Preparation method of ultra-fine grain high-purity copper target material based on ripple rolling

Abstract

The embodiment of the invention discloses an ultra-fine grain high-purity copper target material preparation method based on corrugation rolling, which comprises the following steps: a corrugation roller rolling step: a high-purity copper ingot is subjected to primary hot rolling under a corrugation roller, the surface of the corrugation roller is provided with a plurality of corrugations which are continuously arranged along the axial direction of the corrugation roller, the corrugation depth is 0.1-5mm, and the corrugation width is 2-10mm; the first hot rolling temperature is 100-400 DEG C, the pass deformation amount is 10-30%, and the ripple rolling thinning amount is 40-70%; in the flat roll rolling step, the high-purity copper obtained in the corrugated roll rolling step is subjected to second hot rolling under a flat roll, the second hot rolling temperature ranges from 300 DEG C to 800 DEG C, the pass deformation ranges from 10% to 30%, and the total thinning amount ranges from 60% to 98%; the high-purity copper obtained in the flat roll rolling step is subjected to quenching treatment, the quenching temperature ranges from 100 DEG C to 800 DEG C, and the quenching heat preservation time ranges from 2 min to 60 min; and finally, carrying out post-treatment to obtain the ultra-fine grain high-purity copper target material. The grain size of the copper target material is smaller than 10 microns, and the texture pole density is smaller than 3.

Description

Technical Field

[0001] The present invention belongs to the technical field of magnetron sputtering target preparation, and particularly relates to a method for preparing an ultrafine-grained high-purity copper target based on corrugated rolling. Background Art

[0002] High-purity copper has good electromigration resistance and electrical conductivity. Especially for high-purity copper with a purity above 6N, its performance is more excellent. High-purity copper targets are commonly used as the base materials for interconnections of devices such as semiconductor chips and flat displays.

[0003] CN116240474A discloses a method for preparing a high-purity copper target. After unidirectional drawing and cross-rolling of high-purity copper, heat treatment is carried out to obtain a high-purity copper target with an average grain size greater than 70μm. The grain size of the high-purity copper target obtained by this invention is relatively large. CN103510055A discloses a method for preparing a high-purity copper target, which specifically includes: preheating treatment of a high-purity copper ingot followed by forging, then annealing heat treatment and rolling are carried out, after forming a copper sheet material, annealing heat treatment is carried out again, and finally the copper target blank is machined to obtain a high-purity copper target. Using this method, a high-purity copper target with a grain size less than 100μm and a better sputtering direction can be produced. CN101509125A discloses a method for preparing a copper sputtering target. The copper raw material is melted at 1100 - 1200°C under a protective atmosphere. After refining for 10 - 40 minutes, the molten copper liquid is dropped onto a cold plate to form copper grains, and then the copper grains are hot-pressed into a copper sputtering target; this method has a complex process and a high cost. CN110578126A discloses a method for preparing a multi-specification high-purity copper target, including the following steps: preheating, hot rolling, machining, etc.; the grain size of the high-purity copper target prepared by this method is relatively large, and the average grain size is not greater than 80μm. CN113817995A discloses a high-purity copper target and a method for preparing the same. The copper ingot is successively subjected to forging elongation, first heat treatment, rolling, and second heat treatment. The method for preparing the copper target provided by this invention can meet the requirements of the semiconductor and other industries for copper targets, but the grain size is not less than 50μm and cannot meet the requirements of high-process interconnections. Summary of the Invention

[0004] In view of this, the technical solutions disclosed in some embodiments are a method for preparing an ultrafine-grained high-purity copper target based on corrugated rolling, including:

[0005] S1. Corrugated roll rolling step

[0006] The high-purity copper ingot is subjected to the first hot rolling under a corrugated roll. Among them, the corrugated roll surface has a plurality of corrugations continuously arranged along its axial direction. The corrugation depth is 0.1 - 5mm, and the corrugation width is 2 - 10mm; the first hot rolling temperature is 100 - 400°C, the pass deformation amount is 10 - 30%, and the corrugated rolling thickness reduction is 40 - 70%;

[0007] S2. Flat-roll rolling step

[0008] The high-purity copper obtained from the corrugated-roll rolling step is subjected to a second hot rolling under a flat roll. Among them, the second hot rolling temperature is 300-800 °C, the pass reduction is 10-30%, and the total thickness reduction is 60-98%.

