Loading and unloading equipment for static test of semiconductor

Abstract

The invention relates to the technical field of semiconductor wafer transfer, in particular to feeding and discharging equipment for a semiconductor static test. Comprising a machine frame, the machine frame is provided with symmetrically-distributed power modules, the symmetrically-distributed power modules are jointly provided with symmetrically-distributed conveying belts, air suction pieces distributed in an array mode are fixedly connected between the symmetrically-distributed conveying belts, the air suction pieces are made of soft and easy-to-stretch materials, the machine frame is fixedly connected with symmetrically-distributed flow dividing shells, and the flow dividing shells are fixedly connected with the machine frame. The flow dividing shell is fixedly connected with an air pump, the flow dividing shell is slidably connected with a sealing belt, an air suction port of the air pump communicates with the flow dividing cavity through a pipeline, and the air suction piece is fixedly connected and communicates with a fixing shell. In the process that the vacuum chuck automatically grabs the wafer, the air suction piece and the air pump are used for providing double-phase fixation for the wafer, the wafer is prevented from being possibly damaged by rigid fixation, meanwhile, relative displacement between the wafer and the conveying belt caused by external factors such as mechanical vibration is prevented, and the wafer feeding efficiency is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer transfer, and particularly to a loading and unloading device for semiconductor static testing. Background Art

[0002] Semiconductor wafer static testing technology is a very important part of the semiconductor manufacturing process. It is mainly used to detect the electrical properties, structural integrity, and other key characteristics of wafers during the manufacturing process. Static testing is usually carried out after the wafer manufacturing process is completed and before packaging. The purpose is to detect potential defects or unqualified chips as early as possible, thereby reducing waste and cost losses in subsequent processes.

[0003] In the wafer processing flow, wafer positioning and transportation need to be completed through an automated transfer system before testing. The current standard process adopts an operation mode of continuous conveyor belt transportation combined with vacuum chuck grasping: First, the conveyor belt transports wafers to the testing station one by one, and then the vacuum chuck mechanism accurately grasps and transfers them to the testing platform. It should be noted that there is a key process risk in this link - when the conveyor system encounters mechanical vibration or instantaneous impact, due to the insufficient static friction coefficient between the wafer and the conveyor belt, relative displacement occurs between the wafer and the conveyor belt, resulting in a position deviation during subsequent suction. In severe cases, it may even cause the wafer to collide with the outer shell of the conveying device, resulting in wafer damage, and then triggering abnormal shutdown events such as equipment alarms and grasping failures, thus affecting the wafer loading efficiency. Summary of the Invention

[0004] In order to overcome the above-mentioned drawbacks, the technical problem of the present invention is to provide a loading and unloading device for semiconductor static testing.

[0005] Technical Solution: A loading and unloading device for semiconductor static testing includes a frame. Symmetrically distributed power modules are arranged on the frame. Symmetrically distributed conveyor belts are jointly arranged by the symmetrically distributed power modules. Arrayed suction members are fixedly connected between the symmetrically distributed conveyor belts. The part of the suction member away from the flow dividing shell is made of a soft and easily stretchable material. Symmetrically distributed flow dividing shells are fixedly connected inside the frame. An air pump is fixedly connected to the flow dividing shell through a mounting frame. A sealing belt is slidably connected to the flow dividing shell. The flow dividing shell and the sealing belt jointly form a flow dividing cavity. The suction port of the air pump is communicated with the flow dividing cavity through a pipeline. The suction member is fixedly connected and communicated with a fixed shell. Symmetrically distributed drainage pipes are communicated with the fixed shell. The drainage pipes are fixedly connected to the adjacent sealing belts. The fixed shell is communicated with the flow dividing cavity through the drainage pipes.

[0006] In addition, it is particularly preferred that it further includes symmetrically distributed sliding frames, and the symmetrically distributed sliding frames are all slidably connected to the fixed shell. A sealing plug is fixedly connected to the sliding frame, and the sealing plug is used to block the drainage tube. A damping mechanism that is symmetrically distributed and used to provide damping for the sliding frame according to the state inside the fixed shell is arranged inside the fixed shell.

