Upper cover for IC tray

Abstract

The invention relates to the technical field of upper covers for IC trays, in particular to an upper cover for an IC tray, which comprises a tray body, an upper cover plate is matched above the tray body, plug-in units are fixedly mounted at positions, close to four corners and two sides of the middle, of the lower end of the upper cover plate, and a groove is formed in one side of each plug-in unit. The outer surface of the upper cover plate is coated with a surface antistatic coating, the antistatic coating covers the outer surface of the matrix layer, the thickness of the coating is 10-50 microns, the surface resistivity is less than or equal to 106 omega / sq, a composite matrix layer is arranged in the upper cover plate and is formed by blending 60-80 wt% of PC (polycarbonate) and 20-40 wt% of PET (polyethylene glycol terephthalate), the thickness of the composite matrix layer is 10-50 microns, and the surface resistivity of the composite matrix layer is less than or equal to 106 omega / sq. A conductive fiber layer is arranged in the upper cover plate, is embedded in the matrix layer and comprises carbon fibers with the diameter of 5-15 microns, and the fiber content is 3-8 vol%. Preferably, rectangular grooves are formed in the positions, close to the periphery, of the lower end of the upper cover plate. The upper cover for the IC tray is convenient to use and good in performance.

Description

Technical Field

[0001] This application relates to the technical field of upper covers for IC trays, and particularly to an upper cover for an IC tray. Background Art

[0002] As the core component of modern electronic devices, the protection of integrated circuits (ICs) during their production, transportation, and storage is crucial. IC chips are usually stored and transported in special trays to prevent physical damage and electrostatic breakdown. However, the existing upper covers of IC trays have the following problems in practical applications:

[0003] Insufficient positioning accuracy. The traditional positioning method between the upper cover and the tray relies on simple buckles or edge alignment, which is prone to position deviation due to external force collision or operation error, unable to ensure the precise alignment of the upper cover and the tray, and may cause the internal IC chips to be exposed or squeezed. Limited sealing performance. The sealing design at the edge of the existing upper cover mostly uses plane contact or simple rubber strips, which are difficult to effectively block pollutants such as dust and moisture from entering the inside of the tray. Especially in high humidity or dusty environments, the IC chips are vulnerable to oxidation, short circuit, and other damages.

[0004] Incomplete anti-static measures. Although some upper covers use anti-static materials, their structural designs are unreasonable, such as uneven material thickness and poor contact with the tray, resulting in poor electrostatic dissipation paths and still having the risk of chip breakdown caused by electrostatic accumulation. Those skilled in the art have provided an upper cover for an IC tray to solve the problems raised in the above background art. Summary of the Invention

[0005] To solve the problems raised in the above background art, this application provides an upper cover for an IC tray.

[0006] The upper cover for an IC tray provided by this application adopts the following technical solutions:

[0007] An upper cover for an IC tray includes a tray body, an upper cover plate is fitted above the tray body. Plug-ins are fixedly installed at the lower end of the upper cover plate near the four corners and on both sides of the middle. A groove is provided on one side of the plug-in. The outer surface of the upper cover plate is coated with a surface anti-static coating, and the anti-static coating covers the outer surface of the base layer, with a coating thickness of 10 - 50 μm and a surface resistivity ≤ 10^6 Ω / sq. A composite base layer is provided inside the upper cover plate, and the composite base layer is composed of a blend of polycarbonate PC and polyethylene terephthalate PET, where PC accounts for 60 - 80 wt% and PET accounts for 20 - 40 wt%. A conductive fiber layer is provided inside the upper cover plate, and the conductive fiber layer is embedded inside the base layer, including carbon fibers with a diameter of 5 - 15 μm and a fiber content of 3 - 8 vol%.

[0008] Preferably, rectangular grooves are formed near the periphery at the lower end of the upper cover plate, and a sponge pad is arranged inside the rectangular grooves.

[0009] Preferably, rubber gaskets are fixedly installed near the periphery at the upper end of the tray body, and the rubber gaskets are in snap-fit with the rectangular grooves.

[0010] Preferably, positioning grooves are formed at the upper end of the tray body near the four corners and on both sides in the middle, and the plug is in insertion fit with the positioning grooves.

[0011] Preferably, a rotating column is arranged on the outer side of the tray body, one end of the rotating column is connected with a screw rod, the screw rod penetrates through the inside of the tray body and is in threaded connection with the tray body.

