Electronic equipment and circuit board grounding gasket

Abstract

The invention discloses electronic equipment and a circuit board grounding gasket, and the electronic equipment comprises a housing which is provided with an accommodation space, and the inner wall of the housing is provided with a grounding connection seat; the circuit board is arranged in the accommodating space; the grounding gasket is connected with the grounding connecting seat and the circuit board so as to be in grounding connection with the circuit board; wherein the grounding gasket comprises a gasket part and a part part, the gasket part and the part part are an integrated metal part, the gasket part is in grounding connection with the grounding connection seat, and the part part is formed by extending the edge of the gasket part and serves as a part except the electronic equipment gasket in function. In the scheme, the gasket and other parts except the gasket are prepared into the integrated metal part, so that the number of the whole parts in the electronic equipment can be reduced, and the assembly efficiency of the electronic equipment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and particularly to an electronic device and a circuit board grounding gasket. Background Art

[0002] For a circuit board of an electronic device, such as a main board, grounding treatment is required. A good grounding connection for the circuit board can divert static electricity and other interference currents to the ground, preventing these interferences from damaging the internal circuits and components of the circuit board of the electronic device.

[0003] A grounding gasket is an important component used in an electronic device to achieve the grounding connection of the circuit board. For example, in the grounding of a mobile phone main board, a grounding steel sheet needs to be provided between the metal back shell and the main board to achieve the grounding connection of the main board, ensuring the safe operation of the main board and preventing static interference.

[0004] In achieving a good grounding connection for the circuit board, the circuit board needs to be provided with multiple grounding points, and each grounding point requires a grounding gasket to achieve the grounding of the main board. Therefore, in the manufacture of electronic devices, a relatively large number of grounding gaskets need to be used. Coupled with many other components, the overall number of components of the electronic device is large, and the production and assembly processes are complex. Summary of the Invention

[0005] The purpose of the present invention is to solve at least one of the above technical problems to some extent.

[0006] To this end, the first object of the present invention is to propose an electronic device and a circuit board grounding gasket to reduce the overall number of components in the electronic device and improve the assembly efficiency.

[0007] To achieve the above object, the electronic device proposed in the first aspect embodiment of the present invention includes: a housing having an accommodation space, and the inner wall of the housing has a grounding connection seat; a circuit board disposed in the accommodation space; a grounding gasket connecting the grounding connection seat and the circuit board to ground-connect the circuit board; wherein, the grounding gasket includes a gasket portion and a component portion, the gasket portion and the component portion are an integral metal component, the gasket portion is grounded-connected to the grounding connection seat, and the component portion extends from the edge of the gasket portion and serves as a component other than the gasket function of the electronic device. In this solution, the gasket and other components outside the gasket are prepared as an integral metal component, thereby reducing the overall number of components inside the electronic device and improving the assembly efficiency of the electronic device.

[0008] According to an embodiment of the present invention, the component is disposed on the circuit board so that the grounding gasket ground-connects the circuit board. It can enable the grounding gasket to ground-connect the circuit board, then there is no need for the circuit board to extend to the grounding connection seat.

[0009] According to an embodiment of the present invention, the grounding connection base is an internal-threaded base, and a semi-circular notch is provided at the top thereof; the gasket portion has a semi-circular hole ring, and the gasket portion of the semi-circular hole ring is arranged in the semi-circular notch, so that the semi-circular hole ring and the threaded hole of the internal-threaded base are penetrated. On the premise of ensuring the stable setting of the grounding gasket, the space occupied by it in height can be further reduced, and the thickness of the electronic device can be further reduced.

[0010] According to an embodiment of the present invention, the part portion extends from the gasket portion by bending to a plane outside the plane where the gasket portion is located and is connected to the circuit board. It is convenient to realize bending, and it is easy to realize misaligned connection in height, and the thickness of the electronic device is further reduced.

[0011] According to an embodiment of the present invention, it further includes: a first part; the part portion is a bracket, and the first part is supported on the bracket, and the grounding gasket that can realize the function of the bracket.

[0012] According to an embodiment of the present invention, the circuit board includes a first printed circuit board and a second printed circuit board; the first part is a cable electrically connecting the first printed circuit board and the second printed circuit board; the bracket includes a bottom plate and clamping arms, the clamping arms are arranged on both sides of the bottom plate, the cable is arranged on the bottom plate and is clamped by the clamping arms, and one end of the bottom plate extends and is connected to the gasket portion, and the grounding gasket that can realize the function of the cable bracket.

[0013] According to an embodiment of the present invention, it further includes: a battery; a vibration motor; the first printed circuit board and the second printed circuit board are arranged at opposite ends of the battery; the vibration motor is arranged at one end of the battery close to the first printed circuit board; the bottom plate extends and is connected to the gasket portion at the gap between the vibration motor and the battery; a metal bracket cover is covered above the first printed circuit board; there are multiple grounding connection bases, wherein two grounding connection bases are respectively a first grounding hole seat and a second grounding hole seat, and the metal bracket cover includes a first support leg and a second support leg; the first support leg is grounded and connected to the first grounding hole seat, and the second support leg is grounded and connected to the second grounding hole seat and the gasket portion, and the grounding connection of multiple grounding connection bases can be realized.

[0014] According to an embodiment of the present invention, the second grounding hole seat is located at the gap.

