Temperature measurement method, temperature measurement device, storage medium, and program product

Abstract

The invention relates to a temperature measuring method, a temperature measuring device, a storage medium and a program product. The method comprises a calibration data acquisition step of acquiring calibration data according to a difference between a first temperature measurement value, measured in a first temperature measurement mode, of equipment to be measured and a second temperature measurement value, measured in a second temperature measurement mode, of the equipment to be measured, calibration data used for calibrating the temperature deviation between the temperature measurement value and the actual temperature value of the to-be-measured equipment is obtained, the temperature deviation between the first temperature measurement value and the actual temperature value of the to-be-measured equipment is smaller than a preset allowable value, and the temperature deviation between the second temperature measurement value and the actual temperature value of the to-be-measured equipment is larger than the preset allowable value; a measurement step of measuring a current temperature measurement value of the to-be-measured equipment in a second temperature measurement mode; and a temperature value obtaining step of obtaining an actual temperature value according to the calibration data and the current temperature measurement value. Therefore, the temperature measurement precision, the anti-interference capability and the measurement speed of the to-be-measured equipment can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of temperature control in industry, and particularly to a temperature measurement method, a temperature measurement device, a storage medium, and a program product. Background Art

[0002] In the industrial field, temperature sensors play a crucial role. They can monitor the temperature of equipment operation in real time, thus ensuring the safety and reliability of the equipment. However, with the continuous increase in the clock frequency of modern electronic devices, the significant improvement in system integration, and the increasingly complex and severe external environment changes, higher requirements are put forward for the accuracy, anti-interference ability, and temperature measurement speed of temperature sensors.

[0003] In a related measurement mode, the temperature of an electronic device is calculated by applying two different currents to the electronic device, measuring the corresponding voltages, and calculating the difference between the two. This measurement mode effectively eliminates the influence of reverse saturation current on the measurement accuracy by measuring the voltage difference, so it can significantly improve the measurement accuracy.

[0004] However, in practical applications, system interferences such as power supply noise and electromagnetic interference may have a significant impact on the measurement results. If power fluctuations or noise interference affect the measurement accuracy of the voltage value, a large error may occur in the final temperature measurement result. And due to the existence of parasitic resistance errors inside, multiple measurements need to be taken and averaged each time the voltage is measured, which leads to a significant decrease in the temperature measurement speed.

[0005] In another related measurement mode, the temperature of an electronic device is calculated by applying a large current to the electronic device and measuring the corresponding voltage. Since the measured voltage is usually larger compared to measuring the voltage difference, this measurement mode is less affected by system interference.

[0006] However, due to the fixed deviation between the measured temperature value and the actual temperature value, the measurement accuracy of this measurement mode is low. And since multiple measurements need to be taken and averaged each time the voltage is measured, the temperature measurement speed decreases.

[0007] Therefore, to ensure the stable operation of electronic devices, it is not only necessary to ensure high-precision temperature measurement to accurately reflect the operation state of electronic devices, but also necessary to improve the anti-interference ability to cope with electromagnetic interference, signal noise, etc. in complex environments, and to improve the temperature measurement speed to ensure stability at high clock frequencies.

[0008] In view of this, how to improve the accuracy, anti-interference ability, and measurement speed of temperature measurement of electronic devices is one of the problems to be solved by the present disclosure. Summary of the Invention

[0009] In view of this, the present disclosure provides a temperature measurement method, a temperature measurement device, a storage medium, and a program product, thereby improving the accuracy, anti-interference ability, and measurement speed of temperature measurement of electronic devices.

[0010] According to a first aspect of the present disclosure, there is provided a temperature measurement method, including: a calibration data acquisition step of acquiring calibration data for calibrating an inadmissible temperature deviation between a temperature measurement value and an actual temperature value of a device under test according to a difference between a first temperature measurement value of the device under test measured in a first temperature measurement mode and a second temperature measurement value of the device under test measured in a second temperature measurement mode, wherein a temperature deviation between the first temperature measurement value and the actual temperature value of the device under test is less than a preset allowable value, and a temperature deviation between the second temperature measurement value and the actual temperature value of the device under test is greater than the preset allowable value; a measurement step of measuring a current temperature measurement value of the device under test in the second temperature measurement mode; and a temperature value acquisition step of acquiring a current actual temperature value of the device under test according to the calibration data and the current temperature measurement value.

[0011] In a possible implementation, the first temperature measurement value is a temperature measurement value obtained by measuring a voltage of the device under test in the first temperature measurement mode to obtain a voltage value and calculating based on the voltage value, and the second temperature measurement value is a temperature measurement value obtained by measuring a voltage of the device under test in the second temperature measurement mode to obtain a voltage value and calculating based on the voltage value.

