Wafer post-processing device
By introducing clamping, protection and barrier components into the wafer post-processing device, the problem of droplet sputtering droplet pollution is solved, the cleanliness requirements of the wafer surface are achieved, and the cleaning effect is improved.
Patent Information
- Application Number
- CN202510655847.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-09
- Publication Date
- 2025-07-25
AI Technical Summary
During the post-treatment process of existing wafers, centrifugal droplets will produce sputtered droplets, causing the droplets to escape and contaminate the wafer, affecting the cleaning effect.
A wafer post-processing device is designed, including a clamping assembly, a protective assembly and a barrier assembly, which guides the droplets to the bottom of the box through the liquid discharge port of the rotary cover and the fixed cover, and uses the barrier assembly to suppress the droplets back to the wafer surface. The barrier assembly is used to form a barrier chamber including a first baffle and a side plate to prevent the droplet from escaping.
Effectively prevent mist droplets and particulate contaminants from adhering to the wafer surface, ensure the cleanliness of the wafer surface and improve the cleaning effect.
Smart Images
Figure CN120376469A_ABST
Abstract
Description
[0001] This application is a divisional application of the invention patent application with the application number 2023114819690 and filed on November 9, 2023. Technical Field
[0002] The present invention belongs to the technical field of wafer post-processing, and specifically relates to a wafer post-processing device. Background Art
[0003] The integrated circuit industry is the core of the information technology industry and plays a key role in boosting the transformation and upgrading of the manufacturing industry towards digitalization and intelligentization. A chip is the carrier of an integrated circuit, and chip manufacturing involves processes such as integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting and packaging, and testing. Among them, Chemical Mechanical Polishing (CMP) is one of the five core processes in the wafer manufacturing process.
[0004] The wafers that have completed chemical mechanical polishing need to be post-processed such as cleaning and drying to avoid the contamination of semiconductor devices by trace ions and metal particles and ensure the performance and qualification rate of semiconductor devices. Common cleaning methods include: two-fluid jet cleaning, brush cleaning, and megasonic cleaning, etc.; common drying methods include: spin drying or Marangoni drying, etc.
[0005] Figure 1 FIG. is a schematic diagram of a wafer post-processing device in the prior art. To control the flow direction of centrifugally scattered droplets, an inner retaining ring 10' and an outer retaining ring 20' are provided on the outer side of the rotating wafer. An inner retaining ring drain port 11' is configured between the inner retaining ring 10' and the turntable, and an outer retaining ring drain port 21' is provided below the outer retaining ring 20' fixed to the back panel of the box body. The centrifugally scattered droplets can sequentially pass through the inner retaining ring drain port 11' and the outer retaining ring drain port 21', accumulate at the bottom of the box body, and then be discharged to the outside of the box body through the cavity drain port 31'.
[0006] However, during the wafer post-processing process, the droplets ejected from the inner retaining ring 10' will impact the inner wall of the outer retaining ring 20' at a relatively high speed, thereby generating sputtered droplets, making the droplets fill the space between the inner retaining ring 10' and the outer retaining ring 20'. There is a possibility that the scattered droplets may escape from the outer retaining ring drain port 21', as Figure 2 shown, the escaped droplets may drift to the front side of the wafer along with the airflow, resulting in secondary contamination of the wafer and affecting the wafer cleaning effect. Summary of the Invention
[0007] An embodiment of the present invention provides a wafer post-processing device, aiming to solve at least one of the technical problems existing in the prior art.
