Grinding wheel bearing table tool setting device, tool setting method of grinding wheel bearing table tool setting device and grinding equipment

Abstract

The invention discloses a grinding wheel bearing table tool setting device, a tool setting method of the grinding wheel bearing table tool setting device and grinding equipment.The grinding wheel bearing table tool setting device comprises a support, a tool setting assembly is arranged on the support and comprises a fixing frame, and an elastic lifting assembly is arranged on the fixing frame; the elastic lifting assembly comprises a lifting block capable of moving up and down relative to the fixing frame, and the lifting block is provided with a self-leveling platform and a contact detection sensor which are distributed up and down. The axis of a carrying table, making contact with the bottom of the grinding wheel, of the self-leveling platform and the axis of a probe, making contact with the wafer bearing table, of the contact detection sensor extend in the vertical direction. The tool setting device for the grinding wheel wafer bearing table is of a pure mechanical structure, a complex circuit is not needed, additional operation does not need to be conducted on the grinding wheel, tool setting can be achieved only through one sensor, a complex driving device is not needed, and when detection is not needed, structural protection can be conveniently conducted.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, in particular to a tool setting device for a grinding wheel carrier, a tool setting method thereof, and a grinding device. Background Art

[0002] When thinning semiconductor devices such as wafers by a thinning machine, grinding is performed based on the tabletop of the carrier. Therefore, it is necessary to know the distance that the grinding wheel on the spindle needs to move down from the origin height when the grinding wheel just touches the tabletop of the carrier. Such a process is called tool setting.

[0003] The patent document with the authorization announcement number CN117862965B discloses a tool setting method. In this method, the tool setting block and the grinding wheel are made to have electrical conductivity, and a special contact detection circuit is set up to achieve detection. This detection method requires sticking conductive materials around the grinding wheel before detection and manually removing the conductive materials after detection, which increases the complexity of the operation and also makes it impossible to directly perform processing after tool setting.

[0004] The patent document with the authorization announcement number CN106737195B discloses a grinding wheel position calibration system and method. In this system, a driving device including structures such as a motor and a lead screw is required to drive the measurement sensor to move up and down. And multiple photoelectric sensors need to be set to determine the zero point. This solution requires electrical components such as a motor and multiple sensors, resulting in higher equipment costs and operating costs, and greatly increasing the difficulty of equipment protection. Summary of the Invention

[0005] The purpose of the present invention is to solve the above problems existing in the prior art, and provide a tool setting device for a grinding wheel carrier, a tool setting method thereof, and a grinding device.

[0006] The purpose of the present invention is achieved by the following technical solutions: A tool setting device for a grinding wheel carrier includes a bracket, on which a tool setting assembly is provided. The tool setting assembly includes a fixing frame, on which an elastic lifting assembly is provided. The elastic lifting assembly includes a lifting block that can move up and down relative to the fixing frame. An auto-leveling platform and a contact detection sensor are arranged on the lifting block in an up-and-down distribution. The axis of the carrier of the auto-leveling platform that contacts the bottom of the grinding wheel and the axis of the probe of the contact detection sensor that contacts the carrier extend along the vertical direction. When the carrier receives the downward pressure of the grinding wheel, the lifting block moves down relative to the fixing frame. When the grinding wheel releases the downward pressure applied to the carrier, the lifting block moves up and resets.

[0007] Preferably, in the tool setting device for a grinding wheel carrier, the bracket is arranged on a moving mechanism that drives it to move horizontally.

[0008] Preferably, in the tool setting device for the wheel carrier table, the moving mechanism drives the movement between the standby position and the detection position. When in the standby position, the tool setting assembly is located within a protective cover outside the carrier table.

[0009] Preferably, in the tool setting device for the wheel carrier table, the lifting block is connected to the support block of the fixed frame through at least one elastic piece. A horizontal guiding plate is provided on the side of the support block facing the lifting block. The end of the guiding plate is embedded at the guiding groove inside the lifting block, and the guiding plate is connected to the connecting pin inside the lifting block through an elastic connecting piece.

[0010] Preferably, in the tool setting device for the wheel carrier table, the elastic piece is clamped between two clamping plates, and the two clamping plates are located between the lifting block and the support block.

