Power supply circuit, control method of power supply circuit and electronic equipment
By adopting a dual power manager architecture in electronic devices and switching the power supply mode to share the electrical pressure, the problem of overheating of the power supply system is solved, and the stability and heat dissipation efficiency of the equipment under high load are improved.
Patent Information
- Application Number
- CN202510520893.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-23
- Publication Date
- 2025-07-25
AI Technical Summary
Electronic equipment power supply systems are prone to overheating during power supply, resulting in a decline in user experience and instability in the system, and may even cause equipment damage.
The dual power manager architecture is adopted, which is arranged on the first and second circuit boards respectively. By switching the power supply mode under different conditions, the first power manager and the second power manager jointly supply power to share the electrical pressure, reduce heat generation, and ensure equipment stability.
It improves the heat dissipation efficiency of electronic devices under high load or high heat generation, avoids performance losses caused by overheating and the risk of equipment damage, and improves system stability and user experience.
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Figure CN120371104A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of power supply design, and particularly to a power supply circuit, a control method of the power supply circuit, and an electronic device. Background Art
[0002] As the functions integrated in electronic devices increase, the load of the power supply system of electronic devices also increases accordingly. In related technologies, the power supply system of electronic devices is prone to overheating during the power supply process, resulting in a decline in user experience and even possible instability or damage to the system. Summary of the Invention
[0003] The present disclosure provides a power supply circuit, a control method of the power supply circuit, and an electronic device.
[0004] According to one aspect of the present disclosure, there is provided a power supply circuit applied to an electronic device. The electronic device includes at least a first circuit board and a second circuit board. The power supply circuit includes: an input interface for inputting a power supply signal; a first power management component disposed on the first circuit board and electrically connected to the input interface and a load component, at least for regulating the voltage of the power supply signal; a second power management component disposed on the second circuit board and electrically connected to the input interface and the load component, at least for regulating the voltage of the power supply signal; wherein, under a first condition, the first power management component is configured to supply power to the load component based on the power supply signal input by the input interface, and under a second condition, the first power management component and the second power management component are configured to supply power to the load component based on the power supply signal input by the input interface, and the first condition is different from the second condition.
[0005] According to an embodiment of the present disclosure, the first condition at least includes that the power of the first power management component is less than a preset power threshold, and the second condition at least includes that the power of the first power management component is not less than the preset power threshold.
[0006] According to an embodiment of the present disclosure, the second condition at least includes that the electronic device is in a charging state.
[0007] According to an embodiment of the present disclosure, the second power management component includes a control switch for controlling the connection or disconnection between the second power management component and the load component; wherein, under the second condition, the control switch controls the connection between the second power management component and the load component.
[0008] Another aspect of the present disclosure provides a control method for a power supply circuit. The power supply circuit is applied to an electronic device, which includes a first circuit board and a second circuit board. The power supply circuit includes: an input interface for inputting a power supply signal; a first power management component disposed on the first circuit board and electrically connected to the input interface and a load component, at least for regulating the voltage of the power supply signal; a second power management component disposed on the second circuit board and electrically connected to the input interface and the load component, at least for regulating the voltage of the power supply signal. The method includes: under a first condition, controlling the first power management component to supply power to the load component based on the power supply signal input through the input interface; under a second condition, controlling the first power management component and the second power management component to supply power to the load component based on the power supply signal input through the input interface; wherein the first condition is different from the second condition.
[0009] According to an embodiment of the present disclosure, the electronic device at least includes a first body and a second body, and the second circuit board is disposed on the second body. The method further includes: when the second condition is satisfied and the target battery power is insufficient, controlling the second power management component to charge the target battery based on the power supply signal input through the input interface, where the target battery is a battery disposed in the second body.
[0010] Another aspect of the present disclosure provides an electronic device, including: a first body including a first circuit board; a second body including a second circuit board, and the second circuit board is electrically connected to the first circuit board; wherein the first body and the second body include a load component, and the first circuit board and the second circuit board are provided with a power supply circuit. The power supply circuit includes: an input interface for inputting a power supply signal; a first power management component disposed on the first circuit board and electrically connected to the input interface and the load component, at least for regulating the voltage of the power supply signal; a second power management component disposed on the second circuit board and electrically connected to the input interface and the load component, at least for regulating the voltage of the power supply signal; wherein, under a first condition, the first power management component is configured to supply power to the load component based on the power supply signal input through the input interface, and under a second condition, the first power management component and the second power management component are configured to supply power to the load component based on the power supply signal input through the input interface.