[0012] Preferably, the screw rod penetrates through the inside of the positioning groove, and a fixing ring is fixedly installed on the outer part of the screw rod inside the positioning groove, and a snap ring is fixedly installed on the outer part of the fixing ring.

[0013] Preferably, the snap ring is in snap-fit with the groove.

[0014] In summary, the present application includes the following beneficial technical effects: through the arranged plug, after the plug and the positioning groove are in insertion fit, at this time, the upper cover plate is snap-fitted above the tray body, at this time, the rubber gasket is snap-fitted inside the rectangular groove, and the rubber gasket and the sponge pad inside the rectangular groove are mutually extruded to complete the sealing of the tray body, effectively blocking pollutants such as dust and moisture from entering the inside of the tray body, preventing the IC chip from oxidation, and improving the service life of the IC chip;

[0015] Through the arranged sponge pad, the sponge pad plays a good buffering role, preventing excessive stress when the upper cover plate is snap-fitted above the tray body and causing extrusion damage to the IC chip, and can also overlap and fit with the rubber gasket to prevent dust from entering the inside of the tray body;

[0016] Through the arranged rotating column, when the plug is inserted into the positioning groove, at this time, rotate the rotating column. Since the screw rod is in threaded connection with the tray body, at this time, the fixing ring is driven to rotate. The fixing ring is located inside the positioning groove. Furthermore, when the fixing ring rotates, the snap ring rotates, so that the snap ring is in snap-fit with the groove, preventing the upper cover plate from loosening, and it is more convenient when disassembling the upper cover plate to repair the IC chip above the tray body;

[0017] Through the arranged surface antistatic coating, surface antistatic coating and conductive fiber layer, the conductive fiber layer adopts Toray T700SC carbon fiber (diameter 7μm, volume content 5.5%), forming a continuous conductive path with a grid density of 25 - 40 meshes / mm², and the volume resistivity ≤ 1×10 4Ω·cm2. Adding nano-SiO2 (0.35 wt%) to the matrix improves the interfacial bonding strength. The fiber-matrix peeling force ≥ 18 N / mm1, and the surface charge dissipates dynamically. The antistatic coating contains PEDOT:PSS (2.2 wt%) and nano-zinc oxide (1.5 wt%). By the ion-electron dual conduction mechanism, the surface resistivity is stably controlled within the range of 10 6 -10 7 Ω / sq, and the attenuation rate is < 15% after 200 times of friction, greatly improving the performance of the upper cover plate. Description of the Drawings

[0018] Figure 1 is a schematic diagram of the overall structure of an upper cover for an IC tray in an embodiment of the present application;

[0019] Figure 2 is a schematic diagram of the plug-in structure of an upper cover for an IC tray in an embodiment of the present application;

[0020] Figure 3 is a schematic diagram of the upper cover plate structure of an upper cover for an IC tray in an embodiment of the present application;

[0021] Figure 4 is a schematic diagram of the screw structure of an upper cover for an IC tray in an embodiment of the present application.

[0022] Description of the reference numerals: 1, tray body; 2, upper cover plate; 3, positioning groove; 4, rubber gasket; 5, rotating column; 6, plug-in; 8, groove; 9, rectangular groove; 21, surface antistatic coating; 22, composite matrix layer; 23, conductive fiber layer; 10, screw; 11, fixing ring; 15, snap ring; 16, sponge pad. Detailed Description of the Embodiment

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the embodiments and the drawings.

[0024] Herein, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but not to limit the present invention.

[0025] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] It should be understood that the terms "comprising / including", "consisting of" or any other variant are intended to cover non-exclusive inclusion, such that a product, device, process or method comprising a series of elements not only includes those elements but also, when necessary, other elements not explicitly listed, or elements inherent to such product, device, process or method. Without further limitation, an element defined by the statement "comprising / including..." or "consisting of" does not exclude the presence of additional identical elements in the product, device, process or method comprising the said element.

[0027] It also needs to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device, component or structure referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation on the present invention.

[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more, unless otherwise specifically defined.

