Cold plate type heat dissipation device and server

Abstract

The utility model relates to the technical field of server heat dissipation, in particular to a cold plate type heat dissipation device and a server. A cold plate type heat dissipation device is used for heat dissipation of a server, the cold plate type heat dissipation device comprises a heat dissipation assembly and a pipeline assembly, the heat dissipation assembly comprises a plurality of cold plates, the cold plates are independently arranged, each cold plate inwards forms a liquid cooling flow channel, and each liquid cooling flow channel is provided with an inlet and an outlet; the pipeline assembly comprises a liquid inlet pipe and a return pipe, the liquid inlet pipe is communicated with the multiple inlets in parallel, and the return pipe is communicated with the multiple outlets in parallel; wherein the cold plate is provided with a heat dissipation part, and the heat dissipation part is used for being attached to a chip of the server so as to dissipate heat of the chip; the projection of the heat dissipation part towards the inlet in the thickness direction of the cold plate can cover the inlet. The cold plates are arranged in parallel, so that the temperature of the cooling liquid entering each cold plate is closer, and each cold plate can effectively absorb and dissipate heat.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server heat dissipation, in particular to a cold plate type heat dissipation device and a server. BACKGROUND

[0002] In the process of server running, with the continuous improvement of its performance, the heat generated is also increasing. Effective heat dissipation is crucial for the stable operation and performance of the server. The traditional server heat dissipation method, such as fan heat dissipation, often has poor heat dissipation effect when facing high-power and high-density server chips, and it is difficult to meet the heat dissipation demand.

[0003] Liquid cooling heat dissipation as a kind of efficient heat dissipation method gradually attracts attention. However, the existing liquid cooling heat dissipation device all adopts single cold plate system or series cold plate system. Single cold plate system uses a single cold plate to cool the GPU module of the server. When applied to the heat dissipation of multi-GPU module server, the single cold plate needs a lot of quick connection and pipelines, which requires higher internal space of the case and the cost will also increase accordingly. The series cold plate system uses multiple cold plates in series to cool the GPU module of the server. The series of multiple cold plates will cause large internal liquid resistance, and the requirement for the circulating water pump will also be higher accordingly. Moreover, the cooling liquid of the series cold plate flows through the front and rear chips in turn, resulting in a large temperature difference of the cooling liquid entering the front and rear chip cold plates, which will cause the problem of uneven heat dissipation effect. CONTENT OF THE UTILITY MODEL

[0004] Therefore, it is necessary to provide a cold plate type heat dissipation device with uniform heat dissipation effect and reduced internal flow resistance.

[0005] To solve the above technical problems, the present application provides the following technical solutions:

[0006] A cold plate type heat dissipation device for dissipating heat for a server, comprising:

[0007] a heat dissipation assembly comprising a plurality of cold plates, the plurality of cold plates being independently arranged with each other, wherein each of the cold plates is formed with a liquid cooling flow channel inwardly, and the liquid cooling flow channel has an inlet and an outlet;

[0008] a pipeline assembly comprising an inlet pipe and a return pipe, the inlet pipe being in parallel communication with the plurality of inlets, and the return pipe being in parallel communication with the plurality of outlets;

[0009] wherein the cold plate has a heat dissipation part for adhering to a chip of the server to dissipate heat for the chip, and a projection of the heat dissipation part along a thickness direction of the cold plate towards the inlet can cover the inlet.

[0010] It can be understood that by arranging the cold plates in parallel and the projection of the heat dissipation part along the thickness direction of the cold plate towards the inlet can cover the inlet. During heat dissipation, the cooling liquid enters the heat dissipation part of different cold plates through the parallelly connected inlet pipes, and after cooling, the cooling liquid returns from the cold plate through the also parallelly connected return pipes. The parallelly arranged cold plates can disperse the cooling liquid flow among multiple cold plates, and the temperature of the cooling liquid entering each cold plate is the same, which can ensure that each cold plate can effectively absorb and dissipate heat. Moreover, the cooling liquid can directly reach the heat dissipation part through the inlet, so that the temperature of the cooling liquid entering the heat dissipation part is lower, thereby improving the heat dissipation uniformity and heat dissipation effect of the cold plate type heat dissipation device when dissipating heat for the server. In addition, the configuration of the parallel cold plates can be adjusted according to actual needs, and the number of cold plates can be increased or decreased according to heat dissipation needs, thereby being able to flexibly adapt to different heat dissipation scenes.

