Packaging base, composition board and electronic device

Abstract

The invention relates to the technical field of electronic packaging, and discloses a packaging base, a composition board and an electrical device, and the packaging base comprises an insulating substrate, a metal layer, an electrode bonding pad and a plurality of electroplating wires; the insulating substrate comprises a substrate main body and a frame part, and the peripheral side wall of the substrate main body and the peripheral side wall of the frame part extend in the first direction to form an outer side wall; the plurality of electroplating wires are located in the insulating substrate, one end of each electroplating wire extends in the substrate main body and is connected with the electrode bonding pad, and the other end of each electroplating wire extends in the frame part and is exposed on the outer side wall to form an electroplating wire exposed part. The packaging structure has the beneficial effects that the electroplating wiring is arranged far away from the surface of the segmentation groove, and the adjacent packaging bases can be conducted, so that the problem that the adjacent packaging bases are adhered in the segmentation groove area during electroplating due to the fact that the electroplating wiring is exposed out of the surface of the segmentation groove is solved, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and particularly to a packaging base, a combined board and an electronic device. Background Art

[0002] The packaging base is usually used for packaging electronic components such as quartz crystals and semiconductor chips. The packaged components (such as semiconductor devices, temperature-compensated crystal oscillators TCXO, tuning fork resonators, thermosensitive resonators, automotive components, ordinary oscillators OSC, voltage-controlled crystal oscillators VCXO, etc.) are widely used in various electronic devices.

[0003] The preparation of the packaging base is usually carried out on a large-sized insulating substrate to obtain a combined board of packaging bases arranged in a plurality, and the electroplating wirings on the combined board of packaging bases are used to connect the conductive patterns on two adjacent packaging bases to realize electroplating of all packaging bases. After electroplating, the combined board can be divided into individual packaging bases by using a preset dividing groove.

[0004] However, at present, when the electroplating wiring connects two adjacent packaging bases, part of the electroplating wiring often exposes on the surface of the dividing groove, resulting in adhesion in the area where the electroplating wiring exposes during the electroplating process, making it difficult to divide the combined board into individual packaging bases and reducing the production efficiency of the packaging base. Summary of the Invention

[0005] The object of the present invention is to provide a packaging base, a combined board and an electronic device, so that the electroplating wiring is arranged away from the surface of the dividing groove, and adjacent packaging bases can be conducted, avoiding the problem that adjacent packaging bases stick in the dividing groove area during electroplating due to the electroplating wiring exposing on the surface of the dividing groove, and improving the production efficiency.

[0006] To achieve the above object, the present invention provides a packaging base, including an insulating substrate, a metal layer, electrode pads and a plurality of electroplating wirings;

[0007] The insulating substrate includes a substrate body and a frame portion arranged in sequence in a first direction. The frame portion is provided with a through groove. One end surface of the substrate body and the side wall of the through groove enclose an installation cavity. One end of the substrate body away from the frame portion is provided with a first surface, and one end of the frame portion away from the substrate body is provided with a second surface. The outer peripheral side wall of the substrate body and the outer peripheral side wall of the frame portion extend in the first direction to form an outer side wall. One end of the outer side wall in the first direction is connected to the first surface through a dividing inclined surface, and / or, the other end of the outer side wall in the first direction is connected to the second surface through a dividing inclined surface;

[0008] The metal layer is disposed around the mounting cavity on the second surface;

[0009] The electrode pad is disposed in the mounting cavity;

[0010] A plurality of the electroplating wirings are located in the insulating substrate. One end of the electroplating wiring extends in the substrate body and is connected to the electrode pad, and the other end extends in the frame portion and exposes on the outer side wall to form an electroplating wiring exposed portion for connecting with the electroplating wiring in an adjacent package base.

[0011] Further, the length of the insulating substrate in the first direction is T, and the minimum distance between the end of the electroplating wiring exposed portion exposed on the outer side wall and the second surface in the first direction is D1, where 0.1 ≤ D1 / T ≤ 0.5.

[0012] Further, the minimum distance between the electroplating wiring and the first surface in the first direction is D2, and the length of the substrate body in the first direction is H1, where 0.65 ≤ D2 / H1 ≤ 0.95.

