PECVD (Plasma Enhanced Chemical Vapor Deposition) vacuum coating equipment and cooling method of vacuum coating chamber

Abstract

The invention belongs to the technical field of semiconductor equipment cooling, and particularly relates to PECVD (Plasma Enhanced Chemical Vapor Deposition) vacuum coating equipment and a cooling method of a vacuum coating chamber, a gas inlet valve is opened, so that heat conduction gas is introduced into the chamber, the gas pressure value in the chamber is controlled to be 500-800pa, the heat conduction gas in the pressure range is used for cooling the chamber, and the temperature of the chamber is reduced. Compared with a natural water cooling mode, the cooling speed can be rapidly increased, the cooling method does not need to be provided with a corresponding water cooling system, equipment cost can be saved, heat conduction gas does not need to be continuously introduced, and operation is easy; furthermore, different temperatures in the cavity correspond to different pressures, so that the cavity pressures at different temperatures can be matched more accurately, and the cost and the cooling rate are both considered.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment cooling, and particularly relates to a cooling method for a PECVD vacuum coating equipment and a vacuum coating chamber. Background Art

[0002] The process chamber of a PECVD vacuum coating equipment is generally made of opaque metal material with good airtightness. The interior of the chamber is mainly composed of an upper plate and a lower plate. The gas inlet is located on the upper plate, and the upper and lower plates are parallel. The lower plate serves as the main heater inside the chamber. The chamber structure diagram is as Figure 1 shown. The temperature inside this vacuum reaction chamber is generally relatively high and the cooling rate is slow. Once an abnormality occurs inside the chamber, it is first necessary to cool down the chamber. During the cooling process, if the chamber is directly opened to handle the abnormality at high temperature, exposing the chamber to the air instantly, the upper plate is made of metal material with a large area. The rapid heating and cooling affect the flatness of the plate. There are ceramic blocks and quartz stoppers sealed around the upper plate. The rapid cooling temperature difference may cause damage, affecting the uniformity of the gas distribution inside the chamber and the coating effect. For the metal bellows of the lifting mechanism of the lower plate, rapid cooling during decompression may cause metal deformation, resulting in damage and air leakage of the bellows. Therefore, the chamber cannot be directly opened at high temperature, and the actual temperature inside the chamber needs to be cooled down to below 100 °C before opening the chamber.

[0003] Currently, the existing cooling methods for plate-type PECVD vacuum chambers are as follows: 1. Cooling the equipment by introducing cooling water. Disadvantage: Special design of the chamber structure is required, and the cost is relatively high; 2. Continuously introducing a gas with a large thermal conductivity (such as hydrogen) into the chamber for purging and cooling. The disadvantage of this technology is that a large amount of gas is required, and the cost is relatively high; 3. Closing the heating and naturally cooling. The disadvantage is that a long waiting time is required, resulting in waste of production capacity. Therefore, it is necessary to design a cooling method that can achieve rapid cooling of the plate-type PECVD vacuum reaction chamber and has a low cost.

[0004] It should be noted that this part of the content of the present invention only provides the background technology related to the present invention, and does not necessarily constitute the prior art or the well-known technology. Summary of the Invention

[0005] The purpose of the present invention is to provide a cooling method for a PECVD vacuum coating equipment and a vacuum coating chamber, so as to overcome the technical problems of slow cooling speed and high cost of the existing PECVD vacuum coating chamber.

[0006] To achieve the above object, in a first aspect, the present invention provides a method for cooling a PECVD vacuum coating chamber. The PECVD vacuum coating chamber includes a cavity, an upper electrode plate and a lower electrode plate located inside the cavity. The lower electrode plate is used for heating the inside of the cavity. A pressure detection component for detecting the air pressure and a temperature detection component for detecting the temperature are arranged inside the cavity. The cooling method includes: S100, open the intake valve so that the heat-conducting gas is introduced into the cavity; S200, when it is detected that the air pressure inside the cavity reaches 500 Pa to 800 Pa, close the vacuum system and the intake valve to keep the cavity in a sealed state; S300, after the cavity drops to the required temperature, control the vacuum system to be turned on to evacuate the gas in the cavity.

[0007] Optionally, between S200 and S300, it further includes: Obtain the temperature of the cavity, and gradually turn on the vacuum system according to the chamber temperature to reduce the cavity pressure; When it is detected that the temperature inside the cavity is 151 - 210 °C, control the air pressure value inside the cavity to be 501 - 600 Pa; When it is detected that the temperature inside the cavity is 121 - 150 °C, control the air pressure value inside the cavity to be 401 - 500 Pa; When it is detected that the temperature inside the cavity is 100 - 120 °C, control the air pressure value inside the cavity to be 300 - 400 Pa.

