Solvent-free fluid heat conduction material as well as preparation method and application thereof

Abstract

The invention relates to a solvent-free fluid heat conduction material as well as a preparation method and application thereof, and belongs to the technical field of heat conduction materials. The heat conduction material comprises a core material and a coronal layer grafted on the surface of the core material, the core material comprises a nanometer material inner core and a neck-shaped layer grafted on the surface of the nanometer material inner core; the nano-material core is a heat-conducting network constructed by at least one of a zero-dimensional high-heat-conductivity nano-material, a one-dimensional high-heat-conductivity nano-material and a two-dimensional high-heat-conductivity nano-material; the neck-shaped layer is an organosilane layer; and the coronal layer is a flexible polyether layer. According to the heat conduction material, a continuous heat conduction path is constructed through cooperation of the multi-dimensional high-heat-conduction nanometer inner core, the excellent heat conduction performance and heat stability are achieved, flowability and high interface bonding capacity are shown under the room temperature condition, the contact heat resistance between an electronic device and a radiator interface is effectively reduced, and the heat dissipation efficiency of a system is effectively improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of thermal conductive materials, and particularly relates to a solvent-free fluid thermal conductive material, a preparation method thereof, and an application thereof. Background Art

[0002] In today's era, the chip semiconductor and new energy vehicle industries are experiencing unprecedented rapid development. With the continuous progress of technology, electronic components tend to be high-power and highly integrated, accompanied by an increase in power density and energy consumption. During continuous operation, these electronic components generate a large amount of heat. If this heat cannot be dissipated in time, it is likely to accumulate in a limited space, resulting in a decrease in the working efficiency of the device and even serious problems such as thermal runaway. Against this background, the performance of heat dissipation materials has become a key factor in ensuring the stable operation of electronic devices. Excellent heat dissipation materials need to have excellent heat conduction capabilities to achieve rapid heat transfer; at the same time, they also need to have high reliability and safety to ensure that the temperature distribution of electronic components can be stably regulated under various working conditions and prevent local overheating. The research and application of high-performance heat dissipation materials are crucial for improving the thermal management efficiency of electronic devices. They can not only effectively improve the heat dissipation performance of the device but also extend the service life of the device, ensuring its stability and reliability during long-term operation.

[0003] In the heat transfer process from the heat source to the outside, heat needs to continuously pass through multiple solid-solid interfaces between the electronic components and the heat spreader, and between the heat spreader and the radiator. However, at the microscopic level, these contact interfaces are not flat, and only about 2% of the apparent contact area is composed of actual contact points, and the remaining gaps are filled with air. Therefore, the gap thermal conductivity is only about 0.02 W·m -1 ·K -1 . These air gaps significantly increase the interfacial contact thermal resistance, reduce the overall interfacial heat transfer efficiency, and seriously hinder the heat conduction process. Thermal interface materials can effectively fill these air gaps, form a continuous heat transfer path between the interfaces, and improve the heat dissipation efficiency.

[0004] Common thermal interface materials include thermal grease, thermal gel, thermal pad, phase change material, liquid metal, graphite sheet, etc., but there are still some problems in their comprehensive performance. The main problems include: low thermal conductivity, large interfacial thermal resistance, leakage, easy oxidation, corrosion, etc. Solvent-free fluids can construct heat conduction paths by mixing and filling multi-dimensional high-thermal-conductivity nano cores such as graphene sheets, boron nitride nanosheets, and silver nanowires. At the same time, the low viscosity and ultra-low modulus of the fluid itself greatly reduce the interfacial contact thermal resistance, and are expected to further improve the heat dissipation efficiency. However, there is currently no public report on multi-dimensional high-thermal-conductivity nano core-enhanced solvent-free fluids as thermal interface materials. Summary of the Invention

[0005] In view of the above problems, the present invention provides a solvent-free fluid thermal conductive material, a preparation method thereof, and an application thereof.

[0006] The first object of the present invention is achieved by the following technical solutions: A solvent-free fluid thermal conductive material includes a core material and a crown layer grafted on the surface of the core material; the core material includes a nanomaterial core and a neck layer grafted on the surface of the nanomaterial core; the nanomaterial core is a thermal conductive network constructed by at least one of zero-dimensional high-thermal-conductivity nanomaterials, one-dimensional high-thermal-conductivity nanomaterials, and two-dimensional high-thermal-conductivity nanomaterials; the neck layer is an organosilane layer; and the crown layer is a flexible polyether layer.

