooves 111 are provided at two edges of the cold plate tray 10 , and can accommodate the partitions 202 when the computing node 100 is inserted into the server 200 , thereby reducing the space occupied by the computing node 100 in the server 200 .

[0039] The cold plate tray 10 is provided with a groove 111, which cooperates with the partition 202 of the server 200 to provide flexible installation and adaptation capabilities. At the same time, the design of the groove 111 offsets the impact of the thickness of the partition 202 between the computing nodes 100 and the computing nodes 100 on the height direction of the server 200. This design allows the computing node 100 to be quickly deployed in different types of server 200 environments, improving the compatibility and adaptability of the equipment. Therefore, the computing node 100 of the present invention not only improves the computing expansion capability and heat dissipation efficiency, but also improves the stability and applicability of the equipment, and can better meet the needs of data-intensive applications for high-density data processing.

[0040] Figure 5 for Figure 2 Schematic diagram of the structure of the cold plate tray and processor on the computing node.

[0041] like Figure 5As shown, in some possible implementations, the computing node 100 further includes a spring screw 22 and a processor 21. The processor 21 is disposed on the side of the motherboard 20 facing the cold plate tray 10. The spring screw 22 passes through the cold plate tray 10 and connects to the processor 21, so that the processor 21 contacts the cold plate tray 10.

[0042] By optimizing the fixing design of the processor 21, the spring screw is changed into a spring screw 22. Under the premise of maintaining the snapping force of the processor 21 socket, the space required for installing the processor 21 is compressed.

[0043] The processor 21 is directly set on the side of the mainboard 20 facing the cold plate tray 10, and is in close contact with the cold plate tray 10 through the spring screw 22. This design ensures that the heat generated by the processor 21 can be quickly transferred to the cold plate tray 10, thereby improving the heat dissipation efficiency. Compared with traditional heat dissipation methods, this direct contact method reduces thermal resistance and improves the speed and efficiency of heat transfer. The layout design of the processor 21 makes it close to the cold plate tray 10, saving internal space. This compact design helps to achieve higher component integration within the limited space of the computing node 100, and provides more flexibility for the layout of other functional devices.

[0044] By using spring-cage screws 22 to secure the processor 21 to the cold plate tray 10, additional mechanical stability is provided. The elastic properties of the spring-cage screws 22 can absorb a certain amount of vibration and shock, protecting the processor 21 from external physical stress, thereby improving the reliability of the computing node 100 during operation. At the same time, the spring-cage screws 22 not only ensure a secure connection, but also facilitate quick replacement or maintenance of the processor 21 when necessary, making the installation and removal of the processor 21 easier, reducing equipment downtime and improving maintenance efficiency.

[0045] Figure 6 for Figure 5 One of the structural schematic diagrams of the spring screw shown. Figure 7 for Figure 5 The second structural diagram of the shrapnel screw is shown.

[0046] like Figure 6 and Figure 7 As shown, in some possible implementations, the spring screw 22 includes a spring 222 and a stud 221. The stud 221 passes through the cold plate tray 10 and is connected to the processor 21. The spring 222 is sleeved on the stud 221 and is located on the side of the cold plate tray 10 away from the processor 21.

[0047] The combined design of the stud 221 and the spring 222 allows for quick installation and removal of the processor 21, reducing maintenance time and complexity while ensuring that components are not damaged during maintenance, making the installation and maintenance process easier.

[0048] The studs 221 pass through the cold plate tray 10 and connect directly to the processor 21, ensuring close contact between the processor 21 and the cold plate tray 10. This design minimizes thermal resistance and improves the efficiency of heat conduction from the processor 21 to the cold plate tray 10, thereby enhancing overall heat dissipation performance.

[0049] The shrapnel 222 is sleeved on the stud 221 and is located on the side of the cold plate tray 10 away from the processor 21. This configuration can provide uniform pressure distribution when the stud 221 applies pressure. The elastic properties of the shrapnel 222 allow it to deform within a certain range, thereby maintaining a stable contact pressure between the processor 21 and the cold plate tray 10, avoiding poor contact due to thermal expansion or mechanical stress. The use of the shrapnel 222 not only provides stable pressure, but also has good shock absorption and vibration resistance. This is particularly important for equipment running in a high-performance computing environment, because it can reduce the impact of mechanical stress caused by vibration on the processor 21 and other components, and improve the reliability and durability of the system. At the same time, by arranging the shrapnel 222 on the side of the cold plate tray 10 away from the processor 21, the design effectively utilizes space, avoids occupying the space around the processor 21, and provides a more flexible component layout solution.

[0050] In order to maintain the snapping force F of the processor 21, the formula F=(ESh 3 )(Lx) / (4L 3 ) is used to design the cross-sectional dimensions of the spring 222, where E is the elastic modulus of the material of the spring 222, L is the height of the spring 222, x is the compression amount, S is the effective circumference of the spring 222, which can generally be estimated by taking the circumference of the midpoint of the inner and outer diameters of the spring 222, and h is the thickness of the cross-section of the spring 222.

[0051] In some possible implementations, L is between 2 mm and 4 mm, and x is between 0.5 mm and 1 mm. The remaining design parameters can be varied to ensure that the snap-fit ​​force F meets the snap-fit ​​requirements of the processor 21.

[0052] In some possible implementations, the snap-on F requirement of the processor 21 is between 175 kgf and 205 kgf.

[0053] Figure 8 for Figure 2 One of the structural diagrams of the cold plate tray of the compute node shown. Figure 9 for Figure 2 The second structural diagram of the cold plate tray of the computing node is shown.

