Solid target sheet electroplating equipment and electroplating method for preparing solid target

Abstract

The invention provides solid target sheet electroplating equipment and an electroplating method for preparing a solid target. The solid target sheet electroplating equipment comprises a main body, wherein an electroplating liquid tank extending in the height direction of the main body is arranged in the main body; an anode electrode plate and a cathode target plate; a plurality of pressing plates; the electroplating liquid tank is provided with an electroplating station, the electroplating station penetrates through the main body in the horizontal direction perpendicular to the height direction of the main body and communicates with the electroplating liquid tank, and the electroplating station is provided with a first opening and a second opening in the outer surface of the main body; the anode electrode sheet is fixed to and blocks the first opening by means of a corresponding pressing plate, and the cathode target sheet is fixed to and blocks the second opening by means of a corresponding pressing plate. According to the invention, the anode electrode plate and the cathode target plate to be electroplated are respectively fixed at the two openings of the electroplating station, so that the step of mounting / dismounting the anode electrode plate / cathode target plate is simpler and more convenient than the prior art.

Description

Technical Field

[0001] This application relates to the technical field of positron emission computed tomography (PET), and particularly relates to a solid target plating device and a plating method for preparing a solid target. Background Art

[0002] Bombarding a specific target with an accelerator, the radionuclides produced in this way are the main source of radionuclides for radiopharmaceuticals. In recent years, various 68 Ga-labeled radiopharmaceuticals have been used for tumor diagnosis and are particularly suitable for PET diagnosis. Currently, 68 Ga is mainly prepared using 68 Ge- 68 Ga generators. The long strip-shaped metal targets (10 mm × 96 mm) used in traditional cyclotrons (such as Cyclone ® 30) have the problem of beam energy waste because the beam is distributed in a spindle shape and only irradiates the middle of the long strip-shaped target, resulting in low utilization of both ends of the target. Such relatively low irradiation efficiency leads to high subsequent processing difficulty and increased costs, and there is also a large amount of accompanying radioactive waste.

[0003] In the prior art, on the one hand, it is necessary to ensure that the fixing means of the target to be electroplated in the electroplating equipment is firm enough, and on the other hand, it is necessary to ensure that the electroplating solution remains uniform throughout the electroplating process. These considerations pose certain challenges to the structural configuration of the electroplating equipment, such as the electrical connection of the anode / cathode, the stirring device for the electroplating solution, the feasibility of multiple electroplating stations, etc. These considerations result in a relatively complex structure of the electroplating equipment and cumbersome installation / dismantling steps for the target and the corresponding electrode plates. For example, see Chinese Patent Application CN116575097A. Therefore, it is necessary to optimize the electroplating equipment and process to improve the stability and safety during the target preparation process. Summary of the Invention

[0004] This application provides a solid target plating device and a plating method for preparing a solid target, which are used to solve the defects of complex structure and cumbersome use of electroplating equipment in the prior art, and realize an electroplating device and method with a relatively simple structure, thus facilitating the target preparation process.

[0005] According to the first aspect of this application, this application provides a solid target plating device, which includes: A main body having an electroplating solution tank extending along its height direction inside; An anode electrode plate and a cathode target; and Several pressing plates; Among them, the electroplating bath is provided with an electroplating station, and the electroplating station is formed to penetrate the main body in a horizontal direction perpendicular to the height direction of the main body and communicate with the electroplating bath. The electroplating station forms a first opening and a second opening on the outer surface of the main body; the anode electrode plate is fixed to and seals the first opening by means of a corresponding pressing plate, and the cathode target is fixed to and seals the second opening by means of a corresponding pressing plate.

[0006] According to a solid target electroplating device provided by the present application, the number of electroplating stations is one or more, and the plurality of electroplating stations are arranged in the height direction.

[0007] According to a solid target electroplating device provided by the present application, the area ratio of the opposite end faces of the cathode target to the anode electrode plate is in the range of 1:1 to 1:2.