[0008] In the first aspect of the embodiments of the present invention, a wafer post-processing device is provided, which includes:
[0009] A box body;
[0010] A clamping assembly, arranged in the box body, which includes a clamping disk for clamping and driving the wafer to rotate;
[0011] A protection assembly, arranged on the outer peripheral side of the clamping assembly, which includes a rotating cover and a fixed cover; the rotating cover is connected to the outer edge of the clamping disk, and a drain port of the rotating cover is configured at the connection part of the two; the fixed cover is connected to the box body and concentrically arranged outside the rotating cover, and a drain port of the fixed cover is arranged below it; the fluid formed by the post-processing is discharged towards the bottom of the box body through the drain port of the rotating cover and the drain port of the fixed cover;
[0012] It further includes a blocking assembly, which is arranged between the fixed cover and the bottom plate of the box body to prevent the scattered droplets from adhering back to the wafer surface through the drain port of the fixed cover.
[0013] In some embodiments, the blocking assembly includes a first baffle, which is vertically arranged between the fixed cover and the bottom plate; the first baffle is configured with a liquid outlet, and the liquid outlet is arranged opposite to the drain port of the box body.
[0014] In some embodiments, the blocking assembly further includes side plates, which are arranged on both sides of the first baffle and fixed to the back plate of the box body to form a blocking chamber for suppressing the escape of droplets.
[0015] In some embodiments, the first baffle is located between the drain port of the fixed cover and the drain port of the box body to limit the drain port of the fixed cover inside the blocking chamber.
[0016] In some embodiments, the blocking assembly further includes a second baffle, which is arranged inside the blocking chamber and connected between the side plates, and a gap is formed between the lower end of the second baffle and the bottom plate.
[0017] In some embodiments, the second baffle is a member with an L-shaped cross-section, which extends from the upper edge of the liquid outlet towards the inside of the blocking chamber and then towards the bottom plate.
[0018] In some embodiments, the lower end surface of the second baffle is not higher than the plane where the lower edge of the liquid outlet is located, so that the liquid in the lower part of the blocking chamber can submerge the lower end of the second baffle.
[0019] In some embodiments, the second baffle extends obliquely from the upper edge of the liquid outlet towards the bottom plate, and its lower end surface is not higher than the plane where the lower edge of the liquid outlet is located.
[0020] In some embodiments, the length of the blocking chamber is less than the outer diameter of the fixed cover.
[0021] In some embodiments, an inclined surface is disposed on the inner side and / or the outer side of the lower edge of the liquid outlet.
[0022] The beneficial effects of the present invention include:
[0023] a. A blocking component is disposed at the bottom of the wafer post-processing device to submerge the droplets produced by the wafer post-processing in the liquid at the bottom of the barrier chamber, preventing the droplets from mixing with pollutants such as particulate matter and adhering to the surface of the wafer through the gap between the fixed cover and the bottom plate of the box body, so as to obtain a wafer with a surface cleanliness meeting the requirements;
[0024] b. The lower end surface of the second baffle is not higher than the plane where the lower edge of the liquid outlet is located, so that the liquid in the lower part of the barrier chamber can submerge the lower end of the second baffle, preventing the droplets entering the barrier chamber from flowing towards the liquid outlet through the gap between the lower end surface of the second baffle and the liquid surface, and preventing the droplets mixed with pollutants from adhering to the surface of the wafer again;
[0025] c. The inner side and / or the outer side of the lower edge of the liquid outlet is an inclined surface to accelerate the overflow efficiency and improve the liquid surface stability during liquid discharge. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Advantages of the present invention will become clearer and easier to understand through the following detailed description in conjunction with the accompanying drawings. These drawings are only schematic and do not limit the protection scope of the present invention, where:
[0027] Figure 1 is a schematic diagram of a wafer post-processing device in the prior art;
[0028] Figure 2 is Figure 1 a partial enlarged view within the dashed box;
[0029] Figure 3 is a schematic diagram of a wafer post-processing device provided by an embodiment of the present invention;
[0030] Figure 4 is Figure 3 a sectional view of the lower part of the wafer post-processing device in;
[0031] Figure 5 is a schematic diagram of a rotating cover provided by an embodiment of the present invention;
[0032] Figure 6 is Figure 4 a partial enlarged view within the dashed box;
[0033] Figure 7 is a schematic diagram corresponding to a variant embodiment of the blocking component provided by the present invention;
[0034] Figure 8It is a schematic diagram of a variant structure corresponding to the lower edge of the liquid outlet of the blocking component provided by the present invention; Detailed implementation manners
[0035] The following combines specific embodiments and their accompanying drawings to elaborate on the technical solutions of the present invention in detail. The embodiments described herein are specific specific implementation manners of the present invention for explaining the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation manners of the present invention and the protection scope of the present invention. Except for the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the content disclosed in the claims and the specification of this application. These technical solutions include technical solutions that make any obvious substitutions and modifications to the embodiments described herein.
