Hidden touch diaphragm and display panel

Abstract

The invention discloses a hidden touch diaphragm and a display panel. The hidden touch diaphragm is of a layer structure and can comprise a first substrate layer and a second substrate layer, the one or more pattern layers are arranged on one side of the first substrate layer in a mutually stacked manner; a hidden layer is arranged on one side of the second substrate layer, and the hidden layer comprises a plurality of convex structures and a plurality of concave structures; the pattern layer and the hidden layer are oppositely arranged and are bonded through a first bonding layer; the touch layer comprises a plurality of conductive layers; the conductive layer comprises a base material layer and a conductive wire arranged in or on the base material layer; and the touch layer is arranged on the other side of the second substrate layer.

Description

Technical Field

[0001] The present application relates to the technical field of materials, and particularly to a hidden diaphragm with touch function and a display panel having the diaphragm. Background Art

[0002] In the prior art, a hidden diaphragm with a texture pattern forms a texture image with light transmittance by setting an image printing layer, and displays the texture image when there is no backlight illumination. The overall appearance is similar to that of an ordinary decorative piece, having decorativeness and light transmittance. When backlight illumination is present, the texture pattern is weakened and a hidden graphic is displayed. This characteristic of the hidden diaphragm can effectively integrate systems such as vehicle-mounted driving recorders, air conditioners, infotainment systems, vehicle door window switches, and ambient lights into an integrated display panel. The texture is displayed without backlight, and the functional image is displayed when backlight illumination is present.

[0003] However, traditional hidden diaphragms cannot achieve the touch function, which cannot meet the increasingly high visual requirements of users. Summary of the Invention

[0004] The technical problem to be solved by the present application is how to simultaneously implement the touch function in a hidden diaphragm.

[0005] To solve the above problems, the present application discloses a hidden touch diaphragm and a display panel. The hidden touch diaphragm can simultaneously achieve the functions of hiding and touching. The hidden pattern has higher precision and diverse image effects, including 3D relief effects or dynamic light and shadow effects. While meeting multiple functions, different viewing effects can be obtained by users from different viewing angles.

[0006] One aspect of the present application provides a hidden touch diaphragm. The hidden touch diaphragm is a layer structure and may include: a first base layer; one or more pattern layers disposed on one side of the first base layer in a stacked manner; a second base layer, with a hidden layer provided on one side of the second base layer, the hidden layer including a plurality of convex structures and a plurality of concave structures; the pattern layer is disposed opposite to the hidden layer and is adhered by a first adhesive layer; and a touch layer including a plurality of conductive layers, the conductive layer including a substrate layer and conductive wires disposed inside or on the substrate layer; the touch layer is disposed on the other side of the second base layer.

[0007] In a feasible implementation, the pattern layer includes a graphic printing layer and / or a structural layer having a plurality of micro-nano structures; the graphic printing layer is disposed on the base layer.

[0008] In a feasible implementation, the cross-section of the micro-nano structure includes a ramp shape, a rectangular shape, an arc shape, or a combination of any two or more of the above shapes; the period of the micro-nano structure is 1 μm - 200 μm.

[0009] In a feasible implementation, when the pattern layer is a structural layer, a first ink is filled between the plurality of micro-nano structures, and the first ink is light-transmissive.

[0010] In a feasible implementation, when the pattern layer includes a plurality of structural layers, the first inks filled between the micro-nano structures in different structural layers are the same and / or different.

[0011] In a feasible implementation, a coating layer is laminated on the outer surface of the micro-nano structure; the coating layer is made of a non-conductive material, including SiO2 and indium; the thickness of the coating layer is 80 nm - 260 nm.

[0012] In a feasible implementation, the plurality of convex structures and the plurality of concave structures are arranged at intervals on the hidden layer; the convex structure is a cylinder or a prism, the size of the convex structure is 5 μm - 80 μm, and the depth of the concave structure is 2 μm - 5 μm; the concave structure is filled with a second ink, and the second ink is light-impermeable.

