Full-automatic wafer chemical plating machine, control method and use method

Abstract

The invention discloses a full-automatic wafer chemical plating machine which comprises a pretreatment tank used for containing pretreatment liquid; the gold plating tank comprises an outer tank, a middle tank and an inner tank which are sequentially arranged in a sleeving mode, the inner tank is lower than the middle tank, the inner tank and the middle tank are both used for containing gold plating liquid, the outer tank is used for containing pure water, and the outer tank is provided with a heater; the washing tank is used for containing pure water; the soaking tank is used for containing aqua regia; the hoisting driving module is connected with a hanging basket used for loading wafers, and the hoisting driving module drives the hanging basket to sequentially pass through the pretreatment tank, the gold plating tank and the water washing tank; through the automatic process, the complexity and the time consumption of manual operation are greatly reduced, so that the overall production efficiency is improved, and the consistency and the quality stability of products are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer gold plating, and particularly to a fully automatic wafer plating machine, a control method and a usage method. Background Art

[0002] A wafer gold plating device, also known as a wafer plating machine, is a device specifically used for depositing a metal coating on the surface of a wafer. It plays a crucial role in semiconductor manufacturing, providing the required electrical conductivity, corrosion resistance, and welding performance for the wafer. The wafer plating machine forms a uniform and dense metal film on the surface of the wafer through a series of complex process steps, thereby improving the electrical performance and reliability of the wafer.

[0003] The existing wafer gold plating devices have the following problems:

[0004] First, although the wafer gold plating devices have achieved a certain degree of automation and intelligence, there is still room for further improvement;

[0005] Second, there are still certain limitations in adjusting and controlling the gold plating process of the existing devices, and they cannot fully meet the production requirements of high precision and high efficiency;

[0006] Third, the uneven flow of the plating solution may lead to uneven coating thickness, affecting the quality and performance of the wafer;

[0007] Fourth, during the wafer gold plating process, the plating solution will gradually be consumed and contaminated due to chemical reactions and the introduction of impurities. This not only increases the production cost but also may have an adverse effect on the coating quality;

[0008] Fifth, the wafer gold plating device needs to be regularly maintained and cleaned to ensure its normal operation and extend its service life. However, the complex structure and precision components of the existing devices make the maintenance and cleaning work difficult, and also increase the operation cost and risk. Summary of the Invention

[0009] The purpose of the present invention is to provide a fully automatic wafer plating machine, a control method and a usage method for the problems existing in the prior art; through an automated process, the cumbersome manual operation and time consumption are greatly reduced, thereby improving the overall production efficiency and the consistency and quality stability of the product.

[0010] To achieve the above purpose, the technical solution adopted by the present invention is:

[0011] A fully automatic wafer plating machine, comprising: a pretreatment tank for containing a pretreatment liquid; a gold plating tank including an outer tank, an intermediate tank, and an inner tank which are sleeved in sequence, the height of the inner tank is lower than that of the intermediate tank, both the inner tank and the intermediate tank are used for containing gold plating liquid, the outer tank is used for containing pure water, and the outer tank is provided with a heater; a water washing tank for containing pure water inside; an immersion tank for containing aqua regia inside; a hoisting drive module connected with a hanging basket for loading wafers, and the hoisting drive module drives the hanging basket to sequentially pass through the pretreatment tank, the gold plating tank, and the water washing tank.

[0012] Further, the hoisting drive module includes an X-axis drive rail, the slider of the X-axis drive rail is connected to a Z-axis drive rail, the slider of the Z-axis drive rail is connected to a hook claw, and the hook claw is connected to the hanging basket; the X-axis drive rail is fixedly arranged above the pretreatment tank, the gold plating tank, and the water washing tank, and the upper end faces of the pretreatment tank, the gold plating tank, the water washing tank, and the immersion tank are flush and arranged at intervals in the X-axis direction.

[0013] Further, it includes an aqua regia storage tank, an aqua regia pump, a pure water storage tank, a gold plating liquid storage tank, a pure water pump, and a gold plating liquid pump; a pipeline is connected between the pure water storage tank and the inlet end of the pure water pump, a pipeline is connected between the outlet end of the pure water pump and the water washing tank, and a pipeline is connected between the bottom of the water washing tank and the pure water storage tank; a pipeline is connected between the gold plating liquid storage tank and the inlet end of the gold plating liquid pump, a pipeline is connected between the outlet end of the gold plating liquid pump and the inner tank; a pipeline is connected between the aqua regia storage tank and the inlet end of the aqua regia pump, a pipeline is connected between the outlet end of the aqua regia pump and the immersion tank, and a pipeline is connected between the outlet end of the aqua regia pump and the inner tank.