[0007] Further, the organosilane layer is formed by reacting a silane coupling agent on the surface of at least one of zero-dimensional high-thermal-conductivity nanomaterials, one-dimensional high-thermal-conductivity nanomaterials, and two-dimensional high-thermal-conductivity nanomaterials.

[0008] Further, the silane coupling agent is a silane coupling agent containing an active group A.

[0009] Further, the active group A is one or more of a quaternary ammonium salt structure, an epoxy group, a mercapto group, a double bond, a sulfonic acid group, an amino group, a hydroxyl group, a carboxyl group, and a phosphoric acid group.

[0010] Further, the active group A is a quaternary ammonium salt structure, and the corresponding silane coupling agent containing the active group A is one or several of 3-(trimethoxysilylpropyl)dimethylstearylammonium chloride, 3-triethoxysilylpropyltrimethylammonium chloride, N,N-didecyl-N-methyl-N-(3-trimethoxysilylpropyl)ammonium chloride, and tetradecyldimethyl(3-trimethoxysilylpropyl)ammonium chloride.

[0011] Further, the active group A is an epoxy group, and the corresponding silane coupling agent containing the active group A is γ-glycidoxypropyltrimethoxysilane.

[0012] Further, the active group A is a mercapto group, and the corresponding silane coupling agent containing the active group A is 3-mercaptopropyltrimethoxysilane.

[0013] Further, the active group A is a double bond, and the corresponding silane coupling agent containing the active group A is one or several of silane coupling agent KH-570, silane coupling agent A-150, and silane coupling agent A-171.

[0014] Further, the active group A is an amino group, and the corresponding silane coupling agent containing the active group A is one or several of silane coupling agent KH-550, silane coupling agent KH-792, and silane coupling agent KH-602.

[0015] Further, the active group A is a carboxyl group, and the carboxyl group can be introduced by the reaction of an amino silane coupling agent with an acid anhydride.

[0016] Further, the active group A is a hydroxyl group, and the hydroxyl group can be introduced by the ring-opening reaction of an amino silane coupling agent with an epoxy group.

[0017] Further, the active group A is a sulfonic acid group, and the corresponding silane coupling agent containing the active group A is 3-(trihydroxylsilyl)-propane sulfonic acid.

[0018] Further, the active group A is a phosphoric acid group, and the corresponding silane coupling agent containing the active group A is 3-(trihydroxylsilyl)propyl methyl phosphate.

[0019] Further, the active group A is a multi-active group, such as a combination of a double bond and an amino group, and the corresponding silane coupling agent containing the active group A is 3-(N-allylamino)propyltrimethoxysilane.

[0020] From the perspective of shortening the reaction route of the technical solution of the present invention, as a further solution of the technical solution of the present invention, the silane coupling agent containing the active group A is a commercially available silane coupling agent, such as γ-glycidoxypropyltrimethoxysilane, 3-(N-allylamino)propyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, silane coupling agent KH-550, silane coupling agent KH-792, silane coupling agent KH-602, silane coupling agent KH-570, silane coupling agent A-150, silane coupling agent A-171, etc.

[0021] Further, the flexible polyether layer is made by reacting a flexible polyether containing an active group B with the active group A in the organosilane layer.

[0022] Further, the active group B is one or more of a quaternary ammonium salt structure, an epoxy group, a mercapto group, a double bond, a sulfonic acid group, an amino group, a hydroxyl group, a carboxyl group, and a phosphoric acid group, and the active group B reacts with the active group A.

[0023] Further, the flexible polyether containing the active group B is at least one of polyetheramine M1000, polyetheramine M2070, polyetheramine T5000, polyoxyethylene octadecylamine, nonylphenol polyoxyethylene ether quaternary ammonium salt (NPEQ), nonylphenol polyoxyethylene ether sodium sulfate (NPES), nonylphenol polyoxyethylene ether potassium sulfonate-10 (NPES-10), and potassium salt of poly(ethylene glycol)-4-nonylphenyl-3-thiopropyl ether.