[0008] According to a solid target electroplating device provided by the present application, the peripheries of the first opening and the second opening are formed in a stepped shape, and the formed stepped surface serves as a stop portion for the anode electrode plate or the cathode target.

[0009] According to a solid target electroplating device provided by the present application, it further includes a plurality of seals, and the corresponding seals are arranged between the first opening and the anode electrode plate or between the second opening and the cathode target.

[0010] According to a solid target electroplating device provided by the present application, the shapes of the anode electrode plate and the cathode target are the same or different.

[0011] According to a solid target electroplating device provided by the present application, the anode electrode plate and the cathode target are formed in a disc shape, a strip shape, or a polygonal thin plate shape.

[0012] According to a solid target electroplating device provided by the present application, the anode electrode plate is selected from one of the following materials: Pt, Ti, or graphite.

[0013] According to a solid target electroplating device provided by the present application, it further includes a mechanical stirrer, and the mechanical stirrer is placed in the electroplating bath.

[0014] According to a solid target electroplating device provided by the present application, it further includes a high-frequency pulse rectifier, and the high-frequency pulse rectifier is electrically connected to the anode electrode plate and the cathode target respectively.

[0015] According to the second aspect of the present application, the present application also provides an electroplating method for preparing a solid target, and this electroplating method is completed by using the solid target electroplating device according to the first aspect of the present application, and it includes the following steps: Fix the anode electrode plate to and seal the first opening, and fix the cathode target to and seal the second opening; Introduce the electroplating solution into the electroplating bath, and place the mechanical stirrer in the electroplating bath; Start the external power supply to supply power to the mechanical stirrer, the anode electrode sheet, and the cathode target until a solid target is prepared.

[0016] According to an electroplating method for preparing a solid target provided by the present application, the solid target to be prepared is a Ga-Ni alloy target, and the corresponding first electroplating solution is prepared according to the following steps: Obtain gallium chloride and dissolve it in hydrochloric acid with a concentration of 0.05 mol / L to 0.15 mol / L to obtain a gallium chloride solution with a concentration of 0.5 to 2.5 mol / Lmol / L; Obtain nickel chloride hexahydrate and completely dissolve it in the gallium chloride solution to obtain a gallium chloride-nickel chloride solution in which the ratio of gallium ions to nickel ions is in the range of 1:1 to 5:1.

[0017] According to an electroplating method for preparing a solid target provided by the present application, the solid target to be prepared is a Zn target, and the corresponding second electroplating solution is prepared according to the following steps: Obtain anhydrous zinc chloride and dissolve it in pure water to obtain a zinc chloride solution; Use hydrochloric acid with a concentration of 0.1 mol / L to 11.7 mol / L to adjust the zinc chloride solution to a pH value of 1 and a concentration of 20 g / L to 240 g / L.

[0018] According to an electroplating method for preparing a solid target provided by the present application, before fixing the cathode target sheet to and blocking the second opening, it further includes: Clean the surface of the cathode target sheet until a uniform water film is formed on the surface of the cathode target sheet.

[0019] The solid target sheet electroplating equipment and the electroplating method for preparing a solid target provided by the present application fix the anode electrode sheet and the cathode target sheet to be electroplated at two openings (i.e., the first opening and the second opening) of the electroplating station respectively, thereby ensuring that the anode electrode sheet / cathode target sheet and their associated wires do not have to be arranged in the electroplating solution tank. On the one hand, these electrical components will not interfere with the stirrer or rotating mechanism in the electroplating solution tank. On the other hand, in the process of completing a single electroplating process or maintenance, the steps of installing / removing the anode electrode sheet / cathode target sheet are simpler and more convenient than the prior art. In addition, the solid target sheet electroplating equipment and the electroplating method for preparing a solid target provided by the present application, through the cooperation of the pressing plate and the stepped surface, always fix the cathode target sheet in the position facing the electroplating solution tank, and under the action of the electric field, ensure that this surface continuously receives the impact of cations in the electroplating solution, and a reduction reaction occurs here to obtain high-purity Ga-Ni alloy or Zn. Description of the Drawings

[0020] To more clearly illustrate the technical solutions in the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 is a perspective view of the solid target plating equipment provided by the present application.