[0012] In a possible implementation, the calibration data acquisition step is performed when the device under test is powered on.

[0013] In a possible implementation, the measurement step includes: in the second temperature measurement mode, performing N voltage measurements on the device under test to obtain N voltage values, where N is greater than or equal to 2; calculating an average voltage value of the N voltage values; and calculating a current temperature measurement value of the device under test based on the average voltage value.

[0014] In a possible implementation, calculating the current temperature measurement value of the device under test based on the average voltage value includes: in the second temperature measurement mode, calculating the current temperature measurement value of the device under test based on an output voltage of a bandgap reference source and a ground voltage measured, and an average value of N voltage values of an anode and an average value of N voltage values of a cathode of a diode included in a temperature sensor, where the N voltage values of the anode of the diode and the N voltage values of the cathode are obtained by performing N voltage measurements on the device under test using the temperature sensor.

[0015] In a possible implementation, calculating the current temperature measurement value of the device under test based on the average voltage includes: in the second temperature measurement mode, using the output voltage of the bandgap reference source as the reference voltage of the analog-to-digital converter, and calculating the current temperature measurement value of the device under test only based on the difference between the average of N voltage values of the anode of the diode included in the temperature sensor and the average of N voltage values of the cathode of the diode, where the N voltage values of the anode of the diode and the N voltage values of the cathode are obtained by performing N voltage measurements on the device under test using the temperature sensor.

[0016] In a possible implementation, the temperature value acquisition step includes: adding the calibration data and the current temperature measurement value of the device under test to obtain the actual current temperature value of the device under test.

[0017] According to a second aspect of the present disclosure, there is provided a temperature measurement device, including a memory, a processor, and a computer program stored on the memory, where the processor executes the computer program to implement the steps of the above method.

[0018] According to a third aspect of the present disclosure, there is provided a non-volatile computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0019] According to a fourth aspect of the present disclosure, there is provided a computer program product, including a computer program, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0020] Compared with the prior art solution of using a single measurement mode to measure the temperature of the device under test, the temperature measurement method, temperature measurement device, storage medium, and program product of the present disclosure obtain calibration data for calibrating the temperature deviation greater than the preset allowable value between the temperature measurement value and the actual temperature value of the device under test based on the difference between the first temperature measurement value of the device under test measured in the first temperature measurement mode (the temperature deviation from the actual temperature value of the device under test is less than the preset allowable value, that is, this temperature deviation is allowable) and the second temperature measurement value of the device under test measured in the second temperature measurement mode (the temperature deviation from the actual temperature value of the device under test is greater than the preset allowable value, that is, this temperature deviation is not allowable), measure the current temperature measurement value of the device under test in the second temperature measurement mode, and obtain the actual current temperature value of the device under test according to the calibration data and the current temperature measurement value.

[0021] Since the calibration value (calibration data) of the measurement result (temperature measurement value) is obtained using the first temperature measurement value before the actual measurement using the second temperature measurement mode, and this calibration data is used to calibrate the measurement result in the second temperature measurement mode to eliminate the deviation of the measurement result in this mode, the accuracy of the temperature measurement of the device under test can be improved. Also, since the temperature measurement is mainly performed using the second temperature measurement mode with strong anti-interference ability, the anti-interference ability can be improved. Additionally, since the accuracy of the measurement is improved by obtaining the calibration data in advance, the number of measurements is reduced compared to the solution of ensuring accuracy through multiple measurements, thereby improving the measurement speed.

[0022] Other features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings included in and constituting a part of this specification, together with the specification, illustrate exemplary embodiments, features, and aspects of the present disclosure and are used to explain the principles of the present disclosure.

[0024] Figure 1 Schematic diagram showing the circuit structure adopted by the existing temperature measurement mode of the electronic device.

[0025] Figure 2 Flowchart showing the temperature measurement method according to an embodiment of the present disclosure.

[0026] Figure 3 Specific flowchart showing measurement step 102 according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0027] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the drawings denote elements having the same or similar functions. Although various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0028] As used herein, the terms "comprising," "including," "having," or variations thereof are open-ended and include one or more stated features, wholes, elements, steps, components, or functions, but do not exclude the presence or addition of one or more other features, wholes, elements, steps, components, functions, or groups thereof.

[0029] When an element is referred to as being "connected," "coupled," "responsive," or variations thereof to another element, it may be directly connected, coupled, or responsive to the other element, or there may be intervening elements.