[0009] S3. Quenching treatment step

[0010] The high-purity copper obtained from the flat-roll rolling step is subjected to a quenching treatment. The quenching temperature is 100-800 °C, and the quenching holding time is 2-60 min; finally, post-treatment is carried out to obtain an ultrafine-grained high-purity copper target; the grain size of the copper target is less than 10 μm, and the texture pole density is less than 3.

[0011] Furthermore, for the preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, the shape of the corrugations includes trapezoid, triangle, and arc.

[0012] For the preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, the rolling mode of corrugated-roll rolling is unidirectional rolling or axial rolling. The corrugated-roll rolling is carried out multiple times, and the rotation angle of the rolling direction each time is 0-90°.

[0013] For the preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, in the corrugated-roll rolling step, the rotation angle of the rolling direction each time is 30°, 60°, or 90°.

[0014] For the preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, the rolling mode of flat-roll rolling is unidirectional rolling or axial rolling. The flat-roll rolling is carried out multiple times, and the rotation angle of the rolling direction each time is 0-90°.

[0015] For the preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, in the flat-roll rolling step, the rotation angle of the rolling direction each time is 30°, 60°, or 90°.

[0016] For the preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, the quenching treatment method is water quenching or oil quenching; the quenching is carried out in an inert gas atmosphere.

[0017] For the preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, in the corrugated-roll rolling step, the thickness of the high-purity copper ingot sheet is less than 2 mm more than the maximum distance between the corrugated rolls.

[0018] For the preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, the purity of the high-purity copper ingot is 99.99-99.99999%.

[0019] The preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in some embodiments, in step S1, the corrugation depth is 2-3 mm, and the corrugation width is 2-5 mm; the first hot rolling temperature is 100-200 °C, the pass deformation is 10-20%, and the corrugated rolling thickness reduction is 40-65%; in step S2, the second hot rolling temperature is 300-500 °C, the pass deformation is 20-30%, and the total thickness reduction is 85-95%.

[0020] The preparation method of an ultrafine-grained high-purity copper target based on corrugated rolling disclosed in the embodiments of the present invention. By controlling the corrugated rolling, plane rolling conditions and quenching conditions, high-purity copper can be used to prepare a high-purity copper target with small grain size and low texture pole density. The high-purity copper target with strong texture disclosed in the embodiments of the present invention has a high magnetron sputtering film formation rate, good film layer quality and uniform thickness distribution. The preparation method of the high-purity copper target with strong texture disclosed in the embodiments of the present invention can solve the problem that ultrafine-grained high-purity copper targets cannot be prepared by polycrystalline copper rolling, is simple to operate, has a short process, and is easy to realize industrial production. Description of the Drawings

[0021] Figure 1 The flowchart of the preparation method disclosed in some embodiments;

[0022] Figure 2 Schematic diagram of the shape of the rolling roll disclosed in some embodiments;

[0023] Figure 3 The grain size distribution diagram and {100} pole figure of the copper target disclosed in Example 1;

[0024] Figure 4 The grain size distribution diagram and {100} pole figure of the copper target disclosed in Example 2;

[0025] Figure 5 The grain size distribution diagram and {100} pole figure of the copper target disclosed in Example 3;

[0026] Figure 6 The grain size distribution diagram and {100} pole figure of the copper target disclosed in Comparative Example 1. Detailed Description of the Invention

[0027] The special term "embodiment" here. Any embodiment described as "exemplary" does not have to be construed as superior to or better than other embodiments. For the performance index tests in the embodiments of the present invention, unless otherwise specified, conventional test methods in the art are used. It should be understood that the terms described in the embodiments of the present invention are only for describing specific embodiments and are not used to limit the content disclosed in the embodiments of the present invention.

[0028] Unless otherwise specified, the technical and scientific terms used herein have the same meanings as commonly understood by those of ordinary skill in the technical field to which the embodiments of the present invention pertain; other test methods and technical means not specifically noted in the embodiments of the present invention refer to the test methods and technical means commonly adopted by those of ordinary skill in the art.

[0029] The terms "substantially" and "about" as used herein are used to describe minor fluctuations. For example, they can refer to less than or equal to ±5%, such as less than or equal to ±2%, such as less than or equal to ±1%, such as less than or equal to ±0.5%, such as less than or equal to ±0.2%, such as less than or equal to ±0.1%, such as less than or equal to ±0.05%. Numerical data presented or represented herein in a range format is used only for convenience and brevity and should therefore be flexibly interpreted to include not only the values explicitly recited as the bounds of the range, but also all individual values or sub-ranges subsumed within that range. For example, the numerical range of "1 to 5%" should be interpreted to include not only the explicitly recited values of 1% to 5%, but also the individual values and sub-ranges within the indicated range. Thus, within this numerical range are included individual values such as 2%, 3.5%, and 4%, and sub-ranges such as 1% to 3%, 2% to 4%, and 3% to 5%, etc. This principle also applies to ranges that list only one numerical value. In addition, such an interpretation applies regardless of the width of the range or the characteristics described.