[0022] Figure 2 is an exploded view of the solid target plating equipment provided by the present application.

[0023] Figure 3 is a cross-sectional view of the solid target plating equipment provided by the present application along the height direction.

[0024] Reference numerals: 1, main body; 11, plating solution tank; 12, plating station; 13, first opening; 14, second opening; 2, pressing plate; 21, bolt; 3, anode electrode plate; 4, cathode target; 5, seal. Detailed implementation manners

[0025] The following will further describe the implementation manners of the present application in detail in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0026] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0027] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, which can include an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0028] In the embodiments of the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0029] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples.

[0030] The following is combined with Figures 1 to 3 to describe the solid target electroplating equipment of the present application and the electroplating method for preparing a solid target.

[0031] Such as Figures 1-2As shown, they are respectively a perspective view and an exploded view of the solid target plating device provided by the present application. The solid target plating device includes a main body 1, a pressing plate 2, an anode electrode plate 3, and a cathode target 4. An electroplating solution tank 11 extending along the height direction of the main body 1 is provided inside the main body 1, and the electroplating solution tank 11 can be formed into a cylinder or other suitable shape. It should be noted that the electroplating solution tank 11 extends downward from the top surface of the main body 1 but does not penetrate the main body 1. The electroplating solution tank 11 is provided with an electroplating station 12. Specifically, it penetrates the main body 1 in the horizontal direction, thereby forming the electroplating station 12, where the horizontal direction is perpendicular to the height direction of the main body 1. The middle section of the electroplating station 12 communicates with the electroplating solution tank 11, so that the electroplating solution can flow into the electroplating station 12. At the same time, since the electroplating station 12 penetrates the main body 1 in the horizontal direction, a first opening 13 and a second opening 14 are formed on the outer surface of the main body 1. The anode electrode plate 3 is arranged at the first opening 13, and the cathode target 4 is arranged at the second opening 14. Thus, the anode electrode plate 3 and the cathode target 4 face each other at both ends of the electroplating station 12. On the side where the first opening 13 is located, the pressing plate 2 presses the anode electrode plate 3 tightly against the first opening 13, so that the anode electrode plate 3 closes the first opening 13; similarly, on the side where the second opening 14 is located, the pressing plate 2 presses the cathode target 4 tightly against the second opening 14, so that the cathode target 4 closes the second opening 14.

[0032] In order to fix the pressing plate 2, the anode electrode plate 3, and the cathode target 4 on the main body 1, a plurality of screw holes are provided on the outer surface of the main body 1 around the first opening 13 and the second opening 14. In this embodiment, four screw holes are respectively provided around the first opening 13 and the second opening 14. The pressing plate 2 is provided with through holes corresponding one by one to the plurality of screw holes. In this embodiment, each pressing plate 2 is provided with four through holes. With the help of bolts 21, the pressing plate 2 is fixed to the main body 1 and keeps pressing the anode electrode plate 3 / cathode target 4 against the first opening 13 / second opening 14.

[0033] Preferably, the solid target plating device can have more than one electroplating station 12. In particular, a plurality of electroplating stations 12 are arranged along the height direction on the electroplating solution tank 11. More preferably, the plurality of electroplating stations 12 are arranged at equal intervals. The advantage of such a structure is that each electroplating station 12 can process one cathode target 4, which means that in a single electroplating process, the electroplating processes of multiple cathode targets 4 can be completed simultaneously. It can be envisioned that each electroplating station 12 can accommodate a combination of a set of anode electrode plates 3 and cathode targets 4, and the anode electrode plates 3 and the cathode targets 4 are fixed by their respective corresponding pressing plates 2, that is, in a single solid target plating device, the number of electroplating stations 12, the number of combinations of anode electrode plates 3 and cathode targets 4, and the number of pairs of pressing plates 2 are the same.

