Metal core element, chip card body and method for producing chip card

Abstract

The invention relates to a flat metal core element for a card body of a chip card, to a chip card body for a chip card, to a chip card, and to a method for producing a chip card, in particular a transaction card having a chip module capable of carrying out electronic transactions. The chip card includes: a flat metal core element having a mounting area for mounting a chip module to the metal core element; and at least one plastic layer at least partially covering the metal core element and having a receiving opening providing access to the mounting area and configured to receive the chip module; wherein the mounting area is at least partially provided with an abrasion area, the abrasion area is provided with a surface roughening part, and the surface roughening part is used for improving bonding between the mounting area and the chip module when the chip module is mounted on the metal core element; and wherein the receiving opening surrounds the abrasion region.

Description

FIELD OF THE INVENTION

[0001] The present disclosure relates to the field of manufacturing chip cards or other portable data carriers, which include a card body carrying an electronic chip module. In particular, the present disclosure relates to a metal core element for a card body of a chip card (in particular a transaction card having a chip module capable of performing electronic transactions), to a card body for a chip card (in particular a transaction card having a chip module capable of performing electronic transactions), and to a method for manufacturing a chip card (in particular a transaction card having a chip module capable of performing electronic transactions). BACKGROUND OF THE INVENTION

[0002] Chip cards, also known as portable data carriers, are known in the prior art and can be used, for example, for cashless payment of goods or services, personal identification, and / or access to Internet-based applications. Thus, for example, there are card-shaped data carriers in the form of chip cards, payment cards (such as credit cards or debit cards), and ID cards or identity cards. Such chip cards typically have a card body carrying a chip module, which includes an electronic circuit having electronic components, such as an integrated chip, and the electronic components can be accessed to read data therefrom, and based on this, allow the legitimate owner of the data carrier to perform and / or authorize specific actions, such as transactions, especially financial transactions.

[0003] For example, US 2023 / 409861 A1 relates to a method for producing a card body of a chip card, comprising the steps of: providing a flat card body having a metal core, wherein the metal core is at least partially covered with a plastic layer at least in a main area, and wherein the metal core has a slit extending from an outer edge of the main area into the main area; and incorporating a cavity having a bottom area into the plastic layer, the cavity being for receiving a chip module, such that the cavity at least partially covers the slit and at least along the slit there remains excess material relative to the bottom area.

[0004] WO 2021 / 097208 A1 describes a transaction card for dual-interface communication for transactions, which includes a card body, a chip opening, a discontinuity, and a transponder chip. The card body includes a first metal layer having an outer peripheral edge, a first metal face, and a second metal face. The chip opening includes a first chip hole extending laterally from the first metal face towards the second metal face, thereby defining a first metal edge surrounding a predetermined hole shape. The discontinuity extends from the outer peripheral edge to the first metal edge. The transponder chip module has a module antenna and is configured to be received within the chip opening. The module antenna defines an outer antenna edge surrounding a predetermined antenna shape, such that the predetermined antenna shape is the same as the predetermined hole shape for improved inductive coupling via the discontinuity during use.

[0005] US10762412B2A relates to a transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from a starting point on the card perimeter to an ending point in the opening. The card has greater flexural resistance than a card having a relatively discontinuity without one or more strengthening features, and the ending and starting points of the relatively discontinuity are at the same distance from a line defined by a first long side of the card perimeter. The strengthening features include a discontinuity, multiple discontinuities, a self-supporting non-metal layer provided on at least one surface of the card, or one or more ceramic strengthening tabs surrounding the opening, wherein one of the ending or starting points of the discontinuity is positioned relatively closer to the first long side of the card perimeter than the other, and less than all of the multiple discontinuities extend from the card perimeter to the opening.

[0006] EP 4 264 488 A1 relates to a method for manufacturing a card body for a chip card, having the following steps: - providing a metal body part having two main surfaces opposite each other and a peripheral surface connecting the two main surfaces, wherein a module opening for receiving a chip module has been made or will be made in the body part, and, - making a groove on the peripheral surface between the two main surfaces, wherein the groove extends from the peripheral surface to the module opening or the module opening area, and the insertion angle of the groove in at least one of the two main surfaces with respect to the main surface is not equal to 90°.