[0011] Preferably, in the tool setting device for the wheel carrier table, a convex platform is formed at one end of the guiding plate facing the lifting block, and the convex platform is embedded at the guiding groove. When the carrier of the self-leveling platform is not subjected to a downward pressure, the elastic connecting piece keeps the clamping plate in an inclined state, and the side of the clamping plate close to the lifting block is higher than the opposite side thereof.

[0012] Preferably, in the tool setting device for the wheel carrier table, the self-leveling platform includes a base, a carrier is provided on the base, and the carrier abuts against three supporting parts that keep it in a horizontal state through an elastic member that applies a downward pulling force to it.

[0013] Preferably, in the tool setting device for the wheel carrier table, the three supporting parts are three supporting balls. One supporting ball is embedded at the conical groove or spherical groove at the bottom of the carrier, another supporting ball is embedded at the strip groove at the bottom of the carrier and extending along the radial direction of the carrier; the last supporting ball abuts against the bottom surface of the carrier.

[0014] A grinding device includes the tool setting device for the wheel carrier table as described in any one of the above.

[0015] The tool setting method for the tool setting device for the wheel carrier table as described in any one of the above includes the following steps: Position the tool setting device for the wheel carrier table at the tool setting position. When at the tool setting position, the probe gap of the tool setting device for the wheel carrier table is above the carrier table, and the carrier is below the grinding wheel; Drive the grinding wheel to move downward and obtain the signal of the contact detection sensor in real time; When it is determined according to the signal of the contact detection sensor that the contact detection sensor contacts the top surface of the carrier table, determine the downward movement height corresponding to the current position of the grinding wheel moving downward from the origin height; According to the downward movement height and the distance between the top surface of the carrier table and the lower end of the probe of the contact detection sensor, determine the distance that the grinding wheel needs to move downward from the origin height when the grinding wheel starts to contact the wafer stage.

[0016] The advantages of the technical solution of the present invention are mainly reflected in: The tool setting device for the grinding wheel and wafer stage of the present invention has a pure mechanical structure, does not require a complex circuit, nor does it require additional operations on the grinding wheel. It can achieve tool setting only through one sensor, and does not require a complex driving device. When detection is not required, the structure can be conveniently protected.

[0017] The moving mechanism of the present invention uses a rotary cylinder, which has lower protection requirements for electrical components and is easier to protect. This structure can conveniently avoid interference with normal work by the tool setting assembly through translation, and can move the entire tool setting assembly into the protective cover by translation.

[0018] The elastic lifting assembly of the present invention has a simple structure and good structural integrity. It can conveniently adapt to the movement of the lifting block through the deformation of the elastic sheet. At the same time, the elastic sheet is deformed upwardly inclined under normal conditions, which is beneficial to making the position of the carrier table higher and reducing the downward movement distance of the grinding wheel.

[0019] The structure of the self-leveling platform of the present invention can not only conveniently and reliably make the carrier table in a horizontal state, but also effectively avoid the self-rotation of the carrier table, which is beneficial to ensuring the position accuracy of the carrier table.

[0020] The tool setting method of the present invention can conveniently adapt to the tool setting requirements of grinding wheels with various different thicknesses, and does not need to know the initial thickness of the grinding wheel and control the downward movement stroke of the grinding wheel accordingly. Brief Description of the Drawings

[0021] Figure 1 is the front view of the tool setting device for the grinding wheel and wafer stage of the present invention; Figure 2 is the front view of the tool setting assembly of the present invention; Figure 3 is the schematic diagram of the tool setting of the tool setting assembly of the present invention; Figure 4 is the perspective view of the tool setting assembly of the present invention, and the clamping plate above the elastic sheet is separated from the elastic sheet in the figure; Figure 5 is the cross-sectional view of the self-leveling platform part of the present invention; Figure 6 is the end view of the tool setting assembly of the present invention; Figure 7 is the schematic diagram of the grinding equipment of the present invention. Detailed Description of the Invention

[0022] The objectives, advantages, and features of the present invention will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solution of the present invention, and any technical solution formed by equivalent substitution or equivalent transformation falls within the scope of protection required by the present invention.

