A FPC circuit board implant injection molding exposed part sealing mold

Abstract

The present invention belongs to the field of injection molding technology, and in particular to a mold for sealing the exposed parts of an FPC circuit board for injection molding. The following scheme is proposed, which specifically includes a fixed mold base and a movable mold base, wherein the surfaces of the fixed mold base and the movable mold base are respectively provided with a lower molding cavity and an upper molding cavity, and a molding part is provided in the middle of the lower molding cavity and the upper molding cavity, an injection nozzle is installed on the movable mold base, an FPC circuit board is implanted in the middle of the molding part, and two mounting seats connected to the molding cavity are provided in the middle of the fixed mold base. In the present invention, a special first sealing module or a second sealing module is selected to tightly fix the exposed parts at both ends of the FPC circuit board on the mold, and by sealing the exposed parts at both ends of the FPC circuit board, it is ensured that during the injection molding process, the FPC circuit board will not be displaced, deformed or damaged due to the impact of the plastic melt.

Description

Technical Field

[0001] The present invention relates to the field of injection molding technology, in particular to a mold for sealing an exposed portion of an FPC circuit board by implanting the circuit board into the mold. Background Art

[0002] AR glasses are a sci-fi product, boasting cutting-edge technology. Wearing them allows you to experience the futuristic features used by the handsome male and female protagonists in sci-fi movies. They can be thought of as a miniature mobile phone, tracking the user's gaze to determine their current state and activate corresponding functions.

[0003] The frame of AR glasses is processed by injection molding. During the injection molding process of the AR glasses frame, the FPC circuit board needs to be implanted into the injection molded part. The upper and lower frames of the AR glasses are injection molded separately using the double-shot molding method, and the FPC circuit board is implanted into the middle groove of the upper and lower frames of the AR glasses. When the FPC circuit board is implanted by injection molding, it is necessary to reserve the exposed part of the FPC circuit board for electrical connection to avoid displacement, deformation or damage to the two ends of the FPC circuit board due to the impact of the plastic melt during injection molding.

[0004] In view of this, the present invention provides a FPC circuit board implant injection molding exposed portion sealing mold to solve the technical problems existing in the above-mentioned prior art. Summary of the Invention

[0005] Based on the technical problems existing in the background technology, the present invention proposes a sealing mold for the exposed part of an FPC circuit board implanted in the injection molding.

[0006] The present invention proposes a sealing mold for the exposed part of an FPC circuit board implanted in injection molding, comprising a fixed mold base and a movable mold base, the surfaces of the fixed mold base and the movable mold base are respectively provided with a lower molding cavity and an upper molding cavity, and a molding part is provided in the middle of the lower molding cavity and the upper molding cavity, the movable mold base is equipped with an injection nozzle, the middle of the molding part is implanted with an FPC circuit board, the middle of the fixed mold base is provided with two mounting seats connected to the lower molding cavity, and the inside of the two mounting seats are respectively provided with a first sealing module and a second sealing module, the surface of the movable mold base is provided with a first sealing cover and a second sealing cover, the first sealing cover cooperates with the first sealing module to form a first sealing mold cavity, the second sealing cover cooperates with the second sealing module to form a second sealing mold cavity, and the side wall of the mounting seat is provided with a glue injection flow channel connecting the first sealing mold cavity and the second sealing mold cavity.

[0007] Preferably in the present invention, the first sealing mold group includes a first sealing mold base, and the side of the first sealing mold base is provided with a first injection hole connected to the injection channel, the first sealing mold base is equipped with a first sealing mold mechanism, and the first sealing mold mechanism is composed of a pressure plate assembly and a cavity assembly.

[0008] Preferably in the present invention, the cavity assembly is a columnar structure, and a first guide groove connected to the first glue injection hole is provided on the outside of the cavity assembly, a sealing groove is provided on the top of the cavity assembly, and a protective cavity cooperating with the pressure plate assembly is provided on the top side of the cavity assembly.

[0009] Preferably in the present invention, the pressing plate assembly includes a horizontally arranged pressing plate and a vertically arranged bending edge member, and a first positioning pin is provided at the upper end of the pressing plate.