[0007] EP 2 817 768 B1 relates to a method for manufacturing an electronic module having contact means and comprising the following steps: making available a carrier layer and at least one conductive layer. Applying the at least one conductive layer to the carrier layer by lamination, using a laminate sheet, etc., to form the contact means of the module. The laminate sheet has at least one groove into which the conductive layer is pressed during the lamination process, thereby forming at least one raised portion in the conductive layer such that when the module is embedded in a data carrier base, the contact means and the electrical components of the data carrier base can be contacted through the at least one raised portion.

[0008] As described above, chip cards (e.g., transaction cards) according to the prior art may not fully meet all requirements regarding their mechanical stability. If exposed to certain mechanical shocks, especially repeated bending and pressure applied to the chip card, the mechanical connection and possibly the electrical connection between the chip module and the card body may not last for the required time. For example, the typical or standard service life of a chip card configured as a transaction card is 3 to 8 years, and if the connection between the chip module and the card body or the card body itself is damaged due to daily use, causing the chip card to malfunction at least partially, this period may not be achieved. Summary of the Invention

[0009] Accordingly, the object of the present invention is to provide chip cards which can be used until the end of their respective standard service life and preferably beyond their respective standard service life. In particular, the object of the present invention is to improve the mechanical and / or electrical connection between the chip module and the card body. These objects are achieved at least in part by the subject matter of the independent claims.

[0010] According to one aspect, there is provided a flat metal core element for a chip card body (in particular a transaction card having a chip module capable of performing electronic transactions), the metal core element having a mounting area for mounting the chip module to the metal core element, wherein the mounting area is at least partially provided with an abraded area provided with surface roughening for improving the bond between the mounting area and the chip module when the chip module is mounted to the metal core element.

[0011] According to one aspect, there is provided a chip card body for a chip card (in particular a transaction card having a chip module capable of performing electronic transactions), comprising: a flat metal core element having a mounting area for mounting the chip module to the metal core element, and at least one plastic layer at least partially covering the metal core element and having a receiving opening providing an entrance to the mounting area and configured to receive the chip module; wherein the mounting area is at least partially provided with an abraded area provided with surface roughening for improving the bond between the mounting area and the chip module when the chip module is mounted to the metal core element; and wherein the receiving opening surrounds the abraded area.

[0012] According to one aspect, there is provided a method for manufacturing a chip card (in particular for manufacturing a transaction card having a chip module capable of performing electronic transactions), comprising the steps of: providing a flat metal core element having a mounting area for mounting the chip module to the metal core element; at least partially covering the metal core element with at least one plastic layer having a receiving opening for receiving the chip module and surrounding the mounting area; and bonding the chip module to an abraded area provided with surface roughening in the mounting area for improving the bond between the mounting area and the chip module when the chip module is mounted to the metal core element.

[0013] The proposed solution has the advantage over the prior art that the surface roughening part creates peaks and valleys in the metal surface of the metal core element, enhancing the connection between the mounting area and any material used to mount the chip module to the metal core element. For example, as such a material, an adhesive such as glue and / or solder can be used. The material can flow and adhere to the surface roughening part, thus creating an improved bond. This helps to increase the overall mechanical and / or electrical stability of the chip card, thereby increasing its service life. Setting the surface roughening part as an abraded part has the following advantages: such roughening can be set at any time during the manufacturing process of the chip card, and can be formed and shaped according to the corresponding requirements of the mounting area.

[0014] Further improvement solutions can be derived from the dependent claims and the following description. Features described with reference to the chip card and its components can be implemented as method steps and vice versa. Thus, the description provided in the context of the chip card and its components also applies in a similar way to the corresponding method. In particular, the features and functions of the chip card and its components can be implemented as method steps of a method, and the method steps can be implemented as the corresponding features or functions respectively.

[0015] According to a possible embodiment of the metal core element, the surface roughening part is provided with a rib pattern. The rib pattern can provide a well-defined structure. In addition, the rib pattern can be relatively easily manufactured in a uniform manner. Therefore, the rib pattern helps to provide a reliable and reproducible surface roughening. The ribs constituting the rib pattern further promote the controlled flow of any material used to bond the chip module to the metal core element along the grooves formed between the ribs. Thus, the material can be uniformly distributed between the chip module and the mounting area in a controlled manner without overflowing the mounting area or not covering the mounting area in the desired manner.