[0036] The drawings in this specification are schematic diagrams to assist in explaining the concept of the present invention, schematically showing the shapes of various parts and their mutual relationships. It should be understood that in order to clearly show the structures of the components in the embodiments of the present invention, the drawings are not drawn according to the same scale, and the same reference numerals are used to represent the same parts in the drawings.
[0037] In the present invention, a wafer (Wafer, W) is also referred to as a substrate (Substrate), and their meanings and actual functions are equivalent. The term "including" and its similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc. can refer to different or the same objects, and are only used to distinguish the objects referred to, without implying a specific spatial order, time order, importance order, etc. of the objects referred to. In some embodiments, values, processes, selected items, determined items, devices, apparatuses, means, components, assemblies, etc. are referred to as "optimal", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made among many available functional options, and such a selection does not need to be better, lower, higher, smaller, larger or otherwise preferred in other aspects or all aspects than other selections.
[0038] Figure 3 It is a schematic diagram of a wafer post-processing device 100 provided by an embodiment of the present invention. The wafer post-processing device 100 includes:
[0039] A box body 10, and an opening (not shown) is configured at the top of the box body 10 so that a manipulator can pick up and place wafers to be processed or processed via the opening;
[0040] The clamping assembly 20 is disposed in the box body 10 to vertically hold the wafer and drive the wafer to rotate around its central axis. Further, the clamping assembly 20 includes a clamping disk 21, which is a circular disk-shaped structure. A claw is arranged on the outer peripheral side thereof to clamp the wafer W to be processed; a rotating shaft (not shown) is arranged at the rear side of the clamping disk 21. The rotating shaft is perpendicular to the back plate 11 of the box body 10 and is connected to the output end of the motor to drive the clamping disk 21 and the wafer W thereon to rotate around the central axis;
[0041] The protection assembly 30 is arranged on the outer peripheral side of the clamping assembly 20 to control the droplets centrifugally scattered from the wafer surface, so as to inhibit the scattered droplets from splashing onto the wafer surface and affecting the cleaning effect of the wafer.
[0042] Further, the protection assembly 30 includes a rotating cover 31 and a fixed cover 32. The rotating cover 31 is connected to the outer edge of the clamping disk 21, as Figure 4 shown. The fixed cover 32 is connected to the box body 10 and is concentrically arranged outside the rotating cover 31.
[0043] Specifically, the fixed cover 32 is a ring-shaped structure, which is vertically arranged on the back plate 11 of the box body 10, and the fixed cover 32 is arranged on the outer peripheral side of the rotating cover 31. Since the rotating cover 31 is connected to the outer edge of the clamping disk 21, the rotating speed of the rotating cover 31 is the same as that of the wafer held by the clamping disk 21, that is, there is no speed difference when the droplets centrifugally scattered from the wafer surface fall onto the inner side wall of the rotating cover 31. Different from the situation of the rotating cover 31, the fixed cover 32 is fixed to the side of the back plate 11, so that there is a large speed difference between the rotating cover 31 and the fixed cover 32.
[0044] Further, a rotating cover drain port 31a is arranged between the rotating cover 31 and the clamping disk 21, as Figure 5 shown. The number of the rotating cover drain ports 31a is multiple, and they are evenly distributed along the circumferential direction of the rotating cover 31 to timely discharge the droplets centrifugally scattered into the inside of the rotating cover 31 to the space between the clamping disk 21 and the back plate 11 through the rotating cover drain port 31a.