[0054] like Figure 8 and Figure 9As shown, in some possible implementations, the cold plate tray 10 is provided with a main cold plate 11, a main heat exchange flow channel 12, a processor cold plate 13, and a processor flow channel 14. The main heat exchange flow channel 12 is provided on the main cold plate 11, and the motherboard 20 is supported on the main cold plate 11 to dissipate heat through the main heat exchange flow channel 12 on the main cold plate 11. The processor cold plate 13 is provided on the main cold plate 11 and opposite the processor 21. The processor cold plate 13 is used to dissipate heat from the processor 21. The processor flow channel 14 is connected to the processor cold plate 13.

[0055] The integrated design of the cold plate tray 10 reduces the number of cold plate components and the number of fluid connectors, thereby reducing material costs and improving maintainability.

[0056] The independent design of the main heat exchange flow channel 12 and the processor flow channel 14 allows for separate management and optimization of different heat sources. This allows the fluid flow rate and flow rate to be adjusted according to the heat load requirements of different components, achieving more precise and efficient thermal management. Through this diversion design of the cold plate and flow channel, the system can maintain a lower temperature during high-performance operation, thereby improving the stability and reliability of the system, extending the service life of the components, and ensuring the performance of the equipment under high-load conditions. At the same time, the modular nature of this design makes it easy to perform maintenance and component upgrades when necessary. The independent flow channel design also facilitates local cooling system adjustments or maintenance without affecting other components.

[0057] The main cold plate 11 is provided with a main heat exchange channel 12, and the main board 20 is directly supported on the main cold plate 11 for heat dissipation. This design allows the heat generated by the main board 12 to be quickly transferred through the main cold plate 11 to the main heat exchange channel 12, where the heat is removed by the flow of fluid, thereby improving overall heat dissipation efficiency.

[0058] The processor cold plate 13 is specifically positioned on the main cold plate 11 and faces the processor 21. The processor flow channel 14 connects to the processor cold plate 13. This dedicated heat dissipation path ensures that heat generated by the processor 21 is quickly transferred to the processor cold plate 13 and effectively exchanged through the processor flow channel 14, making it particularly suitable for the high heat density of the processor 21.

[0059] In some possible implementations, the main cold plate 11 is made of aluminum, and the processor cold plate 13 is made of copper. The processor cold plate 13 is fastened to the main cold plate 11 , thereby integrating the cold plate tray 10 .

[0060] Figure 10 for Figure 2 A schematic diagram of the structure of the functional device of the computing node shown.

[0061] like Figure 10As shown, in some possible implementations, the cold plate tray 10 is provided with a blind plug 15. The blind plug 15 is provided on a side of the cold plate tray 10 facing away from the functional device 30. The main heat exchange flow channel 12 and the processor flow channel 14 are respectively connected to the blind plug 15.

[0062] Because the blind plug 15 is located on the side of the cold plate tray 10 facing away from the functional device 30, automatic docking is achieved during installation without the need for precise alignment, greatly simplifying the installation process and reducing the complexity and time of manual operations. This layout optimizes the use of internal space, prevents interference between the cooling connection and the functional device 30, and provides greater flexibility in the arrangement of other components.

[0063] The Blind Plug 15 design reduces the risk of misoperation during connection, such as damage caused by incorrect connections or excessive force. Its automatic docking feature ensures reliable and consistent connections every time, reducing the possibility of equipment failure. The Blind Plug 15 makes connecting and disconnecting the cooling system simpler and faster. This modular design facilitates system maintenance and upgrades, allowing the cooling system to be adjusted or replaced without affecting other components, improving system maintainability.

[0064] The blind plug 15 design allows for quick and easy connection of the main heat exchange channel 12 and the processor channel 14 to an external cooling system. This design allows the system to more flexibly adapt to varying cooling requirements and configuration changes. Whether adding a new cooling circuit or adjusting an existing cooling solution, the blind plug 15 provides convenient interface support.

[0065] In some possible implementations, at one blind plug 15 , the main liquid inlet channel connected to the blind plug 15 is divided into two to form the liquid inlet channel of the main heat exchange channel 12 and the processor channel 14 ; at another blind plug 15 , the liquid outlet channels of the main heat exchange channel 12 and the processor channel 14 are combined into one to form the main liquid outlet channel connected to the blind plug 15 .

[0066] In some possible implementations, the functional device 30 includes a functional component 31 and a functional cold plate 32. The functional component 31 is disposed on the functional cold plate 32. The functional cold plate 32 is provided with a heat conducting block 321. The functional cold plate 32 is fixed to the cold plate tray 10, and the heat conducting block 321 is in contact with the cold plate tray 10.

[0067] For the functional component 31 that needs to be hot-swapped, the functional component 31 and the functional cold plate 32 can be fixed into a module first, and then slid into the cold plate tray 10 , so that the heat conducting block 321 on the functional cold plate 32 contacts the cold plate tray 10 .

[0068] The heat conducting blocks 321 on the functional cold plate 32 are in direct contact with the cold plate tray 10, ensuring that the heat generated by the functional component 31 is quickly transferred to the cold plate tray 10. This design effectively utilizes the heat dissipation capacity of the cold plate tray 10, improves the heat dissipation efficiency of the functional component 31, and ensures stable operation of the equipment under high load conditions.

[0069] By placing the functional component 31 on the functional cold plate 32 and utilizing heat transfer blocks 321 for heat conduction, the system can better manage the heat of different components. This design allows the heat load of the functional component 31 to be independently managed, preventing local overheating and improving the overall thermal balance of the system. The contact between the heat transfer blocks 321 and the cold plate tray 10 not only provides an excellent heat conduction path but also enhances the mechanical stability of the functional component 31. This tight structural connection reduces the risk of component loosening or damage due to vibration or impact.