[0030] In this document, including in the claims, conjunctions such as "comprising", "including", "carrying", "having", "containing", "involving", "accommodating", etc. are understood to be open-ended, that is, meaning "including but not limited to". Only the conjunctions "consisting of" and "composed of" are closed conjunctions.

[0031] For a better illustration of the content of the present invention, numerous specific details are given in the following specific embodiments. Those skilled in the art should understand that the present invention can also be implemented without some of these specific details. In the embodiments, some methods, means, instruments, devices, etc. well-known to those skilled in the art are not described in detail so as to highlight the gist of the present invention.

[0032] On the premise of no conflict, the technical features disclosed in the embodiments of the present invention can be arbitrarily combined, and the obtained technical solutions belong to the content disclosed in the embodiments of the present invention.

[0033] In some embodiments, as Figure 1 shown, the method for preparing an ultrafine-grained high-purity copper target based on ripple rolling includes:

[0034] S1. Corrugated roll rolling step, specifically including: performing the first hot rolling of the high-purity copper ingot under a corrugated roll. Among them, the corrugated roll surface has a plurality of corrugations continuously arranged along its axial direction, the corrugation depth is 0.1 - 5 mm, and the corrugation width is 2 - 10 mm; the first hot rolling temperature is 100 - 400 °C, the pass deformation is 10 - 30%, and the corrugated rolling thickness reduction is 40 - 70%;

[0035] In some embodiments, the purity of the high-purity copper ingot is 99.99 - 99.99999%;

[0036] In some embodiments, the shape of the corrugations provided on the corrugated roll surface is trapezoidal, triangular or arc-shaped; as Figure 2 shown, the first-round hot rolling is the corrugated roll rolling step, and the opposing rolls used are corrugated rolls. The corrugations on the surface of the corrugated roll are triangular, semi-circular or trapezoidal; generally, in the rolling process, opposing rolls are used. Two rolls with the same corrugations form a corrugated opposing roll, and the corrugations of the corrugated opposing roll correspond to each other. There is a first distance between the corresponding corrugation tops, and a second distance between the corresponding corrugation bottoms; generally, during the corrugated roll rolling process, both the first distance and the second distance need to maintain an appropriate distance to ensure that the high-purity copper ingot will not have an excessive deformation during the corrugated roll rolling process, resulting in its cracking; generally, the thickness of the high-purity copper ingot sheet is more than 2 mm less than the second distance between the corrugated rolls.

[0037] In some embodiments, the rolling method of the corrugated roll rolling is unidirectional rolling or axial rolling. The first hot rolling in the corrugated roll rolling step is performed multiple times, and the rotation angle of the rolling direction each time is 0 - 90°;

[0038] In some embodiments, the relatively preferred rotation angles of the rolling direction of the corrugated roll rolling are 30°, 60° or 90°;

[0039] In some embodiments, in the corrugated roll rolling step, the thickness of the high-purity copper ingot sheet is more than 2 mm less than the maximum distance between the corrugated rolls;

[0040] In some relatively preferred embodiments, in step S1, the corrugation depth is 2 - 3 mm, and the corrugation width is 2 - 5 mm; the pass deformation is 10 - 15%, and the corrugated rolling thickness reduction is 40 - 65%; generally, the corrugation depth is the distance between the corrugation top and the corrugation bottom, and the corrugation width is the widest distance between the two sides of the corrugation;

[0041] S2. Flat-roll rolling step, specifically including: hot-rolling the high-purity copper obtained in the corrugated-roll rolling step under a flat roll. Among them, the second hot-rolling temperature is 300 - 800 °C, the pass deformation is 10 - 30%, and the total reduction is 60 - 98%; Generally, the total reduction refers to the total reduction of the high-purity copper ingot after corrugated-roll rolling and flat-roll rolling; Generally, a flat roll means that the surface of the rolling roll is smooth. During the flat-roll rolling process, the high-purity copper ingot obtained in the corrugated-roll rolling step is flattened, such as Figure 2 as shown, the final hot-rolling is the flat-roll rolling step, with the opposing rolls being flat rolls. The hot-rolling process can further flatten the high-purity copper ingot plate obtained by corrugated rolling;