[0015] According to an embodiment of the present invention, the circuit board includes a third printed circuit board; the ground connection seat includes a third ground hole seat, the third ground hole seat penetrates from the bottom surface of the third printed circuit board to the top surface of the third printed circuit board, and the gasket portion is disposed on the top surface of the third printed circuit board and is grounded to the ground connection seat. It is possible to reduce the space occupied in the thickness of the electronic device, which is beneficial to realizing the thinning and lightening of the electronic device.

[0016] According to an embodiment of the present invention, it further includes: a second component; the component portion is a baffle formed by bending and extending from the gasket portion, and the baffle is located on one side of the second component to realize a grounding gasket with a blocking function.

[0017] According to an embodiment of the present invention, the gasket portion includes a bottom sheet and two top sheets, the bottom sheet has an opening, the two top sheets are bent upward from two opposite sides of the bottom sheet and are stacked on the upper parts of both sides of the bottom sheet, and there is a gap in the extending direction of the opening between the ends of the two top sheets; the baffle is formed by bending and extending from one side connecting the two sides of the bottom sheet. It is convenient to meet the requirements of the support strength, the manufacturing process is relatively simple, and it can be processed from a metal sheet.

[0018] According to an embodiment of the present invention, it further includes: a speaker; the second component is a metal speaker bracket, the metal speaker bracket includes a third leg and a fourth leg; there are multiple ground connection seats, wherein two ground connection seats are the third ground hole seat and the fourth ground hole seat respectively; the third leg is grounded to the third ground hole seat, and the fourth leg is grounded to the fourth ground hole seat and the gasket portion, so that the grounding connection of multiple ground connection seats can be realized.

[0019] To achieve the above object, a circuit board grounding gasket proposed in the second aspect embodiment of the present invention includes: a gasket portion; a component portion, the gasket portion and the component portion are an integral metal component, and the component portion is formed by extending from the edge of the gasket portion as a component other than the function of the grounding gasket. In this solution, the gasket and other components outside the gasket are prepared as an integral metal component, so that the number of overall components inside the electronic device can be reduced, and the assembly efficiency of the electronic device can be improved.

[0020] According to an embodiment of the present invention, the component portion is a bracket or a baffle. It is possible to realize a circuit board grounding gasket with a bracket function or a baffle function.

[0021] According to an embodiment of the present invention, when the component portion is a bracket, the bracket is used to be disposed on the circuit board, and the gasket portion has a semi-hole ring. On the premise of ensuring the stable setting of the grounding gasket, the space occupied by it in height can be further reduced, and the thickness of the electronic device can be further reduced.

[0022] According to an embodiment of the present invention, the component part extends from the gasket part by bending and extends beyond the plane where the gasket part is located, so as to achieve the ground connection for the height difference between the main board and the ground connection seat.

[0023] According to an embodiment of the present invention, when the component part is a baffle and the gasket part is a double-layer gasket, the baffle is formed by bending and extending from any one layer of the double-layer gasket. This is convenient for meeting the requirements of the support strength.

[0024] According to an embodiment of the present invention, the double-layer gasket includes a bottom sheet and two top sheets. The bottom sheet has an opening. The two top sheets are bent upward from two opposite sides of the bottom sheet and are stacked on the upper parts of both sides of the bottom sheet. There is a gap between the two top sheets in the extending direction of the opening. The baffle is formed by bending and extending from the edge connecting one side of the two sides of the bottom sheet. In this embodiment, the manufacturing process is relatively simple and can be processed from a metal sheet.

[0025] The technical solution provided by the embodiment of this solution has at least the following advantages:

[0026] In the technical solution provided by the embodiment of this solution, the ground gasket includes a gasket part and a component part. The gasket part and the component part are an integral metal component. The gasket part is grounded to the ground connection seat. The component part is formed by extending from the edge of the gasket part and serves as a component other than the function of the gasket of the electronic device. When grounding the circuit board, the ground gasket connects the ground connection seat and the circuit board to ground the circuit board. Among them, the gasket part serves as the connection end for grounding the ground connection seat and is grounded to the ground connection seat. The component part serves as a component other than the function of the gasket of the electronic device and can play the function of other components besides the gasket. Compared with the existing solution, in this solution, the gasket and other components outside the gasket are prepared as an integral metal component, so that the overall number of components inside the electronic device can be reduced and the assembly efficiency of the electronic device can be improved.

[0027] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0028] The above-mentioned and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the following description of the embodiments in conjunction with the drawings, where:

[0029] Figure 1 is a schematic diagram of the internal structure of an electronic device according to an embodiment of the present invention;

[0030] Figure 2 is Figure 1Enlarged view of A;

[0031] Figure 3 It is a schematic diagram of a partial exploded structure of the position of a ground pad of an electronic device according to an embodiment of the present invention;

[0032] Figure 4 It is a schematic diagram of the structure of the first printed circuit board and the cable of an electronic device according to an embodiment of the present invention;

[0033] Figure 5 It is a schematic diagram of the structure of a ground pad of an electronic device according to an embodiment of the present invention;

[0034] Figure 6 It is a schematic diagram of a partial sectional structure of the ground connection of a ground pad of an electronic device according to an embodiment of the present invention;

[0035] Figure 7 It is Figure 1 Enlarged view of B;

[0036] Figure 8 It is a schematic diagram of a partial exploded structure of another position of a ground pad of an electronic device according to an embodiment of the present invention;

[0037] Figure 9 It is a schematic diagram of a partially enlarged exploded structure of another position of a ground pad of an electronic device according to an embodiment of the present invention;

[0038] Figure 10 It is a schematic diagram of a partial structure of the ground connection of another ground pad of an electronic device according to an embodiment of the present invention;

[0039] Figure 11 It is a schematic diagram of a partial sectional structure of the ground connection of another ground pad of an electronic device according to an embodiment of the present invention;

[0040] Figure 12 It is a schematic diagram of the structure of another ground pad of an electronic device according to an embodiment of the present invention.