[0013] Further, the overlapping area of the projection of the electroplating wiring and the electrode pad on the first surface is A1, and the projected area of the electrode pad on the first surface is A2, where 0.05 ≤ A1 / A2 ≤ 0.35.

[0014] Further, the included angle between the tangent of the extending path of the end of the electroplating wiring connected to the electrode pad and the first surface is θ, where θ ≤ 45°.

[0015] Further, it further includes a plurality of external terminals. The plurality of external terminals are disposed on the first surface and are spaced apart on the first surface, and the electrode pad is connected to one of the external terminals through a via conductor.

[0016] Further, a first area for connecting with the electroplating wiring is provided on the electrode pad, and the via conductor and the projection of the first area on the first surface at least partially overlap.

[0017] Further, the insulating substrate has an intersecting first diagonal and second diagonal. The insulating substrate has a relatively arranged first corner area and third corner area in the extending direction of the first diagonal, and the insulating substrate has a relatively arranged second corner area and fourth corner area in the extending direction of the second diagonal; an edge area is provided between two adjacent corner areas;

[0018] The electroplating wirings for connecting with the electrode pad are both provided in the second corner area and the fourth corner area; or,

[0019] The first corner region and the third corner region are both provided with the electroplating wirings for connecting to the electrode pads; or,

[0020] The side region is provided with the electroplating wirings for connecting to the electrode pads.

[0021] The present invention further provides a package base combined board, which is formed by arranging a plurality of the package bases according to any one of the above, and the electroplating wirings that are connected and conduct with each other are provided between adjacent package bases, and the dividing inclined surfaces of adjacent package bases cooperate with each other to form a dividing groove.

[0022] The present invention further provides an electronic device, which includes the package base according to any one of the above, further includes electronic components arranged in the installation cavity, and a cover plate for sealing the installation cavity.

[0023] Compared with the prior art, a package base, a combined board and an electronic device according to an embodiment of the present invention have the beneficial effects that: the electroplating wiring is located in the insulating substrate, and one end extends in the substrate main body and is connected to the electrode pad, and the other end extends in the frame portion to the outer side wall and is exposed to form an electroplating wiring exposed portion for connecting to the electroplating wiring in the adjacent insulating substrate, so as to realize the electrical connection of the electrode pads on each package base in the combined board, thereby making the internal circuit of the formed combined board conduct; at the same time, since the electroplating wiring exposed portion is arranged far away from the dividing inclined surface, the problem that the adjacent package bases are adhered in the dividing groove region during electroplating due to the electroplating wiring being exposed on the surface of the dividing groove is avoided, making it easy to divide the combined board into individual package bases and improving the production efficiency. Description of the Drawings

[0024] Figure 1 is a three-dimensional perspective view of the package base according to an embodiment of the present invention;

[0025] Figure 2 is a front perspective view of the package base according to an embodiment of the present invention;

[0026] Figure 3 is a top perspective view of the package base according to an embodiment of the present invention;

[0027] Figure 4 is Figure 3 a cross-sectional view taken along line A-A in

[0028] Figure 5 is a front view of the package base according to an embodiment of the present invention;

[0029] Figure 6 is a top view of the package base according to an embodiment of the present invention;

[0030] Figure 7 is a connection diagram of two diagonally adjacent package bases according to an embodiment of the present invention;

[0031] Figure 8 is a three-dimensional view of an encapsulation base of another embodiment of the present invention;

[0032] Figure 9 is a perspective view of an encapsulation base of another embodiment of the present invention;

[0033] Figure 10 is a perspective view of the encapsulation base of another embodiment of the present invention from a top-down perspective;

[0034] Figure 11 is the conductive pattern of the encapsulation base of another embodiment of the present invention;

[0035] Figure 12 is a three-dimensional view of a composite board based on the encapsulation base of another embodiment of the present invention;

[0036] Figure 13 is the conductive pattern of the composite board based on the encapsulation base of another embodiment of the present invention;

[0037] Figure 14 is a connection schematic diagram of the conductive pattern of the composite board based on the encapsulation base of another embodiment of the present invention;