[0024] Further, the zero-dimensional highly thermally conductive nanomaterials are at least one of nanocopper, nanosilver, nanoaluminum, aluminum oxide, aluminum nitride, zinc oxide, magnesium oxide, silicon carbide, silicon nitride, diamond, boron nitride, carbon black, phase change microcapsules, and phase change nanocapsules.

[0025] Further, the one-dimensional highly thermally conductive nanomaterials are at least one of carbon nanotubes, carbon fibers, boron nitride whiskers, and nanosilver wires.

[0026] Further, the two-dimensional highly thermally conductive nanomaterials are at least one of graphene nanosheets, hexagonal boron nitride nanosheets, and MXene nanosheets.

[0027] The second object of the present invention is achieved by the following technical solutions: A preparation method of a solvent-free fluid thermal conductive material, comprising: Mixing the solution containing hydroxylated nanomaterials and the mixed solution X evenly, stirring at 25-45 °C for 6-12 h, and after post-treatment, obtaining a solvent-free fluid thermal conductive material; Wherein, the mixed solution X is made by mixing a silane coupling agent containing an active group A, a flexible polyether containing an active group B, and a second organic solvent; the solution containing hydroxylated nanomaterials is made by mixing a hydroxylated nanomaterial core and a first organic solvent.

[0028] Further, the mass ratio of the hydroxylated nanomaterials, the silane coupling agent containing an active group A, and the flexible polyether containing an active group B is 1-10:1-10:1-10.

[0029] Further, the first organic solvent and the second organic solvent are the same or mutually soluble.

[0030] Further, when the first organic solvent and the second organic solvent are the same, it is one of methanol, ethanol, isopropanol, acetonitrile, and tetrahydrofuran.

[0031] Further, when the first organic solvent and the second organic solvent are the same, they are both one of methanol, ethanol, isopropanol, acetonitrile, and tetrahydrofuran.

[0032] The second object of the present invention can also be achieved by the following technical solutions: A preparation method of a solvent-free fluid thermal conductive material, comprising: The hydroxylated nanomaterials and the silane coupling agent containing an active group A react to obtain a core material; After mixing the core material, the active group B, and a third organic solvent evenly, stirring at room temperature for 5-6 h, and after post-treatment, obtaining a solvent-free fluid thermal conductive material.

[0033] Further, the reaction conditions of the hydroxylated nanomaterial and the silane coupling agent containing the active group A are as follows: in a solution with water present, stirring reaction is carried out at a temperature of 20 - 80 °C for 6 - 24 h.

[0034] Further, the solution with water present further includes a solvent miscible with water, such as ethanol, tetrahydrofuran, isopropanol, and acetonitrile.

[0035] Further, the addition amount of water in the solution with water present is greater than or equal to the mass required for the hydrolysis of the silane coupling agent containing the active group A.

[0036] Further, the third organic solvent is one of chloroform, dichloromethane, tetrahydrofuran, ethylene glycol, polyethylene glycol, and dimethyl sulfoxide.

[0037] Further, the hydroxylated nanomaterial is obtained by treating the nanomaterial with a strong base solution, where the strong base solution is a well-known strong base solution in the technical field.

[0038] The third object of the present invention is to provide the application of the solvent-free fluid thermal conductive material in the fields of electronic information, aerospace thermal control, and advanced energy; The solvent-free fluid thermal conductive material is a thermal interface material and can be widely applied in the field of heat dissipation of electronic devices, that is, it can be applied in the fields of electronic information, aerospace thermal control, and advanced energy.

[0039] Advantages of the present invention: A solvent-free fluid thermal conductive material, its preparation method, and application of the present invention construct a continuous heat conduction path through multi-dimensional high-thermal-conductivity nano cores, and have excellent thermal conductivity and thermal stability.

[0040] The solvent-free fluid thermal conductive material of the present invention shows fluidity and high interface bonding ability at room temperature, effectively reduces the contact thermal resistance between the interface of the electronic device and the radiator, and effectively improves the system heat dissipation efficiency.