[0070] The functional cold plate 32 is fixed to the cold plate tray 10. This modular design simplifies the installation and removal of the functional components 31. Users can easily replace or upgrade functional components 31 without extensive system disassembly, reducing maintenance time and complexity. This design allows for flexible adjustment or replacement of functional components 31 without affecting other components, enabling the system to quickly adapt to changing application requirements and environmental changes, thereby improving the adaptability of the equipment.

[0071] In some possible implementations, the functional device 30 further includes a connector 33. The connector 33 is provided on a side of the functional device 30 facing the main board 20. The functional component 31 is electrically connected to the main board 20 via the connector 33.

[0072] Through the layout of the connector 33, the functional device 30 can be plugged into the mainboard 20 and fixed to the cold plate tray 10 by screws, etc., realizing a cable-free design, good maintenance and convenient assembly, and reducing a series of impacts caused by cable wiring.

[0073] The connector 33 is provided on the side of the functional device 30 facing the mainboard 20, so that the functional component 31 can be directly electrically connected to the mainboard 20 through the connector 33. This design simplifies the electrical connection process, reduces the complexity of wiring and possible wiring errors, and improves installation efficiency. By using the connector 33 for electrical connection, the installation and removal of the functional component 31 becomes simpler and faster. This modular design facilitates maintenance and upgrades of the system, allowing the functional component 31 to be replaced or upgraded without affecting other components, thereby improving the maintainability of the system. At the same time, the design of the connector 33 makes the electrical connection more compact and reduces the internal space occupied. This layout optimization provides more flexibility for the arrangement of other components and improves the overall integration of the system.

[0074] Connector 33 provides a stable electrical connection interface, reducing interference and loss during signal transmission. This design enhances signal transmission reliability between functional component 31 and motherboard 20, ensuring stable system operation. The use of connector 33 allows for rapid configuration and reconfiguration of functional components 31 for diverse application scenarios. This flexibility enables the system to adapt to diverse functional requirements and environmental changes, enhancing the device's adaptability and scalability.

[0075] In some possible implementations, the heat conducting block 321 is disposed on a side of the functional cold plate 32 facing the mainboard 20 and is arranged side by side with the connector 33 .

[0076] The functional cold plate 32 near the rear connector 33 avoids the connector 33 and contacts the cold plate tray 10 through the rear heat conduction block 321. The cross-sectional area of ​​the heat conduction block 321 is maximized to transfer heat from the functional component 31 to the cold plate tray 10 for dissipation.

[0077] The heat conduction block 321 is directly located on the side of the functional cold plate 32 facing the motherboard 20, allowing heat to be more directly transferred to the cold plate tray 10. This compact heat conduction path reduces thermal resistance, improves the heat dissipation efficiency of the functional component 31, and ensures stable operation of the device under high load conditions.

[0078] Placing the heat conducting block 321 and connector 33 side by side effectively utilizes limited space. This layout design allows electrical connections and thermal management functions to be implemented on the same plane, avoiding interference between components and optimizing the use of internal space. This design allows for higher integration within a limited space, supporting the implementation of more functions. This high level of integration is particularly important for applications requiring high performance and compact design.

[0079] By arranging the heat conducting block 321 and connector 33 side by side, installation and maintenance are simplified. This compact assembly layout reduces installation steps and maintenance time, improving system maintainability. The side-by-side arrangement of the heat conducting block 321 and connector 33 provides enhanced mechanical stability. This compact structural layout reduces the risk of component loosening or damage due to vibration or shock, thereby improving system reliability.

[0080] In some possible implementations, the cross-section of the heat conducting block 321 is 18 mm*15 mm.

[0081] Figure 11 for Figure 2 The diagram shows the structure of the functional device of the computing node and the hard disk backplane.

[0082] like Figure 11As shown, in some possible implementations, computing node 100 further includes a hard disk backplane 40. Hard disk backplane 40 is provided with a hard disk connector 41. Functional component 31 includes a hard disk unit 34. Hard disk unit 34 is electrically connected to hard disk backplane 40 via connector 33. Hard disk backplane 40 is electrically connected to motherboard 20 via hard disk connector 41.

[0083] The layout of the hard disk connector 41 achieves a cable-free design, which is easy to maintain and assemble, and reduces a series of impacts caused by cable wiring.

[0084] The hard disk unit 34 is electrically connected to the hard disk backplane 40 via the connector 33, and the hard disk backplane 40 is electrically connected to the mainboard 20 via the hard disk connector 41. This design simplifies the connection path between the hard disk unit 34 and the mainboard 20, reduces wiring complexity, and improves the efficiency of system installation and configuration.

[0085] The hard drive backplane 40 and hard drive connector 41 provide a stable electrical connection interface, reducing interference and loss during signal transmission. This design enhances signal transmission reliability between the hard drive unit 34 and the motherboard 20, ensuring data integrity and stable system operation. The design of the hard drive backplane 40 makes the hard drive unit 34 more compact, reducing internal space requirements. This optimized layout provides greater flexibility for the placement of other components, improving the overall system integration.

[0086] The use of the hard drive backplane 40 facilitates the installation and removal of the hard drive units 34. Users can easily replace or upgrade hard drives without extensive system disassembly, reducing maintenance time and complexity. The hard drive backplane 40 also allows the system to more flexibly support varying numbers and types of hard drive units 34. This design allows for rapid adjustment of the hard drive configuration based on changing storage requirements, enhancing system scalability and adaptability.