[0008] Optionally, the heat-conducting gas is hydrogen, nitrogen or argon.

[0009] In a second aspect, the present invention further provides a PECVD vacuum coating device, including: a PECVD vacuum coating chamber and a control module; the PECVD vacuum coating chamber includes: a cavity, an intake channel arranged at the top of the cavity and an exhaust channel arranged at the bottom of the cavity. In the intake channel and the exhaust channel, an intake valve is arranged in the intake channel, and the exhaust channel is connected to the vacuum system; a temperature detection component and a pressure detection component are arranged inside the cavity; the control module is electrically connected to the intake valve, the vacuum system, the temperature detection component and the pressure detection component respectively, and is used to execute the cooling method of the PECVD vacuum coating chamber as described in the first aspect.

[0010] Optionally, the PECVD vacuum coating device further includes: a lifting mechanism; the lifting mechanism is connected to the bottom of the lower electrode plate and is used to drive the lower electrode plate to rise or fall to adjust the distance between the upper electrode plate and the lower electrode plate. Optionally, the PECVD vacuum coating device further includes: a metal bellows; the metal bellows surrounds the periphery of the lifting mechanism, is used for buffering the lifting mechanism, and assisting the lifting mechanism to move upward in a vacuum state.

[0011] Optionally, an upper electrode plate and a lower electrode plate are arranged in the cavity, the upper electrode plate is located at the top of the cavity, the lower electrode plate is located at the bottom of the cavity, ceramic blocks are arranged on the edge of the side of the upper electrode plate facing the lower electrode plate, and the lower electrode plate is used for heating the interior of the cavity.

[0012] Optionally, a flow detection component is arranged at the inlet of the air inlet channel, and the flow detection component is used for detecting the gas flow rate entering the cavity.

[0013] Optionally, the air inlet channel and the exhaust channel are arranged in a vertically offset manner.

[0014] The embodiments of the present invention at least have the following technical effects: The PECVD vacuum coating device and the cooling method of the vacuum coating chamber provided by the embodiments of the present invention first set the pressure in the chamber to 500 Pa to 800 Pa, then introduce a preset flow rate of heat-conducting gas, and let the introduced heat-conducting gas remain in the chamber to maintain the set pressure. The heat-conducting gas in this pressure range is used to cool the chamber. By introducing the gas, the heat-conducting gas conducts and convects in the chamber, fully exchanges heat with the interior of the chamber, and can play a role in quickly cooling within a certain period of time. Compared with the natural water-cooling cooling method, the cooling speed can be rapidly increased, and this cooling method does not require setting a corresponding water-cooling system, which is beneficial to saving equipment costs; further, by corresponding different temperatures in the cavity to different pressures, it is possible to be more accurate. Description of the Drawings

[0015] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a schematic structural diagram of a PECVD vacuum coating device provided by an embodiment of the present invention; Figure 2 It is a flowchart of the cooling method of the vacuum coating chamber provided by an embodiment of the present invention; Figure 3 It is a schematic diagram of the corresponding relationship between air pressure and cooling speed in the cooling method of the vacuum coating chamber provided by an embodiment of the present invention.

[0017] In the figure: 100 - Cavity; 200 - Intake channel; 300 - Exhaust channel; 400 - Intake valve; 500 - Vacuum system; 600 - Upper electrode plate; 700 - Ceramic block; 800 - Lower electrode plate; 900 - Lifting mechanism; 1000 - Metal bellows. Specific embodiments

[0018] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0019] Those skilled in the art of the present technology can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as the general understanding of those of ordinary skill in the technical field to which the present invention belongs. It should also be understood that terms such as those defined in a general dictionary should be understood to have a meaning consistent with the meaning in the context of the prior art, and will not be interpreted in an idealized or overly formal sense unless specifically defined as here.

[0020] Those skilled in the art of the present technology can understand that, unless specifically stated, the singular forms "a", "an", "the" and "said" used herein may also include the plural forms. It should be further understood that the term "including" used in the specification of the present invention means the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or their groups. The phrase "and / or" used herein includes all or any unit and all combinations of one or more of the associated listed items.