[0038] Figure 15 is a top-down perspective view of the composite board based on the encapsulation base of another embodiment of the present invention;

[0039] Figure 16 is Figure 15 a cross-sectional view taken along line B-B in

[0040] In the figure, 1 is an insulating substrate; 100 is a mounting cavity; 101 is an outer wall; 102 is a dividing slope; 11 is a substrate body; 111 is a first surface; 12 is a frame portion; 121 is a through hole; 122 is a second surface; 2 is a metal layer; 3 is an electrode pad; 31 is a via conductor; 32 is a first region; 4 is an electroplated wiring; 41 is an exposed portion of the electroplated wiring; 5 is an external terminal; 6 is an annular surface interconnection wiring; a is a first corner region; b is a second corner region; c is a third corner region; d is a fourth corner region; e is a side region; X is a first direction. Detailed Embodiments

[0041] The following will further describe in detail the specific embodiments of the present invention with reference to the accompanying drawings and embodiments. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0042] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "inner", "outer", etc. in the present invention is based on the positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the devices and elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0043] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information.

[0044] As Figures 1 to 16 shown, a packaging base of a preferred embodiment of the present invention includes an insulating substrate 1, a metal layer 2, electrode pads 3, and a plurality of electroplated wirings 4. For the convenience of description, refer to Figure 1 , and define the height direction of the insulating substrate 1 as the first direction X. Refer to Figure 1 , Figure 2 It can be seen that the insulating substrate 1 includes a substrate main body 11 and a frame portion 12 arranged in sequence in the first direction X. Among them, the frame portion 12 is provided with a through groove 121, and one end surface of the substrate main body 11 and the side wall of the through groove 121 enclose an installation cavity 100 for placing electronic components. One end of the substrate main body 11 away from the frame portion 12 is provided with a first surface 111, and one end of the frame portion 12 away from the substrate main body 11 is provided with a second surface 122. The first surface 111 and the second surface 122 are spaced apart in the first direction X. The outer peripheral side wall of the substrate main body 11 and the outer peripheral side wall of the frame portion 12 extend in the first direction X to form an outer side wall 101. One end of the outer side wall 101 in the first direction X is connected to the first surface 111 through a split inclined surface 102, and / or, the other end of the outer side wall 101 in the first direction X is connected to the second surface 122 through a split inclined surface 102. The split inclined surfaces 102 provided opposite to each other on adjacent packaging bases cooperate to form a split groove M, and the shape of the split groove M is V-shaped.

[0045] The metal layer 2 is disposed around the mounting cavity 100 on the second surface 122. The metal layer 2 is used for welding with a cover plate (not shown in the figure, the cover plate is located above the metal layer 2) to seal the mounting cavity 100. The electrode pad 3 is disposed in the mounting cavity 100. To facilitate the electrical connection between adjacent packaging bases, a plurality of electroplated wirings 4 are located in the insulating substrate 1. One end of the electroplated wiring 4 extends in the substrate body 11 and is connected to the electrode pad 3, and the other end extends in the frame portion 12 and exposes on the outer sidewall 101 to form an electroplated wiring exposed portion 41 for connecting with the electroplated wiring 4 in an adjacent packaging base. The electroplated wiring 4 is insulated from the metal layer 2. Refer to Figure 7 , Figure 8 and Figures 12 to 16 , adjacent packaging bases are directly or indirectly electrically connected through the electroplated wiring exposed portions 41 of the electroplated wirings 4 on the outer sidewall 101. Specifically, when the electroplated wiring 4 is located in the corner region, the electroplated wiring 4 between two adjacent packaging bases at the corners is indirectly electrically connected and conducted through the toroidal surface interconnection wiring 6 of a packaging base adjacent to the side. When the electroplated wiring 4 is located in the side region, the electroplated wiring 4 between two adjacent packaging bases at the sides can be directly electrically connected and conducted. Since the electroplated wiring exposed portion 41 is far from the dividing inclined surfaces 102 provided at both ends of the outer sidewall 101, the electroplated wiring 4 will not expose on the surface of the dividing groove M, thereby avoiding the adhesion of adjacent packaging bases in the dividing groove M region during electroplating caused by the exposure of the electroplated wiring 4 on the surface of the dividing groove M, making it easy to divide the combined board into individual packaging bases and improving the production efficiency.