[0010] In the present invention, preferably, the first sealing glue cover includes a first raised pressure cover arranged in the upper molding cavity, and the edge of the first raised pressure cover is adapted to the opening of the first sealing glue mold seat, the middle part of the first raised pressure cover is provided with a pressure groove adapted to the pressure plate, and the middle part of the pressure groove is provided with a first positioning groove adapted to the first positioning pin.

[0011] Preferably in the present invention, the second sealing mold assembly includes a second sealing mold base, and a second injection hole connected to the injection channel is provided on the side of the second sealing mold base, and a second sealing mold mechanism is installed in the second sealing mold base.

[0012] In the present invention, preferably, the top of the second sealing mold mechanism is a circular structure, a supporting core rod is provided at the bottom of the second sealing mold mechanism, and the sides of the second sealing mold mechanism and the supporting core rod are both provided with a second guide groove connected to the second injection hole, a second positioning pin is provided above the second sealing mold mechanism, a precision column is provided at the bottom of the second positioning pin, and a precision groove adapted to the precision column is provided in the center of the top of the second sealing mold mechanism, and a U-shaped groove is provided on the side of the top of the second sealing mold mechanism.

[0013] In the present invention, preferably, the second sealing glue cover includes a second raised cover arranged in the upper molding cavity, and the edge of the second raised cover is adapted to the opening of the second sealing glue mold base, the middle part of the second raised cover is provided with a second positioning groove adapted to the second positioning pin, and the side of the second raised cover is provided with a U-shaped raised portion adapted to the U-shaped groove.

[0014] Preferably in the present invention, the molded part includes a primary molded shell and a secondary molded shell, and one end of the primary molded shell and the secondary molded shell is provided with a first groove that cooperates with the first sealing module, and the other end of the primary molded shell and the secondary molded shell is provided with a second groove that cooperates with the second sealing module.

[0015] Compared with the prior art, the present invention provides a mold for sealing the exposed part of an FPC circuit board by injection molding, which has the following beneficial effects:

[0016] The two ends of the FPC circuit board are respectively set in the first groove and the second groove. The exposed parts of the FPC circuit board at both ends are used to connect the AR glasses to the power supply. According to the exposed shape and size of the FPC circuit board, a special first sealing module or second sealing module is selected to tightly fix the exposed parts of the FPC circuit board on the mold. The exposed parts of the FPC circuit board at both ends are sealed to ensure that the FPC circuit board will not be displaced, deformed or damaged due to the impact of the plastic melt during the injection molding process.

[0017] After the fixed mold base and the movable mold base are closed, the first sealing glue cover fixes the pressure plate assembly to the upper end of the cavity assembly. A sealing glue cavity is formed between the first sealing glue cover, the pressure plate assembly and the cavity assembly. When the FPC circuit board is implanted for injection molding, the end of the FPC circuit board is set above the first sealing glue module, and the end of the FPC circuit board is inserted into the cavity assembly. The exposed part of the FPC circuit board is sealed with the pressure plate assembly, and glue is injected from the glue injection flow channel, the first glue injection hole and the outside of the cavity assembly. The sealing glue cavity is filled with glue, and then the connection between the FPC circuit board and the molded part is sealed with glue, so that the FPC circuit board is tightly fixed in the molding cavity.

[0018] A sealing cavity is formed between the second sealing cover, the second sealing mold base and the second sealing mold mechanism. The other end of the FPC circuit board is laid flat in the sealing cavity. After the glue is injected, the other end of the FPC circuit board is completely covered in the protective glue ball. During the injection molding process, the other end of the FPC circuit board will not be displaced, deformed or damaged due to the impact of the plastic melt. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural schematic diagram of a fixed mold base for a mold for sealing the exposed portion of an FPC circuit board implanted in an injection molding process, as proposed by the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of a movable mold base for a mold for sealing the exposed portion of an FPC circuit board implanted in an injection molding process, as proposed by the present invention;