[0023] In the description of the solution, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for convenience of description and simplification of the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0024] Embodiment 1 The following describes the tool setting device for the grinding wheel carrier table of the present invention with reference to the accompanying drawings. As shown in the attached Figure 1 and the attached Figure 2 figures, it includes a bracket 100. A tool setting assembly 200 is provided on the bracket 100. The tool setting assembly 200 includes a fixed frame 201. An elastic lifting assembly 202 is provided on the fixed frame 201. The elastic lifting assembly 202 includes a lifting block 203 that can move up and down relative to the fixed frame 201. An automatically leveling platform 204 and a contact detection sensor 205 are provided on the lifting block 203 and are distributed vertically. The axis of the carrier table 206 of the automatically leveling platform 204 that contacts the bottom of the grinding wheel 500 and the axis of the probe 225 of the contact detection sensor 205 that contacts the carrier table 600 both extend in the vertical direction. Preferably, the axis of the carrier table 206 and the axis of the probe 225 are coaxial.

[0025] As shown in the attached Figure 1 figures, the bracket 100 includes a support shaft 110. A connection disk 120 is provided at the bottom of the support shaft 110 for connecting to an external structure. A horizontal mounting plate 130 is provided at the top of the support shaft 110 to mount the tool setting assembly 200. In this embodiment, the tool setting device for the grinding wheel carrier table may not be always installed in the grinding equipment. Instead, when replacing the grinding wheel 500, the tool setting device for the grinding wheel carrier table is installed in the grinding equipment for tool setting, and after the tool setting is completed, the tool setting device for the grinding wheel carrier table.

[0026] Of course, in another embodiment, the tool setting device for the grinding wheel carrier table may also be fixedly installed in the grinding equipment all the time, and each grinding assembly is configured with a corresponding tool setting device for the grinding wheel carrier table. At this time, as shown in the attached Figure 1As shown, the bracket 100 is disposed on a moving mechanism 300 that drives it to move horizontally. That is, the connecting plate at the bottom of the support shaft 110 is disposed on the moving mechanism 300. The moving mechanism 300 can drive the bracket 100 to move linearly and can also drive the support shaft 110 to rotate about its axis. In order to reduce the size required by the device and facilitate the protection of the tool alignment assembly 200, the moving mechanism 300 drives the support shaft 110 to rotate about its axis. And the moving mechanism 300 is preferably a rotary cylinder. Of course, it can also be other feasible structures, such as a turntable, and a pneumatic motor can be used to drive it.

[0027] And the moving mechanism 300 drives the tool alignment assembly 200 to move between a standby position and a detection position. As shown in the appendix Figure 1 As shown, in the standby position, the tool alignment assembly 200 is located within a protective cover 400 outside the wafer stage 600. The protective cover 400 can be a rectangular cover with a door that can be opened and closed on one side. And an avoidance notch for avoiding the mounting plate 130 of the bracket 100 is provided on the side plate of the protective cover 400. At the same time, a cleaning nozzle 410 for cleaning the stage 206 of the tool alignment assembly 200 located therein is provided at the top of the protective cover 400.

[0028] As shown in the appendix Figure 3 As shown, in the detection position, the stage 206 of the tool alignment assembly 200 is located below the grinding wheel 500 and within the projection range of the grinding wheel 500 on the horizontal plane. The probe 225 of the contact detection sensor 205 of the tool alignment assembly 200 is located above the wafer stage 600 and within the range of the tabletop of the wafer stage 600, and the distance between the probe 225 and the wafer stage 600 is less than the up and down movement stroke of the lifting block.