[0011] In one of the embodiments, the cold plate comprises a cold plate upper cover, a cold plate lower cover and a boss lower cover, the cold plate lower cover is connected with the cold plate upper cover and the boss lower cover respectively, so that the cold plate upper cover, the cold plate lower cover and the boss lower cover jointly enclose the liquid cooling flow channel;

[0012] The inlet and the outlet are arranged on the cold plate upper cover, and the heat dissipation part is arranged on the boss lower cover.

[0013] In one of the embodiments, the boss lower cover further comprises a heat dissipation fin group, the heat dissipation fin group is arranged on the heat dissipation part and is inserted and matched with the cold plate lower cover.

[0014] The heat dissipation part abuts against and is connected and sealed with the cold plate lower cover.

[0015] It can be understood that by arranging the heat dissipation fin group on the heat dissipation part, the heat dissipation area between the boss lower cover and the cooling liquid can be effectively increased when the cooling liquid flows into the heat dissipation fin group, thereby improving the heat dissipation effect of the boss lower cover.

[0016] In one of the embodiments, a reinforcing rib is connected between the cold plate upper cover and the cold plate lower cover, and the reinforcing rib is arranged in the liquid cooling flow channel.

[0017] It can be understood that by connecting the reinforcing rib between the cold plate upper cover and the cold plate lower cover, on the one hand, the connection strength between the cold plate upper cover and the cold plate lower cover can be improved, and the cold plate upper cover and the cold plate lower cover can withstand the flow of cooling liquid with higher pressure; on the other hand, the reinforcing rib can also disturb the flow of the cooling liquid between the cold plate upper cover and the cold plate lower cover, so as to reduce the flow rate of the cooling liquid, thereby further improving the heat dissipation effect that can be achieved by the cold plate.

[0018] In one of the embodiments, a hollow part is formed on the upper cover of the cold plate.

[0019] The projection of the boss lower cover along the thickness direction of the cold plate towards the upper cover of the cold plate is independently arranged relative to the hollow part.

[0020] It can be understood that the hollow part of the upper cover of the cold plate is designed to correspond to the part with lower heat dissipation requirement of the server. By arranging the hollow part, the amount of material required for manufacturing the upper cover of the cold plate can be reduced, which not only reduces the manufacturing cost of the upper cover of the cold plate, but also reduces the weight of the whole cold plate, making the cold plate more convenient to install.

[0021] In one of the embodiments, a heat-conducting pad is attached to the heat dissipation part, and the heat dissipation part can dissipate heat from the chip through the heat-conducting pad.

[0022] The material of the heat-conducting pad is configured as a thermal interface material.

[0023] It can be understood that by attaching the heat-conducting pad of the thermal interface material to the heat dissipation part, the heat generated by the chip is quickly transferred to the cold plate for heat dissipation, thereby improving the heat dissipation efficiency of the heat dissipation part for the chip.

[0024] In one of the embodiments, a detection sensor is installed on the cold plate, which can detect whether the liquid cooling flow channel leaks and generate a feedback signal.

[0025] It can be understood that by arranging the detection sensor, the cold plate has the function of detecting leakage, which can achieve the purpose of monitoring the working of the cold plate type heat dissipation device.

[0026] In one of the embodiments, the cold plate type heat dissipation device further comprises a connecting bracket, and a plurality of cold plates are installed on the connecting bracket.

[0027] The position of the cold plate in the thickness direction of the cold plate can be adjusted relative to the connecting bracket.

[0028] In one of the embodiments, the heat dissipation assembly and the pipeline assembly are combined to form a heat dissipation module.

[0029] The number of heat dissipation modules is configured as multiple, and multiple heat dissipation modules are arranged in sequence along a first direction.

[0030] The application also provides the following technical solutions:

[0031] A server comprises the cold plate type heat dissipation device of any one of the embodiments.