[0030] Although the terms first, second, third, etc. may be used herein to describe various elements / operations, these elements / operations should not be limited by these terms. These terms are only used to distinguish one element / operation from another. Thus, without departing from the teachings of the inventive concept, a first element / operation in some embodiments may be referred to as a second element / operation in other embodiments.

[0031] As used herein, the term "exemplary" means "serving as an example, instance, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or better than other embodiments.

[0032] In addition, for a better illustration of the present disclosure, numerous specific details are given in the following detailed description. Those skilled in the art should understand that the present disclosure can be implemented without some specific details. In some instances, methods, means, elements, and circuits well-known to those skilled in the art are not described in detail so as to highlight the gist of the present disclosure.

[0033] Figure 1 A schematic diagram showing a circuit structure for temperature measurement of an electronic device is presented.

[0034] In Figure 1 , a remote sensor is disposed within the electronic device that is the device under test. For example, when the device under test is a CPU, the remote sensor can be disposed within the CPU core, and the bandgap reference source and ADC (analog-to-digital converter) can be disposed within the CPU Uncore (non-CPU core). The remote sensor includes a diode, the anode of which is connected to a power supply via a switch, and the cathode of which is grounded.

[0035] I1 and I2 are respectively a small current and a large current injected into the diode, N is the ratio of the large current to the small current, N = I2 / I1. VP and VN are the voltage values across the temperature measurement diode when injecting current. Rs_i and Rs_o are the parasitic impedances of the traces across the temperature measurement diode. VBG is the output voltage of the bandgap reference source BANDGAP, approximately 0.6V, which basically does not change with temperature. VSS is the ground voltage of the bandgap reference source BANDGAP, basically 0V. ΔVg is the voltage difference when the remote sensor and the ADC are not at the same ground. Among them, the wire resistance R does not need to be concerned when there is no current, so it can be ignored (No current don’t care).

[0036] Using Figure 1 the circuit structure, for example, a first temperature measurement mode can be adopted, and its basic principle is as follows:

[0037] ΔVBE = (VP2 - VN2) - (VP1 - VN1) = (VBE2) - (VBE1) = (Nf) * ((K * T) / q) * Ln(N)

[0038] … Equation (1)

[0039] In Equation (1), VP1 and VN1 are the voltage values across the diode when injecting a small current I1, and VP2 and VN2 are the voltage values across the diode when injecting a large current I2. VBE (VP - VN) is the forward voltage drop generated when current flows through the diode and has a negative temperature coefficient. VBE1 is the voltage drop when injecting a small current I1, and VBE2 is the voltage drop when injecting a small current I2. ΔVBE = VBE2 - VBE1, which has a positive temperature coefficient and high linearity. Nf is the ideality factor and is usually approximately 1.

[0040] Using the above Equation (1), the calculation formula for temperature T can be obtained as Equation (2):

[0041] T = ([(VP2 - VN2) - (VP1 - VN1)] * q) / (K * Ln(N))… Equation (2)

[0042] In Equation (2), K is the Boltzmann constant, equal to 1.38E - 23 J / K, T is the thermodynamic temperature, equal to Celsius plus 273.15 K, q is the electron charge quantity, which is 1.6e - 19 C.

[0043] In the actual measurement process, by simulating the Q values at different temperatures (e.g., -40 degrees to 125 degrees), the following temperature relationship between T and Q is obtained:

[0044] Q = [(VP2 - VN2) - (VP1 - VN1)] / (VP1 - VN1)

[0045] By extracting the coefficients C4, C3, C2, C1, and C0, the following Equation (3) is obtained:

[0046] T = C4 * Q^4 + C3 * Q^3 + C2 * Q^2 + C1 * Q + C0… Equation (3)

[0047] Therefore, in the actual temperature measurement, only by measuring the voltage values VP1, VN1, VP2, and VN2, the temperature value can be obtained.

[0048] In the first temperature measurement mode, the temperature is calculated by applying two different currents to the device under test, measuring the corresponding voltages, and calculating the difference between the two. It should be understood that this first temperature measurement mode effectively eliminates the influence of the reverse saturation current on the measurement accuracy by measuring the voltage difference, and thus can significantly improve the measurement accuracy.

[0049] In addition, in the first temperature measurement mode, since the input end of the ADC has a high impedance, the current at the input end of the ADC is small, so it is less affected by the parasitic resistance and has less impact on the sensor signal, thereby improving the measurement accuracy.

[0050] However, in practical applications, system interferences such as power supply noise and electromagnetic interference may have a significant impact on the measurement results of the first temperature measurement mode. If power fluctuations or noise interference affect the measurement accuracy of the voltage value, a large error may occur in the final temperature measurement result.