[0029] As shown in the appendix Figure 1 、Appendix Figure 4As shown, the tool setting component 200 is provided on the mounting plate 130. The fixing bracket 201 of the tool setting component 200 includes a support block 207 connected to the mounting plate 130. A horizontally extending first slot 208 is formed at the first side surface of the support block 207 facing the mounting plate 130. One end of the mounting plate 130 away from the support shaft 110 is inserted into the first slot 208, and the two are fixed by screwing. A guiding plate 209 is fixed at the second side surface of the support block 207 facing away from the mounting plate 130. The guiding plate 209 is also horizontally arranged and inserted into a second slot 210 formed at the second side surface. The guiding plate 209 and the support block 207 are also fixed by screwing. The end of the guiding plate 209 is embedded at a guiding groove 211 inside the lifting block 203, and the guiding plate 209 is connected to a connecting pin 213 inside the lifting block 203 through an elastic connecting piece 212. The elastic connecting piece 212 is preferably a tension spring. Of course, it can also be other devices with elastic deformation ability, such as an elastic band, etc. And, a set of the tension springs is arranged on both sides of the guiding plate 209, with three tension springs in each set. The upper end of the tension spring is hung at a hanging hole formed on a flat plate at the top of the guiding plate. Hook grooves corresponding to the hooks at the lower ends of each tension spring are arranged on the connecting pin 213.

[0030] As shown in the Figure 4 attachment, in order to ensure the integrity of the lifting block 203 and the support block 207, the lifting block 203 is connected to the support block 207 of the fixing bracket's support block 201 through at least one elastic sheet 214. The elastic sheet can be, for example, a metal sheet or a plastic sheet. Preferably, an elastic sheet 214 is fixed between the top of the lifting block 203 and the top of the support block 207, and another elastic sheet 214 is fixed between the bottom of the lifting block 203 and the bottom of the support block 207. The lifting block 203 clamps the elastic sheet 214 through a first clamping plate 215 fixed to its top and bottom by screwing, and the support block 207 clamps the elastic sheet 214 through a second clamping plate 216 screwed to its top and bottom.

[0031] As shown in the Figure 4 attachment, in order to improve the rigidity of the two elastic sheets 214, each elastic sheet 214 is clamped between two clamping plates 217. The two clamping plates 217 are located between the lifting block 203 and the support block 207. Specifically, each elastic sheet 214 is screwed together with the two clamping plates 217 above and below it to form a whole. The two ends of the clamping plate 217 are close to the lifting block 203 and the support block 207, and a small gap is maintained.

[0032] As shown in the Figure 4As shown, one end of the guiding plate 209 facing the lifting block 203 is formed with a convex platform 218, and the convex platform 218 is embedded at the guiding groove 211. When the carrier 206 of the self-leveling platform 204 is not under a downward pressure, the elastic connecting member makes the lower groove wall of the guiding groove 211 fit with the bottom surface of the convex platform 218. At the same time, the clamping plate 217 remains in an inclined state, and the side of the clamping plate 217 close to the lifting block 203 is higher than the opposite side thereof, and the inclination angle of the clamping plate does not exceed 5°.

[0033] As shown in the attached Figure 5 , attached Figure 6 As shown, the self-leveling platform 204 is arranged on the side of the lifting block 203 facing away from the supporting block 207, and it includes a base 219 fixed at the supporting block 207. The base 219 is L-shaped and close to the top of the supporting block 207, and a carrier 206 is arranged on the base 219. In order to better keep the carrier 206 in a horizontal state, three supporting parts distributed in a triangle are arranged on the base 219, and the carrier 206 is abutted against the three supporting parts that keep it in a horizontal state by an elastic member 221 that applies a downward pulling force to it.

[0034] Specifically, a connecting rod 222 is coaxially arranged at the bottom of the carrier 206. The connecting rod 222 is inserted into a counterbore 220 on the base 219. The aperture of the upper hole section of the counterbore is smaller than that of the lower hole section. A retaining piece 223 is sleeved on the connecting rod 222 and is located below the base 219. The diameter of the retaining piece 223 is larger than the aperture of the lower hole section of the counterbore. The retaining piece 223 is threadedly connected to the connecting rod 222 and is limited on the connecting rod 222 by a nut 224 located below the retaining piece 223. The elastic member 221 is arranged at the large hole section of the counterbore. The elastic member 221 is preferably a spring, and of course it can also be a leaf spring, etc. The spring is sleeved on the outer periphery of the connecting rod 222, and one end of it is connected to the step surface 225 of the counterbore, and the other end is connected to the retaining piece 223. The spring remains in a compressed state under normal conditions, so that the spring applies a downward pressure to the retaining piece 223, so that the carrier 206 abuts against the three supporting parts.