[0087] In some possible implementations, the functional component 31 also includes an input and output module, a network interface module, and a security control module.

[0088] By integrating input and output modules, network interface modules, and security control modules, the computing node 100 provides a rich set of functional support. This diverse design of functional devices 30 enables the system to meet the needs of different application scenarios, thereby improving the device's applicability. This modular design allows for flexible configuration of different functional devices 30 based on specific needs. Users can select the appropriate module combination based on their application requirements, thereby improving the system's flexibility and scalability.

[0089] The integration of the network interface module provides an efficient data transmission path, supporting higher network bandwidth and lower latency. This is particularly important for applications requiring fast data exchange and high network performance. The integration of the security control module provides an additional layer of security to the system, effectively managing and protecting data access, authentication, and other security functions. This design enhances overall system security and protects sensitive data from unauthorized access.

[0090] By integrating these functional modules, the overall system design becomes more compact, reducing the need for external devices and connections. This integrated design simplifies system management and maintenance, improving operational efficiency. By integrating multiple functional modules into functional component 31, the system can more efficiently utilize internal space. This compact layout design provides greater flexibility in the placement of other components, improving the overall integration of the system.

[0091] Each computing node 100 may be provided with an input / output module, a network interface module, a security control module and a hard disk unit.

[0092] Figure 12 for Figure 2 The diagram shows the structure of the computing node and the power backplane.

[0093] like Figure 12 As shown, in some possible implementations, a power connector 23 is provided on a side of the mainboard 20 facing away from the functional device 30. The power connector 23 is used to electrically connect to the power backplane 203 of the server 200 when the computing node 100 is plugged into the server 200.

[0094] The layout of the power connector 23 achieves a cable-free design, which is easy to maintain and assemble, and reduces a series of impacts caused by cable wiring.

[0095] The power connector 23 is directly provided on the motherboard 20, so that the computing node 100 can be quickly docked with the power backplane 203 of the server 200 when inserted into the server 200. This design simplifies the power connection process, reduces installation time and complexity, and improves the deployment efficiency of the system. The direct docking design of the power connector 23 reduces the risk of misoperation that may occur during the connection process, such as damage caused by incorrect connection or excessive force. Its automatic docking feature ensures the reliability and consistency of each connection. The power connector 23 provides a stable electrical connection interface, ensuring reliable transmission of power. Through this design, the computing node 100 can obtain a stable power supply and reduce the risk of failure caused by poor power connection.

[0096] Placing the power connector 23 on the side of the mainboard 20 facing away from the functional device 30 helps optimize the use of internal space. This prevents the power cord from becoming entangled between the functional device 30 and other components, providing more flexibility for the layout of other components. Through the design of the power connector 23, the computing node 100 can be easily plugged into or unplugged from the server 200 without the need for complex power cord connections. This modular design facilitates maintenance and upgrades of the system, allowing for quick replacement or maintenance of the computing node 100, thereby improving the maintainability of the system. At the same time, this design allows the computing node 100 to be quickly deployed and reconfigured in different server 200 environments. Users can easily adjust the configuration of the computing node 100 as needed, improving the flexibility and scalability of the system.

[0097] Figure 13 for Figure 2 Schematic diagram of the structure of the computing node's memory and cold plate tray.

[0098] like Figure 13 As shown, in some possible implementations, the computing node 100 further includes a memory 24. The memory 24 is disposed on a side of the mainboard 20 facing the cold plate tray 10, so that the memory 24 contacts the cold plate tray 10.

[0099] The memory 24 is in direct contact with the cold plate tray 10, effectively transferring heat generated by the memory 24 to the cold plate tray 10 for dissipation. This design improves the heat dissipation efficiency of the memory 24, ensures stable operation of the memory module under high load conditions, and extends the service life of the memory 24.

[0100] Furthermore, placing the memory 24 on the side of the motherboard 20 facing the cold plate tray 10 helps optimize internal system space usage. This layout reduces wasted space and provides greater flexibility for the placement of other components. Direct contact between the memory 24 and the cold plate tray 10 reduces the need for additional heat sinks. This design simplifies the system's cooling solution, reducing complexity and cost. This allows for the integration of more memory 24 within a limited space, supporting higher memory 24 capacity and density to meet the demands of high-performance computing and data-intensive applications.

[0101] Through effective thermal management, the operating temperature of memory 24 is kept within a safe range, reducing the risk of failure due to overheating and improving overall system reliability. Effective thermal management allows memory 24 to operate at a lower temperature, which helps improve memory 24's performance and responsiveness. Lower operating temperatures can reduce heat-induced delays and errors, thereby improving overall system performance.

[0102] Figure 14 for Figure 13The diagram shows the structure of the second memory and the memory cold plate.

[0103] like Figure 14 As shown, in some possible implementations, the computing node 100 further includes a memory cold plate 25. The memory 24 includes a first memory 241 and a second memory 242. The first memory 241 and the second memory 242 are stacked on the motherboard 20. The first memory 241 is in direct contact with the cold plate tray 10. The memory cold plate 25 is disposed between the first memory 241 and the second memory 242 and is fixedly connected to the second memory 242. The memory cold plate 25 is provided with a cold plate boss 251, and the memory cold plate 25 is in contact with the cold plate tray 10 via the cold plate boss 251.