[0051] Moreover, ΔVBE is usually relatively small, and the voltage change per degree of temperature change is also relatively small, so a high-precision ADC is required.

[0052] In addition, due to the parasitic resistance error inside the ADC, multiple measurements and taking the average value are required each time the voltage is measured. For example, for the input small current I1, the ADC measures VP1 twice and takes the average value, and then measures VN1 twice and takes the average value. For the input large current I2, the ADC also measures VP1 twice and takes the average value, and then measures VN1 twice and takes the average value. Therefore, a total of eight times of ADC voltage measurement time and parameter calculation time (short time) are required for one temperature measurement, which results in a significant decrease in the temperature measurement speed.

[0053] Using Figure 1 the circuit structure of, for example, the second temperature measurement mode can also be adopted, and its basic principle is as follows:

[0054] VBE2 = (VP2 - VN2) = ((K * T) / q) * Ln(I2 / IS) … Equation (4)

[0055] In Equation (4), VP2 and VN2 are the voltage values at both ends of the diode when injecting the large current I2. VBE(VP - VN) is the conduction voltage drop generated when the current flows through the diode and has a negative temperature coefficient. VBE2 is the voltage drop when injecting the large current I2. K is the Boltzmann constant, equal to 1.38E-23 J / K, T is the thermodynamic temperature, equal to the Celsius temperature plus 273.15 K, q is the electron charge amount, which is 1.6e-19 C. IS is the diode saturation current.

[0056] According to the above Equation (4), it can be seen that there is a corresponding relationship between the measured voltage at both ends of the diode and the temperature. Therefore, using this equation, the calculation formula for the temperature T can be obtained.

[0057] In the actual measurement process, in order to eliminate the slope error of the ADC measurement, the measurement of VBG and VSS can be introduced. Specifically, by simulating the Q value at different temperatures (such as, -40 degrees to 125 degrees), the following temperature relationship between T and Q is obtained:

[0058] Q = [(VP2 - VN2) - (VBG - VSS)] / (VBG - VSS)

[0059] Extract coefficients C1 and C0 to obtain the following equation (5):

[0060] T = C1 * Q + C0... Equation (5)

[0061] Therefore, in actual temperature measurement, only the voltage values VP2, VN2, VBG, and VSS need to be measured to obtain the temperature value.

[0062] In the second temperature measurement mode, the temperature is calculated by applying a large current to the device under test and measuring the corresponding voltage. Since the measured voltage is usually larger than measuring the voltage difference, the second temperature measurement mode is less affected by system interference.

[0063] In addition, the second temperature measurement mode is less sensitive to the measurement accuracy of the voltage, and the voltage change generated by each degree change in temperature is also relatively large. Therefore, the second temperature measurement mode has a low requirement for the accuracy of the ADC.

[0064] However, due to the fixed deviation between the measured temperature value and the actual temperature value, the measurement accuracy of the second temperature measurement mode is relatively low.

[0065] Moreover, each time the voltage is measured, multiple measurements and taking the average are also required. For example, for the input large current I2, the ADC measures VP2 twice and takes the average, then measures VN2 twice and takes the average, measures the output VBG of the Bandgap twice and takes the average, and then measures VSS twice and takes the average. Therefore, one temperature measurement requires a total of eight times the time for the ADC to measure the voltage and the parameter calculation time (short time). Thus, the temperature measurement speed is significantly reduced.

[0066] To ensure the stable operation of the electronic device, it is not only necessary to ensure high-precision temperature measurement to accurately reflect the operating state of the electronic device, but also necessary to improve the anti-interference ability to cope with electromagnetic interference, signal noise, etc. in a complex environment and increase the temperature measurement speed to ensure stability at high clock frequencies.

[0067] To solve the above problems, the present disclosure considers integrating the respective advantages of the above first temperature measurement mode and second temperature measurement mode to improve the accuracy, anti-interference ability, and speed of temperature measurement. Specifically, the present disclosure considers that the measurement accuracy can be improved by calibrating the measurement results. Therefore, the present disclosure considers selecting the second temperature measurement mode with strong anti-interference ability as the basic mode for temperature measurement and optimizing it to ensure that the entire temperature measurement process still has strong anti-interference ability in a complex environment, thereby maintaining sufficient stability and reliability throughout the temperature measurement process. On this basis, the first temperature measurement mode is introduced, and with its high-precision characteristics, the measurement results of the second temperature measurement mode are calibrated, thereby improving the accuracy of the measurement results. In addition, when the measurement accuracy is improved by the first temperature measurement mode, the number of measurements is also reduced, thereby improving the measurement speed. Through this integration method, both the strong anti-interference ability is retained, and the measurement accuracy and measurement speed are improved.