[0046] Furthermore, to facilitate the setting of the shape of the electroplated wiring 4, in this embodiment, the shape of the electroplated wiring 4 is a strip structure, which has good stability. At the same time, it is easy to increase the contact area with the electrode pad 3, facilitate the conduction with the electrode pad 3, and the electroplated wirings 4 in adjacent packaging bases are mutually conducted.

[0047] Further, in some embodiments, to facilitate the reasonable arrangement of the electroplated wiring 4 within the insulating substrate 1 and reduce the manufacturing difficulty of the package base, the length of the insulating substrate 1 in the first direction X is T, the minimum distance between the exposed portion 41 of the electroplated wiring and the second surface 122 in the first direction X is D1, and 0.1 ≤ D1 / T ≤ 0.5. Wherein, when D1 / T < 0.1, the exposed portion of the electroplated wiring 4 on the outer sidewall 101 is too close to the second surface 122. To avoid the electroplated wiring 4 from being exposed in the dividing groove M, it is necessary to reduce the depth of the dividing groove M. The shallow depth of the dividing groove M is not conducive to dividing the package base composite plate into individual package bases, reducing production efficiency and accuracy. When D1 / T > 0.5, the exposed portion of the electroplated wiring 4 on the outer sidewall 101 is too far from the second surface 122, resulting in an increase in the overall size of the electroplated wiring 4, increasing the manufacturing difficulty of the package base, and at the same time causing uneven distribution of the electroplated wiring 4 within the insulating substrate 1, that is, there is a large difference in the distribution of the electroplated wiring 4 between the substrate main body 11 and the frame portion 12, resulting in signal reflection, crosstalk or delay caused by local impedance mutation within the insulating substrate 1, affecting the performance of the package base. Preferably, in this embodiment, D1 / T = 0.3.

[0048] Further, to facilitate the connection between the electrode pads 3 within the package base and external devices, refer to Figures 1 to 12 , the package base further includes a plurality of external terminals 5. Among them, the plurality of external terminals 5 are provided on the first surface 111 and are arranged at intervals on the first surface 111. The electrode pads 3 are connected to one external terminal 5 through via conductors 31. The number of external terminals 5 can be adjusted according to the actual design requirements of the package base.

[0049] Furthermore, refer to Figure 2 , a parasitic capacitance is likely to be generated between one end of the electroplated wiring 4 located within the substrate main body 11 and the external terminal 5, resulting in signal interference caused by the parasitic capacitance during the actual application of the package base. Therefore, the distance between the electroplated wiring 4 and the external terminal 5 needs to be set. Specifically, refer to Figure 4 , the minimum distance between the electroplated wiring 4 and the first surface 111 in the first direction X is D2, the length of the substrate main body 11 in the first direction X is H1, and 0.65 ≤ D2 / H1 ≤ 0.95. Preferably, in this embodiment, D2 / H1 = 0.8, which can effectively reduce the parasitic capacitance between the electroplated wiring 4 and the external terminal 5.

[0050] Further, to increase the connection area between the electrode pads 3 and the electroplated wiring 4 and avoid poor contact, refer to Figure 3, the overlapping area of the projection of the electroplated wiring 4 and the electrode pad 3 on the first surface 111 is A1, the projected area of the electrode pad 3 on the first surface 111 is A2, and 0.05 ≤ A1 / A2 ≤ 0.35. If A1 / A2 < 0.05, the connection area between the electroplated wiring 4 and the electrode pad 3 is too small, which is likely to cause poor contact and result in an increase in impedance. If A1 / A2 > 0.35, the parasitic capacitance between the electroplated wiring 4 and the electrode pad 3 increases, which is likely to cause signal interference. Preferably, in this embodiment, A1 / A2 = 0.2, so as to ensure good conduction performance between the electroplated wiring 4 and the electrode pad 3 while reducing the parasitic capacitance.