[0016] According to a possible embodiment of the metal core element, the rib pattern extends substantially diagonally with respect to the lateral direction of the metal core element. In other words, the rib pattern can extend at an angle with respect to the longitudinal extension of the metal core element. This can help to compensate for mechanical stresses acting on the bond between the chip module and the metal core element, especially if these mechanical stresses are caused by bending the metal core element around its longitudinal axis and / or transverse axis.

[0017] According to a possible embodiment of the metal core element, a slit is formed in the metal core element such that the slit extends from the upper side to the lower side of the metal core element and extends through the mounting area. The slit allows radio frequency waves to be transmitted from one side of the chip card to the other side, for example, reaching the back of the chip card through its surface, because in the slit area, there is no conductive metal barrier layer that interferes with wave propagation.

[0018] According to a possible embodiment of the metal core element, the slit terminates in a mounting opening formed in the mounting area for receiving at least one electrical connector for establishing an electrical connection with the chip module. Thus, the slit can help radio waves enter the mounting space within the card body for mounting the chip module that is to pick up radio waves. Accordingly, the slit can further enhance the radio reception ability of the chip module or any antenna element attached thereto, which may extend at least partially within or through the mounting opening.

[0019] According to a possible embodiment of the metal core element, the slit extends through the mounting area on both sides of the mounting opening. In other words, the slit can pass through the mounting opening or can continue through the mounting opening such that the slit extends away from the mounting opening on both sides of the mounting opening. This further helps to transmit radio waves from one side of the chip card to the other side and / or into the mounting space within the card body.

[0020] According to a possible embodiment of the metal core element, at least in the abrasion zone, the slit extends substantially parallel to the longitudinal direction of the metal core element. Thereby, the slit helps to provide structural flexibility in a controlled manner, especially if a bending force is applied to the card body in the longitudinal direction. This helps to further improve the mechanical and / or electrical stability of the chip card.

[0021] According to a possible embodiment of the metal core element, at least segmentally, the abrasion zone is spaced apart from the slit. In other words, a boundary region without surface roughening can be provided around the slit extending through the abrasion zone. Thus, any material used to bond the chip module to the metal core element can be prevented from entering and thus closing the slit, which may result in undesired structural effects and may impede the propagation of radio waves through the slit.

[0022] According to a possible embodiment of the metal core element, the slit has an outer end segment that terminates at the outer edge of the metal core element and extends substantially perpendicular to the outer edge. This helps to increase the structural stability of the chip card. Thereby, the service life of the chip card can be extended.

[0023] According to a possible embodiment of the metal core element, a first bending segment is connected to the outer end segment and has a first radius of curvature. This again helps to further increase the structural stability of the chip card. Thereby, the service life of the chip card can be further extended.

[0024] According to a possible embodiment of the metal core element, the second bending segment of the slit has a second radius of curvature greater than the first radius of curvature. This also helps to further increase the structural stability of the chip card. Thereby, the service life of the chip card can be additionally extended.

[0025] According to a possible embodiment of the metal core element, an intermediate section of the slit extends between a first bending section and a second bending section. This also helps to increase the structural stability of the chip card. Thereby, the service life of the chip card can be additionally extended.

[0026] According to a possible embodiment of the metal core element, an intermediate section of the slit extends between a first bending section and a second bending section. This helps to extend the slit. This further helps to enable radio waves to be transmitted from one side of the chip card to the other side.

[0027] According to a possible embodiment of the metal core element, the intermediate section extends substantially parallel to the outer edge of the metal core element. Thereby, the slit helps to provide structural flexibility in a controlled manner, especially if a bending force is applied to the card body in the middle part. This helps to further improve the mechanical and / or electrical stability of the chip card.