[0068] For ease of understanding, the technical solution of the present disclosure will be described in detail below in conjunction with Figure 2 , Figure 3 to elaborate.

[0069] Figure 2 FIG. shows a flowchart of a temperature measurement method according to an embodiment of the present disclosure. This temperature measurement method can be executed by a device under test such as a CPU, or can be executed by the temperature sensor itself. As Figure 2 shown, this temperature measurement method may include: a calibration data acquisition step 101, a measurement step 102, and a temperature value acquisition step 103.

[0070] In the calibration data acquisition step 101, according to the difference between the first temperature measurement value of the device under test measured in the first temperature measurement mode and the second temperature measurement value of the device under test measured in the second temperature measurement mode, calibration data for calibrating the inadmissible temperature deviation between the temperature measurement value and the actual temperature value of the device under test is obtained, where the temperature deviation between the first temperature measurement value and the actual temperature value of the device under test is less than a preset allowable value, and the temperature deviation between the second temperature measurement value and the actual temperature value of the device under test is greater than the preset allowable value.

[0071] In this embodiment, the current temperature of the device under test can be measured in the first temperature measurement mode and the second temperature measurement mode respectively to obtain the first temperature measurement value of the device under test measured in the first temperature measurement mode and the second temperature measurement value of the device under test measured in the second temperature measurement mode. Thereafter, the difference between the first temperature measurement value of the device under test measured in the first temperature measurement mode and the second temperature measurement value of the device under test measured in the second temperature measurement mode can be calculated, and calibration data can be obtained according to the difference between the first temperature measurement value and the second temperature measurement value.

[0072] In this embodiment, the temperature deviation between the first temperature measurement value and the actual temperature of the device under test is less than the preset allowable value, so this temperature deviation is allowable, while the temperature deviation between the second temperature measurement value and the actual temperature of the device under test is greater than the preset allowable value, so this temperature deviation is not allowable.

[0073] In this embodiment, when the device under test is powered on, the calibration data acquisition step 101 is performed. Since the interference of factors such as the power supply is small at this time, the first temperature measurement value of the device under test measured in the first temperature measurement mode is close to the ideal value. Therefore, the temperature deviation of the second temperature measurement value of the device under test measured in the second temperature measurement mode can be obtained by using this first temperature measurement value.

[0074] In a possible implementation, the difference between the first temperature measurement value and the second temperature measurement value can be directly used as the above calibration data.

[0075] In a possible implementation, the difference between the first temperature measurement value of the device under test measured in the first temperature measurement mode and the second temperature measurement value of the device under test measured in the second temperature measurement mode can also be multiplied by a predetermined coefficient as the above calibration data.

[0076] In this embodiment, the first temperature measurement value is the temperature measurement value obtained by measuring the voltage of the device under test (such as a single measurement) in the first measurement mode to obtain a voltage value and calculating based on this voltage value. The second temperature measurement value is the temperature measurement value obtained by measuring the voltage of the device under test (such as a single measurement) in the second measurement mode to obtain a voltage value and calculating based on this voltage value.

[0077] In a possible implementation, the measurements of steps 1011 and 1012 can be performed multiple times, and the average value of the multiple measurement values can be obtained as the calibration data.

[0078] In a possible implementation, after the calibration data acquisition step, the VBG and VSS voltages are measured and the measured VBG and VSS voltages are stored. Since the values of the VBG and VSS voltages are relatively fixed, they can be measured only once.

[0079] In the measurement step 102, the current temperature measurement value of the device under test is measured in the second temperature measurement mode.

[0080] The following Figure 3 is used to elaborate in detail the specific process of the measurement step 102.

[0081] As Figure 3 shown, the measurement step 102 may include the following steps:

[0082] Step 1021, in the second temperature measurement mode, perform N voltage measurements on the device under test to obtain N voltage values, where N is greater than or equal to 2.

[0083] Step 1022, calculate the average voltage of the N voltage values obtained in the second temperature measurement mode.

[0084] Step 1023, calculate the current temperature measurement value of the device under test based on the calculated average voltage.

[0085] In this embodiment, due to the parasitic resistance error inside the ADC, two or more than two voltage measurements are required each time a voltage measurement is performed on the input current. For example, when measuring two voltage values VP2 and VN2 for the input large current I2, calculate the average value of the measured values of the two voltage values VP2 and the average value of the measured values of the two voltage values VN2 respectively. Therefore, a total of four voltage measurements are required for each temperature measurement. For example, when measuring three voltage values VP2 and VN2 for the input large current I2, calculate the average value of the measured values of the three voltage values VP2 and the average value of the measured values of the three voltage values VN2 respectively. Therefore, a total of six voltage measurements are required for each temperature measurement. And so on. It can be seen from this that according to the present disclosure, the number of ADC measurement voltage measurements required for each temperature measurement is basically equivalent to 1 / 2 of the measurement times of the first temperature measurement mode and the second temperature measurement mode.

