High-temperature pressure switch sensor suitable for semiconductor industry

Abstract

The invention discloses a high-temperature pressure switch sensor suitable for the semiconductor industry, and relates to the technical field of intelligent sensors, the high-temperature pressure switch sensor comprises an outer shell, a floating assembly and a sensing assembly, the outer end of the outer shell is provided with a heat dissipation assembly, the outer end of the bottom of the heat dissipation assembly is provided with a piston seat, and the outer end of the bottom of the piston seat is connected with a butt joint. Cooling oil stored in the heat exchange cavity, the heat dissipation base at the bottom end of the partition plate and the piston base can directly cool the piston base, the situation that the lifting precision is affected by high-temperature expansion of the piston base is prevented, and when the floating piston moves upwards, the cooling oil is pushed to enter the heat exchange cavity through the one-way liquid inlet valve, and high-temperature oil and low-temperature oil are mixed and cooled; according to the circulating system, by means of the direct proportion relation between the temperature and the pressure, the cooling oil is automatically triggered to flow and dissipate heat when the equipment pressure rises, oil boiling is avoided through continuous heat exchange, and the heat stability of the system is maintained.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent sensors, and particularly to a high-temperature pressure switch sensor suitable for the semiconductor industry. Background Art

[0002] As a core component of modern industrial automation and Internet of Things technologies, intelligent sensors have achieved a leap from single physical quantity detection to intelligent decision-making by integrating sensing, data processing, and communication functions. Compared with traditional sensors, their core advantages lie in environmental adaptability, multi-signal fusion, and fault self-diagnosis capabilities. High-temperature pressure switch sensors belong to intelligent sensors, and high-temperature pressure switch sensors can effectively meet the stringent requirements for stability and reliability in high-temperature and high-pressure scenarios such as semiconductor manufacturing.

[0003] In semiconductor manufacturing and packaging processes, the high-temperature and high-pressure environment has extremely high requirements for the stability and reliability of equipment. As a key monitoring component, the pressure switch sensor needs to accurately control the pressure under extreme working conditions and ensure the continuity of signal transmission. Traditional pressure switch sensors mostly use metal materials or simple heat dissipation structures, but they are prone to piston assembly jamming and poor contact of contacts due to thermal expansion during long-term high-temperature operation, which may lead to signal distortion or failure. In addition, conventional cooling systems mostly rely on external heat dissipation devices, which have problems such as response lag and low heat dissipation efficiency, and it is difficult to achieve dynamic adaptation of oil circulation cooling and pressure changes, and it is easy to cause boiling or seal failure due to too high oil temperature.

[0004] In the prior art, the sensor contacts usually adopt a single signal transmission path. When the contacts fail due to high-temperature oxidation or mechanical wear, it is difficult to determine the fault point in time, which may lead to system misjudgment or shutdown. At the same time, for working conditions with a sudden rise in ambient temperature, traditional sensors lack an active temperature control protection design, and internal electronic components are easily damaged by heat, affecting the service life of the equipment. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-temperature pressure switch sensor suitable for the semiconductor industry to solve the problems raised in the above background art.

[0006] To achieve the above object, the present invention provides the following technical solution: A high-temperature pressure switch sensor applicable to the semiconductor industry, comprising a housing, a floating component and a sensing component. A heat dissipation component is provided at the outer end of the housing, and a piston seat is arranged at the outer bottom end of the heat dissipation component, and a docking head is connected to the outer bottom end of the piston seat. A floating component is arranged inside the housing. The floating component includes a floating seat. A first return spring is arranged at the outer bottom end of the floating seat, and a docking rod is connected to the middle bottom end of the floating seat. A floating piston is arranged at the outer bottom end of the docking rod. A sensing head is arranged at the outer top end of the floating seat, and a pressing head is arranged at the outer top end of the sensing head. A pair of through contacts is arranged at the outer end of the sensing head. A communication head is arranged at the outer end of the housing, and a signal transmission line is arranged at the end of the communication head. An opening and closing contact is arranged at one end of the communication head away from the signal transmission line.

[0007] Further, the heat dissipation component includes a heat dissipation seat. Heat dissipation fins are arranged at the outer end of the heat dissipation seat, and a heat exchange cavity is opened inside the heat dissipation seat. A one-way liquid inlet valve and a one-way liquid discharge valve are arranged between the heat exchange cavity and the heat dissipation seat. A partition is arranged inside the heat dissipation seat.