[0035] The three supporting parts can be three supporting columns or platforms, etc. More preferably, the three supporting parts are three supporting balls. One supporting ball is embedded at a conical groove or spherical groove 226 at the bottom of the carrier 206, and another supporting ball is embedded at a strip groove 227 at the bottom of the carrier 206 and extending along the radial direction of the carrier 206; the last supporting ball abuts against the bottom surface 228 of the carrier 206.

[0036] For convenience of description, three supporting balls are defined as the first supporting ball 229, the second supporting ball 230 and the third supporting ball 231. The first supporting ball 229 is directly embedded in a clamping groove 232 provided on the base 219. The groove surface of the clamping groove 232 is a conical surface or a spherical surface. The first supporting ball 229 is also embedded at a conical groove or a spherical groove 226 at the bottom of the carrier 206. The diameter of the first supporting ball 229 is larger than that of the second supporting ball 230 and the third supporting ball 231, and a gap is maintained between the carrier 206 and the base 219. The second supporting ball 230 is arranged at the top of a stud 233. The stud 233 is threadedly connected to a threaded hole on the base 219. At the same time, the stud 233 can also be fixed to the base by a locking nut on the upper and lower sides of the base 219. The second supporting ball 230 is embedded at the strip-shaped groove 227. The strip-shaped groove 227 can be a V-shaped groove or an arc-shaped groove. The third supporting ball 231 is also arranged at the top of a stud 233. The stud 233 is threadedly connected to the base 219, and the third supporting ball 231 abuts against the bottom surface of the base 219. Embedding the first supporting ball 229 in the clamping groove 232 on the base 219 can effectively simplify the installation structure of the first supporting ball 229. At the same time, arranging the second supporting ball 230 in the strip-shaped groove 227 can effectively cooperate with the first supporting ball 229 embedded at the conical groove or the spherical groove 226 at the bottom of the carrier 206 to limit the rotation of the carrier 206 relative to the three supporting parts. At the same time, the heights of the first supporting ball 229 and the second supporting ball 230 can be conveniently adjusted, and the horizontal state of the carrier 206 can be effectively ensured by adjusting the heights of the first supporting ball 229 and the second supporting ball 230, that is, ensuring that the axis of the carrier 206 extends along the vertical direction.

[0037] The contact detection sensor 205 can adopt different devices according to needs. For example, the contact detection sensor 205 can be a pressure sensor with the probe facing downwards; or the contact detection sensor 205 is a known normally open contact sensor or a normally closed contact sensor, and its probe also faces downwards.

[0038] When using the above-mentioned wheel bearing platform tool setting device for tool setting, the following steps are included: As shown in the appendix Figure 3 As shown, place the wheel bearing platform tool setting device at the tool setting position. At the tool setting position, the probe 225 of the wheel 500 bearing platform 600 tool setting device is located above the bearing platform 600 with a gap, and the carrier 206 is located below the wheel 500. The main shaft where the grinding wheel 500 is located is driven by a lifting mechanism to move downward. At this time, the grinding wheel 500 can move downward at a relatively fast speed. During the downward movement, the signal of the contact detection sensor 205 is obtained in real time. During the downward movement of the grinding wheel 500, the grinding wheel 500 presses on the stage 206. At this time, as the grinding wheel 500 continues to move downward, the elastic piece 214 can deform, so that the lifting block 203 can move downward relative to the fixed frame 201. As the lifting block 203 moves downward, the probe 225 of the contact detection sensor 205 on the lifting block 203 moves downward to contact the top surface of the wafer stage 600 and generates a trigger signal, as shown in the appendix Figure 3 As shown. When the contact detection sensor 205 is a pressure sensor, the trigger signal is the signal of the pressure detected by the pressure sensor; when the contact detection sensor 205 is a normally open contact sensor, the trigger signal is the signal of the normally open contact sensor being closed. Due to the certain elasticity of the lifting block and the certain buffering ability of the probe of the contact detection sensor 205, it can effectively avoid the problems caused by the hard contact between the grinding wheel 500 and the stage 206 and between the wafer stage 600 and the tool setting component 200 when the grinding wheel 500 moves downward at a relatively fast speed.