[0021] As Figure 1 shown, an embodiment of the present invention provides a PECVD vacuum coating device, including: a PECVD vacuum coating chamber and a control module. Among them, the PECVD vacuum coating chamber specifically includes: a cavity, an intake channel and an exhaust channel. The intake channel is arranged at the top of the cavity, and the exhaust channel is arranged at the bottom of the cavity. An intake valve and a flow detection component are arranged in the intake channel. The intake valve is used to control the opening and closing of the entire intake channel, and the flow detection component is located at the entrance of the intake channel and is used to detect the gas flow entering the chamber. The exhaust channel is connected to the vacuum system, and when the vacuum system is started, the gas in the chamber can be discharged to the outside of the chamber through the exhaust channel.

[0022] A temperature detection component and a pressure detection component are arranged in the cavity. The temperature detection component is used to detect the temperature condition in the cavity, and the pressure detection component is used to detect the pressure condition in the cavity. For example, to detect whether the pressure in the cavity meets the vacuum degree requirement, the pressure detection component can be a vacuum gauge. The control module is electrically connected to the intake valve, the vacuum system, the temperature detection component, and the pressure detection component respectively, and is used to execute the cooling method of the PECVD vacuum coating chamber.

[0023] Optionally, the PECVD vacuum coating equipment further includes: a lifting mechanism; the lifting mechanism is connected to the bottom of the lower plate and is used to drive the lower plate to rise or fall, so as to adjust the distance between the upper plate and the lower plate, thereby adjusting the space and temperature in the reaction cavity. Optionally, the PECVD vacuum coating equipment further includes: a metal bellows; the metal bellows surrounds the periphery of the lifting mechanism and is used to buffer the lifting mechanism and assist the lifting mechanism to move upward under vacuum conditions, that is, when the lifting mechanism descends, the metal bellows can play a certain buffering role.

[0024] Optionally, an upper plate and a lower plate are arranged in the cavity. The upper plate is located at the top of the cavity, and the lower plate is located at the bottom of the cavity. The lower plate is used to heat the inside of the cavity. Ceramic blocks are arranged on the edge of the side of the upper plate facing the lower plate. The ceramic blocks are located around the upper plate. By arranging the ceramic blocks, the gas introduced into the upper plate can be more evenly distributed in the coating area, which is beneficial to improving the coating uniformity.

[0025] In some embodiments, continue to refer to Figure 1 , the intake channel and the exhaust channel are arranged in a staggered manner in the vertical direction, that is, the intake channel is located at the middle position at the top of the cavity (the intake channel is connected to the upper plate, and a plurality of small holes are evenly distributed on the upper plate, and the gas flows into the cavity evenly through the small holes), and the exhaust channel is located at the edge position at the bottom of the cavity. On the one hand, this is to avoid the lifting mechanism, and on the other hand, the air flow discharged from the edge can avoid the shielding of the electrode plate, which is beneficial to increasing the exhaust efficiency.

[0026] Optionally, the exhaust channels can be evenly distributed around the bottom of the cavity, which is beneficial to improving the exhaust uniformity and exhaust efficiency.

[0027] As Figure 2 shown, the present invention provides a cooling method for a PECVD vacuum coating chamber. The cooling method is based on the PECVD vacuum coating chamber described in the foregoing embodiments. The cooling method includes the following steps: S100, open the intake valve so that the heat-conducting gas is introduced into the cavity.

[0028] Specifically, first close the exhaust passage, then open the intake valve of the intake passage, and adjust the intake flow rate by controlling the opening degree of the flow control valve so that the heat-conducting gas can quickly enter the cavity.

[0029] S200. When it is detected that the air pressure inside the cavity reaches 500 Pa to 800 Pa, turn off the vacuum system and the intake valve to keep the cavity in a sealed state.

[0030] Specifically, since the air pressure inside the cavity will change after the heat-conducting gas is introduced, it is necessary to monitor the air pressure inside the cavity through the air pressure detection component until it reaches the set range of 500 Pa to 800 Pa, and then turn off the vacuum system and the intake valve.

[0031] S300. After the cavity drops to the required temperature, control the vacuum system to start to evacuate the gas in the cavity.

[0032] Specifically, when the temperature detection component detects that the temperature inside the cavity drops to the set temperature (for example, 100 °C), the vacuum system can be controlled to start, so as to extract the remaining gas in the cavity and wait for the preparation of the process film layer in the next cycle.

[0033] Optionally, in S200 and S300, keeping the pressure in the cavity at the set value includes: Obtain the temperature of the cavity, and gradually turn on the vacuum system according to the chamber temperature to reduce the cavity pressure.