[0028] According to a possible embodiment of the card body, the receiving opening has at least one rounded corner section with a corner radius that is smaller than the radius of the mounting opening of the metal core element, preferably smaller than 2.25 mm. In other words, the receiving opening can be shaped differently from the mounting opening. For example, the mounting opening can be substantially circular or at least oval, and the receiving opening can have a shape similar to a TV screen with a corresponding corner radius. Adding a minimum radius of, for example, about 2.25 mm or less than 2.25 mm to each side of the mounting opening allows for the application of an abrasive pattern while minimizing the risk of damaging the plastic layer around the mounting opening.

[0029] According to a possible embodiment of the card body, at least in the region of the rounded corner section, a distance is provided between the abrasive zone and the inner perimeter of the receiving opening. Thus, a safety margin around the abrasive zone is provided. This further facilitates the application of the abrasive pattern while minimizing the risk of damaging the plastic layer around the mounting opening.

[0030] According to a possible embodiment of the card body, the chip module is received in the receiving opening and is mounted to the mounting area by being at least bonded to the abrasive zone. In particular, the chip module can be exclusively bonded to the abrasive zone. Thus, an enhanced and well-defined connection is provided between the mounting area and any material used to mount the chip module to the metal core element. This helps to increase the overall mechanical and / or electrical stability of the chip card, thereby increasing its service life.

[0031] According to a possible embodiment of the card body, the chip module is at least glued to the abrasive zone. Gluing itself is an effective way to mount the chip module to the card body. The abrasive zone helps to enhance the adhesive connection between the chip module and the card body. This helps to further increase the overall mechanical and / or electrical stability of the chip card and thus increase its service life.

[0032] According to a possible embodiment of a method for manufacturing a chip card, the method further includes the step of forming an abraded area through a receiving opening, preferably by laser ablation. Thereby, the abraded area can be arranged and / or shaped according to the individual position of the receiving opening relative to the metal core element. This helps to additionally increase the overall mechanical and / or electrical stability of the chip card and thus increase its service life. Description of the Drawings

[0033] Figure 1 is a schematic top view of a chip card including a card body and a chip module.

[0034] Figure 2 is Figure 1 a schematic top view of the chip card shown before the chip module is mounted to the card body.

[0035] Figure 3 is Figure 2 schematic detail II of the chip card shown.

[0036] Figure 4 is Figure 3 a schematic cross-sectional view of the chip card along section line A-A depicted therein.

[0037] Figure 5 is Figure 4 a schematic top view of the mounting area of the chip card shown, which is provided with an abraded area.

[0038] Figure 6 is a schematic cross-sectional view of the chip card along section line A-A depicted therein, where the chip module has been mounted to the mounting area.

[0039] Figure 7 is including for Figures 1 to 6 a schematic top view of a metal sheet of the chip card shown including a plurality of metal core elements.

[0040] Figure 8 is for manufacturing Figures 1 to 6 a schematic flow chart of the steps of the method for the chip card shown. Detailed Description

[0041] The following detailed description is merely exemplary in nature and is not intended to limit the invention and the use of the invention. Furthermore, it is not intended to be bound by any theory presented in the foregoing background art or the following detailed description. The representations and illustrations in the drawings are schematic and not to scale. Identical reference numerals denote identical elements. A greater understanding of the subject matter described can be obtained by reviewing the illustrations and by reviewing the subsequent detailed description.

[0042] Figure 1Fig. 1 shows a schematic top view of a chip card 1 including a card body 2 and a chip module 3. The chip card 1 extends in a longitudinal direction X, a transverse direction Y, and a height direction Z, together forming a Cartesian coordinate system. The top surface 4 of the chip card 1 faces the height direction Z. The transverse side surfaces 6 of the chip card 1, namely the longitudinal side surface 5a and the transverse side surface 5b, extend substantially parallel to the longitudinal X and the transverse Y, respectively.