[0045] Further, a fixed cover drain port 32a is arranged below the fixed cover 32. The centrifugally scattered droplets are discharged to the space between the clamping disk 21 and the back plate 11 through the rotating cover drain port 31a. The droplets move downward under the action of gravity and then are discharged toward the bottom of the box body 10 through the fixed cover drain port 32a. That is, the converged droplets will be discharged to the outside of the box body 10 through the Figure 3 shown box body drain port 10a.
[0046] As described above, there is a large speed difference between the rotating cover 31 and the fixed cover 32. The droplets falling from the rotating cover 31 are thrown onto the inner side wall of the fixed cover 32 at a certain speed, which will form a large number of droplets (water droplets) between the rotating cover 31 and the fixed cover 32. These droplets will be mixed with pollutants such as particles and reattach to the surface of the wafer W through the gap between the fixed cover 32 and the bottom plate 12 of the box body 10, which will affect the cleaning effect of the wafer.
[0047] To solve the above-mentioned technical problems, the wafer post-processing device 100 provided by the present invention further includes a blocking component 40, as Figure 3 shown. The blocking component 40 is arranged between the fixed cover 32 and the bottom plate 12 of the box body 10 to inhibit the scattered droplets from reattaching to the wafer surface through the liquid discharge port 32a of the fixed cover, thereby avoiding the pollutants in the box body 10 from reattaching to the wafer surface along with the droplets.
[0048] Figure 4 is a cross-sectional view of the lower part of the wafer post-processing device 100, Figure 6 is Figure 4 a partial enlarged view in the dashed box.
[0049] The blocking component 40 includes a first baffle 41, and the first baffle 41 is vertically arranged between the fixed cover 32 and the bottom plate 12; the first baffle 41 is provided with a liquid outlet 41a ( Figure 6 shown), and the position of the liquid outlet 41a is opposite to that of the liquid discharge port 10a of the box body, as Figure 3 shown, so that the droplets accumulated between the blocking component 40 and the bottom plate 12 are discharged to the liquid discharge port 10a of the box body through the liquid outlet 41a and then discharged to the outside of the box body 10.
[0050] Furthermore, the blocking component 40 further includes side plates 43, and the side plates 43 are arranged on both sides of the first baffle 41 and fixed to the back plate 11 of the box body 10 to form a blocking chamber 40a for inhibiting the escape of droplets. The droplets scattered from the protection component 30 are confined inside the blocking chamber 40a to inhibit or prevent the droplets from drifting towards the wafer surface.
[0051] Furthermore, the first baffle 41 is located between the liquid discharge port 32a of the fixed cover and the liquid discharge port 10a of the box body to confine the liquid discharge port 32a of the fixed cover inside the blocking chamber 40a, so that the droplets escaping through the liquid discharge port 32a of the fixed cover are confined in the blocking chamber 40a.
[0052] Figure 6 In, the blocking component 40 further includes a second baffle 42, which is arranged inside the blocking chamber 40a, and the second baffle 42 is connected between the side plates 43. A gap is formed between the lower end of the second baffle 42 and the bottom plate 12, so that the droplets in the blocking chamber 40a can only be discharged towards the liquid outlet 41a through this gap.
[0053] Further, the top surface of the bottom plate 12 is an inclined surface; specifically, the top surface of the bottom plate 12 is inclined towards the position where the liquid discharge port 10a of the box body is located, so as to prevent the liquid inside the blocking chamber 40a from being discharged towards the liquid discharge port 10a of the box body through the liquid outlet 41a.
[0054] Figure 6 In the illustrated embodiment, the second baffle 42 is a member with an L-shaped cross-section, which extends from the upper edge of the liquid outlet 41a into the inside of the blocking chamber 40a and then extends towards the bottom plate 12, so as to form a first gap G1 between the lower end surface of the second baffle 42 and the bottom plate 12, and a second gap G2 is formed between the first baffle 41 and the second baffle 42.