[0039] When it is determined according to the signal of the pressure sensor that the contact detection sensor 205 contacts the top surface of the wafer stage 600, determine the downward movement height H1 corresponding to the grinding wheel 500 moving downward from the origin height to the current position, as shown in the appendix Figure 3 As shown; at the same time, the grinding wheel 500 can be stopped from moving downward, or the grinding wheel 500 can be moved upward in the reverse direction.

[0040] According to the downward movement height H1 and the distance H2 between the top surface of the stage 206 and the lower end of the probe of the contact detection sensor 205, determine the distance that the grinding wheel 500 needs to move downward from the origin height when the grinding wheel 500 starts to contact the wafer stage 600. That is, the sum of the downward movement height H1 and the distance H2 between the top surface of the stage 206 and the lower end of the probe of the contact sensor is the distance that the grinding wheel 500 needs to move downward from the origin height when the grinding wheel 500 starts to contact the wafer stage 600.

[0041] After the tool setting is completed, the tool setting component is moved to the outside of the wafer stage through the moving mechanism, and then grinding can be carried out.

[0042] Embodiment 2 This embodiment discloses a grinding device, including the grinding wheel and wafer stage tool setting device B00 as described in any one of the above. The grinding device can be the structure disclosed in patent documents such as the application publication numbers CN115338717A and CN116652767A.

[0043] In a more preferred embodiment, similar to the patent document with the application publication number CN115338717A, the grinding device includes an indexing table 700 and a plurality of wafer carriers 600 disposed on the indexing table 700. As shown in the appendix Figure 7 As shown, the number of the wafer carriers 600 is preferably four, and the four wafer carriers 600 are evenly arranged on the circumference of the indexing table 700.

[0044] In addition, in addition to the first grinding assembly 800 for rough grinding and the second grinding assembly 900 for fine grinding, the grinding device further includes a third grinding assembly A00 for polishing the workpiece after fine grinding. Their specific structures are known technologies and will not be elaborated here.

[0045] The first grinding assembly 800 and the second grinding assembly 900 are arranged side by side on one side of the indexing table 700, and the third grinding assembly A00 is disposed on the other side of the indexing table 700. Preferably, the third grinding assembly A00 is disposed opposite to the second grinding assembly 900. A wheel carrier alignment device B00 can be respectively arranged beside the first grinding assembly 800, the second grinding assembly 900, and the third grinding assembly A00.

[0046] Meanwhile, thickness measuring mechanisms C00 are respectively arranged beside the first grinding assembly 800, the second grinding assembly 900, and the third grinding assembly A00. The thickness measuring mechanisms C00 are used to measure the thickness of the workpieces on the wafer carriers located at the first grinding assembly 800, the second grinding assembly 900, and the third grinding assembly A00. The thickness measuring mechanisms C00 use known non-contact thickness gauges to measure the thickness of the workpieces. For example, a laser distance sensor can be used for thickness measurement. Its specific structure and thickness measurement principle are known technologies and will not be elaborated here. Moreover, the thickness measuring mechanism arranged beside the third grinding assembly is located on the downstream side of the third grinding assembly, that is, the side that the wafer carrier passes through later when rotating.

[0047] As shown in the appendix Figure 7 As shown, a surface roughness detection assembly D00 is also arranged near the downstream side of the third grinding assembly A00 for measuring the surface roughness of the workpiece. That is, the surface roughness detection assembly D00 can be arranged between the wafer carrier at the loading and unloading position and the wafer carrier at the third grinding assembly. The surface roughness detection assembly D00 uses a known white light interferometer for detection. The principle of using a white light interferometer for roughness detection is a known technology and will not be elaborated here. The thickness measuring mechanism and the surface roughness detection assembly can be suspended in the grinding device by a suspension member, or can be arranged in the grinding device through a bracket outside the indexing table. The grinding device is also provided with a nozzle E00 for providing liquid and / or gas to the tabletop of the wafer carrier located at the third grinding assembly A00.