[0007] In addition, it is particularly preferred that the drainage tube is composed of a frustum-shaped pipe and a cylindrical pipe, and the diameter of the sealing plug is greater than the inner diameter of the cylindrical pipe of the drainage tube.

[0008] In addition, it is particularly preferred that the maximum cross-sectional area of the frustum-shaped pipe on the drainage tube is equal to twice the cross-sectional area of the cylindrical pipe on the drainage tube.

[0009] In addition, it is particularly preferred that the shunt shell is fixedly connected with a first fixing frame, and the first fixing frame is fixedly connected with symmetrically distributed first extrusion frames, and the first extrusion frames are used to extrude the sliding frame.

[0010] In addition, it is particularly preferred that the damping mechanism includes a damping shell, the damping shell is fixedly connected to the inside of the fixed shell through a mounting frame, symmetrically distributed damping frames are slidably connected to the damping shell, a tension spring is arranged between the damping frame and the damping shell, a piston is fixedly connected to the sliding frame, the piston is slidably connected to the adjacent damping shell, and a limiting component for limiting the position of the damping frame is arranged on the fixed shell.

[0011] In addition, it is particularly preferred that the limiting component includes symmetrically distributed second fixing frames, and the symmetrically distributed second fixing frames are all fixedly connected to the inside of the fixed shell. A limiting frame is slidably connected to the second fixing frame, a fixing rod is fixedly connected to the damping frame, and the limiting frame is used to limit the position of the fixing rod.

[0012] In addition, it is particularly preferred that the limiting component further includes symmetrically distributed monitoring rods, the monitoring rods are fixedly connected to the adjacent limiting frames, and the monitoring rods are slidably connected to the fixed shell.

[0013] In addition, it is particularly preferred that uniformly distributed second extrusion frames are slidably connected to the sliding frame, a spring is arranged between the second extrusion frame and the sliding frame, and the second extrusion frame is used to extrude the damping frame.

[0014] In addition, it is particularly preferred that the first fixing frame is fixedly connected with symmetrically distributed partition frames, and the partition frames are used to extrude the sliding frame.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: During the process of the vacuum chuck automatically grasping the wafer, the present invention provides dual-phase fixation (sagging wrapping fixation, negative pressure suction fixation) for the wafer through the air suction member and the air pump, preventing the hard fixation from possibly damaging the wafer, and at the same time preventing relative displacement between the wafer and the conveyor belt caused by external factors such as mechanical vibration, ensuring the wafer loading efficiency; the monitoring rod judges the negative pressure state (whether there is a wafer) in the fixed shell, and controls the symmetrically distributed damping brackets to change the reset damping of the sealing plug according to the result, so that the air suction members currently transporting the wafer and the air suction members not transporting the wafer flexibly distribute the pressure provided by the air pump, reducing energy consumption while ensuring the stable fixation of the air suction members on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a three-dimensional structural schematic diagram of the present invention; Figure 2 is a three-dimensional structural schematic diagram of the shunt housing and the air pump of the present invention; Figure 3 is a three-dimensional structural schematic diagram of the shunt housing and the first fixing bracket of the present invention; Figure 4 is a three-dimensional structural schematic diagram of the shunt housing, the air pump and the first fixing bracket of the present invention; Figure 5 is a three-dimensional structural schematic diagram of the shunt housing and the sealing belt of the present invention; Figure 6 is a three-dimensional structural schematic diagram of the first fixing bracket and the first pressing bracket of the present invention; Figure 7 is a three-dimensional structural sectional view of the air suction member and the fixed shell of the present invention; Figure 8 is a three-dimensional structural sectional view of the sealing belt and the drainage pipe of the present invention; Figure 9 is a three-dimensional structural schematic diagram of the first fixing bracket and the partition bracket of the present invention; Figure 10 is a three-dimensional structural schematic diagram of the sliding bracket and the piston of the present invention; Figure 11 is a three-dimensional structural schematic diagram of the limiting bracket and the fixing rod of the present invention.

[0017] In the figure: 1, frame; 2, power module; 3, conveyor belt; 4, air suction member; 5, shunt housing; 6, air pump; 7, sealing belt; 8, fixed shell; 9, drainage pipe; 10, sliding bracket; 11, sealing plug; 12, first fixing bracket; 13, first pressing bracket; 14, damping shell; 15, damping bracket; 16, piston; 17, second fixing bracket; 18, limiting bracket; 19, fixing rod; 20, monitoring rod; 21, second pressing bracket; 22, partition bracket. DETAILED DESCRIPTION OF THE INVENTION

[0018] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present invention.