[0041] The reference numerals are as follows:

[0042] Housing 10, first folding shell 101, second folding shell 102, ground connection seat 11, first ground hole seat 111, second ground hole seat 112, third ground hole seat 113, fourth ground hole seat 114, internal thread base 111a, semi-circular notch 112a, circuit board 20, first printed circuit board 21, third printed circuit board 22, ground gasket 30, gasket part 31, semi-hole ring 311a, first convex structure 312a, negative film 311b, top film 312b, second convex structure 313b, part portion 32, bracket 32a, bottom plate 321a, clamping arm 322a, baffle 32b, first part 41, battery 42, vibration motor 43, metal bracket cover plate 44, first leg 441, second leg 442, second part 51, third leg 511, fourth leg 512, speaker 52. Detailed implementation manners

[0043] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0044] In the preparation of a mobile phone, it contains a large number of components. For example, the main components may include a housing, a main board, a battery, a display screen, a speaker, a vibration motor, etc. The secondary components may include: a ground gasket, a fixing bolt, a cable, a cable bracket, a limit retaining wall, a metal protective cover bracket, etc. The more components there are inside the mobile phone, the more complex the management of the components becomes, with high management costs and great assembly difficulties.

[0045] Therefore, how to reduce the number of components inside the mobile phone is a difficult problem to improve the production efficiency of the mobile phone and reduce the production cost.

[0046] In the actual preparation of a mobile phone, in order to ensure the good operation of the electronic device, the circuit board needs to be grounded. For example, the circuit board and the metal protective cover bracket need to be grounded to reduce electromagnetic interference to the antenna. In practice, a single grounding point often cannot meet the grounding requirements, so multiple points on the circuit board need to be grounded simultaneously. Therefore, a large number of ground gaskets are required. The ground gasket is one of the components with a large number inside the mobile phone and is located at different positions inside the mobile phone. The inventor considered that, taking advantage of its position, other components close to it can be combined into one to form a multi-functional ground gasket, which can then reduce the number of components in the electronic device.

[0047] Based on this, the present invention proposes an electronic device and a circuit board ground gasket.

[0048] Specifically, an electronic device and a circuit board grounding gasket according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0049] Figure 1 is a schematic internal structure diagram of an electronic device according to an embodiment of the present invention, Figure 2 is Figure 1 an enlarged view of A in Figure 1 and Figure 2 As shown, the grounding gasket in the embodiment of the present invention can be integrated with the bracket of the cable to form a multi-functional grounding gasket, so that the number of components in the electronic device can be reduced. In practice, due to the different positions of the grounding gasket, the shapes or functions of other components around it are also different. Therefore, in implementation, the Figure 1 and the Figure 2 structures and functions corresponding to the grounding gasket in Figure 1 and Figure 2 are only illustrative. In practice, it is not limited to being used for the bracket function. That is, it is easy to understand that for the electronic device in the embodiment of the present solution, the component part of the grounding gasket is not limited to the

[0050] such as Figure 1 and Figure 2 As shown, an electronic device according to an embodiment of the present invention includes: a housing 10, a circuit board 20, and a grounding gasket 30. The housing 10 has an accommodation space, and the inner wall of the housing 10 has a grounding connection seat 11. The circuit board 20 is disposed in the accommodation space. The grounding gasket 30 connects the grounding connection seat 11 and the circuit board 20 to ground the circuit board 20. Wherein, the grounding gasket 30 includes a gasket part 31 and a component part 32, the gasket part 31 and the component part 32 are an integral metal component, the gasket part 31 is grounded to the grounding connection seat 11, and the component part 32 extends from the edge of the gasket part 31 to serve as a component other than the gasket function of the electronic device.

[0051] The metal material of the grounding gasket 30 is a conductive material, specifically any one of steel, iron, copper alloy material, and aluminum alloy conductive material.

[0052] In the technical solution provided by the embodiment of this solution, the grounding gasket 30 includes a gasket portion 31 and a component portion 32. The gasket portion 31 and the component portion 32 are an integral metal component. The gasket portion 31 is grounded and connected to the grounding connection seat 11. The component portion 32 extends from the edge of the gasket portion 31 and serves as a component other than the function of the gasket of the electronic device. When grounding the circuit board 20, the grounding gasket 30 connects the grounding connection seat 11 and the circuit board 20 to ground-connect the circuit board 20. Among them, the gasket portion 31 serves as the connection end for grounding the grounding connection seat 11 and is grounded and connected to the grounding connection seat 11. The component portion 32 serves as a component other than the function of the gasket of the electronic device and can function as other components outside the gasket. Compared with the existing solution, in this solution, the gasket and other components outside the gasket are prepared as an integral metal component, so that the overall number of components inside the electronic device can be reduced and the assembly efficiency of the electronic device can be improved.