[0048] For the convenience of description, the four wafer carriers are sequentially defined as the No. 1 wafer carrier, the No. 2 wafer carrier, the No. 3 wafer carrier, and the No. 4 wafer carrier, and the thickness measuring mechanism C00 for measuring the thickness of the workpiece on the wafer carrier at the third grinding assembly A00 is defined as the No. 1 thickness measuring mechanism. When the entire grinding equipment works, it includes the following processes: When the No. 1 wafer carrier is at the loading and unloading position, the workpiece is concentrically placed on the No. 1 wafer carrier, and then the indexing table 700 rotates clockwise by 90°, so that the workpiece on the No. 1 wafer carrier rotates to the first grinding assembly 800 for rough grinding. At this time, the No. 2 wafer carrier rotates to the loading and unloading position for loading and unloading. When the workpiece on the No. 1 wafer carrier is ground to the target thickness at the first grinding assembly 800, the first grinding assembly 800 stops grinding, and the indexing table 700 continues to rotate clockwise by 90°, so that the workpiece on the No. 1 wafer carrier rotates to the second grinding assembly 900 for fine grinding. At the same time, the workpiece on the No. 2 wafer carrier rotates to the first grinding assembly 800 for rough grinding, and the No. 3 wafer carrier rotates to the loading and unloading position for loading. When the workpiece on the No. 1 wafer carrier is ground to the target thickness at the second grinding assembly 900, the second grinding assembly 900 and the first grinding assembly 800 stop grinding, and the indexing table 700 continues to rotate clockwise by 90° to make the No. 1 wafer carrier rotate to the third grinding assembly A00 for polishing. At this time, the workpiece on the No. 2 wafer carrier rotates to the second grinding assembly 900 for fine grinding, the workpiece on the No. 3 wafer carrier rotates to the first grinding assembly 800 for rough grinding, and the No. 4 wafer carrier rotates to the loading and unloading position for loading and unloading. When the workpiece on the No. 1 wafer carrier is polished, the third grinding assembly A00 stops processing. At this time, the No. 1 wafer carrier keeps rotating, and at the same time, cleaning liquid is sprayed onto the top surface of the workpiece on the No. 1 wafer carrier through the nozzle E00 to wash away the impurities on the top surface of the workpiece. After cleaning, air is blown onto the top surface of the workpiece through the nozzle E00 to dry the liquid on the top surface of the workpiece. Then, the No. 1 wafer carrier rotates slowly, and at the same time, the indexing table 700 continues to rotate clockwise by 90°. At this time, the rotation speed of the indexing table 700 is slower than the rotation speed during normal station switching. During the rotation, while the No. 1 thickness measuring mechanism can detect the workpiece on the No. 1 wafer carrier, the data measured by the No. 1 thickness measuring mechanism is obtained in real time, and based on this, it is determined whether the total thickness deviation (TTV) of the workpiece on the No. 1 wafer carrier meets the requirements. For example, it can be determined whether the difference between the maximum value and the minimum value in the data measured by the No. 1 thickness measuring mechanism is greater than the threshold to determine whether the total thickness deviation meets the requirements and record the detection result.

[0049] Moreover, while the roughness detection component D00 can detect the workpiece on the No. 1 wafer carrier, the signal of the roughness detection component D00 is obtained in real time, and based on this, it is determined whether the surface roughness of the workpiece on the No. 1 wafer carrier meets the requirements and record the detection result.

[0050] Moreover, it is possible to pre-determine the range of the rotation angle when the wafer stage located at the third grinding assembly A00 rotates towards the loading / unloading position, within which the roughness detection assembly D00 and the No. 1 thickness measuring mechanism can detect the workpiece on the wafer stage, and accordingly determine when to collect the signals of the roughness detection assembly D00 and the No. 1 thickness measuring mechanism.

[0051] When the No. 1 wafer stage rotates back to the loading / unloading position, the rotation of the No. 1 wafer stage and the indexing table 700 is stopped. At this time, the processed workpiece on the No. 1 wafer stage can be unloaded and re-loaded. Meanwhile, the workpiece on the No. 2 wafer stage is located at the third grinding assembly A00 for polishing, the workpiece on the No. 3 wafer stage is located at the second grinding assembly 900 for fine grinding, and the workpiece on the No. 4 wafer stage is located at the first grinding assembly 800 for rough grinding.