[0019] Embodiment 1

[0020] A loading and unloading device for semiconductor static testing disclosed in this embodiment is used to convey a semiconductor wafer (hereinafter referred to as a wafer) to a testing position.

[0021] The specific structure and connection relationship of this loading and unloading device are as follows: As Figures 1-8As shown in the figure, it includes a machine frame 1. A control panel is provided on the front side of the machine frame 1, and the control panel is electrically connected to all the electric control components in this device. Symmetrically distributed power modules 2 are provided on the machine frame 1. Two symmetrically distributed power modules 2 jointly provide two conveyor belts 3 that are symmetrically distributed front and back. Both of the two conveyor belts 3 rotate clockwise. The power module 2 is composed of a transmission shaft, a transmission wheel, etc., and is used to support the conveyor belt 3 and provide power for it. An array of air suction parts 4 are fixedly connected between the two conveyor belts 3. Two rectangular through holes are provided on the air suction part 4. There is no requirement for the number of air suction parts 4 during the normal operation of this device, and the number of air suction parts 4 can be adjusted according to actual needs. The number of air suction parts 4 in the figure is only for illustration. Adjacent air suction parts 4 are connected by a flexible connecting piece to prevent the wafer from falling between adjacent two air suction parts 4 due to vibrations and other influences. Two symmetrically distributed shunt shells 5 are fixedly connected to the inner side of the machine frame 1 through a steel structure frame and bolts. The part of the air suction part 4 away from the shunt shell 5 is made of a soft and easily stretchable material for wrapping the wafer, and the connection part between the conveyor belt 3 and the air suction part 4 is made of a hard material. The shape of the shunt shell 5 is similar to the overall shape of the conveyor belt 3, both are waist-shaped. An air pump 6 is fixedly connected to the shunt shell 5 through a mounting frame. The air pump 6 has an overpressure protection module, that is, when the pressure that the air pump 6 can provide is difficult to meet the requirements, the air pump 6 automatically shuts down to protect the body. A sealing belt 7 is slidably connected to the shunt shell 5. The shunt shell 5 and the sealing belt 7 are dynamically sealed. The sealing belt 7 is made of a deformable material. The shunt shell 5 and the sealing belt 7 jointly form a shunt cavity. The suction port of the air pump 6 is communicated with the shunt cavity through a pipeline. One side of the air suction part 4 close to the shunt shell 5 is fixedly connected and communicated with a fixed shell 8. The air suction part 4 and the fixed shell 8 jointly form a single chamber. The fixed shell 8 is communicated with two symmetrically distributed front and back drainage pipes 9. The drainage pipes 9 are fixedly connected to the adjacent sealing belt 7. The conveyor belt 3 drives the sealing belt 7 to move through the air suction part 4, the fixed shell 8 and the drainage pipe 9. The fixed shell 8 is communicated with the shunt cavity through the drainage pipe 9. The air pump 6, the shunt cavity, the drainage pipe 9 and the fixed shell 8 jointly form a gas flow path. When the rectangular through hole on the air suction part 4 is not blocked, the suction force provided by the air pump 6 will not cause a negative pressure in the chamber jointly formed by the air suction part 4 and the fixed shell 8.

[0022] The working process of the loading and unloading equipment in this embodiment is as follows: Transportation preparation: When it is necessary to transport the wafer, the user controls the two power modules 2 to drive the two conveyor belts 3 to rotate. At the same time, the user starts the air pump 6. The suction port of the air pump 6 extracts the gas in the chamber jointly formed by the air suction part 4 and the fixed shell 8 through the pipeline, the shunt cavity composed of the shunt shell 5 and the sealing belt 7, and the drainage pipe 9. At this time, the preparation work is completed.

