Double-track discharging mechanism of high-throughput IC chip Tube sorting machine

Abstract

The invention provides a double-rail discharging mechanism of a high-throughput IC chip Tube sorting machine. The double-rail discharging mechanism comprises a rail assembly, a front stock bin assembly, a clamping and pushing assembly, a rear stock bin assembly and a transverse pushing assembly. The front stock bin assembly is installed at the tail end of the rail assembly, the clamping and pushing assembly is installed below the front stock bin assembly, the rear stock bin assembly is installed right behind the front stock bin assembly, and the transverse pushing assembly is installed between the front stock bin assembly and the rear stock bin assembly. The invention has the following advantages and beneficial effects: the UPH is improved: the double-track design enables the capacity to reach 15, 000-16 and 500 particles per hour (only 7, 000-8 and 500 particles in the traditional single track); the reliability is optimized, the material blocking rate is smaller than 0.1%, and the chip damage rate is smaller than 0.05%; the stacking dislocation rate of the full tubes is less than 0.01%; and the compatibility is as follows: the device can be adapted to Tube tubes with different specifications such as 8mm and 12mm, and the remodeling time is less than 5 minutes.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuits, and in particular relates to a dual-track blanking mechanism for a high-throughput IC chip Tube sorter. Background Art

[0002] With the continuous progress of semiconductor technology, the chip manufacturing process has become increasingly refined, and the integration level has been continuously improved. At the same time, the market's requirements for chip performance, reliability, and cost have also become increasingly strict. This has forced semiconductor manufacturers to adopt more efficient and precise equipment and technologies in the chip manufacturing and testing processes. As one of the key equipment in the semiconductor testing process, the performance and efficiency of the IC chip Tube sorter directly affect the quality and cost of the entire chip manufacturing process.

[0003] The blanking mechanism is an important part of the IC chip Tube sorter. It is responsible for accurately feeding the tested and sorted chips from the discharge port of the sorter into the designated containers or tubes. This process requires a high degree of accuracy and stability to ensure that the chips are not damaged during transportation and can be arranged according to the predetermined specifications and sequences. The performance of the blanking mechanism directly affects the efficiency of the entire sorter and the quality of the chips.

[0004] In the traditional IC chip Tube blanking mechanism, a single-track + single receiving block structure design is usually adopted, which has the following key problems, restricting the production efficiency (UPH) and reliability:

[0005] 1. Low production efficiency (UPH)

[0006] Serial operation mode: The single track can only process one group of Tube tubes at a time. Chip collection and blanking must be completed sequentially and cannot be performed in parallel, resulting in a UPH bottleneck (usually only 7,000 - 8,000 pieces / hour).

[0007] Idle waiting time: After the receiving block completes one blanking operation, it needs to return to the initial position or wait for a new tube to be in place, causing the equipment to be idle, and the effective working time is only 60% - 70%.

[0008] 2. Prominent reliability problems

[0009] High risk of chip jamming / blocking: Once the single track jams due to chip stacking, offset, or vibration, the entire production line needs to be shut down for processing, and the mean time between failures (MTBF) is relatively short.

[0010] High chip damage rate: The traditional receiving block lacks a flexible buffer design, and chips are easily scratched due to collision or friction during high-speed blanking (the defective rate is about 0.5% - 1%).

[0011] 3. Insufficient flexibility and compatibility

[0012] Fixed structure: The track width and the size of the material receiving block are usually not adjustable. When replacing Tube material tubes of different specifications (such as 8mm / 12mm), manual adjustment or even hardware replacement is required, and the changeover time is as long as 10 - 30 minutes.

[0013] Difficult to adapt to miniaturized chips: As the chip size shrinks (such as QFN, CSP packages), the alignment accuracy of the traditional mechanical guiding structure is insufficient, which easily leads to chip dropping or incorrect postures.

[0014] 4. Poor scalability

[0015] The single - track architecture limits the improvement of production capacity: If it is necessary to increase the UPH, only by increasing the running speed of the single track (which may exacerbate vibration and wear), rather than linearly expanding by increasing the number of tracks.