[0013] In a feasible implementation, the thickness of the conductive wire is 6 μm - 20 μm, the substrate layer is a UV glue layer, and the thickness of the substrate layer is greater than the thickness of the conductive wire.

[0014] In a feasible implementation, the touch layer further includes a third base layer, and a plurality of conductive layers are disposed on the third base; the third base layer is adhered to the second base layer through a second adhesive layer.

[0015] On the other hand, the present application provides a display panel, and the display panel includes the hidden touch film as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present application will be further described by way of exemplary embodiments, and these exemplary embodiments will be described in detail through the drawings. These embodiments are not restrictive. In these embodiments, the same reference numerals represent the same structures, wherein:

[0017] Figure 1 is an exemplary schematic diagram of a hidden touch film according to some embodiments of the present application;

[0018] Figure 2 is another exemplary schematic diagram of a hidden touch film according to some embodiments of the present application;

[0019] Figure 3 is another exemplary schematic diagram of a hidden touch diaphragm shown in some embodiments of the present application;

[0020] Figure 4 is another exemplary schematic diagram of a hidden touch diaphragm shown in some embodiments of the present application;

[0021] Figure 5 is another exemplary schematic diagram of a hidden touch diaphragm shown in some embodiments of the present application;

[0022] Figure 6 is another exemplary schematic diagram of a hidden touch diaphragm shown in some embodiments of the present application;

[0023] Figure 7 is another exemplary schematic diagram of a hidden touch diaphragm shown in some embodiments of the present application;

[0024] Figure 8 is another exemplary schematic diagram of a hidden touch diaphragm shown in some embodiments of the present application. Detailed implementation manners

[0025] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0027] The terms "first" and "second" used herein are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0029] Some embodiments of this application will be described below with reference to the accompanying drawings. It should be noted that the following description is for illustrative purposes only and is not intended to limit the scope of protection of this application.

[0030] Figures 1 - 8 is an exemplary schematic diagram of a hidden touch diaphragm shown in some embodiments of this application. As Figures 1 - 8 shown, the hidden touch diaphragm 100 may include a first base layer 110, a pattern layer 120, a first adhesive layer 140, a hidden layer 140, a second base layer 150, and a touch layer 160.

[0031] The first base layer 110 may serve as a support element for the entire hidden touch diaphragm 100 and is used to support the other layers. The material of the first base layer 110 may include polyethylene terephthalate (PET), glass, polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (PI), clear polyimide (CPI), acrylonitrile-butadiene-styrene copolymer (ABS), etc. The first base layer 110 may be transparent, and it may be colored or colorless, which is not specifically limited in this application.

[0032] The first base layer 110 may have two relatively arranged planes (which may also be referred to as "sides" in this application). For example, the one located above in the vertical direction may be called the upper plane (e.g., the upper side), and the one located below may be called the lower plane (e.g., the lower side). In some examples, the pattern layer 120 may be disposed on the upper side of the first base layer 110. Its thickness may be 0.5 - 2 μm. For example, 0.5 μm, 1 μm, 1.5 μm, 2 μm, etc. Optionally or preferably, the thickness of the pattern layer 120 may be 1 μm. The pattern layer 120 may include a graphic printing layer. Exemplarily, the graphic printing layer may be prepared based on offset printing or intaglio printing. For example, the pattern is directly printed on the upper plane of the first base layer 110 by offset printing to form the pattern printing layer. Or, the pattern is directly printed on the upper plane of the first base layer 110 through a printing plate. The pattern printing layer is prepared by multiple printings using printing plates with different degrees of depression. When the pattern layer 120 is a graphic printing layer, it may be disposed above the first base layer 110. The pattern layer 120 may also be a structural layer having a plurality of micro-nano structures. These micro-nano structures may be arranged periodically or randomly. The micro-nano structures may be prepared using methods such as etching (e.g., optical etching or chemical etching, etc.), replication (e.g., mold replication, etc.). Exemplarily, a resin layer may be first laid on the upper plane of the first base layer 110, and then a laser etching device is used to etch the resin layer to remove the excess resin to form micro-nano structures. Or, an ultraviolet curable adhesive (UV adhesive) is laid on the upper side of the first base layer 110, and then a mold (e.g., a microlens array mold) is used to imprint and ultraviolet-cure the UV adhesive to finally form a plurality of micro-nano structures. As Figure 1 shown, the pattern layer 120 is a single-layer pattern printing layer, Figure 2 shown, a single-layer pattern layer 120 including a plurality of micro-nano structures 121.