[0053] It should be noted that the electronic device of the embodiment of the present invention can be a digital camera, a smart phone, a tablet computer, a video camera, a television, a laptop computer, a web camera, a driving recorder, a smart wearable device (such as a smart watch, smart glasses, etc.), a point of sales (POS), an augmented reality (AR), a virtual reality (VR) device, etc.

[0054] Exemplarily, as Figure 1 shown, the electronic device can be a foldable smart phone. The housing 10 includes a first folding shell 101 and a second folding shell 102. The first folding shell 101 and the second folding shell 102 are rotatably connected. By folding or unfolding the first folding shell 101 and the second folding shell 102 with each other, the buckling and opening of the smart phone are realized. It can be understood that in implementation, the specific shape and structure of the housing 10 of the electronic device are not limited to the shape and structure of the housing 10 of the above-mentioned foldable smart phone.

[0055] The grounding connection seat 11 can specifically be a metal grounding connection seat 11, which can realize the function of discharging static electricity. In implementation, the housing 10 can be an overall metal structure, or alternatively, the housing 10 can adopt a partial metal structure, and this metal structure part is used to prepare the grounding connection seat 11. There can be multiple grounding connection seats 11, and the multiple grounding connection seats 11 can be connected by a metal structure wire to form an integrated ground, but it is not limited thereto.

[0056] The grounding connection base 11 can be in the form of a grounding hole base, such as an internally threaded metal connection base. The gasket portion 31 can have an opening, and the gasket portion 31 is fastened to the grounding hole base by bolts to complete the grounding connection between the gasket portion 31 and the grounding connection base 11. In the following embodiments, this method can be used to achieve the grounding connection between the grounding connection base 11 and the gasket portion 31 by means of bolt fastening. In realizing the connection between the grounding gasket 30 and the circuit board 20, in some embodiments, the gasket portion 31 can be connected to the circuit board 20. Since the gasket portion 31 and the component portion 32 are integral metal components, the component portion 32 can also be connected to the circuit board 20 to realize the grounding gasket 30 connecting the grounding connection base 11 and the circuit board 20.

[0057] According to the different internal structures of different electronic devices, the shapes and structures of the housing 10 and the circuit board 20 inside the electronic device are also different. For example, Figure 2 As shown, the grounding connection base 11 is at the corner of the first folding shell 101, and there is a certain distance between the circuit board 20 and the grounding connection base 11 at the corner of the first folding shell 101. In the related art, it is necessary to extend the circuit board 20 to the position of the grounding connection base 11, which increases the complexity of the extension of the circuit board 20. In the embodiments of this solution, the grounding gasket 30 of the grounding gasket 30 is grounded to the grounding connection base 11, and the component portion 32 can extend to the circuit board 20 to form a connection, so as to realize the grounding connection between the circuit board 20 and the grounding connection base 11. In implementation, the components are arranged on the circuit board 20 so that the grounding gasket 30 is grounded to the circuit board 20, then there is no need for the circuit board 20 to extend to the grounding connection base 11.

[0058] In addition, there is also a certain height difference between the circuit board 20 and the grounding connection base 11 at the corner of the first folding shell 101. In the related art, due to the manufacturing process limitations of the circuit board 20, it is usually a planar structure, so it is necessary to "raise" the height of the circuit board 20 and "place" the circuit board 20 on the grounding connection base 11, then it will increase the overall thickness of the electronic device and is not conducive to the thin and light of the electronic device.

[0059] Figure 3 is a partial exploded structural schematic diagram of the position of a grounding gasket 30 of an electronic device according to an embodiment of the present invention. Figure 4 is a structural schematic diagram of a first printed circuit board 21 and a cable of an electronic device according to an embodiment of the present invention. Figure 5 is a structural schematic diagram of a grounding gasket 30 of an electronic device according to an embodiment of the present invention. Figure 6 is a partial cross-sectional structural schematic diagram of the grounding connection of a grounding gasket 30 of an electronic device according to an embodiment of the present invention. Please refer to Figures 3 to 6As shown, in the embodiment of this solution, the gasket part 31 and the component part 32 can be set with a "height offset". During implementation, the component part 32 extends from the gasket part 31 and bends out of the plane where the gasket part 31 is located, and is connected to the circuit board 20. Since the grounding gasket 30 is made of a metal material, it is easy to achieve bending and easy to achieve offset connection in height.

[0060] In the related art, when connecting the grounding gasket 30 to the grounding connection base 11 and the circuit board 20, a grounding steel sheet needs to be welded to the bottom of the circuit board 20. Therefore, this grounding steel sheet will increase the overall thickness of the electronic device. In the embodiment of this solution, in order to further reduce the thickness of the electronic device, during implementation, the grounding connection base 11 is an internal thread base 111a, and its top has a semi-circular notch 112a. The gasket part 31 has a semi-hole ring 311a, and the gasket part 31 of the semi-hole ring 311a is arranged in the semi-circular notch 112a, so that the semi-hole ring 311a and the threaded hole of the internal thread base 111a are communicated. By setting a semi-circular notch 112a at the top of the internal thread base 111a, an installation space can be provided for the gasket part 31. The gasket part 31 can be a semi-hole ring 311a that matches the semi-circular notch 112a. The semi-hole ring 311a is a semi-circular structure and can be inserted into the semi-circular notch 112a. The thickness of the semi-hole ring 311a is the same as the height of the semi-circular notch 112a. Then, the gasket part 31 will not additionally occupy height space. In this embodiment, the components are arranged on the circuit board 20, which can maintain the overall stability of the grounding gasket 30. Then, by adopting the structural form of the semi-hole ring 311a for the gasket part 31, on the premise of ensuring the stable setting of the grounding gasket 30, the space occupied by it in height can be further reduced, and the thickness of the electronic device can be further reduced.