[0041] Other features and advantages of the present invention will be described in the subsequent specification, and part of them will be obvious from the specification, or will be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the structures pointed out in the specification and the drawings. Description of the Drawings

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0043] Figure 1 Shows a schematic process diagram for preparing a solvent-free fluid thermal conductive material according to an embodiment of the present invention: Figure 1 In a, it shows a schematic process diagram for obtaining a solvent-free fluid thermal conductive material from three cores of zero-dimensional highly thermally conductive nanomaterials, one-dimensional highly thermally conductive nanomaterials, and two-dimensional highly thermally conductive nanomaterials; Figure 1 In b, it shows a schematic process diagram for obtaining a solvent-free fluid thermal conductive material from zero-dimensional highly thermally conductive nanomaterials; Figure 2 is Figure 1 An enlarged view of compound I in b; Figure 3 is Figure 1 An enlarged view of compound II in b; Figure 4 Shows a macroscopic photograph of the solvent-free fluid thermal conductive material obtained in Example 1 of the present invention; Figure 5 Shows a surface picture of the solvent-free fluid thermal conductive material obtained in Example 1 of the present invention observed under an optical microscope; Figure 6 Shows a schematic diagram of the application scenario of the solvent-free fluid thermal conductive material according to an embodiment of the present invention. Detailed implementation manners

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0045] As Figure 1 shown in a, the preparation method of the solvent-free fluid thermal conductive material according to an embodiment of the present invention includes subjecting three cores of zero-dimensional highly thermally conductive nanomaterials, one-dimensional highly thermally conductive nanomaterials, and two-dimensional highly thermally conductive nanomaterials to hydroxylation respectively to obtain hydroxylated zero-dimensional highly thermally conductive nanomaterials, one-dimensional highly thermally conductive nanomaterials, and two-dimensional highly thermally conductive nanomaterials; Then, the hydroxylated zero-dimensional highly thermally conductive nanomaterials, one-dimensional highly thermally conductive nanomaterials, and two-dimensional highly thermally conductive nanomaterials react with a silane coupling agent (a silane coupling agent containing an A active group in the embodiment of the present invention) respectively to obtain core materials, and the core materials react with a flexible polyether (a flexible polyether containing a B active group in the embodiment of the present invention) to obtain a solvent-free fluid thermal conductive material.

[0046] Among them, Figure 1Figure b shows one of the example diagrams of adding specific raw materials in the process of obtaining a solvent-free fluid thermal conductive material from zero-dimensional high thermal conductivity nanomaterials.

[0047] Figure 1 The enlarged view of Compound I in Figure b is as Figure 2 shown, Figure 1 The enlarged view of Compound II in Figure b is as Figure 3 shown.

[0048] Example 1 The preparation method of the solvent-free fluid thermal conductive material of this example includes the following steps: S1: Weigh 2 g of graphene nanosheets and add them to 20 mL of 2 mol / L sodium hydroxide solution. Then, at 120 °C, while heating and stirring, make the graphene nanosheets react fully with sodium hydroxide for 18 h. After the reaction ends, cool to room temperature, pour the reaction mixture into a large amount of clear water for dilution, and wash it multiple times until the pH of the solution after washing is neutral. Put the washed product into a vacuum drying oven and dry it at 80 °C to obtain hydroxylated mixed powder; S2: Weigh 0.2 g of the hydroxylated mixed powder, disperse it in 200 mL of deionized water, and ultrasonically disperse it for 30 min. Then, while stirring, dropwise add 7 mL of 40 wt.% 3-(trimethoxysilylpropyl) dimethyloctadecylammonium chloride (DC5700) methanol solution, and stir and react at room temperature for 24 h. After washing and dialysis, dry it at 70 °C for 48 h to obtain (BNNS / Al2O3)@DC5700 (i.e., the core material).

[0049] S3: Dissolve and disperse 1 g of (BNNS / Al2O3)@DC5700 in 100 mL of chloroform, continuously stir for 0.5 h, and place it in an ultrasonic cleaner to disperse it evenly. Add 2 g of nonylphenol polyoxyethylene ether quaternary ammonium salt (NPEQ), stir at room temperature for 5 h, remove the remaining impurities in the liquid by dialysis, and then dry it at 70 °C for 24 h to obtain the solvent-free fluid thermal conductive material. The experimental test results show that the thermal conductivity of this solvent-free fluid thermal conductive material is 0.41 W·m -1 ·K -1 .

[0050] Figure 4 and Figure 5 respectively show the macroscopic picture and the surface picture observed by optical microscope of the thermal conductive material obtained in this example at room temperature; From Figure 4 it can be seen that the thermal conductive material obtained in this example shows fluidity at room temperature.

[0051] From Figure 5As can be seen, the thermal conductive material obtained in the embodiment of the present invention exhibits good interfacial bonding ability.