[0104] In order to ensure that the capacity of the memory 24 can meet the system requirements, a horizontal double-layer stacked structure is adopted for the memory 24. Since the memory 24 is a double-layer structure, the second memory 242 cannot directly dissipate heat through the cold plate tray 10. Therefore, an indirect heat dissipation method is provided. The second memory 242 is first fixed to the memory cold plate 25, wherein the memory cold plate 25 is designed with a cold plate boss 251 that can contact the cold plate tray 10. The height of this cold plate boss 251 is consistent with the height of the particles on the first memory 241, thereby solving the heat dissipation problem of the second memory 242 below, and the first memory 241 above will directly dissipate heat through the cold plate tray 10 to achieve node height optimization.

[0105] The first memory 241 is in direct contact with the cold plate tray 10, while the second memory 242 is in contact with the cold plate tray 10 via the memory cold plate 25 and the cold plate boss 251. This multi-layer heat dissipation path design ensures that each memory 24 can effectively dissipate heat, especially for stacked memories 24, which can disperse heat more evenly. Through the multi-layer heat dissipation path, the operating temperature of the memory 24 can be controlled within a safe range, reducing the risk of failure due to overheating and improving the overall reliability of the system. Through effective thermal management, the memory 24 can operate at a lower temperature, reducing the risk of performance degradation and failure caused by heat. This design improves the performance of the memory 24 and the overall stability of the system.

[0106] The design of stacked memory 24 and memory cold plate 25 effectively utilizes vertical space, allowing the system to increase memory 24 capacity without increasing the footprint. This optimized layout provides greater flexibility in the placement of other components. By stacking memory 24, the system can integrate more memory 24 capacity within a limited space. This high-density design is particularly important for high-performance computing applications that require large memory 24 capacities.

[0107] Furthermore, the layered design of the memory cold plate 25 and the memory 24 makes maintenance and upgrades easier. Users can easily replace or upgrade the memory 24 without having to disassemble the entire system on a large scale.

[0108] The heat-generating surfaces of all devices in the computing node 100 are on the same plane, and the memory cold plate 25 is also parallel to the first memory 241 and other devices on the motherboard 20. Therefore, the integrated cold plate tray 10 can solve the heat dissipation problem of all heat sources in the computing node 100.

[0109] In some possible implementations, the thickness of the memory 24 stack is 9.7 mm, and the thickness of the memory cold plate 25 is 4.4 mm.

[0110] In some possible implementations, a signal connector 26 is provided on a side of the mainboard 20 facing away from the functional device 30 . The signal connector 26 is used to electrically connect to the power backplane 203 of the server 200 when the computing node 100 is plugged into the server 200 .

[0111] The layout of the signal connector 26 achieves a cable-free design, which is easy to maintain and assemble, and reduces a series of impacts caused by cable wiring.

[0112] The signal connector 26 is directly provided on the motherboard 20, so that the computing node 100 can be quickly docked with the power backplane 203 of the server 200 when inserted into the server 200. This design simplifies the signal connection process, reduces installation time and complexity, and improves the deployment efficiency of the system. The direct docking design of the signal connector 26 reduces the risk of misoperation that may occur during the connection process, such as damage caused by incorrect connection or excessive force. Its automatic docking feature ensures the reliability and consistency of each connection. The signal connector 26 provides a stable electrical connection interface, ensuring reliable signal transmission. Through this design, the computing node 100 can obtain stable signal transmission and reduce the risk of failure due to poor connection.

[0113] Placing the signal connector 26 on the side of the mainboard 20 facing away from the functional device 30 helps optimize the use of internal space. This avoids the entanglement of signal lines between the functional device 30 and other components, providing more flexibility for the layout of other components. With this design, the computing node 100 can be easily plugged into or unplugged from the server 200 without the need for complex signal line connections. This modular design facilitates system maintenance and upgrades, allowing for quick replacement or maintenance of the computing node 100, thereby improving the maintainability of the system. At the same time, this design allows the computing node 100 to be quickly deployed and reconfigured in different server 200 environments. Users can easily adjust the configuration of the computing node 100 as needed, improving the flexibility and scalability of the system.

[0114] In some possible implementations, the cold plate tray 10 is provided with a receiving groove 19 , and the main plate 20 is disposed in the receiving groove 19 .

[0115] Specifically, the cold plate tray 10 includes a bottom plate 17 and side plates 18 connected to the bottom plate 17. The side plates 18 and the bottom plate 17 form a receiving groove 19. The main plate 20 is disposed in the receiving groove 19 and is in contact with the bottom plate 17. The cooling flow channel of the cold plate tray 10 is disposed in the bottom plate 17.

[0116] In some possible implementations, the cold plate tray 10 is provided with fixing studs 16 , and the main board 20 is connected to the cold plate tray 10 via the fixing studs 16 .

[0117] Specifically, the fixing stud 16 is disposed in the receiving groove 19 . More specifically, the fixing stud 16 is disposed on a side of the bottom plate 17 facing the main plate 20 .

[0118] The mounting studs 16 provide a strong mechanical connection, securing the motherboard 20 securely to the cold plate tray 10. This design improves the structural stability of the entire compute node 100 and reduces the risk of loosening or damaging components due to vibration or shock. By directly securing the motherboard 20 to the cold plate tray 10, heat is more efficiently transferred from the motherboard 20 to the cold plate tray 10 for dissipation. This design helps improve the system's heat dissipation efficiency and ensures stable component operation under high load conditions.

[0119] The use of mounting studs 16 simplifies the installation and removal of the motherboard 20. These studs provide clear positioning and securing points, making installation more intuitive and quicker while also simplifying subsequent maintenance and upgrades. They also provide precise alignment points, ensuring a secure connection between the motherboard 20, the cold plate tray 10, and other components. This precise alignment helps optimize the reliability of electrical connections and signal transmission.