[0033] The cross-section of the micro-nano structure may be regular. For example, it may be a ramp shape with different bevel angles, a tooth shape, a rectangle, an arc shape with different radian, etc., or any combination of the above. For example, Figure 2 the cross-section of the micro-nano structure shown in is a ramp shape. The cross-section of the micro-nano structure may also be irregular. For example, an irregular curved surface, etc. When the plurality of micro-nano structures are arranged periodically, the period may be 1 μm - 200 μm. For example, 1 μm, 10 μm, 20 μm, 40 μm, 60 μm, 80 μm, 100 μm, 120 μm, 140 μm, 160 μm, 180 μm, 200 μm, etc. Or, the period may be any value within the above numerical range. Through the arrangement of these micro-nano structures, light and shadow or relief or dynamic effects can be generated. A light-transmitting first ink may also be filled between the plurality of micro-nano structures, as Figure 2The first ink 122 between the multiple micro-nano structures 121 shown.

[0034] In some examples, there can also be multiple pattern layers 120. As Figure 3 shown, the hidden touch diaphragm 100 includes two mutually stacked pattern layers, including the lower pattern layer 120-1 and the upper pattern layer 120-2. Both the pattern layer 120-1 and the pattern layer 120-1 are structural layers, each including a plurality of micro-nano structures. Among them, the cross-section of the micro-nano structures in the pattern layer 120-1 is rectangular, and the cross-section of the micro-nano structures in the pattern layer 120-2 is ramp-shaped. Similarly, as a structural layer, the pattern layer includes a plurality of micro-nano structures, and the first ink can be filled between them. The first ink filled in different structural layers can be the same or different. For example, a plurality of micro-nano structures included in the pattern layer 120-1 can be filled with yellow semi-transparent ink 122-1, while a plurality of micro-nano structures included in the pattern layer 120-2 can be filled with red semi-transparent ink 122-2.

[0035] As Figure 4 shown, multiple mutually stacked pattern layers can also be of different types. For example, for two mutually stacked pattern layers, the lower one can be the pattern layer 120-3 as a graphic printing layer, and the upper one can be the pattern layer 120-2 as a structural layer.

[0036] In some examples, a coating layer can also be provided between the micro-nano structure 121 and the first ink 122, as Figure 5 shown, the coating layer 123 between the micro-nano structure 121 and the first ink 122. The coating layer 123 can be used to isolate the micro-nano structure 121 and the first ink 122 to prevent the filling of the structural grooves between the micro-nano structures 121 by the first ink 122 from affecting the light and shadow effect. The coating layer 123 is arranged in imitation of the micro-nano structure 121, and the coating layer 123 uses non-conductive materials, including SiO2, indium, and it can be prepared by methods such as evaporation coating, vacuum sputtering, electroplating, chemical deposition, etc. The thickness can be in the range of 80nm - 260nm. For example, 80nm, 90nm, 100m, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, 200nm, 210nm, 220nm, 230nm, 240nm, 250nm, 260nm, etc. Or, the thickness of the coating layer 123 can be any value within the above value range. Optionally or preferably, the thickness of the coating layer 123 can be 140nm. In addition to functions such as isolation, the coating layer 123 can also achieve functions of brightening, increasing transmittance, and medium color.