[0061] Among them, the circuit board 20 includes an opposite top surface and bottom surface. The bottom surface of the circuit board 20 faces the inner surface of the first folding shell 101. When the component is used as the bracket 32a, the component can be arranged on the top surface of the circuit board 20 to facilitate supporting the components above the circuit board 20. For specific implementation, please refer to Figure 2 As shown, the above-mentioned electronic device further includes: a first component 41, the component part 32 is a bracket 32a, and the first component 41 is supported on the bracket 32a.

[0062] According to the different internal structures of different electronic devices, the number of circuit boards 20 inside the electronic device is not limited to 1, and can also be two or more. In the embodiment of this solution, the number of circuit boards 20 is multiple, and the multiple circuit boards 20 are connected by cables to achieve electrical connection between different circuit boards 20. The bracket 32a can be used to support the cable. Please refer to Figures 3 to 6As shown, the circuit board 20 includes a first printed circuit board 21 and a second printed circuit board (not shown). The first component 41 is a cable electrically connecting the first printed circuit board 21 and the second printed circuit board. The bracket 32a includes a bottom plate 321a and clamping arms 322a. The clamping arms 322a are disposed on both sides of the bottom plate 321a. The cable is disposed on the bottom plate 321a and clamped by the clamping arms 322a. One end of the bottom plate 321a extends and is connected to the gasket portion 31.

[0063] In specific implementation, according to the different internal structures of different electronic devices, in some embodiments, a battery 42 may be disposed between the first printed circuit board 21 and the second printed circuit board. That is, the first printed circuit board 21 and the second printed circuit board are disposed at opposite ends of the battery 42. A vibration motor 43 is disposed at one end of the battery 42 close to the first printed circuit board 21. Both the vibration motor 43 and the first printed circuit board 21 are located at one end of the first printed circuit board 21. The battery 42 supplies power to the first printed circuit board 21, the second printed circuit board, and the vibration motor 43. There is a gap between the vibration motor 43 and the battery 42. The bottom plate 321a extends and is connected to the gasket portion 31 at the gap between the vibration motor 43 and the battery 42. That is, the cable passes through the gap between the vibration motor 43 and the battery 42 and connects the first printed circuit board 21 and the second printed circuit board.

[0064] To protect the first printed circuit board 21, please refer to Figure 3 and Figure 6 As shown, the above-mentioned electronic device further includes: a metal bracket cover 44, which is covered above the first printed circuit board 21. The metal bracket cover 44 can play a role in protecting the first printed circuit board 21. In implementation, on the other hand, the metal bracket cover 44 also serves as a metal plate for multi-point grounding connection. There are a plurality of grounding connection seats 11. The first grounding connection seat 11 is a first grounding hole seat 111, and the second grounding connection seat 11 is a second grounding hole seat 112. The metal bracket cover 44 includes a first leg 441 and a second leg 442. The first leg 441 is grounded and connected to the first grounding hole seat 111, and the second leg 442 is grounded and connected to the second grounding hole seat 112 and the gasket portion 31. Through the metal bracket cover 44, the electrical connection between the first grounding hole seat 111 and the second grounding hole seat 112 can be realized. Then, when the first folding shell 101 is not a full-metal outer shell, the metal bracket cover 44 can simultaneously serve as a conductive connection member for the first grounding hole seat 111 and the second grounding hole seat 112.

[0065] It is easy to understand that between the first leg 441 of the metal bracket cover plate 44 and the first grounding hole seat 111, it can also be electrically connected to the first grounding point of the first printed circuit board 21. Between the second leg 442 of the metal bracket cover plate 44 and the second grounding hole seat 112, it is electrically connected to the second grounding point of the first printed circuit board 21.

[0066] The first printed circuit board 21 can be arranged at the lower part of the first folding shell 101, and the second printed circuit board can be arranged at the upper part of the first folding shell 101. A cable is electrically connected to the first printed circuit board 21 and the second printed circuit board to realize the electrical connection between the first printed circuit board 21 and the second printed circuit board. Since the cable is made of a flexible material, a bracket 32a is needed for fixation. In the related art, the cable needs to be equipped with a separate bracket 32a, and the circuit board 20 needs to be equipped with a separate grounding steel sheet. In the embodiments of this solution, as long as a multifunctional grounding gasket 30 is configured, the grounding of the first printed circuit board 21 and the clamping and fixation of the cable can be realized simultaneously, reducing the number of internal components of the electronic device.