[0120] The even distribution of fixing studs 16 on the motherboard 20 effectively disperses mechanical stress and reduces deformation of the motherboard 20 due to thermal expansion or other physical factors. This design helps extend the service life of the motherboard 20 and other connected components. The use of fixing studs 16 supports a modular design, allowing the motherboard 20 to be replaced or upgraded as a standalone module. This modular design improves system flexibility and maintainability, facilitating rapid response to technology upgrades or troubleshooting.

[0121] The computing node 100 provided in an embodiment of the present application includes a cold plate tray 10, a motherboard 20, and a functional device 30. The motherboard 20 is carried on the cold plate tray 10 to dissipate heat through the cold plate tray 10. The functional device 30 is fixed to the cold plate tray 10 and is electrically connected to the motherboard 20. The cold plate tray 10 is provided with a groove 111, which is located on the side of the cold plate tray 10 facing away from the motherboard 20. The groove 111 is used to cooperate with the partition 202 of the server 200.

[0122] Since the computing node 100 adopts the cold plate tray 10 design, the motherboard 20 is directly carried on the cold plate tray 10, so that heat can be more efficiently conducted and dissipated through the cold plate tray 10. Compared with the traditional air cooling system, the cold plate tray 10 provides a larger heat dissipation surface area, significantly improving the heat dissipation efficiency, thereby ensuring the stable operation of the equipment under high-density deployment. Compared with the traditional laying of liquid cooling pipes, the cold plate tray 10 integrates the functions of the tray and the cold plate, thereby saving the thickness space of the computing node 100. The functional device 30 is fixed to the cold plate tray 10 and electrically connected to the motherboard 20. This design not only simplifies the layout of the components, but also avoids the overly close arrangement between the components, reducing the blockage problem of the heat dissipation channel. Through reasonable layout design, the computing node 100 can achieve a higher degree of integration without increasing the volume. The cold plate tray 10 is provided with a groove 111, which cooperates with the partition 202 of the server 200, providing flexible installation and adaptability. At the same time, the design of the groove 111 offsets the impact of the thickness of the partition 202 between the computing nodes 100 on the height direction of the server 200. This design allows the computing node 100 to be quickly deployed in different types of server 200 environments, improving the compatibility and adaptability of the device. Therefore, the computing node 100 of the present invention not only improves computing expansion capabilities and heat dissipation efficiency, but also improves the stability and applicability of the device, and can better meet the needs of data-intensive applications for high-density data processing.

[0123] In addition, the embodiment of the present application further provides a server 200, which includes a chassis 201, a partition 202, and a plurality of computing nodes 100. The computing nodes 100 are inserted into the chassis 201 via the partition 202.

[0124] Since the server 200 in this embodiment includes the liquid computing node 100 described in any of the above embodiments, the server 200 includes the structure and beneficial effects of the computing node 100, which will not be further described in this embodiment.

[0125] By using partitions 202 to insert multiple computing nodes 100 into the chassis 201, the server 200 can achieve a highly modular design. Each computing node 100 can be maintained separately without affecting each other. This design allows computing nodes 100 to be added or removed as needed, thereby easily expanding or reducing the computing power of the system. The computing nodes 100 are inserted into the chassis 201 through the partitions 202, making the installation and removal process easier. The partitions 202 provide additional physical support and isolation, reducing the risk of loosening or damage to components due to vibration or impact. At the same time, the partitions 202 can help reduce electromagnetic interference and improve the reliability of signal transmission. Users can quickly replace or upgrade computing nodes 100 without large-scale disassembly of the entire server 200, reducing maintenance difficulty and time.

[0126] Since the computing node 100 can be maintained independently and plugged in and out together with the cold plate tray 10, water, electricity and signals can be automatically cut off without affecting the operation of other computing nodes 100, thereby minimizing the reliability explosion radius.

[0127] The use of partitions 202 enables computing nodes 100 to be arranged in a compact and orderly manner within chassis 201, maximizing the use of internal space. This optimized layout provides greater flexibility in the placement of other components, improving the overall integration of the system. This design allows server 200 to flexibly configure computing nodes 100 based on different application requirements. Users can select the appropriate node combination based on specific computing tasks or load requirements, improving system adaptability and management efficiency.

[0128] The design of the partition 202 can also form an effective airflow channel between the computing nodes 100, promoting air flow and heat dissipation. This design helps maintain the system temperature within a safe range and improves the heat dissipation efficiency and stability of the server 200.

[0129] In some possible implementations, the depth of the groove 111 is less than or equal to the thickness of the partition 202 .

[0130] The appropriate depth of groove 111 ensures that compute node 100 is securely embedded during installation, preventing looseness or instability caused by excessive groove 111. This design helps ensure the safety and stability of the component during transportation or operation. The depth of groove 111 matches the thickness of partition 202, ensuring the rational use of the internal space of chassis 201. This maximizes the available space within chassis 201 and provides greater flexibility for the layout of other components.

[0131] By limiting the depth of the groove 111 , the impact of errors and deviations that may occur during the manufacturing and assembly process on system performance can be reduced, thereby improving the reliability and consistency of the system.

[0132] By limiting the depth of groove 111 to within the thickness of partition 202, the overall structural strength of partition 202 is maintained. This design avoids the potential loss of partition 202 strength caused by an excessively deep groove 111, thereby improving the stability and durability of the entire system. A properly designed groove 111 depth also helps maintain good air flow, avoiding airflow obstruction caused by an excessively deep groove 111. This design helps improve the system's heat dissipation efficiency and ensures that components operate at an appropriate temperature.