[0011] According to an embodiment of the present disclosure, the first condition at least includes that the temperature of the first body is less than a preset temperature threshold, and the second condition at least includes that the temperature of the first body is not less than the preset temperature threshold.
[0012] According to an embodiment of the present disclosure, it further includes: a connecting mechanism, and the first body is movably connected to the second body through the connecting mechanism; when the first body and the second body satisfy a target relative position relationship and the first body at least partially shields the second body, it indicates that the electronic device is in a target posture; the second condition at least includes that the electronic device is in the target posture.
[0013] According to an embodiment of the present disclosure, it further includes: a first control module electrically connected to the first battery of the first body for controlling the state of the first battery; a second control module electrically connected to the second battery of the second body for controlling the state of the second battery; wherein, when the second condition is satisfied and the second battery is not fully charged, the first control module controls the first battery to be in an idle state, and the second control module controls the second battery to be in a charging state.
[0014] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The drawings are used to better understand the solution and do not constitute a limitation to the present disclosure. Among them:
[0016] Figure 1 is a schematic structural diagram of a power supply circuit according to an embodiment of the present disclosure;
[0017] Figure 2 is a schematic structural diagram of a power supply circuit according to another embodiment of the present disclosure;
[0018] Figure 3 is a flowchart of a control method for a power supply circuit according to an embodiment of the present disclosure;
[0019] Figure 4 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;
[0020] Figure 5 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure;
[0021] Figure 6 is a schematic structural diagram of a power supply circuit according to another embodiment of the present disclosure;
[0022] Figure 7 is a schematic structural diagram of a power supply circuit according to another embodiment of the present disclosure; and
[0023] Figure 8 is a schematic block diagram of an exemplary electronic device for implementing the embodiments of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0024] The following describes exemplary embodiments of the present disclosure with reference to the accompanying drawings. Various details of the embodiments of the present disclosure are included to assist in understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for clarity and conciseness, the description of well-known functions and structures is omitted below.
[0025] In the technical solution of the present disclosure, the processing of the data involved (such as including but not limited to user personal information), including collection, storage, use, processing, transmission, provision, disclosure, and application, etc., all comply with the provisions of relevant laws and regulations, necessary confidentiality measures are taken, and it does not violate public order and good customs. Figure 1 It is a schematic structural diagram of a power supply circuit according to an embodiment of the present disclosure.
[0026] Such as Figure 1 As shown, the power supply circuit 100 of this embodiment includes an input interface, a first power management component, and a second power management component.
[0027] In the embodiment of the present disclosure, the power supply circuit is applied to an electronic device, and the electronic device can be an electronic device such as a mobile phone, a smart wearable device, or a computer. The electronic device includes at least two circuit boards. For example, a mobile phone with a dual main board, or a foldable device with at least two circuit boards. It should be noted that the present disclosure does not specifically limit the electronic device to which the power supply circuit of the present application is applied, as long as the electronic device has at least two circuit boards.
[0028] In the embodiment of the present disclosure, the power supply circuit includes an input interface, and the input interface is used to input a power supply signal. The input interface can be connected to an external power supply. For example, the input interface is a Type-C interface, the Type-C interface is connected to the external power supply, and the power supply signal input by the Type-C interface can be a power supply signal of 20V / 5A.
[0029] In the embodiment of the present disclosure, the electronic device includes a load component, and the load component is a passive or active device in the electronic device that receives electrical energy and performs specific functions (such as heating, lighting, motion, signal processing, etc.). The types of load components range from basic components (resistors, capacitors) to complex systems (motors, digital chips).
[0030] In the embodiment of the present disclosure, the power supply circuit includes a first power management component, which is arranged on the first circuit board, electrically connected to the input interface and the load component, and is at least used to adjust the voltage of the power supply signal. The first power management component is used to adjust the voltage of the power supply signal to the voltage required by the load component. For example, the first power management component can be a device such as a power management chip, a buck charger, or a charge pump, which adjusts the high voltage of the power supply signal at the input interface to the low voltage required by the load component.