[0043] Figure 2 Fig. 2 shows a schematic top view of the chip card 1 before the chip module 3 is mounted to the card body 2. Figure 1 The chip module 3 is to be received in a cavity 6 formed in the card body 2. The cavity 6 includes a receiving opening 7 and a mounting opening 8 that are concentrically arranged around the center point C of the cavity 6. The point C is arranged at a longitudinal distance d from the nearest transverse side surface 5b x and at a transverse distance d from the nearest longitudinal side surface 5a. y

[0044] In a projection against the height direction Z, the receiving opening 7 has a substantially rectangular or TV screen shape and is provided with a rounded corner 9 having a radius r9 of about 2.2 mm. The length l of the receiving opening 7 measured parallel to the longitudinal axis X is quantified to be about 13.15 mm, while the width w of the receiving opening 7 measured parallel to the transverse axis Y is equal to about 11.95 mm. The mounting opening 8 has a substantially circular or elliptical shape in a projection against the height direction Z, with a radius r8 of approximately 4.9 mm.

[0045] Figure 3 Fig. 3 shows a schematic detail II of the chip card 1 as shown in Figure 2 Fig. 2. It is obvious here that a slit 10 is formed in the metal core element of the chip card 1 (see Figure 4 ). The slit 10 has a first curved section 11 and an intermediate section 13 arranged between them. The radius r 11 of the first curved section 11 is smaller than the radius r 12 of the second curved section 12, and the first curved section 11 is connected to the outer end section 14 of the slit 10, and the outer end section 14 terminates at one of the side surfaces 5, particularly the transition side surface 5b.

[0046] ​The second curved section 12 is connected to the inner end section 15 of the slit 10 in the cavity 6. The extension section 16 is arranged in the cavity 6 on the side opposite to the side of the mounting opening 8 where the inner end section 15 is arranged. In other words, the slit 10 virtually spans across the extension opening 8 such that the inner end section 15 continues as the extension section 16, whereby the slit 10 extends on both sides of the mounting opening 8. The inner end section 15 is aligned with the extension section 16. Both the inner end section 15 and the extension section 16 extend parallel to the longitudinal direction X and thus parallel to the longitudinal side 5a and the corresponding longitudinal edges of the cavity 6, in particular the corresponding longitudinal edges of the part of the cavity 6 defined by the receiving opening 7.

[0047] The end point 17 of the slit 10, in particular the end point 17 of the section 17, is located outside the transverse edge of the receiving opening 7 and thus outside the transverse edge of the cavity 6. Thereby, the longitudinal distance d of the end point 17 measured parallel to the longitudinal direction X from the transverse side 5b 17X exceeds the longitudinal distance of the transverse edge of the receiving opening 7. In other words, the longitudinal distance d of the end point 17 from the conversion side 5b 17X is greater than the longitudinal distance d of the center point C from this transverse side 5b CX plus half of the width w of the cavity 6.

[0048] Therefore, the total longitudinal extension e of the slit 10 measured from the position where the outer end section 14 of the slit 10 terminates in the transverse side 5b 10X is greater than the longitudinal distance of the cavity 6, in particular the receiving opening 7, from this transverse side 5b plus the width w of the cavity 6, in particular the receiving opening 7. The transverse distance d of the end point 17 measured parallel to the transverse direction Y from the longitudinal side 5a 17X is selected such that it is less than the transverse distance d of the center point C from the longitudinal side 5a CY . Thereby, the slit 10, in particular its inner end section 17 and the extension section 16, are arranged in the upper half of the cavity 6. The total transverse extension e of the slit 10 measured parallel to the transverse direction Y between the outer end section 14 and the extension section 16 of the slit 10 10Y is less than the transverse distance d of the end point 17 17X .

[0049] In addition, at Figure 3It becomes apparent that an installation area 20 is provided in the cavity 6 for mounting the chip module 3 onto the card body 2. The installation area 20 is provided in the form of a ledge within the cavity 6, where the installation opening 8 is smaller than the receiving opening 7. The slit 10, in particular its inner end section 15 and the extension section 16, respectively span or pass through the entire installation area 20. The slit 10 and the cavity 6 are covered from below by a plastic layer provided by the plastic bottom element 21, while the slit 10 is formed in the metal core element 22 and extends from the upper side of the metal core element 22 to the lower side of the metal core element 22, and the metal core element 22 provides the installation opening 8 and is covered by another plastic layer in the form of a plastic top element 23 of the card body 2 (see Figure 4 ) As Figure 3 shown, the first bending section 11, the second bending section 12, the intermediate section 13, the outer end section 14 and the end point 17 of the slit 10 are covered by the plastic top element 23, while the inner end section 15 and the extension section 16 are located substantially exposed within the cavity 6.