[0016] The existing technology is limited by defects such as single - track serial operation and rigid structure, and it is difficult to meet the requirements of the semiconductor packaging industry for high UPH, high reliability, flexible production. The dual - track Tube feeding mechanism of the present invention systematically solves these pain points through parallel processing and modular design, providing a better solution for advanced packaging. Summary of the Invention

[0017] In view of this, the present invention aims to propose a dual - track feeding mechanism for a high - throughput IC chip Tube sorter to solve the problems of low production efficiency, poor reliability, insufficient flexibility and compatibility, and poor scalability in the existing technology.

[0018] To achieve the above - mentioned purpose, the technical solution of the present invention is realized as follows:

[0019] A dual - track feeding mechanism for a high - throughput IC chip Tube sorter includes a track assembly, a front bin assembly, a clamping and pushing assembly, a rear bin assembly, and a horizontal pushing assembly;

[0020] The front bin assembly is installed at the end of the track assembly, the clamping and pushing assembly is installed below the front bin assembly, the rear bin assembly is installed directly behind the front bin assembly, and the horizontal pushing assembly is installed between them;

[0021] The track assembly includes two tracks, the two tracks are symmetric left and right, a material receiving block is installed at the front end of the track, a blowing block is installed at the front end of the material receiving block, an inlet fiber optic detection component is installed at the track inlet, an outlet fiber optic detection component is installed at the track outlet, and a counting fiber optic component is installed outside the track;

[0022] The front bin assembly includes two empty tube bins, which are respectively located on both sides of the base body of the front bin assembly. The inner side of the empty tube bin is adjacent to the full tube bin. Two anti-return support members are installed on the full tube bin, and the two anti-return support members are symmetric left and right. A lifting cylinder is installed at the bottom of the base body of the front bin assembly.

[0023] Furthermore, the clamping and pushing assembly includes two clamping jaws, which are symmetric left and right. A clamping cylinder is installed below the clamping jaws, a lifting cylinder is installed below the clamping cylinder, and the lifting cylinder is installed on a cylinder mounting seat, and the cylinder mounting seat is connected to a feeding cylinder.

[0024] Furthermore, the horizontal pushing assembly includes two mounting plates, which are symmetric left and right. A horizontal pushing cylinder is installed above the mounting plates, a tube pushing plate is installed above the horizontal pushing cylinder, a card slot is formed in the tube pushing plate, and a tube is placed inside the card slot.

[0025] Furthermore, the rear bin assembly has the same structure as the front bin assembly.

[0026] Furthermore, empty tubes are stacked in the empty tube bin, and full tubes are stacked in the full tube bin.

[0027] Furthermore, one end of the empty tube is connected to the empty tube bin of the front bin assembly, and the other end is connected to the empty tube bin of the rear bin assembly. One end of the full tube is connected to the full tube bin of the front bin assembly, and the other end is connected to the full tube bin of the rear bin assembly. And both ends of the bottom layer full tube are connected to the anti-return support members of the full tube bin.

[0028] Furthermore, the position of the tube inlet is directly opposite to the position of the track outlet.

[0029] Furthermore, the clamping jaws clamp the tube.

[0030] Compared with the prior art, the dual-track blanking mechanism of the high-throughput IC chip Tube sorter described in the present invention has the following advantages:

[0031] (1) A significant improvement in production efficiency (UPH)

[0032] Parallel processing ability: The dual-track design allows for the simultaneous collection and feeding of two groups of IC chips. Compared with the traditional single-track structure, the theoretical processing speed can be increased by nearly 100%, which is especially suitable for large-scale production scenarios of high-density and small-size chips; Seamless connection operation: Two receiving blocks alternately receive chips, and through timing control, the cycle operation of "receiving - transferring - emptying" is realized, reducing the equipment waiting time and maximizing the equipment utilization rate; Reliability enhancement brought by structural optimization; Anti-interference design: The dual tracks operate independently with low mechanical linkage, avoiding the problem of the whole machine shutdown caused by single-track material jamming, and the failure rate is reduced by more than 30%.

[0033] (2) Reliability enhancement brought by structural optimization

[0034] Anti-interference design: The dual tracks operate independently with low mechanical linkage, avoiding the problem of the whole machine shutdown caused by single-track material jamming, and the failure rate is reduced by more than 30%; Precise positioning: The receiving block adopts a high-precision guiding mechanism (such as a V-groove) to ensure that the chips do not shift or flip during high-speed transmission, and the good product rate is increased to more than 99.5%.