[0051] Furthermore, in order to enable the electroplated wiring 4 to extend reasonably within the substrate body 11, avoid the distance between the electroplated wiring 4 and the first surface 111 and the bottom surface of the mounting cavity 100 from being too small, reduce the risk of cracking of the package base, and at the same time make the connection between the electroplated wiring 4 and the electrode pad 3 more reliable, the included angle between the tangent of the extension path of the end of the electroplated wiring 4 connected to the electrode pad 3 and the first surface 111 is θ, and θ ≤ 45°.

[0052] Further, in order to make the distribution of the electroplated wiring 4 on the entire package base more uniform, improve the current uniformity, thereby ensuring the thickness uniformity of the electroplated layer of the package base, reduce the warpage of the product, and further improve the stress uniformity of the product during actual use and reduce the cracking risk. As Figure 3 shown, the electrode pad 3 is provided with a first region 32 for connecting with the electroplated wiring 4, and the projection of the via conductor 31 and the first region 32 on the first surface 111 at least partially overlap. In some other embodiments, the via conductor 31 may not overlap with the projection of the first region 32 on the first surface 111 (not shown in the figure). The area of the first region 32 is less than or equal to A1.

[0053] In this embodiment, the insulating substrate 1 is integrally in a cuboid structure. In order to facilitate the reasonable arrangement of the position of the electroplated wiring 4 within the insulating substrate 1, the insulating substrate 1 has an intersecting first diagonal and a second diagonal, and the four peripheral corner regions of the insulating substrate 1 are divided. Refer to Figure 6 , the insulating substrate 1 has a relatively arranged first corner region a and a third corner region c in the extending direction of the first diagonal, and the insulating substrate 1 has a relatively arranged second corner region b and a fourth corner region d in the extending direction of the second diagonal; there is a side region e between two adjacent corner regions; in order to facilitate the conduction of the electroplated wiring 4 between adjacent package bases, the electroplated wiring 4 for connecting with the electrode pad 3 is provided in both the second corner region b and the fourth corner region d, or the electroplated wiring 4 for connecting with the electrode pad 3 is provided in both the first corner region a and the third corner region c. That is, the electroplated wiring 4 can be provided in any two opposite corner regions, and can be adaptively adjusted according to actual design requirements.

[0054] Refer to Figure 6 、 Figure 7 , that is, adjacent encapsulation bases are connected in the diagonal extension direction, thereby realizing the electrical connection of the electrode pads 3 on the encapsulation bases in the composite board, and further making the electroplating wiring 4 of the composite board formed by the encapsulation bases conductive. Since the electroplating wirings 4 are oppositely arranged on the diagonal line, therefore, multiple electroplating wirings 4 are centrosymmetrically arranged on the insulating substrate 1.

[0055] In some other embodiments, in order to enable any two adjacent encapsulation bases to be conductive through the electroplating wiring 4, the insulating substrate 1 has an intersecting first diagonal line and a second diagonal line. The insulating substrate 1 has a relatively arranged first corner region a and a third corner region c in the extension direction of the first diagonal line, and the insulating substrate 1 has a relatively arranged second corner region b and a fourth corner region d in the extension direction of the second diagonal line; an edge region e is provided between two adjacent corner regions; an electroplating wiring 4 for connecting with the electrode pad 3 is provided in the edge region e. When the electroplating wiring 4 is arranged in the edge region e, the number can be 4, that is, 4 electroplating wirings 4 are axially symmetrically arranged on the insulating substrate 1. At this time, any two adjacent encapsulation bases can be conductive through the electroplating wiring 4. In some other embodiments, the number of electroplating wirings 4 can be 2 or 3, that is, the electrical connection between adjacent encapsulation bases can be realized as long as 2 to 3 electroplating wirings 4 are arranged in the edge region e.