[0008] Further, the heat dissipation seat, the housing and the piston seat are of an integrated structure, and the heat dissipation seat is communicated with the heat exchange cavity through the one-way liquid inlet valve and the one-way liquid discharge valve.

[0009] Further, the heat dissipation seat is communicated with the piston seat, and the piston seat and the docking head are of an integrated structure.

[0010] Further, the floating seat is elastically connected to the heat dissipation seat through the first return spring, and the outer contour size of the floating piston matches the inner contour size of the piston seat.

[0011] Further, the floating piston drives the floating seat and the sensing head to move upward through the docking rod, and the upward movement of the sensing head drives the pair of through contacts to separate from and contact the opening and closing contacts.

[0012] Further, a top shell is arranged at the outer top end of the housing, and a pair of through grooves are opened inside the top shell. A thermal electromagnetic iron is arranged inside the top of the housing, and a sensing component is arranged inside the bottom of the housing.

[0013] Further, the sensing component includes a lifting seat. A ventilation groove is opened at the outer top end of the lifting seat, and a heat dissipation cavity is opened inside the lifting seat. A pressing contact is arranged at the middle bottom end of the lifting seat, and a second return spring is arranged between the lifting seat and the housing.

[0014] Further, the lifting seat is electromagnetically adsorbed and connected to the thermal electromagnetic iron, and the lifting seat is elastically connected to the second return spring.

[0015] Further, the through groove communicates with the heat dissipation cavity through a ventilation groove, and the extrusion contact is arranged inside the heat dissipation cavity.

[0016] The present invention provides a high-temperature pressure switch sensor applicable to the semiconductor industry, having the following

[0017] Beneficial effects:

[0018] 1. The cooling oil stored inside the heat exchange cavity, the heat dissipation seat at the bottom of the partition board, and the piston seat of the present invention can directly cool the piston seat, preventing its high-temperature expansion from affecting the lifting accuracy. When the floating piston moves upward, it pushes the cooling oil to enter the heat exchange cavity through the one-way liquid inlet valve to realize the mixed cooling of high- and low-temperature oil. When it moves downward, the cooling oil in the heat exchange cavity is sucked back into the heat dissipation seat and the piston seat through the one-way liquid discharge valve. This circulation system utilizes the positive proportional relationship between temperature and pressure to automatically trigger the flow and heat dissipation of the cooling oil when the equipment pressure increases, avoiding the boiling of the oil and maintaining the thermal stability of the system through continuous heat exchange.

[0019] 2. The high-temperature cooling oil entering the heat exchange cavity of the present invention dissipates heat quickly through the heat dissipation fins, ensuring that the heat exchange cavity maintains a low-temperature state. Since the outer shell and the heat dissipation seat are integrally designed, the cooling oil can absorb the heat of the outer shell synchronously when dissipating heat in the heat exchange cavity, thereby reducing the working temperature of the internal communication head and the opening and closing contacts, effectively preventing signal interference and attenuation caused by high temperature, and avoiding contact failure of the opening and closing contacts and the through contacts due to thermal expansion.

[0020] 3. When the equipment ambient temperature is too high, the thermosensitive electromagnet loses power and the lifting seat moves downward driven by the second return spring, making the ventilation groove communicate with the through groove of the top shell. The low-temperature cold air enters the heat dissipation cavity from here to cool and protect the internal extrusion contact. If the bottom contact of the opening and closing contact fails, the floating seat pushes the through contact to contact its top contact under the action of air pressure. At the same time, the extrusion head abuts against the extrusion contact. At this time, the pressure switch can determine the bottom contact fault by receiving the dual signals of the top contact of the opening and closing contact and the extrusion contact through the signal transmission line. If only the signal of the extrusion contact is received, it is judged that the communication head is abnormal. The accurate identification of the fault point and the guarantee of the working stability are realized through the multi-contact signal interaction verification. Description of the Drawings

[0021] Figure 1 is the overall three-dimensional structure schematic diagram of a high-temperature pressure switch sensor applicable to the semiconductor industry of the present invention;

[0022] Figure 2 is the internal sectional structure schematic diagram A of a high-temperature pressure switch sensor applicable to the semiconductor industry of the present invention;

[0023] Figure 3 is the internal sectional structure schematic diagram B of a high-temperature pressure switch sensor applicable to the semiconductor industry of the present invention;

[0024] Figure 4 Schematic diagram of the floating component structure of a high-temperature pressure switch sensor applicable to the semiconductor industry according to the present invention;

[0025] Figure 5 Overall sectional structure schematic diagram of a high-temperature pressure switch sensor applicable to the semiconductor industry according to the present invention;

[0026] Figure 6 Schematic diagram of the displacement structure of the floating component and the sensing component of a high-temperature pressure switch sensor applicable to the semiconductor industry according to the present invention.