[0031] In an embodiment of the present disclosure, the power supply circuit includes a second power management component, which is disposed on a second circuit board and electrically connected to the input interface and the load component, and is at least used to adjust the voltage of the power supply signal. The second power management component is used to adjust the voltage of the power supply signal to the voltage required by the load component. For example, the second power management component may be a power management chip, a buck charger, a charge pump, or the like. The power supply circuit may provide the power supply signal input by the input interface to the load component through the first power management component and / or the second power management component.
[0032] See Figure 1 , in an embodiment of the present disclosure, under a first condition, the first power management component is configured to supply power to the load component based on the power supply signal input by the input interface, and under a second condition, the first power management component and the second power management component are configured to supply power to the load component based on the power supply signal input by the input interface, and the first condition is different from the second condition. The first condition and the second condition are related to the heat dissipated by the electronic device, and the heat generated by the electronic device under the second condition is greater than the heat generated by the electronic device under the first condition. For example, the first condition may include that the temperature of the electronic device is less than a preset temperature value, and the second condition may include that the temperature of the electronic device is greater than or equal to the preset temperature value. Here, the temperature of the electronic device may be the average temperature of the electronic device. For example, after measuring the temperatures of key parts such as the screen, battery, and main board chip of the electronic device, the average value is taken.
[0033] Under the first condition, the heat dissipated by the electronic device is relatively low, and the electronic device is not in an overheated state. At this time, the power supply signal input by the input interface can be adjusted in voltage by only the first power management component and then provided to the load component. Under the second condition, the heat dissipated by the electronic device increases. By adjusting the voltage of the power supply signal input by the input interface through the first power management component and the second power management component at the same time and providing it to the load component, the power supply pressure of the first power management component can be shared, the heat dissipated by the first power management component can be reduced, and thus the heat dissipated by the electronic device can be reduced.
[0034] In an embodiment of the present disclosure, the increase in the heat generated by the electronic device may be caused by an increase in the electrical energy required by the load component. For example, the increase in the electrical energy required by the load component increases the power supply pressure of the first power management component, resulting in an increase in the heat generated by the first power management component, and thus an increase in the heat generated by the electronic device. The increase in the heat generated by the electronic device may be caused by a change in the state of the electronic device. For example, when the electronic device turns on the lighting function, the heat generated by the electronic device increases. For example, when the frame rate of the video played by the electronic device is switched from a low frame rate to a high frame rate, the heat generated by the electronic device increases. The increase in the heat generated by the electronic device may be caused by the environment in which the electronic device is located. For example, when the electronic device is in a hot environment, the heat generated by the electronic device increases.
[0035] According to the embodiments of the present disclosure, under the first condition, the load component is powered by the first power management component. Under the second condition, the heat generation of the electronic device increases, and the load component is powered by the first power management component and the second power management component simultaneously. The second power management component can provide additional current to the load component to share the power supply pressure of the first power management component. The first power management component and the second power management component are respectively arranged on the first circuit board and the second circuit board, which can improve the overall heat dissipation efficiency of the electronic device, reduce the heat generation of the first circuit board, and further reduce the overall heat generation of the electronic device, ensuring that the electronic device can still work stably under high load or high heat generation conditions, improving system stability and user experience. At the same time, the risk of performance loss and device damage caused by overheating is avoided.
[0036] In some embodiments of the present disclosure, the first condition at least includes that the power of the first power management component is less than a preset power threshold, and the second condition at least includes that the power of the first power management component is not less than the preset power threshold.
[0037] In the embodiments of the present disclosure, the power of the first power management component may refer to the effective power provided by the first power management component to the load component. Under the first condition, the power of the first power management component is less than the preset power threshold, and at this time, the heat generation of the first power management component is small, and the load component can continue to be powered by the first power management component. Under the second condition, the power of the first power management component is not less than the preset temperature threshold, and at this time, the heat generation of the first power management component is large, and the load component can be powered by the first power management component and the second power management component. The second power management component arranged on the second circuit board can share the power supply pressure of the first power management component, thereby avoiding performance loss caused by overheating of the first power management component.
[0038] In the embodiments of the present disclosure, the first condition and the second condition include that the electronic device is in a charging state. For example, the first power management component is further configured to charge the electronic device based on the power supply signal input through the input interface, and / or the second power management component is further configured to charge the electronic device based on the power supply signal input through the input interface.