[0050] Figure 4 shows Figure 3 a schematic cross-sectional view of the chip card 1 shown in 22 along the sectional line A-A depicted therein. It is apparent here that the card body 2 generally takes the form of a flat substrate provided by the plastic bottom element 21. The metal core element 22 and the plastic top element 23 provide the top surface 4. For example, the plastic bottom element 21 and the plastic top element 23 can be made of thermoplastic materials such as PC, PVC, PET, PETG, and / or ABS. The height h of the metal core element 22 measured parallel to the height direction Z 22 can be quantified as approximately 0.66 mm. Since the installation opening 8 formed in the metal core element 22 and the receiving opening 7 formed in the plastic top element 23 together define the chamber 6, the height h of the plastic top element 23 measured parallel to the height direction Z 23 can be quantified as approximately 0.22 mm, whereby as the sum of the height h of the metal core element 22 22 and the height h of the plastic top element 23 23 the corresponding depth of the chamber 6 measured parallel to the height direction Z reaches approximately 0.88 mm.

[0051] The installation area 20 is provided on the surface 24 of the metal core element 22, in particular on its top surface. An abrasion area 25 is formed in the installation area 20 on the surface 24. The abrasion area 25 can include a rib pattern 26 composed of peaks 27 and valleys 28, and the abrasion area 25 can be formed to provide a channel 29 such that the slit 10 (in particular its inner end section 15) can pass through the channel 29 and span the abrasion area 25 (see Figure 5). To form the abrading zone 25, an abrading device 30 for applying an abrading tool 31 can be used. In this example, a laser device is used as the abrading device 30, which emits a laser beam serving as the abrading tool 31.

[0052] Figure 5 shows Figure 4 a schematic top view of the mounting area 20 of the chip card shown, which mounting area 20 is provided with an abrading zone 25. It is obvious here that the rib pattern 26 is arranged at an angle α of approximately 60° with respect to the longitudinal direction X and thus extends substantially diagonally across the mounting area 20. Alternative angles α between the rib pattern 26 and the longitudinal direction X can be selected, for example, between 20° and 70°, between 30° and 60°, and / or approximately 45°. The rib pattern 26 provides peaks 27 and valleys 28 arranged adjacent to each other. Any material (such as an adhesive (not shown)) for mounting the chip module 3 to the mounting area 20 can be displaced within the valleys 28 such that the chip module 3 can abut against the peaks 27 while avoiding the material from oozing out between the chip module 3 and the mounting area 20, and at the same time the enlarged surface provided by the rib pattern 26 enables a particularly strong bond between the material and the metal core element 22.

[0053] Furthermore, it becomes apparent in Figure 5 that the channels 29 formed in the abrading zone 25 are provided to omit the rib pattern 26. Thereby, in the region of the channels 29, a boundary region 32 is formed between the abrading zone 25 and the slit 10, especially its inner end section 15. Similarly, the boundary region 32 without the rib pattern 26 is circumferentially arranged around the mounting opening 8 between the mounting opening 8 and the abrading zone 25. The boundary region 32 is also applied peripherally around the abrading zone 25 between the abrading zone 25 and the receiving opening 7. Here, the circular edge 9 of the receiving opening 9 helps to shape the abrading zone 25 such that it covers an area that is sufficient as a part of the mounting area 20 to mount the chip module 3 onto the metal core element 22.

[0054] Figure 6 is a schematic cross-sectional view of the chip card 1 along the section line A - A in the state where the chip module 3 has been mounted to the mounting area 20. The chip module 3 is arranged within the cavity 6, especially within the part provided by the receiving opening 7, and is bonded to the abrading zone 20 by means of a corresponding material (not shown). The chip module 3 rests on the metal core element 22 and is flush with its surface 24. The height h3 of the chip module 3 is substantially equal to the height h of the plastic top element 23 23Thus, the top surface of the chip module 3 is substantially aligned with the top surface 4 of the chip card 1 provided by the plastic top element 23. Below the chip module 8, a closed mounting space 33 is formed within the mounting opening 8, and this mounting space is covered by the chip module 3. Within the mounting space 33, an electrical connector 34, such as conductive lines, can be arranged, for example, for contacting corresponding electrical contacts of the chip module 3 from below. The electrical connector 34 can be provided, for example, for connection to an electrical coil and / or at least partially used as an electrical coil to allow wireless data transmission between the chip module 3 and a transceiver device (not shown) via corresponding radio waves, which can pass through and / or via the slit 10 through the metal core element 22.