[0029] As Figures 1 - 4 shown, a top cover for an IC tray includes a tray body 1, a top cover plate 2 is fitted above the tray body 1, plug-ins 6 are fixedly installed at positions near the four corners and on both sides of the middle at the lower end of the top cover plate 2, a groove 8 is formed on one side of the plug-in 6, a surface antistatic coating 21 is applied on the outer surface of the top cover plate 2, the antistatic coating 21 covers the outer surface of the substrate layer, the coating thickness is 10 - 50 μm, and the surface resistivity ≤ 10^6 Ω / sq. A composite substrate layer 22 is provided inside the top cover plate 2, and the composite substrate layer 22 is composed of a blend of polycarbonate PC and polyethylene terephthalate PET, where the proportion of PC is 60 - 80 wt% and the proportion of PET is 20 - 40 wt%. A conductive fiber layer 23 is provided inside the top cover plate 2, and the conductive fiber layer 23 is embedded inside the substrate layer and contains carbon fibers with a diameter of 5 - 15 μm, and the fiber content is 3 - 8 vol%.

[0030] During use, through the provided plug 6, after the plug 6 is inserted and matched with the positioning groove 3, at this time, the upper cover plate 2 is clamped above the tray body 1. At this time, the rubber gasket 4 is clamped inside the rectangular groove 9, and the rubber gasket 4 and the sponge pad 16 inside the rectangular groove 9 are mutually extruded to complete the sealing of the tray body 1, effectively blocking pollutants such as dust and moisture from entering the inside of the tray body 1, preventing the oxidation of the IC chip, and improving the service life of the IC chip;

[0031] The conductive fiber layer 23 uses Toray T700SC carbon fiber (diameter 7μm, volume content 5.5%) to form a continuous conductive path with a grid density of 25 - 40 meshes / mm², and the volume resistivity ≤ 1×10 4 Ω·cm2.

[0032] In the composite matrix layer 22, nano-SiO2 (0.35wt%) is added to improve the interfacial bonding strength, and the fiber-matrix peel force ≥ 18N / mm1. The surface antistatic coating is a dynamic dissipation antistatic coating containing PEDOT:PSS (2.2wt%) and nano-zinc oxide (1.5wt%), and the surface resistivity is stably controlled in the range of 10 6 -10 7 Ω / sq by the ion-electron double conduction mechanism, and the attenuation rate is < 15% after 200 times of friction; The following data is obtained according to the experiment;

[0033] Performance indicators Test conditions Measured values Improvement compared to the traditional solution Surface potential decay rate ESDS4.1 - 2016, 25℃ / 50%RH Time taken for 500V → 100V < 0.5s 300% accelerated dissipation Electrostatic shielding effectiveness IEC61340 - 5 - 1, 1kHz - 1MHz ≥35dB 2.8 - fold improvement Environmental stability 100 cycles of - 40℃~85℃ Resistivity fluctuation < ±0.5log 40% improvement in temperature change resistance

[0034] In this embodiment, rectangular grooves 9 are provided near the periphery at the lower end of the upper cover plate 2, and a sponge pad 16 is arranged inside the rectangular grooves 9.

[0035] The sponge pad 16 plays a good buffering role, preventing excessive stress when the upper cover plate 2 is clamped above the tray body 1 and causing extrusion damage to the IC chip. It can also be overlapped and fitted with the rubber gasket 4 to prevent dust from entering the inside of the tray body 1.

[0036] In this embodiment, a rubber gasket 4 is fixedly installed near the periphery at the upper end of the tray body 1, and the rubber gasket 4 is inserted and matched with the rectangular groove 9.

[0037] In this embodiment, positioning grooves 3 are provided near the four corners and the two sides in the middle at the upper end of the tray body 1, and the plug 6 is inserted and matched with the positioning grooves 3.

[0038] In this embodiment, a rotating column 5 is arranged on the outside of the tray body 1, and one end of the rotating column 5 is connected with a screw rod 10. The screw rod 10 penetrates through the inside of the tray body 1 and is threadedly connected with the tray body 1.

[0039] In this embodiment, the screw rod 10 penetrates through the inside of the positioning groove 3, and a fixing ring 11 is fixedly installed inside the positioning groove 3 on the outside of the screw rod 10, and a snap ring 15 is fixedly installed on the outside of the fixing ring 11.

[0040] In this embodiment, the snap ring 15 is in snap-fit with the groove 8.

[0041] After the plug-in 6 is inserted into the positioning groove 3, at this time, the rotating column 5 is rotated. Since the screw rod 10 is threadedly connected to the tray body 1, the fixing ring 11 is driven to rotate at this time. The fixing ring 11 is located inside the positioning groove 3. Furthermore, while the fixing ring 11 is rotating, the snap ring 15 rotates, so that the snap ring 15 is engaged with the groove 8, preventing the upper cover plate 2 from loosening, and it is more convenient when disassembling the upper cover plate 2 to repair the IC chip above the tray body 1.