[0037] In some examples, when there are multiple pattern layers 120, if a structural layer is included, a coating layer can be provided in each structural layer. For example, Figure 6 As shown, the pattern layer 120 includes two stacked structural layers. Among them, in the upper structural layer, a coating layer 123-2 is provided between the micro-nano structure and the first ink, and in the lower structural layer, a coating layer 123-1 is provided between the micro-nano structure and the first ink. And as Figure 7 shown, the pattern layer 120 includes a graphic printing layer and a structural layer that are stacked on each other. Among them, the graphic printing layer is located below, and the structural layer is located above. In the structural layer, a coating layer 123-3 is provided between the micro-nano structure and the first ink. These coating layers can be prepared from the same material or different materials, and the present application does not make specific limitations.

[0038] A hidden layer 140 is provided on the second substrate layer 150. Similarly or analogously, the second substrate layer 150 can also have opposite sides, such as the upper side and the lower side. The hidden layer 140 can be provided on the lower side of the second substrate layer 150. In some examples, the hidden layer 140 can include a plurality of convex structures 141 and a plurality of concave structures 142. In some examples, these convex structures 141 and concave structures 142 are arranged at intervals on the hidden layer 140. The convex structures 141 can be transparent. Optionally or preferably, the convex structures 141 can be colorless and transparent. These convex structures 141 can be cylinders or prisms, and their sizes can be in the range of 5μm - 80μm. For example, 5μm, 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, etc. Or any value within the above value range. The depression depth of these concave structures 142 can be in the range of 2μm - 5μm. For example, 2μm, 3μm, 4μm, 5μm, etc. The inside thereof can be filled with an opaque second ink 143 that functions as a light-shielding agent. The second substrate layer 150 can also be prepared from substances such as PET, glass, PC, PMMA, PI, CPI, ABS, etc.

[0039] Through the first adhesive layer 130, the relatively arranged hidden layer 140 and the pattern layer 120 can be adhered. The first adhesive layer 130 can be prepared from a polymer material. For example, resin glue, polymer, etc. Exemplarily, these materials can be uniformly provided on the pattern layer 120 by coating or other means to form the first adhesive layer 130.

[0040] The touch layer 160 can be disposed on the other side of the second substrate layer 150. For example, it can be disposed on the upper side of the second substrate layer 150. The touch layer 160 can include a plurality of conductive layers. The conductive layer can include a substrate layer and conductive wires disposed within or on the substrate layer. The material of the substrate layer can be the same as or similar to that of the first substrate layer 110 / second substrate layer 150, or can be polyethylene terephthalate (PET), glass, polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (PI), clear polyimide (CPI), ultraviolet curable glue (UV glue), etc. Optionally or preferably, the material of the substrate layer can be UV glue. For example, the substrate layer can be a UV glue layer. The conductive wires can be prepared using conductive materials, including but not limited to metals such as silver, copper, aluminum, etc., semiconductors such as silicon, germanium, etc., and carbon-based materials such as graphite. The thickness of the conductive wires can be 6μm - 20μm. For example, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, etc., or any value within the above range. In some embodiments, the thickness of the substrate layer can be greater than the thickness of the conductive wires. In this way, when the conductive wires are disposed within the substrate layer, they will not be exposed outside the substrate layer. As Figure 1 shown, the touch layer 160 can include two conductive layers. The first conductive layer includes a first substrate layer 161 and a first conductive wire 163. The second conductive layer can include a second substrate layer 162 and a second conductive layer 164. Among them, the second conductive layer is stacked above the first conductive layer. For example, the first substrate layer 161 is located at the lowermost layer, and the first conductive wire 163 is disposed inside the first substrate layer 161. The second substrate layer 162 is located above the first substrate layer 161, and the second conductive wire 164 is located inside the second substrate layer 162.

[0041] In some embodiments, the touch layer 160 can further include a third substrate layer. As Figure 8 shown, the third substrate layer 166 can be similar to the first substrate layer 110 / second substrate layer 150, or can be one or a combination of PET, PC, PMMA, PI, CPI, UV glue, glass, etc. A plurality of conductive layers can be disposed above the third substrate layer 166. The third substrate layer 166 can be adhered to the second substrate layer 150 through a second adhesive layer 165. The second adhesive layer 165 can be prepared using a polymer material. For example, resin glue, polymer, etc. The second adhesive layer 165 can be light-transmissive.