[0014] Further, a pipeline is connected between the intermediate tank and the inlet end of the gold plating liquid pump, and a pipeline is connected between the inner tank and the inlet end of the gold plating liquid pump; a first filter is provided at the outlet end of the gold plating liquid pump, and a pipeline is connected between the outlet end of the gold plating liquid pump and the gold plating liquid storage tank.

[0015] Further, it includes a first waste liquid tank, a second waste liquid tank, and a third waste liquid tank, a pipeline is connected between the first waste liquid tank and the bottom of the pretreatment tank, and a pipeline is connected between the second waste liquid tank and the outlet end of the gold plating liquid pump; a pipeline is connected between the bottom of the water washing tank and the aqua regia storage tank, a pipeline is connected between the bottom of the intermediate tank and the aqua regia storage tank, a pipeline is connected between the bottom of the inner tank and the aqua regia storage tank, and a pipeline is connected between the third waste liquid tank and the outlet end of the aqua regia pump.

[0016] Further, the water washing tank includes a tank body, and a spray pipe is arranged around the upper side of the peripheral side of the tank body; a coiled bubbling pipe is arranged at the bottom inside the water washing tank, both ends of the bubbling pipe extend out of the water washing tank and are connected to a nitrogen supply pipe, and a perforated plate is arranged above the bubbling pipe.

[0017] Further, flip covers are arranged above the pretreatment tank, the gold plating tank, the water washing tank, and the immersion tank, and each flip cover is connected to a flipping drive cylinder.

[0018] Further, it includes a moving support. The moving support includes an operating platform. The hoisting drive module is fixedly arranged on the upper end surface of the operating platform. The operating platform is provided with a sealing groove. The pretreatment tank, the gold plating tank, the water washing tank and the soaking tank are all fixedly arranged in the sealing groove. The bottom of the sealing groove is connected with a waste discharge pipe.

[0019] A control method for a full-automatic wafer plating machine includes the following steps:

[0020] Manually add a quantitative pretreatment liquid into the pretreatment tank. After the pretreatment is completed, the pretreatment liquid is discharged into the first waste liquid tank.

[0021] The gold plating liquid pump extracts the gold plating liquid from the gold plating liquid storage tank and gradually injects it into the inner tank of the gold plating tank until the gold plating liquid overflows from the inner tank and flows to the middle tank. Then the gold plating liquid pump extracts the gold plating liquid in the middle tank, passes it through the first filter, and discharges it into the inner tank to form a circulating flow. Or, the gold plating liquid pump extracts the gold plating liquid in the middle tank and the inner tank and discharges it into the gold plating liquid storage tank. Or, the gold plating liquid pump extracts the gold plating liquid in the middle tank and the inner tank and discharges it into the second waste liquid tank.

[0022] The aqua regia pump extracts aqua regia from the aqua regia storage tank, passes it through the second filter, and then injects it into the inner tank, the soaking tank or the third waste bin respectively. The aqua regia injected into the inner tank overflows and enters the middle tank. After the aqua regia finishes cleaning the inner tank and the middle tank, it returns to the aqua regia storage tank through the pressure difference. After the aqua regia finishes soaking the hanging basket in the soaking tank, it returns to the aqua regia storage tank through the pressure difference.

[0023] The pure water pump extracts pure water from the pure water storage tank and injects it into the water washing tank to wash the wafer. During the water washing process, the pure water overflows from the water washing tank into the sealing groove and is discharged through the waste discharge pipe. After the water washing process is completed, the remaining pure water in the water washing tank returns to the pure water storage tank through the pressure difference.

[0024] A usage method for a full-automatic wafer plating machine includes the following steps:

[0025] The hoisting drive module hooks up the hanging basket loaded with the wafer at the loading station, transports it above the pretreatment tank, and then descends to make the hanging basket enter the pretreatment tank to pretreat the wafer.

[0026] The hoisting drive module raises the hanging basket in the pretreatment tank, transports it above the inner tank of the gold plating tank, and then descends to make the hanging basket enter the inner tank and shake to perform gold plating on the wafer.

[0027] The hoisting drive module raises the hanging basket in the gold plating tank, transports it above the water washing tank, and then descends to make the hanging basket enter the water washing tank to wash the wafer.

[0028] The hoisting drive module raises the hanging basket in the water washing tank, transports it to the unloading station for unloading.

[0029] The hoisting drive module transports the empty hanging basket at the blanking station above the soaking tank, and then descends to make the empty hanging basket enter the soaking tank for soaking treatment.

[0030] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0031] Improve production efficiency: Through an automated process, including steps such as pretreatment, gold plating, water washing, and soaking, the cumbersome manual operations and time consumption are greatly reduced, thereby improving the overall production efficiency.

[0032] Ensure product quality: Automated control can ensure that each operation is carried out according to predetermined parameters and conditions, reducing the interference of human factors, making the plating solution flow evenly, and improving the consistency and quality stability of the product.