[0086] In a possible implementation, the calculated average voltage can be used as the current temperature measurement value of the device under test.

[0087] In a possible implementation, step 1023 may include: in the second temperature measurement mode, based on the output voltage of the bandgap reference source and the ground voltage measured, and the average value of the N voltage values (VP1...VPN) of the anode of the diode included in the temperature sensor and the average value of the N voltage values (VN1...VNN) of the cathode, calculate the current temperature measurement value of the device under test, where the N voltage values of the anode of the diode and the N voltage values of the cathode are obtained by performing N voltage measurements on the device under test using the temperature sensor. In the above example, N is taken as 2 for description.

[0088] In a possible implementation, step 1023 may include: in the second temperature measurement mode, using the output voltage of the bandgap reference source as the reference voltage of the analog-to-digital converter, and calculating the current temperature measurement value of the device under test only based on the difference between the average value of N voltage values (VP1…VPN) at the anode of the diode included in the temperature sensor and the average value of N voltage values (VN1…VNN) at the cathode of the diode, where the N voltage values at the anode of the diode and the N voltage values at the cathode are obtained by performing N voltage measurements on the device under test using the temperature sensor. In the above example, N is taken as 2 for description.

[0089] In a possible implementation, in the second temperature measurement mode, VBG is used as the reference voltage of the ADC, and the calculation formula of Q changes from the above formula Q = [(VP2 - VN2) - (VBG - VSS)] / (VBG - VSS) to:

[0090] Q = [(VP2 - VN2) - 1]

[0091] In a possible implementation, the Q value can be obtained by only measuring and acquiring the voltage value difference VP2 - VN2, so as to obtain the temperature value. The simplification of the temperature value calculation is realized.

[0092] In the temperature value acquisition step 103, the current actual temperature value of the device under test is obtained according to the calibration data and the current temperature measurement value.

[0093] In a possible implementation, in the temperature value acquisition step 103, the calibration data and the temperature measurement value are added to obtain the current actual temperature value of the device under test.

[0094] In a possible implementation, in the temperature value acquisition step 103, the calibration data is multiplied by a predetermined coefficient, and this value and the temperature measurement value are added to obtain the current actual temperature value of the device under test.

[0095] Next, the temperature measurement performance of the temperature measurement method of the present disclosure will be described relative to only using the first temperature measurement mode and the second temperature measurement mode.

[0096] As described above, due to the parasitic resistance error inside the ADC, two or more voltage measurements are required each time a voltage measurement is performed on the input current. The following description is based on the following default settings: tm_clkoutcounter (the number of cycles spent for one ADC measurement) is a, fclk (clock frequency) is b, and the quantization times for each analog voltage quantity is c.

[0097] For the first temperature measurement mode, for the input small current I1, the ADC measures the voltage value VP1 c times and the voltage value VN1 c times, and calculates the average value of the measured values of the c voltage values VP1 and the average value of the measured values of the c voltage values VN1 respectively; for the input large current I2, the ADC measures the voltage value VP2 c times and the voltage value VN2 c times, and calculates the average value of the measured values of the c voltage values VP2 and the average value of the measured values of the c voltage values VN2. Therefore, a total of 4c ADC voltage measurements are required for one temperature measurement. In addition, in order to obtain the temperature value, additional parameter calculation time (short time) is required.

[0098] For the second temperature measurement mode, for the input large current I2, the ADC measures the voltage value VP2 c times and the voltage value VN2 c times, and calculates the average value of the measured values of the c voltage values VP2 and the average value of the measured values of the c voltage values VN2 respectively, measures the output voltage VBG of the bandgap reference source c times and the ground voltage VSS of the bandgap reference source c times, and calculates the average value of the output voltage VBG of the c bandgap reference sources and the average value of the ground voltage VSS of the c bandgap reference sources respectively. Therefore, a total of 4c ADC voltage measurements are required for one temperature measurement. In addition, in order to obtain the temperature value, additional parameter calculation time (short time) is required.