[0042] The hidden touch diaphragm disclosed in this application can simultaneously achieve the functions of hiding and touch control. The hidden pattern has higher precision and diverse image effects, including 3D relief effects or dynamic light and shadow effects. While meeting multiple functions, it can enable users to obtain different viewing effects from different observation perspectives.

[0043] This application also discloses a preparation method for the above-mentioned hidden touch diaphragm. The preparation method may include the following steps.

[0044] Step 1: Provide a first base layer.

[0045] In some examples, the first base layer may include two relatively arranged planes, for example, an upper plane and a lower plane. Its material may be polyethylene terephthalate (PET), glass, polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (PI), clear polyimide (CPI), ultraviolet curable glue (UV glue), etc. The base layer 110 may be transparent, and it may be colored or colorless.

[0046] Step 2: Set a pattern layer on the first base layer by means of pattern printing.

[0047] In some examples, the pattern printing means may include offset printing, multi-layer gravure printing, ultraviolet replication, etc. Based on the different printing means, the pattern layer may include a graphic printing layer or a structure layer. When the pattern layer is a structure layer, it may include a plurality of micro-nano structures. Taking ultraviolet curing as an example, a layer of ultraviolet curable glue (UV glue) may be first coated on the upper plane of the first base layer, and then a mold (micro-nano structure array mold) is used to imprint and cure the UV glue with ultraviolet light, finally forming a plurality of micro-nano structures. These micro-nano structures may be arranged periodically, and the period may be 1μm - 200μm. For example, 1μm, 10μm, 20μm, 40μm, 60μm, 80μm, 100μm, 120μm, 140μm, 160μm, 180μm, 200μm, etc.

[0048] In this step, a first ink may also be filled between the micro-nano structures. The first ink may be light-transmissive. In some examples, the number of the pattern layers may be single or multiple. When there are multiple structure layers, the first ink filled in each structure layer may be the same or different.

[0049] In some examples, a coating layer may also be provided in the pattern layer. The coating layer is located between the micro-nano structure and the first ink, and is used to isolate the micro-nano structure and the first ink to prevent the first ink from filling the structural grooves between the micro-nano structures and affecting the light and shadow effect. The coating layer is made of a non-conductive material, including SiO2 and indium. It can be prepared by methods such as evaporation coating, vacuum sputtering, electroplating, and chemical deposition.

[0050] Step three: Provide a second substrate and prepare a hidden layer on the second substrate.

[0051] In some examples, the hidden layer may include a plurality of convex structures and a plurality of concave structures. Similarly, a method such as ultraviolet curable glue replication can be used to prepare the hidden layer on the second substrate. After preparation, the interior of the concave structure can be filled with an opaque second ink that serves as a light-shielding agent. In some examples, the hidden layer is adhered to the pattern layer through a first adhesive layer.

[0052] Step four: Prepare a touch layer on the second substrate.

[0053] In some examples, the touch layer may include a plurality of conductive layers. The conductive layer includes a substrate layer and conductive wires disposed inside or on the substrate layer. The substrate layer may be similar to the base layer, or may be one or a combination of PET, PC, PMMA, PI, CPI, UV glue, and glass. The conductive wires can be prepared using conductive materials such as metals, semiconductor materials, and carbon-based conductive materials. For example, a conductive material is deposited on one side of the substrate layer, such as the side away from the base layer, and then the conductive layer is obtained by patterning the conductive material.

[0054] In some examples, the touch layer may further include a third base layer, and a plurality of conductive layers are disposed on the third base layer and adhered to the second base layer through a second adhesive layer.