[0133] In some possible implementations, the thickness of the partition 202 is 1 mm, and the depth of the groove 111 is less than or equal to 1 mm.

[0134] In some possible implementations, the cold plate tray 10 is provided with a blind plug 15, which is arranged on the side of the cold plate tray 10 away from the functional device 30. The blind plugs 15 include two, one of which is connected to the liquid inlet channel of the cold plate tray 10, and the other blind plug 15 is connected to the liquid outlet channel of the cold plate tray 10.

[0135] The blind plug 15 design allows the cold plate tray 10 to connect to the liquid cooling system without requiring precise alignment during installation. This design simplifies the installation and removal of the liquid cooling system, improving operational convenience and efficiency. The blind plug 15 provides an automatic docking function, reducing the risk of poor connections or leaks due to human error. This design improves the reliability and safety of the liquid cooling system and ensures stable operation. Through the design of the liquid inlet and outlet channels, the cold plate tray 10 can efficiently circulate liquid, effectively removing heat. This design helps improve the system's heat dissipation efficiency and ensure that components maintain a suitable temperature under high load conditions.

[0136] At the same time, the blind plug 15 design reduces the need for external piping and connectors, optimizes space utilization within chassis 201, reduces the complexity of the liquid cooling system, and lowers the overall system cost. Through the design of the blind plug 15, the cold plate tray 10 can be quickly deployed and reconfigured in different system configurations, allowing users to easily adjust the configuration of the liquid cooling system as needed, improving the flexibility and scalability of the system. The use of the blind plug 15 supports a modular design, allowing the cold plate tray 10 to be replaced or upgraded as a standalone module. This modular design improves the flexibility and maintainability of the system, facilitating rapid response to technology updates or troubleshooting.

[0137] Figure 15 for Figure 2 The diagram shows the structure of the computing node and the water distributor.

[0138] like Figure 15 As shown, in some possible implementations, server 200 further includes an inlet water splitter 204 and an outlet water splitter 205. One end of the inlet water splitter 204 is connected to the blind plugs 15 that connect the computing nodes 100 to the liquid inlet flow channel, and the other end is provided with a water inlet 206. One end of the outlet water splitter 205 is connected to the blind plugs 15 that connect the computing nodes 100 to the liquid outlet flow channel, and the other end is provided with a water outlet 207.

[0139] The use of the water inlet manifold 204 and the water outlet manifold 205 can effectively organize and manage the pipe connections of the liquid cooling system. By centrally managing the water inlet and outlet flow channels, complex pipeline layouts are reduced, making the system neater and easier to maintain. The water inlet manifold 204 and the water outlet manifold 205 centrally manage liquid flow, simplifying the installation and maintenance process of the liquid cooling system. Users can more easily inspect, clean and maintain the system, improving operational efficiency. Through the design of the water inlet manifold 204 and the water outlet manifold 205, the crossing and entanglement of pipes in the liquid cooling system can be reduced, and the space utilization inside the chassis 201 can be optimized. This layout optimization provides more flexibility for the layout of other components. The water inlet manifold 204 and the water outlet manifold 205 can evenly distribute coolant to each computing node 100, ensuring that each node can obtain sufficient coolant for heat dissipation. This uniform fluid distribution helps to improve the heat dissipation efficiency of the overall system and maintain the temperature of each node stable.

[0140] At the same time, centralized management of water inlet manifold 204 and water outlet manifold 205 reduces the risk of leaks and poor connections in the liquid cooling system, improving its reliability and safety and ensuring stable operation. The use of water inlet manifold 204 and water outlet manifold 205 also supports a modular design, allowing the liquid cooling system to be easily expanded or reduced as needed. Users can adjust coolant distribution based on the system's cooling requirements, improving system flexibility and scalability.

[0141] In some possible implementations, the number of computing nodes 100 is eight, with four computing nodes 100 forming a group. Along the height direction of the chassis 201, the four computing nodes 100 in each group are stacked.

[0142] By stacking the computing nodes 100 along the height of the chassis 201, vertical space can be maximized. This design allows more computing nodes 100 to be accommodated within the limited volume of the chassis 201, thereby increasing the system's computing density. The stacking design can support higher computing density and is suitable for application scenarios requiring high-performance computing capabilities, such as AI servers, edge servers, data centers, cloud computing, and scientific computing. This stacking design supports modular expansion, allowing users to increase or decrease the number of computing nodes 100 as needed to meet different computing needs. This flexibility enables the system to adapt to changing workloads and application requirements.

[0143] The stacked compute nodes 100 layout simplifies wiring for power and signal connections. A rational layout design reduces cable length and complexity, improving system cleanliness and ease of maintenance. Through a modular stacking design, each compute node 100 in the system can be independently maintained and replaced, minimizing the impact on other nodes. This design improves system reliability and stability, facilitating troubleshooting and maintenance. The vertical stacking design utilizes a combination of natural convection and forced air cooling to enhance heat dissipation efficiency.

[0144] The water distribution system in the chassis 201 is also designed to be divided into four water distributors, namely two water inlet distributors 204 and two water outlet distributors 205, with two total water inlets and two total water outlets, realizing eight inlets and eight outlets of the coolant on the corresponding computing node 100.

[0145] In some possible implementations, chassis 201 is a 2U chassis. Each computing node 100 is provided with two processors 21 and 32 memories 24, thereby achieving a layout of 8 computing nodes 100, 16 processors 21, and 256 memories 24 in a 2U space.