[0032] Compared with the prior art, the cold plate type heat dissipation device can cover the inlet by arranging the cold plates and the projection of the heat dissipation part along the thickness direction of the cold plate towards the inlet. When dissipating heat, the cooling liquid enters the heat dissipation part of different cold plates through the parallelly connected liquid inlet pipes, and after cooling, the cooling liquid returns through the parallelly connected return pipes. The parallelly arranged cold plates can disperse the cooling liquid flow among the cold plates, and the temperature of the cooling liquid entering each cold plate is the same, so that each cold plate can effectively absorb and dissipate heat. Moreover, the cooling liquid can directly reach the heat dissipation part through the inlet, so that the temperature of the cooling liquid entering the heat dissipation part is lower, thereby improving the heat dissipation uniformity and heat dissipation effect of the cold plate type heat dissipation device when dissipating heat for the server. In addition, the configuration of the parallelly arranged cold plates can be adjusted according to actual needs, and the number of cold plates can be increased or decreased according to the heat dissipation demand, so that different heat dissipation scenes can be flexibly adapted. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0034] Figure 1 A perspective view of the structure of the cold plate type heat dissipation device provided by the present application.

[0035] Figure 2 A perspective view of the structure of the cold plate type heat dissipation device provided by the present application. Figure 1 An enlarged view of A in the present application.

[0036] Figure 3 An exploded view of the cold plate provided by the present application.

[0037] Figure 4 A perspective view of the structure of the cold plate type heat dissipation device provided by the present application.

[0038] Figure 5 An exploded view of the cold plate provided by the present application.

[0039] The element reference numbers are as follows:

[0040] 100, cold plate heat dissipation device; 10, heat dissipation assembly; 11, cold plate; 111, upper cover of cold plate; 1111, inlet; 1112, outlet; 1113, hollow part; 112, lower cover of cold plate; 1121, heat dissipation pad; 113, boss lower cover; 1131, heat dissipation part; 11311, heat conduction pad; 1132, heat dissipation fin group; 114, reinforcing rib; 12, liquid cooling flow channel; 20, pipeline assembly; 21, liquid inlet pipe; 22, return pipe; 23, water nozzle; 231, T-shaped water nozzle; 232, L-shaped water nozzle; 30, detection sensor; 31, liquid leakage detection line; 40, connecting support; 41, fixed cover; 42, structural frame; 43, spring screw; 50, handle. DETAILED DESCRIPTION

[0041] To make the above objectives, features and advantages of the present application more clear and easily understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many different ways other than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0042] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used in the description of the present application are for the purpose of illustration only and do not indicate the only orientation of the implementation.

[0043] In addition, the terms "first", "second", etc. are used only for descriptive purposes and should not be construed as indicating or implying relative importance or an indicated number of technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0044] In the present application, unless specifically defined and limited otherwise, the first feature is "on", "under", "above" or "over" the second feature can be that the first feature is in direct contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, the first feature is "on", "above" and "over" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature is "under", "below" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.

[0045] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification of the present application includes any and all combinations of one or more related listed items.

[0046] Please refer to Figures 1 to 5 The present application provides a cold plate type heat dissipation device 100 for server heat dissipation of multi-GPU module.

[0047] Specifically, as Figures 1 to 5 shown, the cold plate type heat dissipation device 100 includes a heat dissipation assembly 10 and a pipeline assembly 20, the heat dissipation assembly 10 includes a plurality of cold plates 11, the plurality of cold plates 11 are independently arranged between each other, wherein each cold plate 11 is formed with a liquid cooling flow channel 12 inward, the liquid cooling flow channel 12 has an inlet 1111 and an outlet 1112; the pipeline assembly 20 includes a liquid inlet pipe 21 and a return pipe 22, the liquid inlet pipe 21 is in parallel communication with a plurality of inlets 1111, and the return pipe 22 is in parallel communication with a plurality of outlets 1112; wherein the cold plate 11 has a heat dissipation part 1131, the heat dissipation part 1131 is used for adhering to the chip (not shown in the figure) of the server, so as to dissipate heat for the chip; the projection of the heat dissipation part 1131 along the thickness direction of the cold plate 11 towards the inlet 1111 can cover the inlet 1111.

[0048] As can be seen from the above, by arranging the cold plates 11 in parallel and the projections of the heat dissipation portions 1131 along the thickness direction of the cold plates 11 towards the inlets 1111 can cover the inlets 1111, during heat dissipation, the cooling liquid enters the heat dissipation portions 1131 of different cold plates 11 through the parallelly connected inlet pipes 21 respectively, and after cooling is completed, the cooling liquid returns from the cold plates 11 through the also parallelly connected return pipes 22. The parallelly arranged cold plates 11 can disperse the cooling liquid flow among the multiple cold plates 11, the temperature of the cooling liquid entering each cold plate 11 is the same, which can ensure that each cold plate 11 can effectively absorb and dissipate heat, and the cooling liquid can directly reach the heat dissipation portions 1131 through the inlets 1111, so that the temperature of the cooling liquid entering the heat dissipation portions 1131 is lower, thereby improving the heat dissipation uniformity and heat dissipation effect of the cold plate type heat dissipation device 100 when dissipating heat for the server. In addition, the configuration of the parallelly arranged cold plates 11 can be adjusted according to actual needs, and the number of cold plates 11 can be increased or decreased according to heat dissipation needs, so as to be able to flexibly adapt to different heat dissipation scenes.