[0034] To further ensure that the anode electrode sheet 3 / cathode target sheet 4 remains stationary at the first opening 13 / second opening 14, as Figure 3 shown, the perimeters of the first opening 13 and the second opening 14 are formed in a stepped shape, and the resulting stepped surfaces respectively serve as stoppers for the anode electrode sheet 3 and the cathode target sheet 4 to prevent the anode electrode sheet 3 and the cathode target sheet 4 from being pressed by the pressing plate 2 to the vicinity of the middle section of the electroplating station 12 or even entering the electroplating solution tank 11. Preferably, a seal 5, such as a sealing gasket, may be provided between the stepped surface of the first opening 13 and the anode electrode sheet 3, and between the stepped surface of the second opening 14 and the cathode target sheet 4. With the above configuration, when the electroplating solution tank 11 is filled with electroplating solution, the seal 5 seals the gap between the stepped surfaces of the first opening 13 / second opening 14 and the anode electrode sheet 3 / cathode target sheet 4, ensuring that the solid target electroplating equipment is in a liquid-sealed state.

[0035] Returning to Figure 2 , in this embodiment, the cathode target sheet 4 and the anode electrode sheet 3 to be electroplated are disc-shaped, and the electroplating station 12 is also formed in a cylindrical shape, thereby forming an electric field between the anode electrode sheet 3 and the cathode target sheet 4 that generally covers the opposite end faces of both. The disc-shaped target is applied to the Cyclotron 30 cyclotron, which can match the beam shape. In other words, the beam covers it more evenly. The advantage of such a configuration is that it not only improves the irradiation efficiency and reduces energy waste, but also makes full use of the target material to reduce the cost required for subsequent processing, and effectively reduces the amount of radioactive waste and chemical treatment waste. Of course, according to actual needs, the solid target electroplating equipment of the present application can still be used to prepare target sheets of other shapes, such as long strips, polygonal thin sheets, or any other shape, and it is necessary to control the area ratio of the opposite end faces of the cathode target sheet 4 to the anode electrode sheet 3 to be 1:1 - 1:2. Preferably, no matter what shapes the cathode target sheet 4 and the anode electrode sheet 3 to be electroplated are formed into, and consequently, no matter what shape the cross-sectional shape of the electroplating station 12 is formed into, the maximum cross-sectional dimension of the electroplating station 12 (for example, cross-sectional length, cross-sectional width, cross-sectional diameter, etc.) is always smaller than the diameter of the electroplating solution tank so that the electroplating solution can flow into the electroplating station 12.

[0036] The material constituting the anode electrode sheet 3 can be selected from one of the following materials: Pt, Ti, graphite, or other suitable materials. The graphite anode has excellent high-temperature resistance, electrical and thermal conductivity, acid and alkali corrosion resistance, high stability and is suitable for machining; the crystal structure of the Ti anode is stable and it is not easily dissolved during electrolysis, thus ensuring stable macroscopic dimensions; the Pt anode has low power consumption and can work in a strongly corrosive environment. The target sheet manufacturer can select a suitable material to constitute the anode electrode sheet 3 according to actual conditions such as the target material to be prepared and the composition of the electroplating solution.

[0037] To ensure that the concentration of the electroplating solution remains uniform throughout the electroplating process, the solid target electroplating equipment may further include a mechanical stirrer (not shown in the figure), which is placed in the electroplating solution tank 11. The mechanical stirrer is electrically connected to an external power supply. Therefore, when the external power supply is enabled to electroplate the cathode target 4, the mechanical stirrer is simultaneously activated to continuously stir the electroplating solution to keep its concentration uniform throughout.

[0038] Furthermore, the solid target electroplating equipment may further include a high-frequency pulse rectifier (not shown in the figure), which is electrically connected to the anode electrode plate 3 and the cathode target 4 respectively. The electrical energy supplied by the external power supply is modulated by the high-frequency pulse rectifier and then supplied to the anode electrode plate 3 and the cathode target 4, so as to ensure the formation of a stable and strong electric field between the anode electrode plate 3 and the cathode target 4, thereby guaranteeing the quality of the prepared target.