[0056] In some other embodiments, refer to Figures 8 to 16 , the encapsulation base of the present invention further includes a toroidal interconnection wiring 6. The toroidal interconnection wiring 6 is located within the frame portion. One end of the toroidal interconnection wiring 6 is connected to the metal layer 2, and the other end of the toroidal interconnection wiring 6 extends outward and exposes to form a toroidal interconnection wiring exposed portion. In this embodiment, since the insulating substrate 1 is integrally in the shape of a cuboid and has four corner regions, the electroplating wiring 4 is 2 and is diagonally arranged on one diagonal line, that is, 1 conductive wiring is located in one corner region. Similarly, the toroidal interconnection wiring 6 is also 2 and is diagonally arranged on the other diagonal line of the insulating substrate 1. The electroplating wiring 4 between the corner-adjacent encapsulation bases can be connected through the toroidal interconnection wiring 6 on the third encapsulation base. Specifically, as Figure 15 shown, the second encapsulation base B2 and the fourth encapsulation base B4 are corner-adjacent. The electroplating wiring 4 between the second encapsulation base B2 and the fourth encapsulation base B4 can be connected through the toroidal wiring 6 on the first encapsulation base B1 and the second encapsulation base B3. To facilitate the understanding of the corner adjacency of two encapsulation bases, as Figure 7 shown, the corner adjacency means that the corner regions of two encapsulation bases are connected on the same diagonal line. To facilitate the understanding of the edge adjacency of two encapsulation bases, as Figure 12As shown, two adjacent encapsulation bases adjacent in the length and width directions of the composite board are adjacent to each other at the sides.

[0057] Furthermore, the present invention also provides a composite board of encapsulation bases. Refer to Figures 12 to 16 , which is formed by arranging a plurality of the above-mentioned encapsulation bases. Electroplated wirings 4 that are connected and conduct electricity with each other are provided between adjacent encapsulation bases, and the dividing inclined surfaces 102 of adjacent encapsulation bases cooperate with each other to form a dividing groove M.

[0058] Specifically, the composite board of encapsulation bases includes a first encapsulation base B1, a second encapsulation base B2, a third encapsulation base B3, and a fourth encapsulation base B4 arranged in a two-row and two-column manner. Among them, the first encapsulation base B1 and the third encapsulation base B3 are arranged diagonally, the second encapsulation base B2 and the fourth encapsulation base B4 are arranged diagonally, and a dividing groove M is formed between adjacent encapsulation bases. The dividing groove M is composed of dividing inclined surfaces. Each encapsulation base has a first corner region a and a third corner region c that are oppositely arranged, and a second corner region b and a fourth corner region d that are oppositely arranged; an edge region e is provided between two adjacent corner regions.

[0059] Even further, refer to Figure 12 , Figure 15 , electroplated wirings 4 are provided in both the second corner region b and the fourth corner region d, and a toroidal interconnection wiring 6 is provided in the first corner region a; the electroplated wiring 4 of the fourth encapsulation base B4 is connected to the electroplated wiring 4 of the second encapsulation base B2. As Figure 15 shown, when the electroplated wirings 4 of the fourth encapsulation base B4 and the second encapsulation base B2 arranged diagonally are connected, it is a point contact or a line contact, and the impedance is large, and it is not easy to achieve electrical connection. Therefore, the electroplated wirings 4 of the fourth encapsulation base B4 and the second encapsulation base B2 arranged diagonally need to be indirectly electrically connected through the toroidal interconnection wiring 6 on the third encapsulation base (such as the first encapsulation base B1, the third encapsulation base B3) adjacent to the sides. That is, when the electroplated wiring 4 is provided in the corner region, the electroplated wirings 4 of two diagonally adjacent encapsulation bases need to be indirectly electrically connected through the toroidal interconnection wiring 6 in the corner region of the third encapsulation base. When the electroplated wiring 4 is provided in the edge region e, the electroplated wirings 4 of two adjacent encapsulation bases adjacent to each other in the composite board are directly electrically connected.

[0060] Even further, the present invention also provides an electronic device, which includes the encapsulation base described in any one of the above, and further includes an electronic component provided in the installation cavity, and a cover plate (not shown in the figure) for sealing the installation cavity.

[0061] In summary, the embodiment of the present invention provides a packaging base and a composite board. The electroplated wiring 4 is located within the insulating substrate 1, with one end extending within the substrate body 11 and connecting to the electrode pad 3, and the other end extending away from the dividing inclined surface 102 within the frame portion 12 to expose on the outer sidewall 101 for connecting to the electroplated wiring 4 within the adjacent insulating substrate 1, thereby realizing the electrical connection of the electrode pads 3 on each packaging base in the composite board, so that the internal circuit of the formed composite board is conducted. At the same time, since the exposed portion of the electroplated wiring 4 on the outer sidewall 101 is arranged away from the dividing inclined surface 102, it avoids the problem that the electroplated wiring 4 is exposed on the surface of the dividing groove M, resulting in adhesion of adjacent packaging bases in the area of the dividing groove M during electroplating, making it easy to divide the composite board into individual packaging bases and improving production efficiency.