[0099] For the temperature measurement method of the present disclosure, as described above, in the calibration data acquisition step, it is necessary to perform measurements in the first temperature measurement mode and the second temperature measurement mode, for example, once. After that, it is necessary to measure the output voltage VBG of the bandgap reference source and the output voltage VSS of the bandgap reference source once. In the measurement step, for the input large current I2, the ADC measures the voltage value VP2 c times and the voltage value VN2 c times, and calculates the average value of the measured values of the c voltage values VP2 and the average value of the measured values of the c voltage values VN2 respectively. Therefore, a total of 2c ADC voltage measurements are required for one temperature measurement. In addition, in order to obtain the accurate actual temperature value, it is necessary to calculate the calibration data time and obtain the current actual temperature value of the device under test according to the calibration data and the temperature measurement value. However, compared with the time required for voltage measurement, these parameter calculation times are very short.

[0100] It can be seen that the number of measurements of the temperature measurement method of the present disclosure is significantly reduced compared with the number of measurements in the first temperature measurement mode and the second temperature measurement mode.

[0101] Taking the quantization times of each analog voltage quantity as 2 as an example, as shown in Table 1 below, the measurement times of the temperature measurement method of the present disclosure are significantly reduced compared to those of the first temperature measurement mode and the second temperature measurement mode. Therefore, the measurement time is significantly reduced and the measurement speed is increased. At the same time, while maintaining high measurement accuracy, a strong anti-interference ability is ensured. Therefore, the temperature measurement method of the present disclosure shows significant advantages in terms of anti-interference ability, measurement accuracy, and measurement speed as a whole.

[0102] [Table 1]

[0103]

[0104]

[0105] In a possible implementation manner, the time for measuring the temperature once in the first temperature measurement mode and the second temperature measurement mode is about 0.9 ms, the time for measuring the temperature once in the temperature measurement method of the present disclosure is about 0.45 ms, the ADC interference 1 mv temperature deviations in the first temperature measurement mode and the second temperature measurement mode are 1.7 degrees and 0.92 degrees respectively, and the ADC interference 1 mv temperature deviation in the temperature measurement method of the present disclosure is 0.92 degrees. According to the present disclosure, compared with the first temperature measurement mode, the anti-interference ability is improved by about 1.85 times, and compared with the first temperature measurement mode and the second temperature measurement mode, the temperature measurement speed is increased by about 2 times.

[0106] Therefore, the temperature measurement method according to the above embodiments of the present disclosure can improve the temperature measurement speed, anti-interference ability, and temperature measurement accuracy simultaneously while the power consumption and area are almost unchanged, so as to meet the temperature measurement requirements of the CPU system under the conditions of multi-core and strong interference. And, the present disclosure is optimized and improved on the basis of the existing mode, so the reliability is high.

[0107] The embodiments of the present disclosure also provide a temperature measurement device, including a memory, a processor, and a computer program stored on the memory, and the processor executes the computer program to implement the steps of the above method.

[0108] The embodiments of the present disclosure also provide a non-volatile computer-readable storage medium, on which a computer program is stored, and the computer program realizes the steps of the above method when being executed by a processor.

[0109] The embodiments of the present disclosure also provide a computer program product, including a computer program, or a non-volatile computer-readable storage medium carrying the computer program, and the computer program realizes the steps of the above method when being executed by a processor.

[0110] A computer-readable storage medium can be a tangible device that can hold and store programs / instructions used by an instruction execution device. The computer-readable storage medium can be, for example, -- but is not limited to -- an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (non-exhaustive list) of the computer-readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disc (DVD), a memory stick, a floppy disk, a mechanically encoded device, such as a punched card or raised structures in grooves storing instructions thereon, and any suitable combination of the foregoing. The computer-readable storage medium used herein is not construed as an instantaneous signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagated through a waveguide or other transmission medium (e.g., an optical pulse through an optical fiber cable), or an electrical signal transmitted through a wire.

[0111] The computer programs (or computer-readable program instructions) described herein can be downloaded from a computer-readable storage medium to respective computing / processing devices, or downloaded to an external computer or external storage device through a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include a copper transmission cable, an optical fiber transmission, a wireless transmission, a router, a firewall, a switch, a gateway computer, and / or an edge server. A network adapter or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable storage medium in each computing / processing device.

[0112] A computer program (or computer program instructions) for performing the operations of the present disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine - related instructions, microcode, firmware instructions, state - setting data, or source code or object code written in any combination of one or more programming languages, including object - oriented programming languages such as Smalltalk, C++, etc., and conventional procedural programming languages such as the "C" language or similar programming languages. The computer - readable program instructions may be executed entirely on a user's computer, partially on the user's computer, executed as a stand - alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider). In some embodiments, by using the state information of the computer - readable program instructions to customize an electronic circuit, such as a programmable logic circuit, a field - programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit can execute the computer - readable program instructions to implement various aspects of the present disclosure.