[0027] In the figure: 1. Outer housing; 2. Heat dissipation component; 201. Heat dissipation base; 202. Heat dissipation fins; 203. Heat exchange cavity; 204. One-way liquid inlet valve; 205. One-way liquid discharge valve; 206. Partition board; 3. Piston seat; 4. Docking head; 5. Floating component; 501. Floating seat; 502. First return spring; 503. Docking rod; 504. Floating piston; 505. Sensing head; 506. Extrusion head; 507. Through contact; 6. Communication head; 7. Signal transmission line; 8. Open / close contact; 9. Top shell; 10. Through slot; 11. Thermosensitive electromagnet; 12. Sensing component; 1201. Lifting seat; 1202. Ventilation slot; 1203. Heat dissipation cavity; 1204. Extrusion contact; 1205. Second return spring. Specific embodiments

[0028] Please refer to Figures 1 to 6 , the present invention provides a technical solution: a high-temperature pressure switch sensor applicable to the semiconductor industry, including an outer housing 1, a floating component 5 and a sensing component 12. A heat dissipation component 2 is arranged at the outer end of the outer housing 1, and a piston seat 3 is arranged at the outer bottom end of the heat dissipation component 2, and a docking head 4 is connected to the outer bottom end of the piston seat 3. A floating component 5 is arranged inside the outer housing 1. The floating component 5 includes a floating seat 501. A first return spring 502 is arranged at the outer bottom end of the floating seat 501, and a docking rod 503 is connected to the middle bottom end of the floating seat 501. A floating piston 504 is arranged at the outer bottom end of the docking rod 503. A sensing head 505 is arranged at the outer top end of the floating seat 501, and an extrusion head 506 is arranged at the outer top end of the sensing head 505. A through contact 507 is arranged at the outer end of the sensing head 505. A communication head 6 is arranged at the outer end of the outer housing 1, and a signal transmission line 7 is arranged at the end of the communication head 6, and an open / close contact 8 is arranged at one end of the communication head 6 away from the signal transmission line 7.

[0029] The specific operation is as follows. The inside of the adapter 4 is provided with threads, which enables the adapter 4 to be conveniently and stably connected to the external pipeline. After the staff connects the adapter 4 to the pipeline to be pressure-tested and powers on the device and completes the electrical connection with the pressure switch, the device can operate normally. During the operation of the device, the gas pressure and liquid pressure in the pipeline can be transmitted to the inside of the piston seat 3 through the adapter 4. The floating piston 504 is arranged inside the piston seat 3, so that the pressure can push the floating piston 504 to move upward. The floating piston 504 is connected to the floating seat 501 through the connecting rod 503, which enables the floating seat 501 to push the sensing head 505 to rise. When the sensing head 505 moves upward, the on-communication contact 507 is separated from the bottom contact of the opening and closing contact 8. The communication head 6 can sense this separation state and transmit this signal to the pressure switch through the signal transmission line 7. At this time, the pressure switch can open the valve to relieve pressure. After the pressure is restored, the floating seat 501 will reset under the traction of the first return spring 502. At this time, the contacts are re-closed, and the pressure switch will control the valve to close.

[0030] Please refer to Figures 1 to 6 , the heat dissipation component 2 includes a heat dissipation seat 201. The outer end of the heat dissipation seat 201 is provided with heat dissipation fins 202, and a heat exchange cavity 203 is formed inside the heat dissipation seat 201. A one-way liquid inlet valve 204 and a one-way liquid discharge valve 205 are arranged between the heat exchange cavity 203 and the heat dissipation seat 201. A partition 206 is arranged inside the heat dissipation seat 201. The heat dissipation seat 201 is an integrated structure with the outer shell 1 and the piston seat 3, and the heat dissipation seat 201 is communicated with the heat exchange cavity 203 through the one-way liquid inlet valve 204 and the one-way liquid discharge valve 205. The heat dissipation seat 201 is communicated with the piston seat 3, and the piston seat 3 and the adapter 4 are an integrated structure. The floating seat 501 is elastically connected to the heat dissipation seat 201 through the first return spring 502. The outer contour size of the floating piston 504 matches the inner contour size of the piston seat 3. The floating piston 504 drives the floating seat 501 and the sensing head 505 to move upward through the connecting rod 503, and the upward movement of the sensing head 505 drives the on-communication contact 507 to be separated from and contact the opening and closing contact 8;