[0042] In some embodiments, the rolling method of flat-roll rolling is unidirectional rolling or axial rolling. The second hot-rolling in the flat-roll rolling step is performed multiple times, and the rotation angle of the rolling direction each time is 0 - 90°;

[0043] In some embodiments, the more preferred rotation angles of the rolling direction in flat-roll rolling are 30°, 60° or 90°;

[0044] In some more preferred embodiments, in step S2, the second hot-rolling temperature is 300 - 500 °C, the pass deformation is 20 - 30%, and the total reduction is 85 - 95%;

[0045] S3. Quenching treatment step, specifically including: quenching the high-purity copper obtained in the flat-roll rolling step. The quenching temperature is 100 - 800 °C, and the quenching holding time is 2 - 60 min; Finally, post-treatment is carried out to obtain an ultrafine-grained high-purity copper target; The grain size of the copper target is less than 10 μm, and the texture pole density is less than 3;

[0046] Generally, the quenching treatment can make the grains of the prepared high-purity copper target fully recrystallize. The high-purity copper target with a small grain size has a large grain boundary area and a fast sputtering rate;

[0047] Generally, the post-treatment includes processes such as cutting and polishing of the copper target; The polishing treatment includes mechanical polishing;

[0048] In some embodiments, the quenching treatment method is water quenching or oil quenching; The quenching is carried out in an inert atmosphere;

[0049] In some more preferred embodiments, the quenching method is water quenching, the quenching temperature is 100 - 300 °C, the quenching holding time is 2 - 30 min, and the quenching atmosphere is argon.

[0050] Generally, after hot rolling the high-purity copper ingot through two steps of corrugated roll rolling and flat roll rolling, its original grains will be fully broken, and finally, a high-purity copper target with fine grains can be prepared. During the corrugated rolling process, the grains of the high-purity copper ingot are broken more thoroughly by increasing local stress, which is conducive to promoting finer grains in the high-purity copper target. After hot rolling, the high-purity single-crystal copper block is quenched and then polished to obtain an ultrafine-grained high-purity copper target.

[0051] Use AztecCrystal software to calculate and characterize the average grain size and texture pole density. The average grain size is statistically calculated using the equivalent circle diameter calculation method, and the statistical method is the area-weighted method. The texture pole density is statistically the pole density of the {100} plane. The smaller the grain size, the larger the grain boundary area. During the sputtering process, the grain boundaries are more likely to be bombarded by ions, resulting in an increase in the sputtering rate. The film of the fine-grained sputtering target is denser. The ultrafine-grained target has a higher hardness and stronger resistance to sputtering erosion, which can extend the target life. A low texture pole density helps to improve the film thickness uniformity.

[0052] The following further exemplarily illustrates the technical details in combination with embodiments.

[0053] Embodiment 1

[0054] The preparation method of the ultrafine-grained high-purity copper target based on corrugated rolling disclosed in Embodiment 1 includes:

[0055] Corrugated roll rolling: The size of the high-purity copper ingot is 30mm×30mm×50mm. Corrugated roll rolling is carried out on the 30mm×50mm plane, with a deformation amount of 15% per pass, a hot rolling temperature of 200°C, a rolling method of circumferential rolling, a rotation angle of 90° each time of rolling, a trapezoidal corrugation shape, a depth of 2mm for each corrugation, a length of 5mm for each corrugation, and the thickness of the high-purity copper ingot plate is less than the maximum spacing of 3mm of the corrugated roll during each rolling process. The reduction amount in the first round of corrugated roll rolling is 50%.

[0056] Flat roll rolling: The reduction amount of hot rolling per pass is 15%, the hot rolling temperature is 400°C, the rolling method is unidirectional rolling, the roll is a flat roll, and after the last round of rolling, the total reduction amount of the high-purity copper target blank reaches 85%.

[0057] Quenching: After rolling, the rolled plate is quenched at a temperature of 150°C for 30 minutes, the cooling method is water cooling, the quenching atmosphere is argon, and after quenching, the high-purity copper target blank is cut and polished, and the polishing method is mechanical polishing. Finally, an ultrafine-grained high-purity copper target is formed, with an average grain size of 8.29μm and a pole density of 2.19, as Figure 3 shown.