[0033] Reduce production costs: The automated process can reduce the dependence on a large number of workers and lower labor costs; at the same time, by optimizing resource utilization and reducing waste, the production costs are further reduced.

[0034] Environmental protection and energy conservation: Through a reasonable waste liquid treatment and recycling system, environmental pollution is reduced; at the same time, by precisely controlling the use of resources such as pure water and gold plating solution, energy conservation and emission reduction are achieved.

[0035] Easy to operate: The centralized control system makes the operation of the entire process easier, reducing the training and management costs of operators.

[0036] High flexibility: Through modular design, the configuration and parameters of each part can be flexibly adjusted according to different production requirements to meet the gold plating requirements of different products, which is convenient for regular maintenance and cleaning, reducing the operation costs and risks.

[0037] Improve safety: Automated operations reduce the chance of workers directly contacting harmful chemicals, reducing the risks of work injuries and occupational diseases, and improving the safety of the working environment. Description of the Drawings

[0038] Figure 1 It is the overall structure diagram of the wafer plating machine in an embodiment of the present application;

[0039] Figure 2 It is the structure diagram of the Z-axis drive rail and the hanging basket in an embodiment of the present application;

[0040] Figure 3 It is the structural schematic diagram of the pipeline system in an embodiment of the present application;

[0041] Figure 4 It is the structural schematic diagram of the gold plating tank in an embodiment of the present application;

[0042] In the figure: 1, pretreatment tank; 2, gold plating tank; 201, outer tank; 202, intermediate tank; 203, inner tank; 3, water washing tank; 4, soaking tank; 5, hanging basket; 6, X-axis drive rail; 7, Z-axis drive rail; 8, aqua regia storage tank; 9, aqua regia pump; 10, pure water storage tank; 11, gold plating solution storage tank; 12, pure water pump; 13, gold plating solution pump; 14, first waste liquid tank; 15, second waste liquid tank; 16, third waste liquid tank. Specific implementation mode

[0043] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative work fall within the scope of protection of the present invention.

[0044] A wafer gold plating device, also known as a wafer plating machine, is a device specifically used for depositing a metal coating on the surface of a wafer. It plays a crucial role in semiconductor manufacturing, providing the required electrical conductivity, corrosion resistance, and welding performance for the wafer. The wafer plating machine forms a uniform and dense metal film on the surface of the wafer through a series of complex process steps, thereby improving the electrical performance and reliability of the wafer. Although the wafer gold plating device has achieved a certain degree of automation and intelligence to some extent, there is still room for further improvement. There are still certain limitations in adjusting and controlling the gold plating process of existing devices, and they cannot fully meet the production requirements of high precision and high efficiency.

[0045] In the first aspect of the present application, as Figures 1 to 4 shown, a full-automatic wafer plating machine is provided, including: a pretreatment tank 1 for containing a pretreatment solution; a gold plating tank 2, the gold plating tank 2 includes an outer tank 201, an intermediate tank 202, and an inner tank 203 that are sequentially sleeved. The height of the inner tank 203 is lower than that of the intermediate tank 202. Both the inner tank 203 and the intermediate tank 202 are used for containing a gold plating solution, and the outer tank 201 is used for containing pure water. The outer tank 201 is provided with a heater; a water washing tank 3 for containing pure water inside; a soaking tank 4 for containing aqua regia inside; a hoisting drive module, the hoisting drive module is connected with a hanging basket 5 for loading wafers, and the hoisting drive module drives the hanging basket 5 to sequentially pass through the pretreatment tank 1, the gold plating tank 2, and the water washing tank 3.

[0046] The specific working process of the full-automatic wafer plating machine in the above solution is as follows:

[0047] Pretreatment stage: The wafer is first placed in the hanging basket 5, and the hoisting drive module drives the hanging basket 5 to move above the pretreatment tank 1. The hanging basket 5 descends into the pretreatment tank 1, and the wafer is immersed in the pretreatment liquid. The pretreatment liquid is usually used to remove oil stains, oxides or other impurities on the wafer surface, providing a clean surface for the subsequent gold plating operation. After the pretreatment is completed, the hanging basket 5 rises and moves out of the pretreatment tank 1, preparing to enter the gold plating stage.