[0067] In the related art, if the second grounding hole seat 112 is arranged at the gap, since the grounding steel sheet has an overall round hole structure, the diameter it occupies is relatively large. Then, a sufficient gap distance also needs to be reserved between the vibration motor 43 and the battery 42. Then, a relatively large space in the height direction of the first folding shell 101 needs to be occupied, sacrificing the space of the battery, and the battery power is low, unable to meet the usage requirements of a large-capacity battery. If the gap space is narrow, the grounding steel sheet cannot be accommodated, and the grounding connection of the circuit board 20 cannot be realized. In the embodiments of this solution, the second grounding hole seat 112 can be located at the gap. In practice, since the components can be arranged on the circuit board 20 and the circuit board 20 can support the grounding gasket 30, then, the grounding gasket 30 does not require large fixed support. The gasket part 31 can adopt the semi-circular ring 311a structure of the above embodiments. The annular angle of the semi-circular ring 311a can be between 45° and 180°, for example, it can be 45°, 90°, 135°, 175°, 180° or a value between any two of these angles. Among them, it is easy to understand that due to the adoption of the semi-circular ring 311a structure, its width can be narrower, suitable for being arranged in a narrower gap, so as to reduce the gap distance between the vibration motor 43 and the battery 42 and reduce the space occupied in the height direction of the first folding shell 101.

[0068] Furthermore, in order to achieve a good grounding connection between the semi-circular ring 311a and the second grounding hole seat 112, the semi-circular ring 311a has a first convex structure 312a, and the first convex structure 312a is supported on the top surface of the semi-ring notch 112a of the internal thread base 111a. The number of the first convex structures 312a can be two, located on both sides of the semi-circular ring 311a.

[0069] That is, in the embodiments of the present solution, a very narrow grounding gasket is used. The part is a strip-shaped metal part, which can be welded to the top surface of the first printed circuit board and bent upward to be connected to the gasket part. At the same time, the second leg of the metal bracket cover plate can also be stacked on the gasket part. The second leg and the gasket part are connected to the second grounding hole seat by bolts, and the grounding connection is achieved by using the depth space of the second grounding hole seat (the contact between the bolt and the internal thread of the second grounding hole seat).

[0070] In the related art, a grounding steel sheet is welded to the bottom of the circuit board and grounded to the housing grounding seat. On the top of the circuit board, it is connected to other grounding seats through a metal bracket. In this technical solution, the space occupied in the thickness direction of the electronic device is relatively large. In the embodiments of the present solution, the adopted grounding gasket has a gasket part that can be grounded to the grounding seat. The part extends from the gasket part and bends beyond the plane where the gasket part is located and is connected to the circuit board, so that the part and the gasket part can be at different height positions (i.e., the thickness position of the electronic device), which can reduce the thickness space of a grounding steel sheet and facilitate the realization of the ultra-thinness of the electronic device. At the same time, when welding the grounding steel sheet on the circuit board, a relatively large welding area is required, so the area of the grounding steel sheet is also relatively large. In the present solution, the gasket part and the grounding seat can be fixed by bolts, and the occupied area of the gasket part is small.

[0071] The above embodiments are specific embodiments of a grounding gasket 30 of the present application applied to the electronic device of the present application. In the following embodiments, they are specific embodiments of another grounding gasket 30 of the present application applied to the electronic device. In the embodiments of the above-mentioned grounding gasket 30, the part 32 of the grounding gasket 30 and the circuit board 20 are used to achieve the grounding connection. In the embodiments of the present solution, different from the above embodiments, the gasket part 31 and the circuit board 20 can be used for grounding connection, that is, the gasket part 31 is grounded to connect the circuit board 20 and the grounding seat 11 at the same time.

[0072] In the related art, it is necessary to weld a grounding steel sheet under the circuit board 20, which will occupy the space under the circuit board 20. In the embodiments of the present solution, the grounding gasket 30 can be arranged above the circuit board 20. On the one hand, it can reduce the height position of the circuit board 20 and realize the sinking of the circuit board 20. On the other hand, compared with the related art, in the present solution, since the part 32 of the grounding gasket 30 can be used as a part other than the function of the electronic device gasket. Relatively speaking, in the embodiments of the present solution, under the condition of realizing the functions of the components, the space of the grounding steel sheet originally arranged under the circuit board 20 can be saved.

[0073] According to the different internal structures of different electronic devices, the shapes and structures of the housing 10 and the circuit board 20 inside the electronic device are also different. Figure 7Yes Figure 1 An enlarged view of B in Figure 8 is a partial exploded structural schematic diagram of the position of another ground pad 30 of an electronic device according to an embodiment of the present invention. Figure 9 is a partially enlarged exploded structural schematic diagram of the position of another ground pad 30 of an electronic device according to an embodiment of the present invention. Figure 10 is a partial structural schematic diagram of the ground connection of another ground pad 30 of an electronic device according to an embodiment of the present invention. Figure 11 is a partial cross-sectional structural schematic diagram of the ground connection of another ground pad 30 of an electronic device according to an embodiment of the present invention. Please refer to Figures 7 to 11 As shown, different from the ground connection seat 11 at the corner of the first folding shell 101 in the above embodiment, the ground connection seat 11 in this embodiment can be at the corner of the second folding shell 102, but is not limited thereto. The circuit board 20 includes a third printed circuit board 22. The ground connection seat 11 can be at least one, but is not limited thereto. It includes a third ground hole seat 113. The third ground hole seat 113 penetrates from the bottom surface to the top surface of the third printed circuit board 22. The gasket portion 31 is disposed on the top surface of the third printed circuit board 22 and is grounded to the ground connection seat 11. In the embodiment of this solution, only the installation thickness space of one gasket portion 31 needs to be occupied above the third printed circuit board 22. In the related art, not only the thickness space of the ground steel sheet needs to be occupied below the circuit board 20, but also the thickness space of the installation parts needs to be occupied above the circuit board 20. Therefore, the space occupied in the thickness of the electronic device can be reduced, which is beneficial to realizing the thin and light of the electronic device.