[0042] The implementation principle of an upper cover for an IC tray in an embodiment of the present application is as follows: during use, through the provided plug-in 6, after the plug-in 6 and the positioning groove 3 are inserted and matched, at this time, the upper cover plate 2 is snap-fitted above the tray body 1. At this time, the rubber gasket 4 is snap-fitted inside the rectangular groove 9, and the rubber gasket 4 and the sponge pad 16 inside the rectangular groove 9 are mutually pressed to complete the sealing of the tray body 1, effectively blocking pollutants such as dust and moisture from entering the inside of the tray body 1, preventing the oxidation of the IC chip, and improving the service life of the IC chip. The sponge pad 16 plays a good buffering role, preventing excessive stress when the upper cover plate 2 is snap-fitted above the tray body 1 and causing extrusion damage to the IC chip. It can also coincide with the rubber gasket 4 to prevent dust from entering the inside of the tray body 1. After the plug-in 6 is inserted into the positioning groove 3, at this time, the rotating column 5 is rotated. Since the screw rod 10 is threadedly connected to the tray body 1, the fixing ring 11 is driven to rotate at this time. The fixing ring 11 is located inside the positioning groove 3. Furthermore, while the fixing ring 11 is rotating, the snap ring 15 rotates, so that the snap ring 15 is engaged with the groove 8, preventing the upper cover plate 2 from loosening, and it is more convenient when disassembling the upper cover plate 2 to repair the IC chip above the tray body 1.

[0043] Finally, several points should be noted: First, in the description of the present application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. It can be a mechanical connection or an electrical connection, or it can be the communication inside two components. It can be directly connected. "Up", "down", "left", "right", etc. are only used to represent relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change;

[0044] Second: In the attached drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments of the present disclosure are involved. Other structures can refer to the general design. Without conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0045] Finally, the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An upper cover for an IC tray, comprising a tray body (1), and an upper cover plate (2) is fitted above the tray body (1), characterized in that: At the lower end of the upper cover plate (2), plugins (6) are fixedly installed near the four corners and on both sides in the middle. A groove (8) is formed on one side of the plugin (6). The outer surface of the upper cover plate (2) is coated with a surface antistatic coating (21), and the antistatic coating (21) covers the outer surface of the substrate layer. The coating thickness is 10 - 50 μm, and the surface resistivity ≤ 10^6 Ω / sq. A composite substrate layer (22) is arranged inside the upper cover plate (2), and the composite substrate layer (22) is composed of a blend of polycarbonate (PC) and polyethylene terephthalate (PET), where the proportion of PC is 60 - 80 wt% and the proportion of PET is 20 - 40 wt%. A conductive fiber layer (23) is arranged inside the upper cover plate (2), and the conductive fiber layer (23) is embedded inside the substrate layer, including carbon fibers with a diameter of 5 - 15 μm, and the fiber content is 3 - 8 vol%.

2. The upper cover for an IC tray according to claim 1, characterized in that: Rectangular grooves (9) are formed near the periphery at the lower end of the upper cover plate (2), and a sponge pad (16) is arranged inside the rectangular grooves (9).

3. The upper cover for an IC tray according to claim 1, wherein: Rubber sealing gaskets (4) are fixedly installed near the periphery at the upper end of the tray body (1), and the rubber sealing gaskets (4) are snap - fitted with the rectangular grooves (9).

4. The upper cover for an IC tray according to claim 1, characterized in that: Positioning grooves (3) are formed near the four corners and on both sides in the middle at the upper end of the tray body (1), and the plugins (6) are inserted and matched with the positioning grooves (3).

5. The upper cover for an IC tray according to claim 4, characterized in that: A rotating column (5) is arranged outside the tray body (1), and one end of the rotating column (5) is connected with a screw rod (10). The screw rod (10) penetrates through the inside of the tray body (1) and is thread - connected with the tray body (1).

6. The upper cover for an IC tray according to claim 5, characterized in that: The screw rod (10) penetrates through the inside of the positioning groove (3), and a fixing ring (11) is fixedly installed on the outside of the screw rod (10) inside the positioning groove (3). A snap ring (15) is fixedly installed on the outside of the fixing ring (11).

7. The upper cover for an IC tray according to claim 6, wherein: The snap ring (15) is snap - fitted with the groove (8).

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