[0048] Gold plating stage: The hoisting drive module brings the hanging basket 5 into the gold plating tank 2. The gold plating tank 2 adopts a multi-layer nested structure, including an outer tank 201, an intermediate tank 202 and an inner tank 203. The outer tank 201 contains pure water and is heated by a heater to maintain the temperature stability of the gold plating solution. The intermediate tank 202 and the inner tank 203 are used to contain the gold plating solution. Since the height of the inner tank 203 is lower than that of the intermediate tank 202, a certain liquid level difference is formed by the gold plating solution under the action of gravity, which helps to form a uniform coating on the wafer surface. The hanging basket 5 descends into the inner tank 203, and the wafer begins to receive the gold plating treatment. During the gold plating process, an electric current passes through the wafer and the gold plating solution, causing metal ions to be reduced and deposited on the wafer surface to form the required metal coating. After the gold plating is completed, the hanging basket 5 rises and moves out of the gold plating tank 2, entering the next stage.

[0049] Cleaning stage: The hoisting drive module brings the hanging basket 5 into the water washing tank 3. The water washing tank 3 contains pure water, which is used to remove the residual gold plating solution and other impurities on the wafer surface. The hanging basket 5 moves up and down in the water washing tank 3 to ensure that the wafer surface is fully cleaned.

[0050] After the cleaning is completed, the hanging basket 5 rises and moves out of the water washing tank 3, completing the entire gold plating process.

[0051] The above-mentioned fully automatic wafer electroplating machine integrates the entire process of wafer from pretreatment to gold plating and then to cleaning on one device based on an automated process flow, thus realizing the efficient and continuous production of wafer gold plating.

[0052] In some embodiments, the hoisting drive module includes an X-axis drive rail 6. The slider of the X-axis drive rail 6 is connected to the Z-axis drive rail 7. The slider of the Z-axis drive rail 7 is connected to a hook claw, and the hook claw is connected to the hanging basket 5. The X-axis drive rail 6 is fixedly arranged above the pretreatment tank 1, the gold plating tank 2, the water washing tank 3 and the soaking tank 4. The upper end surfaces of the pretreatment tank 1, the gold plating tank 2, the water washing tank 3 and the soaking tank 4 are flush and arranged at intervals along the X-axis direction.

[0053] Through the combined use of the X-axis drive rail 6 and the Z-axis drive rail 7, the hanging basket 5 can be accurately positioned among the pretreatment tank 1, the gold plating tank 2, the water washing tank 3, and the soaking tank 4. This high-precision positioning ensures that the wafers can be accurately processed in each processing step, avoiding quality problems caused by inaccurate positioning. Since the hoisting drive module can move the hanging basket 5 automatically and quickly, the time of the entire gold plating process is greatly shortened, improving the production efficiency. The upper end faces of the pretreatment tank 1, the gold plating tank 2, the water washing tank 3, and the soaking tank 4 are flush and arranged at intervals along the X-axis direction, making the layout of the entire equipment more compact and saving production space.

[0054] In some embodiments, it includes a aqua regia storage tank 8, an aqua regia pump 9, a pure water storage tank 10, a gold plating solution storage tank 11, a pure water pump 12, and a gold plating solution pump 13; a first pipeline is connected between the pure water storage tank 10 and the inlet end of the pure water pump 12, a second pipeline is connected between the outlet end of the pure water pump 12 and the water washing tank 3, and a sixteenth pipeline is connected between the bottom of the water washing tank 3 and the pure water storage tank 10; a third pipeline is connected between the gold plating solution storage tank 11 and the inlet end of the gold plating solution pump 13, a fourth pipeline is connected between the outlet end of the gold plating solution pump 13 and the inner tank 203; a fifth pipeline is connected between the aqua regia storage tank 8 and the inlet end of the aqua regia pump 9, a sixth pipeline is connected between the outlet end of the aqua regia pump 9 and the soaking tank 4, and a seventh pipeline is connected between the outlet end of the aqua regia pump 9 and the inner tank 203.

[0055] The pure water pump 12 extracts pure water from the pure water storage tank 10 and transports it to the water washing tank 3 through pipelines for cleaning the wafers. The cleaned pure water flows back to the pure water storage tank 10 through another pipeline for recycling. The gold plating solution pump 13 extracts the gold plating solution from the gold plating solution storage tank 11 and transports it to the inner tank 203 of the gold plating tank 2 for depositing a metal coating on the surface of the wafers. The aqua regia pump 9 extracts aqua regia from the aqua regia storage tank 8 and can be transported to the soaking tank 4 or the inner tank 203 of the gold plating tank 2 through different pipelines. When the hanging basket is placed in the soaking tank 4, the aqua regia is used to clean the hanging basket 5, and the aqua regia is used to clean the inner tank 203 and the intermediate tank 202 of the gold plating tank.

[0056] By setting components such as the aqua regia storage tank, the aqua regia pump, the pure water storage tank, the gold plating solution storage tank, the pure water pump, and the gold plating solution pump, the functions of automatic liquid supply and recovery are realized. This automatic operation greatly improves the work efficiency, reduces the need for manual operation, and also reduces production problems caused by human operation errors.