[0055] In some embodiments, the first gap G1 between the lower end surface of the second baffle 42 and the bottom plate 12 is greater than 0.5 mm, so as to form a channel leading to the liquid outlet 41a between the second baffle 42 and the bottom plate 12, so that the converged liquid droplets flow towards the liquid discharge port 10a of the box body through the liquid outlet 41a. There is no limitation on the second gap G2 between the first baffle 41 and the second baffle 42, as long as the fluid can flow smoothly.
[0056] Figure 3 In the illustrated embodiment, a drainage pipeline is provided at the lower part of the liquid discharge port 10a of the box body, and the drainage pipeline is communicated with an external negative pressure device to suck the wafer cleaning waste liquid towards the outside of the box body 10, so that the fluid filling the inside of the blocking chamber 40a has a tendency to flow towards the liquid outlet 41a.
[0057] Due to the speed difference between the rotating cover 31 and the fixed cover 32, the droplets scattered to form mist droplets adhere to the inner side wall of the blocking chamber 40a or immerse in the liquid at the bottom of the blocking chamber 40a, thereby preventing the mist droplets mixed with pollutants from flying towards the wafer surface.
[0058] Further, the lower end surface of the second baffle 42 is not higher than the plane where the lower edge of the liquid outlet 41a is located, so that the liquid at the lower part of the blocking chamber 40a can submerge the lower end of the second baffle 42, so as to prevent the mist droplets entering the blocking chamber 40a from flowing towards the liquid outlet 41a through the gap between the lower end surface of the second baffle 42 and the liquid surface, and these flowing mist droplets may be mixed with pollutants and adhere to the wafer surface again.
[0059] In some embodiments, the height difference between the lower end surface of the second baffle 42 and the plane where the lower edge of the liquid outlet 41a is located is less than or equal to 30 mm. In the present invention, the lower edge of the liquid outlet 41a refers to the plane corresponding to the lower edge of the liquid outlet 41a. Similarly, the upper edge of the liquid outlet 41a refers to the plane corresponding to the upper edge of the liquid outlet 41a.
[0060] Preferably, the height difference between the lower end surface of the second baffle 42 and the plane where the lower edge of the liquid outlet 41a is located is 1-3 mm, so that the fluid converging in the blocking chamber 40a can flow out of the blocking chamber 40a successively through the first gap G1, the second gap G2 and the liquid outlet 41a, and then flow towards the box body drain port 10a under the action of gravity and be discharged to the outside of the box body 10.
[0061] Figure 6 In it, the distance between the lower edge of the liquid outlet 41a and the bottom plate 12 is H, and the distance H is 3-60 mm to form a continuous liquid flow between the lower part of the liquid outlet 41a and the box body drain port 10a. Preferably, the distance H between the lower edge of the liquid outlet 41a and the bottom plate 12 is 5-20 mm.
[0062] It should be noted that before the wafer post-processing device 100 executes the wafer cleaning process, appropriate deionized water needs to be sprayed onto the wafer surface. On the one hand, it is a pre-procedure for executing the cleaning process, and on the other hand, it can Figure 6 leave an appropriate amount of liquid in the reserved interior of the shown blocking chamber 40a. Further, the liquid inside the blocking chamber 40a at least submerges the first gap G1 to prevent the droplets formed during the wafer cleaning process from flowing towards the liquid outlet 41a through the first gap G1.
[0063] Furthermore, during the wafer cleaning process, a small amount of pollutants such as particulate matter may adhere to the inner side wall of the blocking chamber 40a, especially the surfaces of the first baffle 41 and the second baffle 42. For the convenience of cleaning, the first baffle 41 and the second baffle 42 can be set as detachable structures, so as to regularly clean the pollutants immersed in the blocking chamber 40a and avoid the particulate matter from blocking the first gap G1 and the second gap G2 and affecting the normal operation of the wafer post-processing device 100.