[0021] Figure 3 This is a schematic diagram of the mounting base structure of an FPC circuit board embedded in an injection molding exposed portion of a sealing mold, as proposed by the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of a molded part of an FPC circuit board implanted in an injection molding mold for an exposed portion of the circuit board proposed by the present invention;

[0023] Figure 5This is a structural schematic diagram of the first sealing module of a sealing mold for an FPC circuit board implanted in an injection molding exposed portion, as proposed by the present invention;

[0024] Figure 6 This is a schematic diagram of the first sealing cover structure of a sealing mold for an FPC circuit board implanted in an injection molding exposed portion of the circuit board according to the present invention;

[0025] Figure 7 This is a structural schematic diagram of a second sealing module of a sealing mold for an FPC circuit board implanted in an injection molding exposed portion, as proposed by the present invention;

[0026] Figure 8 This is a schematic diagram of the second sealing cover structure of the sealing mold for the exposed portion of an FPC circuit board implanted in the injection molding process proposed by the present invention;

[0027] Figure 9 This is a schematic diagram of the structure of a cavity component of a mold for sealing the exposed portion of an FPC circuit board implanted in an injection molding process proposed by the present invention;

[0028] Figure 10 This is a schematic diagram of the distribution of an FPC circuit board proposed by the present invention, in which an FPC circuit board is embedded in a sealing mold for an exposed portion of an injection mold.

[0029] In the figure: 1 fixed mold base, 2 movable mold base, 3 lower molding cavity, 4 upper molding cavity, 5 first sealing mold group, 51 first sealing mold base, 52 first glue injection hole, 53 cavity assembly, 54 sealing groove, 55 pressure plate assembly, 56 first positioning pin, 57 protective cavity, 6 second sealing mold group, 61 second sealing mold base, 62 second glue injection hole, 63 supporting core rod, 64 second sealing mold mechanism, 65 second positioning pin, 66 precision column, 7 molding part, 71 secondary molding shell, 72 primary molding shell, 73 second groove, 74 first groove, 8 injection nozzle, 9 first sealing cover, 91 first raised cover, 92 groove, 93 first positioning groove, 10 second sealing cover, 101 second raised cover, 102 U-shaped raised portion, 103 second positioning groove, 11 FPC circuit board, 12 mounting seat, 13 glue injection channel. DETAILED DESCRIPTION

[0030] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0031] Reference Figure 1-Figure 3, a FPC circuit board implant injection molding exposed part sealing mold, including a fixed mold base 1 and a movable mold base 2, the fixed mold base 1 and the movable mold base 2 are respectively provided with a lower molding cavity 3 and an upper molding cavity 4 on the surface, and a molding part 7 is provided in the middle of the lower molding cavity 3 and the upper molding cavity 4, an injection nozzle 8 is installed on the movable mold base 2, an FPC circuit board 11 is implanted in the middle of the molding part 7, two mounting seats 12 connected to the lower molding cavity 3 are provided in the middle of the fixed mold base 1, and the first sealing module 5 and the second sealing module 6 are respectively installed inside the two mounting seats 12, a first sealing cover 9 and a second sealing cover 10 are provided on the surface of the movable mold base 2, the first sealing cover 9 and the first sealing module 5 cooperate to form a first sealing cavity, the second sealing cover 10 and the second sealing module 6 cooperate to form a second sealing cavity, and the side wall of the mounting seat 12 is provided with a glue injection channel 13 connecting the first sealing cavity and the second sealing cavity.

[0032] Reference Figure 4 The molded part 7 includes a primary molded shell 72 and a secondary molded shell 71, and one end of the primary molded shell 72 and the secondary molded shell 71 is provided with a first groove 74 that cooperates with the first sealing module 5, and the other end of the primary molded shell 72 and the secondary molded shell 71 is provided with a second groove 73 that cooperates with the second sealing module 6. In the present invention, the two ends of the FPC circuit board 11 are respectively arranged in the first groove 74 and the second groove 73. After the two ends of the FPC circuit board 11 are implanted, the exposed parts are used to connect the AR glasses to the power. According to the exposed form and size of the FPC circuit board 11, a special first sealing module 5 or a second sealing module 6 is selected to tightly fix the exposed parts at both ends of the FPC circuit board 11 on the mold, and by sealing the exposed parts at both ends of the FPC circuit board 11, it is ensured that during the injection molding process, the FPC circuit board 11 will not be displaced, deformed or damaged due to the impact of the plastic melt.