[0057] In some embodiments, an eighth pipeline is connected between the intermediate tank 202 and the inlet end of the gold plating solution pump 13, and a ninth pipeline is connected between the inner tank 203 and the inlet end of the gold plating solution pump 13; a first filter is provided at the outlet end of the gold plating solution pump 13, and a seventeenth pipeline is connected between the outlet end of the gold plating solution pump 13 and the gold plating solution storage tank 11.

[0058] The gold plating solution in the intermediate tank and the inner tank 203 is connected to the gold plating solution pump 13 through the eighth pipeline and the ninth pipeline, realizing the recycling of the gold plating solution. This can not only improve the utilization rate of the gold plating solution, reduce production costs, but also help maintain the stability of the gold plating solution concentration, thereby improving the gold plating quality. Setting a first filter at the outlet end of the gold plating solution pump 13 can effectively remove impurities and particles in the gold plating solution, ensuring the purity of the gold plating solution. This helps reduce defects on the wafer surface and defective coatings, and improves the product qualification rate. By flowing the filtered gold plating solution back to the gold plating solution storage tank 11 through the seventeenth pipeline, centralized management and maintenance of the gold plating solution can be achieved. At the same time, this also facilitates the regular replacement and replenishment of the gold plating solution, ensuring the continuity and stability of the production process.

[0059] In some embodiments, it includes a first waste liquid tank 14, a second waste liquid tank 15, and a third waste liquid tank 16. A tenth pipeline is connected between the first waste liquid tank 14 and the bottom of the pretreatment tank 1, and an eleventh pipeline is connected between the second waste liquid tank 15 and the outlet end of the gold plating solution pump 13; a twelfth pipeline is connected between the bottom of the water washing tank 3 and the aqua regia storage tank 8, a thirteenth pipeline is connected between the bottom of the intermediate tank 202 and the aqua regia storage tank 8, a fourteenth pipeline is connected between the bottom of the inner tank 203 and the aqua regia storage tank 8, and a fifteenth pipeline is connected between the third waste liquid tank 16 and the outlet end of the aqua regia pump 9.

[0060] The waste liquid generated in the pretreatment tank 1 flows into the first waste liquid tank 14 through the tenth pipeline for separate collection and treatment. During the recycling process of the gold plating solution pump 13, waste liquid containing impurities and particles may be generated, and this part of the waste liquid flows into the second waste liquid tank 15 through the eleventh pipeline. The waste liquid in the water washing tank 3, the intermediate tank 202, and the inner tank 203, due to possibly containing aqua regia or other harmful components, flows back to the aqua regia storage tank 8 through the twelfth, thirteenth, and fourteenth pipelines. This can not only realize the recycling and reuse of aqua regia, but also avoid environmental pollution caused by direct discharge. After long-term use, when replacing the aqua regia in the aqua regia storage tank 8, the aqua regia pump 9 discharges the aqua regia in the aqua regia storage tank 8 into the third waste liquid tank 16 through the fifteenth pipeline for special treatment. In summary, through the design of waste liquid classification, recycling, and reuse, effective treatment of waste liquid in the wafer gold plating process is achieved, improving resource utilization rate and production safety, and also meeting environmental protection requirements.

[0061] In some embodiments, the water washing tank 3 includes a tank body 1, and a spray pipe is arranged around the upper side of the circumferential side of the tank body 1; a coiled bubbling pipe is arranged at the bottom inside the water washing tank, both ends of the bubbling pipe extend out of the water washing tank and are connected to a nitrogen gas supply pipe, and a perforated plate is arranged above the bubbling pipe.

[0062] By arranging the spray pipe above the circumferential side of the water washing tank 3, the wafer can be sprayed and cleaned in all directions, ensuring that impurities and residues on the wafer surface are completely removed. This design improves the cleaning efficiency and shortens the cleaning time. The coiled bubbling pipe arranged at the bottom of the water washing tank 3 can generate a uniform bubbling effect in the tank by connecting to the nitrogen gas supply pipe. This bubbling effect helps to increase the contact area between water and the wafer surface, improve the cleaning effect, and carry away the residues. At the same time, nitrogen, as an inert gas, will not cause oxidation or other adverse effects on the wafer. The perforated plate arranged above the bubbling pipe can play a role in supporting the hanging basket 5, and the perforated design ensures the smooth flow of water and does not affect the cleaning effect.

[0063] In some embodiments, flip covers are arranged above each of the pretreatment tank 1, the gold plating tank 2, the water washing tank 3, and the soaking tank 4, and each flip cover is connected to a flip driving cylinder. By controlling the opening and closing of the flip cover through the flip driving cylinder, the entire processing process can be automated. This reduces the complexity of manual operation, improves work efficiency, and also reduces production problems caused by human operation errors.