[0064] Figure 7 is a schematic diagram corresponding to a variant embodiment of the blocking component 40 provided by the present invention. In this embodiment, it is similar to the Figure 3 shown wafer post-processing device 100. The first baffle 41 is vertically arranged between the fixed cover 32 and the bottom plate 12, and side plates 43 ( Figure 3 shown) are arranged at the ends of the first baffle 41 along the length direction of the box body 10 to form a blocking chamber 40a at the lower part of the box body 10.
[0065] Furthermore, the second baffle 42 extends obliquely from the upper edge of the liquid outlet 41a towards the bottom plate 12. A first gap G1 is formed between the lower end of the second baffle 42 and the bottom plate 12, and a second gap G2 with a changing lateral width is formed between the second baffle 42 and the first baffle 41. Specifically, the width of the second gap G2 gradually becomes smaller from bottom to top, so that the fluid entering the first gap G1 and the second gap G2 can quickly flow towards the liquid outlet 41a.
[0066] Figure 7 In this case, the lower end surface of the second baffle 42 is not higher than the plane where the lower edge of the liquid outlet 41a is located. Before the post-treatment of the wafer, there is at least a liquid submerging the first gap G1 inside the barrier chamber 40a to prevent the droplets formed during the wafer cleaning process from flowing to the liquid outlet 41a via the first gap G1 and the second gap G2.
[0067] In the present invention, the length of the barrier chamber 40a is smaller than the outer diameter of the fixed cover 32, as Figure 3 shown. With such a setting, the size of the barrier chamber 40a can be controlled to a certain extent so as to confine the droplets formed by the post-treatment of the wafer in a relatively small space. Preferably, the length of the barrier chamber 40a is 60%-80% of the outer diameter of the fixed cover 32.
[0068] Figure 3 In the embodiment shown, the length of the barrier chamber 40a is 65% of the outer diameter of the fixed cover 32.
[0069] Furthermore, a box body drain port 10a is provided on the bottom plate 12 of the box body 10, and the bottom plate 12 is provided with an inclined surface facing the box body drain port 10a, so that the droplets falling on the bottom of the box body 10 can converge towards the box body drain port 10a along the inclined surface under the action of gravity.
[0070] A liquid outlet 41a is configured on the first baffle 41 of the barrier assembly 40, and the liquid outlet 41a is arranged corresponding to the arrangement position of the box body drain port 10a, so that the liquid can be directly discharged to the box body drain port 10a via the liquid outlet 41a and then discharged to the outside of the box body 10 via the drainage pipeline.
[0071] In order to improve or adjust the flow state of the fluid inside the barrier chamber 40a via the liquid outlet 41a, different structural forms can be set for the lower edge of the liquid outlet 41a.
[0072] In some embodiments, the inner side of the lower edge of the liquid outlet 41a is an inclined surface, as Figure 8 (a) shown; with such a setting, it is beneficial to improve the efficiency of the liquid inside the barrier chamber 40a overflowing outwards. As an aspect of this embodiment, the included angle between the inclined surface on the inner side of the lower edge of the liquid outlet 41a and the horizontal plane is 20-70°.
[0073] It should be noted that the "inner side" here and the "outer side" mentioned below are relative to the barrier chamber 40a. Specifically, the direction towards the barrier chamber 40a is the "inner side", and the direction away from the barrier chamber 40a is the "outer side".
[0074] Furthermore, the outer side of the lower edge of the liquid outlet 41a is an inclined surface, as Figure 8(b) As shown; with such a setting, it is beneficial for the overflowed fluid to flow away quickly and smoothly. As an aspect of this embodiment, the angle between the inclined surface on the outer side of the lower edge of the liquid outlet 41a and the horizontal plane is 20 - 70°.