[0023] Transportation process: The user sequentially places wafers (or the user uses an existing device to sequentially place wafers) one by one on the air suction member 4. As the wafer blocks the rectangular through-holes on the air suction member 4, the inlet area of the air suction member 4 (the inlet area refers to the sum of the areas of the two rectangular through-holes on the air suction member 4) decreases. The air suction member 4 and the fixed housing 8 together form a negative pressure in the cavity, and the wafer is adsorbed on the upper surface of the air suction member 4. Moreover, the suction force provided by the air pump 6 is sufficient to pull the wafer and deform the soft and easily stretchable material on the air suction member 4, causing the wafer to sink. Thus, the air suction member 4 completes the double fixation of the wafer (sinking and wrapping fixation, negative pressure suction fixation), thereby preventing relative displacement between the wafer and the conveyor belt caused by external factors such as mechanical vibration, and preventing the wafer from being damaged by hard collisions, ensuring the wafer loading efficiency.

[0024] Embodiment 2

[0025] In the above Embodiment 1, all the air suction members 4 perform the suction work. If the wafer supply device fails (or when sampling and testing are carried out using a small number of wafers of different models), or when the wafer supply amount of the wafer supply device fluctuates, it will cause the wafer supply frequency to be unstable. That is, when transporting to a research and development test line or a multi-variety and small-batch production line, such fluctuations in frequency will have a dynamic impact on the negative pressure adsorption environment during transportation, thereby affecting the stable transportation of the wafer.

[0026] A semiconductor static testing loading and unloading device disclosed in this embodiment is further improved on the basis of Embodiment 1.

[0027] The structure, connection relationship, and working process of the loading and unloading device in Embodiment 1 will not be elaborated again. The working principle of the following structure will be mainly described.

[0028] As Figures 6-8As shown in the figure, it further includes two sliding frames 10 symmetrically distributed front and back. Both sliding frames 10 are slidably connected to the fixed shell 8. The sliding frame 10 is composed of a T-shaped rod and two L-shaped rods. A plug 11 is fixedly connected to the T-shaped rod part of the sliding frame 10. The plug 11 is used to block the drainage tube 9. As the plug 11 gradually moves upward, the distance between the plug 11 and the inner wall of the drainage tube 9 gradually increases (i.e., the flow area of the drainage tube 9 gradually increases). A damping mechanism is arranged in the fixed shell 8, which is symmetrically distributed and used to provide damping for the sliding frame 10 according to the state in the fixed shell 8. The drainage tube 9 is composed of a frustum-shaped pipe and a cylindrical pipe, and the diameter of the plug 11 is larger than the inner diameter of the cylindrical pipe of the drainage tube 9. The minimum radius of the frustum-shaped pipe is equal to the radius of the cylindrical pipe, and the maximum cross-sectional area of the frustum-shaped pipe on the drainage tube 9 is twice the cross-sectional area of the cylindrical pipe on the drainage tube 9. That is, when the plug 11 is located at the uppermost side, the annular flow area between the plug 11 and the drainage tube 9 is equal to the flow area of the cylindrical pipe of the drainage tube 9, so as to reduce the air flow resistance. The plug 11 is initially located at the connection between the frustum-shaped pipe and the cylindrical pipe of the drainage tube 9 and blocks the drainage tube 9. The diversion shell 5 is fixedly connected with a first fixing frame 12. The first fixing frame 12 is a steel structure frame, and a lubricating medium is coated between the first fixing frame 12 and the sliding frame 10. The first fixing frame 12 is fixedly connected with symmetrically distributed first extrusion frames 13. The first extrusion frames 13 are located near the right side of the wafer loading position (the upper left part of the first fixing frame 12). The maximum vertical distance between the first extrusion frame 13 and the first fixing frame 12 is equal to the distance between the plug 11 and the maximum diameter of the frustum-shaped pipe of the drainage tube 9. The first extrusion frame 13 is used to extrude the sliding frame 10.

[0029] As Figures 7-11 shown in the figure, the damping mechanism includes a damping shell 14. The damping shell 14 is fixedly connected to the inside of the fixed shell 8 through a mounting frame. Two damping frames 15 symmetrically distributed front and back are slidably connected to the upper side of the damping shell 14. The damping frame 15 is composed of a T-shaped rod and a semi-circular plate, and round holes are arranged in its semi-circular plate part. The two damping frames 15 of the same damping shell 14 are in a group, and the semi-circular plate parts of the two damping frames 15 of the same damping shell 14 are pieced together to form a complete circular plate, covering the upper part inside the damping shell 14. A tension spring is arranged between the damping frame 15 and the damping shell 14, and the tension spring between them is in a stretched state initially. A piston 16 is fixedly connected to the sliding frame 10. The piston 16 is initially located below the damping shell 14. The piston 16 is slidably connected to the adjacent damping shell 14, and the seal between them is dynamic. A limit component is arranged on the fixed shell 8 to limit the position of the damping frame 15.