[0035] (3) Cost and maintenance advantages

[0036] Modular design: The receiving block and the track can be quickly disassembled and replaced, shortening the maintenance time by 50% and reducing the spare parts inventory cost at the same time; Strong compatibility: By adjusting the distance between the receiving blocks or the width of the track, it can be adapted to different specifications of Tube tubes (such as 8mm / 12mm), reducing the equipment transformation cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The drawings forming a part of the present invention are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0038] Figure 1 is the schematic diagram of the overall structure according to the embodiment of the present invention;

[0039] Figure 2 is the schematic diagram of the track assembly according to the embodiment of the present invention;

[0040] Figure 3 is the schematic diagram of the horizontal pushing assembly according to the embodiment of the present invention;

[0041] Figure 4 is the schematic diagram of the front bin assembly according to the embodiment of the present invention;

[0042] Figure 5 is the schematic diagram of the rear bin assembly according to the embodiment of the present invention;

[0043] Figure 6 is the schematic diagram of the clamping and pushing assembly according to the embodiment of the present invention.

[0044] Description of the reference numerals in the drawings:

[0045] 1. Rail assembly; 101. Material receiving block; 102. Rail; 103. Counting optical fiber assembly; 104. Inlet optical fiber detection assembly; 105. Outlet optical fiber detection assembly; 2. Front bin assembly; 201. Anti-retreat support; 202. Lifting cylinder; 203. Empty material pipe bin; 204. Full material pipe bin; 3. Clamping and pushing assembly; 301. Clamping cylinder; 302. Lifting cylinder; 303. Feeding cylinder; 304. Cylinder mounting seat; 305. Claw; 4. Rear bin assembly; 5. Horizontal pushing assembly; 501. Horizontal pushing cylinder; 502. Material pipe push plate; 503. Mounting plate; 504. Material pipe. Detailed implementation manners

[0046] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments may be combined with each other.

[0047] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0048] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.

[0049] The present invention will be described in detail below with reference to the drawings and in combination with embodiments.

[0050] As Figures 1 to 6As shown in the figure, a double-track blanking mechanism of a high-throughput IC chip Tube sorter includes a track assembly 1, a front bin assembly 2, a clamping and pushing assembly 3, a rear bin assembly 4, and a horizontal pushing assembly 5. The front bin assembly 2 is installed at the end of the track assembly 1. The clamping and pushing assembly 3 is installed below the front bin assembly 2. The rear bin assembly 4 is installed directly behind the front bin assembly 2, and the horizontal pushing assembly 5 is installed between the two.

[0051] The specific implementation is as follows:

[0052] In a preferred embodiment of the present invention, the track assembly 1 includes two tracks 102, which are symmetrically arranged left and right. A receiving block 101 is installed at the front end of the track 102. A blowing block is installed at the front end of the receiving block 101. An inlet fiber optic detection component 104 is installed at the inlet of the track 102. An outlet fiber optic detection component 105 is installed at the outlet of the track 102. A counting fiber optic component 103 is installed outside the track 102. The inlet position of the material tube 504 is directly opposite to the outlet position of the track 102. In this embodiment, the double-track 102 structure is used for the synchronous feeding and conveying of IC chips. The front-end PPU (Pick&Place Unit) places two IC chips on the receiving blocks 101 on the left and right sides respectively. The blowing block is supplied with compressed air to blow the chips into the track 102 and convey them to the outlet position of the material tube 504 by air flow. The double tracks 102 are independently controlled, and two paths of IC chips can be processed simultaneously to improve UPH (units per hour production capacity). The air flow pressure is adjustable to avoid chip splashing or jamming.