[0039] This application also provides an electroplating method for preparing a solid target, which is completed by using the solid target electroplating equipment as described above, and includes the following steps: Fix the anode electrode plate 3 to and block the first opening 13, and fix the cathode target 4 to and block the second opening 14; Introduce the electroplating solution into the electroplating solution tank 11, and place the mechanical stirrer in the electroplating solution tank 11; Start the external power supply to supply power to the mechanical stirrer, the anode electrode plate 3 and the cathode target 4 until a solid target is prepared.

[0040] In one embodiment, the solid target to be prepared is a Ga-Ni alloy target, and the corresponding first electroplating solution can be prepared according to the following steps: Weigh gallium chloride (GaCl3) in a glove box, pour it into a hydrochloric acid solution with a concentration of 0.05 mol / L to 0.15 mol / L to dissolve, and prepare a gallium chloride solution with a concentration of 0.5 mol / L to 2.5 mol / L; Weigh nickel chloride hexahydrate (NiCl2·6H2O), pour it into the above-mentioned gallium chloride solution, and completely dissolve the nickel chloride hexahydrate, thereby preparing the first electroplating solution, that is, a gallium chloride-nickel chloride solution. It should be noted that ensure that the ratio of gallium ions to nickel ions in the first electroplating solution is within the range of 1:1 to 5:1.

[0041] In another embodiment, the solid target to be prepared is a Zn target, and the corresponding second electroplating solution is prepared according to the following steps: Weigh anhydrous zinc chloride (ZnCl2), pour a certain amount of pure water to dissolve it, and obtain a zinc chloride solution; Use a pipette / measuring cylinder to transfer hydrochloric acid with a concentration of 0.1 mol / L to 11.7 mol / L until the zinc chloride solution is adjusted to a pH value of 1 and a concentration of 20 g / L to 240 g / L, thereby obtaining the second electroplating solution.

[0042] In addition, before fixing and sealing the cathode target 4 to the second opening 14, the electroplating method for preparing a solid target of the present application further includes: Clean the surface of the cathode target 4 (for example, using cleansing powder) until a uniform water film is formed on the surface of the cathode target 4.

[0043] In the process of preparing a Ga-Ni alloy target by using the electroplating method for preparing a solid target provided by the present application, after placing the anode electrode sheet 3, the cathode target 4, and the mechanical stirrer in place and pouring in a sufficient amount of the first electroplating solution, an external power source is enabled to supply power to the mechanical stirrer, the anode electrode sheet 3, and the cathode target 4. The stirring rate of the mechanical stirrer can be set within the range of 100 rpm to 1000 rpm. With the aid of a high-frequency pulse rectifier, the electrical energy supplied by the external power source is adjusted to direct current, and its current intensity is within the range of 10 to 50 mA / cm 2 . Preferably, an external heating device can also be used to keep the temperature of the first electroplating solution within the range of 50 °C to 90 °C. Under the above working conditions, electroplate the cathode target 4 for 1 to 24 hours to obtain the desired high-purity Ga-Ni alloy target.

[0044] In addition, in the process of preparing a Zn target by using the electroplating method for preparing a solid target provided by the present application, after placing the anode electrode sheet 3, the cathode target 4, and the mechanical stirrer in place and pouring in a sufficient amount of the second electroplating solution, an external power source is enabled to supply power to the mechanical stirrer, the anode electrode sheet 3, and the cathode target 4. The stirring rate of the mechanical stirrer can be set within the range of 100 rpm to 1000 rpm. With the aid of a high-frequency pulse rectifier, the electrical energy supplied by the external power source is adjusted to direct current, and its current intensity is within the range of 8 to 24 mA / cm 2 . Under the above working conditions, electroplate the cathode target 4 for 0.5 to 12 hours to obtain the desired high-purity Zn target.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A solid target electroplating device, characterized in that, Comprising: A main body having an electroplating solution tank extending along its own height direction inside; An anode electrode plate and a cathode target plate; and A plurality of pressing plates; Wherein, the electroplating solution tank is provided with an electroplating station, and the electroplating station is formed to penetrate the main body in a horizontal direction perpendicular to the height direction of the main body and communicate with the electroplating solution tank. The electroplating station forms a first opening and a second opening on the outer surface of the main body; the anode electrode plate is fixed to and seals the first opening by means of the corresponding pressing plate, and the cathode target plate is fixed to and seals the second opening by means of the corresponding pressing plate.