[0033] Reference Figure 5The first sealing mold assembly 5 includes a first sealing mold base 51, and a first injection hole 52 connected to the injection flow channel 13 is provided on the side of the first sealing mold base 51. The first sealing mold mechanism is installed in the first sealing mold base 51, and the first sealing mold mechanism is composed of a pressure plate assembly 55 and a cavity assembly 53. In the present invention, after the fixed mold base 1 and the movable mold base 2 are closed, the first sealing cover 9 fixes the pressure plate assembly 55 to the upper end of the cavity assembly 53. The first sealing cover 9, the pressure plate assembly 55 and the cavity assembly 53 form a sealing cavity. When the FPC circuit board 11 is implanted in the injection molding, the FPC circuit board 11 The end portion is arranged above the first sealing module 5, the end portion of the FPC circuit board 11 is inserted into the cavity assembly 53, and the exposed portion of the FPC circuit board 11 is sealed using the pressure plate assembly 55. Glue is injected from the glue injection channel 13, the first glue injection hole 52 and the outside of the cavity assembly 53, and the sealing cavity is filled with glue. The connection between the FPC circuit board 11 and the molded part 7 is then sealed, so that the FPC circuit board 11 is tightly fixed in the molding cavity, ensuring that during the injection molding process, the FPC circuit board 11 will not be displaced, deformed or damaged due to the impact of the plastic melt.

[0034] Reference Figure 9 The cavity component 53 has a columnar structure, and a first guide groove connected to the first glue injection hole 52 is provided on the outside of the cavity component 53, a sealing groove 54 is provided on the top of the cavity component 53, and a protective cavity 57 cooperating with the pressure plate component 55 is provided on the top side of the cavity component 53. In the present invention, the first sealing cover 9, the pressure plate component 55 and the sealing groove 54 of the cavity component 53 are combined to form a combined sealing cavity. By utilizing the cooperation between the pressure plate component 55 and the protective cavity 57, after the end of the FPC circuit board 11 is inserted into the protective cavity 57, the pressure plate component 55 is used to seal and fix the connection between the FPC circuit board 11 and the sealing cavity, thereby protecting the exposed part of the FPC circuit board 11.

[0035] Reference Figure 5 and Figure 9 The pressure plate assembly 55 includes a horizontally arranged pressure plate and a vertically arranged bending member, and a first positioning pin 56 is provided at the upper end of the pressure plate. In the present invention, the end of the FPC circuit board 11 is bent under the action of the bending member and inserted into the protective cavity 57, and the pressure plate is used to seal and position the opening of the protective cavity 57 to ensure the flat position of the exposed edge of the FPC circuit board 11, thereby ensuring the uniformity and sealing of the sealing glue inside the sealing cavity, while preventing glue from entering the protective cavity 57.

[0036] Reference Figure 2 and Figure 6The first sealing cover 9 includes a first raised cover 91 arranged in the upper molding cavity 4, and the edge of the first raised cover 91 is adapted to the opening of the first sealing mold base 51, and the middle of the first raised cover 91 is provided with a pressing groove 92 adapted to the pressure plate, and the middle of the pressing groove 92 is provided with a first positioning groove 93 adapted to the first positioning pin 56. In the present invention, the first sealing cover 9 is used to firmly fix the first positioning pin 56 and the pressure plate assembly 55 to avoid the stability of the sealing cavity formed by the first sealing cover 9, the pressure plate assembly 55 and the cavity assembly 53 during the sealing and injection molding process.