[0053] In a preferred embodiment of the present invention, the front bin assembly 2 includes two empty tube bins 203, and the two empty tube bins 203 are respectively located on both sides of the base of the front bin assembly 2. The inner side of the empty tube bin 203 is adjacent to the full tube bin 204. Two anti-return supports 201 are installed on the full tube bin 204. The two anti-return supports 201 are symmetric left and right. A lifting cylinder 202 is installed at the bottom of the base of the front bin assembly 2. The rear bin assembly 4 has the same structure as the front bin assembly 2. The empty tube bins 203 are stacked with empty tubes, and the full tube bins 204 are stacked with full tubes. One end of the empty tube is connected to the empty tube bin 203 of the front bin assembly 2, and the other end is connected to the empty tube bin 203 of the rear bin assembly 4. One end of the full tube is connected to the full tube bin 204 of the front bin assembly 2, and the other end is connected to the full tube bin 204 of the rear bin assembly 4. And both ends of the bottom layer full tube are connected to the anti-return supports 201 of the full tube bin 204. In this embodiment, the rear bin assembly 4 and the front bin assembly 2 are symmetrically arranged for the supply of empty tubes and the stacking of full tubes. When the number of IC chips in the tube 504 reaches a set number (such as 25), the lifting cylinder 202 is activated. The lifting cylinder 202 rises to lift the full tube above the height of the support. The lifting cylinder 202 descends, and the full tube falls above the anti-return support 201 to complete single-layer stacking. By repeating the above actions, the full tubes are stacked layer by layer in the full tube bin 204 to achieve automatic storage. The lifting mechanism adopts a double guide post + linear bearing structure to ensure stable lifting, avoid tilting of the tube 504, and the stacking height of the bins is adjustable to adapt to the storage requirements of different specifications of tubes 504.

[0054] In a preferred embodiment of the present invention, the clamping and pushing assembly 3 includes two jaws 305, and the two jaws 305 are symmetric left and right. A clamping cylinder 301 is installed below the jaws 305. A lifting cylinder 302 is installed below the clamping cylinder 301. The lifting cylinder 302 is installed on the cylinder mounting seat 304. The cylinder mounting seat 304 is connected to the feeding cylinder 303. The jaws 305 clamp the tube 504. In this embodiment, the clamping and feeding assembly is used to accurately adjust the position of the tube 504 to ensure that the IC chips smoothly enter the tube 504. The clamping cylinder 301 opens, and the lifting cylinder 302 rises to place the tube 504 in the middle of the clamping mechanism. The clamping cylinder 301 closes to clamp the tube 504. The feeding cylinder 303 moves forward to accurately send the head of the tube 504 to the outlet position of the track 102 to ensure that the IC chips smoothly enter the tube 504. When the tube 504 is filled with IC chips, the feeding cylinder 303 retracts, and the clamping cylinder 301 releases. The full tube enters the stacking process. A servo motor + precision guide rail or a high-precision cylinder is used to ensure the positioning accuracy of the tube 504 (±0.1 mm). The jaws 305 are made of a flexible material (such as silicone or polyurethane) to avoid scratching the tube 504.

[0055] In a preferred embodiment of the present invention, the horizontal pushing assembly 5 includes two mounting plates 503, the two mounting plates 503 are symmetric left and right, a horizontal pushing cylinder 501 is installed above the mounting plate 503, a material pipe pushing plate 502 is installed above the horizontal pushing cylinder 501, a card slot is formed in the material pipe pushing plate 502, and a material pipe 504 is placed inside the card slot. In this embodiment, the horizontal pushing assembly 5 is used to push the empty material pipe from the material bin to the collection position. The empty material pipes are pre-stored horizontally in the empty material pipe bin 203 and the full material pipe bin 204, and the bottom is limited by the anti-return support 201. The cylinder of the horizontal pushing assembly 5 acts to horizontally push the empty material pipe from the material bin to the collection position of the full material pipe bin. The horizontal pushing cylinder 501 adopts a high-precision guiding mechanism to ensure the smooth pushing of the material pipe 504 and avoid deviation. The front and rear end material bins act synchronously to ensure the feeding consistency of the double tracks 102.

[0056] Embodiment 1:

[0057] As Figure 2 shown, the front-end track assembly 1 is composed of two tracks 102 on the left and right sides. The receiving blocks 101 on the left and right sides can simultaneously place ICs. Two ICs are placed at the receiving blocks 101 through the front-end PPU at the same time. The front-end blowing block blows the ICs into the tracks 102, and the purpose of transporting the ICs is achieved by blowing compressed air inside the tracks.