[0058] Embodiment 2

[0059] The preparation method of the ultrafine-grained high-purity copper target based on corrugated rolling disclosed in Example 2 includes:

[0060] Corrugated roll rolling: The size of the high-purity copper ingot is 40mm×40mm×50mm; corrugated roll rolling is carried out on the 40mm×50mm plane, the deformation amount per pass is 15%, the hot rolling temperature is 300°C, the rolling method is circumferential rolling, the rotation angle per rolling is 90°, the corrugation shape is trapezoidal, the depth of each corrugation is 2mm, the corrugation length is 5mm, and the thickness of the high-purity copper ingot plate is less than the maximum spacing of the corrugated roll, which is 3mm, during each rolling process; the thickness reduction in the first round of corrugated rolling is 40%;

[0061] Flat roll rolling: The hot rolling thickness reduction per pass is 20%, the hot rolling temperature is 600°C, the rolling method is unidirectional rolling, the roll is a flat roll, and the total thickness reduction of the high-purity copper target blank reaches 95% after the last round of rolling;

[0062] Quenching: After rolling, the rolled plate is quenched at a temperature of 250°C for 10 min, the cooling method is water cooling, the quenching atmosphere is argon, and after quenching, the high-purity copper target blank is cut and polished, and the polishing method is mechanical polishing, and finally an ultrafine-grained high-purity copper target is formed, with an average grain size of 9.26μm and a true density of 2.31, as Figure 4 shown.

[0063] Example 3

[0064] The preparation method of the ultrafine-grained high-purity copper target based on corrugated rolling disclosed in Example 3 includes:

[0065] Corrugated roll rolling: The size of the high-purity copper ingot is 40mm×30mm×50mm; corrugated roll rolling is carried out on the 40mm×50mm plane, the deformation amount per pass is 10%, the hot rolling temperature is 100°C, the rolling method is circumferential rolling, the rotation angle per rolling is 90°, the corrugation shape is semi-circular, the depth of each corrugation is 4mm, the corrugation width is 5mm, and the thickness of the high-purity copper ingot plate is less than the maximum spacing of the corrugated roll, which is 3mm, during each rolling process; the thickness reduction in the first round of corrugated rolling is 60%;

[0066] Flat roll rolling: The hot rolling thickness reduction per pass is 20%, the hot rolling temperature is 400°C, the rolling method is unidirectional rolling, the roll is a flat roll, and the total thickness reduction of the high-purity copper target blank reaches 95% after the last round of rolling;

[0067] Quenching: After rolling, the rolled plate is quenched at a temperature of 200°C for 20 min, the cooling method is water cooling, the quenching atmosphere is argon, and after quenching, the high-purity copper target blank is cut and polished, and the polishing method is mechanical polishing, and finally an ultrafine-grained high-purity copper target is formed, with an average grain size of 10.12μm and a true density of 2.17, as Figure 5 shown.

[0068] The ultrafine-grained high-purity copper target materials prepared in the above Examples 1 to 3 were tested. The grain size was observed through a metallographic microscope, and the {100} pole figure was plotted by EBSD. The test results are shown in Table 1.

[0069] Table 1 Test results of the ultrafine-grained high-purity copper target materials prepared in Examples 1 to 3

[0070]

[0071] As can be seen from Table 1, the grain size of the high-purity copper target material prepared by the embodiment of the present invention is less than 10 μm, and the texture pole density is less than 3.

[0072] Comparative Example 1

[0073] The preparation method of the high-purity copper target material disclosed in Comparative Example 1 includes:

[0074] The size of the high-purity copper ingot is 30 mm × 30 mm × 50 mm. Rolling is carried out on the 30 mm × 50 mm plane. The deformation per pass is 15%, the hot rolling temperature is 200 °C, the rolling method is circumferential rolling, the roll is a flat roll, the rotation angle per rolling is 90°, the thickness of the sheet is less than the maximum distance between the rolls by 3 mm each time, and the reduction in the first round of rolling is 50%;

[0075] The reduction per pass of hot rolling is 15%, the hot rolling temperature is 400 °C, the rolling method is unidirectional rolling, the roll is a flat roll, and after the last round of rolling, the total reduction of the high-purity copper target blank reaches 85%;

[0076] After rolling is completed, the rolled plate is quenched at a temperature of 150 °C for 30 min. The cooling method is water cooling, the quenching atmosphere is argon, and after annealing and quenching, the high-purity copper target blank is cut and polished. The polishing method is mechanical polishing. The finally formed high-purity copper target material has an average grain size of 16.87 μm and a pole density of 7.10, as Figure 6 shown.