[0037] Reference Figure 7 and Figure 9 The second sealing module 6 includes a second sealing mold base 61, and the side of the second sealing mold base 61 is provided with a second sealing hole 62 connected to the injection channel 13, and the second sealing mold base 61 is equipped with a second sealing mold mechanism 64. In the present invention, a sealing cavity is formed between the second sealing cover 10, the second sealing mold base 61 and the second sealing mold mechanism 64. The other end of the FPC circuit board 11 is flatly laid in the sealing cavity. After the glue is injected, the other end of the FPC circuit board 11 is completely covered in the protective glue ball. During the injection molding process, the other end of the FPC circuit board 11 will not be displaced, deformed or damaged due to the impact of the plastic melt.

[0038] Reference Figure 7 and Figure 9 The top of the second sealing mold mechanism 64 is a circular structure, and a supporting core rod 63 is provided at the bottom of the second sealing mold mechanism 64, and the sides of the second sealing mold mechanism 64 and the supporting core rod 63 are provided with a second guide groove connected to the second injection hole 62, and a second positioning pin 65 is provided above the second sealing mold mechanism 64, and a precision column 66 is provided at the bottom of the second positioning pin 65, and a precision groove adapted to the precision column 66 is provided in the center of the top of the second sealing mold mechanism 64, and a U-shaped groove is provided on the side of the top of the second sealing mold mechanism 64. In the present invention, after the FPC circuit board 11 is placed, the end of the FPC circuit board 11 is provided between the second sealing cover 10 and the second sealing mold mechanism 64, and the end of the FPC circuit board 11 is precisely positioned by the precision column 66, so that the protective glue ball can completely wrap the end of the FPC circuit board 11 during glue injection to avoid protection defects.

[0039] Reference Figure 2 and Figure 8The second sealing cover 10 includes a second raised cover 101 arranged on the upper molding cavity 4, and the edge of the second raised cover 101 is adapted to the opening of the second sealing mold seat 61, and the middle part of the second raised cover 101 is provided with a second positioning groove 103 adapted to the second positioning pin 65, and the side of the second raised cover 101 is provided with a U-shaped raised portion 102 adapted to the U-shaped groove. In the present invention, the second sealing cover 10 wraps and fixes the second positioning pin 65, and then the second sealing cover 10, the second sealing mold seat 61 and the second sealing mold mechanism 64 form a sealing cavity that completely covers the end of the FPC circuit board 11.

[0040] After the fixed mold base 1 and the movable mold base 2 are closed, the first sealing cover 9 fixes the pressure plate assembly 55 to the upper end of the cavity assembly 53. A sealing cavity is formed between the first sealing cover 9, the pressure plate assembly 55 and the cavity assembly 53. When the FPC circuit board 11 is implanted for injection molding, the end of the FPC circuit board 11 is set above the first sealing module 5, and the end of the FPC circuit board 11 is inserted into the cavity assembly 53. The exposed part of the FPC circuit board 11 is sealed by the pressure plate assembly 55. Glue is injected from the glue injection channel 13, the first glue injection hole 52 and the outside of the cavity assembly 53. The glue is used to fill the sealing cavity, and then the connection between the FPC circuit board 11 and the molded part 7 is sealed, so that the FPC circuit board 11 is tightly fixed in the molding cavity.

[0041] A sealing cavity is formed between the second sealing cover 10, the second sealing mold base 61 and the second sealing mold mechanism 64. The other end of the FPC circuit board 11 is laid flat in the sealing cavity. After the injection of glue, the other end of the FPC circuit board 11 is completely covered in the protective glue ball. Then, according to the exposed shape and size of the FPC circuit board 11, a special first sealing module 5 or second sealing module 6 is selected to tightly fix the exposed parts at both ends of the FPC circuit board 11 on the mold. By sealing the exposed parts at both ends of the FPC circuit board 11, it is ensured that during the injection molding process, the FPC circuit board 11 will not be displaced, deformed or damaged due to the impact of the plastic melt.