[0030] As Figures 7-11As shown in the figure, the limiting component includes symmetrically distributed second fixing frames 17, and the symmetrically distributed second fixing frames 17 are fixedly connected inside the fixed shell 8. The second fixing frames 17 are slidably connected with limiting frames 18. The limiting frames 18 are composed of rectangular plates and hook-shaped rods, and inclined surfaces that gradually move away from each other from top to bottom are arranged on the opposite sides of the hook-shaped rod parts of the two limiting frames 18. A fixed rod 19 is fixedly connected to the damping frame 15. The limiting frames 18 are used to limit the position of the fixed rod 19. The fixed rod 19 squeezes the inclined surfaces of the hook-shaped rod parts on the limiting frames 18 to squeeze the limiting frames 18 to move upward and reset. The limiting component also includes symmetrically distributed monitoring rods 20. The lower sides of the monitoring rods 20 are in contact with the external air pressure environment. When the air pressure inside the fixed shell 8 decreases, the external air pressure squeezes the monitoring rods 20 to move upward and drives the limiting frames 18 to move upward, thereby releasing the limit of the limiting frames 18 on the fixed rod 19. The monitoring rods 20 are fixedly connected to the lower sides of the rectangular plate parts of the adjacent limiting frames 18. The monitoring rods 20 are slidably connected with the fixed shell 8, and the dynamic seal is provided between the two. Four second extrusion frames 21 are evenly distributed and slidably connected to the sliding frame 10. Springs are arranged between the second extrusion frames 21 and the sliding frame 10. The four second extrusion frames 21 are divided into two symmetrically distributed parts on the left and right, and each part is composed of two second extrusion frames 21 that are symmetrically distributed in the front and back. The second extrusion frames 21 are used to extrude the damping frame 15. The first fixing frame 12 is fixedly connected with symmetrically distributed partition frames 22. The partition frames 22 are located near the left side of the wafer loading and unloading position (the upper right part of the first fixing frame 12). The side of the partition frame 22 close to the first extrusion frame 13 is lower than the highest point of the first extrusion frame 13, and the highest points of the two are at the same height. The right side of the partition frame 22 gradually slopes downward, which is used to control the plug 11 to gradually block the drainage pipe 9, thereby preventing the situation that the plug 11 quickly blocks the drainage pipe 9 and causes the wafer to bounce due to the reaction force of the soft part on the air suction part 4. The partition frame 22 is used to extrude the sliding frame 10. There is a gap between the rightmost end of the partition frame 22 and the first fixing frame 12 for the sliding frame 10 that is not on the partition frame 22 to pass through.

[0031] In this embodiment, the working process of the loading and unloading equipment is as follows: During the process of the air suction member 4 gradually moving to the right following the conveyor belt 3, the air suction member 4 drives the sliding frame 10 to move to the right synchronously through the fixed housing 8. The sliding frame 10 gradually contacts the first extrusion frame 13. At the same time, the sliding frame 10 is extruded upward by the first extrusion frame 13 and moves upward, driving the sealing plug 11 to move upward gradually, so that the flow area of the drainage tube 9 gradually increases. At the same time, the piston 16 moves upward synchronously with the sliding frame 10 and reduces the distance between the piston 16 and the damping frame 15. The air pump 6 extracts the gas in the fixed housing 8 through the shunt housing 5. If there is no wafer placed on the air suction member 4 at this time, the air pressure in the fixed housing 8 remains stable until the sliding frame 10 passes over the first extrusion frame 13. The sliding frame 10 loses support, and the sealing plug 11 moves downward under the attraction of the airflow of the air pump 6 and the action of gravity, so that the bent part of the L-shaped rod of the sliding frame 10 falls to the lower side of the partition frame 22, and the sealing plug 11 resumes the blocking of the drainage tube 9, thus preventing the waste of the pressure provided by the air pump 6 and saving energy.