[0075] Figure 8 (c) is a combination of the above embodiments. Inclined surfaces are arranged on both the inner and outer sides of the lower edge of the liquid outlet 41a to accelerate the overflow efficiency, improve the liquid level stability during liquid discharge, and ensure the stable and efficient operation of the liquid discharge system in the box body 10.
[0076] Figure 8 In the embodiment shown in (c), the angles between the inclined surfaces on the inner and outer sides of the lower edge of the liquid outlet 41a and the horizontal plane are 45°; it can be understood that the inclined angles corresponding to the inclined surface on the inner side of the lower edge of the liquid outlet 41a and the inclined surface on the outer side of the lower edge of the liquid outlet 41a can also be different.
[0077] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.
[0078] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present invention. The scope of the present invention is defined by the claims and their equivalents.
Claims
1. A wafer post-processing device, characterized in that, Comprising: A box body; A clamping assembly, disposed in the box body, which includes a clamping disk for vertically clamping and driving a wafer to rotate; A protection assembly, disposed on the outer peripheral side of the clamping assembly, which includes a rotating cover and a fixed cover; the rotating cover is connected to the outer edge of the clamping disk, and a rotating cover liquid discharge port is configured at the connection between the two; the fixed cover is connected to the box body and concentrically disposed outside the rotating cover, and a fixed cover liquid discharge port is provided below it; the fluid formed after post-treatment is discharged towards the bottom of the box body through the rotating cover liquid discharge port and the fixed cover liquid discharge port; A blocking assembly, disposed between the fixed cover and the bottom plate of the box body to prevent scattered droplets from adhering back to the wafer surface through the fixed cover liquid discharge port; The blocking assembly includes: A first baffle, vertically disposed between the fixed cover and the bottom plate, which is configured with a liquid discharge port corresponding to the box body liquid discharge port; Side plates, disposed on both sides of the first baffle and fixed to the back plate of the box body to form a blocking chamber for suppressing the escape of droplets; the first baffle is located between the fixed cover liquid discharge port and the box body liquid discharge port to confine the fixed cover liquid discharge port inside the blocking chamber; The top surface of the bottom plate is inclined towards the position where the box body liquid discharge port is located to facilitate the discharge of the liquid inside the blocking chamber through the liquid discharge port.
2. The wafer post-processing device according to claim 1, wherein, The blocking assembly further includes a second baffle, which is disposed inside the blocking chamber and connected between the side plates, and a gap is formed between the lower end of the second baffle and the bottom plate.
3. The wafer post-processing device according to claim 2, wherein, A first gap is formed between the lower end surface of the second baffle and the bottom plate, and the first gap is greater than 0.5 mm.
4. The wafer post-processing device according to claim 3, wherein, The lower end surface of the second baffle is not higher than the plane where the lower edge of the liquid discharge port is located, so that the liquid in the lower part of the blocking chamber submerges the lower end of the second baffle.
5. The wafer post-processing device according to claim 2, wherein, The height difference between the lower end surface of the second baffle and the plane where the lower edge of the liquid discharge port is located is less than or equal to 30 mm.
6. The wafer post-processing device according to claim 1, wherein The distance between the lower edge of the liquid discharge port and the bottom plate is 3 - 60 mm to form a continuous liquid flow between the lower part of the liquid discharge port and the box body liquid discharge port.
7. The wafer post-processing device according to claim 2, wherein, The first baffle and the second baffle are of detachable structure to facilitate the regular cleaning of the pollutants immersed in the blocking chamber.
8. The wafer post-processing device according to claim 1, wherein, The length of the blocking chamber is 60% - 80% of the outer diameter of the fixed cover.
9. The wafer post-processing apparatus according to claim 1, wherein An inclined surface is configured on the inner or outer side of the lower edge of the liquid discharge port, and the included angle between the inclined surface and the horizontal plane is 20 - 70°.
10. The wafer post-processing device according to claim 1, wherein, Inclined surfaces are configured on both the inner and outer sides of the lower edge of the liquid discharge port, and the included angle between the inclined surface and the horizontal plane is 45°.