[0042] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A mold for sealing an exposed portion of an FPC circuit board by injection molding, comprising a fixed mold base (1) and a movable mold base (2), wherein the surfaces of the fixed mold base (1) and the movable mold base (2) are respectively provided with a lower molding cavity (3) and an upper molding cavity (4), and a molding part (7) is provided in the middle of the lower molding cavity (3) and the upper molding cavity (4), an injection nozzle (8) is installed on the movable mold base (2), and an FPC circuit board (11) is implanted in the middle of the molding part (7), characterized in that: The middle part of the fixed mold base (1) is provided with two mounting seats (12) connected to the lower molding cavity (3), and the interiors of the two mounting seats (12) are respectively provided with a first sealing module (5) and a second sealing module (6), and the surface of the movable mold base (2) is provided with a first sealing cover (9) and a second sealing cover (10), the first sealing cover (9) cooperates with the first sealing module (5) to form a first sealing mold cavity, and the second sealing cover (10) cooperates with the second sealing module (6) to form a second sealing mold cavity, and the side wall of the mounting seat (12) is provided with a glue injection channel (13) connecting the first sealing mold cavity and the second sealing mold cavity; The first sealing mold assembly (5) includes a first sealing mold seat (51), and a first injection hole (52) connected to the injection flow channel (13) is provided on the side of the first sealing mold seat (51). A first sealing mold mechanism is installed in the first sealing mold seat (51), and the first sealing mold mechanism is composed of a pressure plate component (55) and a cavity component (53). The cavity component (53) is a columnar structure, and a first guide groove connected to the first injection hole (52) is provided on the outside of the cavity component (53). A sealing groove (54) is provided on the top of the cavity component (53), and a side surface of the top of the cavity component (53) is provided. A protective cavity (57) cooperates with a pressure plate assembly (55), wherein the pressure plate assembly (55) includes a horizontally arranged pressure plate and a vertically arranged bending member, and a first positioning pin (56) is provided at the upper end of the pressure plate, the first sealing glue cover (9) includes a first protruding pressure cover (91) provided in the upper molding cavity (4), and the edge of the first protruding pressure cover (91) is adapted to the opening of the first sealing glue mold base (51), the middle of the first protruding pressure cover (91) is provided with a pressure groove (92) adapted to the pressure plate, and the middle of the pressure groove (92) is provided with a first positioning groove (93) adapted to the first positioning pin (56).

2. The FPC circuit board implant injection molding exposed part sealing mold according to claim 1, characterized in that: The second sealing mold assembly (6) includes a second sealing mold base (61), and a second sealing mold hole (62) connected to the sealing flow channel (13) is provided on the side of the second sealing mold base (61), and a second sealing mold mechanism (64) is installed in the second sealing mold base (61).

3. The FPC circuit board implant injection molding exposed part sealing mold according to claim 2, characterized in that: The top of the second sealing mold mechanism (64) is a circular structure, the bottom of the second sealing mold mechanism (64) is provided with a supporting core rod (63), and the sides of the second sealing mold mechanism (64) and the supporting core rod (63) are both provided with a second guide groove connected to the second injection hole (62), a second positioning pin (65) is provided above the second sealing mold mechanism (64), a precision column (66) is provided at the bottom of the second positioning pin (65), and a precision groove adapted to the precision column (66) is provided at the center of the top of the second sealing mold mechanism (64), and a U-shaped groove is provided on the side of the top of the second sealing mold mechanism (64).

4. The FPC circuit board implant injection molding exposed part sealing mold according to claim 3, characterized in that: The second sealing glue cover (10) includes a second raised cover (101) arranged in the upper molding cavity (4), and the edge of the second raised cover (101) is adapted to the opening of the second sealing glue mold base (61), the middle of the second raised cover (101) is provided with a second positioning groove (103) adapted to the second positioning pin (65), and the side of the second raised cover (101) is provided with a U-shaped raised portion (102) adapted to the U-shaped groove.

5. The FPC circuit board implant injection molding exposed part sealing mold according to claim 1, characterized in that: The molded part (7) comprises a primary molded shell (72) and a secondary molded shell (71), and one end of the primary molded shell (72) and the secondary molded shell (71) is provided with a first groove (74) that cooperates with the first sealing module (5), and the other end of the primary molded shell (72) and the secondary molded shell (71) is provided with a second groove (73) that cooperates with the second sealing module (6).

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