[0032] If there is a wafer placed on the air suction member 4 when the air pump 6 extracts the gas in the fixed housing 8 through the shunt housing 5 as described above, a negative pressure gradually generates in the fixed housing 8, and the external air pressure squeezes the monitoring rod 20 to move upward. The monitoring rod 20 drives the limit frame 18 to move upward, thus losing the limit on the fixed rod 19. The tension spring between the damping housing 14 and the damping frame 15 drives the two damping frames 15 to move towards each other. The semi-circular plate parts of the two damping frames 15 are combined into a complete circular plate, and only the two through holes in the complete circular plate part can communicate the spaces above and below the two damping frames 15. Until the sliding frame 10 passes over the first extrusion frame 13, the sliding frame 10 loses support, and the sealing plug 11 moves downward under the attraction of the airflow of the air pump 6 and the action of gravity. However, because the two damping frames 15 are combined into a complete circular plate, and the piston 16 moves downward synchronously with the sliding frame 10 (that is, the piston 16 extracts the gas above the damping frame 15 to between the two through the two through holes in the complete circular plate), the resistance of the air passing through the through holes slows down the downward movement speed of the sealing plug 11 and the sliding frame 10. As the sliding frame 10 continues to move to the right, the sliding frame 10 falls onto the partition frame 22. As the sliding frame 10 continues to move to the right, the partition frame 22 squeezes the sliding frame 10 to drive the sealing plug 11 to move upward and reset, and maintains the attraction of the air pump 6 to the wafer, thus ensuring the stable state of the wafer during the entire conveying process.

[0033] When the sliding carriage 10 moves to the inclined part on the right side of the partition frame 22 and moves rightward, the sliding carriage 10 gradually moves downward as it moves rightward. The sealing plug 11 and the sliding carriage 10 move downward synchronously, and the flow area of the drainage tube 9 gradually decreases, thereby gradually releasing the fixation of the wafer. During this process, the second extrusion frame 21 moves downward synchronously and is squeezed by the T-shaped rod part of the damping frame 15. The left and right parts of the second extrusion frame 21 move away from each other under the squeeze and squeeze the spring between the second extrusion frame 21 and the sliding carriage 10. Until the second extrusion frame 21 moves downward past the damping frame 15, the spring between the second extrusion frame 21 and the sliding carriage 10 drives the second extrusion frame 21 to reset. Subsequently, the wafer is taken away by a robot and a vacuum chuck.

[0034] When the two combined damping frames 15 rotate a full circle and then move to the left side of the first extrusion frame 13 again, the sliding carriage 10 is squeezed by the first extrusion frame 13 to drive the sealing plug 11 and the piston 16 to move upward forcibly. During the process, the sliding carriage 10 drives the second extrusion frame 21 to move upward. The second extrusion frame 21 squeezes and drives the damping frame 15 to move away from the damping housing 14, and at the same time stretches the tension spring between the damping frame 15 and the damping housing 14. The damping frame 15 drives the fixed rod 19 to move back to its original position. The fixed rod 19 squeezes the inclined surface of the limit frame 18 and resets, so that the limit frame 18 re-limits the fixed rod 19 again. The reset of the damping frame 15 is completed until the second extrusion frame 21 stops moving upward with the sliding carriage 10. At this time, the second extrusion frame 21 is located above the damping frame 15. The negative pressure state (whether there is a wafer) in the fixed housing 8 is judged through the monitoring rod 20, and according to the result, the symmetrically distributed damping frames 15 are controlled to change the reset damping of the sealing plug, so that the suction members 4 transporting the wafer currently and the suction members 4 not transporting the wafer flexibly distribute the pressure provided by the air pump 6, reducing energy consumption while ensuring the stable fixation of the wafer by the suction members 4.

[0035] The above are only examples of the present invention and are not used to limit the present invention. All equivalent replacements made within the principle of the present invention shall be included in the protection scope of the present invention. The content not elaborated in detail in the present invention belongs to the prior art well-known to those skilled in the art.