[0031] The specific operation is as follows. Cooling oil is stored inside the heat exchange chamber 203, as well as in the heat dissipation seat 201 at the bottom of the partition plate 206 and inside the piston seat 3. The cooling oil can directly cool the piston seat 3, preventing the piston seat 3 from expanding and deforming at high temperatures, which may affect its normal lifting and lowering. In addition, during the upward movement of the floating piston 504, it can push the cooling oil to flow, enabling the cooling oil to enter the inside of the heat exchange chamber 203 through the one-way liquid inlet valve 204. This allows the high-temperature cooling oil to be mixed and cooled with the low-temperature cooling oil inside the heat exchange chamber 203. During the downward movement of the floating piston 504, the cooling oil inside the heat exchange chamber 203 will flow back to the heat dissipation seat 201 and inside the piston seat 3 through the one-way liquid discharge valve 205 due to the suction force during the displacement of the floating piston 504. Through this operation, the mixed cooling of the cooling oil can be achieved, which can prevent the cooling oil from boiling at too high a temperature. Since the temperature rise is directly proportional to the pressure rise, the device can automatically perform a cooling operation when the pressure rises, effectively improving the working stability of the device in a high-temperature environment. The high-temperature cooling oil entering the heat exchange chamber 203 will be quickly dissipated through the heat dissipation fins 202, ensuring that the cooling oil inside the heat exchange chamber 203 is at a low temperature during subsequent heat exchange. Since the outer housing 1 and the heat dissipation seat 201 are integrated, during the cooling process of the cooling oil inside the heat exchange chamber 203, it can absorb heat from the outer housing 1, enabling the communication head 6 and the opening and closing contact 8 inside the outer housing 1 to be in a low-temperature environment. This can effectively prevent signal interference and attenuation caused by high temperature, as well as contact failure between the opening and closing contact 8 and the corresponding contact 507 due to thermal expansion caused by high temperature.

[0032] Please refer to Figures 1 to 6 , a top shell 9 is provided at the outer end of the top of the outer housing 1, and a corresponding through groove 10 is formed inside the top shell 9. A thermal electromagnetic iron 11 is arranged inside the top of the outer housing 1, and a sensing assembly 12 is arranged inside the bottom of the outer housing 1. The sensing assembly 12 includes a lifting seat 1201. An air vent groove 1202 is formed at the outer end of the top of the lifting seat 1201, and a heat dissipation chamber 1203 is formed inside the lifting seat 1201. An extrusion contact 1204 is arranged at the middle of the bottom of the lifting seat 1201, and a second return spring 1205 is arranged between the lifting seat 1201 and the outer housing 1. The lifting seat 1201 is electromagnetically adsorbed and connected to the thermal electromagnetic iron 11, and the lifting seat 1201 is elastically connected to the second return spring 1205. The corresponding through groove 10 is communicated with the heat dissipation chamber 1203 through the air vent groove 1202, and the extrusion contact 1204 is arranged inside the heat dissipation chamber 1203;

[0033] The specific operation is as follows. When the ambient temperature of the device is too high, the thermal electromagnetic iron 11 will lose power after sensing that the ambient temperature reaches the specified temperature. At this time, the second return spring 1205 will push the lifting seat 1201 downward, which makes the ventilation groove 1202 communicate with the through groove 10 of the top shell 9, so that the low-temperature cold air can enter the inside of the heat dissipation cavity 1203. The end of the extrusion contact 1204 is located inside the heat dissipation cavity 1203, which enables the extrusion contact 1204 to be cooled to prevent it from being damaged in a high-temperature environment. In addition, if the contact at the bottom of the opening and closing contact 8 fails to transmit a signal, under the push of air pressure, the floating seat 501 will push the through contact 507 to contact the top contact of the opening and closing contact 8. At this point, the extrusion head 506 will just contact the extrusion contact 1204. The extrusion contact 1204 is separately connected to a signal transmission line 7 and connected to a pressure switch. Through the above operations, when the pressure switch receives dual signals from the top contact of the opening and closing contact 8 and the extrusion contact 1204, the device can determine that the contact at the bottom of the opening and closing contact 8 is damaged. If the pressure switch only receives the signal from the extrusion contact 1204, it can be judged that the communication head 6 is damaged. This enables the device to transmit signals through multiple contacts to ensure the working stability and determine the faulty signal transmission point through the verification of multiple signals.