[0039] In the embodiments of the present disclosure, the first power management component and / or the second power management component can charge the battery of the electronic device while powering the load component. During the process of charging the battery of the electronic device, the power management component also plays a role in regulating the voltage. For example, the voltage of the power supply signal input through the input interface is regulated to the voltage required by the battery.
[0040] Taking the example of the first power management component charging the battery and supplying power to the load component, the principle of switching from the first condition to the second condition will be described. Since the battery can only switch between the charging state and the discharging state, when the battery is in the charging state, the load component can only obtain electrical energy through the first power management component. When the power supply demand of the load component increases, the power of the first power management component correspondingly increases, which in turn leads to an increase in the heat generation of the first power management component. When the power of the first power management component is greater than or equal to the preset power threshold, it switches from the first condition to the second condition.
[0041] Figure 2 It is a schematic structural diagram of a power supply circuit according to another embodiment of the present disclosure.
[0042] As Figure 2 shown, the power supply circuit 200 includes an input interface, a first power management component, and a second power management component. The first power management component is disposed on the first circuit board 210, and the second power management component is disposed on the second circuit board 220. The electronic device includes a battery and a load component.
[0043] In some embodiments of the present disclosure, the second condition at least includes that the electronic device is in the charging state.
[0044] As Figure 2 shown, the battery can be charged through the first power management component and / or the second power management component.
[0045] In one embodiment of the present disclosure, the first condition at least includes that the electronic device is not in the charging state, that is, the battery of the electronic device is in the discharging state or the idle state. The second condition at least includes that the electronic device is in the charging state. When the electronic device is in the charging state, compared with when the electronic device is not in the charging state, the overall heat generation of the electronic device will increase, so the second condition is satisfied.
[0046] In some embodiments of the present disclosure, the second power management component includes a control switch for controlling the connection or disconnection between the second power management component and the load component. Under the second condition, the control switch controls the connection between the second power management component and the load component.
[0047] In an embodiment of the present disclosure, under the second condition, the heat generation of the electronic device increases, and it is necessary to supply power to the load component through the second power management component to share the power supply pressure of the first power management component. Therefore, the connection between the second power management component and the load component can be controlled through the control switch.
[0048] Figure 3 It is a flowchart of a control method for a power supply circuit according to an embodiment of the present disclosure.
[0049] As Figure 3As shown, the control method of the power supply circuit of this embodiment includes operations S310 - S320.
[0050] In operation S310, under the first condition, control the first power management component to supply power to the load component based on the power supply signal input through the input interface.
[0051] In operation S320, under the second condition, control the first power management component and the second power management component to supply power to the load component based on the power supply signal input through the input interface.
[0052] In the embodiment of the present disclosure, the power supply circuit is applied to an electronic device. The electronic device includes a first circuit board and a second circuit board. The power supply circuit includes: an input interface for inputting a power supply signal; a first power management component disposed on the first circuit board, electrically connected to the input interface and the load component, and at least used for regulating the voltage of the power supply signal; a second power management component disposed on the second circuit board, electrically connected to the input interface and the load component, and at least used for regulating the voltage of the power supply signal. Among them, the first condition is different from the second condition.
[0053] In the embodiment of the present disclosure, operations S310 to S320 are similar to the operations performed by the power supply circuit 100 described above, and will not be elaborated here.
[0054] In some embodiments of the present disclosure, the electronic device at least includes a first body and a second body, and the second circuit board is disposed on the second body; the method further includes: when the second condition is satisfied and the target battery power is insufficient, control the second power management component to charge the target battery based on the power supply signal input through the input interface, where the target battery is a battery disposed in the second body. In the embodiment of the present disclosure, when the first circuit board is disposed on the first body, when the second condition is satisfied, it indicates that the electronic device generates a relatively high amount of heat at this time. Since the first power management component on the first body is controlled to supply power to the load component based on the power supply signal input through the input interface under the first condition, the increase in the heat generated by the electronic device may be caused by the first power management component on the first body, that is, the relatively high heat generated by the electronic device is caused by the relatively high heat generated by the first body. A battery may be provided in the first body. When the target battery power in the second body is insufficient, control the second power management component to charge the target battery based on the power supply signal input through the input interface, so that the battery in the first body is in an idle state, which can effectively reduce the heat generated by the first body, and further reduce the overall heat generated by the electronic device.