[0055] Figure 7 A schematic top view of the metal sheet 40 is shown, and the metal sheet 40 includes those for Figures 1 to 6 the multiple metal core elements 22 of the chip card 1 shown. The slits 10 for the multiple metal core elements 22 can already be formed in the metal sheet 40. Some of the slits 10, especially their outer end segments 14, can be formed such that they terminate at the outer edge 41 of the metal sheet 41, and this outer edge 41 will constitute the outer edge 41 of the metal core element 22 located in the region of the corresponding conversion side 5b of the chip card 1. To separate the metal core elements 22 from each other, the metal sheet 40 can be provided with cutting marks 42 and / or reference marks 43. Some of the cutting marks 42 can constitute the reference marks 43, and vice versa.

[0056] Figure 8 An exemplary step S of a method for manufacturing Figures 1 to 6 the chip card shown is illustrated in a schematic flowchart, where the techniques of the steps S can be selected and / or changed as needed. For example, in a first step S1, the metal sheet 40 can be provided. In step S2, the cutting marks 42 and / or reference marks 43 can be applied to the metal sheet 40. In step S3, the slits 10 can be formed in the metal sheet 40. In step 4, the metal core elements 22 can be separated from each other, i.e., individualized. In step S5, the metal core elements 22 can be provided into the mounting opening 8.

[0057] In step S6, the plastic bottom element 21 can be joined to the metal core element 22. In step S7, the plastic top element 23 can be joined to the medical element 22. In step S8, the receiving opening 7 can be formed. In step S9, the abrasion zone 25 can be formed. In step S10, by mounting the chip module 3 to the mounting area 20, for example, by gluing the bottom side of the chip module 3 to the abrasion zone 25 while electrically connecting the chip module 3 to the electrical connector 34, the chip module 3 can be joined to the card body 2.