[0064] In some embodiments, it includes a moving bracket, the moving bracket includes an operating table, a hoisting driving module is fixedly arranged on the upper end surface of the operating table, the operating table is provided with a sealing groove, the pretreatment tank 1, the gold plating tank 2, the water washing tank 3, and the soaking tank 4 are all fixedly arranged in the sealing groove, and a waste discharge pipe is connected to the bottom of the sealing groove. By integrating components such as the pretreatment tank 1, the gold plating tank 2, the water washing tank 3, and the soaking tank 4 through the moving bracket, a modular wafer gold plating processing system is formed. This design makes the entire system more compact and stable, facilitating transportation and installation. The waste discharge pipe connected to the bottom of the sealing groove can timely discharge the waste liquid generated during the processing process, avoiding the accumulation of waste liquid in the tank body. This design not only improves the efficiency of waste liquid treatment but also helps to keep the tank body clean and the working environment hygienic.

[0065] In the second aspect of the present application, a control method for a full-automatic wafer plating machine is provided, including the following steps:

[0066] Manually add a quantitative pretreatment liquid into the pretreatment tank 1, and after the pretreatment is completed, the pretreatment liquid is discharged into the first waste liquid tank 14;

[0067] The gold plating solution pump 13 extracts the gold plating solution from the gold plating solution storage tank 11 and gradually injects it into the inner tank 203 of the gold plating tank 2 until the gold plating solution overflows from the inner tank 203 and flows into the intermediate tank 202. After the gold plating solution pump 13 extracts the gold plating solution in the intermediate tank 202 and passes it through the first filter, it is discharged into the inner tank 203 to form a circulating flow. Alternatively, the gold plating solution pump 13 extracts the gold plating solution in the intermediate tank 202 and the inner tank 203 and discharges it into the gold plating solution storage tank 11. Alternatively, the gold plating solution pump 13 extracts the gold plating solution in the intermediate tank 202 and the inner tank 203 and discharges it into the second waste liquid tank 15;

[0068] The aqua regia pump 9 extracts aqua regia from the aqua regia storage tank 8. After passing through the second filter, it is respectively injected into the inner tank 203, the soaking tank 4 or the third waste bin 16. The aqua regia injected into the inner tank 203 overflows and enters the intermediate tank 202. After the aqua regia finishes cleaning the inner tank 203 and the intermediate tank 202, it returns to the aqua regia storage tank 8 through the pressure difference; after the aqua regia finishes soaking the hanging basket in the soaking tank 4, it returns to the aqua regia storage tank 8 through the pressure difference;

[0069] The pure water pump 12 extracts pure water from the pure water storage tank 10 and injects it into the water washing tank 3 to wash the wafer. During the water washing process, the pure water overflows from the water washing tank 3 into the sealing tank and is discharged through the waste discharge pipe. After the water washing process is completed, the remaining pure water in the water washing tank 3 returns to the pure water storage tank 10 through the pressure difference.

[0070] In the third aspect of the present application, a method for using a full-automatic wafer electroplating machine is provided, which is characterized by including the following steps:

[0071] The hoisting drive module hooks the hanging basket 5 loaded with the wafer at the loading station, transports it above the pretreatment tank 1, and then descends to make the hanging basket 5 enter the pretreatment tank 1 to perform pretreatment on the wafer;

[0072] The hoisting drive module raises the hanging basket 5 in the pretreatment tank 1, transports it above the inner tank of the gold plating tank 2, and then descends to make the hanging basket 5 enter the inner tank 203 and shake to perform gold plating treatment on the wafer;

[0073] The hoisting drive module raises the hanging basket in the gold plating tank 2, transports it above the water washing tank 3, and then descends to make the hanging basket 5 enter the water washing tank 3 to perform water washing treatment on the wafer;

[0074] The hoisting drive module raises the hanging basket in the water washing tank 3, transports it to the unloading station for unloading;

[0075] The hoisting drive module transports the empty hanging basket at the unloading station above the soaking tank 4, and then descends to make the empty hanging basket enter the soaking tank 4 to perform soaking treatment on the empty hanging basket.

[0076] The pipeline system of the embodiment of the present application is summarized as follows:

[0077] The first pipeline: between the pure water storage tank 10 and the inlet end of the pure water pump 12;

[0078] The second pipeline: between the outlet end of the pure water pump 12 and the water washing tank 3;

[0079] The third pipeline: between the gold plating solution storage tank 11 and the inlet end of the gold plating solution pump 13;

[0080] The fourth pipeline: between the outlet end of the gold plating solution pump 13 and the inner tank 203;

[0081] The fifth pipeline: between the aqua regia storage tank 8 and the inlet end of the aqua regia pump 9;

[0082] The sixth pipeline: between the outlet end of the aqua regia pump 9 and the soaking tank 4;