[0055] Figure 4 It is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure.
[0056] As Figure 4 shown, the electronic device 400 includes a first body 410 and a second body 420.
[0057] In an embodiment of the present disclosure, a first body includes a first circuit board. A second body includes a second circuit board, and the second circuit board is electrically connected to the first circuit board. The first body and the second body include a load component, and a power supply circuit is provided on the first circuit board and the second circuit board. The power supply circuit includes: an input interface for inputting a power supply signal. A first power management component is provided on the first circuit board and is electrically connected to the input interface and the load component, and is at least used to adjust the voltage of the power supply signal. A second power management component is provided on the second circuit board and is electrically connected to the input interface and the load component, and is at least used to adjust the voltage of the power supply signal. Wherein, under a first condition, the first power management component is configured to supply power to the load component based on the power supply signal input by the input interface, and under a second condition, the first power management component and the second power management component are configured to supply power to the load component based on the power supply signal input by the input interface.
[0058] In an embodiment of the present disclosure, the foldable device at least includes a first body and a second body. For example, a folding mobile phone includes a first body and a second body, a flexible screen covers the first body, the second body, and a connecting mechanism that movably connects the first body and the second body, and the connecting mechanism can be a rotating shaft, and the first body and the second body are electrically connected. For example, a folding tablet computer includes a first body, a second body, and a rotating shaft that movably connects the first body and the second body, and the first body and the second body are electrically connected.
[0059] In an embodiment of the present disclosure, the first condition may include that the temperature of the first circuit board is less than a preset temperature, and the second condition may include that the temperature of the second circuit board is greater than or equal to the preset temperature. The temperature of the circuit board can be obtained by taking the average value after monitoring the temperatures of multiple components in the circuit board. The temperature of the circuit board can also be the temperature of the component with the highest temperature in the circuit board.
[0060] In some embodiments of the present disclosure, the first condition at least includes that the temperature of the first body is less than a preset temperature threshold, and the second condition at least includes that the temperature of the first body is not less than the preset temperature threshold.
[0061] In an embodiment of the present disclosure, the temperature of the first body may refer to the average temperature of the first body. For example, the average value is taken after measuring the temperatures of key parts such as the screen, battery, and circuit board chip of the first body. The temperature of the first body may also refer to the temperature of the circuit board in the first body, which can be measured by devices such as a temperature sensor or a thermistor provided on the circuit board. The temperature of the first body may also refer to the temperature of the first power management component in the first body.
[0062] According to the embodiments of the present disclosure, under the first condition, the temperature of the first body is less than the preset temperature threshold. At this time, the heat generation of the first body is small, and the first power management component can continue to supply power to the load component. Under the second condition, the temperature of the first body is not less than the preset temperature threshold. At this time, the heat generation of the first body is large, and the first power management component and the second power management component can supply power to the load component. The second power management component provided on the second body can share the power supply pressure of the first power management component, thereby avoiding performance loss caused by overheating of the first body.
[0063] As Figure 4 shown, the electronic device 400 further includes: a connecting mechanism 430, and the first body is movably connected to the second body through the connecting mechanism. The first body and the second body satisfy a target relative position relationship through the connecting mechanism, and the first body at least partially shields the second body to represent that the electronic device is in a target posture. The second condition at least includes that the electronic device is in the target posture.
[0064] In the embodiments of the present disclosure, the electronic device includes a fully unfolded state, a partially folded state, and a fully folded state. When the electronic device is in the fully unfolded state, the flexible screen covering the first body and the flexible screen on the second body are in the same plane. When the electronic device is in the fully folded state, at this time, the screen of the first body and the screen of the second body can be in a relative state, that is, the flexible screen covering the first body and the flexible screen on the second body are parallel to each other, and the first body at least partially shields the second body. When the electronic device is in the partially folded state, the first body at least partially shields the second body. Figure 4 The electronic device shown is in the partially folded state.
[0065] Figure 5 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.
[0066] As Figure 5 shown, the electronic device 500 includes a first body 510, a second body 520, and a connecting mechanism 530. Figure 5 The electronic device shown is in the fully folded state.