[0052] Example 2 The preparation method of the solvent-free fluid thermal conductive material of this embodiment includes the following steps: S1: Weigh 1 g of graphene nanosheets and 1 g of carbon nanotubes, add them to 20 mL of 2 mol / L sodium hydroxide solution, and then stir while heating at 120 °C to allow graphene and carbon nanotubes to fully react with sodium hydroxide for 18 h. Cool to room temperature, pour the reaction mixture into a large amount of clear water for dilution, and wash multiple times until the pH of the solution after washing is neutral. Put the washed product into a vacuum drying oven and dry it at 80 °C to obtain hydroxylated mixed powder; S2: Add 0.55 g of silane coupling agent KH560 and 5 g of polyetheramine M2070 to 70 mL of methanol solution (10% - 20%), and mechanically stir at a reaction temperature of 45 °C for 12 h to obtain a reaction mixture solution. Weigh 0.5 g of hydroxylated mixed powder, disperse it in 50 mL of methanol solution, and add it to the reaction mixture solution. Continue to stir at 45 °C for 6 h, cool to room temperature, dialyze in distilled water for 12 h to remove unreacted silane coupling agent and polyetheramine, and rotary evaporate to remove the solvent, then vacuum dry at 60 °C until solvent-free to obtain a solvent-free fluid thermal conductive material. The results show that the thermal conductivity of this solvent-free fluid thermal conductive material is 0.38 W·m -1 ·K -1 .

[0053] Example 3 The preparation method of the solvent-free fluid thermal conductive material of this embodiment includes the following steps: S1: Weigh 1 g of alumina particles, 1 g of boron nitride nanosheets and 1 g of boron nitride nanowhiskers, add them to 30 mL of 2 mol / L sodium hydroxide solution, and then stir while heating at 120 °C to allow boron nitride and alumina to fully react with sodium hydroxide for 18 h. After the reaction ends, cool to room temperature, pour the reaction mixture into a large amount of clear water for dilution, and then wash multiple times until the pH of the solution after washing is neutral. Dry the washed product at 80 °C to obtain hydroxylated mixed powder; S2: Weigh 0.3 g of hydroxylated mixed powder, disperse it in 250 mL of deionized water, ultrasonically disperse for 30 min, and then dropwise add 10 mL of 40 wt.% 3-(trimethoxysilylpropyl) dimethyloctadecylammonium chloride (DC5700) methanol solution under stirring. Stir and react at room temperature for 24 h, then after washing and dialysis, dry at 70 °C for 48 h to obtain (Al2O3 / BNNS / BNNW)@DC5700 (i.e., the core material).

[0054] S3: Dissolve and disperse 1 g of (Al2O3 / BNNS / BNNW)@DC5700 in 100 mL of chloroform, continuously stir for 0.5 h, and place it in an ultrasonic cleaner to disperse evenly. Then add 2 g of sodium nonylphenol polyoxyethylene ether sulfate (NPES) and stir at room temperature for 5 h. Finally, dialyze to remove the remaining impurities in the liquid. Dry it in a vacuum drying oven at 70 °C for 24 h to obtain a solvent-free fluid thermal conductive material.

[0055] As Figure 6 shown, apply this solvent-free fluid thermal conductive material to the LED and chip heat dissipation systems, and observe the temperature changes during the operation of the device through infrared thermal imaging, thermocouples, and data loggers to expand the actual thermal management application scenarios of this material.

[0056] Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A solvent-free fluid heat-conducting material, characterized in that, It includes a core material and a corona layer grafted on the surface of the core material; the core material includes a nanomaterial core and a neck-like layer grafted on the surface of the nanomaterial core; the nanomaterial core is a heat conduction network constructed by at least one of zero-dimensional high-heat-conductivity nanomaterials, one-dimensional high-heat-conductivity nanomaterials, and two-dimensional high-heat-conductivity nanomaterials; the neck-like layer is a silane layer; the corona layer is a flexible polyether layer.

2. The solvent-free fluid heat-conducting material according to claim 1, wherein The silane layer is made by reacting a silane coupling agent on the surface of at least one of zero-dimensional high-heat-conductivity nanomaterials, one-dimensional high-heat-conductivity nanomaterials, and two-dimensional high-heat-conductivity nanomaterials; the silane coupling agent is a silane coupling agent containing an active group A.