[0034] Adjust the air pressure value inside the cavity according to the temperature inside the cavity. When the initial temperature is higher, the corresponding pressure value is also controlled within a higher pressure range. In the later stage of temperature reduction, since the temperature has almost dropped to the preset value, the air pressure value can be controlled within a lower pressure range, so as to set corresponding air pressure ranges for different temperatures.

[0035] Specifically, when the temperature inside the cavity is 151 - 200 °C, control the air pressure value inside the cavity to be 501 - 600 Pa. When the temperature inside the cavity is 121 - 150 °C, control the air pressure value inside the cavity to be 401 - 500 Pa. When the temperature inside the cavity is 100 - 120 °C, control the air pressure value inside the cavity to be 300 - 400 Pa. It should be noted that at a relatively high temperature, setting a relatively high air pressure within a certain range can accelerate the cooling rate. When the temperature drops to a certain level, the gas in the chamber has reached a certain temperature due to heat conduction. The gas in the chamber can be evacuated, and then gas with a certain air pressure value can be introduced again to achieve cooling. When the temperature inside the chamber drops to a certain extent, the cooling rate will decrease. By comparing the cooling rates at different air pressures, it is found that at 100°C - 150°C, the difference in cooling rates between 400 Pa and 600 Pa air pressures is not significant. Therefore, a lower air pressure can be selected at a lower temperature, which can reduce the amount of gas introduced.

[0036] Optionally, the flux of the heat-conducting gas is set to 10 L / min - 100 L / min. The flux in the embodiments of the present invention is set according to the equipment conditions of the existing experimental machines. Setting this flux range can reach the required air pressure in a relatively short time and at the same time be within the optimal usage range of the gas flowmeter (20% - 80% of the range). The specific flux can be adjusted according to the gas flowmeter on the equipment.

[0037] Optionally, the heat-conducting gas is hydrogen, nitrogen, or argon. These gases have good heat-conducting properties and can improve the heating rate.

[0038] The PECVD vacuum coating equipment and the cooling method of the vacuum coating chamber provided by the embodiments of the present invention first set the pressure in the chamber to 500 Pa - 800 Pa, then introduce a heat-conducting gas with a preset flow rate, and let the introduced heat-conducting gas remain in the chamber to maintain the set pressure. The heat-conducting gas in this pressure range is used to cool the chamber. By introducing the gas, the heat-conducting gas conducts and convects in the chamber, fully exchanging heat with the inside of the chamber, and can play a role in quickly cooling within a certain time. Compared with the natural water-cooling cooling method, the cooling rate can be quickly increased, and this cooling method does not require setting a corresponding water-cooling system, which is beneficial to saving equipment costs; further, by corresponding different pressures to different temperatures inside the chamber, it can be made more precise.

[0039] In a specific embodiment, a cooling method for a PECVD vacuum coating chamber includes the following steps: (1)First, turn off the heating system of the PECVD vacuum coating equipment. Through the control module, set the flux of the flow detection component of the reaction gas (hydrogen) to 10 L to 100 L / min. The specific flux can be adjusted according to the gas flowmeter on the equipment. Open the intake valve and introduce hydrogen into the chamber. For the set value of air pressure, conduct a comparative verification of the temperature reduction rates at different air pressure values. Compare the temperature reduction rates at different air pressures within 5 minutes. The temperature reduction effect below 200 Pa is poor, and the temperature drops by 1.3 °C to 1.4 °C; when the pressure is between 300 and 600 Pa, the temperature drops by 1.6 °C to 1.7 °C; under the condition of 700 to 1000 Pa, the temperature drops by 1.6 °C, and the temperature reduction rates are basically the same, but more gas is required. Therefore, in the embodiment of the present invention, the interval of 300 to 600 Pa is selected as the preferred condition for temperature reduction, and the corresponding relationship between air pressure and temperature reduction rate is as Figure 3 shown.

[0040] (2)When the vacuum gauge shows that the internal air pressure of the chamber reaches the set value, the vacuum system of the equipment can be turned off to keep the chamber of the equipment airtight. Set the flux of the hydrogen flowmeter to 0 L / min, and there is no need to introduce hydrogen into the chamber anymore.

[0041] (3)Let the introduced hydrogen remain in the chamber to maintain the set pressure. Specifically, maintaining the set pressure can be fixed at a certain pressure value or within a certain pressure range. Of course, in order to balance cost and temperature reduction rate, as the temperature drops, the gas pressure in the chamber can also be appropriately reduced.