[0067] In an embodiment of the present disclosure, the target posture refers to a state where the electronic device is in a partially folded state or a fully folded state. When the electronic device is in the target posture, since the first body at least partially obscures the second body, the heat dissipation efficiency of the electronic device will be affected, which may lead to an increase in the heat generation of the electronic device. The second condition at least includes that the electronic device is in the target posture. When the electronic device is in a partially folded state or a fully folded state, timely controlling the first power management component and the second power management component to supply power to the load component based on the power supply signal input through the input interface can increase the heat dissipation efficiency of the electronic device, avoid performance loss and equipment damage risks caused by overheating of the electronic device, and improve the stability of the system and the user experience.
[0068] Figure 6 It is a schematic structural diagram of a power supply circuit according to another embodiment of the present disclosure.
[0069] As Figure 6 shown, the power supply circuit 600 includes an input interface, a first control module, a first power management component, a first battery, a second control module, a second power management component, and a second battery. The first control module, the first power management component, and the first battery are disposed on a first circuit board 610 of the first body, and the second control module, the second power management component, and the second battery are disposed on a second circuit board 620 of the second body.
[0070] In an embodiment of the present disclosure, the first control module is electrically connected to the first battery of the first body and is used to control the state of the first battery. The second control module is electrically connected to the second battery of the second body and is used to control the state of the second battery. When the second condition is satisfied and the second battery is not fully charged, the first control module controls the first battery to be in an idle state, and the second control module controls the second battery to be in a charging state.
[0071] In an embodiment of the present disclosure, when the electronic device is in a charging state, that is, the first power management component provides the power supply signal of the input interface to charge the first battery, and the second power management component provides the power supply signal of the input interface to charge the second battery. When the second condition is satisfied, it indicates that the temperature of the first body is too high, or the power of the first power management component is too high. At this time, the heat generation of the first body or the first power management component is relatively high, and the heat dissipation efficiency needs to be improved. When the second condition is satisfied and the second battery is not fully charged, by preferentially charging the second battery, it is possible to avoid the first battery in the first body from continuing to generate heat during charging, thereby avoiding the situation where the first body or the first power management component overheats.
[0072] In an embodiment of the present disclosure, the first control module may include a first coulombmeter and a first switch. The first coulombmeter is used to monitor data such as the real-time power and health status of the first battery. The first switch can control whether the first battery is electrically connected to the first power management component. The second control module may include a second coulombmeter and a second switch. The second coulombmeter is used to monitor data such as the real-time power and health status of the second battery. The second switch can control whether the second battery is electrically connected to the second power management component. When the second condition is met and the second coulombmeter detects that the power of the second battery is insufficient, the first switch controls the first battery to disconnect from the first power management component, and the first battery enters the idle state. The second switch controls the second battery to be electrically connected to the second power management component, and the second battery enters the charging state.
[0073] Figure 7 It is a schematic structural diagram of a power supply circuit according to another embodiment of the present disclosure.
[0074] As Figure 7 shown, the power supply circuit 700 includes an input interface, a gallium nitride switch, a first power management component, a first charge pump, a first control module, a first battery, a second power management component, a second charge pump, a second control module, and a second battery. The first power management component, the first charge pump, the first control module, and the first battery are arranged on a first circuit board 710 of a first body. The second power management component, the second charge pump, the second control module, and the second battery are arranged on a second circuit board 720 of a second body.
[0075] In an embodiment of the present disclosure, the first power management component may be a power management integrated circuit (PMIC). The PMIC is an integrated power management chip responsible for functions such as battery charge and discharge control, voltage regulation, and power consumption allocation. The second power management component may be a buck charger. The buck charger can efficiently convert voltage, reducing energy loss and heat generation during the charging process. The first charge pump and the second charge pump are respectively arranged on the first circuit board 310 and the second circuit board 320. The charge pump (Charge Pump 2:1, CP2:1) can achieve voltage rise and fall through capacitor energy storage. CP2:1 can reduce current heat loss (such as 20V→10V) in fast charging, improving the charging efficiency. The gallium nitride switch (GaN) can reduce energy loss and improve system efficiency. The load component may include a core power supply system, which is responsible for providing stable power for the core components of the electronic device (such as the processor, memory, display driver, etc.).