[0074] One ground pad 30 in the above embodiment can specifically have the functions of the ground pad 30 and the bracket 32a. Another ground pad 30 in this embodiment can specifically have the functions of the ground pad 30 and the baffle 32b. It should be noted that the blocking of the baffle 32b can be understood as the blocking function when the ground pad 30 is assembled to the ground connection seat 11, or it can be the blocking function during the process of assembling the ground pad 30 to the ground connection seat 11. Specifically, it can be understood as the guiding block during installation. In practice, the above electronic device further includes: a second part 51; the part portion 32 is a baffle 32b formed by bending and extending from the gasket portion 31, and the baffle 32b is located on one side of the second part 51.

[0075] After the grounding gasket 30 is assembled to the grounding connection seat 11, the blocking function thereof can form a contact conflict between the baffle 32b and one side of the second part 51. In the process of assembling the grounding gasket 30 to the grounding connection seat 11, the blocking function thereof does not need to form a contact conflict after the grounding gasket 30 is assembled to the grounding connection seat 11.

[0076] Figure 12 FIG. 1 is a schematic diagram of the structure of another grounding pad 30 of an electronic device according to an embodiment of the present invention. Figure 12 As shown, since the baffle 32b will bear a certain load force, in the embodiment of this scheme, the gasket part 31 can be a double-layer gasket formed by bending a metal plate, and the baffle 32b is formed by bending and extending any one layer of the double-layer gasket. Specifically, the gasket part 31 includes a bottom plate 311b and two top plates 312b, the bottom plate 311b has an opening, and the two top plates 312b are bent upward from two opposite sides of the bottom plate 311b and stacked on the upper parts of both sides of the bottom plate 311b. There is a gap between the ends of the two top plates 312b in the extension direction of the opening, and the baffle 32b is formed by bending and extending one side connecting the two sides of the bottom plate 311b. With this structure, the load bearing capacity of the gasket part 31 can be increased, and the manufacturing process is relatively simple, and it can be processed by a metal plate.

[0077] Another grounding gasket 30 in this embodiment, the grounding connection seat 11 directly connected to it can be grounded to other grounding connection seats 11 to form an integral grounding network. Please refer to the following embodiments for details. In this embodiment, the above-mentioned electronic device also includes: a speaker 52. The second part 51 is a metal speaker 52 bracket 32a, and the metal speaker 52 bracket 32a includes a third leg 511 and a fourth leg 512; the grounding connection seat 11 can be multiple, one of which is a third grounding hole seat 113, and the other grounding connection seat 11 is a fourth grounding hole seat 114; the third leg 511 is grounded to the third grounding hole seat 113, and the fourth leg 512 is grounded to the fourth grounding hole seat 114 and the gasket part 31. The third grounding hole socket 113 and the fourth grounding hole socket 114 can be electrically connected through the metal speaker 52 bracket 32a. Therefore, when the second folding shell 102 is a non-all-metal shell, the metal speaker 52 bracket 32a can also serve as a conductive connector for the third grounding hole socket 113 and the fourth grounding hole socket 114.

[0078] It is easy to understand that between the third foot 511 of the metal speaker 52 bracket 32a and the third ground hole seat 113, it can also be electrically connected to the first grounding point of the third printed circuit board 22. Between the fourth foot 512 of the metal speaker 52 bracket 32a and the fourth ground hole seat 114, it is electrically connected to the second grounding point of the third printed circuit board 22.

[0079] In this embodiment, the metal speaker 52 bracket 32a can be disposed on one side of the speaker 52 as the bracket 32a on one side of the speaker 52. The metal speaker 52 bracket 32a can be supported on one side of the speaker 52 on one side and on the side wall of the second folding shell 102 on the other side. And in the embodiment of this solution, the baffle 32b of the grounding gasket 30 can be used as a guiding plate during the installation of the metal speaker 52 bracket 32a. That is, in practice, the operating space of the metal speaker 52 bracket 32a is small, and it may be difficult to install it in place quickly during assembly. In this solution, first, the third printed circuit board 22 is disposed on the bottom of the second folding shell 102, and then the grounding gasket 30 is disposed on the third printed circuit board 22. A guiding installation space will be formed between the baffle 32b of the grounding gasket 30 and the speaker 52, which facilitates guiding and assembling the metal speaker 52 bracket 32a into the installation space, and then it can be locked to the fourth ground hole seat 114 through bolts.

[0080] Furthermore, in order to achieve a good grounding connection between the two top pieces 312b and the installed metal speaker 52 bracket 32a, the two top pieces 312b have a second convex structure 313b, and the second convex structure 313b is supported on the bottom surface of the installed metal speaker 52 bracket 32a.

[0081] A circuit board grounding gasket according to another embodiment of the present invention includes: a gasket portion 31 and a part portion 32. The gasket portion 31 and the part portion 32 are an integral metal component. The part portion 32 extends from the edge of the gasket portion 31 and serves as a part other than the function of the grounding gasket of the electronic device. Specifically, the circuit board grounding gasket in this embodiment can adopt the grounding gasket 30 of any one of the above embodiments, and this embodiment will not be elaborated.

[0082] The circuit board grounding gasket of this embodiment can be applied to the circuit board grounding of an electronic device.