[0055] It should be noted that the descriptions of the above steps are only for illustration and explanation, and do not limit the scope of application of this specification. For those skilled in the art, various modifications and changes can be made to the above steps under the guidance of this specification. However, these modifications and changes are still within the scope of this specification.

[0056] This application also discloses a display panel. The display panel may include the above-mentioned hidden touch diaphragm.

[0057] The basic concepts have been described in this text. Obviously, for those skilled in the art, the above detailed disclosure is merely an example and does not constitute a limitation to this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this specification.

[0058] It should be noted that, in order to simplify the expression of the disclosure in this specification and thus help the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of this specification, sometimes multiple features are merged into one embodiment, drawing, or the description thereof. However, this disclosure method does not mean that the features required by the object of this specification are more than those mentioned in the claims. In fact, the features of the embodiments are fewer than all the features of the individual embodiments disclosed above.

[0059] In some embodiments, numbers describing components and attribute quantities are used. It should be understood that such numbers used for the description of embodiments are, in some examples, modified by the modifiers "about", "approximately", or "substantially". Unless otherwise stated, "about", "approximately", or "substantially" indicate that the said numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and such approximate values may change according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining general digits. Although the numerical ranges and parameters used in some embodiments of this specification to confirm the breadth of their scope are approximate values, in specific embodiments, such numerical settings are made as precise as possible within the feasible range.

[0060] Finally, it should be understood that the embodiments described in this specification are only used to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this specification may be considered to be in accordance with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly introduced and described in this specification.

Claims

1. A hidden touch diaphragm, characterized in that, The hidden touch diaphragm is a layer structure, including: A first base layer; One or more pattern layers, which are arranged on one side of the first base layer in a stacked manner; A second base layer; A hidden layer is arranged on one side of the second base layer. The hidden layer includes a plurality of convex structures and a plurality of concave structures; the pattern layer is arranged opposite to the hidden layer and is adhered through a first adhesive layer; and, A touch layer, including a plurality of conductive layers; the conductive layer includes a base material layer and a conductive wire arranged inside or on the base material layer; the touch layer is arranged on the other side of the second base layer.

2. The hidden touch diaphragm according to claim 1, wherein, The pattern layer includes a graphic printing layer and / or a structural layer with a plurality of micro-nano structures; the graphic printing layer is arranged on the base layer.

3. The hidden touch diaphragm according to claim 2, characterized in that, The cross-section of the micro-nano structure includes a ramp shape, a rectangle, an arc, or a combination of any two or more of the above shapes; the period of the micro-nano structure is 1μm - 200μm.

4. The hidden touch diaphragm according to claim 2, characterized in that, When the pattern layer is a structural layer, a first ink is filled between the plurality of micro-nano structures, and the first ink is light-transmissive.

5. The hidden touch diaphragm according to claim 4, characterized in that, When the pattern layer includes a plurality of structural layers, the first inks filled between the micro-nano structures in different structural layers are the same and / or different.

6. The hidden touch diaphragm according to claim 4, wherein A coating layer is laminated on the outer surface of the micro-nano structure; the coating layer is made of a non-conductive material, including SiO2 and indium; the thickness of the coating layer is 80nm - 260nm.

7. The hidden touch diaphragm according to claim 1, characterized in that, The plurality of convex structures and the plurality of concave structures are arranged at intervals on the hidden layer; the convex structure is a cylinder or a prism, the size of the convex structure is 5μm - 80μm, the depth of the concave structure is 2μm - 5μm; the concave structure is filled with a second ink, and the second ink is light-impermeable.

8. The hidden touch diaphragm according to claim 1, characterized in that, The thickness of the conductive wire is 6μm - 20μm, the base material layer is a UV glue layer, and the thickness of the base material layer is greater than the thickness of the conductive wire.

9. The hidden touch diaphragm according to claim 1, wherein The touch layer further includes a third base layer, and a plurality of conductive layers are arranged on the third base layer; the third base layer is adhered to the second base layer through a second adhesive layer.

10. A display panel, including the hidden touch diaphragm according to any one of claims 1 - 9.

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