Claims

1. A semiconductor static test loading and unloading device, characterized in that It includes a machine frame (1), on which power modules (2) are symmetrically distributed. The symmetrically distributed power modules (2) are jointly provided with symmetrically distributed conveyor belts (3). Array - distributed air suction members (4) are fixedly connected between the symmetrically distributed conveyor belts (3). The part of the air suction member (4) away from the flow - dividing shell (5) is made of a soft and easily stretchable material. Symmetrically distributed flow - dividing shells (5) are fixedly connected inside the machine frame (1). An air pump (6) is fixedly connected to the flow - dividing shell (5) through a mounting frame. A sealing belt (7) is slidably connected to the flow - dividing shell (5). The flow - dividing shell (5) and the sealing belt (7) jointly form a flow - dividing cavity. The suction port of the air pump (6) is communicated with the flow - dividing cavity through a pipeline. The air suction member (4) is fixedly connected and communicated with a fixed shell (8). The fixed shell (8) is communicated with symmetrically distributed diversion pipes (9). The diversion pipes (9) are fixedly connected to the adjacent sealing belts (7). The fixed shell (8) is communicated with the flow - dividing cavity through the diversion pipes (9).

2. The loading and unloading device for semiconductor static testing according to claim 1, characterized in that, It further includes symmetrically distributed sliding frames (10). The symmetrically distributed sliding frames (10) are all slidably connected to the fixed shell (8). A plug (11) is fixedly connected to the sliding frame (10). The plug (11) is used to block the diversion pipe (9). A damping mechanism is arranged symmetrically inside the fixed shell (8) and is used to provide damping for the sliding frame (10) according to the state inside the fixed shell (8).

3. The loading and unloading device for semiconductor static testing according to claim 2, characterized in that, The diversion pipe (9) is composed of a frustum - shaped pipe and a cylindrical pipe, and the diameter of the plug (11) is larger than the inner diameter of the cylindrical pipe of the diversion pipe (9).

4. The loading and unloading device for semiconductor static testing according to claim 3, characterized in that, The maximum cross - sectional area of the frustum - shaped pipe of the diversion pipe (9) is equal to twice the cross - sectional area of the cylindrical pipe of the diversion pipe (9).

5. The loading and unloading device for semiconductor static testing according to claim 2, characterized in that, The flow - dividing shell (5) is fixedly connected with a first fixing frame (12). The first fixing frame (12) is fixedly connected with symmetrically distributed first extrusion frames (13). The first extrusion frames (13) are used to extrude the sliding frame (10).

6. The loading and unloading device for semiconductor static testing according to claim 5, characterized in that The damping mechanism includes a damping shell (14). The damping shell (14) is fixedly connected inside the fixed shell (8) through a mounting frame. Symmetrically distributed damping frames (15) are slidably connected to the damping shell (14). A tension spring is arranged between the damping frame (15) and the damping shell (14). A piston (16) is fixedly connected to the sliding frame (10). The piston (16) is slidably connected to the adjacent damping shell (14). A limiting component is arranged on the fixed shell (8) to limit the position of the damping frame (15).

7. The loading and unloading device for semiconductor static testing according to claim 6, characterized in that, The limiting component includes symmetrically distributed second fixing frames (17). The symmetrically distributed second fixing frames (17) are all fixedly connected inside the fixed shell (8). A limiting frame (18) is slidably connected to the second fixing frame (17). A fixing rod (19) is fixedly connected to the damping frame (15). The limiting frame (18) is used to limit the position of the fixing rod (19).

8. A semiconductor static test loading and unloading device according to claim 7, characterized in that, The limiting component further includes monitoring rods (20) symmetrically distributed, the monitoring rods (20) are fixedly connected to the adjacent limiting frames (18), and the monitoring rods (20) are slidably connected to the fixed shell (8).

9. The loading and unloading device for semiconductor static testing according to claim 7, characterized in that, Evenly distributed second extrusion frames (21) are slidably connected to the sliding frame (10), springs are arranged between the second extrusion frames (21) and the sliding frame (10), and the second extrusion frames (21) are used for extruding the damping frame (15).

10. The semiconductor static test loading and unloading device according to claim 9, characterized in that, Symmetrically distributed partition frames (22) are fixedly connected to the first fixing frame (12), and the partition frames (22) are used for extruding the sliding frame (10).

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