[0042] (4)After the chamber drops to the required temperature, restart the vacuum system to evacuate the gas in the chamber. This temperature reduction method can achieve rapid temperature reduction for the plate-type PEVCD vacuum airtight chamber, reduce the waiting time, improve the production efficiency of the enterprise, and the method is simple. There is no need to transform the original equipment with a water cooling system, etc., which is beneficial to cost control.

[0043] Compared with the existing natural cooling method, the temperature reduction method provided by the embodiment of the present invention, on the one hand, does not need to design the equipment structure with a water cooling system, saving equipment costs; on the other hand, it can reduce the cooling waiting time by about half without water cooling. The cooling method adopted in the present invention has an average temperature reduction of 5 °C to 6 °C per hour, and the experimental data are shown in Table 1 and Table 2. Using the method of the present invention, the temperature can be reduced by about 20 °C in the fastest one hour, and the average temperature reduction is 12 °C to 14 °C per hour, which is beneficial to improving the temperature reduction efficiency and thus reducing the waste of production capacity during the production process.

[0044] Table 1 Monitoring data during the temperature reduction process

[0045] Table 2 Time required for different temperature reduction methods at the same temperature

[0046] In addition, compared with the method of continuously purging and cooling with gas, the cooling method of the embodiment of the present invention can achieve the same cooling effect, and can greatly reduce the gas waste caused during purging; when using the method of purging with a cooling gas (such as H2), the gas flux is set to 10 L per minute, that is, 60 * 10 = 600 L of gas is required per hour. The cooling method provided by the present invention is set to introduce gas of 300 Pa to 600 Pa into the sealed chamber, and the flux is set in the range of 10 L to 100 L per minute. The set air pressure can be reached within one minute, only 10 L of gas is required, and there is no need to replace the gas. If the chamber needs to be cooled by 100 °C, that is, continuous purging takes about 7 hours and 4200 L of gas is required. That is, within the same cooling time, the cooling method provided by the embodiment of the present invention can save at least 4000 L of gas.

[0047] The embodiments of the present invention will be described in detail below. They are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0048] Embodiment 1 As Figure 1 shown, the present invention provides a method for cooling a PECVD vacuum coating chamber, including: S100, open the intake valve so that the heat-conducting gas is introduced into the chamber.

[0049] S200, when it is detected that the air pressure inside the chamber reaches 500 Pa to 600 Pa, close the vacuum system and the intake valve to keep the chamber in a sealed state.

[0050] When it is detected that the temperature inside the chamber is 151 to 210 °C, control the air pressure value inside the chamber to be 501 to 600 Pa; When it is detected that the temperature inside the chamber is 121 to 150 °C, control the air pressure value inside the chamber to be 401 to 500 Pa; When it is detected that the temperature inside the chamber is 100 to 120 °C, control the air pressure value inside the chamber to be 300 to 400 Pa; S300, after the chamber is cooled to the required temperature, control the vacuum system to start to evacuate the gas inside the chamber.

[0051] Embodiment 2 Referring to the cooling method of the PECVD vacuum coating chamber in Embodiment 1, the difference is that in step 200, when the air pressure inside the chamber reaches 701 to 800 Pa, and the air pressure does not change with the temperature during the entire cooling process.

[0052] Embodiment 3 Referring to the method for cooling the PECVD vacuum coating chamber in Embodiment 1, the difference is that in step 200, when the air pressure in the chamber reaches 701 - 800 Pa, and the air pressure during the entire cooling process changes with temperature: When it is detected that the temperature in the chamber is 151 - 210 °C, the air pressure value in the chamber is controlled at 601 - 700 Pa; When it is detected that the temperature in the chamber is 121 - 150 °C, the air pressure value in the chamber is controlled at 501 - 600 Pa; When it is detected that the temperature in the chamber is 100 - 120 °C, the air pressure value in the chamber is controlled at 400 - 500 Pa.

[0053] Example 4 Referring to the method for cooling the PECVD vacuum coating chamber in Embodiment 1, the difference is that in step 200, the air pressure value in the chamber is set at 601 - 700 Pa, and the air pressure during the entire cooling process does not change with temperature.

[0054] Example 5 Referring to the method for cooling the PECVD vacuum coating chamber in Embodiment 1, the difference is that in step 200, the air pressure value in the chamber is set at 601 - 700 Pa, and the air pressure during the entire cooling process changes with temperature: When it is detected that the temperature in the chamber is 151 - 210 °C, the air pressure value in the chamber is controlled at 501 - 600 Pa; When it is detected that the temperature in the chamber is 121 - 150 °C, the air pressure value in the chamber is controlled at 401 - 500 Pa; When it is detected that the temperature in the chamber is 100 - 120 °C, the air pressure value in the chamber is controlled at 300 - 400 Pa.