[0034] In summary, for this high-temperature pressure switch sensor applicable to the semiconductor industry, during use, first, the connector 4 is internally provided with threads, which enables the connector 4 to be conveniently and stably docked with the external pipeline. The staff completes the docking of the connector 4 with the pipeline to be pressure-tested, and after the device is powered on and the circuit is connected to the pressure switch, the device can operate normally;

[0035] Then, during the operation of the device, the gas pressure and liquid pressure in the pipeline can be transmitted to the inside of the piston seat 3 through the connector 4. The floating piston 504 is arranged inside the piston seat 3, which enables the pressure to push the floating piston 504 upward. The floating piston 504 is connected to the floating seat 501 through the docking rod 503, which enables the floating seat 501 to push the sensing head 505 to rise. When the sensing head 505 rises, the through contact 507 separates from the bottom contact of the opening and closing contact 8. The communication head 6 can sense this separation state and transmit this signal to the pressure switch through the signal transmission line 7. At this time, the pressure switch can open the valve to relieve the pressure. After the pressure is restored, the floating seat 501 will reset under the traction of the first return spring 502. At this time, the contacts are re-closed, and the pressure switch will control the valve to close;

[0036] Subsequently, the heat exchange cavity 203, as well as the heat dissipation seat 201 at the bottom of the partition plate 206 and inside the piston seat 3, store cooling oil. The cooling oil can directly cool the piston seat 3, preventing the piston seat 3 from expanding and deforming at high temperatures, which may affect its normal lifting and lowering. In addition, during the upward movement of the floating piston 504, it can push the cooling oil to flow, enabling the cooling oil to enter the heat exchange cavity 203 through the one-way liquid inlet valve 204. This allows the high-temperature cooling oil to be mixed and cooled with the low-temperature cooling oil in the heat exchange cavity 203. When the floating piston 504 moves downward, the cooling oil in the heat exchange cavity 203 will flow back to the heat dissipation seat 201 and inside the piston seat 3 through the one-way liquid discharge valve 205 due to the suction force during the displacement of the floating piston 504. Through this operation, the mixed cooling of the cooling oil can be achieved, preventing the cooling oil from boiling at too high a temperature. Since the temperature rise is directly proportional to the pressure rise, the device can automatically perform a cooling operation when the pressure rises, effectively enhancing the working stability of the device in a high-temperature environment;

[0037] Subsequently, the high-temperature cooling oil entering the heat exchange cavity 203 will be quickly dissipated through the heat dissipation fins 202, ensuring that the cooling oil in the heat exchange cavity 203 is at a low temperature during subsequent heat exchange. Since the outer housing 1 and the heat dissipation seat 201 are integrated, during the cooling process of the cooling oil in the heat exchange cavity 203, it can absorb heat from the outer housing 1, enabling the communication head 6 and the opening and closing contact 8 inside the outer housing 1 to be in a low-temperature environment. This can effectively prevent signal interference and attenuation caused by high temperatures, as well as contact failure between the opening and closing contact 8 and the corresponding contact 507 due to thermal expansion;

[0038] Finally, when the ambient temperature of the device is too high, the thermosensitive electromagnet 11 will lose power after sensing that the ambient temperature reaches the specified temperature. At this time, the second return spring 1205 will push the lifting seat 1201 downward, causing the ventilation groove 1202 to communicate with the corresponding groove 10 of the top shell 9. This allows low-temperature cold air to enter the heat dissipation cavity 1203, squeezing the end of the extrusion contact 1204 located inside the heat dissipation cavity 1203, enabling the extrusion contact 1204 to be cooled to prevent it from being damaged in a high-temperature environment. In addition, if the contact at the bottom of the opening and closing contact 8 fails to transmit a signal, under the push of air pressure, the floating seat 501 will push the corresponding contact 507 to contact the top contact of the opening and closing contact 8. At this point, the extrusion head 506 will exactly contact the extrusion contact 1204. The extrusion contact 1204 is separately connected to a signal transmission line 7 and connected to a pressure switch. Through the above operations, when the pressure switch receives dual signals from the top contact of the opening and closing contact 8 and the extrusion contact 1204, the device can determine that the contact at the bottom of the opening and closing contact 8 is damaged. If the pressure switch only receives the signal from the extrusion contact 1204, it can determine that the communication head 6 is damaged. This enables the device to transmit signals through multiple contacts to ensure working stability and determine the faulty signal transmission point through the verification of multiple signals.