[0083] It should be noted that in the examples and the description of this patent, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one" does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0084] Although this application has been illustrated and described by reference to certain preferred embodiments thereof, those of ordinary skill in the art should understand that various changes in form and detail may be made thereto without departing from the spirit and scope of this application.

Claims

1. An electronic device, characterized in that, Comprising: A housing having an accommodation space, and the inner wall of the housing has a ground connection seat; A circuit board disposed in the accommodation space; A ground gasket connecting the ground connection seat and the circuit board for grounding the circuit board; wherein The ground gasket includes a gasket portion and a component portion. The gasket portion and the component portion are an integral metal component. The gasket portion is grounded to the ground connection seat, and the component portion extends from the edge of the gasket portion and serves as a component other than the function of the gasket of the electronic device.

2. The electronic device according to claim 1, characterized in that The component is disposed on the circuit board so that the ground gasket grounds the circuit board.

3. The electronic device according to claim 2, characterized in that The ground connection seat is an internally threaded base, and its top has a semi-circular notch; The gasket portion has a semi-circular hole ring, and the gasket portion of the semi-circular hole ring is disposed in the semi-circular notch so that the semi-circular hole ring and the threaded hole of the internally threaded base are in communication.

4. The electronic device according to claim 2, characterized in that The component portion extends from the gasket portion to a plane outside the plane where the gasket portion is located and is connected to the circuit board.

5. The electronic device according to any one of claims 1-4, characterized in that, Further comprising: A first component; The component portion is a bracket, and the first component is supported on the bracket.

6. The electronic device according to claim 5, characterized in that The circuit board includes a first printed circuit board and a second printed circuit board; The first component is a cable electrically connecting the first printed circuit board and the second printed circuit board; The bracket includes a bottom plate and clamping arms. The clamping arms are disposed on both sides of the bottom plate. The cable is disposed on the bottom plate and is clamped by the clamping arms. One end of the bottom plate extends and is connected to the gasket portion.

7. The electronic device according to claim 6, wherein Further comprising: A battery; A vibration motor; The first printed circuit board and the second printed circuit board are disposed at opposite ends of the battery; The vibration motor is disposed at one end of the battery close to the first printed circuit board; The bottom plate extends and is connected to the gasket portion at the gap between the vibration motor and the battery; A metal bracket cover is disposed above the first printed circuit board; There are multiple ground connection seats. Among them, two ground connection seats are respectively a first ground hole seat and a second ground hole seat. The metal bracket cover includes a first support leg and a second support leg; The first support leg is grounded to the first ground hole seat, and the second support leg is grounded to the second ground hole seat and the gasket portion.

8. The electronic device according to claim 7, characterized in that The second ground hole seat is located at the gap.

9. The electronic device according to claim 1, characterized in that The circuit board includes a third printed circuit board; The ground connection seat includes a third ground hole seat. The third ground hole seat penetrates from the bottom surface of the third printed circuit board to the top surface of the third printed circuit board. The gasket portion is disposed on the top surface of the third printed circuit board and is grounded to the ground connection seat.

10. The electronic device according to claim 1 or 9, characterized in that, Further comprising: A second component; The part portion is a baffle formed by bending and extending from the gasket portion, and the baffle is located on one side of the second part.

11. The electronic device according to claim 10, wherein The gasket portion includes a bottom sheet and two top sheets. The bottom sheet has an opening. The two top sheets are bent upward from two opposite sides of the bottom sheet and stacked on the upper parts of both sides of the bottom sheet. There is a gap between the ends of the two top sheets in the extending direction of the opening. The baffle is formed by bending and extending from one side connecting the two sides of the bottom sheet.

12. The electronic device according to claim 11, wherein It further includes: Speaker; The second part is a metal speaker bracket, and the metal speaker bracket includes a third leg and a fourth leg; There are multiple grounding connection seats, wherein two grounding connection seats are the third grounding hole seat and the fourth grounding hole seat respectively; The third leg is grounded to the third grounding hole seat, and the fourth leg is grounded to the fourth grounding hole seat and the gasket portion.

13. A circuit board ground gasket, characterized in that, It includes: Gasket portion; Part portion. The gasket portion and the part portion are an integral metal component. The part portion is formed by extending from the edge of the gasket portion and serves as a part other than the function of the grounding gasket.

14. The circuit board grounding gasket according to claim 13, wherein The part portion is a bracket or a baffle.

15. The circuit board grounding gasket according to claim 14, wherein When the part portion is a bracket, the bracket is used to be arranged on the circuit board, and the gasket portion has a semi-hole ring.

16. The circuit board grounding gasket according to claim 15, wherein The part portion is bent and extended from the gasket portion to outside the plane where the gasket portion is located.

17. The circuit board grounding gasket according to claim 14, wherein When the part portion is a baffle, the gasket portion is a double-layer gasket, and the baffle is formed by bending and extending from any one layer of the double-layer gasket.

18. The circuit board grounding gasket according to claim 17, wherein The double-layer gasket includes a bottom sheet and two top sheets. The bottom sheet has an opening. The two top sheets are bent upward from two opposite sides of the bottom sheet and stacked on the upper parts of both sides of the bottom sheet. There is a gap between the two top sheets in the extending direction of the opening. The baffle is formed by bending and extending from the edge of one side connecting the two sides of the bottom sheet.

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