[0076] In the embodiments of the present disclosure, different charging methods can be used for different charging protocols. For example, the first battery and the second battery can be charged through the first power management component and the second power management component respectively, or the first battery and the second battery can be charged through the first charge pump and the second charge pump respectively. The first power management component, the second power management component, the first charge pump, and the second charge pump are used to adjust the voltage of the power supply signal.
[0077] In the embodiments of the present disclosure, when the electronic device is not charging, the first battery supplies power to the load component. At this time, the electrical energy of both the first battery and the second battery is provided to the load component through the first power management integrated circuit (PMIC). Since the PMIC does not need to adjust the voltage at this time, the situation of PMIC overheating rarely occurs.
[0078] During the charging process of the electronic device, on the one hand, the power supply signal of the input interface supplies power to the load component through the first power management integrated circuit, and on the other hand, the power supply signal of the input interface charges the battery through the power management component or the charge pump. When the power supply demand of the load component is large, the first power management integrated circuit (PMIC) needs to bear a large pressure of voltage conversion, and the PMIC may overheat. When the second condition (the heat generation of the electronic device is relatively high) is met, the second power management component (Buck Charger) shares the power supply pressure of the PMIC. Since the PMIC and the Buck Charger are respectively disposed on the first body and the second body, the heat dissipation efficiency can be effectively improved.
[0079] According to the embodiments of the present disclosure, the present disclosure also provides an electronic device, a readable storage medium, and a computer program product.
[0080] Figure 8 FIG. shows a schematic block diagram of an exemplary electronic device 800 that can be used to implement the methods of the embodiments of the present disclosure. The electronic device is intended to represent various forms of digital computers, such as, a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as, a personal digital processor, a cellular phone, a smart phone, a wearable device, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely exemplary and are not intended to limit the implementation of the present disclosure described and / or claimed herein.
[0081] As Figure 8As shown, device 800 includes a computing unit 801, which can perform various appropriate actions and processes according to computer programs stored in a read-only memory (ROM) 802 or computer programs loaded from a storage unit 808 into a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of device 800 can also be stored. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.
[0082] Multiple components in device 800 are connected to the I / O interface 805, including: an input unit 806, such as a keyboard, a mouse, etc.; an output unit 807, such as various types of displays, speakers, etc.; a storage unit 808, such as a disk, an optical disc, etc.; and a communication unit 809, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 809 allows device 800 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.
[0083] The computing unit 801 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 801 include but are not limited to a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The computing unit 801 executes the various methods and processes described above, such as a control method. For example, in some embodiments, the control method can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as the storage unit 808. In some embodiments, part or all of the computer program can be loaded and / or installed onto device 800 via the ROM 802 and / or the communication unit 809. When the computer program is loaded into the RAM 803 and executed by the computing unit 801, one or more steps of the control method described above can be executed. Alternatively, in other embodiments, the computing unit 801 can be configured to execute the control method in any other appropriate manner (e.g., by means of firmware).
[0084] The various embodiments of the systems and techniques described above in this specification can be implemented in digital electronic circuitry, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chip (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be a special-purpose or general-purpose programmable processor that receives data and instructions from, and transmits data and instructions to, a storage system, at least one input device, and at least one output device.
[0085] The program code for implementing the methods of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing device, such that the program codes, when executed by the processor or controller, cause the functions / operations specified in the flowchart and / or block diagram to be implemented. The program code can be executed entirely on the machine, partly on the machine, as a stand-alone software package partly on the machine and partly on a remote machine, or entirely on the remote machine or server.
[0086] In the context of the present disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
[0087] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and a pointing device (e.g., a mouse or a trackball) through which the user can provide input to the computer. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, speech input, or tactile input).
[0088] The systems and techniques described herein can be implemented in a computing system including backend components (e.g., as a data server), or a computing system including middleware components (e.g., an application server), or a computing system including frontend components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system including any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected to each other by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local area network (LAN), wide area network (WAN), and the Internet.
[0089] A computer system can include a client and a server. The client and the server are generally far from each other and usually interact through a communication network. The relationship between the client and the server is generated by computer programs running on the respective computers and having a client-server relationship with each other. Among them, the server can be a cloud server, also known as a cloud computing server or a cloud host, which is a host product in the cloud computing service system, solving the defects of difficult management and weak business scalability existing in traditional physical hosts and VPS services ("Virtual Private Server", or simply "VPS"). The server can also be a server of a distributed system, or a server combined with a blockchain.