[0039] It should be noted that, in this document, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0040] Specific examples are used in this article to illustrate the principles and implementation manners of the present invention. The description of the above examples is only for helping to understand the method of the present invention and its core idea. The above is only the preferred implementation manner of the present invention. It should be pointed out that due to the limitation of literal expression and objectively infinite specific structures, for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements, refinements or changes can be made, or the above technical features can be combined in an appropriate manner; these improvements, refinements, changes or combinations, or directly applying the concept and technical solution of the invention to other occasions without improvement, shall all be regarded as the protection scope of the present invention.

Claims

1. A high-temperature pressure switch sensor applicable to the semiconductor industry, characterized in that, It includes a housing (1), a floating component (5) and a sensing component (12). A heat dissipation component (2) is provided at the outer end of the housing (1), and a piston seat (3) is arranged at the outer bottom end of the heat dissipation component (2), and a docking head (4) is connected to the outer bottom end of the piston seat (3). The floating component (5) is arranged inside the housing (1). The floating component (5) includes a floating seat (501). A first return spring (502) is arranged at the outer bottom end of the floating seat (501), and a docking rod (503) is connected to the middle end of the bottom of the floating seat (501), and a floating piston (504) is arranged at the outer bottom end of the docking rod (503). A sensing head (505) is arranged at the outer top end of the floating seat (501), and a pressing head (506) is arranged at the outer top end of the sensing head (505). A pair of through contacts (507) is arranged at the outer end of the sensing head (505). A communication head (6) is arranged at the outer end of the housing (1), and a signal transmission line (7) is arranged at the end of the communication head (6), and an opening and closing contact (8) is arranged at one end of the communication head (6) away from the signal transmission line (7).

2. The high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 1, characterized in that, The heat dissipation component (2) includes a heat dissipation seat (201). Heat dissipation fins (202) are arranged at the outer end of the heat dissipation seat (201), and a heat exchange cavity (203) is opened inside the heat dissipation seat (201). A one-way liquid inlet valve (204) and a one-way liquid discharge valve (205) are arranged between the heat exchange cavity (203) and the heat dissipation seat (201). A partition plate (206) is arranged inside the heat dissipation seat (201).

3. The high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 2, wherein The heat dissipation seat (201) is an integral structure with the housing (1) and the piston seat (3), and the heat dissipation seat (201) is communicated with the heat exchange cavity (203) through the one-way liquid inlet valve (204) and the one-way liquid discharge valve (205).

4. The high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 2, characterized in that, The heat dissipation seat (201) is communicated with the piston seat (3), and the piston seat (3) and the docking head (4) are an integral structure.

5. A high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 1, characterized in that, The floating seat (501) is elastically connected to the heat dissipation seat (201) through the first return spring (502), and the outer contour dimension of the floating piston (504) matches the inner contour dimension of the piston seat (3).

6. The high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 1, wherein, The floating piston (504) drives the floating seat (501) and the sensing head (505) to move upward through the docking rod (503), and the upward movement of the sensing head (505) drives the pair of through contacts (507) to separate from and contact the opening and closing contact (8).

7. The high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 1, characterized in that A top shell (9) is arranged at the outer top end of the housing (1), and a pair of through grooves (10) are opened inside the top shell (9). A thermal electromagnet (11) is arranged inside the top of the housing (1), and a sensing component (12) is arranged inside the bottom of the housing (1).

8. A high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 7, characterized in that, The sensing component (12) includes a lifting seat (1201). An air vent groove (1202) is formed at the outer end of the top of the lifting seat (1201), and a heat dissipation cavity (1203) is formed inside the lifting seat (1201). A pressing contact point (1204) is arranged at the middle end of the bottom of the lifting seat (1201), and a second return spring (1205) is arranged between the lifting seat (1201) and the outer housing (1).

9. A high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 8, characterized in that, The lifting seat (1201) is electromagnetically adsorbed and connected to the thermosensitive electromagnet (11), and the lifting seat (1201) is elastically connected to the second return spring (1205).

10. A high-temperature pressure switch sensor applicable to the semiconductor industry according to claim 8, characterized in that, The through groove (10) is communicated with the heat dissipation cavity (1203) through the air vent groove (1202), and the pressing contact point (1204) is arranged inside the heat dissipation cavity (1203).

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