[0083] The seventh pipeline: between the outlet end of the aqua regia pump 9 and the inner tank 203;

[0084] The eighth pipeline: between the intermediate tank 202 and the inlet end of the gold plating solution pump 13;

[0085] The ninth pipeline: between the inner tank 203 and the inlet end of the gold plating solution pump 13;

[0086] The tenth pipeline: between the first waste liquid tank 14 and the bottom of the pretreatment tank 1;

[0087] The eleventh pipeline: between the second waste liquid tank 15 and the outlet end of the gold plating solution pump 13;

[0088] The twelfth pipeline: between the bottom of the water washing tank 3 and the aqua regia storage tank 8;

[0089] The thirteenth pipeline: between the bottom of the intermediate tank 202 and the aqua regia storage tank 8;

[0090] The fourteenth pipeline: between the bottom of the inner tank 203 and the aqua regia storage tank 8;

[0091] The fifteenth pipeline: between the third waste liquid tank 16 and the outlet end of the aqua regia pump 9;

[0092] The sixteenth pipeline: between the bottom of the water washing tank 3 and the pure water storage tank 10;

[0093] The seventeenth pipeline: between the outlet end of the gold plating solution pump 13 and the gold plating solution storage tank 11.

[0094] It should be noted that each pipeline is provided with a directional diaphragm valve. It is easy for those skilled in the art to adaptively open and close the directional diaphragm valve of the corresponding pipeline according to the functional requirements, and it is not specifically limited and described here.

[0095] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0096] In addition, the terms "horizontal", "vertical", etc. do not mean that the components are required to be absolutely horizontal or hanging vertically, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0097] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0098] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic wafer plating machine, characterized in that, Comprising: A pretreatment tank (1) for containing a pretreatment liquid; A gold plating tank (2) which includes an outer tank (201), an intermediate tank (202), and an inner tank (203) sleeved in sequence. The height of the inner tank (203) is lower than that of the intermediate tank (202). Both the inner tank (203) and the intermediate tank (202) are for containing gold plating liquid, and the outer tank (201) is for containing pure water. The outer tank (201) is provided with a heater; A water washing tank (3) whose interior is for containing pure water; An immersion tank (4) whose interior is for containing aqua regia; A hoisting drive module connected to a hanging basket (5) for loading wafers. The hoisting drive module drives the hanging basket (5) to pass through the pretreatment tank (1), the gold plating tank (2), and the water washing tank (3) in sequence.

2. The full-automatic wafer plating machine according to claim 1, characterized in that, The hoisting drive module includes an X-axis drive rail (6). The slider of the X-axis drive rail (6) is connected to a Z-axis drive rail (7). The slider of the Z-axis drive rail (7) is connected to a hook claw which is connected to the hanging basket (5). The X-axis drive rail (6) is fixedly arranged above the pretreatment tank (1), the gold plating tank (2), the water washing tank (3), and the immersion tank (4). The upper end faces of the pretreatment tank (1), the gold plating tank (2), the water washing tank (3), and the immersion tank (4) are flush and arranged at intervals along the X-axis direction.

3. The fully automatic wafer plating machine according to claim 1, wherein, Including an aqua regia storage tank (8), an aqua regia pump (9), a pure water storage tank (10), a gold plating liquid storage tank (11), a pure water pump (12), and a gold plating liquid pump (13). A first pipeline is connected between the pure water storage tank (10) and the inlet end of the pure water pump (12). A second pipeline is connected between the outlet end of the pure water pump (12) and the water washing tank (3). A sixteenth pipeline is connected between the bottom of the water washing tank (3) and the pure water storage tank (10). A third pipeline is connected between the gold plating liquid storage tank (11) and the inlet end of the gold plating liquid pump (13). A fourth pipeline is connected between the outlet end of the gold plating liquid pump (13) and the inner tank (203). A fifth pipeline is connected between the aqua regia storage tank (8) and the inlet end of the aqua regia pump (9). A sixth pipeline is connected between the outlet end of the aqua regia pump (9) and the immersion tank (4). A seventh pipeline is connected between the outlet end of the aqua regia pump (9) and the inner tank (203).

4. The fully automatic wafer plating machine according to claim 3, wherein, An eighth pipeline is connected between the intermediate tank (202) and the inlet end of the gold plating liquid pump (13). A ninth pipeline is connected between the inner tank (203) and the inlet end of the gold plating liquid pump (13). A first filter is provided at the outlet end of the gold plating liquid pump (13). A seventeenth pipeline is connected between the outlet end of the gold plating liquid pump (13) and the gold plating liquid storage tank (11).