[0055] Comparative Example 1 Turn off the heating and automatic cooling, and do not introduce any gas.

[0056] Test Example Detect the chamber cooling rate obtained from the above examples and comparative examples. The specific test results are shown in Table 3 below.

[0057] Table 3 Comparison of cooling parameters for different examples and comparative examples

[0058] From the above results, it can be seen that compared with Comparative Example 1, the embodiment scheme of the present invention greatly improves the cooling rate. This cooling method does not require the setting of a corresponding water cooling system, which is beneficial to saving equipment costs. According to Example 1 and Examples 2-5, it can be known that the cooling method of the present invention can set a reasonable air pressure according to different temperatures inside the chamber and can more accurately control the cooling rate.

[0059] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0060] The terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more.

[0061] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations. In the description of this specification, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A cooling method for a PECVD vacuum coating chamber, the PECVD vacuum coating chamber comprising a cavity, an upper electrode plate and a lower electrode plate located inside the cavity, the lower electrode plate being used for heating the interior of the cavity, and a pressure detection component for detecting the air pressure and a temperature detection component for detecting the temperature being arranged inside the cavity, characterized in that, The cooling method includes: S100, opening the intake valve to allow the heat-conducting gas to enter the cavity; S200, when it is detected that the air pressure inside the cavity reaches 500 Pa to 800 Pa, closing the vacuum system and the intake valve to keep the cavity in a sealed state; S300, after the cavity drops to the required temperature, controlling the vacuum system to start to evacuate the gas in the cavity.

2. The cooling method of the PECVD vacuum coating chamber according to claim 1, wherein Between S200 and S300, it further includes: Obtaining the temperature of the cavity and gradually opening the vacuum system according to the cavity temperature to reduce the cavity pressure; When it is detected that the temperature inside the cavity is 151 - 210 °C, controlling the air pressure value inside the cavity to be 501 - 600 Pa; When it is detected that the temperature inside the cavity is 121 - 150 °C, controlling the air pressure value inside the cavity to be 401 - 500 Pa; When it is detected that the temperature inside the cavity is 100 - 120 °C, controlling the air pressure value inside the cavity to be 300 - 400 Pa.

3. The cooling method of the PECVD vacuum coating chamber according to claim 1, characterized in that, The flux of the heat-conducting gas is set to be 10 L / min to 100 L / min.

4. The cooling method of the PECVD vacuum coating chamber according to claim 3, wherein The heat-conducting gas is hydrogen, nitrogen or argon.

5. A PECVD vacuum coating device, characterized in that, It includes: PECVD vacuum coating chamber and control module; The PECVD vacuum coating chamber includes: a cavity, an intake channel provided at the top of the cavity, and an exhaust channel provided at the bottom of the cavity. An intake valve is provided in the intake channel, and the exhaust channel is connected to the vacuum system; a temperature detection component and a pressure detection component are provided inside the cavity; The control module is electrically connected to the intake valve, the vacuum system, the temperature detection component, and the pressure detection component respectively, and is used to execute the cooling method of the PECVD vacuum coating chamber as described in any one of claims 1 - 4.

6. The PECVD vacuum coating equipment according to claim 5, wherein, It further includes: Lifting mechanism; The lifting mechanism is connected to the bottom of the lower plate and is used to drive the lower plate to rise or fall to adjust the distance between the upper plate and the lower plate.

7. The PECVD vacuum coating equipment according to claim 6, wherein, It further includes: Metal bellows; the metal bellows surrounds the periphery of the lifting mechanism and is used to buffer the lifting mechanism and assist the lifting mechanism to move under vacuum conditions.

8. The PECVD vacuum coating equipment according to claim 7, wherein, An upper plate and a lower plate are provided inside the cavity. The upper plate is located at the top of the cavity, and the lower plate is located at the bottom of the cavity. Ceramic blocks are provided at the edge of the side of the upper plate facing the lower plate, and the lower plate is used to heat the inside of the cavity.

9. The PECVD vacuum coating equipment according to claim 6, wherein, A flow detection component is provided at the inlet of the intake channel, and the flow detection component is used to detect the gas flow entering the cavity.

10. The PECVD vacuum coating equipment according to claim 5, wherein The intake channel and the exhaust channel are arranged in a vertical dislocation.

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