[0058] List of reference numerals

[0059] 1 Chip card

[0060] 2 Card body

[0061] 3 Chip module

[0062] 4 Top surface

[0063] 5 Lateral side

[0064] 5a Longitudinal side

[0065] 5b Transverse side

[0066] 6 Cavity

[0067] 7 Receiving opening

[0068] 8 Mounting opening

[0069] 9 Rounded corner

[0070] 10 Slit

[0071] 11 First curved section

[0072] 12 Second curved section

[0073] 13 Intermediate section

[0074] 14 Outer end section

[0075] 15 Inner end section

[0076] 16 Extension section

[0077] 17 End point

[0078] 20 Mounting area

[0079] 21 Plastic bottom element

[0080] 22 Metal core element

[0081] 23 Plastic top element

[0082] 24 Surface

[0083] 25 Abrasion area

[0084] 26 Ribbed pattern

[0085] 27 Peak

[0086] 28 Valley

[0087] 29 Channel

[0088] 30 Abrasion device

[0089] 31 Abrasion tool / Laser

[0090] 32 Edge area

[0091] 33 Installation space

[0092] 34 Electrical connector

[0093] 40 Metal sheet

[0094] 41 Outer edge

[0095] 42 Cutting mark

[0096] 42 Reference mark

[0097] d CX Longitudinal distance of the center point

[0098] d CY Transverse distance of the center point

[0099] d 17X Longitudinal distance of the slit end

[0100] d 17Y Transverse distance of the slit end

[0101] e 10X Longitudinal extension of the slit

[0102] e 10Y Transverse extension of the slit

[0103] h 22 Height of the metal core element

[0104] h 23 Height of the plastic top element

[0105] h3 Height of the chip module

[0106] l Cavity length

[0107] r7 Radius of the receiving opening

[0108] r9 Radius of the rounded corner

[0109] w Cavity width

[0110] X Longitudinal direction

[0111] Y Transverse direction

[0112] Z Height direction

[0113] α Angle

[0114] S1 Provide the metal sheet

[0115] S2 Apply the mark

[0116] S3 Form the slit

[0117] S4 Individualize the core element

[0118] S5 provides an installation opening

[0119] S6 applies a plastic bottom

[0120] S7 applies a plastic top

[0121] S8 forms a receiving opening

[0122] S9 forms an abrasion area

[0123] S10 installs the chip module

Claims

1. A flat metal core element for a chip card, in particular for a transaction card having a chip module capable of performing electronic transactions, for a card body, The metal core element has a mounting area for mounting the chip module to the metal core element, Among them, The mounting area is at least partially provided with an abrasion area, and the abrasion area is provided with a surface roughening portion for improving the bonding between the mounting area and the chip module when the chip module is mounted to the metal core element.

2. The metal core component according to claim 1, wherein, The surface roughening portion is provided as a rib pattern.

3. The metal core component according to claim 2, wherein, The rib pattern extends substantially diagonally with respect to the lateral direction of the metal core element.

4. The metal core element according to claim 1, wherein A slit is formed in the metal core element such that the slit extends from the upper side to the lower side of the metal core element and extends through the mounting area.

5. The metal core element according to claim 4, wherein, The slit terminates at a mounting opening formed in the mounting area, and the mounting opening is for receiving at least one electrical connector for establishing an electrical connection with the chip module.

6. The metal core element according to claim 5, wherein, The slit extends through the mounting area on both sides of the mounting opening.

7. The metal core element according to claim 5, wherein At least in the area of the abrasion area, the slit extends substantially parallel to the longitudinal direction of the metal core element.

8. The metal core element according to claim 7, wherein, The abrasion area is at least segmentally spaced apart from the slit.

9. The metal core element according to claim 4, wherein The slit has an outer end segment that terminates at the outer edge of the metal core element and extends substantially perpendicular to the outer edge.

10. The metal core element according to claim 9, wherein, A first bent segment of the slit is connected to the outer end segment and has a first radius of curvature.

11. The metal core element according to claim 9, wherein, A second bent segment of the slit has a second radius of curvature greater than the first radius of curvature.

12. The metal core element according to claim 11, wherein, An intermediate segment of the slit extends between the first bent segment and the second bent segment.

13. The metal core element according to claim 12, wherein, The intermediate segment extends substantially parallel to the outer edge of the metal core element.

14. A chip card body for a chip card, in particular for a transaction card having a chip module capable of performing electronic transactions, the chip card body comprising: A flat metal core element having a mounting area for mounting the chip module to the metal core element, and At least one plastic layer that at least partially covers the metal core element and has a receiving opening that provides access to the mounting area and is configured to receive the chip module; Wherein the mounting area is at least partially provided with an abrasion area, and the abrasion area is provided with a surface roughening portion for improving the bonding between the mounting area and the chip module when the chip module is mounted to the metal core element; and Wherein the receiving opening surrounds the abrasion area.

15. The card body according to claim 14, wherein, The receiving opening has at least one rounded corner segment, and the corner radius of the rounded corner segment is smaller than the radius of the mounting opening of the metal core element, preferably smaller than 2.25 mm.

16. The card body according to claim 15, wherein, At least in the area of the rounded corner segment, there is a certain distance between the abrasion area and the inner periphery of the receiving opening.

17. The card body according to claim 14, wherein, The chip module is received in the receiving opening and is mounted to the mounting area by at least bonding to the abrasion area.

18. The card body according to claim 14, wherein, The chip module is at least glued to the abrasion area.

19. A method for manufacturing a chip card, in particular a transaction card having a chip module capable of performing electronic transactions, comprising the following steps: Providing a flat metal core element having a mounting area for mounting the chip module to the metal core element; At least partially covering the metal core element with at least one plastic layer, the plastic layer having a receiving opening for receiving the chip module and surrounding the mounting area; And Bonding the chip module to an abraded area, thereby providing a surface roughening in the mounting area to improve the bonding between the mounting area and the chip module when the chip module is mounted to the metal core element.

20. The method according to claim 19, further comprising the step of forming the abraded area through the receiving opening, preferably by means of laser ablation.

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