[0090] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in this disclosure can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and no limitation is made herein.
[0091] The above specific embodiments do not constitute a limitation on the protection scope of the present disclosure. Those skilled in the art should understand that various modifications, combinations, sub - combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present disclosure shall be included within the protection scope of the present disclosure.
Claims
1. A power supply circuit is applied to an electronic device. The electronic device at least includes a first circuit board and a second circuit board. The power supply circuit includes: An input interface for inputting a power supply signal; A first power management component is disposed on the first circuit board and is electrically connected to the input interface and a load component, and is at least used to adjust the voltage of the power supply signal; A second power management component is disposed on the second circuit board and is electrically connected to the input interface and the load component, and is at least used to adjust the voltage of the power supply signal; Wherein, under a first condition, the first power management component is configured to supply power to the load component based on the power supply signal input by the input interface. Under a second condition, the first power management component and the second power management component are configured to supply power to the load component based on the power supply signal input by the input interface. The first condition is different from the second condition.
2. According to the power supply circuit of claim 1, the first condition at least includes that the power of the first power management component is less than a preset power threshold, and the second condition at least includes that the power of the first power management component is not less than the preset power threshold.
3. According to the power supply circuit of claim 1, the second condition at least includes that the electronic device is in a charging state.
4. According to the power supply circuit of claim 1, the second power management component includes a control switch for controlling the connection or disconnection between the second power management component and the load component; Among them, Under the second condition, the control switch controls the connection between the second power management component and the load component.
5. A control method for a power supply circuit, the power supply circuit being applied to an electronic device, the electronic device including a first circuit board and a second circuit board, the power supply circuit comprising: An input interface for inputting a power supply signal; A first power management component is disposed on the first circuit board and is electrically connected to the input interface and a load component, and is at least used to adjust the voltage of the power supply signal; A second power management component is disposed on the second circuit board and is electrically connected to the input interface and the load component, and is at least used to adjust the voltage of the power supply signal; The method includes: Under a first condition, controlling the first power management component to supply power to the load component based on the power supply signal input by the input interface; Under a second condition, controlling the first power management component and the second power management component to supply power to the load component based on the power supply signal input by the input interface; Wherein, the first condition is different from the second condition.
6. According to the method of claim 5, the electronic device at least includes a first body and a second body, and the second circuit board is disposed on the second body; The method further includes: When the second condition is satisfied and the target battery power is not full, controlling the second power management component to charge the target battery based on the power supply signal input by the input interface. The target battery is a battery disposed in the second body.
7. An electronic device includes: A first body including a first circuit board; A second body including a second circuit board, and the second circuit board is electrically connected to the first circuit board; Wherein, the first body and the second body include a load component, and a power supply circuit is disposed on the first circuit board and the second circuit board. The power supply circuit includes: An input interface for inputting a power supply signal; A first power management component, disposed on the first circuit board, electrically connected to the input interface and the load component, and at least used to adjust the voltage of the power supply signal; A second power management component, disposed on the second circuit board, electrically connected to the input interface and the load component, and at least used to adjust the voltage of the power supply signal; Wherein, under a first condition, the first power management component is configured to supply power to the load component based on the power supply signal input by the input interface, and under a second condition, the first power management component and the second power management component are configured to supply power to the load component based on the power supply signal input by the input interface.
8. The electronic device according to claim 7, wherein the first condition at least includes that the temperature of the first body is less than a preset temperature threshold, and the second condition at least includes that the temperature of the first body is not less than the preset temperature threshold.
9. The electronic device according to claim 7, further comprising: A connecting mechanism, through which the first body is movably connected to the second body; The first body and the second body satisfy a target relative position relationship through the connecting mechanism, and the first body at least partially shields the second body to represent that the electronic device is in a target posture; The second condition at least includes that the electronic device is in the target posture.
10. The electronic device according to claim 8 or 9, further comprising: A first control module, electrically connected to the first battery of the first body, for controlling the state of the first battery; A second control module, electrically connected to the second battery of the second body, for controlling the state of the second battery; Wherein, when the second condition is satisfied and the second battery is not fully charged, the first control module controls the first battery to be in an idle state, and the second control module controls the second battery to be in a charging state.