[0049] As can be seen from the above, by arranging the cold plates 11 in parallel and the projections of the heat dissipation portions 1131 along the thickness direction of the cold plates 11 towards the inlets 1111 can cover the inlets 1111, during heat dissipation, the cooling liquid enters the heat dissipation portions 1131 of different cold plates 11 through the parallelly connected inlet pipes 21 respectively, and after cooling is completed, the cooling liquid returns from the cold plates 11 through the also parallelly connected return pipes 22. The parallelly arranged cold plates 11 can disperse the cooling liquid flow among the multiple cold plates 11, the temperature of the cooling liquid entering each cold plate 11 is the same, which can ensure that each cold plate 11 can effectively absorb and dissipate heat, and the cooling liquid can directly reach the heat dissipation portions 1131 through the inlets 1111, so that the temperature of the cooling liquid entering the heat dissipation portions 1131 is lower, thereby improving the heat dissipation uniformity and heat dissipation effect of the cold plate type heat dissipation device 100 when dissipating heat for the server. In addition, the configuration of the parallelly arranged cold plates 11 can be adjusted according to actual needs, and the number of cold plates 11 can be increased or decreased according to heat dissipation needs, so as to be able to flexibly adapt to different heat dissipation scenes.

[0050] As Figure 2 shown, the pipeline assembly 20 further includes a water nozzle 23, the water nozzle 23 is welded with the cold plate upper cover 111, the inlet pipe 21 and the return pipe 22 are communicated with the cold plate upper cover 111 through the water nozzle 23 to realize parallel connection between the liquid cooling flow channels 12 of the cold plates 11. It can be understood that when the inlet pipe 21 and the return pipe 22 interfere with each other, different height water nozzles 23 can be arranged to avoid interference.

[0051] Here, the water nozzle 23 includes a T-shaped water nozzle 231 and an L-shaped water nozzle 232. The cooling water enters the T-shaped water nozzle 231 through the inlet pipe 21, is branched through the T-shaped water nozzle 231, and part of the cooling water enters the first cold plate 11 to flow in the first cold plate 11 to dissipate heat for the front chips. Another part of the cooling water flows to the L-shaped water nozzle 232 of the second cold plate 11 through the inlet pipe 21, enters the second cold plate 11 through the L-shaped water nozzle 232, and then flows out from the L-shaped water nozzle 232 of the second cold plate 11, flows to the T-shaped water nozzle 231 of the first cold plate through the return pipe 22, and then flows out after being combined with the cooling water from the first cold plate 11 to dissipate heat for the chips.

[0052] In an embodiment, as shown in Figure 3 and Figure 5 The cold plate 11 includes a cold plate upper cover 111, a cold plate lower cover 112, and a boss lower cover 113. The cold plate lower cover 112 is connected with the cold plate upper cover 111 and the boss lower cover 113 respectively, so that the cold plate upper cover 111, the cold plate lower cover 112, and the boss lower cover 113 jointly form the liquid cooling flow channel 12. The inlet 1111 and the outlet 1112 are arranged on the cold plate upper cover 111, and the heat dissipation part 1131 is arranged on the boss lower cover 113.

[0053] In the embodiment, the cold plate lower cover 112 is welded with the cold plate upper cover 111 and the boss lower cover 113 respectively.

[0054] Further, the cold plate upper cover 111 is formed with a hollow part 1113. The projection of the boss lower cover 113 along the thickness direction of the cold plate 11 towards the cold plate upper cover 111 is independently arranged relative to the hollow part 1113. By arranging the hollow part 1113, the amount of material required for manufacturing the cold plate upper cover 111 can be reduced, which not only reduces the manufacturing cost of the cold plate upper cover 111, but also reduces the weight of the whole cold plate 11, so that the cold plate 11 is more convenient to install.