5. The full-automatic wafer plating machine according to claim 4, characterized in that, It includes a first waste liquid tank (14), a second waste liquid tank (15) and a third waste liquid tank (16). A tenth pipeline is connected between the bottom of the first waste liquid tank (14) and the bottom of the pretreatment tank (1). An eleventh pipeline is connected between the second waste liquid tank (15) and the outlet end of the gold plating solution pump (13). A twelfth pipeline is connected between the bottom of the water washing tank (3) and the aqua regia storage tank (8). A thirteenth pipeline is connected between the bottom of the intermediate tank (202) and the aqua regia storage tank (8). A fourteenth pipeline is connected between the bottom of the inner tank (203) and the aqua regia storage tank (8). A fifteenth pipeline is connected between the third waste liquid tank (16) and the outlet end of the aqua regia pump (9).

6. The fully automatic wafer plating machine according to claim 1, wherein, The water washing tank (3) includes a tank body (1). A spray pipe is arranged around the upper side of the circumferential side of the tank body (1). A coiled bubbling pipe is arranged at the bottom inside the water washing tank. Both ends of the bubbling pipe extend out of the water washing tank and are connected to a nitrogen supply pipe. A perforated plate is arranged above the bubbling pipe.

7. A fully automatic wafer plating machine according to claim 1, characterized in that, Flip covers are arranged above the pretreatment tank (1), the gold plating tank (2), the water washing tank (3) and the soaking tank (4). Each flip cover is connected to a flipping driving cylinder.

8. The full-automatic wafer plating machine according to any one of claims 1 to 7, characterized in that, It includes a moving support. The moving support includes an operating platform. The hoisting driving module is fixedly arranged on the upper end surface of the operating platform. The operating platform is provided with a sealing groove. The pretreatment tank (1), the gold plating tank (2), the water washing tank (3) and the soaking tank (4) are all fixedly arranged in the sealing groove. A waste discharge pipe is connected to the bottom of the sealing groove.

9. The control method of the fully automatic wafer plating machine according to any one of claims 1 to 7, characterized in that, It includes the following steps: Manually add a quantitative pretreatment liquid into the pretreatment tank (1). After the pretreatment is completed, the pretreatment liquid is discharged into the first waste liquid tank (14). The gold plating solution pump (13) extracts the gold plating solution from the gold plating solution storage tank (11) and gradually injects it into the inner tank (203) of the gold plating tank (2) until the gold plating solution overflows from the inner tank (203) and flows to the intermediate tank (202). Then the gold plating solution pump (13) extracts the gold plating solution in the intermediate tank (202), passes it through the first filter, and then discharges it into the inner tank (203) to form a circulating flow. Or the gold plating solution pump (13) extracts the gold plating solution in the intermediate tank (202) and the inner tank (203) and discharges it into the gold plating solution storage tank (11). Or the gold plating solution pump (13) extracts the gold plating solution in the intermediate tank (202) and the inner tank (203) and discharges it into the second waste liquid tank (15). The aqua regia pump (9) extracts aqua regia from the aqua regia storage tank (8), passes it through the second filter, and then injects it into the inner tank (203), the soaking tank (4) or the third waste tank (16) respectively. The aqua regia injected into the inner tank (203) overflows and enters the intermediate tank (202). After the aqua regia finishes cleaning the inner tank (203) and the intermediate tank (202), it returns to the aqua regia storage tank (8) through the pressure difference. After the aqua regia finishes soaking the hanging basket in the soaking tank (4), it returns to the aqua regia storage tank (8) through the pressure difference. The pure water pump (12) extracts pure water from the pure water storage tank (10) and injects it into the water washing tank (3) to wash the wafers. During the water washing process, the pure water overflows from the water washing tank (3) into the sealing tank and is discharged through the waste pipe. After the water washing process is completed, the remaining pure water in the water washing tank returns to the pure water storage tank (10) by differential pressure.

10. The method of using the fully automatic wafer plating machine according to any one of claims 1 to 7, characterized in that, It includes the following steps: The hoisting drive module hooks the hanging basket (5) loaded with wafers at the loading station, transports it above the pretreatment tank (1), and then descends to make the hanging basket (5) enter the pretreatment tank (1) to pretreat the wafers. The hoisting drive module raises the hanging basket (5) in the pretreatment tank (1), transports it above the inner tank of the gold plating tank (2), and then descends to make the hanging basket (5) enter the inner tank (203) and shake to perform gold plating treatment on the wafers. The hoisting drive module raises the hanging basket in the gold plating tank (2), transports it above the water washing tank (3), and then descends to make the hanging basket (5) enter the water washing tank (3) to wash the wafers. The hoisting drive module raises the hanging basket in the water washing tank (3), transports it to the unloading station for unloading. The hoisting drive module transports the empty hanging basket at the unloading station above the soaking tank (4), and then descends to make the empty hanging basket enter the soaking tank (4) to soak the empty hanging basket.

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