[0058] As Figure 4 and Figure 5 shown, the empty material pipe bin 203 in the front material bin assembly 2 is a bin for placing empty material pipes. Similarly, the empty material pipe bin 401 in the rear material bin assembly 400 corresponding to the rear end is also a bin for placing empty material pipes and is used to support the tail end part of the material pipe. The full material pipe bin 204 in the front material bin assembly 2 is a bin for placing full material pipes. When a certain number of ICs enter the material pipe, the lifting cylinder 202 at the bottom of the full material pipe bin 204 will lift the material pipe, and the lifting height exceeds the anti-return support 201. When the cylinder drops, the material pipe will be supported by the anti-return support 201, so as to achieve the purpose of stacking the material pipes. The same action is repeated, and the full material pipes will be continuously stored upward in the full material pipe bin 204, so as to achieve the purpose of collecting the full material pipes. Similarly, the function of collecting the material pipes of the rear material bin assembly 400 is the same as that of the front material bin assembly 200, and the actions of the bottom cylinders are synchronized during the operation of the mechanism.

[0059] As Figure 3 shown, the left and right structures in the horizontal pushing assembly 5 are the same. The function of this assembly is to push the material pipes from the empty material pipe bins of the front material bin assembly 2 and the rear material bin assembly 4 to the collection position of the full material pipe bin 204, that is, the position where the ICs can enter the material pipes.

[0060] As Figure 6As shown, the left and right structural principles of the clamping and feeding component 3 are the same. It is used to clamp the feeding tube. The empty tube bins 203 in the front bin component 2 and the rear bin component 4 are pushed by the horizontal pushing component 5 to the full tube bins 204 of the front bin component 2 and the rear bin component 4. At this time, the head position of the tube has not reached the edge of the track outlet. It still needs to go through the clamping and feeding action of the clamping and feeding component 3 to make the head of the tube reach the position of the track outlet in the track component 1, so as to achieve the purpose of the IC smoothly entering the tube. The feeding cylinder 303 can move the cylinder mounting seat 304 back and forth as a whole. The lifting cylinder 302 drives the clamping jaw 305 to move up and down. The clamping cylinder 301 drives the clamping jaw 305 to open. After the lifting cylinder 302 raises the clamping cylinder 301, the clamping cylinder 301 drives the clamping jaw 305 to clamp the tube. The feeding cylinder 303 moves forward, and the whole mechanism holds the tube and moves the tube to the track outlet, thus ensuring the feeding of the tube. When the number of chips in the tube reaches a certain amount, the feeding cylinder 303 moves backward while the clamping jaw 305 holds the full tube, so as to move the collected full tube back to the original position. During normal operation, the actions are repeated, achieving the effects of feeding the tube forward and clamping and retracting the tube.

[0061] Advantages and beneficial effects of the present invention:

[0062] The beneficial effects are as follows:

[0063] UPH improvement: The double-track design enables the production capacity to reach 15,000 - 16,500 pieces per hour (the traditional single track is only 7,000 - 8,500 pieces).

[0064] Reliability optimization: The material jamming rate < 0.1%, and the chip damage rate < 0.05%.

[0065] The misalignment rate of stacked full tubes < 0.01%.

[0066] Compatibility: It can be adapted to different specifications of Tube tubes such as 8mm / 12mm, and the changeover time < 5 minutes.

[0067] The advantages are as follows:

[0068] (1) A significant increase in production efficiency (UPH)

[0069] Parallel processing ability: The dual-track design allows the collection and feeding of two groups of IC chips simultaneously. Compared with the traditional single-track structure, the theoretical processing speed can be increased by nearly 100%, especially suitable for high-volume production scenarios of high-density and small-size chips; Seamless connection operation: Two receiving blocks alternately receive chips, and through timing control, a cycle operation of "receiving - transferring - emptying" is realized, reducing the equipment waiting time and maximizing the equipment utilization rate; Reliability enhancement brought by structural optimization; Anti-interference design: The two tracks operate independently with low mechanical linkage, avoiding the problem of the whole machine shutdown caused by single-track material jamming, and the failure rate is reduced by more than 30%.