[0055] In the embodiment, the cold plate lower cover 112 is attached with a heat dissipation pad 1121 at the projection position of the hollow part 1113 along the thickness direction of the cold plate 11. The heat dissipation pad 1121 is used to dissipate heat for the components of the server with lower heat dissipation requirements. The heat dissipation pad 1121 is mainly composed of a high polymer material such as silica gel and metal oxide particles, carbon fibers, and other heat-conducting fillers.

[0056] In an embodiment, the heat dissipation part 1131 is attached with a heat conduction pad 11311, and the heat dissipation part 1131 can dissipate heat from the chip through the heat conduction pad 11311; wherein the material of the heat conduction pad 11311 is configured as a thermal interface material. In this way, by attaching the heat dissipation part 1131 with the heat conduction pad 11311 of the thermal interface material, the heat generated by the chip is quickly transferred to the cold plate for heat dissipation by using the material properties of the thermal interface material, so as to improve the heat dissipation efficiency of the heat dissipation part 1131 to the chip. When the heat conduction pad 11311 is configured as a thermal interface material, the thermal interface material is melted after being in contact with the chip due to the high temperature of the chip, filling the extremely fine gap between the surface of the chip and the cold plate type heat dissipation device 100, and excluding air, so as to establish an effective heat conduction channel between the surface of the chip and the cold plate type heat dissipation device 100, ensuring good heat conduction performance and further improving the heat dissipation effect of the heat dissipation part 1131.

[0057] As shown in Figure 3 and Figure 5 , the boss lower cover 113 further comprises a heat dissipation fin group 1132, which is arranged on the heat dissipation part 1131 and is inserted and matched with the cold plate lower cover 112; wherein the heat dissipation part 1131 is attached to and sealed with the cold plate lower cover 112. By arranging the heat dissipation fin group 1132 on the heat dissipation part 1131, the contact area between the boss lower cover 113 and the cooling liquid can be effectively increased when the cooling liquid flows into the heat dissipation fin group 1132, so as to improve the heat dissipation effect of the boss lower cover 113.

[0058] Further, the cold plate upper cover 111 and the cold plate lower cover 112 are connected with a reinforcing rib 114, which is arranged in the liquid cooling flow channel 12. In this way, on the one hand, the connection strength between the cold plate upper cover 111 and the cold plate lower cover 112 can be improved, and the cold plate upper cover 111 and the cold plate lower cover 112 can withstand the flow of cooling liquid with higher pressure; on the other hand, the flow of cooling liquid between the cold plate upper cover 111 and the cold plate lower cover 112 can also be disturbed, so as to reduce the flow rate of the cooling liquid, thereby further improving the heat dissipation effect of the cold plate 11. Here, the liquid cooling flow channel 12 should be arranged with a longer flow path, so that the cooling liquid flows for a longer time, thereby making the cold plate 11 have better heat dissipation effect.

[0059] In an embodiment, the cold plate 11 is installed with a detection sensor 30, which can detect whether the liquid cooling flow channel 12 leaks and generate a feedback signal. By arranging the detection sensor 30, the cold plate 11 has the function of leak detection, so as to achieve the purpose of monitoring the working of the cold plate type heat dissipation device 100.

[0060] In the embodiment, the detection sensor 30 is configured as a leakage detection line 31 of an external circuit. When the leakage detection line 31 is arranged at a position where the pipeline is prone to leakage, the leakage detection line 31 is soaked by the cooling liquid to form a short circuit when the cooling liquid leaks, and the external circuit sends a reminder.

[0061] As shown in Figure 2 The cold plate type heat dissipation device 100 further comprises a connecting bracket 40, and the plurality of cold plates 11 are mounted on the connecting bracket 40. The cold plate 11 can be adjusted in position relative to the connecting bracket 40 in the thickness direction of the cold plate 11.

[0062] Further, the connecting bracket 40 comprises a fixing cover 41 and a structure frame 42, and the cold plate 11 is fixed on the fixing cover 41. When the cold plate 11 is thin, the fixing cover 41 is additionally arranged to increase the bending and torsion resistance of the structure. The structure frame 42 is connected to the fixing cover 41 to fix a plurality of cold plates, so that the plurality of cold plates can be mounted on the server together.

[0063] As shown in Figure 1 and Figure 2 The fixing cover 41 is locked and mounted on the server by a spring screw 43.