2. The electroplating device for solid target wafers according to claim 1, wherein The number of the electroplating stations is one or more, and the plurality of electroplating stations are arranged in the height direction.

3. The electroplating equipment for solid target wafers according to claim 1, wherein The area ratio of the opposite end faces of the cathode target plate to the anode electrode plate is in the range of 1:1 to 1:

2.

4. The solid target electroplating equipment according to claim 1, characterized in that, The peripheries of the first opening and the second opening are formed in a stepped shape, and the formed stepped surface serves as a stop portion for the anode electrode plate or the cathode target plate.

5. The electroplating equipment for solid target slices according to claim 4, wherein, It further includes a plurality of seals, and the corresponding seals are arranged between the first opening and the anode electrode plate or between the second opening and the cathode target plate.

6. The electroplating equipment for solid target wafers according to claim 1, characterized in that, The shapes of the anode electrode plate and the cathode target plate are the same or different.

7. The electroplating equipment for solid target wafers according to claim 6, characterized in that, The anode electrode plate and the cathode target plate are formed into a disc shape, a long strip shape, or a polygonal thin plate shape.

8. The electroplating equipment for solid target wafers according to claim 1, characterized in that, The anode electrode plate is selected from one of the following materials: Pt, Ti, or graphite.

9. The electroplating equipment for solid target wafers according to claim 1, characterized in that, It further includes a mechanical stirrer, and the mechanical stirrer is placed into the electroplating solution tank.

10. The solid target electroplating equipment according to claim 1, characterized in that, It further includes a high-frequency pulse rectifier, and the high-frequency pulse rectifier is electrically connected to the anode electrode plate and the cathode target plate respectively.

11. An electroplating method for preparing a solid target, the electroplating method being completed by using the solid target sheet electroplating equipment according to any one of claims 1-10, characterized in that, Including the following steps: Fix the anode electrode plate to and seal the first opening, and fix the cathode target plate to and seal the second opening; Introduce the electroplating solution into the electroplating solution tank, and place the mechanical stirrer in the electroplating solution tank; Start an external power supply to supply power to the mechanical stirrer, the anode electrode plate, and the cathode target plate until the solid target is prepared.

12. The electroplating method for preparing a solid target according to claim 11, characterized in that, The solid target to be prepared is a Ga-Ni alloy target, and the corresponding first electroplating solution is prepared according to the following steps: Obtain gallium chloride and dissolve it in hydrochloric acid with a concentration of 0.05 mol / L to 0.15 mol / L to obtain a gallium chloride solution with a concentration of 0.5 mol / L to 2.5 mol / L; Obtain nickel chloride hexahydrate and completely dissolve it in the gallium chloride solution to obtain a gallium chloride-nickel chloride solution with a ratio of gallium ions to nickel ions in the range of 1:1 to 5:

1.

13. The electroplating method for preparing a solid target according to claim 11, wherein The solid target to be prepared is a Zn target, and the corresponding second electroplating solution is prepared according to the following steps: Obtain anhydrous zinc chloride and dissolve it in pure water to obtain a zinc chloride solution; Use hydrochloric acid with a concentration of 0.1 mol / L to 11.7 mol / L to adjust the pH value of the zinc chloride solution to 1 and the concentration to 20 g / L to 240 g / L.

14. The electroplating method for preparing a solid target according to claim 11, wherein Before fixing the cathode target plate to and sealing the second opening, it further includes: Clean the surface of the cathode target plate until a uniform water film is formed on the surface of the cathode target plate.

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