[0146] The height of each computing node 100 is only 0.5U (22mm), which increases the number of configurations within a unit volume of the computing node 100.

[0147] The above is a detailed introduction to a computing node and server provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core ideas of this application. It should be noted that, for those skilled in the art, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A computing node, characterized in that: The present invention comprises a cold plate tray, a mainboard and a functional device, wherein the mainboard is carried on the cold plate tray so as to dissipate heat through the cold plate tray, and the cold plate tray is an integrated cold plate, which integrates the functions of the tray and the cold plate to save the thickness space of the computing node; the functional device is fixed to the cold plate tray and electrically connected to the mainboard to simplify the layout of the components, avoid too close arrangement between the components, and reduce the blockage problem of the heat dissipation channel; the cold plate tray is provided with a groove, the groove is located on the side of the cold plate tray away from the mainboard and the groove is provided on two edges of the cold plate tray, the groove is used to cooperate with the partition of the server; when the computing node is inserted into the server, the groove is used to accommodate the partition to offset the influence of the thickness of the partition between the computing nodes on the height of the server; The computing node also includes a processor, which is arranged on the side of the mainboard facing the cold plate tray. The cold plate tray is provided with a main cold plate, a main heat exchange flow channel, a processor cold plate and a processor flow channel. The main heat exchange flow channel is provided on the main cold plate. The mainboard is carried on the main cold plate to dissipate heat through the main cold plate. The processor cold plate is provided on the main cold plate and opposite to the processor. The processor flow channel is connected to the processor cold plate.

2. The computing node according to claim 1, wherein: The computing node further includes a spring screw and a processor. The processor is disposed on a side of the mainboard facing the cold plate tray. The spring screw passes through the cold plate tray and is connected to the processor so that the processor contacts the cold plate tray.

3. The computing node according to claim 2, characterized in that The spring screw includes a spring and a stud. The stud passes through the cold plate tray and is connected to the processor. The spring is sleeved on the stud and is arranged on a side of the cold plate tray away from the processor.

4. The computing node according to claim 1, wherein: The cold plate tray is provided with a blind plug, which is arranged on a side of the cold plate tray away from the functional device, and the main heat exchange flow channel and the processor flow channel are respectively communicated with the blind plug. The computing node according to claim 1 , wherein: The functional device includes a functional component and a functional cold plate. The functional component is arranged on the functional cold plate. The functional cold plate is provided with a heat conducting block. The functional cold plate is fixed to the cold plate tray, and the heat conducting block is in contact with the cold plate tray.

6. The computing node according to claim 5, characterized in that The functional device further includes a connector, which is provided on a side of the functional device facing the main board, and the functional component is electrically connected to the main board via the connector.

7. The computing node according to claim 6, characterized in that The heat conducting block is arranged on a side of the functional cold plate facing the main board and is arranged side by side with the connector.

8. The computing node according to claim 5, characterized in that The computing node also includes a hard disk backplane, which is provided with a hard disk connector. The functional component includes a hard disk unit, which is electrically connected to the hard disk backplane via the connector, and the hard disk backplane is electrically connected to the mainboard via the hard disk connector.

9. The computing node according to claim 5, characterized in that The functional components also include input and output modules, network interface modules, and security control modules.

10. The computing node according to claim 1, wherein: A power connector is provided on a side of the mainboard facing away from the functional device. The power connector is used to be electrically connected to a power backplane of the server when the computing node is plugged into the server.

11. The computing node according to claim 1, wherein: The computing node further includes a memory, and the memory is disposed on a side of the mainboard facing the cold plate tray, so that the memory contacts the cold plate tray.

12. The computing node according to claim 11, characterized in that The computing node also includes a memory cold plate. The memory includes a first memory and a second memory. The first memory and the second memory are stacked on the mainboard. The first memory is in direct contact with the cold plate tray. The memory cold plate is arranged between the first memory and the second memory and is fixedly connected to the second memory. The memory cold plate is provided with a cold plate boss. The memory cold plate is in contact with the cold plate tray through the cold plate boss.

13. The computing node according to claim 1, wherein: A signal connector is provided on a side of the mainboard facing away from the functional device. The signal connector is used to be electrically connected to a power backplane of the server when the computing node is plugged into the server.

14. The computing node according to claim 1, wherein: The cold plate tray is provided with a receiving groove, and the main board is arranged in the receiving groove.

15. The computing node according to claim 14, characterized in that: The receiving groove is provided with fixing studs, and the mainboard is connected to the cold plate tray through the fixing studs.

16. A server, characterized in that: The computer comprises a chassis, a partition, and a plurality of computing nodes according to any one of claims 1 to 15, wherein the computing nodes are inserted into the chassis through the partition.

17. The server according to claim 16, wherein: The depth of the groove is less than or equal to the thickness of the partition.

18. The server according to claim 16, wherein: The cold plate tray is provided with a blind plug, which is provided on the side of the cold plate tray away from the functional device. The blind plugs include two, one of which is connected to the liquid inlet channel of the cold plate tray, and the other is connected to the liquid outlet channel of the cold plate tray. The server also includes a water inlet distributor and a water outlet distributor. One end of the water inlet distributor is respectively connected to the blind plugs that connect the multiple computing nodes to the liquid inlet channel, and the other end is provided with a water inlet. One end of the water outlet distributor is respectively connected to the blind plugs that connect the multiple computing nodes to the liquid outlet channel, and the other end is provided with a water outlet.

19. The server according to claim 16, wherein: The computing nodes include eight nodes, four of which form a group, and the four computing nodes in each group are stacked along the height direction of the chassis.

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