[0070] (2) Reliability enhancement brought by structural optimization

[0071] Anti-interference design: The two tracks operate independently with low mechanical linkage, avoiding the problem of the whole machine shutdown caused by single-track material jamming, and the failure rate is reduced by more than 30%; Precise positioning: The receiving block adopts a high-precision guiding mechanism (such as a V-groove) to ensure that the chips have no offset or flipping during high-speed transmission, and the qualified product rate is increased to more than 99.5%.

[0072] (3) Cost and maintenance advantages

[0073] Modular design: The receiving block and the track can be quickly disassembled and replaced, the maintenance time is shortened by 50%, and at the same time, the spare parts inventory cost is reduced; Strong compatibility: By adjusting the distance between the receiving blocks or the width of the track, different specifications of Tube tubes (such as 8mm / 12mm) can be adapted, reducing the equipment modification cost.

[0074] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A double-track blanking mechanism for a high-throughput IC chip Tube sorter, characterized in that: It includes an orbit component (1), a front bin component (2), a clamping and pushing component (3), a rear bin component (4) and a horizontal pushing component (5); The front bin component (2) is installed at the end of the orbit component (1), the clamping and pushing component (3) is installed below the front bin component (2), the rear bin component (4) is installed directly behind the front bin component (2), and the horizontal pushing component (5) is installed between them; The orbit component (1) includes two orbits (102), the two orbits (102) are symmetric left and right, a material receiving block (101) is installed at the front end of the orbit (102), a blowing block is installed at the front end of the material receiving block (101), an inlet fiber optic detection component (104) is installed at the inlet of the orbit (102), an outlet fiber optic detection component (105) is installed at the outlet of the orbit (102), and a counting fiber optic component (103) is installed outside the orbit (102); The front bin component (2) includes two empty pipe bins (203), the two empty pipe bins (203) are respectively located on both sides of the base of the front bin component (2), the inner side of the empty pipe bin (203) is adjacent to the full pipe bin (204), two anti - return support members (201) are installed on the full pipe bin (204), the two anti - return support members (201) are symmetric left and right, and a lifting cylinder (202) is installed at the bottom of the base of the front bin component (2).

2. The dual-track blanking mechanism of a high-throughput IC chip Tube sorter according to claim 1, characterized in that: The clamping and pushing component (3) includes two clamping claws (305), the two clamping claws (305) are symmetric left and right, a clamping cylinder (301) is installed below the clamping claw (305), a lifting cylinder (302) is installed below the clamping cylinder (301), the lifting cylinder (302) is installed on a cylinder mounting seat (304), and the cylinder mounting seat (304) is connected to a feeding cylinder (303).

3. The dual-track blanking mechanism of a high-throughput IC chip Tube sorter according to claim 1, wherein: The horizontal pushing component (5) includes two mounting plates (503), the two mounting plates (503) are symmetric left and right, a horizontal pushing cylinder (501) is installed above the mounting plate (503), a pipe pushing plate (502) is installed above the horizontal pushing cylinder (501), a card slot is provided on the pipe pushing plate (502), and a pipe (504) is placed inside the card slot.

4. The dual-track blanking mechanism of a high-throughput IC chip Tube sorter according to claim 1, characterized in that: The rear bin component (4) has the same structure as the front bin component (2).

5. The dual-track blanking mechanism of a high-throughput IC chip Tube sorter according to claim 1, characterized in that: The empty pipe bins (203) stack and place empty pipes, and the full pipe bins (204) stack and place full pipes.

6. The dual-track blanking mechanism of a high-throughput IC chip Tube sorter according to claim 5, characterized in that: One end of the empty pipe is connected to the empty pipe bin (203) of the front bin component (2), and the other end is connected to the empty pipe bin (203) of the rear bin component (4). One end of the full pipe is connected to the full pipe bin (204) of the front bin component (2), and the other end is connected to the full pipe bin (204) of the rear bin component (4). And both ends of the bottom - layer full pipe are connected to the anti - return support members (201) of the full pipe bin (204).

7. The dual-track blanking mechanism of a high-throughput IC chip Tube sorter according to claim 3, characterized in that: The inlet position of the pipe (504) is directly opposite to the outlet position of the orbit (102).

8. The dual-track blanking mechanism of a high-throughput IC chip Tube sorter according to claim 2 or 3, characterized in that: The clamping claw (305) clamps the pipe (504).

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