[0062] The above description is only a preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present invention.

Claims

1. An encapsulation base, characterized in that: It includes an insulating substrate, a metal layer, electrode pads, and a plurality of electroplated wirings; The insulating substrate includes a substrate body and a frame portion arranged in sequence in a first direction. The frame portion is provided with a through groove. One end surface of the substrate body and the side wall of the through groove enclose an installation cavity. One end of the substrate body away from the frame portion is provided with a first surface, and one end of the frame portion away from the substrate body is provided with a second surface. The outer peripheral side wall of the substrate body and the outer peripheral side wall of the frame portion extend in the first direction to form an outer side wall. One end of the outer side wall in the first direction is connected to the first surface through a split inclined surface, and / or the other end of the outer side wall in the first direction is connected to the second surface through a split inclined surface; The metal layer is arranged around the installation cavity on the second surface; The electrode pads are arranged in the installation cavity; A plurality of the electroplated wirings are located in the insulating substrate. One end of the electroplated wiring extends in the substrate body and is connected to the electrode pad, and the other end extends in the frame portion and exposes on the outer side wall to form an electroplated wiring exposed portion for connecting with the electroplated wiring in an adjacent package base.

2. The encapsulation base according to claim 1, wherein: The length of the insulating substrate in the first direction is T, and the minimum distance between the electroplated wiring exposed portion and the second surface in the first direction is D1, where 0.1 ≤ D1 / T ≤ 0.

5.

3. The encapsulation base according to claim 1, wherein: The minimum distance between the electroplated wiring and the first surface in the first direction is D2, and the length of the substrate body in the first direction is H1, where 0.65 ≤ D2 / H1 ≤ 0.

95.

4. The encapsulation base according to claim 1, wherein: The overlapping area of the projection of the electroplated wiring and the electrode pad on the first surface is A1, and the projected area of the electrode pad on the first surface is A2, where 0.05 ≤ A1 / A2 ≤ 0.

35.

5. The encapsulation base according to claim 1, characterized in that: The angle between the tangent of the extending path of the end of the electroplated wiring connected to the electrode pad and the first surface is θ, where θ ≤ 45°.

6. The encapsulation base according to claim 1, wherein: It further includes a plurality of external terminals. The plurality of external terminals are arranged on the first surface and are spaced apart on the first surface. The electrode pad is connected to one of the external terminals through a via conductor.

7. The encapsulation base according to claim 6, wherein: The electrode pad is provided with a first area for connecting with the electroplated wiring, and the via conductor and the projection of the first area on the first surface at least partially overlap.

8. The encapsulation base according to claim 1, characterized in that: The insulating substrate has an intersecting first diagonal and second diagonal. The insulating substrate has a relatively arranged first corner area and third corner area in the extending direction of the first diagonal, and the insulating substrate has a relatively arranged second corner area and fourth corner area in the extending direction of the second diagonal; there is a side area between two adjacent corner areas; The electroplated wirings for connecting with the electrode pads are both arranged in the second corner area and the fourth corner area; or, The electroplated wirings for connecting with the electrode pads are both arranged in the first corner area and the third corner area; or, The electroplated wiring for connecting with the electrode pad is arranged in the side area.

9. An encapsulation base composite plate is formed by arranging a plurality of encapsulation bases according to any one of claims 1-8, and is characterized in that: The electroplating wirings which are connected and conduct with each other are arranged between the adjacent encapsulation bases, and the dividing inclined surfaces of the adjacent encapsulation bases cooperate with each other to form a dividing groove.

10. An electronic device, comprising the encapsulation base according to any one of claims 1-8, characterized in that: It further includes electronic components arranged in the installation cavity and a cover plate for sealing the installation cavity.

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