3. The solvent-free fluid heat-conducting material according to claim 2, wherein The active group A is one or more of a quaternary ammonium salt structure, an epoxy group, a mercapto group, a double bond, a sulfonic acid group, an amino group, a hydroxyl group, a carboxyl group, and a phosphate group structure.

4. The solvent-free fluid heat-conducting material according to claim 3, characterized in that, The silane coupling agent containing an active group A is at least one of γ-glycidyl ether oxypropyltrimethoxysilane, 3-(N-allylamino)propyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-(trimethoxysilylpropyl)dimethyl octadecyl ammonium chloride, 3-triethoxysilylpropyltrimethyl ammonium chloride, N,N-didecyl-N-methyl-N-(3-trimethoxysilylpropyl) ammonium chloride, tetradecyldimethyl(3-trimethoxysilylpropyl) ammonium chloride, 3-(trihydroxysilyl)-propane sulfonic acid, and 3-(trihydroxysilyl)propyl methyl phosphate.

5. The solvent-free fluid heat-conducting material according to claim 1, wherein, The flexible polyether layer is made by reacting a flexible polyether containing an active group B with the active group A in the silane layer.

6. The solvent-free fluid heat-conducting material according to claim 5, wherein The active group B is one or more of a quaternary ammonium salt structure, an epoxy group, a mercapto group, a double bond, a sulfonic acid group, an amino group, a hydroxyl group, a carboxyl group, and a phosphate group, and the active group B reacts with the active group A.

7. The solvent-free fluid heat-conducting material according to claim 6, wherein The flexible polyether containing an active group B is at least one of polyetheramine M1000, polyetheramine M2070, polyetheramine T5000, polyoxyethylene octadecylamine, nonylphenol polyoxyethylene ether quaternary ammonium salt, nonylphenol polyoxyethylene ether sodium sulfate, nonylphenol polyoxyethylene ether potassium sulfonate-10, and poly(ethylene glycol)-4-nonylphenyl-3-thiopropyl ether potassium salt.

8. The solvent-free fluid thermal conductive material according to any one of claims 1-7, characterized in that, The zero-dimensional high-heat-conductivity nanomaterial is at least one of nanocopper, nanosilver, nanoaluminum, alumina, aluminum nitride, zinc oxide, magnesium oxide, silicon carbide, silicon nitride, diamond, boron nitride, carbon black, phase change microcapsules, and phase change nanocapsules.

9. The solvent-free fluid heat-conducting material according to claim 1, wherein The one-dimensional high-heat-conductivity nanomaterial is at least one of carbon nanotubes, carbon fibers, boron nitride whiskers, and nanosilver wires.

10. The solvent-free fluid heat-conducting material according to claim 1, characterized in that, The two-dimensional high-heat-conductivity nanomaterial is at least one of graphene nanosheets, hexagonal boron nitride nanosheets, and MXene nanosheets.

11. The preparation method of the solvent-free fluid heat-conducting material according to any one of claims 1-10, characterized in that, It includes: Mix the solution containing hydroxylated nanomaterials and the mixed solution X evenly, stir at 25~45 °C for 6~12 h, and after post-treatment, a solvent-free fluid heat conduction material is obtained; Among them, the mixed solution X is made by mixing a silane coupling agent containing an active group A, a flexible polyether containing an active group B, and a second organic solvent; the solution containing hydroxylated nanomaterials is made by mixing a hydroxylated nanomaterial core and a first organic solvent.

12. The preparation method of the solvent-free fluid heat-conducting material according to claim 11, characterized in that, The mass ratio of the hydroxylated nanomaterial, the silane coupling agent containing reactive group A, and the flexible polyether containing reactive group B is 1 to 10: 1 to 10: 1 to 10.

13. The preparation method of the solvent-free fluid heat-conducting material according to any one of claims 1-10, characterized in that, It includes: The hydroxylated nanomaterial and the silane coupling agent containing reactive group A react to obtain a core material; The core material, the reactive group B, and a third organic solvent are mixed evenly, stirred at room temperature for 5 to 6 hours, and post-treated to obtain a solvent-free fluid thermal conductive material.

14. Application of the solvent-free fluid thermal conductive material according to any one of claims 1-10 in the fields of electronic information, aerospace thermal control, and advanced energy.

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