[0113] Aspects of the present disclosure are described herein with reference to the flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present disclosure. It should be understood that each block of the flowcharts and / or block diagrams, and combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer - readable program instructions.

[0114] These computer - readable program instructions can be provided to a processor of a general - purpose computer, a special - purpose computer, or other programmable data - processing apparatus to produce a machine such that the instructions, when executed by the processor of the computer or other programmable data - processing apparatus, create a means for implementing the functions / actions specified in one or more blocks of the flowchart and / or block diagram. These computer - readable program instructions can also be stored in a computer - readable storage medium, which causes a computer, a programmable data - processing apparatus, and / or other devices to operate in a particular manner, so that the computer - readable medium storing the instructions includes a manufacture, which includes instructions for implementing various aspects of the functions / actions specified in one or more blocks of the flowchart and / or block diagram.

[0115] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device, causing a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process such that the instructions executed on the computer, other programmable data processing apparatus, or other device implement the functions / acts specified in one or more boxes of the flowchart and / or block diagram.

[0116] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a segment of code, or a portion of an instruction, which contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the figures. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending upon the functionality involved. It should also be noted that each block of the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified function or act, or by a combination of dedicated hardware and computer instructions.

[0117] The embodiments of the present disclosure have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the market, or to enable other ordinary skilled artisans in the art to understand the embodiments disclosed herein.

Claims

1. A temperature measurement method, characterized in that, Comprising: A calibration data acquisition step, which acquires calibration data for calibrating an inadmissible temperature deviation between a temperature measurement value and an actual temperature value of the device under test according to a difference between a first temperature measurement value of the device under test measured in a first temperature measurement mode and a second temperature measurement value of the device under test measured in a second temperature measurement mode, wherein a temperature deviation between the first temperature measurement value and the actual temperature value of the device under test is less than a preset allowable value, and a temperature deviation between the second temperature measurement value and the actual temperature value of the device under test is greater than the preset allowable value; A measurement step, which measures a current temperature measurement value of the device under test in the second temperature measurement mode; and A temperature value acquisition step, which acquires a current actual temperature value of the device under test according to the calibration data and the current temperature measurement value.

2. The temperature measurement method according to claim 1, characterized in that, The first temperature measurement value is a temperature measurement value obtained by measuring the voltage of the device under test in the first temperature measurement mode to obtain a voltage value and calculating based on the voltage value, and the second temperature measurement value is a temperature measurement value obtained by measuring the voltage of the device under test in the second temperature measurement mode to obtain a voltage value and calculating based on the voltage value.

3. The temperature measurement method according to claim 1 or 2, characterized in that, When the device under test is powered on, the calibration data acquisition step is performed.

4. The temperature measurement method according to claim 1 or 2, characterized in that The measurement step includes: Performing N voltage measurements on the device under test in the second temperature measurement mode to obtain N voltage values, where N is greater than or equal to 2; Calculating an average voltage value of the N voltage values; and Calculating a current temperature measurement value of the device under test based on the average voltage value.

5. The temperature measurement method according to claim 4, wherein Calculating a current temperature measurement value of the device under test based on the average voltage value includes: In the second temperature measurement mode, calculating a current temperature measurement value of the device under test based on an output voltage of a bandgap reference source and a ground voltage measured, and an average value of N voltage values of an anode of a diode included in a temperature sensor and an average value of N voltage values of a cathode, where the N voltage values of the anode of the diode and the N voltage values of the cathode are obtained by performing N voltage measurements on the device under test using the temperature sensor.

6. The temperature measurement method according to claim 4, characterized in that, Calculating a current temperature measurement value of the device under test based on the average voltage value includes: In the second temperature measurement mode, using the output voltage of the bandgap reference source as a reference voltage of an analog-to-digital converter, and calculating a current temperature measurement value of the device under test only based on a difference between an average value of N voltage values of an anode of a diode included in a temperature sensor and an average value of N voltage values of a cathode of the diode, where the N voltage values of the anode of the diode and the N voltage values of the cathode are obtained by performing N voltage measurements on the device under test using the temperature sensor.

7. The temperature measurement method according to claim 1 or 2, characterized in that, The temperature value acquisition step includes: Adding the calibration data and the current temperature measurement value of the device under test to obtain a current actual temperature value of the device under test.

8. A temperature measurement device, comprising a memory, a processor, and a computer program stored on the memory, characterized in that, The processor executes the computer program to implement the steps of the method according to any one of claims 1 to 7.

9. A non-volatile computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

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