[0064] In an embodiment, the cold plate type heat dissipation device 100 further comprises a handle 50, so that the user can hold the cold plate type heat dissipation device 100 by the handle 50 during installation, thereby making the cold plate type heat dissipation device 100 more convenient to hold during installation.

[0065] As shown in Figure 1 and Figure 4 The heat dissipation assembly 10 and the pipeline assembly 20 are combined to form a heat dissipation module. The number of heat dissipation modules is configured to be multiple, for example, three, four, five, etc. The plurality of heat dissipation modules are arranged in sequence along the first direction x.

[0066] In the embodiment, the number of heat dissipation modules is configured to be four.

[0067] The application further provides a server comprising the cold plate type heat dissipation device 100 of any one of the above embodiments.

[0068] The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0069] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific manner, but should not be construed as limiting the scope of the patent application. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A cold plate type heat dissipation device for heat dissipation of a server, characterized in that, The cold plate heat dissipation device (100) includes: The heat dissipation assembly (10) includes multiple cold plates (11), which are independently arranged with each other. Each cold plate (11) has a liquid cooling channel (12) formed inward, and the liquid cooling channel (12) has an inlet (1111) and an outlet (1112). The piping assembly (20) includes an inlet pipe (21) and a return pipe (22), wherein the inlet pipe (21) is connected in parallel to a plurality of the inlets (1111), and the return pipe (22) is connected in parallel to a plurality of the outlets (1112); The cold plate (11) has a heat dissipation part (1131) for attaching to the chip of the server to dissipate heat from the chip; the projection of the heat dissipation part (1131) along the thickness direction of the cold plate (11) toward the inlet (1111) can cover the inlet (1111).

2. The cold plate heat dissipation device according to claim 1, characterized in that, The cold plate (11) includes a cold plate upper cover (111), a cold plate lower cover (112), and a boss lower cover (113). The cold plate lower cover (112) is connected to the cold plate upper cover (111) and the boss lower cover (113) respectively, so that the cold plate upper cover (111), the cold plate lower cover (112), and the boss lower cover (113) together enclose the liquid cooling channel (12). The inlet (1111) and the outlet (1112) are disposed on the cold plate cover (111), and the heat dissipation part (1131) is disposed on the boss lower cover (113).

3. The cold plate heat dissipation device according to claim 2, characterized in that, The lower cover of the boss (113) also includes a heat dissipation fin assembly (1132), which is disposed on the heat dissipation part (1131) and is inserted into the lower cover of the cold plate (112); The heat dissipation part (1131) abuts against the lower cover of the cold plate (112) and is connected and sealed to the lower cover of the cold plate (112).

4. The cold plate heat dissipation device according to claim 2, characterized in that, A reinforcing rib (114) is connected between the upper cover (111) of the cold plate and the lower cover (112) of the cold plate, and the reinforcing rib (114) is disposed in the liquid cooling channel (12).

5. The cold plate heat dissipation device according to claim 2, characterized in that, A hollow portion (1113) is formed on the top cover (111) of the cold plate. The projection of the lower cover of the boss (113) toward the upper cover of the cold plate (11) along the thickness direction of the cold plate (11) is independently set relative to the hollow part (1113).

6. The cold plate heat dissipation device according to claim 1, characterized in that, A thermal pad (11311) is attached to the heat dissipation part (1131), and the heat dissipation part (1131) can dissipate heat to the chip through the thermal pad (11311); The thermal pad (11311) is made of a thermal interface material.

7. The cold plate heat dissipation device according to claim 1, characterized in that, A detection sensor (30) is installed on the cold plate (11). The detection sensor (30) can detect whether the liquid cooling channel (12) is leaking and generate a feedback signal.

8. The cold plate heat dissipation device according to claim 1, characterized in that, The cold plate heat dissipation device also includes a connecting bracket (40), on which multiple cold plates (11) are mounted; wherein, the position of the cold plate (11) relative to the connecting bracket (40) can be adjusted in the thickness direction of the cold plate (11).

9. The cold plate heat dissipation device according to claim 1, characterized in that, The heat dissipation component (10) and the pipeline component (20) are combined to form a heat dissipation module; The number of heat dissipation modules is configured to be multiple, and the multiple heat dissipation modules are arranged sequentially at intervals along the first direction.

10. A server, characterized in that, Includes the cold plate heat dissipation device (100) as described in any one of claims 1 to 9.

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