[0052] This method can directly detect roughness and TTV during the thinning process, effectively improving the processing efficiency, eliminating the process of re-detection after boxing, and improving the safety of detection.

[0053] There are still various implementation manners of the present invention. All technical solutions formed by equivalent transformation or equivalent substitution fall within the protection scope of the present invention.

Claims

1. Grinding wheel bearing piece table tool setting device, including a bracket, characterized in that: A tool setting component is provided on the bracket. The tool setting component includes a fixed bracket. An elastic lifting component is provided on the fixed bracket. The elastic lifting component includes a lifting block that can move up and down relative to the fixed bracket. An automatically leveling platform and a contact detection sensor are provided on the lifting block and are distributed vertically. The axis of the carrier table of the automatically leveling platform that contacts the bottom of the grinding wheel and the axis of the probe of the contact detection sensor that contacts the wafer stage both extend in the vertical direction. When the carrier table is subjected to the downward pressure of the grinding wheel, the lifting block moves downward relative to the fixed bracket. When the grinding wheel releases the downward pressure applied to the carrier table, the lifting block moves upward and resets.

2. The tool setting device for the grinding wheel carrier according to claim 1, characterized in that: The bracket is provided on a moving mechanism that drives its horizontal movement.

3. The tool setting device for the grinding wheel carrier according to claim 2, characterized in that: The moving mechanism drives the bracket to move between a standby position and a detection position. In the standby position, the tool setting component is located in a protective cover outside the wafer stage.

4. The wheel bearing sheet stage tool setting device according to claim 1, characterized in that: The lifting block is connected to the support block of the fixed bracket through at least one elastic sheet. A horizontal guiding plate is provided on the side of the support block facing the lifting block. The end of the guiding plate is embedded in a guiding groove inside the lifting block. The guiding plate is connected to a connecting pin inside the lifting block through an elastic connecting piece.

5. The tool setting device for the grinding wheel carrier according to claim 4, characterized in that: The elastic sheet is clamped between two clamping plates. The two clamping plates are located between the lifting block and the support block.

6. The tool setting device for the grinding wheel carrier according to claim 5, characterized in that: A convex platform is formed at one end of the guiding plate facing the lifting block. The convex platform is embedded in the guiding groove. In the case where the carrier table of the automatically leveling platform is not subjected to downward pressure, the elastic connecting piece keeps the clamping plate in an inclined state, and the side of the clamping plate close to the lifting block is higher than the opposite side.

7. The wheel carrier blade alignment device according to any one of claims 1-6, characterized in that: The automatically leveling platform includes a base. A carrier table is provided on the base. The carrier table is abutted against three supporting parts that keep it in a horizontal state through an elastic member that applies a downward pulling force to it.

8. The wheel carrier blade setting device according to claim 7, wherein: The three supporting parts are three supporting balls. One supporting ball is embedded in a conical groove or spherical groove at the bottom of the carrier table. Another supporting ball is embedded in a strip groove at the bottom of the carrier table and extending along the radial direction of the carrier table. The last supporting ball abuts against the bottom surface of the carrier table.

9. Grinding equipment, characterized in that: It includes a grinding wheel and wafer stage tool setting device according to any one of claims 1-8.

10. The tool setting method of the tool setting device for the grinding wheel carrier according to any one of claims 1-8, characterized in that, It includes the following steps: Position the grinding wheel and wafer stage tool setting device at the tool setting position. In the tool setting position, the probe gap of the grinding wheel and wafer stage tool setting device is located above the wafer stage, and the carrier table is located below the grinding wheel. Drive the grinding wheel to move downward and continuously obtain the signal of the contact detection sensor. When it is determined according to the signal of the contact detection sensor that the contact detection sensor contacts the top surface of the wafer stage, determine the downward movement height corresponding to the current position where the grinding wheel moves downward from the origin height. Determine the distance that the grinding wheel needs to move downward from the origin height when the grinding wheel starts to contact the wafer stage according to the downward movement height and the distance between the top surface of the carrier table and the lower end of the probe of the contact detection sensor.

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