[0077] The preparation method of the ultrafine-grained high-purity copper target material based on corrugated rolling disclosed in the embodiment of the present invention obtains a high-purity copper target material with a small grain size and a low texture pole density by controlling corrugated rolling, flat rolling and quenching treatment. The high-purity copper target material with strong texture disclosed in the embodiment of the present invention has a high magnetron sputtering film formation rate, good film layer quality and uniform thickness distribution. It can solve the problem that polycrystalline copper rolling cannot prepare ultrafine-grained high-purity copper target materials. The operation is simple, the process is short, and it is easy to realize industrial production.

[0078] The technical solutions disclosed in the embodiments of the present invention and the technical details disclosed in the embodiments are only illustrative of the inventive concept of the present invention and do not constitute a limitation on the technical solutions of the embodiments of the present invention. Any conventional changes, substitutions or combinations made to the technical details disclosed in the embodiments of the present invention have the same inventive concept as the present invention and are within the protection scope of the claims of the present invention.

Claims

1. A method for preparing an ultrafine-grained high-purity copper target based on ripple rolling, characterized in that, Including: S1. Corrugated roll rolling step The high-purity copper ingot is subjected to the first hot rolling under the corrugated roll. Among them, the surface of the corrugated roll has a plurality of corrugations continuously arranged along its axial direction, the corrugation depth is 0.1-5 mm, and the corrugation width is 2-10 mm; the first hot rolling temperature is 100-400 °C, the pass deformation is 10-30%, and the corrugated rolling thickness reduction is 40-70%; S2. Flat roll rolling step The high-purity copper obtained in the corrugated roll rolling step is subjected to the second hot rolling under the flat roll. Among them, the second hot rolling temperature is 300-800 °C, the pass deformation is 10-30%, and the total thickness reduction is 60-98%; S3. Quenching treatment step The high-purity copper obtained in the flat roll rolling step is subjected to quenching treatment. The quenching temperature is 100-800 °C, and the quenching holding time is 2-60 min; finally, post-treatment is carried out to obtain an ultrafine-grained high-purity copper target; the grain size of the copper target is less than 10 μm, and the texture pole density is less than 3.

2. The method for preparing an ultrafine-grained high-purity copper target based on ripple rolling according to claim 1, wherein The shape of the corrugation includes trapezoid, triangle, and arc.

3. The preparation method of the ultrafine-grained high-purity copper target based on ripple rolling according to claim 1, wherein The rolling method of the corrugated roll rolling is unidirectional rolling or axial rolling. The corrugated roll rolling is carried out multiple times, and the rotation angle of the rolling direction each time is 0-90°.

4. The method for preparing an ultrafine-grained high-purity copper target based on corrugated rolling according to claim 1, wherein In the corrugated roll rolling step, the rotation angle of the rolling direction each time is 30°, 60°, or 90°.

5. The method for preparing an ultrafine-grained high-purity copper target based on corrugated rolling according to claim 1, wherein The rolling method of the flat roll rolling is unidirectional rolling or axial rolling. The flat roll rolling is carried out multiple times, and the rotation angle of the rolling direction each time is 0-90°.

6. The method for preparing an ultrafine-grained high-purity copper target based on ripple rolling according to claim 5, characterized in that, In the flat roll rolling step, the rotation angle of the rolling direction each time is 30°, 60°, or 90°.

7. The method for preparing an ultrafine-grained high-purity copper target based on corrugated rolling according to claim 1, wherein, The quenching treatment method is water quenching or oil quenching; the quenching is carried out in an inert gas atmosphere.

8. The method for preparing an ultrafine-grained high-purity copper target based on ripple rolling according to claim 1, characterized in that, In the corrugated roll rolling step, the thickness of the high-purity copper ingot sheet is more than 2 mm less than the maximum distance between the corrugated rolls.

9. The method for preparing an ultrafine-grained high-purity copper target based on ripple rolling according to claim 1, characterized in that, The purity of the high-purity copper ingot is 99.99-99.99999%.

10. The method for preparing an ultrafine-grained high-purity copper target based on corrugated rolling according to claim 1, wherein, In step S1, the corrugation depth is 2-3 mm, and the corrugation width is 2-5 mm; the first hot rolling temperature is 100-200 °C, the pass deformation is 10-20%, and the corrugated rolling thickness reduction is 40-65%; in step S2, the second hot rolling temperature is 300-500 °C, the pass deformation is 20-30%, and the total thickness reduction is 85-95%.

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